WO2007074778A1 - 表面保護フィルム - Google Patents
表面保護フィルム Download PDFInfo
- Publication number
- WO2007074778A1 WO2007074778A1 PCT/JP2006/325793 JP2006325793W WO2007074778A1 WO 2007074778 A1 WO2007074778 A1 WO 2007074778A1 JP 2006325793 W JP2006325793 W JP 2006325793W WO 2007074778 A1 WO2007074778 A1 WO 2007074778A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- surface protective
- condensation reaction
- reaction type
- resin
- contact angle
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/14—Production of collotype printing forms
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
Definitions
- the present invention relates to a surface protective film having releasability, and in particular, surface protection suitably used for the surface of a manuscript (photomask) when exposing an adhesive photoresist in a printed circuit board manufacturing process or the like It relates to film.
- Patent Document 1 a film having a surface protective layer having releasability on one side of a plastic film and an adhesive layer on the other side has been proposed.
- Patent Document 1 a resin having releasability such as a silicone resin is usually used.
- the surface of the surface protection film is periodically tallyed (cleaning operation) with a cleaning solvent in order to remove the photoresist and other dust remaining on the surface protection film.
- Patent Document 2 Patent Document 2
- it is complicated to perform such an operation, and it is desired to reduce the number of times of tiling and eliminate cleaning in order to increase mass productivity.
- Patent Document 1 Japanese Patent Application Laid-Open No. 11-7121 (Claims)
- Patent Document 2 Japanese Patent Laid-Open No. 2003_96409 (Problems to be Solved by the Invention)
- an object of the present invention is to provide a surface protection Finolem that maintains extremely high releasability with respect to a photoresist.
- the present inventors have determined that the contact angle with water in JIS R3257: 1999 is 1 as a releasable component. Consists of a condensation reaction type silicone resin having a degree of 00 degrees or more and a condensation reaction type resin having a contact angle with water of JIS R3 257: 1999 of 90 degrees or less as a binder component. As a result, the present invention has been completed.
- the surface protective film of the present invention is a surface protective film in which a surface protective layer is provided on one surface of a transparent polymer film, and the surface protective layer is a water repellent component according to JIS R3257: 1999 as a releasable component. Characterized in that it is composed of a condensation reaction type resin with a contact angle force with water of 0 degrees or less in JIS R3257: 1999 as a binder component. Is.
- the surface protective film of the present invention is characterized in that it includes a condensation reaction type silicone resin as the condensation reaction type resin having a contact angle with water of 90 degrees or less.
- the surface protective film of the present invention on the other surface of the transparent polymer film Is provided with an adhesive layer.
- the composition for a surface protective layer of the present invention comprises a condensation reaction type silicone resin having a contact angle with water of 100 degrees or more in JIS R3257: 1999, and a contact angle with water in JIS R3257: 1999. It is characterized by containing a condensation reaction type resin having an angle of 90 degrees or less.
- the condensation reaction type resin includes a condensation reaction type silicone resin having a contact angle with water of 90 degrees or less in JIS R3257: 1999.
- the condensation reaction type resin includes, for example, 15 to 70% by weight of the condensation reaction type silicone resin.
- the composition for a surface protective layer of the present invention comprises a condensation reaction type silicone resin having a contact angle with water of 100 ° or more and a condensation reaction type resin having a contact angle with water of 90 ° or less. .
- the composition for a surface protective layer of the present invention was provided directly on the surface of a surface protective film provided with a surface protective layer on a substrate such as a polymer film or on the surface of a material to be surface protected (for example, a photomask). Used to form a surface protective layer.
- the surface protective film of the present invention is a surface protective film in which a surface protective layer is provided on one surface of a transparent polymer film and an adhesive layer is provided on the other surface, and the surface protective layer is the surface protective film of the present invention. It is formed from the layer composition.
- a surface protective layer is provided on one surface of a transparent polymer film and an adhesive layer is provided on the other surface, and the surface protective layer is the surface protective film of the present invention. It is formed from the layer composition.
- the transparent polymer film is good if it has a high transmittance of ultraviolet rays used in exposure.
- Polymer films with excellent transparency such as acrylic and polychlorinated bur are used.
- a biaxially stretched polyethylene terephthalate film can be suitably used because it is excellent in mechanical strength and dimensional stability.
- These transparent polymers A film suitably provided with an easy-adhesion layer or the like is also preferably used.
- the thickness of the transparent polymer film is preferably thinner because it affects the resolution, but considering the handleability, the lower limit of the thickness is lzm or more, preferably 2 zm or more, and more preferably 4 xm or more.
- a desirable upper limit is 100 zm or less, preferably 25 zm or less, and more preferably 12 zm or less.
- the pressure-sensitive adhesive layer provided on the surface opposite to the surface on which the surface protective layer of the transparent polymer film is provided is a commonly used acrylic pressure-sensitive adhesive, rubber-based pressure-sensitive adhesive, urethane-based pressure-sensitive adhesive, or silicone-based.
- a known transparent adhesive such as an adhesive can be used. Since the surface protective film of the present invention is intended to protect images and the like, it is desirable that the pressure-sensitive adhesive is transparent and has high weather resistance.
- an adhesive urethane crosslinkable or epoxy crosslinkable high molecular weight acrylic adhesive is suitable. It is also possible to use an adhesive with performance such as antistatic.
- an adhesive layer may be provided on the surface of the transparent polymer film provided with the antistatic layer.
- the thickness of the pressure-sensitive adhesive layer has a lower limit of 0.5 xm or more, preferably lxm or more, and more preferably 2 ⁇ m so as to obtain appropriate adhesion without inhibiting transparency (resolution).
- the desired upper limit of the above range is 30 / im or less, preferably 15 ⁇ or less, more preferably 7 m or less.
- a release film having a release treatment applied to the surface is appropriately attached to the adhesive layer. be able to.
- the surface protective layer provided on the other surface of the transparent polymer film is composed of a surface protective layer having releasability, and is composed of a releasable component and a binder component.
- the releasable component is a component that imparts high releasability to the photoresist, and is mainly a condensation reaction type silicone resin (hereinafter referred to as a high contact angle) whose contact angle with water in JIS R3257: 1999 is 100 degrees or more. (Also referred to as condensation reaction type resin).
- the binder component is a component that gives high adhesion to a transparent polymer film, and is mainly a condensation reaction type resin (hereinafter referred to as low contact angle condensation) having a contact angle with water of 90 degrees or less in JIS R3257: 1999. Also called a reactive resin).
- low contact angle condensation a condensation reaction type resin having a contact angle with water of 90 degrees or less in JIS R3257: 1999.
- a reactive resin also called a reactive resin.
- the surface protective layer surface has a high concentration of a releasable component having a high releasability. Sex is obtained.
- the region where the releasable component is present at a high concentration and the region where the binder component is present at a high concentration are bonded by the condensation reaction of the resins constituting both components, so that the releasable component is lost. It is possible to maintain releasability.
- the high contact angle condensation reaction type resin which is a releasable component, has poor adhesion to a transparent polymer film and inferior mechanical strength, and has sufficient scratch resistance when contacting a printed circuit board. I can't get it.
- a high contact angle condensation reaction type silicone resin is combined with a resin that is not a condensation reaction type resin as a binder component, or when a low contact angle condensation reaction type resin is used as a release component, a condensation reaction type silicone resin is used. When it is combined with a non-resin, the releasable component and the binder component do not bind, and thus a sustained releasability cannot be obtained.
- the condensation reaction type silicone resin is a silicone resin having a siloxane main chain represented by the following formula (1), and generates a silanol group as a side chain organic functional group R and Z or a terminal group. It has a functional group, that is, a group that hydrolyzes to regenerate a silanol group (Si_OH), further undergoes dehydration condensation to form a siloxane bond between the main chains, and a hydrophobic group.
- the hydrolyzable group include acetoxy group, oxime group, methoxy group, amide group, propenoxy group and the like.
- the hydrophobic group include a phenyl group, an alkyl group, and a fluoroalkyl group.
- the contact angle of the condensation reaction type silicone resin with water can be adjusted. Specifically, the contact angle can be increased as the proportion of the hydrophobic group is increased. Further, the contact angle can be reduced as the proportion of the hydrophobic group is decreased and the hydrolyzable group is increased. [Chemical 1]
- condensation reaction type silicone resin having a high contact angle for example, a resin having a dimethylpolysiloxane as a base polymer and having a phenyl group, an alkyl group, or a fluoroalkyl group at the Z or terminal group may be used.
- a resin having a dimethylpolysiloxane as a base polymer and having a phenyl group, an alkyl group, or a fluoroalkyl group at the Z or terminal group may be used.
- a hydrolyzable group that generates a silanol group for example, an acetoxy group, an oxime group, a methoxy group, an amide group, a propenoxy group, and the like can be used.
- a releasable component other than the above-described condensation reaction type silicone resin can also be added as long as the function of the coating film is not impaired.
- examples of other releasable components include les having no hydrolyzable groups in the side chains or terminal groups, silicone oil (dimethylpolysiloxane), and the like.
- the proportion of the condensation reaction type silicone resin in the release component is preferably 90% or more.
- the low contact angle condensation reaction type resin plays a role as a binder component, and a contact angle with water is 90 degrees or less, preferably 85 degrees or less.
- the contact angle of the condensation reaction type resin with water can be adjusted by appropriately adjusting the ratio of the hydrolyzable group and the hydrophobic group constituting the organic functional group that is the side chain. Is possible.
- a condensation reaction type silicone resin, a condensation reaction type alkyd resin, a condensation reaction type melamine resin, a condensation reaction type acrylic resin, a condensation reaction type polyester resin and the like can be used.
- the condensation reaction type silicone resin is preferably used because it has a good compatibility with the silicone resin as a releasing component in a solution state, for example, having a hydrolyzable group that generates a silanol group. can do.
- the silicone component (silicone resin) in the condensation reaction type resin is preferably contained in an amount of about 70% by weight as the upper limit, preferably 15% by weight or more as the lower limit.
- a resin other than the condensation reaction type resin can be added as a binder component within a range that does not impair the function of the coating film.
- the resin other than the condensation reaction type resin include a thermoplastic acrylic resin and a thermoplastic epoxy resin.
- the ratio of the condensation reaction type resin in all binder components is about 70% by weight or more as the lower limit.
- the condensation-reactive silicone resin as the releasable component has an upper limit of 40 parts by weight or less, more preferably 20 parts by weight or less, and a lower limit of 1 part by weight or more, and further 2 parts per 100 parts by weight of the binder component. Part by weight or more is preferable.
- the lower limit is set to 1 part by weight or more because if it is less than 1 part by weight, it is difficult to obtain a release effect.
- the upper limit is 40 parts by weight or less because if it exceeds 40 parts by weight, it becomes difficult to obtain sufficient mechanical strength and scratch resistance with respect to the solvent contained in the photoresist. This is because the adhesiveness deteriorates, and even if more is added, the release effect is not improved.
- the composition for a surface protective layer of the present invention may contain a catalyst for promoting the condensation reaction with the above-described high contact angle condensation reaction type silicone resin and low contact angle condensation reaction type resin.
- a catalyst for promoting the condensation reaction with the above-described high contact angle condensation reaction type silicone resin and low contact angle condensation reaction type resin.
- known catalysts such as metal fatty acid salts and metal alcoholates can be used. Specifically, tin compounds, zirconium compounds, titanium compounds, and the like are used.
- the surface protective film of the present invention can bind each component by a condensation reaction, the mechanical strength and scratch resistance are improved, and the release of the releasable component from the coating film is reduced, that is, to the printed circuit board. It is possible to reduce the transfer of the mold release component and to improve the mold release sustainability.
- inorganic pigments fine particles such as resin beads, and the like can be added to the surface protective layer in addition to these resins.
- fine particles include inorganic pigments such as calcium carbonate, magnesium carbonate, barium sulfate, silica, aluminum hydroxide, kaolin, clay, talc, acrylic resin particles, polystyrene resin particles, polyurethane resin particles, polyethylene.
- Resin beads such as resin particles, benzoguanamine resin particles, and epoxy resin particles can be used. The amount of such fine particles added is fine Since it differs depending on the type of the child and the thickness of the surface protective layer, it cannot be generally stated, but it is usually about 0.05 to 9.5% by weight in the total solid content constituting the surface protective layer.
- the average particle size of such fine particles varies depending on the thickness of the surface protective layer-it cannot be generally stated, but is usually 0. ⁇ ⁇ ⁇ ! ⁇ 10 zm, preferably 0.5 111 to 5/111 is used.
- the thickness of the surface protective layer is not particularly limited, but is preferably as thin as possible from the viewpoint of not reducing the resolution of the photomask at the time of exposure. Specifically, from the viewpoint of scraping of the surface protective layer by repeating the steps, initial release properties, and sustainability of release properties, 0.2 / 1 111 to 5/1 111, preferably 0.4 / im to 2 . About 5 ⁇ m.
- the surface protective layer and the adhesive layer as described above are prepared by mixing each constituent component and other components as necessary, and dissolving or dispersing in an appropriate solvent to prepare the coating solution. Is applied to the transparent polymer film by a known method such as a roll coating method, a bar coating method, a spray coating method, or an air knife coating method, dried, and then cured using a necessary curing method as appropriate. Can do.
- a surface protective film can be easily formed by adhering to a substrate having a surface protected via an adhesive layer.
- the surface of the surface protective film can be kept hard, it is possible to make it difficult to get a stain, so that extremely high releasability with respect to the photoresist can be maintained.
- the surface protective film generally has an adhesive layer, but the adhesive layer is not essential in the surface protective film of the present invention. Are also included in the present invention.
- Example 1 A surface protective layer coating solution of the following composition was applied to one surface of a 6 ⁇ m thick transparent polymer film (Lumirror: Toray Industries, Inc.) by bar coating and cured by heating at 120 ° C for 5 minutes. A 1 ⁇ m surface protective layer was formed. Furthermore, a coating solution for the pressure-sensitive adhesive layer having the following composition was applied to the other surface and dried to form a pressure-sensitive adhesive layer having a thickness of about 2 zm, thereby producing a surface protective film. A 25 xm thick polyethylene terephthalate release film (MRB: Mitsubishi Chemical Polyester Film Co.) was bonded to the adhesive layer for handling.
- MRB Mitsubishi Chemical Polyester Film Co.
- a surface protective film was produced in the same manner as in Example 1 except that the surface protective layer coating solution of Example 1 was changed to the following surface protective layer coating solution.
- a surface protective film was produced in the same manner as in Example 1 except that the surface protective layer coating solution of Example 1 was changed to the following surface protective layer coating solution.
- a surface protective film was produced in the same manner as in Example 1 except that the surface protective layer coating solution of Example 1 was changed to the following surface protective layer coating solution. [0046] ⁇ Coating liquid for surface protective layer>
- a surface protective film was produced in the same manner as in Example 1 except that the surface protective layer coating solution of Example 1 was changed to the following surface protective layer coating solution.
- Adhesive tape (Nichiban Cello Tape No. 405: Nichiban Co., Ltd.) with a width of 18 mm was applied to the surface having the surface protective layer of the surface protective film of Examples 1 to 3 and Comparative Examples 1 to 2, and a tensile tester (TENSILON HTM-100: Toyo Baldwin), peeling speed 300m The 180 ° peel force at m / min was measured.
- TENSILON HTM-100 Toyo Baldwin
- Ethoxylated bisphenol A diatalylate (A—BPE4: Shin-Nakamura Chemical Co., Ltd.) is used as a photoresist (photosensitive resin), and a phototophenone-based optical radical polymerization initiator (Irgacure 184: Ciba Specialty) is used as the photopolymerization initiator.
- Specimen A was prepared by applying 3% by weight of Techemikanorez Co., Ltd.) onto a polyester film with a bar coater to a coating thickness of 10 ⁇ m.
- the surface having the surface protective layer of the surface protective film of Examples 1 to 3 and Comparative Examples 1 to 2 was rubbed 20 times with a gauze soaked with propylene glycol monomethyl ether while applying a load of 100 gZcm2, The surface having the surface protective layer was observed. No change in the surface protective layer is observed, “ ⁇ ” for objects, scratch marks are observed, but no removal of the surface protective layer is observed, “ ⁇ ” for objects, slight loss of the surface protective layer is observed Was marked “ ⁇ ”, and “X” was marked when the surface protective layer was noticeably removed.
- Example 2 since the surface protective layer was formed of a condensation reaction type silicone resin for both the releasable component and the binder component, initial releasability, releasability by repeated exposure, Scratch resistance, and any evaluation, showed sufficient performance as a surface protective film.
- Example 3 the initial releasability and releasability by repeated exposure were as good as those in the other examples, but the release component was higher than in the other examples. As a result, the abrasion resistance was slightly inferior.
- Comparative Example 1 uses the addition polymerization type silicone resin used in the conventional surface protective film, so that the performance is significantly deteriorated in the evaluation of releasability by repeated exposure. It was.
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- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
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Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2007551961A JP4842281B2 (ja) | 2005-12-26 | 2006-12-25 | 表面保護フィルム |
KR1020087015571A KR101304774B1 (ko) | 2005-12-26 | 2006-12-25 | 표면보호필름 |
CN2006800493962A CN101346665B (zh) | 2005-12-26 | 2006-12-25 | 表面保护薄膜 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2005-371639 | 2005-12-26 | ||
JP2005371639 | 2005-12-26 |
Publications (1)
Publication Number | Publication Date |
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WO2007074778A1 true WO2007074778A1 (ja) | 2007-07-05 |
Family
ID=38217998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/325793 WO2007074778A1 (ja) | 2005-12-26 | 2006-12-25 | 表面保護フィルム |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4842281B2 (ja) |
KR (1) | KR101304774B1 (ja) |
CN (1) | CN101346665B (ja) |
TW (1) | TWI418929B (ja) |
WO (1) | WO2007074778A1 (ja) |
Cited By (5)
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WO2011064859A1 (ja) * | 2009-11-26 | 2011-06-03 | 株式会社 きもと | ガラスマスク用熱硬化型保護液およびガラスマスク |
CN103991263A (zh) * | 2008-06-27 | 2014-08-20 | 屈德加薄膜产品股份有限公司 | 光学基材叠层和多层整体卷材的制造方法 |
KR20160035702A (ko) * | 2014-09-23 | 2016-04-01 | (주)엘지하우시스 | 뉴턴링 방지 필름 및 그 제조방법 |
WO2022044557A1 (ja) * | 2020-08-31 | 2022-03-03 | 富士フイルム株式会社 | フォトマスク、露光方法、樹脂パターンの製造方法及びフォトマスクの製造方法 |
WO2024185776A1 (ja) * | 2023-03-07 | 2024-09-12 | リンテック株式会社 | 剥離シート |
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TWI500588B (zh) * | 2009-12-07 | 2015-09-21 | Kimoto Kk | Protrusion of glass hood with thermal hardening and glass curtain |
CN104145216A (zh) * | 2012-04-19 | 2014-11-12 | 木本股份有限公司 | 玻璃掩模用热固化型保护液及玻璃掩模 |
JP5651259B2 (ja) * | 2013-03-25 | 2015-01-07 | 積水ナノコートテクノロジー株式会社 | 積層フィルム及びそのフィルムロール、並びにそれから得られうる光透過性導電性フィルム及びそれを利用したタッチパネル |
JP5852998B2 (ja) * | 2013-07-29 | 2016-02-09 | 藤森工業株式会社 | 表面保護フィルム、及びそれが貼合された光学部品 |
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CN103991263A (zh) * | 2008-06-27 | 2014-08-20 | 屈德加薄膜产品股份有限公司 | 光学基材叠层和多层整体卷材的制造方法 |
WO2011064859A1 (ja) * | 2009-11-26 | 2011-06-03 | 株式会社 きもと | ガラスマスク用熱硬化型保護液およびガラスマスク |
CN102612665A (zh) * | 2009-11-26 | 2012-07-25 | 木本股份有限公司 | 玻璃掩模用热固化型保护液及玻璃掩模 |
CN102612665B (zh) * | 2009-11-26 | 2014-07-30 | 木本股份有限公司 | 玻璃掩模用热固化型保护液及玻璃掩模 |
KR20160035702A (ko) * | 2014-09-23 | 2016-04-01 | (주)엘지하우시스 | 뉴턴링 방지 필름 및 그 제조방법 |
KR101984535B1 (ko) | 2014-09-23 | 2019-06-03 | (주)엘지하우시스 | 뉴턴링 방지 필름 및 그 제조방법 |
WO2022044557A1 (ja) * | 2020-08-31 | 2022-03-03 | 富士フイルム株式会社 | フォトマスク、露光方法、樹脂パターンの製造方法及びフォトマスクの製造方法 |
WO2024185776A1 (ja) * | 2023-03-07 | 2024-09-12 | リンテック株式会社 | 剥離シート |
Also Published As
Publication number | Publication date |
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JPWO2007074778A1 (ja) | 2009-06-04 |
TWI418929B (zh) | 2013-12-11 |
JP4842281B2 (ja) | 2011-12-21 |
KR20080083647A (ko) | 2008-09-18 |
TW200741333A (en) | 2007-11-01 |
CN101346665A (zh) | 2009-01-14 |
CN101346665B (zh) | 2011-12-21 |
KR101304774B1 (ko) | 2013-09-05 |
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