WO2009025151A1 - 新規なアミド基含有シロキサンアミン化合物 - Google Patents
新規なアミド基含有シロキサンアミン化合物 Download PDFInfo
- Publication number
- WO2009025151A1 WO2009025151A1 PCT/JP2008/063520 JP2008063520W WO2009025151A1 WO 2009025151 A1 WO2009025151 A1 WO 2009025151A1 JP 2008063520 W JP2008063520 W JP 2008063520W WO 2009025151 A1 WO2009025151 A1 WO 2009025151A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- amine compound
- amide group
- containing siloxane
- integer
- novel amide
- Prior art date
Links
- 125000003368 amide group Chemical group 0.000 title abstract 3
- -1 siloxane amine compound Chemical class 0.000 title abstract 3
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 150000001412 amines Chemical class 0.000 abstract 1
- 150000004985 diamines Chemical class 0.000 abstract 1
- 239000000178 monomer Substances 0.000 abstract 1
- 229920002577 polybenzoxazole Polymers 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
- 239000009719 polyimide resin Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 125000005156 substituted alkylene group Chemical group 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0838—Compounds with one or more Si-O-Si sequences
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Silicon Polymers (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009528989A JP5370676B2 (ja) | 2007-08-22 | 2008-07-28 | 新規なアミド基含有シロキサンアミン化合物 |
US12/452,957 US8193295B2 (en) | 2007-08-22 | 2008-07-28 | Amide group-containing siloxane amine compound |
CN2008801039887A CN101784554B (zh) | 2007-08-22 | 2008-07-28 | 新型含酰胺基硅氧烷胺化合物 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-216215 | 2007-08-22 | ||
JP2007216215 | 2007-08-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009025151A1 true WO2009025151A1 (ja) | 2009-02-26 |
Family
ID=40378059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/063520 WO2009025151A1 (ja) | 2007-08-22 | 2008-07-28 | 新規なアミド基含有シロキサンアミン化合物 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8193295B2 (ja) |
JP (1) | JP5370676B2 (ja) |
KR (1) | KR101546981B1 (ja) |
CN (1) | CN101784554B (ja) |
TW (1) | TWI391425B (ja) |
WO (1) | WO2009025151A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010002178A1 (de) | 2010-02-22 | 2011-08-25 | Evonik Goldschmidt GmbH, 45127 | Verfahren zur Herstellung von Amin-Amid-funktionellen Siloxanen |
JP5362811B2 (ja) * | 2009-02-21 | 2013-12-11 | デクセリアルズ株式会社 | 保護膜形成用原料液、保護膜、保護膜付き配線基板 |
TWI512015B (zh) * | 2014-05-30 | 2015-12-11 | Nat Inst Chung Shan Science & Technology | Cross - linked polysiloxane molecules |
JPWO2016017344A1 (ja) * | 2014-07-30 | 2017-06-01 | 住友精化株式会社 | シリコーン樹脂組成物、シリコーン樹脂硬化物、及び、光半導体素子封止体 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8487062B2 (en) * | 2009-09-30 | 2013-07-16 | Shin-Etsu Chemical Co., Ltd. | Polyimidesilicone having alcoholic hydroxyl group and process for producing the same |
US8852848B2 (en) * | 2010-07-28 | 2014-10-07 | Z Electronic Materials USA Corp. | Composition for coating over a photoresist pattern |
US8618236B2 (en) * | 2011-12-23 | 2013-12-31 | Chi Mei Corporation | Polysiloxane-grafted polyimide resin composition and flexible substrate made therefrom |
KR101451630B1 (ko) * | 2012-12-05 | 2014-10-23 | 금오공과대학교 산학협력단 | 이산화탄소 환원방법 및 이를 이용한 이산화탄소 환원장치 |
WO2018135657A1 (ja) * | 2017-01-23 | 2018-07-26 | 日産化学工業株式会社 | 液晶配向剤及び液晶配向膜の製造方法 |
KR101840978B1 (ko) | 2017-09-14 | 2018-03-21 | 주식회사 엘지화학 | 폴리이미드 공중합체 및 이를 이용한 폴리이미드 필름 |
KR101840977B1 (ko) | 2017-09-14 | 2018-03-21 | 주식회사 엘지화학 | 폴리이미드 전구체 조성물 및 이를 이용한 폴리이미드 필름 |
JP7338681B2 (ja) * | 2019-05-22 | 2023-09-05 | 信越化学工業株式会社 | 繊維処理剤 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3488371A (en) * | 1967-08-18 | 1970-01-06 | Gen Electric | Linear difunctional silylamide and process therefor |
JPS57123223A (en) * | 1980-12-15 | 1982-07-31 | M & T Chemicals Inc | Thermostable polymer containing siloxane units and manufacture of siloxane and disiloxane |
JPS61293224A (ja) * | 1985-06-20 | 1986-12-24 | Tokyo Inst Of Technol | ポリシロキサン−ポリアミド系マルチブロツク共重合体及びその製造方法 |
JPS6384188A (ja) * | 1986-09-29 | 1988-04-14 | 新日鐵化学株式会社 | フレキシブルプリント基板の製造方法 |
JPH04325523A (ja) * | 1991-01-24 | 1992-11-13 | Cheil Synthetics Inc | シロキシサン変性ポリイミド樹脂の製造方法 |
JPH0543700A (ja) * | 1991-08-15 | 1993-02-23 | Shin Etsu Chem Co Ltd | 硬化性化合物、その製造方法、絶縁保護膜形成剤及び電子部品用保護剤 |
JPH06206856A (ja) * | 1992-07-20 | 1994-07-26 | Kolon Co Ltd | 高弾性芳香族ポリアミドフィルムおよびその製造方法 |
JP2000173345A (ja) * | 1998-07-02 | 2000-06-23 | Natl Starch & Chem Investment Holding Corp | アリル化されたアミド化合物類から製造される回路部品 |
JP2002201279A (ja) * | 2000-12-28 | 2002-07-19 | Hitachi Chem Co Ltd | ポリフェニルアミドシロキサン重合体の製造方法及びポリフェニルアミドシロキサン重合体 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4480009A (en) * | 1980-12-15 | 1984-10-30 | M&T Chemicals Inc. | Siloxane-containing polymers |
US4890009A (en) * | 1987-04-30 | 1989-12-26 | Hitachi, Ltd. | Monolithic integrated circuit device |
EP0641832B1 (en) * | 1993-08-25 | 1999-01-13 | Dow Corning Asia, Ltd. | Diorganopolysiloxane-Rigid aromatic polymer compositions and preparation thereof |
JP2003131371A (ja) | 2001-10-24 | 2003-05-09 | Kanegafuchi Chem Ind Co Ltd | 難燃性の感光性ドライフィルムレジスト |
-
2008
- 2008-07-28 US US12/452,957 patent/US8193295B2/en not_active Expired - Fee Related
- 2008-07-28 KR KR1020107003390A patent/KR101546981B1/ko not_active IP Right Cessation
- 2008-07-28 JP JP2009528989A patent/JP5370676B2/ja not_active Expired - Fee Related
- 2008-07-28 WO PCT/JP2008/063520 patent/WO2009025151A1/ja active Application Filing
- 2008-07-28 CN CN2008801039887A patent/CN101784554B/zh not_active Expired - Fee Related
- 2008-08-06 TW TW097129782A patent/TWI391425B/zh not_active IP Right Cessation
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3488371A (en) * | 1967-08-18 | 1970-01-06 | Gen Electric | Linear difunctional silylamide and process therefor |
JPS57123223A (en) * | 1980-12-15 | 1982-07-31 | M & T Chemicals Inc | Thermostable polymer containing siloxane units and manufacture of siloxane and disiloxane |
JPS61293224A (ja) * | 1985-06-20 | 1986-12-24 | Tokyo Inst Of Technol | ポリシロキサン−ポリアミド系マルチブロツク共重合体及びその製造方法 |
JPS6384188A (ja) * | 1986-09-29 | 1988-04-14 | 新日鐵化学株式会社 | フレキシブルプリント基板の製造方法 |
JPH04325523A (ja) * | 1991-01-24 | 1992-11-13 | Cheil Synthetics Inc | シロキシサン変性ポリイミド樹脂の製造方法 |
JPH0543700A (ja) * | 1991-08-15 | 1993-02-23 | Shin Etsu Chem Co Ltd | 硬化性化合物、その製造方法、絶縁保護膜形成剤及び電子部品用保護剤 |
JPH06206856A (ja) * | 1992-07-20 | 1994-07-26 | Kolon Co Ltd | 高弾性芳香族ポリアミドフィルムおよびその製造方法 |
JP2000173345A (ja) * | 1998-07-02 | 2000-06-23 | Natl Starch & Chem Investment Holding Corp | アリル化されたアミド化合物類から製造される回路部品 |
JP2002201279A (ja) * | 2000-12-28 | 2002-07-19 | Hitachi Chem Co Ltd | ポリフェニルアミドシロキサン重合体の製造方法及びポリフェニルアミドシロキサン重合体 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5362811B2 (ja) * | 2009-02-21 | 2013-12-11 | デクセリアルズ株式会社 | 保護膜形成用原料液、保護膜、保護膜付き配線基板 |
DE102010002178A1 (de) | 2010-02-22 | 2011-08-25 | Evonik Goldschmidt GmbH, 45127 | Verfahren zur Herstellung von Amin-Amid-funktionellen Siloxanen |
EP2365021A1 (de) | 2010-02-22 | 2011-09-14 | Evonik Goldschmidt GmbH | Verfahren zur Herstellung von Amin-Amid-funktionellen Siloxanen |
TWI512015B (zh) * | 2014-05-30 | 2015-12-11 | Nat Inst Chung Shan Science & Technology | Cross - linked polysiloxane molecules |
JPWO2016017344A1 (ja) * | 2014-07-30 | 2017-06-01 | 住友精化株式会社 | シリコーン樹脂組成物、シリコーン樹脂硬化物、及び、光半導体素子封止体 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009025151A1 (ja) | 2010-11-18 |
US8193295B2 (en) | 2012-06-05 |
TWI391425B (zh) | 2013-04-01 |
TW200914499A (en) | 2009-04-01 |
KR101546981B1 (ko) | 2015-08-24 |
CN101784554A (zh) | 2010-07-21 |
US20100137547A1 (en) | 2010-06-03 |
JP5370676B2 (ja) | 2013-12-18 |
CN101784554B (zh) | 2013-07-17 |
KR20100057810A (ko) | 2010-06-01 |
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