WO2009063954A1 - 基板処理方法及びこの方法によって処理された基板 - Google Patents

基板処理方法及びこの方法によって処理された基板 Download PDF

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Publication number
WO2009063954A1
WO2009063954A1 PCT/JP2008/070713 JP2008070713W WO2009063954A1 WO 2009063954 A1 WO2009063954 A1 WO 2009063954A1 JP 2008070713 W JP2008070713 W JP 2008070713W WO 2009063954 A1 WO2009063954 A1 WO 2009063954A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
recessed
substrate surface
processing method
mask
Prior art date
Application number
PCT/JP2008/070713
Other languages
English (en)
French (fr)
Inventor
Susumu Sakio
Hideo Takei
Kazuya Saito
Kazuhiro Watanabe
Shinsuke Iguchi
Hiroyuki Yamakawa
Kyuzou Nakamura
Yu-Hsin Lin
Huang-Choung Chang
Tung-Jung Wu
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to CN2008801161982A priority Critical patent/CN101861640B/zh
Priority to JP2009541175A priority patent/JP5232798B2/ja
Priority to US12/743,054 priority patent/US20100310828A1/en
Priority to KR1020107011380A priority patent/KR101159438B1/ko
Priority to EP08850923A priority patent/EP2211374A4/en
Publication of WO2009063954A1 publication Critical patent/WO2009063954A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0236—Special surface textures
    • H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/24—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

Abstract

【課題】工程数を少なくして基板表面へ凹凸構造を形成することができる基板処理方法を提供する 【解決手段】本発明に係る基板処理方法は、基板１０の表面１０ｓに粒子１１を散布し、粒子をマスクとして基板の表面をエッチングして基板の表面に凹凸構造１２を形成すると同時に、マスク１１を上記エッチングによって除去する。この方法によれば、凹凸構造１２の形成後、基板表面１０ｓからマスク１１を除去する工程が不要となる。したがって、基板表面への凹凸構造の形成に必要な工程数が大幅に削減されるので、生産性の大きな向上を図ることが可能となる。
PCT/JP2008/070713 2007-11-16 2008-11-13 基板処理方法及びこの方法によって処理された基板 WO2009063954A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2008801161982A CN101861640B (zh) 2007-11-16 2008-11-13 基板处理方法以及用该方法进行处理而形成的基板
JP2009541175A JP5232798B2 (ja) 2007-11-16 2008-11-13 基板処理方法
US12/743,054 US20100310828A1 (en) 2007-11-16 2008-11-13 Substrate processing method and substrate processed by this method
KR1020107011380A KR101159438B1 (ko) 2007-11-16 2008-11-13 기판 처리 방법, 및 이 방법에 의해 처리된 기판
EP08850923A EP2211374A4 (en) 2007-11-16 2008-11-13 PROCESS FOR TREATING SUBSTRATE AND SUBSTRATE PROCESSED THEREBY

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007297810 2007-11-16
JP2007-297810 2007-11-16

Publications (1)

Publication Number Publication Date
WO2009063954A1 true WO2009063954A1 (ja) 2009-05-22

Family

ID=40638801

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070713 WO2009063954A1 (ja) 2007-11-16 2008-11-13 基板処理方法及びこの方法によって処理された基板

Country Status (8)

Country Link
US (1) US20100310828A1 (ja)
EP (1) EP2211374A4 (ja)
JP (1) JP5232798B2 (ja)
KR (1) KR101159438B1 (ja)
CN (1) CN101861640B (ja)
RU (1) RU2459312C2 (ja)
TW (1) TWI423325B (ja)
WO (1) WO2009063954A1 (ja)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011091374A (ja) * 2009-09-11 2011-05-06 Samco Inc サファイア基板のエッチング方法
JP2011091261A (ja) * 2009-10-23 2011-05-06 Ulvac Japan Ltd 基板処理装置、基板処理方法及びこの方法によって処理された基板
CN102263174A (zh) * 2010-05-24 2011-11-30 广镓光电股份有限公司 半导体发光元件
JP2012004375A (ja) * 2010-06-17 2012-01-05 Teijin Dupont Films Japan Ltd テクスチャーフィルムの製造方法
WO2012086522A1 (ja) * 2010-12-21 2012-06-28 三洋電機株式会社 光電変換装置及びその製造方法
US20130214245A1 (en) * 2010-11-03 2013-08-22 Richard Rugin Chang Light emitting diode and fabrication method thereof
JP2015026826A (ja) * 2013-06-17 2015-02-05 王子ホールディングス株式会社 半導体発光素子用基板、半導体発光素子、半導体発光素子用基板の製造方法、および、半導体発光素子の製造方法
US9203052B2 (en) 2009-11-18 2015-12-01 Samsung Display Co., Ltd. Organic light emitting diode display and method of manufacturing the same
JPWO2013186945A1 (ja) * 2012-06-13 2016-02-01 三菱電機株式会社 太陽電池およびその製造方法
JP2016035932A (ja) * 2011-12-28 2016-03-17 王子ホールディングス株式会社 有機発光ダイオード、有機発光ダイオードの製造方法、画像表示装置および照明装置
JP2016201445A (ja) * 2015-04-09 2016-12-01 王子ホールディングス株式会社 凹凸基板の製造方法。
EP2477238B1 (en) * 2009-09-07 2017-12-20 EL-Seed Corporation Semiconductor light emitting element
JP2019201080A (ja) * 2018-05-15 2019-11-21 王子ホールディングス株式会社 光電変換素子用構造体及び光電変換素子とこれらの製造方法

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CN1839317B (zh) * 2003-05-19 2012-05-30 东丽株式会社 选择结合性物质固定化载体
KR101293205B1 (ko) * 2011-02-15 2013-08-05 한국기계연구원 나노 딤플 패턴의 형성방법 및 나노 구조물
JP2013168505A (ja) * 2012-02-15 2013-08-29 Ulvac Japan Ltd テクスチャー構造形成方法
CN102544289B (zh) * 2012-03-06 2013-12-18 中国科学院半导体研究所 将氮化镓基发光二极管的外延结构表面粗化的方法
EP2922103B1 (en) 2012-08-21 2017-04-05 Oji Holdings Corporation Substrate for semiconductor light emitting elements and semiconductor light emitting element
CN103681302B (zh) * 2012-09-25 2016-07-27 南亚科技股份有限公司 选择性蚀刻方法
CN103730525B (zh) * 2014-01-21 2016-03-30 南通大学 一种同心圆型波纹式太阳能电池硅基片及其制造工艺
CN103746018B (zh) * 2014-01-21 2016-04-13 南通大学 一种瓦片状型波纹式太阳能电池硅基片及其制造工艺
CN108886075B (zh) * 2015-07-29 2021-07-13 日机装株式会社 发光元件的制造方法
CN107204288A (zh) * 2017-05-26 2017-09-26 武汉纺织大学 一种三维微结构的刻蚀方法及其应用
RU2707663C1 (ru) * 2019-01-18 2019-11-28 Федеральное государственное бюджетное учреждение науки Институт Ядерной Физики им. Г.И. Будкера Сибирского отделения (ИЯФ СО РАН) Способ изготовления брэгговской структуры с гофрировкой поверхности
CN111250863B (zh) * 2020-03-31 2021-06-29 格物感知（深圳）科技有限公司 一种特殊无铝焊接键合工艺

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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2477238B1 (en) * 2009-09-07 2017-12-20 EL-Seed Corporation Semiconductor light emitting element
JP2011091374A (ja) * 2009-09-11 2011-05-06 Samco Inc サファイア基板のエッチング方法
JP2011091261A (ja) * 2009-10-23 2011-05-06 Ulvac Japan Ltd 基板処理装置、基板処理方法及びこの方法によって処理された基板
US9203052B2 (en) 2009-11-18 2015-12-01 Samsung Display Co., Ltd. Organic light emitting diode display and method of manufacturing the same
CN102263174A (zh) * 2010-05-24 2011-11-30 广镓光电股份有限公司 半导体发光元件
JP2012004375A (ja) * 2010-06-17 2012-01-05 Teijin Dupont Films Japan Ltd テクスチャーフィルムの製造方法
WO2012032803A1 (ja) * 2010-09-10 2012-03-15 サムコ株式会社 サファイア基板のエッチング方法
CN103168346A (zh) * 2010-09-10 2013-06-19 莎姆克株式会社 蓝宝石基板的蚀刻方法
US20130214245A1 (en) * 2010-11-03 2013-08-22 Richard Rugin Chang Light emitting diode and fabrication method thereof
WO2012086522A1 (ja) * 2010-12-21 2012-06-28 三洋電機株式会社 光電変換装置及びその製造方法
JP2016035932A (ja) * 2011-12-28 2016-03-17 王子ホールディングス株式会社 有機発光ダイオード、有機発光ダイオードの製造方法、画像表示装置および照明装置
JPWO2013186945A1 (ja) * 2012-06-13 2016-02-01 三菱電機株式会社 太陽電池およびその製造方法
JP2015026826A (ja) * 2013-06-17 2015-02-05 王子ホールディングス株式会社 半導体発光素子用基板、半導体発光素子、半導体発光素子用基板の製造方法、および、半導体発光素子の製造方法
JP2016201445A (ja) * 2015-04-09 2016-12-01 王子ホールディングス株式会社 凹凸基板の製造方法。
JP2019201080A (ja) * 2018-05-15 2019-11-21 王子ホールディングス株式会社 光電変換素子用構造体及び光電変換素子とこれらの製造方法
JP7072801B2 (ja) 2018-05-15 2022-05-23 王子ホールディングス株式会社 光電変換素子用構造体及び光電変換素子

Also Published As

Publication number Publication date
KR20100074300A (ko) 2010-07-01
KR101159438B1 (ko) 2012-06-22
RU2010124378A (ru) 2011-12-27
RU2459312C2 (ru) 2012-08-20
TW200943409A (en) 2009-10-16
TWI423325B (zh) 2014-01-11
EP2211374A1 (en) 2010-07-28
CN101861640A (zh) 2010-10-13
US20100310828A1 (en) 2010-12-09
EP2211374A4 (en) 2012-10-10
CN101861640B (zh) 2013-07-03
JP5232798B2 (ja) 2013-07-10
JPWO2009063954A1 (ja) 2011-03-31

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