WO2008053840A1 - Feuille adhésive double face décollable sous l'action de la chaleur et procédé de traitement d'une pièce à travailler - Google Patents
Feuille adhésive double face décollable sous l'action de la chaleur et procédé de traitement d'une pièce à travailler Download PDFInfo
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- WO2008053840A1 WO2008053840A1 PCT/JP2007/071033 JP2007071033W WO2008053840A1 WO 2008053840 A1 WO2008053840 A1 WO 2008053840A1 JP 2007071033 W JP2007071033 W JP 2007071033W WO 2008053840 A1 WO2008053840 A1 WO 2008053840A1
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- sensitive adhesive
- heat
- pressure
- workpiece
- peelable
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/26—Porous or cellular plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/24—Presence of a foam
- C09J2400/243—Presence of a foam in the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68331—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding of passive members, e.g. die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
Definitions
- the present invention relates to a heat-peelable double-sided pressure-sensitive adhesive sheet and a method for applying an object to be coated using the same, and more specifically, the adhesive force can be quickly reduced by heat treatment, and the surface has large surface irregularities.
- the present invention relates to a heat-peelable double-sided pressure-sensitive adhesive sheet suitable for processing a resin body and a method for processing an object to be processed using the same.
- a heat-peelable pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer containing thermally expandable microspheres is provided on a substrate has been known (for example, patent documents;! To 4 etc.).
- the adhesive strength can be reduced by foaming or expansion treatment by heating the adhesive layer, and it can be easily peeled off from the adherend.
- a support that is approximately the same size as the wafer is bonded with a heat-releasable double-sided adhesive sheet. The method has been recognized.
- Patent Document 1 Japanese Patent Publication No. 51-24534
- Patent Document 2 JP-A-56-61468
- Patent Document 3 Japanese Patent Laid-Open No. 56-61469
- Patent Document 4 JP-A-60-252681
- the object of the present invention is to bond the surface side of the workpiece to one side and paste the support to the other side as a pedestal and perform processing on the back side of the workpiece. Even if there are large irregularities on the surface of the workpiece, the support does not float, and as a result, cracks do not occur in the workpiece during processing! /,
- the heat-peelable double-sided PSA sheet, and the heat It is providing the processing method of the to-be-processed object using a peelable double-sided adhesive sheet.
- the present inventors have found that when a specific substrate is used as the heat-releasable double-sided pressure-sensitive adhesive sheet, the surface unevenness is large!
- the present invention has been completed by finding that even when the workpiece is fixed, it is possible to prevent the floating of the support used as a pedestal and the occurrence of cracks in the workpiece during machining due to this.
- the present invention is a heat-peelable double-sided pressure-sensitive adhesive sheet in which a heat-peelable pressure-sensitive adhesive layer A is provided on one side of the substrate and a pressure-sensitive adhesive layer B is provided on the other side.
- a heat-peelable double-sided pressure-sensitive adhesive sheet characterized in that the material comprises a porous substrate.
- the porous substrate preferably has a density of 0.9 g / cm 3 or less and a tensile modulus of 20 MPa or less.
- the substrate may be composed of a laminate of a porous substrate and a non-porous substrate.
- the adhesive constituting the pressure-sensitive adhesive layer B for example, a pressure-sensitive adhesive, an ultraviolet curable pressure-sensitive adhesive, a heat-peelable pressure-sensitive adhesive, a thermoplastic pressure-sensitive adhesive, a thermosetting pressure-sensitive adhesive, and the like can be used.
- the present invention also provides a laminate in which a workpiece is bonded to one of the heat-peelable pressure-sensitive adhesive layer A and the pressure-sensitive adhesive layer B of the heat-peelable double-sided pressure-sensitive adhesive sheet, and a support is bonded to the other.
- a processing method of a workpiece including a processing step, a processing step of processing the bonded workpieces, and a peeling recovery step of peeling and collecting the workpieces by heat treatment after the processing of the workpieces.
- examples of the workpiece include an electronic component and a semiconductor wafer.
- This method is particularly suitable for processing a workpiece having a surface having a maximum surface unevenness difference of 10 in or more by bonding the surface to the adhesive surface of a heat-peelable double-sided pressure-sensitive adhesive sheet.
- the pedestal method using a support is thin even for workpieces having excellent unevenness-relieving properties and large surface unevenness such as bump wafers. Processing such as mold grinding can be performed.
- FIG. 1 is a schematic cross-sectional view showing an example of a heat-peelable double-sided pressure-sensitive adhesive sheet of the present invention.
- FIG. 1 is a schematic sectional view showing an example of the heat-peelable double-sided pressure-sensitive adhesive sheet of the present invention.
- a heat-peelable adhesive layer 2 is provided on one surface of the substrate 1
- an adhesive layer 3 is provided on the other surface
- a separator 4 is laminated on the heat-peelable adhesive layer 2 and the adhesive layer 3. ing.
- the substrate 1 is a support base for the heat-peelable pressure-sensitive adhesive layer 2 and the pressure-sensitive adhesive layer 3, and is made of a porous substrate.
- the substrate 1 may be composed of a laminate of a porous substrate and a non-porous substrate, which may be composed of only a porous substrate.
- the volume of the irregularities is absorbed when the heat-peelable pressure-sensitive adhesive sheet is attached to a workpiece having large irregularities on the surface. The uneven shape does not appear on the side. Therefore, when sticking the support to the back side of the adhesive sheet using the pedestal method, bubbles may be trapped, the support may float and water may enter after grinding the wafer back, or wafer cracks may occur. Can be prevented.
- the material of the substrate 1 can be appropriately selected within a range that does not impair the handleability as an adhesive sheet, and may be any of a thermoplastic resin, a thermosetting resin, an elastomer, and the like.
- the material include olefin-based resins such as polyethylene and polypropylene; Polyester resins such as terephthalate and polyethylene naphthalate; Polystyrene resins such as polystyrene; Bull resins such as polychlorinated butyl; Polyurethane resins; Acrylic resins such as poly (methyl methacrylate); Acrylic urethane copolymers; Cellulose Polyresin resin; Polycarbonate resin; Polyamide resin; Polyimide resin; Polyamideimide resin; Polysulfone resin; Fluorine resin; Plastic film or sheet such as rubber polymer.
- the porous substrate may be formed by any method. For example, a porous film obtained by casting a polymer solution into a film and then guiding it to a coagulation liquid, and stretching treatment. A porous film obtained by removing the fine particles from a film mixed with removal fine particles by elution treatment, a porous film obtained by embossing the film, a polymer powder A porous film obtained by fusing the material with heat, a foam film foamed using a chemical foaming agent or a physical foaming agent, and a hollow filler such as thermally expandable microspheres or hollow glass beads were dispersed. Any film can be used.
- the average particle size of the hollow glass beads can be appropriately selected in consideration of the thickness of the porous substrate, etc., but is generally 3 to 200 111, preferably 10 to 100 ⁇ m. Further, the average particle diameter of the thermally expandable microspheres can be appropriately set in consideration of the thickness of the porous substrate, and the like, for example, 3 to 100 m, preferably 10 to 100 m after the thermal expansion. .
- porous substrate a mixture comprising urethane polymer, acrylic monomer, photopolymerization initiator, and hollow glass beads or thermally expandable microspheres is applied to a non-porous substrate and the like.
- a sheet-like material obtained by irradiating with ultraviolet rays after forming a film.
- the density of the porous substrate is not particularly limited, but is generally 0.9 g / cm 3 or less (for example, 0.
- Density is measured at a room temperature of 23 ° C and humidity of 50%. The sample dimensions (length and width) are measured with a steel ruler, the thickness is measured with a l / 1000mm dial gauge, and the mass is measured with a l / 1000g digital weigh scale. Measured and determined by mass / volume (gravimetric method). When the density of the porous substrate exceeds 0.9 g / cm 3 , the unevenness absorbability decreases and the adherend may not be retained.
- the tensile elastic modulus of the porous substrate is not particularly limited, but is generally 20 MPa or less (for example, 0.;! To 20 MPa), preferably about 0.;! To 15 MPa.
- the tensile elastic modulus is obtained as the initial elastic modulus from the stress-strain curve using a tensile load measuring machine. When the tensile elastic modulus of the porous substrate exceeds 20 MPa, the unevenness absorbability decreases and the adherend may not be held.
- the thickness of the porous substrate is not particularly limited, but it is generally 10 to 1000 ⁇ m, preferably 25 to 500 ⁇ m, in view power such as cutting ability and unevenness absorbability. More preferably, it is about 50-300 111. When the thickness of the porous substrate is less than 10 m, the unevenness absorbability decreases, and if it exceeds lOOOOrn immediately, the cutting property tends to decrease.
- the substrate 1 is composed of a laminate of a porous substrate and a non-porous substrate (for example, a non-porous substrate made of polyethylene terephthalate, polyimide, etc.), the total thickness of the substrate is For example, 20 to 1100 m, preferably 35 to 550 mm 111, more preferably about 60 to 350 mm.
- the substrate 1 is constituted by a laminate of a porous substrate and a non-porous substrate
- the laminate is obtained by a conventional film lamination method such as a coating method, an extrusion method, or a dry lamination method.
- the heat-peelable pressure-sensitive adhesive layer 2 is a layer exhibiting releasability, for example, by expanding or foaming due to heating to reduce the adhesive force to the adherend (workpiece).
- the heat-peelable pressure-sensitive adhesive layer 2 is generally composed of a foaming agent such as a heat-expandable microsphere and a binder.
- a foaming agent such as a heat-expandable microsphere
- a binder suitable ones such as polymers and waxes that allow foaming and / or expansion by heating a foaming agent such as thermally expandable microspheres can be used. In particular, restrain the foaming and / or expansion of foaming agents such as thermally expandable microspheres as much as possible!
- a particularly preferable binder is a pressure-sensitive adhesive from the viewpoint of controllability of adhesive properties such as heat expansion of a foaming agent such as thermally expandable microspheres and adhesion to an adherend.
- the pressure-sensitive adhesive is not particularly limited, and examples thereof include rubber polymers, acrylic polymers, butyl alkyl ether polymers, silicone polymers, polyester polymers, polyamide polymers, urethane polymers, fluorine polymers, Adhesives composed of polymers such as styrene-gen block copolymers, adhesives with a melting point of about 200 ° C or less, and improved creep properties, radiation curable adhesives, or these For example, crosslinkers (eg polyisocyanates, alkyl etherified melamines) Compounds, epoxy compounds, etc.), tackifiers (eg, rosin derivative resins, polyterpene resins, petroleum resins, oil-soluble phenol resins, etc.), plasticizers, softeners, fillers, pigments, colorants, anti-aging agents, Those containing various additives such as surfactants can be used (Japanese Patent Laid-Open Nos. 56-61468, 61-174857, 63-
- the pressure-sensitive adhesive constituting the heat-peelable pressure-sensitive adhesive layer 2 is from normal temperature to 150 from the point of balance between controllability of an appropriate adhesion force to the adherend before heating and reduction of adhesive strength by heating.
- the base polymer is preferably a polymer having a dynamic elastic modulus of 50,000 to 10 million dyn / cm 2 in the temperature range up to ° C.
- the pressure-sensitive adhesive a rubber-based pressure-sensitive adhesive using natural rubber or various synthetic rubbers as a base polymer; (meth) acrylic acid alkyl ester (for example, methyl ester, ethyl esterol, propinoreesterol, isopropyl 1 or 2 of Noreestenole, Butinoreestenole, 2-Ethenolehexyl ester, Isootatyl ester, Isononyl ester, Isodecyl ester, Dodecyl ester, Eicosyl ester, etc.)
- acrylic acid alkyl ester for example, methyl ester, ethyl esterol, propinoreesterol, isopropyl 1 or 2 of Noreestenole, Butinoreestenole, 2-Ethenolehexyl ester, Isootatyl ester, Isononyl ester, Isodecyl ester, Dodecyl ester
- An acrylic pressure-sensitive adhesive having an acrylic polymer (homopolymer or copolymer) using at least a seed as a monomer component as a base polymer is used.
- the acrylic polymer may contain other monomer that can be copolymerized with the (meth) acrylic acid alkyl ester, if necessary, for the purpose of modifying cohesion, heat resistance, crosslinkability, and the like. Units corresponding to body components may be included.
- Such monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, and itaconic acid; acid anhydride monomers such as maleic anhydride; hydroxymethyl (meth) acrylate, (meth) Hydroxyl group-containing monomers such as hydroxypropyl acrylate; Sulphonic acid group-containing monomers such as styrene sulfonic acid and aryl sulfonic acid; Amide group-containing monomers such as N-methylol (meth) acrylamide; ) Aminoalkyl acrylate monomers; (meth) acrylic acid alkoxyalkyl monomers such as (meth) acrylate methoxyethyl; maleimide monomers such as N-cyclohexylmaleimide; itaconimide monomers such as N-methylitaconimide; N— (Meta) Ataliloyloxymethylene sushi Succinimide monomers such as imide imide; butyl monomers such
- thermally expandable microspheres examples include microspheres in which a substance that easily expands by gasification by heating, such as isobutane, propane, or pentane, is encapsulated in an elastic shell. .
- the shell is often formed of a hot-melt material or a material that breaks down due to thermal expansion.
- the substance forming the shell include vinylidene chloride-atari nitrile copolymer, polybutyl alcohol, polybutyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, and polysulfone.
- Thermally expandable microspheres can be produced by a conventional method such as a coacervation method or an interfacial polymerization method. Examples of thermally expandable microspheres include commercial products such as “Matsumoto Microsphere” (manufactured by Matsumoto Yushi Seiyaku Co., Ltd.).
- thermally expandable microspheres By using the thermally expandable microspheres, it is possible to stably suppress an increase in the degree of contamination of the adherend due to heating. In the case of a foaming agent or the like that is not microencapsulated, the effect of suppressing the increase in the degree of contamination is poor due to the cohesive failure of the adhesive layer. In order to efficiently and stably reduce the adhesive strength of the heat-peelable adhesive layer by heating, it has an appropriate strength that does not rupture until the volume expansion coefficient is 5 times or more, especially 7 times or more, especially 10 times or more. Thermally expandable microspheres are preferred.
- the average particle diameter of the heat-expandable microspheres can be appropriately selected according to the thickness of the heat-peelable pressure-sensitive adhesive layer 2 and the like.
- the force S is 100 [I m or less (for example;! To 100 ⁇ m), preferably 80 ⁇ m or less (for example;! To 80 m), more preferably 1 to 50 111, but not limited thereto. .
- the blending amount of the foaming agent such as the heat-expandable microspheres may be appropriately determined depending on the expansion ratio of the heat-peelable pressure-sensitive adhesive layer 2 and the ability to reduce the adhesive force.
- the binder is an adhesive or the like, it is 1 to 150 parts by weight, preferably 10 to 130 parts by weight, more preferably 25 to 100 parts by weight with respect to 100 parts by weight of the base polymer. is there.
- the thickness of the heat-peelable pressure-sensitive adhesive layer 2 can be appropriately selected in consideration of the adhesiveness and the ability to reduce the adhesive strength during heat-peeling, and is generally 300 m or less (eg;! -300 m), preferably Is 2 to 20 O ⁇ m, more preferably 5 to 150 150. If the thickness is too small, the surface may be uneven due to the foaming agent such as thermally expandable microspheres, and sufficient adhesion may not be exhibited. On the other hand, if the thickness is excessive, the adherend may not be peeled smoothly due to insufficient reduction in the adhesive strength due to defective heat deformation.
- a foaming agent such as a heat-expandable microsphere and a blending component such as a binder are mixed using a solvent as necessary, and the mixture is applied. It can be carried out by a method of developing by a suitable method such as a method to form a sheet-like layer.
- the above mixture is coated on a suitable separator (release paper, etc.) that can be applied directly on the substrate 1 to form a heat-peelable adhesive layer, which is transferred onto the substrate 1. May be.
- the pressure-sensitive adhesive layer 3 is not particularly limited, and is a pressure-sensitive adhesive such as rubber or acrylic, an ultraviolet curable pressure-sensitive adhesive, a heat-peelable pressure-sensitive adhesive, a thermoplastic pressure-sensitive adhesive, or a thermosetting pressure-sensitive adhesive. Etc., and can be composed of a known pressure-sensitive adhesive.
- a pressure-sensitive adhesive such as rubber or acrylic, an ultraviolet curable pressure-sensitive adhesive, a heat-peelable pressure-sensitive adhesive, a thermoplastic pressure-sensitive adhesive, or a thermosetting pressure-sensitive adhesive.
- Etc. and can be composed of a known pressure-sensitive adhesive.
- the rubber-based and acrylic pressure-sensitive adhesives those exemplified above as the rubber-based pressure-sensitive adhesive and acrylic pressure-sensitive adhesive can be used.
- the adhesive examples include a cross-linking agent (eg, polyisocyanate, alkyl etherified melamine compound, epoxy compound), tackifier (eg, rosin derivative resin, polyterpene resin, petroleum resin, oil-soluble phenol resin, etc.). ), Various additives such as plasticizers, softeners, fillers, pigments, colorants, anti-aging agents, and surfactants may be added! /.
- a cross-linking agent eg, polyisocyanate, alkyl etherified melamine compound, epoxy compound
- tackifier eg, rosin derivative resin, polyterpene resin, petroleum resin, oil-soluble phenol resin, etc.
- additives such as plasticizers, softeners, fillers, pigments, colorants, anti-aging agents, and surfactants may be added! /.
- the adhesive layer 3 may be provided on either the porous substrate-side surface or the non-porous substrate-side surface. Good.
- the thickness of the pressure-sensitive adhesive layer 3 is not particularly limited. In general, 0 ⁇ 1-500, ⁇ , preferably;! To 300 ⁇ m, more preferably in the range of 5 to 250 ⁇ m.
- the heat-peelable double-sided pressure-sensitive adhesive sheet of the present invention can take an appropriate form such as a sheet, a tape, or a label.
- the separator 4 can be temporarily attached for the purpose of protecting the heat-peelable pressure-sensitive adhesive layer 2 and the pressure-sensitive adhesive layer 3.
- a plastic film or paper coated with an appropriate release agent such as silicone, long chain alkyl, or fluorine can be used.
- the processing method of the present invention includes a heat-peelable pressure-sensitive adhesive layer of the heat-peelable double-sided pressure-sensitive adhesive sheet of the present invention.
- the workpiece is not particularly limited, and examples thereof include electronic parts such as ceramic capacitors, semiconductor wafers, and the like.
- the adherend since the base material is a porous base material, the adherend has a large unevenness on the surface of the heat-peelable double-sided pressure-sensitive adhesive sheet on the side to be adhered to the heat-peelable pressure-sensitive adhesive layer 2. However, the unevenness is reduced and absorbed in volume by the porous substrate. Therefore, when sticking a rigid support (base) to the pressure-sensitive adhesive layer 3 of the heat-peelable double-sided pressure-sensitive adhesive sheet, unevenness does not appear on the pressure-sensitive adhesive layer 3 and a smooth surface can be maintained. can get.
- the workpiece after bonding the support (base), the workpiece can be processed without causing problems such as cracks and water intrusion due to the strong support of the workpiece. Therefore, for example, workpieces with a maximum surface unevenness of 10 m or more (for example, 10 to 150, 111, especially about 15 to 50 in), such as semiconductor wafers with bumps and semiconductor wafers in which depressions such as transistors are formed. This is especially effective when processing the back of the body (eg grinding).
- the type of processing is not particularly limited, and examples thereof include processing such as polishing ij, cutting, assembly, lamination, and firing.
- the heat treatment after the processing can be performed using appropriate heating means such as a hot plate, a hot air dryer, a near infrared lamp, an air dryer, and the like.
- the heating temperature may be equal to or higher than the thermal expansion start temperature (foaming start temperature) of the foaming agent such as the heat-expandable microspheres in the heat-peelable adhesive layer 2, but the heat treatment conditions are the heat resistance of the adherend. It can be set as appropriate depending on the heating method.
- General heat treatment conditions are a temperature of 100 to 250 ° C, 1 to 90 seconds (hot plate etc.) or 1 to 15 minutes (hot air dryer etc.)
- PET polyethylene terephthalate
- the system adhesive B was applied onto a PET separator so as to have a thickness of 20 m, dried, and transferred to the PET film side of the porous substrate to obtain a heat-peelable double-sided adhesive sheet A.
- Isocyanate-based crosslinking agent [trade name “Coronate L”, manufactured by Nippon Polyurethane Industry Co., Ltd.] 2.5 parts by weight per 100 parts by weight of acrylic polymer consisting of 100 parts by weight of butyl acrylate and 4 parts by weight of acrylic acid ,
- Heat-expandable microspheres [trade name “Matsumoto Microsphere F80V SD”, manufactured by Matsumoto Yushi Seiyaku Co., Ltd.]
- the heat-expandable adhesive compounded with 40 parts by weight is ⁇ ⁇
- the heat-expandable microspheres are expanded through a heating process at 160 ° C to form a 170 m thick porous film with PET (acrylic copolymer) Porous substrate layer / PET film). Thereafter, a heat-peelable double-sided PSA sheet B was obtained by the same operation as in Example 1.
- a heat-peelable double-sided pressure-sensitive adhesive sheet C was obtained in the same manner as in Example 1 except for the strength and the point when the hollow glass beads were not blended.
- the layer structure of the base material is a non-porous base material layer / PET film composed of acrylic-urethane copolymer force.
- a heat-peelable double-sided PSA sheet was obtained in the same manner as in Example 1 except that a PET film having a thickness of 250 Hm was used as a substrate.
- the heat release property of the bump wafer was verified by heat treatment (heated for 3 minutes in a 120 ° C hot air dryer).
- the product name “DR3000II—WS” (manufactured by Nitto Seiki Co., Ltd.) is used for bonding the heat-peelable double-sided adhesive sheet and bump wafer, and the product name “ ⁇ —3000 ⁇ -WS” is used for bonding glass wafers.
- the product name “DFG-8460” [manufactured by Disco Corporation] was used for wafer grinding. The results are shown in Table 1.
- the present invention relates to a heat-peelable double-sided PSA sheet and a method for processing a workpiece using the same. More specifically, a heat-releasable double-sided pressure-sensitive adhesive sheet that can quickly reduce the adhesive force by heat treatment and is suitable for processing a workpiece with a surface irregularity, and a method for processing an object using the same About.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020097004892A KR101333945B1 (ko) | 2006-11-04 | 2007-10-29 | 열박리성 양면 점착 시트 및 피가공체의 가공 방법 |
EP07830767.5A EP2078741A4 (en) | 2006-11-04 | 2007-10-29 | DOUBLE-SIDED ADHESIVE SHEET REMOVABLE UNDER THE ACTION OF THE HEAT AND METHOD FOR TREATING A WORKPIECE |
US12/311,980 US20090288763A1 (en) | 2006-11-04 | 2007-10-29 | Thermally strippable double faced adhesive sheet and method of working work piece |
CN200780040736XA CN101541905B (zh) | 2006-11-04 | 2007-10-29 | 热剥离性双面粘合片材及工件的加工方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-299737 | 2006-11-04 | ||
JP2006299737A JP2008115272A (ja) | 2006-11-04 | 2006-11-04 | 熱剥離性両面粘着シート及び被加工体の加工方法 |
Publications (1)
Publication Number | Publication Date |
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WO2008053840A1 true WO2008053840A1 (fr) | 2008-05-08 |
Family
ID=39344181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/071033 WO2008053840A1 (fr) | 2006-11-04 | 2007-10-29 | Feuille adhésive double face décollable sous l'action de la chaleur et procédé de traitement d'une pièce à travailler |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090288763A1 (ja) |
EP (1) | EP2078741A4 (ja) |
JP (1) | JP2008115272A (ja) |
KR (1) | KR101333945B1 (ja) |
CN (1) | CN101541905B (ja) |
TW (1) | TWI466976B (ja) |
WO (1) | WO2008053840A1 (ja) |
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WO2013146707A1 (ja) * | 2012-03-27 | 2013-10-03 | 日東電工株式会社 | 電子部品切断用加熱剥離型粘着シート及び電子部品加工方法 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102027088A (zh) * | 2008-05-14 | 2011-04-20 | 日东电工株式会社 | 涂膜保护用粘合片 |
JP2010208019A (ja) * | 2008-08-01 | 2010-09-24 | Sekisui Chem Co Ltd | 研磨材固定用両面粘着テープ及びその製造方法 |
WO2013146707A1 (ja) * | 2012-03-27 | 2013-10-03 | 日東電工株式会社 | 電子部品切断用加熱剥離型粘着シート及び電子部品加工方法 |
CN104185665A (zh) * | 2012-03-27 | 2014-12-03 | 日东电工株式会社 | 电子部件切断用加热剥离型粘合片及电子部件加工方法 |
US20230026124A1 (en) * | 2021-07-08 | 2023-01-26 | Dic Corporation | Adhesive tape and electronic device |
US11898070B2 (en) * | 2021-07-08 | 2024-02-13 | Dic Corporation | Adhesive tape and electronic device |
Also Published As
Publication number | Publication date |
---|---|
JP2008115272A (ja) | 2008-05-22 |
CN101541905A (zh) | 2009-09-23 |
KR20090077038A (ko) | 2009-07-14 |
KR101333945B1 (ko) | 2013-11-27 |
CN101541905B (zh) | 2013-05-01 |
TW200844204A (en) | 2008-11-16 |
EP2078741A4 (en) | 2013-04-24 |
TWI466976B (zh) | 2015-01-01 |
EP2078741A1 (en) | 2009-07-15 |
US20090288763A1 (en) | 2009-11-26 |
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