A7 445289 B7 五、發明說明（1 ) 本發明係有關針對固體表面（被覆體）具有優異之粘 著性同時，貼於固體表面後可輕易由其固體表面剝離之粘 著性薄膜者，更詳細者係用於作成撓性印刷基板時，不會 產生基板之彎曲、或基板面出現皺紋等，甚至不會因基板 之延伸而降低模型之尺寸安定性及基板之裂開等現象，之 撓性印刷基板作成用載體薄膜者。 先行技術上，電器製品愈來愈被強製要求爲小型、輕 薄、輕量化者，爲了製成更輕之印刷基板，因此撓性印刷 基板被廣泛使用之。所謂撓性印刷基板係指基礎薄膜，如 :聚亞胺、聚酯、玻璃、耐熱性樹脂等之薄膜上介著耐熱 性接合劑積層銅箔後作成貼銅積層板，此貼銅積層板之銅 箔層利用記憶裝置作成模型者。 爲使此撓性印刷基板亦更爲小型、輕薄、輕量化而將 基礎薄膜做成2 5 Jtzm以下，總厚度爲6 0 以下者使 用之，惟，基礎薄膜太薄則整體則硬性將降低，回路形成 過程中，易出現皴紋、彎曲、延伸、破裂等現象，而造成 製品收率低減。回路形成過程通常以roll . two . roll之方 式連續進行之，回路形成時之貼銅層積板承受極大壓力。 因此，易產生皺紋、彎曲、延伸及破裂等問題。 爲解決此問題，於①特開平7 — 9 9 3 7 9號及②特 開平8_ 1 8 1 7 1號公報被提出撓性印刷基板作成時’ 使用藉由照射紫外線後降低粘著力之粘著層積層薄膜後之 載體薄膜；將此薄膜之粘著層與基板相互粘貼後’於粘合 此基板與薄膜之基板上形成所定印刷回路後’使紫外線照 <請先閱讀背面之注意事項揭填寫本頁} 裝------ 訂---------線 經濟部智慧財產局員工消费合作社印製 本紙張尺度適用令國國家標準（CNS)A4規格（210 * 297公釐） -4- ^fA45 2 89 A7 B7 t 五、 發明說明（2 ) 射其粘 著 層後降低其粘著力後使載體薄膜剝離之方法者。 此 公 報中•設定照射紫外線前之粘著力爲①時爲 2 0 g f /cm以上，②時做成150- -8 0 0 g / 2 5 m m ，而照射紫外線後之粘著力爲 ①時爲1 0 g f / C m 以 下 ，②時爲5 0 g/2 5mm以 下之粘著層者被 記 載 之 » 惟 ，此粘著層中粘貼載體薄膜與 基板時於粘著層 與 基 板 間 易 卷入空氣，而此空氣層於剝離 載體薄膜時爲遮 掩 所 照 射 之 紫外線，而無法於粘著層均勻 照射紫外線，其 結 果 > 刹 離 薄膜時，粘糊殘留於基板，特 別是空氣層之周 邊 產 生 粘 糊 ，而不易將薄膜剝離。基板上 殘留粘糊則使得 基 板 搬 運 性 受粘糊部阻撓，接下來使用紫 外線之露光工程 中 > 紫 外 線 被遮蓋等之後，無法作成正確 之模型。另外， 因 其 殘 留 粘 糊使得基板之電氣特性降低等 問題——出現， 更 且 作成 製品時，由於粘糊之殘留亦使得極不良之外觀。 本 發 明之主要目的係爲提供一種於 固體表面具優異 之 粘 著 性 ， 且，粘於固體表面後可輕易由 其固體表面剝離 之 粘 著 性 薄 膜者。 本 發 明另一目的係提供具有良好之 粘合性與剝離性 之 印 畫 印刷 基板作成用載體薄膜者。 本 發 明又一目的係提供貼附於貼銅 積層板後於其積 層 板 面 上 形 成回路時，不會於其貼銅積層 板上產生皴紋， 彎 曲 延 伸 及破裂現象，另外，結束回路 形成後，藉由照 射 紫 外 線 後 可簡單剝離之印畫印刷基板作成用載體薄膜者。 本 發 明更有其他目的係由以下所載而簡易被理解者。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -5-A7 445289 B7 V. Explanation of the invention (1) The present invention relates to an adhesive film that has excellent adhesion to a solid surface (cover) and can be easily peeled off from the solid surface after being adhered to the solid surface. More details When it is used to make a flexible printed circuit board, there will be no warping of the substrate, no wrinkles on the substrate surface, and even the dimensional stability of the model and the cracking of the substrate will not be reduced due to the extension of the substrate. A carrier film for a printed circuit board. In the prior art, electrical products are increasingly required to be small, thin, and lightweight. In order to make lighter printed substrates, flexible printed substrates are widely used. The so-called flexible printed circuit board refers to the base film, such as: polyimide, polyester, glass, heat-resistant resin, etc. The copper foil is laminated with a heat-resistant adhesive to form a copper-clad laminated board. The copper foil layer is modeled by a memory device. In order to make the flexible printed circuit board smaller, lighter, and lighter, the base film is made to be less than 25 Jtzm and the total thickness is 60 or less. However, if the base film is too thin, the overall rigidity will be reduced. In the process of forming a loop, it is easy to cause creases, bends, extensions, cracks, etc., resulting in a low yield of the product. The loop forming process is usually carried out continuously in the form of roll. Two. Roll. The copper-clad laminated board is subjected to extreme pressure when the loop is formed. Therefore, problems such as wrinkles, bending, extension, and cracking easily occur. In order to solve this problem, in ① Japanese Patent Application Laid-Open No. 7-9 9 3 7 9 and ② Japanese Patent Application Laid-Open No. 8_ 1 8 1 7 1 when it was proposed that a flexible printed circuit board be made, 'adhesion that reduces the adhesive force after irradiation with ultraviolet rays is used. The carrier film after laminating the film; after the adhesive layer of the film and the substrate are pasted to each other, 'after the predetermined printing circuit is formed on the substrate which adheres the substrate and the film', the ultraviolet light is illuminated < please read the precautions on the back first Fill out this page} Packing ------ Ordering --------- Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Online Economics The paper size applies the national standard (CNS) A4 specification (210 * 297) (Centi) -4- ^ fA45 2 89 A7 B7 t V. Description of the invention (2) Method of peeling the carrier film after spraying its adhesive layer and reducing its adhesive force. In this bulletin, the adhesive force before UV irradiation is set to 20 gf / cm or more when ①, 150--8 0 0 g / 2 5 mm when ②, and 1 when UV light is ①. 0 gf / C m or less, ② at 50 g / 2 5 mm or less Adhesive layer is recorded »However, when a carrier film and a substrate are stuck to this adhesive layer, air is easily drawn between the adhesive layer and the substrate When the air layer is peeled off the carrier film, it is used to mask the ultraviolet rays irradiated, and it is not possible to uniformly irradiate the ultraviolet rays on the adhesive layer. As a result, when the film is disengaged, the sticky residue remains on the substrate, especially the periphery of the air layer is sticky. It is difficult to peel off the film. Residual sticky paste on the substrate makes the substrate's transportability obstructed by the sticky part. Next, after using the ultraviolet light exposure project > After the ultraviolet light is covered, etc., the correct model cannot be made. In addition, due to the residual stickiness, problems such as reduction of the electrical characteristics of the substrate appear. Moreover, when the product is made, the sticky residue also makes the appearance extremely poor. The main purpose of the present invention is to provide an adhesive thin film which has excellent adhesion to a solid surface and can be easily peeled off from the solid surface after being adhered to the solid surface. Another object of the present invention is to provide a carrier film for printing a printed circuit board having excellent adhesion and peelability. Another object of the present invention is to provide a circuit on the surface of a laminated board after being attached to the copper-clad laminated board, which will not cause ridges, bending extensions and cracks on the copper-clad laminated board. In addition, after the formation of the circuit is finished, Those who make carrier films for printing and printing substrates that can be easily peeled off after irradiating ultraviolet rays. The present invention has other purposes which are easily understood by those set forth below. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -5-
I • 4452B9 A7 經濟部智慧財產局貝工消費合作社印製 B7 五、發明說明（3 ) 〔發明開示〕 本發明者爲達成該目的而進行精密硏討結果發現，於 表面上具有粘著層之薄膜中，將其粘著層表面藉由所規定 之某特定物性後，與被覆體（固體表面）之密著性良好， 且貼附時被覆體與薄膜間卷入空氣機會減少。又，粘著此 薄膜之銅張積層板於回路形成過程中於其貼銅積層板不會 出現皺紋、彎曲、延伸、及破裂等，且，回路形成後藉由 照射紫外線後伸張後，可輕易由貼銅積層板剝離，進而完 成本發明。 本發明可提供設定於基板薄膜上至少含有紫外線硬化 型之粘著劑之粘合層之粘著性薄膜中.，該粘合層表面之 JIS Z0237中其board tuck値爲1 〇以下者爲其特 徵之粘合性薄膜者。 又，本發明可提供於基材薄膜上設定至少含紫外線硬 化型粘合劑之粘合層之撓性印刷基板作成用載體薄膜中， 該載體薄膜之粘合層表面之J I S Z0 2 37中board iuck値爲1 〇以下者爲其特徵之撓性印刷基板作成用載體 薄膜。 本發明之粘合性薄膜係於基板薄膜上設定含有紫外線 硬化型粘合劑之粘合層者。 做爲該基材薄膜者係使用透明或半透明之塑料薄膜者 ，如：聚酯樹脂、丙烯樹脂、聚碳酸酯樹脂、聚醚硫樹脂 、聚烯烴樹脂等例，其中又以聚對苯二甲酸乙酯爲較理想 本紙張尺度適用中困國家標準（CNS)A4规格（210 X 297公；« ) -6- (請先閲讀背面之注意ί項為填寫本頁) II _ I ! —訂--I-- 經濟部智慧財產局具工消费合作社印製 N4452Uy A7 _______B7____ 五、發明說明（4 ) 者由耐熱性、剛硬性、加工性及使用面觀之者。本發明所 使用之基材薄膜厚度係依被覆體厚度做適當選擇者，而通 常爲5 0〜2 0 0 ym者，由搬運性及加工性面視之，以 75〜150扛m者宜。 又，以半透明者做爲基材薄膜使用者，務必使用未載 剪者於貼合後剝離時進行紫外線之照射（波長3 0 0 nm 〜3 8 0 n m )者。 本發明粘著性薄膜中，爲提昇基材薄膜與粘合層之密 合性，亦可於基材薄膜與粘合層間設置底漆層。做爲此底 漆層者通常以飽和聚酯樹脂、尿烷樹脂等使用之。此底漆 層之塗佈量一般爲0.5〜20g/m2者，而較理想者爲 0 5〜10g/m2者。當塗佈量小於〇 · 5g/m2時 ，則無法取得密合性佳之底漆層，塗佈量大於2 0 g/m2 時，則成本、作業性均不理想。 又，爲提昇基材薄片與粘合層之密合力，於基材薄片 表面亦可進行活化其表面之處理。此表面活性化處理中， 除鉻酸處理等化學浸蝕處理，電暈處理、等離子處理等之 離子化放射處理之外，包括臭氧層暴露、火災、高壓電擊 等之氧化處理等。 市販有預先於表面進行易接著處理之薄膜者，而本發 明中此薄膜亦可做爲基材薄膜使用者。做爲此薄膜之例者 如：三菱化學聚酯薄膜公司製之T 1 0 0 E、 Duepon公司 製之商標「Merynex」5 4 2等β 本發明粘著性薄膜中|其粘合層係含有紫外線硬化型 本紙張尺度適用中困國家標準（CNS)A4蜆格（210 X 297公釐） d I I n n I n * n n *1 J 1 1· n tj n i n )· · 線- ^ » . (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消费合作社印製 Α7 -__Β7 五、發明說明（5 ) 之粘合劑者’且，於其粘合層照射紫外線前粘著層表面之 j I s Z 〇 2 3 7之board tuck値爲1 ◦以下者。當粘合 層表面之board tuck値超過1 〇則貼附於被覆體時，將使空 氣進入被覆體與薄膜之間，被覆體與薄膜間形成空氣層， 因此’貼粘後剝離薄膜時照射紫外線時此空氣層遮擋紫外 線後，無法均勻使紫外線照射於粘合層，粘糊之殘留，粘 附於空氣層之粘糊使得薄膜無法剝離等問題產生。爲提昇 對於被覆體之殘留粘糊性及薄膜之剝離性，其board tuck値 以6以下者宜。board tuck値之下限一般爲0者。具有 board tuck値爲1〜6之粘合層薄膜其粘著性與剝離性均極 優異者。 該粘著劑之例如：丙烯系粘著劑、橡膠系粘著劑、聚 矽氧粘著劑等。其中由粘合力、耐熱性、透明性等觀之， 又以丙烯系粘著劑爲較理想。此丙烯系粘著劑之例如：丙 烯酸酯、如：丙烯酸甲酯、丙烯酸乙酯、丙烯酸丁酯、丙 烯酸2 —乙基己酯等，甲基丙烯酸酯、如：甲基丙烯酸甲 酯、甲基丙烯酸乙酯、甲基丙烯酸丁酯、甲基丙烯酸2-乙基己酯、丙烯酸、丙烯酸2 —羥乙酯、甲基丙烯酸2 — 羥乙酯等之丙烯系單體、甲基丙烯系單體之1種以上組合 者，必要時，亦組合丙烯酸縮水甘油酯、甲基丙烯酸縮水 甘油酯、異氰酸酯乙基丙烯酸酯、異氰酸酯乙基甲基丙烯 酸酯、2 —（1 一氮雜環丙烯基）乙基丙烯酸酯、2 —( 1-氮雜環丙烯基）乙基甲基丙烯酸酯等之具有自體交聯 性官能基之單體、二丁基苯、丙烯酸乙烯酯、甲基丙烯酸 本紙張尺度適用令國囷家標準<CNS)A4規格（210 X 297公釐） -8- -------- ^----!| -----I I--I - J . <請先閱讀背面之注意Ϋ項兵填寫本頁) 經濟部智慧財產局貝工消f合作社印製 4452S9 a7 _____B7 五、發明說明（6 ) 乙烯酯、丙烯酸烯丙酯、甲基丙烯酸烯丙酯等之多官能性 單體、苯乙烯、丙烯腈、醋酸乙烯酯、丙烯醯胺等之聚合 性碳-碳雙重鍵之單體者。該粘合劑之重量平均分子量爲 50，〇〇 ◦〜1，500，000者宜。當分子量小於 此範圍時，則硬化聚合時，聚合體凝聚變弱，無法取得適 當之粘著力，反之，若超出此範圍時，則粘合劑組成物之 互溶性變差，因此掌控性降低。由理想之粘合力及掌控性 観之，更理想之粘合劑重量平均分子量以5 0，0 0 0〜 1，000，000者佳。 本發明粘著層除含有該（A)粘合劑之外，尙含有（ B)光聚合性之低聚物或單體，（C)硬化劑，（D)光 聚合啓發劑。 做爲（B )成份之低聚物者如：環氧基丙烯酸酯系低 聚物、尿烷丙烯酸酯系低聚物、尿烷甲基丙烯酸酯系低聚 物、環氧基甲基丙烯酸酯系低聚物等例。另外，做爲光聚 合性單體者如：雙酚A二丙烯酸酯、雙酚A二甲基丙烯酸 、雙（丙烯氧乙基）羥基乙基三異聚氰酸酯、雙（甲基丙 烯氧乙基）羥基乙基三異聚氰酸酯、三（丙烯氧乙基）三 異聚氰酸酯、三（甲基丙烯氧乙基）三異聚氰酸酯、雙酚 F二（甲基）丙烯酸酯、二乙二醇二（甲基）丙烯酸酯、 1，6_己二醇二（甲基）丙烯酸酯、季戊二醇二（甲基 )丙烯酸酯、三羥甲基丙烷三（甲基）丙烯酸酯、季戊四 醇三（甲基）丙烯酸酯、季戊四醇四（甲基）丙烯酸酯、 二季戊四醇單羥基五（甲基）丙烯酸酯、二季戊四醇六（ 本紙張尺度適用中國國家標準<CNS)A4規格（210 X 297公釐） -9- — II------·1111111 I J- I I I-- .·· <請先閲讀背面之注意事項我填寫本頁) 445289 A7 _____B7__ 五、發明說明（7 ) (請先閱讀背面之注意事項再填寫本頁) 甲基）丙烯酸酯 '三（甲基丙烯氧乙基）三異聚氰酸酯之 各種變性體，雙酚A二（甲基）丙烯酸酯之各種變性體、 雙酚F二（甲基）丙烯酸酯之各種變性體、三羥甲基丙烷 三（甲基）丙烯酸酯之各種變性體、二季戊四醇六（甲基 )丙烯酸酯之各種變性體等。此等可以1種單獨使用，亦 可2種以上倂用之。 其中，由耐熱性、粘合性提昇面觀之又以環氧基丙烯 酸酯系低聚物與雙酚A二丙烯酸酯之組合者爲較理想者。 此時低聚物與單體之配合比例可藉由所取得粘合層之耐熱 性及初期粘著力做適當選擇。 其中，所記載之（甲基）丙烯酸係指丙烯酸、甲基丙 烯酸或其混合物者。所記載之（甲基）丙烯酸酯係指丙烯 酸酯、甲基丙烯酸酯或其混合物者。 經濟部智慧財產局員工消费合作社印製 本發明（A)成份與（B)成份之配合比例其重量比 爲100 : 5〜9 0之範圍者。當（B)成份比例小於此 範圍則紫外線照射後之粘著層不會有效降低粘著力，（B )成份比例大於此範圍時，則粘著層之初期粘著力降低， 造成粘著性薄膜由被覆體表面剝離。由針對紫外線照射後 充份降低粘著層之粘合力與紫外線照射前被覆體之密合性 面觀之，理想之（A)成份與（B )成份之配合比例爲 1 0 0 : 1 0 〜7 0 者。 該（C )成份係於形成粘著層之加熱乾燥工程中與（ A )成份反應時，扮演調整粘著層之粘著力角色者。此者 之例如：山梨糖醇聚縮水甘油醚、聚甘油聚縮水甘油醚、 本紙張尺度適用中困國家標準（CNS)A4規格（210 X 297公釐） -10- 經濟部智慧財產局員工消费合作社印製 y A7 ______B7 五、發明說明（8 ) 季戊四醇聚縮水甘油醚、二甘油聚縮水甘油醚、甘油聚縮 水甘油醚、季戊二醇二縮水甘油醚、雷索辛二縮水甘油醒 等之環氧基系化合物、四亞甲基二異氰酸酯、六亞甲基二 異氰酸酯'三羥甲基丙烷之甲苯二異氰酸酯3附加物、聚 異氰酸酯等之異氰酸酯系化合物、四羥甲基甲烷三-万一 氮雜環丙烯基丙酸酯、N，Ν’ _二苯基甲烷_4，4， —雙（1—氮雜環丙烷羧基醯胺）、Ν，Ν，—六亞甲基 _1 ，6 —雙（1—氮雜環丙烷羧基醯胺）、Ν，Ν’ -甲苯_2 ’ 4 —雙（1 一氮雜環丙烷）、三羥甲基丙烷一 三一 Θ - (2 -甲基氮雜環丙烷）丙酸酯等之氮雜環丙烯 基系化合物、及六甲氧基羥甲基蜜胺等之蜜胺系化合物例 。其中，由與被覆體之密合性，粘合層之耐熱性、與粘著 劑之反應性面觀之，特別以三羥甲基丙烷之甲苯二異氰酸 酯3附加物爲較理想者。 該（C)成份可1種單獨使用，亦可2種以上混合使 用之。（Α)成份與（C)成份之配合比例爲1 0 0 : 0 . 1〜1 0之範圍者宜。（C )成份小於此範圍則粘合 層中粘合劑成份之交聯密度變小，阻礙粘著層彈性之提昇 ，反之，大於此範圍則粘著層之交聯密度變得太大，而造 成降低初期粘著力之原因。由提升粘著層彈性及初期粘合 力之面觀之，（Α)成份與（C)成份之配合比例爲 100 : 0 . 5〜10之範圍者佳。 做爲可含於本發明粘著層之該（D )成份者如：苯偶 因、苯偶因甲醚、苯偶因乙醚、苯偶因丙醚、苯偶因丁醚 ------------裝----! f I 訂--J*------線 一 * · <請先M讀背面之注意事項Wf填寫本頁) 本紙張尺度適用ΐ國囡家標準（CNS)A4規格（210x297公« > -11 - A7 4452 8 9 B7 五、發明說明（9 ) 、苯甲基二甲基縮酮等之苯偶因系者，1一羥基環己苯酮 、2 -甲基—1〔4 —(甲基硫代）苯基〕_2_ monofolinopropan — 1、二乙氧基苯乙酮、4 — ( 2 ~ 經基 乙氧基）苯基（2_羥基一 2丙基）酮、2 —羥基一 2_ 甲基一 1—苯基丙烷一 1—酮等之苯乙酮系者、二苯甲嗣 、羥基二苯甲酮等之二苯甲酮系者、噻噸酮、2_甲基噻 噸酮、2，4 一二乙基噻噸酮、氯噻噸酮、二甲基噻噸酮 、癸基噻噸酮、二乙基噻噸酮等之噻噸酮系、苯甲基、蒽 醌、2 —乙基蒽醌、2 —第3_ 丁基蒽醌、等例。其中又 以苯偶因異丁醚、苯甲基二甲基縮酮等之苯偶因系者藉由 紫外線光聚合性低聚物或單體之原子因聚合反應性、粘著 層之耐熱性等爲較理想者。此等可以1種使用之，亦可2 種以上倂用之。 該（A )成份與（D )成份之配合比例之重量比爲 100 : 0 . 1〜10之範圍者。當（D)成份小於此範 圍則紫外線照射時之硬化速度下降，或紫外線照射後無法 有效降低粘合力，反之，（D)成份大於此範圍時，紫外 線照射無法充份進行連鎖反應，鏈長之分子含於粘著層而 阻礙此者之彈性率之提昇。由紫外線照射後可充份降低粘 著力及提昇粘著層彈性率之面觀之較理想之（A)成份與 (D)成份之配合率爲100:0.5〜10之範圍者。 本發明粘著層係該（A )成份〜（D )成份分別以所 定比例溶解或分散於溶媒後所形成者，於基材薄膜或所期 待之設計基材薄膜之底漆層上依常法將固形份濃度2 0〜 本紙張尺度適用t國國家標準（CNS>A4規格（210x297公；) ------— ml— 1 *-------ιτ---ν----- - •鼇 * ' <請先閱讀背面之注項再填寫本頁) 經濟部智慧財產局貝工消费合作社印製 -12- 44528^ 4 45 2 1、 a? __ B7 五、發明說明（10) (請先閱讀背面之注意事項再填寫本頁) 8 0重量份之塗工液塗佈後乾燥之後可形成之。此時所使 用之溶媒例如：甲苯、二甲苯等之芳香族系烴基溶媒， MEK、MI BK等之酮系溶媒、醋酸乙酯、溶纖劑等之 酯類溶媒等例，當然，粘合劑爲水溶性時，亦可使用水系 溶媒者。 經濟部智慧財產局員1·^費合作杜印驳 該粘著層之形成中，藉由乾燥後，溶媒去除後，粘著 劑分子與硬化劑分子反應後之交聯高分子中，光聚合啓始 劑分子與光聚合性低聚物或單體分子形成均勻分散之固形 物層，而本發明調節其粘著層成份組成，乾燥條件等之後 ，規定其粘著層表面之board tuck値爲1 〇以下者。board tuck値係代表t u c k方法之一，規定於 J I S Z 0 2 3 7。降低board tuck値之方法有①做爲粘 合層之粘著劑者以具有高度玻璃轉移溫度者使用之方法， ②粘合層分子與光聚合性低聚物以非互溶型者使用之方法 ，③藉由配合有機樹脂粒子或無機粒子以及此等混合物於 粘合層後，使粘著層表面之粘著性改質之方法。①之方法 雖可做爲降低board tuck値，主要做爲降低初期粘著力者。 又，③之方法，其粘著劑、光聚合性低聚物之選擇性有困 難。因此，以②之方法較可防止降低初期粘著性之同時可 降低board tuck値者爲較理想之方法。通常，紫外線照射前 其具有可塑作用之光聚合性低聚物於紫外線照射後，光連 鎖聚合、變更爲高分子後’置入粘著劑分子後形成相互貫 入網目狀態，使粘著力降低。惟’粘著劑分子與光聚合性 低聚物互溶性良好時’於紫外線照射前即形成透明粘著層 -13 - 本紙張尺度適用中國困家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局具工消费合作社印製 '4 4 5 2 8 9 A7 __B7_ 五、發明說明（11 ) 。此粘著層之初期粘著力易取得高強度者，惟，紫外線硬 化後相互貫入網目狀態下，粘著劑分子之領域包入不足， 而難以期待有效降低粘著力。因此，該②之方法中，藉由 粘著劑分子與光聚合性低聚物做成非互溶型後於紫外線硬 化後使相互之高分子鏈互相排除，使得粘著劑分子domain 尺寸變小，結果降低粘著力。又，藉由該②之方法所取得 紫外線硬化前粘著層之外觀會呈不透明者，藉由此不透明 度（通常可以污濁値（％)示之），本發明値以10以下 爲基準β 將該（Α)成份〜（D)成份溶解或分散於溶媒之粘 著層形成塗工液中可添加先行技術所慣用之各種添加劑， 如：粘著性附與劑、界面活性劑、潤滑劑、安定劑、著色 劑等。 本發明粘著性薄膜中|其粘著層之厚度爲5〜1 ◦ 0 V m者》小於此範圍時，粘著層太薄則無法充份取得初期 粘著力，大於此範圔則太厚，於紫外線硬化時無法取得均 勻硬化物，因此造成阻擾有效降低其粘著力者。由初期粘 著性及紫外線硬化後有效降低粘著力之面觀之，其粘著層 較理想之厚度爲5〜8 0 //m者。 本發明粘著性薄膜中，其粘著層上以積層脫模性薄片 後再保護其粘著層者宜。使用此薄膜時，剝離此脫模性薄 片後再粘著於被覆體者。此脫模性薄片係防止使用其薄膜 之前，粘著層硬化後無法貼附於被覆體者，除被覆體之外 ，防止貼附於薄膜者。做爲此脫模性薄片者可使用如直接 ------------- ! 1 ! 1 f I 訂 I I----- r h » {請先閱讀背面之注意事項與填窝本頁> 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -14- jf AA528 A7 B7 桷充 五I • 4452B9 A7 Printed by B7, Shellfish Consumer Cooperative, Intellectual Property Bureau, Ministry of Economic Affairs 5. Description of the Invention (3) [Invention Disclosure] The present inventor carried out a precise investigation to achieve the purpose, and found that there was an adhesive layer on the surface. In the film, after the surface of the adhesive layer passes a specified specific physical property, the adhesiveness with the covering body (solid surface) is good, and the chance of being caught in air between the covering body and the film during attachment is reduced. In addition, the copper laminated laminate that adheres to this film will not have wrinkles, bends, extensions, and cracks on the copper laminated laminate during the circuit formation process. After the circuit is formed, it can be easily stretched after being irradiated with ultraviolet rays. The present invention was completed by peeling off the copper-clad laminated board. The present invention can provide an adhesive film provided on an adhesive layer of an adhesive layer containing at least an ultraviolet-curable adhesive on a substrate film. The JIS Z0237 on the surface of the adhesive layer has a board tuck 値 of 10 or less. Features of adhesive film. In addition, the present invention can provide a JIS Z0 2 37 board for a carrier film for forming a flexible printed circuit board having an adhesive layer containing at least an ultraviolet curable adhesive on a base film, and the surface of the adhesive layer of the carrier film. iuck (R) is a carrier film for forming a flexible printed circuit board having a characteristic of 10 or less. The adhesive film of the present invention is an adhesive layer containing a UV-curable adhesive on a substrate film. The substrate film is a transparent or translucent plastic film, such as polyester resin, acrylic resin, polycarbonate resin, polyether sulfide resin, polyolefin resin, etc. Ethyl formate is ideal. This paper size applies the National Standard (CNS) A4 specification (210 X 297 male; «) -6- (Please read the note on the back first to complete this page) II _ I! — Order --I-- Printed N4452Uy A7 by the Intellectual Property Cooperative of the Ministry of Economic Affairs. _______B7____ V. Description of the invention (4) Those who have heat resistance, rigidity, processability, and use. The thickness of the substrate film used in the present invention is appropriately selected according to the thickness of the covering body, and is usually 50 to 200 μm, which is preferably carried by 75 to 150 m from the viewpoint of portability and processability. In addition, if a translucent person is used as the substrate film user, be sure to use an unloaded person who irradiates ultraviolet rays (wavelength 300 nm to 380 nm) when peeling after bonding. In the adhesive film of the present invention, in order to improve the adhesion between the substrate film and the adhesive layer, a primer layer may be provided between the substrate film and the adhesive layer. As the primer layer, saturated polyester resin, urethane resin and the like are usually used. The coating amount of this primer layer is generally from 0.5 to 20 g / m2, and more preferably from 0.5 to 10 g / m2. When the coating amount is less than 0.5 g / m2, a primer layer with good adhesion cannot be obtained, and when the coating amount is more than 20 g / m2, the cost and workability are not satisfactory. In addition, in order to improve the adhesion between the substrate sheet and the adhesive layer, the surface of the substrate sheet may be treated to activate the surface. This surface activation treatment includes, in addition to chemical etching treatments such as chromic acid treatment, ionizing radiation treatments such as corona treatment and plasma treatment, as well as oxidation treatments such as ozone layer exposure, fire, and high-voltage electric shock. Commercially available films can be easily adhered to the surface in advance, and this film can also be used as a substrate film user in the present invention. Examples of such films include: T 1 0 0 E manufactured by Mitsubishi Chemical Polyester Film Co., Ltd., and a trademark "Merynex" 5 4 2 manufactured by Duepon. In the adhesive film of the present invention, the adhesive layer contains Ultraviolet hardening paper size: Applicable to the national standard (CNS) A4 grid (210 X 297 mm) d II nn I n * nn * 1 J 1 1 · n tj nin) · · Line-^ ». (Please Read the notes on the back before filling this page) Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Α7 -__ Β7 V. Adhesives of the invention description (5), and the adhesive layer before the adhesive layer is irradiated with ultraviolet rays The board tuck 値 of j I s Z 〇 2 3 7 is 1 or less. When the board tuck 値 on the surface of the adhesive layer is more than 10, it will be attached to the cover, so that air will enter between the cover and the film, and an air layer will be formed between the cover and the film. At this time, after the air layer blocks ultraviolet rays, the ultraviolet rays cannot be uniformly irradiated on the adhesive layer, and the sticky residue remains. The sticky paste adhered to the air layer makes the film unable to peel off and other problems. In order to improve the residual stickiness of the coating and the peelability of the film, the board tuck 値 should be 6 or less. The lower limit of board tuck 値 is generally 0. An adhesive layer film having a board tuck 値 of 1 to 6 is excellent in both adhesion and peelability. Examples of the adhesive include an acrylic adhesive, a rubber adhesive, and a silicone adhesive. Among them, in terms of adhesion, heat resistance, transparency, etc., acrylic adhesives are more preferred. Examples of the propylene-based adhesive include: acrylates, such as: methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, etc .; methacrylates, such as: methyl methacrylate, methyl Acrylic monomers, methacrylic monomers such as ethyl acrylate, butyl methacrylate, 2-ethylhexyl methacrylate, acrylic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, etc. For one or more combinations, if necessary, glycidyl acrylate, glycidyl methacrylate, isocyanate ethyl acrylate, isocyanate ethyl methacrylate, 2- (1-azacyclopropenyl) ethyl Monomers with self-crosslinking functional groups such as methacrylic acid ester, 2- (1-azacyclopropenyl) ethyl methacrylate, dibutylbenzene, vinyl acrylate, methacrylic acid Applicable to the national standard < CNS) A4 specification (210 X 297 mm) -8- -------- ^ ----! | ----- I I--I-J. < Please read the note on the back first to fill in this page) Printed by the Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 2S9 a7 _____B7 V. Description of the invention (6) Polyfunctional monomers such as vinyl ester, allyl acrylate, allyl methacrylate, etc., polymerizable carbon such as styrene, acrylonitrile, vinyl acetate, acrylamide, etc. -Monomers of carbon double bonds. The weight average molecular weight of the adhesive is preferably 50,000 to 1,500,000. When the molecular weight is less than this range, the polymer aggregation becomes weak during hardening polymerization, and proper adhesion cannot be obtained. On the other hand, when the molecular weight is out of this range, the mutual solubility of the adhesive composition is deteriorated, and therefore the controllability is lowered. From the ideal adhesion and controllability, the weight average molecular weight of the more ideal adhesive is preferably 50,000 to 1,000,000. In addition to the adhesive (A), the adhesive layer of the present invention contains (B) a photopolymerizable oligomer or monomer, (C) a hardener, and (D) a photopolymerization heuristic. As the oligomer of the component (B), such as: epoxy acrylate oligomer, urethane acrylate oligomer, urethane methacrylate oligomer, epoxy methacrylate Examples of oligomers. In addition, as the photopolymerizable monomer, there are bisphenol A diacrylate, bisphenol A dimethacrylic acid, bis (propyleneoxyethyl) hydroxyethyltriisocyanate, and bis (methpropyleneoxy). Ethyl) hydroxyethyltriisocyanate, tris (propyleneoxyethyl) triisocyanate, tris (methacryloxyethyl) triisocyanate, bisphenol F di (methyl) ) Acrylate, diethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, pentaerythylene glycol di (meth) acrylate, trimethylolpropane tri ( Methacrylic acid ester, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (This paper size applies to Chinese national standards < CNS ) A4 specification (210 X 297 mm) -9- — II ------ · 1111111 I J- II I-- .. < Please read the notes on the back first and fill in this page) 445289 A7 _____B7__ V. Description of the invention (7) (Please read the notes on the back before filling in this page) Methacrylate) Tris (methyl Various modifications of propyleneoxyethyl) triisocyanate, various modifications of bisphenol A di (meth) acrylate, various modifications of bisphenol F di (meth) acrylate, trimethylol Various modifications of propane tri (meth) acrylate, various modifications of dipentaerythritol hexa (meth) acrylate, and the like. These can be used alone or in combination of two or more. Among them, a combination of an epoxy acrylate oligomer and a bisphenol A diacrylate, which is improved in terms of heat resistance and adhesion, is preferable. At this time, the mixing ratio of the oligomer to the monomer can be appropriately selected by the heat resistance and initial adhesion of the obtained adhesive layer. The (meth) acrylic acid described herein refers to acrylic acid, methacrylic acid, or a mixture thereof. The term (meth) acrylate means an acrylic acid ester, a methacrylic acid ester, or a mixture thereof. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. The proportion of the component (A) and component (B) in the present invention is in the range of 100: 5 ~ 90. When the proportion of (B) component is less than this range, the adhesive layer after ultraviolet irradiation will not effectively reduce the adhesive force. When the proportion of (B) component is greater than this range, the initial adhesive force of the adhesive layer will be reduced, resulting in the formation of an adhesive film. The cover surface was peeled. From the viewpoint of sufficiently reducing the adhesive force of the adhesive layer after ultraviolet irradiation and the adhesiveness of the coating body before ultraviolet irradiation, it is desirable that the mixing ratio of the component (A) and the component (B) is 1 0 0: 1 0 ~ 7 0 persons. The component (C) is a person who plays a role in adjusting the adhesive force of the adhesive layer when reacting with the component (A) in the heating and drying process for forming the adhesive layer. Examples of this: sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, this paper size applies to the National Standard for Difficulties (CNS) A4 (210 X 297 mm) -10- Consumption by Employees of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the cooperative y A7 ______B7 V. Description of the invention (8) Pentaerythritol polyglycidyl ether, diglycerol polyglycidyl ether, glycerin polyglycidyl ether, pentaerythrylene glycol diglycidyl ether, rasoxine diglycidyl ether, etc. Epoxy-based compounds, tetramethylene diisocyanate, hexamethylene diisocyanate, toluene diisocyanate 3 of trimethylolpropane, isocyanate compounds such as polyisocyanate, tetramethylol methane Azapropenyl propionate, N, N'_diphenylmethane_4,4, —bis (1-azacyclopropanecarboxamide), N, N, —hexamethylene_1,6 —Bis (1-azetidinylcarboxyamidoamine), N, N′-toluene_2 '4 —Bis (1-azacyclopropane), trimethylolpropane-trinity Θ-(2-methyl Azacyclopropane) aziridinyl compounds such as propionate, and six Examples of melamine compounds such as methoxymethylolmelamine. Among them, in terms of adhesion to the coating, heat resistance of the adhesive layer, and reactivity with the adhesive, toluene diisocyanate 3 additive of trimethylolpropane is particularly preferred. The component (C) may be used singly or in combination of two or more kinds. The combination ratio of the component (A) and the component (C) is preferably in the range of 100: 0.1 to 10. (C) If the component is smaller than this range, the crosslinking density of the adhesive component in the adhesive layer becomes smaller, which hinders the improvement of the elasticity of the adhesive layer. On the contrary, if it is larger than this range, the crosslinking density of the adhesive layer becomes too large, and Causes the reduction of initial adhesion. From the perspective of improving the elasticity and initial adhesion of the adhesive layer, it is preferable that the compounding ratio of the component (A) and the component (C) is in the range of 100: 0.5 to 10. As the (D) component that can be contained in the adhesive layer of the present invention, such as: benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin butyl ether ----- ------- Loading ----! F I order --J * ------ line one * < Please read the precautions on the back first and fill in this page)) This paper size is applicableΐ National Standard (CNS) A4 specification (210x297 male «> -11-A7 4452 8 9 B7 V. Description of invention (9), benzyl dimethyl ketal, etc., 1-hydroxyl Cyclohexanone, 2-methyl-1 [4- (methylthio) phenyl] _2_ monofolinopropan — 1, diethoxyacetophenone, 4 — (2-ethoxyethoxy) phenyl ( 2-hydroxy- 2 -propyl) ketone, 2-hydroxy- 2-methyl-1-phenylpropane-1-ketone and other acetophenones, benzophenone, hydroxybenzophenone and other benzoyl Ketones, thioxanthone, 2-methylthioxanthone, 2,4-diethylthioxanthone, chlorothioxanthone, dimethylthioxanthone, decylthioxanthone, diethylthioxanthone Examples of thioxanthone based on ketones, benzyl, anthraquinone, 2-ethylanthraquinone, 2-3-anthraquinone, etc. Among them, benzene Isobutyl ether, benzyl dimethyl ketal, etc. are preferred because of ultraviolet photopolymerizable oligomers or monomer atoms due to polymerization reactivity, heat resistance of the adhesive layer, etc. These can be used alone or in combination of two or more. The weight ratio of the mixing ratio of the (A) component to the (D) component is in the range of 100: 0.1 to 10. When (D) If the composition is smaller than this range, the curing speed will decrease when UV irradiation, or the adhesive force cannot be effectively reduced after UV irradiation. Conversely, when the component is larger than this range, UV irradiation will not be able to fully perform chain reaction, and the chain length molecules are contained in The adhesive layer hinders the increase of the elastic modulus of the adhesive layer. After irradiation with ultraviolet rays, it is possible to sufficiently reduce the adhesive force and increase the elastic modulus of the adhesive layer. The ideal combination ratio of the (A) component and the (D) component is 100: 0.5 to 10. The adhesive layer of the present invention is formed by dissolving or dispersing the (A) component to (D) component in a predetermined proportion in a solvent, in a substrate film or a desired design substrate. The solid content concentration of the film's primer layer is 20 ~ The scale is applicable to the national standard of China (CNS > A4 specification (210x297);) -------- ml— 1 * ------- ιτ --- ν ------• Ao * ' < Please read the note on the back before filling out this page) Printed by Shelley Consumer Cooperatives, Bureau of Intellectual Property, Ministry of Economic Affairs-12- 44528 ^ 4 45 2 1. a? __ B7 V. Description of Invention (10) (Please read first Note on the back, please fill in this page again.) 80 parts by weight of the coating liquid can be formed after drying. Examples of the solvents used at this time include aromatic hydrocarbon solvents such as toluene and xylene, ketone solvents such as MEK and MI BK, and ester solvents such as ethyl acetate and cellosolve. Of course, adhesives When it is water-soluble, an aqueous solvent may be used. Member of the Intellectual Property Bureau of the Ministry of Economic Affairs, Du Fei cooperated with Du Yin to refute the formation of the adhesive layer. After drying, after the solvent was removed, the adhesive molecules reacted with the hardener molecules in the crosslinked polymer. The initiator molecules and the photopolymerizable oligomers or monomer molecules form a uniformly dispersed solid layer. After adjusting the composition of the adhesive layer, the drying conditions, etc., the board tuck on the surface of the adhesive layer is specified as 1. 〇 The following. Board tuck 値 represents one of the t u c k methods and is specified in J I S Z 0 2 3 7. There are two methods to reduce board tuck 値: ① used as the adhesive of the adhesive layer with a high glass transition temperature; ② used the non-miscible type of the molecules of the adhesive layer and the photopolymerizable oligomer, ③ The method of improving the adhesiveness on the surface of the adhesive layer by blending organic resin particles or inorganic particles and these mixtures in the adhesive layer. ① Method Although it can be used to reduce board tuck 値, it is mainly used to reduce the initial adhesion. In the method of (3), the selectivity of the adhesive and the photopolymerizable oligomer is difficult. Therefore, the method of ② is more ideal to prevent the decrease of initial tack and reduce the board tuck 値. Generally, the photopolymerizable oligomer having a plasticizing effect before ultraviolet irradiation is subjected to photo-interlocking polymerization after being irradiated with ultraviolet rays, and is changed to a macromolecule, and the adhesive molecules are formed to form a state of interpenetrating the mesh to reduce the adhesive force. However, 'when the adhesive molecules and the photopolymerizable oligomer have good mutual solubility', a transparent adhesive layer is formed before UV irradiation-13-This paper size is applicable to the Chinese Standard (CNS) A4 (210 X 297 mm) ) Printed '4 4 5 2 8 9 A7 __B7_ by the Intellectual Property Cooperative of the Bureau of Intellectual Property of the Ministry of Economic Affairs 5. Description of Invention (11). This adhesive layer is easy to obtain high strength in the initial adhesive force. However, when ultraviolet rays are hardened and penetrate into the mesh state, the area of the adhesive molecule is insufficiently enclosed, and it is difficult to expect effective reduction of the adhesive force. Therefore, in the method of (2), the adhesive molecule and the photopolymerizable oligomer are made into a non-miscible type, and after curing by ultraviolet rays, mutual polymer chains are mutually excluded, so that the size of the adhesive molecule domain becomes smaller. The result is reduced adhesion. In addition, the appearance of the adhesive layer before ultraviolet curing obtained by the method of ② will be opaque. Based on this opacity (usually indicated by stain (%)), the present invention uses 10 or less as a reference β. The components (A) to (D) can be dissolved or dispersed in the adhesive layer forming solvent of the solvent, and various additives commonly used in the prior art can be added, such as: adhesive adhesion agents, surfactants, lubricants, Stabilizers, colorants, etc. In the adhesive film of the present invention, the thickness of the adhesive layer is 5 to 1 ◦ When the thickness of the 0 V m is less than this range, the initial adhesive force cannot be fully obtained if the adhesive layer is too thin, and it is too thick if it is larger than this range. In the case of ultraviolet curing, it is not possible to obtain a uniform hardened product, so it will cause interference and effectively reduce its adhesion. From the perspective of the initial adhesiveness and the effect of effectively reducing the adhesive force after ultraviolet curing, the thickness of the adhesive layer is preferably 5 to 8 0 // m. In the adhesive film of the present invention, it is preferable to protect the adhesive layer by laminating a release sheet on the adhesive layer. When this film is used, the release sheet is peeled and then adhered to the coating body. This release sheet prevents those who cannot adhere to the cover after the adhesive layer has hardened before using the film, and prevents those who adhere to the film except the cover. For this release sheet, you can use such as direct -------------! 1! 1 f I order I I ----- rh »{Please read the precautions on the back and the This page > This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -14- jf AA528 A7 B7
圖 熱 膜 可 常 銅 9以修正 發坤說明（12) I氏、合成紙、塑料、橡膠等薄片或於表面進行脫模處理 等可被使用之。 面之簡單說明 圖1係做爲被覆體之貼銅積層板1之截面圖者，介著耐 接合層3積層銅箔4於基礎薄膜2者。藉由可取得基礎薄 2之材質及厚度之撓性印刷基板後，進行適當之選擇，通常 使用聚亞胺、聚酯等之薄膜者。該聚亞胺薄膜之厚度通 爲25// m以下、聚酯薄膜之厚度通常爲75 A m以下者。 箔4之厚度通常爲35// m以下者。 圖2係本發明粘著性薄膜（載體薄膜）5之截面圖者，於附 易接合層7之基材薄膜6上設置粘著層8及脫模性薄片9者 0 圖3係於貼銅積層板1貼附載體薄膜5時之截面圖者。 主要元件對照表 1貼銅镡層板、2基礎薄膜、3耐熱接合層、4銅箔、 5粘著性薄膜、6基材薄膜、7易接合層 8粘著層 9脫模性薄片 以本發明粘著性薄片5做爲載體薄膜者係使粘著於做 爲被覆體之貼銅積層板1時，剝離其薄膜5上之脫模性薄 片9 ，將薄膜5之粘著層8貼附於貼銅積層板1之基礎薄 膜2之表面。本發明薄膜於貼附時極少使空氣卷入粘著層 8與基礎薄膜2之間。 / 貼銅積層板與載體薄膜粘著後，將其貼銅積層板供與 回路形成工程。具體而言係藉由記憶體於其積層板之銅箔 上形成模型後，進行曝光、顯像、洗淨後1於銅箔上形成 模型。模型形成後，因無須薄膜，由薄膜之基材薄膜側照 I H <1 I I MB Η* 1· * (請先閱讀背面之>i意事項再填寫本頁) 經濟部智慧財產局員工消费合作社印製 本紙張尺度適用中圈國家標準（CNS)A4規格（210 X 297公釐） -15- 經濟部智慧財產局貝工消费合作社印製 44528 ^ A7 ____B7___ 五、發明說明（13) 射紫外線後，使粘著層硬化後，有效降低粘著力後，將薄 膜之粘著層於貼銅積層板之基礎薄膜之間剝離之。藉此， 作成撓性印刷基板。 本發明粘著性薄膜於被覆體表面具有良好之密合性。 因此，將本發明粘合性薄膜貼於做爲載體薄膜之貼銅積層 板後，供與回路形成工程後，於其銅箔上形成模型時，其 薄膜不會由貼銅積層板剝離。本發明薄膜粘著於貼銅積層 板者因張力強度佳，具有良好運送性，可防止於其貼銅積 層板產生皺紋、彎曲、延伸及破裂之產生。同時，藉由於 貼著層照射紫外線後可充份降低粘著力，因此，不僅可使 貼銅積層板與薄膜不留殘糊之剝離，更於貼附面極少卷入 空氣，照射紫外線後紫外線均勻照射於粘著層，故，粘著 層之硬化均勻，其結果，剝離時不會產生殘留粘糊。 本發明粘著性薄膜除於作成撓性印刷基板時使用載體 薄膜之外，更使用貼著後剝離時所使用各種領域之薄膜者 。本發明之粘著性薄膜適於用於一過性保護聚矽氧晶圓， 其他固體表面之粘著性薄膜者。 實施例 以下藉由實施例更詳細進行本發明之說明|惟，本發 明並非僅限於此。 又1以下所示各物性係藉由以下方法測定者。 (1 ) board tuck 値 依J IS Z0237爲基準，傾斜角30°下，測 ----II------* 1 I i I I I I ^ - II----- <請先閱讀背面之注意Ϋ項ΐ填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） -16- 經濟部智慧財產局貝工消费合作社印製 4452 8 9 a? ____B7_ 五、發明說明（14) 定照射紫外線前薄膜上粘著層表面之board tuck値》 (2 )剝離惟 以厚度爲2 5 之聚亞胺薄膜做爲被覆體使用之， 於80°C，線壓5kg/cm2、搬運速度7 . 5m /分之 條件下，使此聚亞胺薄膜與粘著性薄膜於薄膜粘著層與聚 亞胺薄膜接觸後，以層壓塑料裝置（Somal公司製，A S L -3 2 )進行壓著後，取得粘合薄片。於此粘合薄片上使 用紫外線照射裝置（HI TECH公司製，UV — 5600-3H)，由粘著性薄膜側照射600 m J / c m 2之紫外線量後，使粘著層硬化之。照射後放置 3 0分鐘後，剝離被覆體與薄膜後，藉由目測被覆體表面 殘留之粘糊後，以以下基準進行評定。另外，評定對象薄 片之試料數各爲2 0 0 0片者。 ◎:2000片中，出現殘糊，無法簡易剝離片數爲 0片。 〇：2000片中，出現殘糊，無法輕易剝離片數爲 1〜2片。. X:2000片中，出現殘糊，無法輕易剝離片數爲 3片以上者。 (3 )粘著力 依J I S Z0237爲基準，測定180°剝離力 。測定時，將厚度2 5 jtzm之聚亞胺薄膜於不銹鋼板雙面 貼附膠帶者做爲被覆體使用之。將此被覆體與粘著性薄膜 相互粘著後，測定此粘合薄片之粘著層與聚亞胺薄膜間剝 I ---------I I -HI— — — — ^ · I Ί---II— <請先Μ讀背面之注意事項A填寫本頁) 本紙張尺度適用中國國家標準（CNS>A4規格（210 X 297公釐） -17- A7 B7 4452 8 9 五、發明說明（15) 離時之剝離力。 <請先閱讀背面之注意事項我填寫本頁) 更於上述取得之粘合薄片利用紫外線照射裝置（Η I -TECH公司製、UV— 5600 3 Η )，由薄膜側 照射6 0 0 m J / c m3之紫外線量後，使粘著層硬化。照 射後放置30分鐘以上之後，以JIS Z0237爲基 準測定粘合薄片之粘著層與聚乙醯胺薄膜間剝離時之 1 8 0 °剝離力》 (4 )空氣卷入之程度 於1 20°C，線壓5kg/cm2，搬運速度5 m/m 1 η之條件下，以層壓塑料裝置（Somal公司製， AS L-3 2 )壓著厚度2 5 之聚亞胺薄膜之薄片（ 長2 2 cm，寬1 7 cm)與粘著性薄膜（長2 1 cm， 寬1 5 cm)後，取得粘合薄片。計算所取得粘合薄片之 粘合層與聚亞胺薄膜間卷入氣泡中直徑爲3 mm以上者後 ，求取其總面積，於粘著性薄膜表面求其總面積比例A ( % )。 (5 )污濁値 經濟部智慧財產局員工消费合作社印製 依J I S K7361爲基準，利用濁度計 NDH2000 (日本電色工業公司製）測定粘著層之污 濁値。 實施例1 將1 0 0重量份之丙烯系粘著劑（綜硏化學公司製； SW— 22，固形份43wt%) ，9 · 3重量份之環氧 -18- 本紙張尺度適用中國國家標準（CNS>A4規格（210 X 297公；g ) 4 452 8 9 A7 B7 五、發明說明（16) f锖先閲讀背面之注意事項ΐ填窝本頁) 丙烯酸酯系低聚物（共榮社化學公司製’ EX— 0205 ，固形份7〇wt%) ，8 . 1重量份之雙酚A二丙烯酸 酯（大阪有機公司製：Biscote 5 4 0 )之80wt%甲 苯溶液，2 . 5重量份之三羥甲基丙烷之甲苯二異氰酸酯 3附加物（綜硏化學公司製；L — 45 ’固形份45wt % ) ，2 0重量份之2，2 —二甲氧基一 2 -苯基苯乙 嗣（日本 chibagagi 公司製；Irugacuia 6 5 1 )之 4 0 wt %甲苯溶液，7重量份之做爲粘度調整用溶劑之甲苯 相互混合後，調製成粘著層形成塗工液。 於厚度2 5 /zm之單面易接合處理後之透明聚對苯二 甲酸乙酯薄片（三菱化學聚酯薄膜公司製；DFT — 1 〇 0 EU0 7 )之其易接合處理面上以Apriketa塗佈該 塗工液，再於8 0°C之乾燥器中進行乾燥2分鐘後，形成 厚度1 9/zm之粘合層。於此將脫模性薄片（kaito化學公 司製；Smillease S T_ 8 0 K CM)積層後，作成本發 明之粘著性薄膜。將此薄膜置入遮光性袋內’ 4 0°C下進 行浸蝕4 8小時。此者物性示於表2及表3。 經濟部智慧財產局貝工消费合作社印製 實施例2〜7，比較例1 將各成份以表1所示之配合比例配合後*除調製粘著 層形成塗工液之外，與實施例1同法製成粘著性薄膜。此 者物性示於表2及表3。 表1數字代表重量份’括弧內數字代表固形份量（ w t % )。 -19- 本紙張尺度適用中國國家標準<CNS)A4規格（210 X 297公31 > Λ45289 A7 B7 五、發明說明（17) 表1 經濟部智慧財產局員Η消費合作社印製 實施例 比較例 1 2 3 4 5 1 2 3 丙烯基系粘著 SKDain 100 100 100 100 100 100 100 劑 SW-22 (43) (43) (43) (43) (43) (40) (43) 粘 coponil 23.5 41.1 著 5767 (9.4) (16.4) 層 coponil 100 形 5740 (40) 成 AS-375 10 塗 (4.5) 工 光聚合性 biscote540之 80% 8.1 8.1 16.1 8.1 液 低聚物 甲苯溶液 (5.5) (6.3) (12.9) (6.5) EX-0205 9.3 9.3 (6.5) (6.5) kayarat 12.9 12 DPHA (12.9) Aronix 6.45 M-315 硬化劑 colonate L-45 2.5 2.5 2.9 3.1 2.5 2.5 2.4 2.5 (1.2) (1.2) (1.3) (1.4) (1.2) (1.2) (0.96) (1.2) 光聚合啓始劑 Irugacuia 651 之 2.0 2.0 2.0 2.0 2.0 2.0 6 2.0 40%甲苯溶液 (0.8) (0.8) (0.8) (0.8) (0.8) (0.8) (2.4) (0.B) m 之厚度("m) 19 17 17 17 17 17 17 17 <請先閱讀背面之注意事項再填寫本頁) 裝------ 訂---τ-----線 本紙張尺度適用争國國家標準（CNS)A4規格（210 X 297公ίί ) -20- ;4 452 ^¾) A7 ___B7_ 五、發明說明（18 ) 另外，表1中製品名之內容係如下所述。 (請先閱讀背面之注意事項"填寫本頁) (1 ) S K Dain SW-22C綜硏化學公司 製，固形份43wt%) (2 ) Coaponyl 5767 (日本合成化學工業公司製，固 形份4〇wt%) (3 ) Coaponyl 5740 (曰本合成化學工業公司製，固 形份4 0 w t % ) (4)AS—375 (~方社油脂工業公司製，固形 份 4 5 w t % ) (5 ) Biscote 540 (大阪有機公司製，雙酚A型環氧 丙烯酸酯） (6) EX—0205 (共榮社化學公司製，環氧丙 烯酸酯系低聚物，固形份7 〇w t %) (7) karayadDPHA (日本化藥公司製，二季戊四醇 六丙烯酸酯） (8 ) Aronix M-3 15 (東亞合成公司製，三（丙儲氧 乙基）三異聚氰酸酯） 經濟部智慧財產局員工消费合作社印製 (9) L一45 (綜硏化學公司製，三羥甲基丙烷， 甲苯二異氰酸酯3附加物，固形份4 5w t%) (1 0 ) qrugacuia651 (日本 chibagaigi 公司製，二甲 基苯甲基縮酮） -21 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐〉 ^ A452 8 9 A7 B7 五、發明說明（19) 經濟部智慧財產局員X消费合作杜印製 表2 實施例 1 2 3 4 5 board tuck 値（X/32) 4 4 6 5 5 污濁値（％) 29.5 22.3 23.4 23.1 22.4 剝離性 ◎ ◎ ◎ ◎ ◎ 粘著力 (kgf/25mm) 紫外線照射前 1000 680 440 650 1150 紫外線照射後 7 9 6 8 10 空氣之卷入程度 直徑3mm以上 氣泡之個數 19 15 22 12 10 A(%) 0.8 0.7 0.7 0.4 1.1 表3 比較例 實施例 1 6 7 board tuck 値（X/32) 14 7 8 污濁値（％) 1 1.7 20.3 17.5 剝離性 X 〇 〇 粘著力 (kgf/25mm) 紫外線照射前 1270 210 610 紫外線照射後 6 11 6 空氣之卷入 程度 直徑3mm以上氣 泡之個數 29 40 19 A(%) 2.6 1.7 1.7 ----------^-----— li 訂·--^-1----線 I (請先閲讀背面之注意事項ΐ填窝本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -22- * 445 2 B p A7 _4 4 B ? fi 9_B7 五、發明說明（20) 實施例1〜7所示之本發明粘著性薄膜與比較例1所 示者相較後，紫外線照射後’被覆體與粘著層間剝離時， 於被覆體表面未具殘粘糊，或即使有亦極少》又，本發明 之粘著性薄膜於紫外線照射後，比比較例更輕易由被覆體 使薄膜剝離之《藉此，本發明粘著性薄膜不會受薄膜剝離 後基板之加工工程之不良影響（如：搬運性，模型燒烤等 )。使用本發明粘著性薄膜製成撓性印刷基板時，可取得 無殘糊後電器特性之降低，亦無不良外觀之撓性印刷基板 者。 (請先W讀背面之注意事填寫本頁) 經濟部智慧財產局貝工消费合作社印製 本紙張尺度適用中國國家標準（CNS〉A4規格（210 X 297公* ) -23-Fig. Hot film may often be copper 9 for correction. Fakun explanation (12) Sheets such as I, synthetic paper, plastic, rubber, etc. can be used for surface release treatment. Brief description of the surface FIG. 1 is a cross-sectional view of a copper-clad laminated board 1 as a coating body, and a copper foil 4 is laminated on a base film 2 through a bonding-resistant layer 3. The flexible printed circuit board can be obtained after obtaining the material and thickness of the base sheet 2, and generally, a film such as polyimide or polyester is used. The thickness of the polyimide film is generally 25 // m or less, and the thickness of the polyester film is usually 75 A m or less. The thickness of the foil 4 is usually 35 // m or less. Fig. 2 is a cross-sectional view of the adhesive film (carrier film) 5 of the present invention, and an adhesive layer 8 and a release sheet 9 are provided on a base film 6 with an easy-to-bond layer 7. Fig. 3 is a copper foil. A cross-sectional view of the laminate 1 when the carrier film 5 is attached. Main component comparison table 1 copper-clad laminated board, 2 base film, 3 heat-resistant bonding layer, 4 copper foil, 5 adhesive film, 6 base film, 7 easy-to-bond layer 8 adhesive layer 9 release sheet When the adhesive sheet 5 is invented as a carrier film, when the adhesive sheet 5 is adhered to the copper-clad laminated sheet 1 as a coating body, the release sheet 9 on the film 5 is peeled off, and the adhesive layer 8 of the film 5 is attached. On the surface of the base film 2 of the copper-clad laminated board 1. When the film of the present invention is attached, air is rarely entangled between the adhesive layer 8 and the base film 2. / After the copper-clad laminated board is adhered to the carrier film, the copper-clad laminated board is provided for the circuit formation process. Specifically, a memory is used to form a model on a copper foil of the laminated board, and then exposure, development, and cleaning are performed to form a model on the copper foil. After the model is formed, since the film is not needed, the side of the film's base film is illuminated with IH < 1 II MB Η * 1 · * (Please read the > i notice on the back before filling in this page) Staff Consumption of Intellectual Property Bureau, Ministry of Economic Affairs The paper size printed by the cooperative is applicable to the Central Circle National Standard (CNS) A4 specification (210 X 297 mm). -15- Printed by the Shelling Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 44528 ^ A7 ____B7___ 5. Description of the invention (13) UV radiation After the adhesive layer is hardened, the adhesive force of the film is effectively reduced, and then the adhesive layer of the film is peeled from the base film of the copper-clad laminated board. Thereby, a flexible printed circuit board is produced. The adhesive film of the present invention has good adhesion on the surface of a coating body. Therefore, after the adhesive film of the present invention is applied to a copper-clad laminated board as a carrier film, and after the circuit forming process is performed, when the model is formed on the copper foil, the film is not peeled from the copper-clad laminated board. The film adhered to the copper-clad laminated board of the present invention has good tensile strength and good transportability, and can prevent the occurrence of wrinkles, bending, extension and cracking of the copper-clad laminated board. At the same time, because the adhesive layer can sufficiently reduce the adhesive force after irradiating ultraviolet rays, not only can the copper-clad laminated board and the film be left without peeling off, but also the air is rarely entrapped on the adhesive surface, and the ultraviolet rays are uniform after ultraviolet rays are irradiated. Since the adhesive layer is irradiated, the adhesive layer is hardened uniformly. As a result, no residual sticky paste is generated during peeling. The adhesive film of the present invention uses a carrier film when forming a flexible printed circuit board, and also uses a film in various fields used when peeling after adhesion. The adhesive film of the present invention is suitable for temporarily protecting polysiloxane wafers and other adhesive films on solid surfaces. Examples Hereinafter, the present invention will be described in more detail by way of examples. However, the present invention is not limited to this. Furthermore, each physical property shown below is measured by the following method. (1) Board tuck is based on J IS Z0237, and at an inclination angle of 30 °, measured ---- II ------ * 1 I i IIII ^-II ----- < Please read the back first (Note: Please fill in this page.) This paper size is applicable to China National Standard (CNS) A4 (210 x 297 mm). -16- Printed by Shelley Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 4452 8 9 a? ____B7_ V. Description of the invention (14) Board tuck 値 on the surface of the adhesive layer on the film before the ultraviolet radiation is fixed. (2) The polyimide film with a thickness of 2 5 is used as a coating. It is used at 80 ° C and a linear pressure of 5kg. / cm2, conveying speed of 7.5m / min, the polyimide film and the adhesive film were brought into contact with the polyimide film at the film adhesive layer, and then a plastic device (manufactured by Somal, ASL- 3 2) After pressing, an adhesive sheet is obtained. An ultraviolet irradiation device (UV-5600-3H, manufactured by Hi Tech Co., Ltd.) was used on this adhesive sheet, and the adhesive film was irradiated with an ultraviolet amount of 600 m J / cm 2, and then the adhesive layer was hardened. After being left for 30 minutes after irradiation, the cover and the film were peeled off, and the sticky residue remaining on the surface of the cover was visually inspected, and then evaluated based on the following criteria. In addition, the number of samples to be evaluated is 2,000. :: In 2000 pieces, a residue appeared, and the number of pieces that could not be easily peeled off was 0 pieces. 〇: Among the 2,000 pieces, a residue appears, and the number of pieces that cannot be easily peeled off is 1 to 2. X: In 2000, there are residues, and the number of pieces that cannot be easily peeled off is 3 or more. (3) Adhesive force 180 ° peeling force was measured according to J IS Z0237. During the measurement, a polyimide film with a thickness of 2 5 jtzm was used as a covering body if a tape was attached to both sides of the stainless steel plate. After the covering body and the adhesive film were adhered to each other, the peeling between the adhesive layer of the adhesive sheet and the polyimide film was measured I --------- II -HI— — — — ^ · I Ί --- II— < Please read the notes on the back A to fill in this page) This paper size is applicable to the Chinese national standard (CNS > A4 specification (210 X 297 mm) -17- A7 B7 4452 8 9 V. Description of the invention (15) Peeling force at the time of departure. ≪ Please read the precautions on the back side and fill in this page first. ≫ The adhesive sheet obtained above is using an ultraviolet irradiation device (ΗI-TECH, UV-5600 3 Η) ), After the film side is irradiated with an ultraviolet amount of 600 m J / c m3, the adhesive layer is hardened. After leaving it for 30 minutes or more after irradiation, the peeling force between the adhesive layer of the adhesive sheet and the polyethylene film was measured at 180 ° based on JIS Z0237. (4) The degree of air entrainment was 120 ° C, under the conditions of a linear pressure of 5 kg / cm2 and a conveying speed of 5 m / m 1 η, a sheet of a polyimide film with a thickness of 2 5 is pressed by a laminated plastic device (manufactured by Somal, AS L-3 2) (length 2 2 cm, 17 cm wide) and an adhesive film (21 cm long, 15 cm wide), and then an adhesive sheet was obtained. Calculate the total area of the obtained adhesive sheet after the diameter of 3 mm or more is involved in the bubble between the adhesive layer and the polyimide film, and find the total area ratio A (%) on the surface of the adhesive film. (5) Pollution and contamination Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy Based on J IS K7361, the contamination and contamination of the adhesive layer was measured using a turbidimeter NDH2000 (manufactured by Nippon Denshoku Industries Co., Ltd.). Example 1 100 parts by weight of a propylene-based adhesive (manufactured by Sogo Chemical Co., Ltd .; SW-22, solid content 43% by weight), 9 · 3 parts by weight of epoxy-18- This paper size applies Chinese national standards (CNS > A4 specification (210 X 297 male; g) 4 452 8 9 A7 B7 V. Description of the invention (16) f 锖 Read the precautions on the back firstΐFill this page) Acrylate oligomers (Kyoeisha Chemical company 'EX-0205, solid content 70% by weight), 8.1 parts by weight of 80% by weight toluene solution of bisphenol A diacrylate (manufactured by Osaka Organic Corporation: Biscote 5 40), 2.5 parts by weight Trimethylolpropane Toluene Diisocyanate 3 Additive (manufactured by Sogo Chemical Co., Ltd .; L-45 'solid content 45wt%), 20 parts by weight of 2,2-dimethoxy-2-phenylphenylethyl After mixing 40% of a toluene solution of 嗣 (manufactured by Japan's Chibagagi Corporation; Irugacuia 6 51) with 7 parts by weight of toluene as a solvent for viscosity adjustment, an adhesive layer was formed to form a coating solution. The transparent polyethylene terephthalate sheet (manufactured by Mitsubishi Chemical Polyester Film Co., Ltd .; DFT — 100 EU0 7) with a single-sided easy-bonding thickness of 2 5 / zm is coated with Apriketa. The coating solution was spread and dried in a dryer at 80 ° C. for 2 minutes to form an adhesive layer with a thickness of 19 / zm. Here, a release sheet (manufactured by Kaito Chemical Co., Ltd .; Smallease S T 80 K CM) was laminated to form an adhesive film according to the present invention. This film was etched in a light-shielding bag at 40 ° C for 48 hours. The physical properties are shown in Tables 2 and 3. Examples 2 to 7 are printed by the Shellfish Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Comparative Example 1 After mixing the ingredients in the mixing ratio shown in Table 1, * Except for the preparation of the coating solution for the adhesive layer, it is the same as in Example 1. An adhesive film was made in the same way. The physical properties are shown in Tables 2 and 3. The numbers in Table 1 represent parts by weight. The numbers in parentheses represent the solid content (w t%). -19- This paper size applies the Chinese national standard < CNS) A4 specification (210 X 297 male 31 > Λ45289 A7 B7 V. Description of invention (17) Table 1 Comparative example printed by the member of the Intellectual Property Bureau of the Ministry of Economic Affairs and the Consumer Cooperative 1 2 3 4 5 1 2 3 Acrylic Adhesion SKDain 100 100 100 100 100 100 100 Agent SW-22 (43) (43) (43) (43) (43) (40) (43) Coponil 23.5 41.1 With 5767 (9.4) (16.4) layer coponil 100 shape 5740 (40) into AS-375 10 coating (4.5) 80% of photopolymerizable biscote540 8.1 8.1 16.1 8.1 liquid oligomer toluene solution (5.5) (6.3) ( 12.9) (6.5) EX-0205 9.3 9.3 (6.5) (6.5) kayarat 12.9 12 DPHA (12.9) Aronix 6.45 M-315 hardener colony L-45 2.5 2.5 2.9 3.1 2.5 2.5 2.4 2.5 (1.2) (1.2) (1.3) ) (1.4) (1.2) (1.2) (0.96) (1.2) Photopolymerization initiator Irugacuia 651 2.0 2.0 2.0 2.0 2.0 2.0 6 2.0 40% toluene solution (0.8) (0.8) (0.8) (0.8) (0.8) ) (0.8) (2.4) (0.B) m (" m) 19 17 17 17 17 17 17 17 < Please read the precautions on the back before filling out this page) Loading -------- Ordering --- τ ----- The size of the paper is applicable to the national standard (CNS) A4 (210 X 297 公 ί) -20-; 4 452 ^ ¾) A7 ___B7_ V. Description of the invention (18) In addition, the contents of the product names in Table 1 are as follows. (Please read the precautions on the back first and fill in this page) (1) SK Dain SW-22C manufactured by Ito Chemical Co., Ltd., solid content 43wt%) (2) Coaponyl 5767 (manufactured by Japan Synthetic Chemical Industry Co., Ltd., solid content 4 ％) wt%) (3) Coaponyl 5740 (manufactured by Japan Synthetic Chemical Industry Co., Ltd., solid content of 40 wt%) (4) AS—375 (~ manufactured by Fangshe Oil and Fat Industry Co., Ltd., solid content of 4 5 wt%) (5) Biscote 540 (manufactured by Osaka Organic Co., Ltd., bisphenol A epoxy acrylate) (6) EX — 0205 (manufactured by Kyoeisha Chemical Co., Ltd., epoxy acrylate oligomer, solid content 70% by weight) (7) karayadDPHA (Manufactured by Nippon Kayaku Co., Ltd., dipentaerythritol hexaacrylate) (8) Aronix M-3 15 (manufactured by Toa Kosei Co., Ltd., tris (propyloxyethyl) triisocyanate) Consumer Cooperative of Intellectual Property Bureau, Ministry of Economy Printed (9) L-45 (manufactured by Sogo Chemical Co., trimethylolpropane, toluene diisocyanate 3 additive, solid content 4 5w t%) (1 0) qrugacuia651 (manufactured by Chibagaigi, Japan, dimethylbenzene Methyl ketal) -21-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) ^ A452 8 9 A7 B7 V. Description of the invention (19) Member of the Intellectual Property Bureau of the Ministry of Economic Affairs X Consumption Cooperation Du Print Table 2 Example 1 2 3 4 5 board tuck 値 (X / 32) 4 4 6 5 5 Foul 値 (%) 29.5 22.3 23.4 23.1 22.4 Peelability ◎ ◎ ◎ ◎ ◎ Adhesion (kgf / 25mm) Before UV irradiation 1000 680 440 650 1150 After UV irradiation 7 9 6 8 10 Air entrainment degree Number of bubbles with a diameter of 3mm or more 19 15 22 12 10 A (%) 0.8 0.7 0.7 0.4 1.1 Table 3 Comparative Example Example 1 6 7 board tuck 値 (X / 32) 14 7 8 Foul 値 (%) 1 1.7 20.3 17.5 Peelability X 〇〇Adhesion (kgf / 25mm) Before UV irradiation 1270 210 610 After UV irradiation 6 11 6 Air entrainment degree Number of bubbles with a diameter of 3mm or more 29 40 19 A (%) 2.6 1.7 1.7 ---------- ^ --- --- li order ·-^-1 ---- line I (please read the precautions on the back ΐfill this page first) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -22- * 445 2 B p A7 _4 4 B? Fi 9_B7 V. Description of the invention (20) The adhesive film of the present invention shown in Examples 1 to 7 and Comparative Example 1 In comparison, after the ultraviolet irradiation, when the covering body and the adhesive layer are peeled off, there is no residual stickiness on the surface of the covering body, or there is very little, if any. "The adhesive film of the present invention is compared with For example, it is easier for the film to be peeled off by the covering body. "With this, the adhesive film of the present invention will not be adversely affected by the processing process of the substrate after the film is peeled off (such as transportability, model grilling, etc.). When a flexible printed circuit board is produced by using the adhesive film of the present invention, a flexible printed circuit board with no deterioration in electrical characteristics and no bad appearance can be obtained. (Please read the cautions on the reverse side and fill out this page first) Printed by the Shellfish Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper size applies to Chinese national standards (CNS> A4 specification (210 X 297 male *) -23-