WO2008133010A1 - フィルタ回路素子及び電子回路装置 - Google Patents

フィルタ回路素子及び電子回路装置 Download PDF

Info

Publication number
WO2008133010A1
WO2008133010A1 PCT/JP2008/057003 JP2008057003W WO2008133010A1 WO 2008133010 A1 WO2008133010 A1 WO 2008133010A1 JP 2008057003 W JP2008057003 W JP 2008057003W WO 2008133010 A1 WO2008133010 A1 WO 2008133010A1
Authority
WO
WIPO (PCT)
Prior art keywords
multilayer substrate
layer
vias
fixed potential
outer side
Prior art date
Application number
PCT/JP2008/057003
Other languages
English (en)
French (fr)
Inventor
Takashi Nakano
Masaharu Imazato
Yoji Nishio
Original Assignee
Nec Corporation
Elpida Memory, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation, Elpida Memory, Inc. filed Critical Nec Corporation
Priority to US12/450,690 priority Critical patent/US8253029B2/en
Priority to JP2009511763A priority patent/JPWO2008133010A1/ja
Publication of WO2008133010A1 publication Critical patent/WO2008133010A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H01P1/20327—Electromagnetic interstage coupling
    • H01P1/20336—Comb or interdigital filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H01P1/20327—Electromagnetic interstage coupling
    • H01P1/20354—Non-comb or non-interdigital filters
    • H01P1/20363—Linear resonators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Filters And Equalizers (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

多層基板に複数のビアを隣接させて配置し、複数のビアの一方の外側の第１のビアは多層基板に設けられた第１の引き出し線とで電気的に接続され、他方の外側の第２のビアは多層基板に設けられた第２の引き出し線と電気的に接続され、複数のビアは多層基板の第１の固定電位層（例えばグランド層）と接続され、第１及び第２の引き出し線と固定電位層との間に、多層基板の内層として、複数のビアとクリアランスを介して、第１の固定電位層と同電位の、少なくとも１層の第２の固定電位層を設ける。これにより、多層基板上に余分な製造工程の追加無く、面積占有率の低いＢＰＦを形成する。
PCT/JP2008/057003 2007-04-12 2008-04-09 フィルタ回路素子及び電子回路装置 WO2008133010A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/450,690 US8253029B2 (en) 2007-04-12 2008-04-09 Filter circuit element and electronic circuit device
JP2009511763A JPWO2008133010A1 (ja) 2007-04-12 2008-04-09 フィルタ回路素子及び電子回路装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007104838 2007-04-12
JP2007-104838 2007-04-12

Publications (1)

Publication Number Publication Date
WO2008133010A1 true WO2008133010A1 (ja) 2008-11-06

Family

ID=39925469

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057003 WO2008133010A1 (ja) 2007-04-12 2008-04-09 フィルタ回路素子及び電子回路装置

Country Status (3)

Country Link
US (1) US8253029B2 (ja)
JP (1) JPWO2008133010A1 (ja)
WO (1) WO2008133010A1 (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011010393A1 (en) * 2009-07-21 2011-01-27 Nec Corporation Resonant elements designed vertically in a multilayer board and filters based on these elements
JP2011091781A (ja) * 2009-09-28 2011-05-06 Kyocera Corp 複合フィルタならびにそれを用いた無線通信モジュールおよび無線通信機器
JP2011097209A (ja) * 2009-10-28 2011-05-12 Kyocera Corp 同軸フィルタならびにそれを用いた無線通信モジュールおよび無線通信機器
JP2012514350A (ja) * 2008-12-25 2012-06-21 日本電気株式会社 組み合わせビア構造体に基づくフィルタ
WO2013171788A1 (en) * 2012-05-15 2013-11-21 Nec Corporation Hybrid resonators in multilayer substratesand filters based on these resonators
WO2014199591A1 (ja) * 2013-06-11 2014-12-18 パナソニックＩｐマネジメント株式会社 マイクロ波回路
WO2015198912A1 (ja) * 2014-06-26 2015-12-30 ソニー株式会社 半導体装置および半導体装置の製造方法
WO2019111354A1 (ja) * 2017-12-06 2019-06-13 三菱電機株式会社 信号伝送システム
JP2019096691A (ja) * 2017-11-21 2019-06-20 日本オクラロ株式会社 プリント回路基板及び当該プリント回路基板を備える光送受信器
JP7473258B1 (ja) 2023-03-17 2024-04-23 Ｎｅｃプラットフォームズ株式会社 配線基板切り替え装置および切り替え方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6169395B2 (ja) 2012-08-27 2017-07-26 株式会社トーキン 共振器
US9357632B1 (en) * 2013-04-19 2016-05-31 Juniper Networks, Inc. Apparatus, system, and method for reducing interference between clock signals
JP2015177004A (ja) * 2014-03-14 2015-10-05 ミネベア株式会社 フレキシブルプリント基板
KR102602697B1 (ko) * 2018-05-21 2023-11-16 삼성전자주식회사 베이스 기판을 가지는 전자 장치
US20220407212A1 (en) * 2021-06-17 2022-12-22 Intel Corporation Millimeter wave components in a glass core of a substrate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04317202A (ja) * 1991-04-17 1992-11-09 Tdk Corp 誘電体トリプレートストリップ線路共振回路及びその共振周波数調整方法
JP2002094302A (ja) * 2000-09-14 2002-03-29 Advanced Space Communications Research Laboratory 高域通過フィルタ
JP2005033264A (ja) * 2003-07-07 2005-02-03 Fujitsu Ltd 超伝導デュプレクサ装置
JP2005277962A (ja) * 2004-03-25 2005-10-06 Murata Mfg Co Ltd 誘電体フィルタ、誘電体デュプレクサおよび通信装置
JP2006014009A (ja) * 2004-06-28 2006-01-12 Matsushita Electric Ind Co Ltd 配線基板およびその製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60177703A (ja) * 1984-02-23 1985-09-11 Mitsubishi Electric Corp 共振素子
JPS63128801A (ja) * 1986-11-19 1988-06-01 Matsushita Electric Ind Co Ltd 濾波器
US5406235A (en) * 1990-12-26 1995-04-11 Tdk Corporation High frequency device
JP3505773B2 (ja) * 1994-04-11 2004-03-15 株式会社村田製作所 誘電体フィルタの周波数調整方法
US5952709A (en) * 1995-12-28 1999-09-14 Kyocera Corporation High-frequency semiconductor device and mounted structure thereof
JPH1028006A (ja) * 1996-07-10 1998-01-27 Kyocera Corp 積層共振器および積層誘電体フィルタならびに積層誘電体フィルタの共振特性調整方法
JP4234833B2 (ja) 1998-02-02 2009-03-04 パナソニック株式会社 配線基板の設計支援装置
JP3201345B2 (ja) * 1998-05-13 2001-08-20 日本電気株式会社 多層プリント配線板
JP3669219B2 (ja) * 1999-08-10 2005-07-06 日本電気株式会社 多層プリント配線板
JP2001077498A (ja) 1999-09-03 2001-03-23 Nec Eng Ltd セラミック基板及びその製造方法
JP3577262B2 (ja) * 2000-07-07 2004-10-13 シャープ株式会社 フィルタ回路およびそれを用いた高周波通信回路装置
JP2002171193A (ja) 2000-11-30 2002-06-14 Kyocera Corp 高周波モジュール基板
JP3443408B2 (ja) * 2001-02-26 2003-09-02 松下電器産業株式会社 配線基板及びそれを用いた半導体装置
JP3781178B2 (ja) * 2001-03-30 2006-05-31 ユーディナデバイス株式会社 高周波半導体装置の多層配線構造
JP3649183B2 (ja) * 2001-12-27 2005-05-18 ソニー株式会社 フィルタ回路装置及びその製造方法
JP2004039897A (ja) 2002-07-04 2004-02-05 Toshiba Corp 電子デバイスの接続方法
JP4248988B2 (ja) 2003-10-02 2009-04-02 シャープ株式会社 多層回路基板、回路基板情報の修正方法、回路基板情報の修正装置、回路基板情報の修正プログラム及び修正プログラムを記録した記録媒体
JP2005277028A (ja) 2004-03-24 2005-10-06 Mitsubishi Electric Corp 高速伝送用基板構造
JP4367660B2 (ja) * 2004-07-23 2009-11-18 日本電気株式会社 多層印刷回路基板の複合ビア構造およびこれを用いたフィルタ
JP2006129215A (ja) 2004-10-29 2006-05-18 Matsushita Electric Ind Co Ltd 配線基板、および電子機器
JP2006269627A (ja) 2005-03-23 2006-10-05 Nec Corp プリント配線基板のヴィア構造
JP4317202B2 (ja) 2006-05-10 2009-08-19 日本発條株式会社 スライダ支持装置とその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04317202A (ja) * 1991-04-17 1992-11-09 Tdk Corp 誘電体トリプレートストリップ線路共振回路及びその共振周波数調整方法
JP2002094302A (ja) * 2000-09-14 2002-03-29 Advanced Space Communications Research Laboratory 高域通過フィルタ
JP2005033264A (ja) * 2003-07-07 2005-02-03 Fujitsu Ltd 超伝導デュプレクサ装置
JP2005277962A (ja) * 2004-03-25 2005-10-06 Murata Mfg Co Ltd 誘電体フィルタ、誘電体デュプレクサおよび通信装置
JP2006014009A (ja) * 2004-06-28 2006-01-12 Matsushita Electric Ind Co Ltd 配線基板およびその製造方法

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012514350A (ja) * 2008-12-25 2012-06-21 日本電気株式会社 組み合わせビア構造体に基づくフィルタ
JP2012533912A (ja) * 2009-07-21 2012-12-27 日本電気株式会社 多層基板中に縦方向に構成された共振素子およびこれらを用いたフィルタ
US8994480B2 (en) 2009-07-21 2015-03-31 Nec Corporation Resonant elements designed vertically in a multilayer board and filters based on these elements
WO2011010393A1 (en) * 2009-07-21 2011-01-27 Nec Corporation Resonant elements designed vertically in a multilayer board and filters based on these elements
JP2011091781A (ja) * 2009-09-28 2011-05-06 Kyocera Corp 複合フィルタならびにそれを用いた無線通信モジュールおよび無線通信機器
JP2011097209A (ja) * 2009-10-28 2011-05-12 Kyocera Corp 同軸フィルタならびにそれを用いた無線通信モジュールおよび無線通信機器
US9583807B2 (en) 2012-05-15 2017-02-28 Lenovo Innovations Limited (Hong Kong) Hybrid resonators in multilayer substrates and filters based on these resonators
WO2013171788A1 (en) * 2012-05-15 2013-11-21 Nec Corporation Hybrid resonators in multilayer substratesand filters based on these resonators
WO2014199591A1 (ja) * 2013-06-11 2014-12-18 パナソニックＩｐマネジメント株式会社 マイクロ波回路
WO2015198912A1 (ja) * 2014-06-26 2015-12-30 ソニー株式会社 半導体装置および半導体装置の製造方法
US10008458B2 (en) 2014-06-26 2018-06-26 Sony Corporation Semiconductor device capable of realizing impedance control and method of manufacturing the same
JP2019096691A (ja) * 2017-11-21 2019-06-20 日本オクラロ株式会社 プリント回路基板及び当該プリント回路基板を備える光送受信器
US11057986B2 (en) 2017-11-21 2021-07-06 Lumentum Japan, Inc. Printed circuit board and optical transceiver with the printed circuit board
WO2019111354A1 (ja) * 2017-12-06 2019-06-13 三菱電機株式会社 信号伝送システム
JPWO2019111354A1 (ja) * 2017-12-06 2020-04-09 三菱電機株式会社 信号伝送システム
JP7473258B1 (ja) 2023-03-17 2024-04-23 Ｎｅｃプラットフォームズ株式会社 配線基板切り替え装置および切り替え方法

Also Published As

Publication number Publication date
US20100096174A1 (en) 2010-04-22
US8253029B2 (en) 2012-08-28
JPWO2008133010A1 (ja) 2010-07-22

Similar Documents

Publication Publication Date Title
WO2008133010A1 (ja) フィルタ回路素子及び電子回路装置
WO2007122550A3 (en) Semiconductor light emitting device with integrated electronic components
WO2011084216A3 (en) Substrate for integrated circuit devices including multi-layer glass core and methods of making the same
EP1739747A3 (en) Semiconductor chip and method of manufacturing the same
WO2009066183A3 (en) Tightly-coupled pcb gnss circuit and manufacturing method
WO2009037939A1 (ja) プリント配線板及びその製造方法
WO2010145907A3 (en) Methods and systems for fabrication of mems cmos devices
WO2009048604A3 (en) Robust multi-layer wiring elements and assemblies with embedded microelectronic elements
WO2010104610A8 (en) Stacked microelectronic assembly with microelectronic elements having vias extending through bond pads
WO2008123399A1 (ja) 三次元構造半導体装置
WO2010104744A3 (en) Electronic devices formed of two or more substrates bonded together, electronic systems comprising electronic devices and methods of making electronic devices
WO2009048154A1 (ja) 半導体装置及びその設計方法
EP2654387B1 (en) Printed circuit board
WO2008120755A1 (ja) 機能素子内蔵回路基板及びその製造方法、並びに電子機器
TW200713487A (en) Embedded capacitor with interdigitated structure
WO2011103266A3 (en) Shielding structure for transmission lines
WO2015015319A3 (en) Architecture of spare wiring structures for improved engineering change orders
WO2012175207A3 (de) Elektronische baugruppe und verfahren zu deren herstellung
WO2011056306A3 (en) Microelectronic package and method of manufacturing same
WO2011132971A3 (ko) 장벽층을 갖는 범프를 포함하는 반도체칩 및 그 제조방법
WO2008111408A1 (ja) 多層配線基板及びその製造方法
WO2009037833A1 (ja) 立体プリント配線板およびその製造方法ならびに電子部品モジュール
TW200715525A (en) Semiconductor integrated circuit device and method for manufacturing same
TW200733830A (en) Differential signal transmission structure, wiring board and chip package
WO2007070356A3 (en) Package using array capacitor core

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08740106

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009511763

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12450690

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08740106

Country of ref document: EP

Kind code of ref document: A1