WO2007123003A1 - Pellicule adhésive de connexion de circuit, structure de connexion d'élément de circuit et procédé de connexion d'élément de circuit - Google Patents

Pellicule adhésive de connexion de circuit, structure de connexion d'élément de circuit et procédé de connexion d'élément de circuit Download PDF

Info

Publication number
WO2007123003A1
WO2007123003A1 PCT/JP2007/057667 JP2007057667W WO2007123003A1 WO 2007123003 A1 WO2007123003 A1 WO 2007123003A1 JP 2007057667 W JP2007057667 W JP 2007057667W WO 2007123003 A1 WO2007123003 A1 WO 2007123003A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
adhesive layer
connection
electrode
insulating
Prior art date
Application number
PCT/JP2007/057667
Other languages
English (en)
Japanese (ja)
Inventor
Yukihisa Hirosawa
Tadamitsu Iimura
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to KR1020117010921A priority Critical patent/KR101150116B1/ko
Priority to JP2007528907A priority patent/JP4775377B2/ja
Priority to CN2007800130291A priority patent/CN101421886B/zh
Publication of WO2007123003A1 publication Critical patent/WO2007123003A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer

Definitions

  • the present invention relates to an adhesive film for circuit connection, a circuit member connection structure, and a circuit member connection method. More specifically, the present invention is used for connection between circuit boards or electronic components such as an IC chip and a wiring board. The present invention relates to an adhesive film for circuit connection, a circuit member connection structure using the same, and a circuit member connection method.
  • An anisotropic conductive adhesive in which conductive particles are dispersed in an adhesive is used when electrically connecting circuit boards to each other or an electronic component such as an IC chip and a circuit board.
  • this anisotropic conductive adhesive is placed between the electrodes of the circuit members facing each other as described above, and the electrodes are connected by heating and pressurization, thereby providing conductivity in the pressurization direction.
  • the electrodes formed adjacent to each other can be provided with an insulating property so that only the electrodes facing each other can be electrically connected.
  • an anisotropic conductive adhesive for example, an adhesive for circuit connection based on an epoxy resin has been proposed (for example, see Patent Document 1).
  • the basic idea for increasing the resolution of the above-mentioned adhesive for circuit connection is to ensure the insulation between adjacent electrodes by making the particle size of the conductive particles smaller than the insulating part between the adjacent electrodes At the same time, the conductive particle content is set to such an extent that the particles do not come into contact with each other, and the conductive particles are surely present on the electrodes to obtain conductivity between the opposing electrodes.
  • Patent Document 1 Japanese Patent Laid-Open No. 3-16147
  • Patent Document 2 Japanese Patent Laid-Open No. 1236588
  • Patent Document 3 Japanese Patent Laid-Open No. 2-18809
  • Patent Document 4 JP-A-4 366630
  • Patent Document 5 Japanese Patent Application Laid-Open No. 8-279371
  • Patent Document 6 Japanese Patent Laid-Open No. 2002-76607
  • the adhesive for circuit connection described in Patent Document 6 enables connection of dot-shaped fine electrodes, but the manufacturing method of the adhesive is troublesome and connects the electrodes. However, there is a problem in that workability is inferior because precise alignment of the conductive particle dense area and the electrode is necessary.
  • the present invention has been made in view of the above-mentioned problems, and has excellent high resolution and long-term connection reliability in which the outflow of conductive particles from the electrodes is small when circuit members are connected to each other. It is an object of the present invention to provide an adhesive film for circuit connection that is excellent in workability because accurate alignment is not required, a circuit member connection structure using the same, and a circuit member connection method.
  • the present invention provides a first circuit member in which a first circuit electrode is formed on a main surface of a first substrate, and a first circuit member on a main surface of a second substrate.
  • the adhesive film for circuit connection when used for connecting circuit members, the outflow of conductive particles from the electrodes is small, and the particle trapping property is good. Also for the electrodes, sufficient insulation between adjacent electrodes and conductivity between the electrodes to be connected can be ensured. Therefore, the adhesive film for circuit connection of the present invention can achieve high resolution and long-term connection reliability at a high level. Further, since the adhesive film for circuit connection of the present invention does not require accurate alignment between the conductive particles and the electrodes, Excellent workability when connecting materials.
  • the reason why the above-described effect is exhibited by the adhesive film for circuit connection of the present invention is considered to be as follows. That is, by disposing the conductive particles only in the conductive adhesive layer, the conductive particles are prevented from flowing out from the electrode, and the particle trapping efficiency is improved. As a result, the conductive particles do not come into contact with each other and can surely exist on the electrode, and the conductivity at the connection portion can be sufficiently obtained. Also, by forming an insulating adhesive layer on both sides of the conductive adhesive layer, the insulating adhesive layer should be placed between adjacent circuit electrodes to ensure sufficient insulation between the P contact electrodes. Can do.
  • the thickness of at least one insulating adhesive layer is set to 0.1 to 5 xm, sufficient insulation between adjacent electrodes is ensured, and sufficient contact between the electrodes and conductive particles is ensured. Therefore, it is possible to sufficiently ensure the insulation between the adjacent electrodes and the conductivity between the electrodes to be connected.
  • the adhesive contains a thermosetting resin
  • the conductive adhesive layer includes the first insulating adhesive layer and the above-described adhesive layer.
  • the melt viscosity at the time of connection between the first circuit member and the second circuit member is preferably higher than that of the second insulating adhesive layer.
  • the conductive adhesive layer preferably further contains a film-forming polymer.
  • the film forming property of the conductive adhesive layer can be improved, and the conductive particles can be held in a uniformly dispersed state.
  • the strong adhesive film for circuit connection is excellent in workability because it does not require accurate alignment between the conductive particles and the electrode, and it is difficult to contain bubbles in the connection part.
  • the present invention also includes a first circuit member in which a first circuit electrode is formed on the main surface of the first substrate, and a second circuit electrode formed on the main surface of the second substrate.
  • the second circuit member is provided between the first and second circuit members, and the circuit connection adhesive according to the present invention is provided.
  • a circuit member connection structure in which the first circuit electrode and the second circuit electrode are opposed to each other and electrically connected by a circuit connection member made of a cured film. .
  • the circuit connection member is made of a cured product of the adhesive film for circuit connection according to the present invention
  • the circuit member connection structure has a good particle trapping property with less outflow of conductive particles from the electrode.
  • the insulation between the adjacent electrodes and the continuity between the electrodes to be connected can be sufficiently ensured, and high resolution and long-term connection reliability can be achieved at a high level.
  • At least one of the first circuit electrode and the second circuit electrode has a height of 3. Oxm or less, and is used for the circuit connection.
  • the circuit electrode having a thickness of 0.:! To 5. O xm in the adhesive film, wherein the first insulating adhesive layer or the second insulating adhesive layer has a height of 3. O xm or less. It is preferable to arrange on the side.
  • connection structure of the circuit member that can be applied to a minute circuit electrode can sufficiently secure the insulation between adjacent electrodes and the conductivity between the electrodes to be connected.
  • the demand for higher resolution can be achieved at a high level.
  • the present invention further includes a first circuit member in which a first circuit electrode is formed on a main surface of the first substrate, the circuit connecting adhesive film of the present invention, and a main substrate of the second substrate.
  • a second circuit member having a second circuit electrode formed on the surface is laminated and heated and pressed in this order so that the first circuit electrode and the second circuit electrode are opposed to each other.
  • a circuit member connecting method for connecting the first circuit member and the second circuit member so that the first circuit electrode and the second circuit electrode are electrically connected to each other. provide.
  • the adhesive film for circuit connection of the present invention by using the adhesive film for circuit connection of the present invention, the outflow of the conductive particles from the electrode is suppressed, and the particle capturing property is improved. It is possible to secure sufficient insulation between adjacent electrodes and electrical continuity between electrodes to be connected. Therefore, it is possible to form a circuit member connection structure that achieves high resolution and long-term connection reliability at a high level.
  • a height of at least one of the first circuit electrode and the second circuit electrode is 3.0 ⁇ m or less.
  • the first circuit member and the second circuit electrode are arranged so that the first circuit electrode and the second circuit electrode are electrically connected by being heated and pressurized by being arranged on the circuit electrode side that is less than or equal to m. It is preferable to connect the second circuit member.
  • the outflow of the conductive particles from the electrodes is small, the high resolution and the long-term connection reliability are excellent, and accurate alignment between the conductive particles and the electrodes is unnecessary.
  • an adhesive film for circuit connection excellent in workability, a circuit member connection structure using the same, and a circuit member connection method can be provided.
  • FIG. 1 is a schematic cross-sectional view showing a preferred embodiment of an adhesive film for circuit connection of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing another preferred embodiment of the adhesive film for circuit connection of the present invention.
  • FIG. 3 is a schematic cross-sectional view showing a preferred embodiment of a circuit member connection structure according to the present invention.
  • FIG. 1 is a schematic cross-sectional view showing a preferred embodiment of an adhesive film for circuit connection (anisotropic conductive adhesive film) according to the present invention.
  • the adhesive film 100 for circuit connection shown in FIG. 1 is composed of a conductive adhesive layer 3 including conductive particles 1 and an adhesive 2, and an insulating insulating adhesive formed on both surfaces of the conductive adhesive layer 3.
  • the thickness of the insulating adhesive layer 5 is in the range of 0.:! To 5. Ozm.
  • FIG. 2 is a schematic cross-sectional view showing another preferred embodiment of the adhesive film for circuit connection of the present invention.
  • An adhesive film 110 for circuit connection shown in FIG. 2 includes a conductive adhesive layer 3 including conductive particles 1 and an adhesive 2, and an insulating insulating adhesive layer formed on both surfaces of the conductive adhesive layer 3. 5 and the thickness of each of the insulating adhesive layers 5 on both sides is in the range of 0.:! To 5.0 xm.
  • a peelable base material support film
  • the circuit connecting adhesive film 100 shown in FIG. 1 is used and each layer constituting the circuit connecting adhesive film 100 will be described in detail.
  • the conductive adhesive layer 3 is a layer containing the conductive particles 1 and the adhesive 2, and connects the circuit electrodes facing each other when the circuit members having the circuit electrodes are connected to each other. It is a layer having anisotropic conductivity that exhibits conductivity in the direction and can electrically connect only the circuit electrodes facing each other.
  • the adhesive 2 preferably includes a reactive resin (thermosetting resin) that is cured by heat.
  • Thermosetting resins include mixtures of epoxy resins with latent curing agents such as imidazoles, hydrazides, boron trifluoride-amine complexes, sulfonium salts, amine amines, polyamine salts, dicyandiamide, and radical reactivity. A mixture of resin and organic peroxide is used.
  • the epoxy resin is derived from bisphenol-type epoxy resin derived from epichlorohydrin and bisphenol A, F, AD, etc., derived from epichlorohydrin and phenol novolac or cresol novolac.
  • Various epoxy compounds having two or more glycidyl groups in one molecule such as nyl and alicyclic can be used alone or in admixture of two or more.
  • epoxy resins it is possible to use high-purity products in which the content of impurity ions (Na + , C ⁇ , etc.) and hydrolyzable chlorine is reduced to 300 ppm or less. It is preferable from the viewpoint.
  • Conductive particles 1 are mixed in and dispersed for the purpose.
  • the conductive particles 1 are conductive particles containing metals such as Au, Ag, Ni, Cu, and solder, for example, and Au, Ag, Ni are formed on the surface of a spherical core made of a polymer such as polystyrene. More preferably, the particles are formed by forming a conductive layer made of a metal such as Cu or solder.
  • the conductive particles 1 may be formed by forming a surface layer of Su, Au, solder, or the like on the surface of conductive particles.
  • the particle diameter of the conductive particles 1 needs to be smaller than the minimum distance between the electrodes of the circuit members connected by the circuit connecting adhesive film 100, and the height of the electrodes varies.
  • the height is preferably larger than the variation in height.
  • the average particle size of the conductive particles 1 is preferably:! ⁇ 10 / im, more preferably 2 ⁇ 5 / im. If the average particle size is less than ⁇ , it may not be possible to cope with variations in electrode height, and the conductivity between the electrodes tends to decrease, and if it exceeds ⁇ , the insulation between adjacent electrodes Tend to decrease.
  • the content of the conductive particles 1 in the conductive adhesive layer 3 is preferably 0.:! To 30% by volume based on the total volume of the solid content in the conductive adhesive layer. More preferably, it is 2 to 20% by volume. If this content is less than 0.1% by volume, the number of conductive particles on the electrodes to be connected decreases, so the number of contact points is insufficient, and the conductivity between the connecting electrodes tends to be reduced. If the volume% is exceeded, the particle surface area tends to increase due to a significant increase in the particle surface area, and the insulation between the electrodes tends to decrease as soon as they are connected.
  • the conductive adhesive layer 3 can also be blended with a film-forming polymer.
  • the film-forming polymer include thermoplastic resins such as a phenoxy resin, a polyester resin, and a polyamide resin. These This film-forming polymer is effective for stress relaxation during curing of the thermosetting resin.
  • the film-forming polymer has a functional group such as a hydroxyl group because the adhesiveness is improved.
  • the insulating adhesive layers 4 and 5 constituting the circuit connecting adhesive film 100 are insulating layers.
  • the composition is not particularly limited as long as it can be set to 1 ⁇ 10 8 ⁇ or more).
  • the same composition as the composition obtained by removing the conductive particles 1 from the conductive adhesive layer 3 described above. It can be.
  • the conductive adhesive layer 3 and the insulating adhesive layers 4 and 5 can further contain and disperse rubber particles such as inorganic fillers. These can be mixed and dispersed in the conductive adhesive layer 3 together with the conductive particles 1, and can be mixed and dispersed in the insulating adhesive layers 4 and 5 where the conductive particles 1 are not used. It is preferable to mix and disperse in the conductive adhesive layer 3 using By adding these inorganic fillers or rubber particles to the conductive adhesive layer 3, the melt viscosity when the circuit members of the conductive adhesive layer 3 are connected to each other can be reduced. It can be easily and sufficiently higher than the melt viscosity.
  • the inorganic filler is not particularly limited, and examples thereof include powders such as fused silica, crystalline silica, calcium silicate, alumina, and calcium carbonate.
  • the average particle size of the inorganic filler is preferably 3 ⁇ or less from the viewpoint of preventing poor conduction at the connecting portion.
  • the blending amount is 5 to 100 parts by mass with respect to 100 parts by mass of the adhesive 2 in any of the conductive adhesive layer 3 and the insulating adhesive layers 4 and 5. It is preferable that In order to increase the melt viscosity, the larger the blending amount, the more effective.
  • the rubber particles have a glass transition temperature of 25.
  • butadiene rubber, attalinole rubber, styrene-butadiene-styrene rubber, nitrile-butadiene rubber, silicone rubber, and the like can be used as long as they are C or less rubber particles.
  • particles having an average particle size of 0.:! To 10 zm are preferably used. Rubber particles occupying 80% or more of the particle size distribution are more preferable. More preferably, the average particle size of the rubber particles is 0.:! ⁇ 5/im.
  • the surface of the rubber particles is treated with a silane coupling agent, the dispersibility to the reactive resin is more preferable.
  • silicone rubber particles are excellent in solvent resistance and dispersibility, and therefore can be preferably used as effective rubber particles.
  • Silicone rubber particles are hydrolyzed and polycondensed by adding a silane compound and methyltrialkoxysilane and / or a partially hydrolyzed condensate thereof to an aqueous alcohol solution adjusted to pH 9 or higher with a basic substance such as caustic soda or ammonia. It can be obtained by the method of making it, or by copolymerization of onoreganosiloxane.
  • silicone fine particles containing a functional group such as a hydroxyl group, an epoxy group, a ketimine, a carboxyl group, or a mercapto group at the molecular terminal or inner molecular chain are preferable because dispersibility in a reactive resin is improved.
  • the blending amount is 5 to 50 parts by mass with 100 parts by mass of the adhesive 2 in both the conductive adhesive layer 3 and the insulating adhesive layers 4 and 5. It is preferable that there is.
  • the formation of the conductive adhesive layer 3 and the insulating adhesive layers 4 and 5 includes at least the adhesive 2 (reactive resin, latent curing agent, and the like).
  • the adhesive composition containing the conductive particles 1 is dissolved or dispersed in an organic solvent to liquefy it to prepare a coating solution, and this coating solution is applied onto a peelable substrate (support film) to activate the curing agent. This can be done by removing the solvent below the temperature.
  • the solvent used at this time is preferably a mixed solvent of an aromatic hydrocarbon solvent and an oxygen-containing solvent from the viewpoint of improving the solubility of the material.
  • a PET film or the like that has been surface-treated so as to have releasability is preferably used as the peelable substrate.
  • a conductive adhesive layer or an insulating adhesive layer may be further provided outside the insulating adhesive layers 4 and 5.
  • circuit-connecting adhesive film 100 for example, a method of laminating the conductive adhesive layer 3 and the insulating adhesive layers 4 and 5 formed as described above, or the respective layers sequentially
  • a known method such as a coating method can be employed.
  • the thickness of the conductive adhesive layer 3 Is preferably 3-15 ⁇ , more preferably 5-10 / im.
  • the thickness force is less than 3 ⁇ 4 ⁇ , when conductive particles having a suitable average particle diameter are applied, the formability of the conductive adhesive layer tends to decrease. There is an increasing tendency for the conductive particles to flow out from above, making it difficult to sufficiently ensure the insulation between the electrodes that are in contact with each other and the conductivity between the electrodes to be connected.
  • the thickness of the insulating adhesive layer 5 is required to be 0.:! To 5.0 ⁇ m 1.
  • O z m is preferable, and 2.0 to 4.0 ⁇ m is more preferable. If the thickness is less than 0.1 lxm, sufficient insulation cannot be secured between the adjacent electrodes when arranged between adjacent circuit electrodes in the circuit member. As a result, the outflow of conductive particles increases, so that sufficient insulation between adjacent electrodes and conductivity between electrodes to be connected cannot be secured.
  • the thickness of the insulating adhesive layer 4 is the same as the thickness of the first circuit electrode formed on the main surface of the first substrate and the thickness of the second circuit electrode formed on the main surface of the second substrate. It is preferable that it is below the sum total of the thickness of this circuit electrode. If the thickness of the insulating adhesive layer 4 is larger than the sum of the thickness of the first circuit electrode and the thickness of the second circuit electrode, the amount of conductive particles flowing out from the electrode increases, and the gap between adjacent electrodes increases. There is a tendency to make it difficult to ensure sufficient insulation and conductivity between electrodes to be connected.
  • the conductive adhesive layer 3 preferably has a higher melt viscosity when connecting circuit members than the insulating adhesive layers 4 and 5.
  • the melt viscosity at the time of connection is a melt viscosity at a heating temperature when circuit members are connected to each other using the adhesive film 100 for circuit connection.
  • the heating temperature for connecting the circuit members is appropriately adjusted according to the curability of the adhesive in the circuit connecting adhesive film 100, but is usually in the range of 120 ° C to 220 ° C. is there. Therefore, it is more preferable that the melt viscosity of the conductive adhesive layer 3 is higher than the melt viscosity of the insulating adhesive layers 4 and 5 within the temperature range.
  • the melt viscosity at the time of connection of the conductive adhesive layer 3 is, for example, 5.0 X 10 2 to 5.0 X 10 6 Pa's at 120 ° C. That force S, preferably 5.0 X 10 3 to 5.0 X 10 ° Pa ⁇ s.
  • the melt viscosity at the time of connecting the insulating adhesive layers 4 and 5 is specifically 1.0 X 10 2 to 1.0 X 10 6 Pa's at 120 ° C, for example. Force S, preferably 1.0 X 10 3 to 1.0 X 1 0 5 Pa ⁇ s.
  • connection structure of the circuit member of the present invention using the adhesive film for circuit connection 110 of the present invention will be described.
  • FIG. 3 is a schematic cross-sectional view showing a preferred embodiment of a circuit member connection structure according to the present invention.
  • the circuit member connection structure 200 shown in FIG. 3 includes a first circuit member 10 having a first circuit electrode 12 formed on the first substrate 11 and its main surface, a second circuit board 21 and its main substrate.
  • the second circuit member 20 having the second circuit electrode 22 formed on the surface is made of a cured product obtained by curing the adhesive film for circuit connection 110 of the present invention, and the first and second circuit members 10. , 20 are connected by a circuit connecting member 110a formed between them.
  • the first circuit electrode 12 and the second circuit electrode 22 face each other and are electrically connected.
  • the circuit connecting member 110a is made of a cured product obtained by curing the circuit connecting adhesive film 110 of the present invention, and includes the cured product 2a of the adhesive 2 and the conductive particles 1 dispersed therein. It consists of a cured product 3a of the conductive adhesive layer 3 and a cured product 5a of the insulating adhesive layer 5 formed on both sides thereof.
  • the first circuit electrode 12 and the second circuit electrode 22 are electrically connected via the conductive particles 1.
  • the cured product 5a of the insulating adhesive layer 5 is formed so as to cover at least the first and second substrates 11 and 12 side periphery of the first and second circuit electrodes 12 and 22. This is because when the first and second circuit members 10 and 20 are connected, the insulating adhesive layer 5 extends from the first and second circuit electrodes 12 and 22 (on the surfaces facing each other) to the periphery thereof. This is because it flows out.
  • the first and second circuit members 10 and 20 are not particularly limited as long as electrodes that require electrical connection are formed. Specific examples include glass or plastic substrates used in liquid crystal displays, electrodes with electrodes such as ITO, printed wiring boards, ceramic wiring boards, flexible wiring boards, and semiconductor silicon chips. Are used in combination as needed. As described above, in this embodiment, not only materials such as printed wiring boards and polyimide, but also metals such as copper and aluminum, and IT ⁇ (i ndium tin oxide), silicon nitride (SiN), silicon dioxide (SiO2), and other inorganic materials
  • circuit members having various surface states can be used.
  • the circuit member connection structure 200 includes, for example, the first circuit member 10, the circuit connection adhesive film 110 of the present invention, the second circuit member 20, and the first circuit electrode 11 and the first circuit electrode 11.
  • the first circuit electrode 11 and the second circuit electrode 21 are electrically connected by stacking in this order so as to face the second circuit electrode 21 and heating and pressurizing. It is obtained by a method of connecting the circuit member 10 and the second circuit member 20.
  • the circuit connection adhesive film 110 formed on the peelable substrate is heated and pressed in a state where the film is adhered to the second circuit member 20, and then the circuit connection adhesion is performed. After the film 110 is temporarily bonded and the peelable substrate is peeled off, the first circuit member 10 is placed with the circuit electrodes aligned, and the second circuit member 20, the circuit connecting adhesive film 110 and the first circuit member 10 are placed. A laminated body in which one circuit member 10 is laminated in this order can be prepared.
  • Conditions for heating and pressurizing the laminate are set so that the adhesive film for circuit connection is cured and sufficient adhesive strength is obtained according to the curability of the adhesive in the adhesive film for circuit connection. Adjust as appropriate.
  • circuit connection adhesive film 110 is used instead of the circuit connection adhesive film 110.
  • Use adhesive film 100 Use adhesive film 100.
  • Phenoxy resin (Union Carbide, trade name: PKHC) 32 parts by mass, bisphenol A type acrylic resin containing acrylic particles with an average particle size of 0.2 ⁇ m dispersed in 20% by mass Resin (made by Nippon Shokubai Co., Ltd., trade name: BPA328) 10 parts by weight, bisphenol A type solid epoxy resin (made by Yuka Shell Epoxy Co., Ltd., trade name: YL980) 20 parts by weight, imidazole curing agent (made by Asahi Kasei Kogyo Co., Ltd.) , Product name: Novaki Yua HX— 3941) 35 parts by mass and 3 parts by mass of a silane coupling agent (trade name: A187, manufactured by Nippon Tunica Co., Ltd.) were dissolved in Tonoleen as a solvent to obtain a coating solution for forming an insulating adhesive layer having a solid content of 50% by mass.
  • PKHC bisphenol A type acrylic resin containing acrylic particles with an average particle size of 0.2
  • this coating solution was applied to a PET film having a thickness of 50 ⁇ m on one side (the surface to which the coating solution was applied) using a coating device, and 70 ° C.
  • a coating device By drying with hot air for 10 minutes, an insulating adhesive layer (a) having a thickness of 11 ⁇ m was formed on the PET film.
  • the melt viscosity of this insulating adhesive layer (a) was measured at a rate of temperature increase of 10 ° C / min, tensile mode, frequency 10Hz, 25 ° C to 200 ° C. 120 when measured under the above conditions.
  • the melted rice occupancy in C was 1.0 X 10 3 Pa's.
  • the coating liquid for forming the insulating adhesive layer was applied to a PET film having a thickness of 25 am having a release treatment on one side (the surface on which the coating liquid was applied) using a coating apparatus, By drying with hot air at 70 ° C for 10 minutes, an insulating adhesive layer (b) with a thickness of 2 ⁇ m was formed on the PET film.
  • the melt viscosity of this insulating adhesive layer (b) can be measured using a viscoelasticity measuring device (Rheometrics) up to 10 ° C / min, tensile mode, frequency 10Hz, 25 ° C to 200 ° C. As a result, the melt viscosity at 120 ° C was 1.0 X 10 3 Pa's.
  • acrylic resin particles having an average particle size of 0.2 ⁇ m were dispersed in 32 parts by mass of phenoxy resin (trade name: PKHC, manufactured by Union Carbide) and bisphenol A type epoxy resin.
  • PKHC phenoxy resin
  • Acrylic particle-containing resin made by Nippon Shokubai Co., Ltd., trade name: BPA328
  • imidazole-based curing agent made by Asahi Kasei Kogyo Co., Ltd., trade name: Novaki Yua HX-3941
  • silane coupling agent Neippon Tunica Product name: A187
  • silicone rubber product name: E604 manufactured by Toray Dow Coung Co., Ltd.
  • This coating solution was applied to a 50 ⁇ m thick ⁇ ⁇ ⁇ ⁇ ET film with a release treatment on one side (the surface to which the coating solution was applied) using a coating device, and heated with air at 70 ° C for 10 minutes.
  • a 10 ⁇ m thick conductive adhesive layer (c) was formed on the PET film.
  • This conductive adhesive The melt viscosity of the layer (c) was measured using a viscoelasticity measuring device (manufactured by Rheometrics) under conditions of a heating rate of 10 ° C / min, a tensile mode, a frequency of 10Hz, and 25 ° C to 200 ° C.
  • the melt viscosity at 120 ° C. was 1 ⁇ 0 ⁇ 10 4 Pa ′s.
  • the insulating adhesive layer (a) and the conductive adhesive layer (c) obtained above were laminated with a roll laminator with a force S and heated at 40 ° C to obtain a laminated film.
  • the insulating adhesive layer (b) obtained above Is laminated with a roll laminator while heating at 40 ° C.
  • the thickness of the insulating adhesive layer (a) is 11 xm
  • the thickness of the conductive adhesive layer (c) is 10 ⁇ m
  • the insulating adhesive layer An adhesive film for circuit connection having a three-layer structure with a thickness of (b) of 2 ⁇ m was obtained.
  • the thickness of the insulating adhesive layer (a) was 8 ⁇ m, the thickness of the insulating adhesive layer (b) was 5 ⁇ m, and the thickness of the conductive adhesive layer (c) was 10 ⁇ m.
  • a three-layer adhesive film for circuit connection was obtained in the same manner as Example 1 except for the above.
  • the thickness of the insulating adhesive layer (a) is 12 / m
  • the thickness of the insulating adhesive layer (b) is 0.1 ⁇ m
  • the thickness of the conductive adhesive layer (c) is 10 ⁇ m.
  • a three-layered adhesive film for circuit connection was obtained in the same manner as Example 1 except for the above.
  • the thickness of the insulating adhesive layer (a) was 3 ⁇ m
  • the thickness of the insulating adhesive layer (b) was 3 ⁇ m
  • the thickness of the conductive adhesive layer (c) was 10 ⁇ m.
  • a three-layer adhesive film for circuit connection was obtained in the same manner as Example 1 except for the above.
  • Phenoxy resin (Union Carbide, trade name: PKHC) 32 parts by mass, bisphenol A acrylic resin containing acrylic particles with an average particle diameter of 0.2 ⁇ m dispersed in 20% by mass in a type A epoxy resin (Nippon Shokubai Co., Ltd., trade name: BPA328) 20 parts by mass, imidazole-based curing agent (Asahi Kasei Kogyo Co., Ltd., trade name: HX_3941) 35 parts by mass, silane coupling agent (Nihon Tunica, trade name: A187) 3 parts by mass and silicone rubber (Torayda 30 parts by mass in toluene as a solvent was dissolved in toluene as a solvent to obtain a coating solution for forming an insulating adhesive layer having a solid content of 50% by mass.
  • PKHC bisphenol A acrylic resin containing acrylic particles with an average particle diameter of 0.2 ⁇ m dispersed in 20% by mass in a type A epoxy resin (Nippon Shokubai Co.
  • this coating solution was applied to a 50 ⁇ m-thick PET film with a release treatment applied to one side (the surface to which the coating solution was applied) using a coating device, and 70 ° C.
  • a coating device By drying with hot air for 10 minutes, an insulating adhesive layer (a) having a thickness of 11 ⁇ m was formed on the PET film.
  • the melt viscosity of this insulating adhesive layer (a) was measured at a rate of temperature increase of 10 ° C / min, tensile mode, frequency 10Hz, 25 ° C to 200 ° C. When measured under the above conditions, the melt viscosity at 120 ° C. was 1.0 ⁇ 10 4 Pa ′s.
  • the insulating adhesive layer-forming coating solution is applied to a PET film having a thickness of 25 am having a release treatment on one side (the surface on which the coating solution is applied) using a coating apparatus, By drying with hot air at 70 ° C for 10 minutes, an insulating adhesive layer (b) with a thickness of 2 ⁇ m was formed on the PET film.
  • the melt viscosity of this insulating adhesive layer (b) is measured using a viscoelasticity measuring device (Rheometrics) up to 10 ° C / min, tensile mode, frequency 10Hz, 25 ° C to 200 ° C. As a result, the melt viscosity at 120 ° C was 1.0 X 10 4 Pa 's.
  • An adhesive solution was prepared. Disperse 20 parts by mass of conductive particles (average particle size: 3.2 zm) formed by forming Ni and Au layers on the surface of polystyrene core (diameter: 3 ⁇ m) in 100 parts by mass of this adhesive solution Thus, a coating solution for forming a conductive adhesive layer was obtained.
  • This coating solution was applied to a 50 ⁇ m thick ⁇ ET film with a release treatment on one side (the surface to which the coating solution was applied) using a coating device, and heated with air at 70 ° C for 10 minutes.
  • an insulating adhesive layer (c) having a thickness of 10 ⁇ m was formed on the PET film.
  • This conductive adhesive The melt viscosity of the layer (c) was measured using a viscoelasticity measuring device (manufactured by Rheometrics) under conditions of a heating rate of 10 ° C / min, a tensile mode, a frequency of 10Hz, and 25 ° C to 200 ° C.
  • the melt viscosity at 120 ° C. was 1 ⁇ 0 ⁇ 10 3 Pa ′s.
  • the insulating adhesive layer (a) and the conductive adhesive layer (c) obtained above were laminated with a roll laminator while heating at 40 ° C, and a laminated film was obtained.
  • the insulating adhesive layer (b) obtained above Is laminated with a roll laminator while heating at 40 ° C.
  • the thickness of the insulating adhesive layer (a) is 11 xm
  • the thickness of the conductive adhesive layer (c) is 10 ⁇ m
  • the insulating adhesive layer An adhesive film for circuit connection having a three-layer structure with a thickness of (b) of 2 ⁇ m was obtained.
  • the thickness of the insulating adhesive layer (a) is 7 ⁇ m
  • the thickness of the insulating adhesive layer (b) is 7 ⁇ m
  • the thickness of the conductive adhesive layer (c) is 9 ⁇ m.
  • Phenoxy resin (Union Carbide, trade name: PKHC) 32 parts by mass, bisphenol A type acrylic resin containing acrylic particles with an average particle size of 0.2 ⁇ m dispersed in 20% by mass Resin (made by Nippon Shokubai Co., Ltd., trade name: BPA328) 10 parts by weight, bisphenol A type solid epoxy resin (made by Yuka Shell Epoxy Co., Ltd., trade name: YL980) 20 parts by weight, imidazole curing agent (made by Asahi Kasei Kogyo Co., Ltd.) Product name: Novakia HX-3941) 35 parts by mass and silane coupling agent (manufactured by Nippon Tunica, product name: A187) 3 parts by mass are dissolved in Tonoleen, a solvent, and an insulating adhesive with a solid content of 50% by mass A layer forming coating solution was obtained.
  • PKHC bisphenol A type acrylic resin containing acrylic particles with an average particle size of 0.2 ⁇ m dispersed in 20% by
  • this coating solution was applied to a 50 ⁇ m-thick PET film having a release treatment on one side (the surface to which the coating solution was applied) using a coating apparatus, and the coating solution was applied at 70 ° C for 10 minutes.
  • an insulating adhesive layer (a) having a thickness of 13 xm was formed on the PET film.
  • the melt viscosity of this insulating adhesive layer (a) was measured at a rate of temperature increase of 10 ° C / min, tensile mode, frequency 10Hz, 25 ° C to 200 ° C. Measured under conditions up to However, the molten rice occupation at 120 ° C was 1.0 X 10 3 Pa's.
  • conductive particles (average particle size: average particle diameter: 100 parts by mass of the coating solution for insulating adhesive layer formation) on which an Au layer is formed on the surface of a polystyrene core (diameter: 3 / m). 3.2 / m) 20 parts by mass was dispersed to obtain a coating solution for forming a conductive adhesive layer.
  • This coating solution is applied to a 50-am-thick PET film with a release treatment applied to one side (the surface to which the coating solution is applied) using a coating device, and dried with hot air at 70 ° C for 10 minutes.
  • a conductive adhesive layer (c) having a thickness of 10 xm was formed on the PET film.
  • melt viscosity of this conductive adhesive layer (c) is increased to 10 ° CZ min, tensile mode, frequency 10Hz, 25 ° C to 200 ° C.
  • melt viscosity at 120 ° C. was 1.0 ⁇ 10 3 Pa ′s.
  • the insulating adhesive layer (a) obtained above and the conductive adhesive layer (c) are laminated at a temperature of 40 ° C with a roll laminator, and a two-layer circuit. An adhesive film for connection was obtained.
  • the thickness of the insulating adhesive layer (a) is 12 / m
  • the thickness of the insulating adhesive layer (b) is 0 ⁇ 08 ⁇ m
  • the thickness of the conductive adhesive layer (c) is 10 / m.
  • a three-layered adhesive film for circuit connection was obtained in the same manner as Example 1 except that.
  • a chip (1.2 X 19 mm) with gold bumps (area: 30 X 50 / im, bump height: 15 / im, number of bumps: 300) , Thickness: 500 / im) and a glass substrate with an ITO circuit (thickness: 0 ⁇ 7 mm, electrode height: 0 ⁇ 15 / im) were connected as shown below.
  • an adhesive film for circuit connection (1.5 X 20mm) was heated and pressed for 2 seconds at 80 ° C and 0.998MPa (10kgf / cm 2 ) on a glass substrate with an ITO circuit. Pasted.
  • the adhesive film for circuit connection having a three-layer structure is obtained by attaching the insulating adhesive layer (b) to the glass substrate after peeling the PET film on the insulating adhesive layer (b).
  • the conductive adhesive layer (c) was attached to the glass substrate after peeling the PET film on the conductive adhesive layer (c).
  • the PET film is peeled off from the adhesive film for circuit connection, and the bumps on the chip and the IT After aligning with the glass substrate with O circuit, heat and pressurize from above the chip under the conditions of 190 ° C, 40g / bump, 10 seconds, and the chip and glass substrate through the adhesive film for circuit connection Made this connection.
  • Chips with gold bumps (area: 30 ⁇ 100 ⁇ ⁇ , space between bumps 10 xm, height: 15 ⁇ ⁇ , number of bumps: 472) using the adhesive films for circuit connection produced in the above examples and comparative examples 1.
  • 9 X 15 mm, thickness: 500 ⁇ m) and a glass substrate with an ITO circuit (thickness: 0.7 mm, electrode height: 0.15 zm) were connected as shown below.
  • an adhesive film for circuit connection (2.0 X 20mm) was heated and pressed for 2 seconds at 80 ° C and 0.998MPa (10kgf / cm 2 ) on a glass substrate with an ITO circuit. Pasted.
  • the adhesive film for circuit connection having a three-layer structure is obtained by attaching the insulating adhesive layer (b) to the glass substrate after peeling the PET film on the insulating adhesive layer (b).
  • the conductive adhesive layer (c) was attached to the glass substrate after peeling the PET film on the conductive adhesive layer (c).
  • the chip was conditioned at 190 ° C, 40g / bump for 10 seconds. Heating and pressurization were performed from above, and the main connection between the chip and the glass substrate through the adhesive film for circuit connection was performed.
  • connection sample thus obtained was subjected to the following current and moisture resistance test.
  • the connection sample was treated by applying 15 VDC for 500 hours in an environment of 85 ° C and 85% RH.
  • the insulation resistance value of the connection sample after the energization and moisture resistance test an insulation resistance meter was used to measure the insulation resistance between adjacent bumps at room temperature under the conditions of a measurement voltage of 50 V and a voltage application time of 60 seconds. This makes it possible to determine whether the insulation characteristics between adjacent bumps are good. I refused. In this case, the good insulation characteristic is that the insulation resistance value is 1 X 10 8 ⁇ or more and the insulation resistance value between all adjacent bumps is 1 X 10 8 ⁇ or more. An evaluation was made by using a case where the resistance value was less than 1 X 10 8 ⁇ as ⁇ . Table 1 shows the results and the minimum insulation resistance.
  • a chip with a gold bump (area: 30 X 50 zm, bump height: 15 ⁇ , number of bumps: 300) (1.2 X 19 mm, The thickness was connected to a glass substrate with an ITO circuit (thickness: 0.7 mm, electrode height: 0.15 zm) as shown below.
  • the adhesive film for circuit connection (1. 5 X 20mm), on a glass substrate with an ITO circuit, 8 0 ° C, 0. 98MPa (10kgf / cm 2) 2 seconds by heating and pressing under the conditions of Pasted.
  • the adhesive film for circuit connection having a three-layer structure is obtained by attaching the insulating adhesive layer (b) to the glass substrate after peeling the PET film on the insulating adhesive layer (b).
  • the conductive adhesive layer (c) was attached to the glass substrate after peeling the PET film on the conductive adhesive layer (c).
  • the chip was conditioned at 190 ° C, 40g / bump, 10 seconds. Heating and pressurization were performed from above, and the main connection between the chip and the glass substrate through the adhesive film for circuit connection was performed.
  • connection sample thus obtained. That is, the connection sample was left to stand for 1000 hours in an environment of 85 ° C and 85% RH.
  • connection resistance value of the connection sample after the moisture resistance test the connection resistance for each bump was measured by a four-terminal method using a digital multimeter. Based on this, it was judged whether the continuity was good. In this case, good continuity means that the connection resistance value is 20 ⁇ or less, the connection resistance value of all bumps is 20 ⁇ or less, A is evaluated, and the one that includes bumps whose connection resistance value is more than 20 ⁇ is evaluated as B. did.
  • the results and the maximum connection resistance are shown in Table 1.
  • the two-layered adhesive film for circuit connection consisting of a conductive adhesive layer and an insulating adhesive layer (Comparative Example 2) had inferior insulation resistance values after the energization and moisture resistance test.
  • Comparative Example 3 where the thickness of the insulating adhesive layer is 0.08 xm less than 0.1111, the insulation resistance value after the energization and moisture resistance test deteriorates due to insufficient insulation between the P-contact electrodes. Force S confirmed.
  • the adhesive film for circuit connection of the present invention it was confirmed that when the circuit members are connected to each other, the high-resolution and long-term connection reliability in which the outflow of the conductive particles from the electrodes is small is excellent.
  • connection structure and circuit member connection method can be provided.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

La présente invention concerne une pellicule adhésive de connexion de circuit servant à connecter un premier élément de circuit qui comporte une première électrode de circuit sur le plan principal d'un premier substrat, avec un second élément de circuit qui comporte une seconde électrode de circuit sur le plan principal d'un second substrat, dans un état où les première et seconde électrodes de circuit sont disposées face à face. La pellicule comporte au moins une couche adhésive conductrice (3) contenant des particules conductrices (1) et un adhésif (2) ; une première couche adhésive isolante (4) disposée sur un plan de la couche adhésive conductrice (3) ; et une seconde couche adhésive isolante (5) disposée sur la couche adhésive conductrice (3) sur le plan opposé à celui qui comporte la première couche adhésive isolante (4). L'épaisseur d'au moins l'une des première et seconde couches adhésives isolantes (4, 5) est de 0,1-5,0 µm.
PCT/JP2007/057667 2006-04-12 2007-04-05 Pellicule adhésive de connexion de circuit, structure de connexion d'élément de circuit et procédé de connexion d'élément de circuit WO2007123003A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020117010921A KR101150116B1 (ko) 2006-04-12 2007-04-05 회로 접속용 접착 필름, 회로 부재의 접속 구조 및 회로 부재의 접속 방법
JP2007528907A JP4775377B2 (ja) 2006-04-12 2007-04-05 回路接続用接着フィルム、回路部材の接続構造及び回路部材の接続方法
CN2007800130291A CN101421886B (zh) 2006-04-12 2007-04-05 电路连接用粘接膜、电路部件的连接结构以及电路部件的连接方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006-109690 2006-04-12
JP2006109690 2006-04-12
JP2006213444 2006-08-04
JP2006-213444 2006-08-04

Publications (1)

Publication Number Publication Date
WO2007123003A1 true WO2007123003A1 (fr) 2007-11-01

Family

ID=38624909

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/057667 WO2007123003A1 (fr) 2006-04-12 2007-04-05 Pellicule adhésive de connexion de circuit, structure de connexion d'élément de circuit et procédé de connexion d'élément de circuit

Country Status (5)

Country Link
JP (1) JP4775377B2 (fr)
KR (2) KR101090561B1 (fr)
CN (3) CN101421886B (fr)
TW (1) TW200745308A (fr)
WO (1) WO2007123003A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009028241A1 (fr) * 2007-08-24 2009-03-05 Sony Chemical & Information Device Corporation Film électroconducteur anisotrope et procédé permettant de produire une structure de connexion au moyen de ce dernier
JP2009194359A (ja) * 2008-01-16 2009-08-27 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法
JP2010241993A (ja) * 2009-04-08 2010-10-28 Canon Chemicals Inc 導電性接着剤
WO2017130789A1 (fr) * 2016-01-29 2017-08-03 日立化成株式会社 Film adhésif, procédé de production associé, ruban adhésif et bobine pour film adhésif
JP2022542011A (ja) * 2018-07-12 2022-09-29 エイチアンドエス ハイ テック コーポレーション 導電粒子の隔離距離が制御された異方性導電接着フィルムの製造方法
JP2022544451A (ja) * 2018-07-12 2022-10-19 エイチアンドエス ハイ テック コーポレーション 異方性導電接着フィルムの製造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011001895A1 (fr) * 2009-07-01 2011-01-06 日本化薬株式会社 Agent d'étanchéité pour cristaux liquides conçu pour un procédé de dépôt goutte à goutte de cristaux liquides et cellule d'affichage à cristaux liquides l'utilisant
KR101351617B1 (ko) * 2010-12-23 2014-01-15 제일모직주식회사 이방 도전성 필름
KR20120076187A (ko) * 2010-12-29 2012-07-09 제일모직주식회사 이방 도전성 필름
JP5972844B2 (ja) * 2012-09-18 2016-08-17 デクセリアルズ株式会社 異方性導電フィルム、異方性導電フィルムの製造方法、接続体の製造方法、及び接続方法
CN103596379A (zh) * 2013-10-26 2014-02-19 溧阳市东大技术转移中心有限公司 一种双层柔性电路板的制造方法
JP6408759B2 (ja) * 2013-11-08 2018-10-17 デクセリアルズ株式会社 接着剤組成物、及びフィルム巻装体
WO2016189829A1 (fr) * 2015-05-28 2016-12-01 タツタ電線株式会社 Pâte conductrice pour le montage
TWI741973B (zh) * 2015-12-22 2021-10-11 美商英特爾股份有限公司 層積體之製造方法，層積體及多層電路基板
CN108040425B (zh) * 2017-12-14 2019-09-20 广东长盈精密技术有限公司 电子设备及其电路板
CN110875101A (zh) * 2018-08-31 2020-03-10 玮锋科技股份有限公司 异方性导电膜结构及其制作方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01236588A (ja) * 1988-03-17 1989-09-21 Matsushita Electric Ind Co Ltd 異方導電性接着体
JPH0218809A (ja) * 1988-07-06 1990-01-23 Nitto Denko Corp 導電性接着テープ
JPH0316147A (ja) * 1989-03-09 1991-01-24 Hitachi Chem Co Ltd 回路の接続方法及びそれに用いる接着剤フィルム
JPH04366630A (ja) * 1991-06-13 1992-12-18 Sharp Corp 異方性導電接着テープ
JPH07230840A (ja) * 1994-02-17 1995-08-29 Hitachi Chem Co Ltd 接続部材及びこれを用いた電極の接続構造
JPH08279371A (ja) * 1995-02-07 1996-10-22 Hitachi Chem Co Ltd 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
JP2002076607A (ja) * 2000-08-25 2002-03-15 Sekisui Chem Co Ltd 微粒子の転写・配置方法、微粒子配置フィルム、導電接続フィルム、及び、導電接続構造体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61195179A (ja) * 1985-02-25 1986-08-29 Matsushita Electric Ind Co Ltd 異方導電性接着シ−ト
JPH03107888A (ja) * 1989-09-21 1991-05-08 Sharp Corp 回路基板の接続構造
US5401913A (en) * 1993-06-08 1995-03-28 Minnesota Mining And Manufacturing Company Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
US5718789A (en) * 1995-06-07 1998-02-17 The Dexter Corporation Method for making a debossed conductive film composite
JP3914606B2 (ja) * 1997-04-25 2007-05-16 松下電器産業株式会社 接着層の製造装置、両面基板の製造装置および多層基板の製造装置
US6429382B1 (en) * 1999-04-13 2002-08-06 Matsushita Electric Industrial Co., Ltd. Electrical mounting structure having an elution preventive film
KR100559937B1 (ko) * 2003-01-08 2006-03-13 엘에스전선 주식회사 미세회로의 접속방법 및 그에 의한 접속 구조체

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01236588A (ja) * 1988-03-17 1989-09-21 Matsushita Electric Ind Co Ltd 異方導電性接着体
JPH0218809A (ja) * 1988-07-06 1990-01-23 Nitto Denko Corp 導電性接着テープ
JPH0316147A (ja) * 1989-03-09 1991-01-24 Hitachi Chem Co Ltd 回路の接続方法及びそれに用いる接着剤フィルム
JPH04366630A (ja) * 1991-06-13 1992-12-18 Sharp Corp 異方性導電接着テープ
JPH07230840A (ja) * 1994-02-17 1995-08-29 Hitachi Chem Co Ltd 接続部材及びこれを用いた電極の接続構造
JPH08279371A (ja) * 1995-02-07 1996-10-22 Hitachi Chem Co Ltd 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
JP2002076607A (ja) * 2000-08-25 2002-03-15 Sekisui Chem Co Ltd 微粒子の転写・配置方法、微粒子配置フィルム、導電接続フィルム、及び、導電接続構造体

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009028241A1 (fr) * 2007-08-24 2009-03-05 Sony Chemical & Information Device Corporation Film électroconducteur anisotrope et procédé permettant de produire une structure de connexion au moyen de ce dernier
JP2009054377A (ja) * 2007-08-24 2009-03-12 Sony Chemical & Information Device Corp 異方性導電フィルム及びそれを用いた接続構造体の製造方法
JP2009194359A (ja) * 2008-01-16 2009-08-27 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法
JP2010241993A (ja) * 2009-04-08 2010-10-28 Canon Chemicals Inc 導電性接着剤
WO2017130789A1 (fr) * 2016-01-29 2017-08-03 日立化成株式会社 Film adhésif, procédé de production associé, ruban adhésif et bobine pour film adhésif
JPWO2017130789A1 (ja) * 2016-01-29 2018-11-22 日立化成株式会社 接着剤フィルム及びその製造方法、接着剤テープ、並びに接着剤フィルム用リール
JP2022542011A (ja) * 2018-07-12 2022-09-29 エイチアンドエス ハイ テック コーポレーション 導電粒子の隔離距離が制御された異方性導電接着フィルムの製造方法
JP2022544451A (ja) * 2018-07-12 2022-10-19 エイチアンドエス ハイ テック コーポレーション 異方性導電接着フィルムの製造方法
JP7317415B2 (ja) 2018-07-12 2023-07-31 エイチアンドエス ハイ テック コーポレーション 導電粒子の隔離距離が制御された異方性導電接着フィルムの製造方法
JP7336812B2 (ja) 2018-07-12 2023-09-01 エイチアンドエス ハイ テック コーポレーション 異方性導電接着フィルムの製造方法

Also Published As

Publication number Publication date
CN101421886A (zh) 2009-04-29
KR20080108615A (ko) 2008-12-15
CN101901971B (zh) 2012-07-04
TW200745308A (en) 2007-12-16
CN101901972A (zh) 2010-12-01
CN101901971A (zh) 2010-12-01
CN101421886B (zh) 2010-12-15
JPWO2007123003A1 (ja) 2009-09-03
CN101901972B (zh) 2012-07-04
KR101150116B1 (ko) 2012-06-08
KR20110063586A (ko) 2011-06-10
KR101090561B1 (ko) 2011-12-08
JP4775377B2 (ja) 2011-09-21
TWI367930B (fr) 2012-07-11

Similar Documents

Publication Publication Date Title
WO2007123003A1 (fr) Pellicule adhésive de connexion de circuit, structure de connexion d'élément de circuit et procédé de connexion d'élément de circuit
JP2009194359A (ja) 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法
JP3342703B2 (ja) 回路接続用フィルム状接着剤及び回路板
JP4924773B2 (ja) 導電接続材料、電子部品の製造方法、導電接続材料付き電子部材および電子部品
JP4978493B2 (ja) 回路接続材料、接続構造体及びその製造方法
WO2009123285A1 (fr) Activateur de flux, composition de résine adhésive, pâte adhésive, film adhésif, procédé de fabrication d'un dispositif semi-conducteur, et dispositif semi-conducteur
WO2000009623A1 (fr) Adhesif pour fixer des elements de circuit, carte de circuit imprime et procede de production
KR20110063483A (ko) 도전 접속 재료 및 그것을 이용한 단자간 접속 방법 및 접속 단자의 제조 방법
WO2009081874A1 (fr) Composition de résine du type film pour remplissage d'encapsulation, procédé de fabrication d'un boîtier de semi-conducteur ou d'un dispositif à semi-conducteur utilisant celle-ci et dispositif à semi-conducteur
JP5558140B2 (ja) 絶縁性樹脂フィルム、並びにこれを用いた接合体及びその製造方法
KR20060123491A (ko) 접착 필름, 및 접착 필름의 제조 방법
JP5029691B2 (ja) 回路接続用フィルム状接着剤
JP2002204052A (ja) 回路接続材料及びそれを用いた回路端子の接続方法、接続構造
JP5563932B2 (ja) 異方性導電フィルム
JP4254995B2 (ja) 異方導電性接着剤及び回路板
JP4110589B2 (ja) 回路用接続部材及び回路板の製造法
JP2005194413A (ja) 回路接続用接着フィルム及び回路接続構造体
JPH11148059A (ja) 接着剤及び電子部品装置
JP4687576B2 (ja) 回路接続用フィルム状接着剤
JP5143329B2 (ja) 回路接続体の作製方法
JP2005220341A (ja) 充填材及びこれを用いた配線基板並びに配線基板の製造方法
JP6006539B2 (ja) 回路基板及び電子部品搭載基板
JP2021089894A (ja) 異方導電性フィルム及び接続構造体
JP2003253217A (ja) 回路接続用接着剤を用いた接続方法
JP2003253216A (ja) 回路接続用接着剤を用いた接続方法

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2007528907

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07741103

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 200780013029.1

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1020087027564

Country of ref document: KR

122 Ep: pct application non-entry in european phase

Ref document number: 07741103

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 1020117010921

Country of ref document: KR