WO2008099626A1 - 磁気抵抗効果素子、および磁気ランダムアクセスメモリ - Google Patents
磁気抵抗効果素子、および磁気ランダムアクセスメモリ Download PDFInfo
- Publication number
- WO2008099626A1 WO2008099626A1 PCT/JP2008/050196 JP2008050196W WO2008099626A1 WO 2008099626 A1 WO2008099626 A1 WO 2008099626A1 JP 2008050196 W JP2008050196 W JP 2008050196W WO 2008099626 A1 WO2008099626 A1 WO 2008099626A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- random access
- access memory
- sensing
- magnetic
- Prior art date
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Classifications
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1675—Writing or programming circuits or methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3268—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
- H01F10/3272—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn by use of anti-parallel coupled [APC] ferromagnetic layers, e.g. artificial ferrimagnets [AFI], artificial [AAF] or synthetic [SAF] anti-ferromagnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/329—Spin-exchange coupled multilayers wherein the magnetisation of the free layer is switched by a spin-polarised current, e.g. spin torque effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
- H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
- H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008558018A JP5224127B2 (ja) | 2007-02-13 | 2008-01-10 | 磁気抵抗効果素子、および磁気ランダムアクセスメモリ |
US12/526,994 US8023315B2 (en) | 2007-02-13 | 2008-01-10 | Magnetoresistive effect element and magnetic random access memory |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007031769 | 2007-02-13 | ||
JP2007-031769 | 2007-02-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008099626A1 true WO2008099626A1 (ja) | 2008-08-21 |
Family
ID=39689872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/050196 WO2008099626A1 (ja) | 2007-02-13 | 2008-01-10 | 磁気抵抗効果素子、および磁気ランダムアクセスメモリ |
Country Status (3)
Country | Link |
---|---|
US (1) | US8023315B2 (ja) |
JP (2) | JP5224127B2 (ja) |
WO (1) | WO2008099626A1 (ja) |
Cited By (16)
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JP2010080920A (ja) * | 2008-08-29 | 2010-04-08 | National Institute Of Advanced Industrial Science & Technology | トンネル磁気抵抗素子 |
WO2010047328A1 (ja) * | 2008-10-23 | 2010-04-29 | 日本電気株式会社 | 半導体記憶装置 |
EP2221826A1 (en) * | 2009-02-19 | 2010-08-25 | Crocus Technology S.A. | Active strap magnetic random access memory cells |
WO2010095589A1 (ja) * | 2009-02-17 | 2010-08-26 | 日本電気株式会社 | 磁気抵抗効果素子、及び磁気ランダムアクセスメモリ |
JP2010245415A (ja) * | 2009-04-09 | 2010-10-28 | Nec Corp | 磁気抵抗記憶装置及びその製造方法 |
JPWO2011027404A1 (ja) * | 2009-09-04 | 2013-01-31 | 株式会社日立製作所 | 磁気メモリ |
JP2013030769A (ja) * | 2011-07-12 | 2013-02-07 | Crocus Technology Sa | スイッチング磁界の改善された分散を伴う磁気ランダムアクセスメモリセル |
JP5146846B2 (ja) * | 2007-03-08 | 2013-02-20 | 日本電気株式会社 | 磁気メモリセル及び磁気ランダムアクセスメモリ |
JP2013513255A (ja) * | 2009-12-08 | 2013-04-18 | クアルコム,インコーポレイテッド | 磁気トンネル接合デバイス |
JP2013541219A (ja) * | 2010-10-26 | 2013-11-07 | サントル ナショナル ドゥ ラ ルシェルシュ シアンティフィク | 書込み可能な磁気エレメント |
JP2014140077A (ja) * | 2009-11-27 | 2014-07-31 | Nec Corp | 磁気抵抗効果素子及び磁気ランダムアクセスメモリの製造方法 |
US20170323928A1 (en) * | 2010-12-17 | 2017-11-09 | Intel Corporation | Write current reduction in spin transfer torque memory devices |
JP2018067701A (ja) * | 2016-10-20 | 2018-04-26 | コリア ユニバーシティ リサーチ アンド ビジネス ファウンデーションKorea University Research And Business Foundation | 磁気トンネル接合素子及び磁気メモリ素子 |
JP6481805B1 (ja) * | 2018-01-12 | 2019-03-13 | Tdk株式会社 | 磁壁移動型磁気記録素子及び磁気記録アレイ |
JP2019204949A (ja) * | 2018-05-22 | 2019-11-28 | Tdk株式会社 | スピン流磁化回転型磁気抵抗効果素子、及び磁気メモリ |
JP2021002694A (ja) * | 2015-11-27 | 2021-01-07 | Tdk株式会社 | スピン流磁化反転素子、磁気抵抗効果素子及び磁気メモリ |
Families Citing this family (18)
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JP5099368B2 (ja) | 2006-04-11 | 2012-12-19 | 日本電気株式会社 | 磁気ランダムアクセスメモリ |
US8300456B2 (en) * | 2006-12-06 | 2012-10-30 | Nec Corporation | Magnetic random access memory and method of manufacturing the same |
US8238135B2 (en) * | 2007-03-07 | 2012-08-07 | Nec Corporation | MRAM utilizing free layer having fixed magnetization regions with larger damping coefficient than the switching region |
WO2008120482A1 (ja) | 2007-03-29 | 2008-10-09 | Nec Corporation | 磁気ランダムアクセスメモリ |
KR101684915B1 (ko) * | 2010-07-26 | 2016-12-12 | 삼성전자주식회사 | 자기 기억 소자 |
US8482967B2 (en) | 2010-11-03 | 2013-07-09 | Seagate Technology Llc | Magnetic memory element with multi-domain storage layer |
US9337424B2 (en) * | 2012-11-13 | 2016-05-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Magnetoresistive tunnel junction |
KR102114285B1 (ko) * | 2013-04-09 | 2020-05-22 | 에스케이하이닉스 주식회사 | 반도체 장치 및 이 반도체 장치를 포함하는 마이크로프로세서, 프로세서, 시스템, 데이터 저장 시스템 및 메모리 시스템 |
US9344345B2 (en) * | 2014-03-19 | 2016-05-17 | Micron Technology, Inc. | Memory cells having a self-aligning polarizer |
US9165610B1 (en) * | 2014-06-30 | 2015-10-20 | Globalfoundries Singapore Pte. Ltd. | Non-volatile memory cell arrays and methods of fabricating semiconductor devices |
US10109331B2 (en) * | 2016-03-01 | 2018-10-23 | Toshiba Memory Corporation | Magnetic storage device with a wiring having a ferromagnetic layer |
WO2018004648A1 (en) * | 2016-07-01 | 2018-01-04 | Intel Corporation | Apparatuses, systems, and methods associated with a magnetoelectric cell including a magnetoelectric nanocomposite |
US10741318B2 (en) | 2017-09-05 | 2020-08-11 | Tdk Corporation | Spin current magnetization rotational element, spin-orbit-torque magnetoresistance effect element, magnetic memory, and high-frequency magnetic element |
JP2019047030A (ja) * | 2017-09-05 | 2019-03-22 | Tdk株式会社 | スピン流磁化反転素子、磁気抵抗効果素子、磁気メモリ及び高周波磁気素子 |
US10923649B2 (en) * | 2018-05-22 | 2021-02-16 | Tdk Corporation | Spin current magnetization rotation magnetoresistance effect element, and magnetic memory |
US11276730B2 (en) * | 2019-01-11 | 2022-03-15 | Intel Corporation | Spin orbit torque memory devices and methods of fabrication |
US10891999B1 (en) * | 2019-06-19 | 2021-01-12 | Western Digital Technologies, Inc. | Perpendicular SOT MRAM |
JP2021132110A (ja) * | 2020-02-19 | 2021-09-09 | Tdk株式会社 | 磁壁移動素子および磁気記録アレイ |
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2013
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JP5146846B2 (ja) * | 2007-03-08 | 2013-02-20 | 日本電気株式会社 | 磁気メモリセル及び磁気ランダムアクセスメモリ |
JP2010080920A (ja) * | 2008-08-29 | 2010-04-08 | National Institute Of Advanced Industrial Science & Technology | トンネル磁気抵抗素子 |
WO2010047328A1 (ja) * | 2008-10-23 | 2010-04-29 | 日本電気株式会社 | 半導体記憶装置 |
JP5565704B2 (ja) * | 2008-10-23 | 2014-08-06 | 日本電気株式会社 | 半導体記憶装置 |
WO2010095589A1 (ja) * | 2009-02-17 | 2010-08-26 | 日本電気株式会社 | 磁気抵抗効果素子、及び磁気ランダムアクセスメモリ |
JPWO2010095589A1 (ja) * | 2009-02-17 | 2012-08-23 | 日本電気株式会社 | 磁気抵抗効果素子、及び磁気ランダムアクセスメモリ |
JP2010192902A (ja) * | 2009-02-19 | 2010-09-02 | Crocus Technology Sa | アクティブストラップ式磁気ランダムアクセスメモリの記憶素子 |
EP2221826A1 (en) * | 2009-02-19 | 2010-08-25 | Crocus Technology S.A. | Active strap magnetic random access memory cells |
JP2010245415A (ja) * | 2009-04-09 | 2010-10-28 | Nec Corp | 磁気抵抗記憶装置及びその製造方法 |
JPWO2011027404A1 (ja) * | 2009-09-04 | 2013-01-31 | 株式会社日立製作所 | 磁気メモリ |
JP5374589B2 (ja) * | 2009-09-04 | 2013-12-25 | 株式会社日立製作所 | 磁気メモリ |
JP2014140077A (ja) * | 2009-11-27 | 2014-07-31 | Nec Corp | 磁気抵抗効果素子及び磁気ランダムアクセスメモリの製造方法 |
JP2013513255A (ja) * | 2009-12-08 | 2013-04-18 | クアルコム,インコーポレイテッド | 磁気トンネル接合デバイス |
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JP2013541219A (ja) * | 2010-10-26 | 2013-11-07 | サントル ナショナル ドゥ ラ ルシェルシュ シアンティフィク | 書込み可能な磁気エレメント |
KR20140051104A (ko) * | 2010-10-26 | 2014-04-30 | 상뜨로 나쇼날 드 라 러쉐르쉐 샹띠피크 | 기록가능한 자기 부재 |
US20170323928A1 (en) * | 2010-12-17 | 2017-11-09 | Intel Corporation | Write current reduction in spin transfer torque memory devices |
JP2013030769A (ja) * | 2011-07-12 | 2013-02-07 | Crocus Technology Sa | スイッチング磁界の改善された分散を伴う磁気ランダムアクセスメモリセル |
JP2021002694A (ja) * | 2015-11-27 | 2021-01-07 | Tdk株式会社 | スピン流磁化反転素子、磁気抵抗効果素子及び磁気メモリ |
US11637237B2 (en) | 2015-11-27 | 2023-04-25 | Tdk Corporation | Spin current magnetization rotational element |
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JP7035147B2 (ja) | 2015-11-27 | 2022-03-14 | Tdk株式会社 | スピン流磁化反転素子、磁気抵抗効果素子及び磁気メモリ |
KR20180043696A (ko) * | 2016-10-20 | 2018-04-30 | 고려대학교 산학협력단 | 자기 터널 접합 소자 및 자기 메모리 소자 |
US10693058B2 (en) | 2016-10-20 | 2020-06-23 | Korea University Research And Business Foundation | Magnetic tunnel junction device and magnetic memory device |
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JP2018067701A (ja) * | 2016-10-20 | 2018-04-26 | コリア ユニバーシティ リサーチ アンド ビジネス ファウンデーションKorea University Research And Business Foundation | 磁気トンネル接合素子及び磁気メモリ素子 |
US10600461B2 (en) | 2018-01-12 | 2020-03-24 | Tdk Corporation | Magnetic domain wall displacement type magnetic recording element and magnetic recording array |
WO2019138535A1 (ja) * | 2018-01-12 | 2019-07-18 | Tdk株式会社 | 磁壁移動型磁気記録素子及び磁気記録アレイ |
JP6481805B1 (ja) * | 2018-01-12 | 2019-03-13 | Tdk株式会社 | 磁壁移動型磁気記録素子及び磁気記録アレイ |
JP2019204949A (ja) * | 2018-05-22 | 2019-11-28 | Tdk株式会社 | スピン流磁化回転型磁気抵抗効果素子、及び磁気メモリ |
JP7124788B2 (ja) | 2018-05-22 | 2022-08-24 | Tdk株式会社 | スピン流磁化回転型磁気抵抗効果素子、及び磁気メモリ |
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US8023315B2 (en) | 2011-09-20 |
US20100091555A1 (en) | 2010-04-15 |
JP2013118417A (ja) | 2013-06-13 |
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JP5224127B2 (ja) | 2013-07-03 |
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