WO2017130789A1 - Film adhésif, procédé de production associé, ruban adhésif et bobine pour film adhésif - Google Patents

Film adhésif, procédé de production associé, ruban adhésif et bobine pour film adhésif Download PDF

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Publication number
WO2017130789A1
WO2017130789A1 PCT/JP2017/001366 JP2017001366W WO2017130789A1 WO 2017130789 A1 WO2017130789 A1 WO 2017130789A1 JP 2017001366 W JP2017001366 W JP 2017001366W WO 2017130789 A1 WO2017130789 A1 WO 2017130789A1
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WO
WIPO (PCT)
Prior art keywords
adhesive
conductive
adhesive layer
adhesive film
thickness
Prior art date
Application number
PCT/JP2017/001366
Other languages
English (en)
Japanese (ja)
Inventor
立澤　貴
田中　勝
Original Assignee
日立化成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成株式会社 filed Critical 日立化成株式会社
Priority to KR1020187024131A priority Critical patent/KR20180111858A/ko
Priority to CN201780008489.9A priority patent/CN108603078A/zh
Priority to CN202210037588.2A priority patent/CN114262577A/zh
Priority to JP2017564179A priority patent/JP6988482B2/ja
Priority to CN202210037591.4A priority patent/CN114196334A/zh
Publication of WO2017130789A1 publication Critical patent/WO2017130789A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04—Kinds or types
    • B65H75/08—Kinds or types of circular or polygonal cross-section
    • B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Definitions

  • the present invention relates to an adhesive film and a method for producing the same, an adhesive tape, and an adhesive film reel.
  • an anisotropic conductive film (Anisotropic Conductive Film) has been used as a connection material for electrically connecting connected members having a large number of electrodes to manufacture a circuit connection body.
  • Anisotropic conductive film keeps the conductive state between opposing electrodes when connecting a semiconductor element such as an IC or LSI, a package, etc. to a substrate such as a printed wiring board, LCD glass substrate, or flexible printed circuit board. It is a connection material that performs electrical connection and mechanical fixation so as to maintain insulation between electrodes.
  • non-conductive films NCF (Non-Conductive Film)
  • connection materials are known as connection materials.
  • connection material contains, for example, an adhesive component containing a thermosetting resin and the like, and conductive particles blended as necessary in the anisotropic conductive film, on a base material such as a polyethylene terephthalate (PET) film.
  • a base material such as a polyethylene terephthalate (PET) film.
  • PET polyethylene terephthalate
  • the adhesive film may be used in the form of a reel obtained by cutting a film-like original fabric into a tape having a width suitable for the application and winding the tape around a winding core (for example, a patent). Reference 1).
  • connection material when connecting a driver IC or the like to an LCD module using a connection material, the portion of the connection material that contributes effectively to the connection of circuit members is essentially less than about half of the entire LCD module. From the viewpoint of capital investment, it is common to mount a driver IC or the like after first attaching a connection material over the entire LCD module. However, in recent years, there has been a movement to reduce the amount of connection material used for the purpose of reducing the manufacturing cost of LCDs. On the other hand, when COF, FPC, etc. are connected to the LCD module, the connection material is first attached to the COF or FPC side and then mounted on the LCD module side, thereby reducing the amount of connection material used. Cost reduction is being considered.
  • connection material having a two-layer structure is generally obtained by forming a non-conductive adhesive layer on a substrate and further forming a conductive adhesive layer thereon.
  • the step of pasting the connection material having the two-layer structure on the COF or FPC side first is adopted, the surface on the non-conductive adhesive layer side is pasted toward the LCD module side. There arises a problem that connection characteristics cannot be obtained.
  • connection material having a two-layer structure In order to solve the above problems, the present inventors have first adopted a process of attaching a connection material having a two-layer structure to the COF or FPC side and then mounting it on the LCD module. A conductive adhesive layer was formed on the material, and a non-conductive adhesive layer was further formed thereon to obtain a two-layer connection material.
  • a phenomenon so-called blocking phenomenon
  • the blocking phenomenon occurs in which the conductive adhesive layer is transferred to the base material when the base material is peeled from the connection material at the time of circuit connection.
  • connection reliability electrical connection or mechanical fixation
  • the present invention has been made in view of the above circumstances, and has a conductive adhesive layer and a non-conductive adhesive layer, and can suppress the occurrence of a blocking phenomenon and is used for manufacturing a circuit connector. It is an object of the present invention to provide an adhesive film capable of obtaining excellent connection reliability, a method for producing the same, an adhesive tape, and a reel for an adhesive film.
  • the first non-conductive adhesive layer, the conductive adhesive layer containing conductive particles, and the second non-conductive adhesive layer are laminated in this order, Provided is an adhesive film in which the thickness T1 of the first nonconductive adhesive layer and the thickness T of the conductive adhesive layer satisfy the following formula (1). T1 ⁇ T (1)
  • a first nonconductive adhesive layer, a conductive adhesive layer containing conductive particles, and a second nonconductive adhesive layer are laminated in this order.
  • a method for producing an adhesive film comprising a step of obtaining an adhesive film, wherein the thickness T1 of the first nonconductive adhesive layer and the thickness T of the conductive adhesive layer satisfy the following formula (1). T1 ⁇ T (1)
  • T1 and the average particle size r of the conductive particles preferably satisfy the following formula (2).
  • T1 and the thickness T2 of the second non-conductive adhesive layer preferably satisfy the following formula (3).
  • the present invention is an adhesive film containing conductive particles, the first non-conductive region where the conductive particles are not present, the conductive region where the conductive particles are present, and the conductive film.
  • a second nonconductive region in which no conductive particles are present in this order in the thickness direction of the adhesive film, the length L1 of the first nonconductive region in the thickness direction of the adhesive film, and the conductive region Provided is an adhesive film in which the length L in the thickness direction of the adhesive film satisfies the following formula (4). L1 ⁇ L (4)
  • L1 and the average particle size r of the conductive particles preferably satisfy the following formula (5).
  • L1 and the length L2 in the thickness direction of the adhesive film of the second nonconductive region preferably satisfy the following formula (6).
  • the present invention provides an adhesive tape comprising a tape-like base material and the adhesive film provided on one surface of the base material.
  • an adhesive film reel comprising the above adhesive tape and a core around which the adhesive tape is wound.
  • the present invention while having a conductive adhesive layer and a non-conductive adhesive layer, the occurrence of a blocking phenomenon can be suppressed, and excellent connection reliability can be obtained when used in the manufacture of a circuit connector. It is possible to provide an adhesive film that can be manufactured and a method for producing the same, an adhesive tape, and a reel for the adhesive film.
  • FIG. 1 It is a schematic cross section showing one embodiment of an adhesive film. It is a schematic cross section which shows other embodiment of an adhesive film. It is a perspective view which shows one Embodiment of the reel for adhesive film. It is an expansion schematic cross section of the adhesive tape in the reel for adhesive film shown in FIG. It is a schematic cross section which shows one Embodiment of the manufacturing method of a circuit connection body.
  • FIG. 1 is a schematic cross-sectional view showing an adhesive film according to the first embodiment.
  • the adhesive film 1 includes a first non-conductive adhesive layer 2, a conductive adhesive layer 3, and a second non-conductive adhesive layer 4 laminated in this order. Become.
  • the first and second nonconductive adhesive layers 2 and 4 are composed of adhesive components 2a and 4a, respectively.
  • the adhesive components 2a and 4a constituting the first and second non-conductive adhesive layers 2 and 4 may be the same as or different from each other.
  • any components that can be cured by heat or light can be widely used.
  • an epoxy adhesive or an acrylic adhesive can be used.
  • the adhesive components 2a and 4a are preferably crosslinkable components from the viewpoint of excellent heat resistance and moisture resistance of the cured product.
  • an epoxy adhesive containing an epoxy resin as a main component as a thermosetting resin is preferable in that it can be cured in a short time, has good connection workability, and has excellent adhesiveness.
  • epoxy adhesives for example, when an adhesive film is provided on a substrate to form an adhesive tape (details will be described later), transfer of adhesive components to the substrate It is preferable at the point which can suppress.
  • a radical curable adhesive as described in International Publication No. 98/44067 may be used.
  • the epoxy adhesive examples include a high molecular weight epoxy resin (for example, a weight average molecular weight of 10,000 to 100,000), a solid epoxy resin or a liquid epoxy resin, or these epoxy resins are urethane, polyester, acrylic rubber, nitrile rubber ( NBR), and an adhesive containing as a main component a modified epoxy resin modified with a synthetic linear polyamide or the like.
  • the epoxy adhesive may further contain additives such as a curing agent, a catalyst, a coupling agent, and a filler in addition to the epoxy resin.
  • the acrylic adhesive examples include an acrylic resin (homopolymer or copolymer) containing at least one of acrylic acid, acrylic acid ester, methacrylic acid ester, and acrylonitrile as a monomer component as a main component. Is mentioned.
  • the acrylic adhesive may further contain additives such as a curing agent, a catalyst, a coupling agent, and a filler.
  • adhesive component 2a, 4a contains the component which exhibits the internal stress relaxation effect from a viewpoint of suppressing the curvature of the circuit member resulting from the difference with the linear expansion coefficient between both circuit members. It is preferable to do.
  • the adhesive components 2a and 4a preferably contain acrylic rubber, an elastomer component, and the like.
  • the conductive adhesive layer 3 contains an adhesive component 3 a and conductive particles 5.
  • the adhesive component 3a may be the same as the adhesive component described as the adhesive components 2a and 4a constituting the first and second non-conductive adhesive layers 2 and 4 described above. It may be the same as or different from each of the adhesive components 2a and 4a constituting the second non-conductive adhesive layers 2 and 4.
  • the conductive particles 5 are dispersed in the adhesive component 3a.
  • the conductive particles 5 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, and conductive carbon particles.
  • the conductive particles 5 may be coated conductive particles in which particles such as non-conductive glass, ceramic, and plastic are used as nuclei and the nuclei are covered with the metal or conductive carbon.
  • the conductive particles 5 may be insulating coated conductive particles whose surfaces are coated with an insulating layer.
  • the conductive adhesive layer 3 may further contain insulating particles in addition to the conductive particles 5 from the viewpoint of improving the insulation between adjacent electrodes.
  • the content of the conductive particles 5 is, for example, 0.1 to 30 parts by volume, preferably 0.1 to 10 parts by volume with respect to 100 parts by volume of the adhesive component 3a contained in the conductive adhesive layer 3. It is.
  • the content is 0.1 part by volume or more, the connection resistance between the opposing electrodes tends to be low, and when it is 30 parts by volume or less, a short circuit between adjacent electrodes can be suppressed.
  • the thickness T1 of the first non-conductive adhesive layer 2 and the thickness T of the conductive adhesive layer 3 satisfy the following formula (1). T1 ⁇ T (1)
  • T1 and T are preferably T1 ⁇ 0.9 ⁇ T, more preferably T1 ⁇ 0.8 ⁇ T, and more preferably T1 from the viewpoint of further improving the capture efficiency of the conductive particles 5 at the time of circuit connection.
  • the relational expression of ⁇ 0.7 ⁇ T is satisfied.
  • the thickness T1 of the first non-conductive adhesive layer 2 and the average particle size r of the conductive particles 5 are excellent in capturing efficiency of the conductive particles 5 at the time of circuit connection, and further increase the connection resistance. From the viewpoint of reduction, the following formula (2) is preferably satisfied. T1 ⁇ 0.8 ⁇ r (2)
  • T1 and r satisfy the relational expression of T1 ⁇ 0.7 ⁇ r more preferably from the same viewpoint.
  • the thickness T1 of the first non-conductive adhesive layer 2 and the thickness T2 of the second non-conductive adhesive layer 4 are the transferability to the circuit member and the distance between the circuit members at the time of circuit connection.
  • the following formula (3) is preferably satisfied from the viewpoint of excellent space fillability. T1 ⁇ T2 (3)
  • T1 and T2 satisfy T1 ⁇ 0.5 ⁇ T2, more preferably T1 ⁇ 0.4 ⁇ T2, and particularly preferably T1 ⁇ 0.3 ⁇ T2.
  • the maximum value of the thickness of each layer is set to the thickness T1. , Thickness T or thickness T2.
  • the average particle size of the conductive particles in the present invention is defined as follows. That is, a conductive particle image is observed at 3000 times with a scanning electron microscope (SEM), and a plurality of conductive particles are selected at random. At this time, in order to accurately determine the average particle diameter, it is preferable to select 30 or more conductive particles. The maximum diameter and the minimum diameter are measured for the selected conductive particles, and the square root of the product of the maximum diameter and the minimum diameter is defined as the particle diameter of the conductive particles. The average particle size is defined by dividing the particle size thus calculated by the number of particles measured.
  • SEM scanning electron microscope
  • the thickness T1 of the first nonconductive adhesive layer 2, the thickness T of the conductive adhesive layer 3, the thickness T2 of the second nonconductive adhesive layer 4, and the average particle size r of the conductive particles 5 are: Each of the above relationships is preferably satisfied, and the specific thickness or average particle diameter thereof is not particularly limited.
  • the thickness T1 of the first non-conductive adhesive layer 2 may be, for example, 0.5 ⁇ m or more, or 1 ⁇ m or more, for example, 2.5 ⁇ m or less, or 2 ⁇ m or less.
  • the thickness T of the conductive adhesive layer 3 may be, for example, 1.5 ⁇ m or more, or 2 ⁇ m or more, for example, 4 ⁇ m or less, or 3.5 ⁇ m or less.
  • the thickness T2 of the second non-conductive adhesive layer 4 may be, for example, 5 ⁇ m or more, or 7 ⁇ m or more, for example, 10 ⁇ m or less, or 9 ⁇ m or less.
  • the average particle diameter r of the conductive particles 5 may be, for example, 2 ⁇ m or more, or 3 ⁇ m or more, for example, 5 ⁇ m or less, or 4 ⁇ m or less.
  • the adhesive film 1 is on the surface of the first non-conductive adhesive layer 2 opposite to the conductive adhesive layer 3 or opposite to the conductive adhesive layer 3 of the second non-conductive adhesive layer 4.
  • a base material (not shown) may be further provided on the side surface.
  • the thickness of the substrate may be 4 to 200 ⁇ m, for example.
  • Base materials are, for example, polyethylene terephthalate, polyethylene naphthalate, polyethylene isophthalate, polybutylene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, ethylene / vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, synthesis It may be a base material made of rubber, liquid crystal polymer or the like. A release treatment may be applied to the adhesive surface of the substrate with the first or second non-conductive adhesive layer.
  • FIG. 2 is a schematic cross-sectional view showing an adhesive film according to the second embodiment.
  • the adhesive film 11 contains an adhesive component 11 a and conductive particles 5.
  • the adhesive film 11 includes a first non-conductive region R1 where the conductive particles 5 are not present, a conductive region R where the conductive particles 5 are present, and a second non-conductive region where the conductive particles 5 are not present.
  • R2 is provided in this order in the thickness direction of the adhesive film 11.
  • the adhesive component 11a may be the same adhesive component as the adhesive components 2a, 3a, 4a described in the first embodiment, and the conductive particles 5 are electrically conductive described in the first embodiment. Conductive particles similar to the conductive particles 5 may be used.
  • the adhesive component 11 a may have a uniform component throughout the adhesive film 11, or may have different components depending on the position of the adhesive film 11. For example, the adhesive component 11a may have different components for each of the first non-conductive region R1, the conductive region R, and the second non-conductive region R2.
  • the conductive region R is a plane that is in the shortest distance from the surface 11b among the planes in contact with the conductive particles 5 and substantially parallel to the surface 11b on the first nonconductive region R1 side of the adhesive film 11.
  • the first tangent plane is present at the shortest distance from the surface 11c. It is defined as a region between a second tangent plane that is a plane.
  • the first non-conductive region R1 extends in the thickness direction of the adhesive film 11 from the first tangential plane toward the surface 11b of the adhesive film 11 on the first non-conductive region R1 side. Is defined as a non-region.
  • the second non-conductive region R2 is a conductive region R extending in the thickness direction of the adhesive film 11 from the second tangential plane toward the surface 11c of the adhesive film 11 on the second non-conductive region R2 side. Is defined as a non-region.
  • the length L1 of the first non-conductive region R1 and the length L of the conductive region R satisfy the following formula (4).
  • L1 and L are preferably L1 ⁇ 0.9 ⁇ L, more preferably L1 ⁇ 0.8 ⁇ L, and more preferably L1 from the viewpoint of further improving the capture efficiency of the conductive particles 5 at the time of circuit connection.
  • the relational expression of ⁇ 0.7 ⁇ L is satisfied.
  • the length L1 of the first non-conductive region R1 and the average particle size r of the conductive particles 5 are excellent in capturing efficiency of the conductive particles 5 at the time of circuit connection, and further reduce the connection resistance. From the viewpoint of enabling, preferably the following formula (5) is satisfied. L1 ⁇ 0.8 ⁇ r (5)
  • L1 and r more preferably satisfy the relational expression of L1 ⁇ 0.7 ⁇ r.
  • the length L1 of the first non-conductive region R1 and the length L2 of the second non-conductive region R2 are the transferability to the circuit member and the space between the circuit members at the time of circuit connection. From the viewpoint of excellent fillability, the following formula (6) is preferably satisfied. L1 ⁇ L2 (6)
  • L1 and L2 satisfy the relational expression of L1 ⁇ 0.5 ⁇ L2, more preferably L1 ⁇ 0.4 ⁇ L2, and particularly preferably L1 ⁇ 0.3 ⁇ L2.
  • the length L1 of the first non-conductive region R1, the length L of the conductive region R, the length L2 of the second non-conductive region R2, and the average particle size r of the conductive particles 5 are as described above. The relationship is preferably satisfied, and the specific length or average particle size thereof is not particularly limited.
  • the length L1 of the first non-conductive region R1 may be, for example, 0.5 ⁇ m or more, or 1 ⁇ m or more, for example, 2.5 ⁇ m or less, or 2 ⁇ m or less.
  • the length L of the conductive region R may be, for example, 1.5 ⁇ m or more, or 2 ⁇ m or more, for example, 4 ⁇ m or less, or 3.5 ⁇ m or less.
  • the length L2 of the second non-conductive region R2 may be, for example, 5 ⁇ m or more, or 7 ⁇ m or more, for example, 10 ⁇ m or less, or 9 ⁇ m or less.
  • the adhesive film 11 may further include a region where the conductive particles are present or a region where the conductive particles are not present on the side opposite to the conductive region R of the first non-conductive region R1.
  • the adhesive films 1 and 11 according to the first and second embodiments described above include, for example, the first non-conductive adhesive layer 2, the conductive adhesive layer 3 containing the conductive particles 5, and the second The non-conductive adhesive layer 4 is laminated in this order.
  • the first non-conductive adhesive layer 2 and the conductive adhesive layer 3 are laminated using a laminator or the like to obtain a laminated body, and then, in the same manner,
  • the adhesive films 1 and 11 can be obtained by further laminating the second non-conductive adhesive layer 4 on the conductive adhesive layer 3 side of the body.
  • the conductive adhesive layer 3 and the second non-conductive adhesive layer 4 are first laminated using a laminator or the like to obtain a laminated body, and then the conductive adhesive of the laminated body is similarly obtained.
  • the adhesive films 1 and 11 can also be obtained by further laminating the first non-conductive adhesive layer 2 on the agent layer 3 side.
  • Each layer of the first non-conductive adhesive layer 2, the conductive adhesive layer 3, and the second non-conductive adhesive layer 4 is produced by the following method, for example.
  • the coating liquid is applied onto, for example, the surface of the base material that has been subjected to the release treatment, and is, for example, below the activation temperature of the curing agent contained in the adhesive components 2a, 3a, 4a (eg, 100 ° C. or less).
  • Each layer is obtained by drying and removing the solvent.
  • the solvent may be an aromatic hydrocarbon solvent, an oxygen-containing solvent, or the like.
  • the boiling point of the solvent may be 150 ° C. or less, and may be 60 to 150 ° C. or 70 to 130 ° C.
  • the thickness T1 of the first nonconductive adhesive layer 2 used in this manufacturing method the thickness T of the conductive adhesive layer 3, the thickness T2 of the second nonconductive adhesive layer 4, and the conductive particles 5 It is preferable that the average particle diameter r satisfies the relationships such as the formulas (1), (2), and (3) described in the first embodiment.
  • FIG. 3 is a perspective view showing an embodiment of an adhesive film reel.
  • the adhesive film reel 21 includes a cylindrical core 22 and disk-shaped side plates 23 provided on both end surfaces of the core 22 in the axial direction.
  • a long adhesive tape 24 is wound around the outer surface 22 a of the core 22, whereby the adhesive tape 24 is wound.
  • the adhesive tape 24 includes a tape-like base material 25 and an adhesive film 26 provided on one surface of the base material 25.
  • the inner surface of the winding core 22 is a shaft hole 22b for mounting on the rotating shaft of a crimping device used when connecting a circuit, for example.
  • the outer diameter of the winding core 22 is, for example, 4 to 15 cm from the viewpoint of excellent handleability.
  • FIG. 4 is an enlarged schematic cross-sectional view of the adhesive tape 24 in the adhesive film reel 21 shown in FIG.
  • adhesive tape 24A is 1st implementation as the tape-shaped base material 25 and the adhesive film 26 provided on the one surface of this base material 25 in one Embodiment.
  • the adhesive film 1 which concerns on a form is provided.
  • adhesive tape 24B is 2nd as adhesive film 26 provided on the tape-shaped base material 25 and the one surface of this base material 25 in other embodiment.
  • the adhesive film 11 which concerns on embodiment is provided.
  • the length of the substrate 25 is, for example, 1 to 400 m, preferably 50 to 300 m.
  • the thickness of the substrate 25 is, for example, 4 to 200 ⁇ m, and preferably 20 to 100 ⁇ m.
  • the width of the substrate 25 is preferably the same as the width of the adhesive films 1 and 11 or wider than the width of the adhesive films 1 and 11, specifically 0.5 to 30 mm, for example. Preferably, it is 0.5 to 3.0 mm.
  • the length, thickness, and width of the substrate 25 are not limited to the above ranges.
  • the substrate 25 examples include polyethylene terephthalate, polyethylene naphthalate, polyethylene isophthalate, polybutylene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, ethylene / vinyl acetate copolymer, polyvinyl chloride, and polyvinylidene chloride. It is possible to use a tape-like substrate formed of a synthetic rubber system, a liquid crystal polymer, or the like. The material which comprises the base material 25 is not limited to these. The adhesive surface of the base material 25 with the adhesive film 26 may be subjected to a release treatment.
  • the width of the adhesive film 26 may be adjusted according to the intended use, for example, 0.5 to 5 mm, and preferably 0.5 to 3.0 mm.
  • the first non-conductive adhesive layer 2 or the first non-conductive adhesive layer 2 is formed between the base material 25 of the adhesive tapes 24 ⁇ / b> A and 24 ⁇ / b> B and the conductive adhesive layer 3 or the conductive region R. Since the non-conductive region R1 is provided, when the adhesive film 26 is peeled off from the base material 25 and used for circuit connection, the conductive adhesive layer 3 or the conductive region R is transferred to the base material 25. (Blocking phenomenon) can be suppressed.
  • the adhesive tape 24 is used in the form of the adhesive film reel 21.
  • the adhesive tape 24 is, for example, in the form of a single wafer (preliminarily cut into a desired size and shape). May be used.
  • FIG. 5 is a schematic cross-sectional view showing an embodiment of a method for producing a circuit connector.
  • a first circuit member 33 including a first circuit board 31 and a first circuit electrode 32 formed on the main surface 31 a of the first circuit board 31.
  • the adhesive tape is placed on the first circuit member 33 so that the first circuit electrode 32 of the first circuit member 33 and the second non-conductive adhesive layer 4 of the adhesive tape 24A face each other. 24A is placed.
  • the first circuit member 33 include an FPC board and a COF board. These circuit members generally have a large number of circuit electrodes.
  • the first circuit electrode 32 may be composed of one or more selected from gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum, and indium tin oxide (ITO).
  • the material of the plurality of first circuit electrodes 32 may be the same as or different from each other.
  • the adhesive film reel 21 is mounted on the rotating shaft of the crimping apparatus, and the second non-conductive adhesive layer 4 of the adhesive tape 24A is the first one. After the adhesive tape 24A is pulled out from the adhesive film reel 21 so as to face the first circuit electrode 32 of the first circuit member 33, the adhesive tape 24A is cut into a predetermined length, and the first It may be placed on the circuit member 33.
  • the first circuit member 33 and the adhesive tape 24 ⁇ / b> A are pressurized in the directions of arrows A and B, and the adhesive film 26 is temporarily connected to the first circuit member 33.
  • the pressure at this time is not particularly limited as long as it does not damage the first circuit member 33.
  • it is preferably 0.1 to 30.0 MPa.
  • pressure may be applied while heating.
  • the heating temperature in this case may be a temperature at which the adhesive film 1 is not substantially cured, and is preferably 50 to 100 ° C., for example. Pressurization (and heating) is preferably performed for 0.1 to 2 seconds.
  • a second circuit member including a second circuit board 34 and a second circuit electrode 35 formed on the main surface 34 a of the second circuit board 34. 36 is prepared. And after peeling the base material 25 of adhesive tape 24A from the adhesive film 1, the 1st circuit member 33 and the adhesive film so that the 1st circuit electrode 32 and the 2nd circuit electrode 35 may oppose. 1 is placed on the second circuit member 36.
  • the second circuit member 36 include an LCD module.
  • the second circuit electrode 35 may be composed of one or more selected from gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum, and indium tin oxide (ITO).
  • a plurality of second circuit electrodes 35 may be made of the same material or different materials.
  • the heating temperature at this time may be a temperature at which the adhesive components 2a, 3a, 4a of the adhesive film 1 can be cured, preferably 60 to 180 ° C., more preferably 70 to 170 ° C., still more preferably 80 to 160 ° C.
  • the heating time is preferably 0.1 to 180 seconds, more preferably 0.5 to 180 seconds, and still more preferably 1 to 180 seconds.
  • connection conditions are appropriately selected according to the use of the obtained circuit connection body and the type of adhesive film and circuit member.
  • the actinic rays or energy rays may be appropriately applied to the adhesive film 1 at the time of connection.
  • the active light include ultraviolet light, visible light, and infrared light.
  • energy rays include electron beams, X-rays, ⁇ rays, and microwaves.
  • the adhesive components 2a, 3a, 4a are cured, thereby forming the connection portion 38 containing the cured product 37 of the adhesive components 2a, 3a, 4a and the conductive particles 5, as shown in FIG.
  • a circuit connector 39 as shown in (c) is obtained. That is, the circuit connection body 39 includes a first circuit member 33, a second circuit member 36, and a connection portion 38 provided between the first circuit member 33 and the second circuit member 36. Yes. In the circuit connector 39, the first circuit electrode 32 and the second circuit electrode 35 are electrically connected via the conductive particles 5.
  • the conductive particles 5 are in direct contact with both the first and second circuit electrodes 32 and 35, the connection resistance between the first and second circuit electrodes 32 and 35 is sufficiently reduced, and the first Good electrical connection between the first and second circuit electrodes 32 and 35 becomes possible.
  • cured material 37 has electrical insulation, the insulation of adjacent 1st circuit electrodes 32 and 2nd circuit electrodes 35 is ensured. Therefore, in this circuit connector 39, the flow of electricity between the first and second circuit electrodes 32 and 35 becomes smooth, and the functions of the circuit members 33 and 36 are sufficiently exhibited.
  • the adhesive film 1 is temporarily connected to the first circuit member 33 such as an FPC board or a COF board. Therefore, the second circuit member 36 such as an LCD module is first connected. Compared with the case where the adhesive film 1 is temporarily connected to the adhesive film 1, the amount of the adhesive film 1 used can be minimized, and the manufacturing cost can be reduced. Further, in the method for manufacturing the circuit connector 39, the first and second adhesive films 1 are used because the thickness of the first non-conductive adhesive layer 2 is less than the thickness of the conductive adhesive layer 3. When the circuit members 33 and 36 are connected to each other, the conductive particles 5 are easily captured between the first and second circuit electrodes 32 and 35, and a good electrical connection is possible.
  • the adhesive tape 24A including the adhesive film 1 according to the first embodiment is used as the adhesive tape.
  • the adhesive tape 11 includes the adhesive film 11 according to the second embodiment as an adhesive tape.
  • An agent tape 24B may be used.
  • Example 1 [Synthesis of urethane acrylate] 400 parts by mass of polycaprolactone diol having a weight average molecular weight of 800, 131 parts by mass of 2-hydroxypropyl acrylate, 0.5 parts by mass of dibutyltin dilaurate as a catalyst, and 1.0 part by mass of hydroquinone monomethyl ether as a polymerization inhibitor are stirred. The mixture was heated to 50 ° C. while mixing. Next, 222 parts by mass of isophorone diisocyanate was added dropwise, and the mixture was further heated to 80 ° C. with stirring to conduct a urethanization reaction. After confirming that the reaction rate of the isocyanate group was 99% or more, the reaction temperature was lowered to obtain urethane acrylate.
  • polyester urethane resin Preparation of polyester urethane resin
  • terephthalic acid as the dicarboxylic acid
  • propylene glycol as the diol
  • 4,4′-diphenylmethane diisocyanate as the isocyanate
  • the molar ratio of terephthalic acid / propylene glycol / 4,4′-diphenylmethane diisocyanate was 1.0 / 1.3 / 0.
  • Two types of polyester urethane resins A and B were prepared as .25 or 1.0 / 2.0 / 0.25. Each polyester urethane resin was dissolved in methyl ethyl ketone so as to be 20% by mass.
  • a methyl ethyl ketone solution of each polyester urethane resin was applied to a PET film having a thickness of 80 ⁇ m on one surface using a coating apparatus, and a film having a thickness of 35 ⁇ m was obtained by drying with hot air at 70 ° C. for 10 minutes.
  • the temperature dependence of the elastic modulus was measured at a tensile load of 5 g and a frequency of 10 Hz using a wide area dynamic viscoelasticity measuring apparatus.
  • the glass transition temperature of the polyester urethane resin obtained therefrom was polyester urethane resin A: 105 ° C. and polyester urethane resin B: 70 ° C.
  • first non-conductive adhesive layer As a radical polymerizable substance, 20 parts by mass of the above urethane acrylate, 20 parts by mass of bis (acryloxyethyl) isocyanurate (product name: M-325, manufactured by Toagosei Co., Ltd.), dimethylol tricyclodecane diacrylate (product name: As a free radical generator, 10 parts by mass of DCP-A (manufactured by Kyoeisha Chemical Co., Ltd.) and 1 part by mass of 2-methacryloyloxyethyl acid phosphate (product name: P-2M, produced by Kyoeisha Chemical Co., Ltd.) 3 parts by mass of benzoyl peroxide (product name: Nyper BMT-K, manufactured by NOF Corporation) was used.
  • DCP-A manufactured by Kyoeisha Chemical Co., Ltd.
  • 2-methacryloyloxyethyl acid phosphate product name: P-2M, produced by Kyoeisha Chemical Co.
  • a radical polymerizable substance 25 parts by mass of the urethane acrylate, 15 parts by mass of bis (acryloxyethyl) isocyanurate (product name: M-325, manufactured by Toagosei Co., Ltd.), and 2-methacryloyloxyethyl acid phosphate 1 part by mass (product name: P-2M, manufactured by Kyoeisha Chemical Co., Ltd.) was used, and 3 parts by mass of benzoyl peroxide (product name: Nyper BMT-K40, manufactured by NOF Corporation) was used as a free radical generator.
  • a nickel layer having a thickness of 0.1 ⁇ m is provided on the surface of the polystyrene particles, and a gold layer having a thickness of 0.04 ⁇ m is further provided on the outside of the nickel layer to provide conductive particles having an average particle diameter of 3 ⁇ m (20% compression modulus). (K value): 500 kgf / mm 2 ) was obtained.
  • the conductive particles were dispersed by 3% by volume with respect to the binder resin solution, applied to a PET film having a thickness of 50 ⁇ m on one surface using a coating apparatus, and dried with hot air at 70 ° C. for 10 minutes.
  • Second non-conductive adhesive layer As a radical polymerizable substance, 20 parts by mass of the above urethane acrylate, 20 parts by mass of bis (acryloxyethyl) isocyanurate (product name: M-325, manufactured by Toagosei Co., Ltd.), dimethylol tricyclodecane diacrylate (product name: As a free radical generator, 10 parts by mass of DCP-A (manufactured by Kyoeisha Chemical Co., Ltd.) and 1 part by mass of 2-methacryloyloxyethyl acid phosphate (product name: P-2M, produced by Kyoeisha Chemical Co., Ltd.) 3 parts by mass of benzoyl peroxide (product name: Nyper BMT-K, manufactured by NOF Corporation) was used.
  • DCP-A manufactured by Kyoeisha Chemical Co., Ltd.
  • 2-methacryloyloxyethyl acid phosphate product name: P-2M, produced by Kyoeisha Chemical Co.
  • the obtained laminate PAB and laminate PC were bonded so that the conductive adhesive layer B and the nonconductive adhesive layer C face each other, and a laminator (product name: RISTON, model: HRL, Lamination was performed using DuPont, roll pressure: spring load only, roll temperature: 40 ° C., speed: 50 cm / min).
  • a laminator product name: RISTON, model: HRL, Lamination was performed using DuPont, roll pressure: spring load only, roll temperature: 40 ° C., speed: 50 cm / min.
  • the PET film on the non-conductive adhesive layer C side is peeled off, and the PET film (base material), the non-conductive adhesive layer A, the conductive adhesive layer B, and the non-conductive adhesive layer C are in this order.
  • a laminate PABC width: 15 cm, length: 60 m
  • the end face of the obtained laminate PABC is observed with a scanning electron microscope (SEM), and the length L of the conductive region, the length L1 of the first nonconductive region R1, and the second nonconductive region R2 are observed.
  • the length L2 of each was measured as follows.
  • the shortest distance from the interface is a plane that is in contact with the conductive particles and substantially parallel to the interface between the PET film and the nonconductive adhesive layer A (a line on the SEM image; the same applies hereinafter).
  • the first tangential plane that is a plane existing at a distance and the plane that is in contact with the conductive particles and substantially parallel to the surface on the non-conductive adhesive layer C side of the laminate PABC are present at the shortest distance from the surface.
  • the length was measured as L1.
  • the length was measured as L2.
  • L 3 ⁇ m
  • L1 2 ⁇ m
  • L2 8 ⁇ m.
  • the obtained laminate PABC was cut into a tape having a width of 1.0 mm to form an adhesive tape, and a plastic core (width 1.7 mm) having an inner diameter of 40 mm and an outer diameter of 48 mm with the adhesive film surface facing inward to 50 m. Winding was performed to obtain a reel for an adhesive film.
  • Example 2 In the production of the conductive adhesive layer, a nickel layer having a thickness of 0.2 ⁇ m is provided on the surface of the polystyrene particles, and a gold layer having a thickness of 0.04 ⁇ m is further provided on the outside of the nickel layer.
  • the conductive particles (20% compression elastic modulus (K value): 410 kgf / mm 2 ) were obtained and the thickness of the conductive adhesive layer was 4 ⁇ m.
  • a laminate with an adhesive film (thickness 14 ⁇ m) was obtained.
  • the laminate was cut into a tape having a width of 1.0 mm to form an adhesive tape, and an adhesive film reel was obtained in the same manner as in Example 1.
  • Example 3 The substrate and the adhesive film (thickness 14) were the same as in Example 2 except that the thickness of the first non-conductive adhesive layer was 2.5 ⁇ m and the thickness of the second non-conductive adhesive layer was 8 ⁇ m. 0.5 ⁇ m) was obtained.
  • the laminate was cut into a tape having a width of 1.0 mm to form an adhesive tape, and an adhesive film reel was obtained in the same manner as in Example 1.
  • Example 5 The substrate and the adhesive film (thickness 14) were the same as in Example 1 except that the thickness of the first nonconductive adhesive layer was 2.5 ⁇ m and the thickness of the second nonconductive adhesive layer was 10 ⁇ m. 0.5 ⁇ m) was obtained.
  • the conductive particles were dispersed by 3% by volume with respect to the binder resin solution, applied to a PET film having a thickness of 50 ⁇ m on one surface using a coating apparatus, and dried with hot air at 70 ° C. for 10 minutes.
  • radical polymerizable substance 20 parts by mass of the above urethane acrylate, 20 parts by mass of bis (acryloxyethyl) isocyanurate (product name: M-325, manufactured by Toagosei Co., Ltd.), dimethylol tricyclodecane diacrylate (product name: As a free radical generator, 10 parts by mass of DCP-A (manufactured by Kyoeisha Chemical Co., Ltd.) and 1 part by mass of 2-methacryloyloxyethyl acid phosphate (product name: P-2M, produced by Kyoeisha Chemical Co., Ltd.) 3 parts by mass of benzoyl peroxide (product name: Nyper BMT-K, manufactured by NOF Corporation) was used.
  • DCP-A manufactured by Kyoeisha Chemical Co., Ltd.
  • 2-methacryloyloxyethyl acid phosphate product name: P-2M, produced by Kyoeisha Chemical Co., Ltd.
  • the obtained laminate PB ′ and laminate PC ′ were bonded so that the conductive adhesive layer B ′ and the nonconductive adhesive layer C ′ face each other, and a laminator (product name: RISTON, model: HRL). , Manufactured by Dupont, roll pressure: spring load only, roll temperature: 40 ° C., speed: 50 cm / min).
  • PB′C ′ width 15 cm, length 60 m
  • the obtained laminate is cut into a tape having a width of 1.0 mm to form an adhesive tape, and is 50 m with a plastic core (width 1.7 mm) having an inner diameter of 40 mm and an outer diameter of 48 mm with the adhesive film surface facing inward. Winding was performed to obtain a reel for an adhesive film.
  • a nickel layer having a thickness of 0.2 ⁇ m is provided on the surface of the polystyrene particles, and a gold layer having a thickness of 0.04 ⁇ m is further provided on the outside of the nickel layer.
  • a laminate with an agent film (thickness 16 ⁇ m) was obtained.
  • a glass substrate on which the FPC board is temporarily fixed with an adhesive film is installed in the main pressure bonding apparatus, and a silicone rubber having a thickness of 200 ⁇ m is used as a cushioning material, and is heated and pressed at 170 ° C. and 3 MPa for 5 seconds from the FPC board side by a heat tool.
  • a circuit connection body was obtained by connecting over a width of 1.0 mm of the adhesive film.
  • the adhesive film was temporarily connected to the ITO-coated glass substrate, and then the FPC substrate was temporarily fixed to the adhesive film.
  • the circuit connection body was obtained on the same conditions as said Example and a comparative example.
  • connection resistance About each produced circuit connection body, the resistance value between the adjacent circuits of the FPC board containing a connection part was measured with the multimeter (device name: TR6845, Advantest Co., Ltd. make). The resistance value was obtained as an average value obtained by measuring 30 points of resistance between different adjacent circuits. The evaluation results are shown in Tables 1 and 2.
  • the present invention for example, it can be attached to the FPC board side, the occurrence of blocking can be suppressed, and excellent connection reliability can be obtained when the circuit connector is used for manufacturing. Was confirmed.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)

Abstract

Dans un mode de réalisation, la présente invention concerne un film adhésif (1) qui comprend, superposées dans l'ordre suivant, une première couche adhésive non électroconductrice (2), une couche adhésive électroconductrice (3) contenant des particules électroconductrices (5), et une seconde couche adhésive non électroconductrice (4), l'épaisseur T1 de la première couche adhésive non électroconductrice (2) et l'épaisseur T de la couche adhésive électroconductrice (3) satisfont la relation (1) suivante : T1<T (1).
PCT/JP2017/001366 2016-01-29 2017-01-17 Film adhésif, procédé de production associé, ruban adhésif et bobine pour film adhésif WO2017130789A1 (fr)

Priority Applications (5)

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KR1020187024131A KR20180111858A (ko) 2016-01-29 2017-01-17 접착제 필름 및 그의 제조 방법, 접착제 테이프, 및 접착제 필름용 릴
CN201780008489.9A CN108603078A (zh) 2016-01-29 2017-01-17 粘接剂膜及其制造方法、粘接剂带以及粘接剂膜用卷轴
CN202210037588.2A CN114262577A (zh) 2016-01-29 2017-01-17 粘接剂带及其制造方法、以及粘接剂膜用卷轴
JP2017564179A JP6988482B2 (ja) 2016-01-29 2017-01-17 接着剤フィルム及びその製造方法、接着剤テープ、並びに接着剤フィルム用リール
CN202210037591.4A CN114196334A (zh) 2016-01-29 2017-01-17 粘接剂带及其制造方法、以及粘接剂膜用卷轴

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JP2005200521A (ja) * 2004-01-15 2005-07-28 Sony Chem Corp 接着フィルム、接着フィルムの製造方法
WO2007123003A1 (fr) * 2006-04-12 2007-11-01 Hitachi Chemical Company, Ltd. Pellicule adhésive de connexion de circuit, structure de connexion d'élément de circuit et procédé de connexion d'élément de circuit
JP2009194359A (ja) * 2008-01-16 2009-08-27 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法
JP2010183049A (ja) * 2008-04-28 2010-08-19 Hitachi Chem Co Ltd 回路接続材料、フィルム状接着剤、接着剤リール及び回路接続構造体
JP2015187221A (ja) * 2014-03-26 2015-10-29 デクセリアルズ株式会社 接着フィルム、フィルム巻装体、接続体の製造方法

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JP2011003924A (ja) * 2006-08-25 2011-01-06 Hitachi Chem Co Ltd 回路接続材料、これを用いた回路部材の接続構造及びその製造方法
JP4862944B2 (ja) * 2007-12-17 2012-01-25 日立化成工業株式会社 回路接続材料
CN104403589B (zh) * 2010-03-12 2017-01-11 日立化成株式会社 粘接材料卷轴
KR101659128B1 (ko) * 2013-09-30 2016-09-22 제일모직주식회사 이방성 도전 필름 및 이를 이용한 반도체 장치
KR101628440B1 (ko) * 2013-10-31 2016-06-08 제일모직주식회사 이방성 도전 필름 및 이를 이용한 반도체 장치

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JP2005200521A (ja) * 2004-01-15 2005-07-28 Sony Chem Corp 接着フィルム、接着フィルムの製造方法
WO2007123003A1 (fr) * 2006-04-12 2007-11-01 Hitachi Chemical Company, Ltd. Pellicule adhésive de connexion de circuit, structure de connexion d'élément de circuit et procédé de connexion d'élément de circuit
JP2009194359A (ja) * 2008-01-16 2009-08-27 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法
JP2010183049A (ja) * 2008-04-28 2010-08-19 Hitachi Chem Co Ltd 回路接続材料、フィルム状接着剤、接着剤リール及び回路接続構造体
JP2015187221A (ja) * 2014-03-26 2015-10-29 デクセリアルズ株式会社 接着フィルム、フィルム巻装体、接続体の製造方法

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JPWO2017130789A1 (ja) 2018-11-22
CN108603078A (zh) 2018-09-28
CN114196334A (zh) 2022-03-18
TW201739864A (zh) 2017-11-16
KR20180111858A (ko) 2018-10-11
CN114262577A (zh) 2022-04-01
JP6988482B2 (ja) 2022-01-05

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