WO2008122891A3 - Binding of costituents having a high mobility in an electronic connection - Google Patents
Binding of costituents having a high mobility in an electronic connection Download PDFInfo
- Publication number
- WO2008122891A3 WO2008122891A3 PCT/IB2008/001444 IB2008001444W WO2008122891A3 WO 2008122891 A3 WO2008122891 A3 WO 2008122891A3 IB 2008001444 W IB2008001444 W IB 2008001444W WO 2008122891 A3 WO2008122891 A3 WO 2008122891A3
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- WO
- WIPO (PCT)
- Prior art keywords
- barrier material
- volume
- bonding metal
- electrically conductive
- conductive bonding
- Prior art date
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08762784A EP2313917A2 (en) | 2007-04-05 | 2008-06-05 | Binding of constituents having a high mobility in an electronic connection |
KR1020097022612A KR101119761B1 (en) | 2007-04-05 | 2008-06-05 | Binding of constituents having a high mobility in an electronic connection |
CN2008800166211A CN101681853B (en) | 2007-04-05 | 2008-06-05 | Mobile binding in an electronic connection |
JP2010501616A JP2011501395A (en) | 2007-04-05 | 2008-06-05 | Movable coupling in electrical connections |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/696,796 US7748116B2 (en) | 2007-04-05 | 2007-04-05 | Mobile binding in an electronic connection |
US11/696,796 | 2007-04-05 |
Publications (2)
Publication Number | Publication Date |
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WO2008122891A2 WO2008122891A2 (en) | 2008-10-16 |
WO2008122891A3 true WO2008122891A3 (en) | 2009-05-07 |
Family
ID=39826236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2008/001444 WO2008122891A2 (en) | 2007-04-05 | 2008-06-05 | Binding of costituents having a high mobility in an electronic connection |
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US (1) | US7748116B2 (en) |
EP (1) | EP2313917A2 (en) |
JP (1) | JP2011501395A (en) |
KR (1) | KR101119761B1 (en) |
CN (1) | CN101681853B (en) |
WO (1) | WO2008122891A2 (en) |
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KR101329355B1 (en) * | 2007-08-31 | 2013-11-20 | 삼성전자주식회사 | stack-type semicondoctor package, method of forming the same and electronic system including the same |
WO2011027820A1 (en) * | 2009-09-04 | 2011-03-10 | 千住金属工業株式会社 | Lead-free solder alloy, joining member and manufacturing method thereof, and electronic component |
CN104593655B (en) * | 2014-12-31 | 2017-02-22 | 广州汉源新材料股份有限公司 | Method for improving indium thermal conductive interface material |
CN106702243A (en) * | 2016-12-07 | 2017-05-24 | 北京态金科技有限公司 | Low-melting-point metal and preparation method and application thereof |
CN107442965A (en) * | 2017-08-11 | 2017-12-08 | 东北大学 | A kind of Sn Bi serial alloy welding powder and preparation method thereof |
CN110937911A (en) * | 2018-09-25 | 2020-03-31 | 宁波江丰电子材料股份有限公司 | Target assembly forming method |
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Also Published As
Publication number | Publication date |
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US20080246145A1 (en) | 2008-10-09 |
KR101119761B1 (en) | 2012-03-22 |
US7748116B2 (en) | 2010-07-06 |
KR20100012863A (en) | 2010-02-08 |
JP2011501395A (en) | 2011-01-06 |
WO2008122891A2 (en) | 2008-10-16 |
EP2313917A2 (en) | 2011-04-27 |
CN101681853A (en) | 2010-03-24 |
CN101681853B (en) | 2013-02-06 |
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