WO2008081794A1 - 発光装置およびその製造方法 - Google Patents

発光装置およびその製造方法 Download PDF

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Publication number
WO2008081794A1
WO2008081794A1 PCT/JP2007/074892 JP2007074892W WO2008081794A1 WO 2008081794 A1 WO2008081794 A1 WO 2008081794A1 JP 2007074892 W JP2007074892 W JP 2007074892W WO 2008081794 A1 WO2008081794 A1 WO 2008081794A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting device
emitting element
section
resin
Prior art date
Application number
PCT/JP2007/074892
Other languages
English (en)
French (fr)
Inventor
Masaki Hayashi
Original Assignee
Nichia Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corporation filed Critical Nichia Corporation
Priority to EP07860121.8A priority Critical patent/EP2109157B1/en
Priority to US12/521,428 priority patent/US8093619B2/en
Priority to JP2008552112A priority patent/JP5168152B2/ja
Publication of WO2008081794A1 publication Critical patent/WO2008081794A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

　効率よく製造でき、安定した発光特性を長期間維持できる発光装置を提供する。発光装置１は、発光素子１０を収容する凹部４０ａを形成する周辺部４０ｂと凹部４０ａの底面を形成する底面部４０ｃとを有する第１樹脂成形体４０と、発光素子１０を被覆する第２樹脂成形体５０とを有し、第１樹脂成形体４０は、エポキシ樹脂を必須成分とする熱硬化性エポキシ樹脂組成物から構成され、底面部４０ｃが発光素子１０およびワイヤ６０の配設領域２０ａ，３０ａを除いてリードフレーム２０，３０の表面を覆うと共に、底面部４０ｃの厚さがリードフレーム２０，３０の表面から発光素子１０の先端までの厚さよりも薄く形成されている。
PCT/JP2007/074892 2006-12-28 2007-12-26 発光装置およびその製造方法 WO2008081794A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP07860121.8A EP2109157B1 (en) 2006-12-28 2007-12-26 Light emitting device and method for manufacturing the same
US12/521,428 US8093619B2 (en) 2006-12-28 2007-12-26 Light emitting device
JP2008552112A JP5168152B2 (ja) 2006-12-28 2007-12-26 発光装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-353669 2006-12-28
JP2006353669 2006-12-28

Publications (1)

Publication Number Publication Date
WO2008081794A1 true WO2008081794A1 (ja) 2008-07-10

Family

ID=39588477

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074892 WO2008081794A1 (ja) 2006-12-28 2007-12-26 発光装置およびその製造方法

Country Status (4)

Country Link
US (1) US8093619B2 (ja)
EP (1) EP2109157B1 (ja)
JP (1) JP5168152B2 (ja)
WO (1) WO2008081794A1 (ja)

Cited By (62)

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JP2010062272A (ja) * 2008-09-03 2010-03-18 Nichia Corp 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法
JP2010283261A (ja) * 2009-06-08 2010-12-16 Nichia Corp 発光装置
JP2011014739A (ja) * 2009-07-02 2011-01-20 Shindengen Electric Mfg Co Ltd 半導体装置
JP2011029420A (ja) * 2009-07-27 2011-02-10 Nichia Corp 光半導体装置及びその製造方法
JP2011035082A (ja) * 2009-07-31 2011-02-17 Nichia Corp 光半導体装置及びその製造方法
JP2011109102A (ja) * 2009-11-17 2011-06-02 Lg Innotek Co Ltd 発光素子パッケージ
JP2011119729A (ja) * 2009-12-01 2011-06-16 Lg Innotek Co Ltd 発光素子
JP2011159837A (ja) * 2010-02-01 2011-08-18 Apic Yamada Corp リードフレーム及びｌｅｄパッケージ用基板
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WO2011136356A1 (ja) * 2010-04-30 2011-11-03 ローム株式会社 Ｌｅｄモジュール
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US20120001312A1 (en) * 2010-06-29 2012-01-05 Panasonic Corporation Package for semiconductor device, method of manufacturing the same and semiconductor device
JP2012089638A (ja) * 2010-10-19 2012-05-10 Kobe Steel Ltd Ｌｅｄ用リードフレーム
KR101172177B1 (ko) 2010-08-09 2012-08-07 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 시스템
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US8093619B2 (en) 2012-01-10
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US20100314654A1 (en) 2010-12-16
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