WO2007037365A1 - Module optique - Google Patents

Module optique Download PDF

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Publication number
WO2007037365A1
WO2007037365A1 PCT/JP2006/319450 JP2006319450W WO2007037365A1 WO 2007037365 A1 WO2007037365 A1 WO 2007037365A1 JP 2006319450 W JP2006319450 W JP 2006319450W WO 2007037365 A1 WO2007037365 A1 WO 2007037365A1
Authority
WO
WIPO (PCT)
Prior art keywords
lid
housing
casing
optical module
thin film
Prior art date
Application number
PCT/JP2006/319450
Other languages
English (en)
Japanese (ja)
Inventor
Takaharu Ohyama
Ikuo Ogawa
Akimasa Kaneko
Yoshiyuki Doi
Katsutoshi Takatoi
Yuichi Suzuki
Yuji Akahori
Original Assignee
Nippon Telegraph And Telephone Corporation
Ntt Electronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph And Telephone Corporation, Ntt Electronics Corporation filed Critical Nippon Telegraph And Telephone Corporation
Publication of WO2007037365A1 publication Critical patent/WO2007037365A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/166—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers

Definitions

  • the present invention relates to an optical module in which a plurality of optical elements are sealed.
  • optical elements an optical module incorporating a plurality of light-emitting elements or light-receiving elements (hereinafter referred to as optical elements) is used in an optical transceiver to which wavelength division multiplexing transmission technology is applied.
  • FIG. 1 shows a configuration of a conventional optical module.
  • the optical module 11 includes four light emitting elements or light receiving elements (hereinafter referred to as optical elements) 15 having a light emitting surface or a light receiving surface (hereinafter referred to as a light receiving / emitting surface) 14.
  • the optical module 11 has an optical element 15 sealed by a box-shaped housing 12 and a lid 13 having a sapphire glass force (see, for example, Non-Patent Document 1).
  • the optical element 15 is connected to a metal wiring 17 on the bottom surface of the housing 12 by a bonding wire 16.
  • the metal wiring 17 extends through the housing 12 to the back and side surfaces of the housing 12.
  • a metal thin film is vapor-deposited or plated on the peripheral upper portion 18 where the casing 12 contacts the lid 13 and the outer peripheral portion 19 where the lid 13 contacts the casing 12.
  • a metal solder is used as a bonding agent for bonding the casing 12 and the lid 13.
  • FIG. 2 shows details of the joint between the housing and the lid.
  • the metal thin film 22 formed on the housing 12 and the metal thin film 23 formed on the lid 13 are opposed to each other by the metal solder 21 and the outer dimension of the peripheral edge of the casing 12 is equal to the outer dimension of the lid 13. It is joined by. Since the metal solder 21 is formed only in the gap between the casing 12 and the lid 13, the strength against the impact from the side of the optical module, for example, the impact from the left in FIG. This is because the joint surface may be broken or the metal thin film may be peeled off.
  • An object of the present invention is to provide an optical module that has high airtightness, high long-term reliability, and can simplify the manufacturing process.
  • Non-patent document 1 A. Kaneko, et al, Ultra small and low power consumption 8ch variable optical attenuator multiplexer (V- AWu) using multi-chip PLC integration technol ogy ", Proc. OFC'2005, OTuD3
  • an embodiment of the present invention includes an optical element fixed to a casing, and includes a lid that transmits light coupled to the optical element and the casing.
  • the casing is formed with a metal thin film on a peripheral upper portion in contact with the lid
  • the lid is formed with a metal thin film on an outer peripheral portion and a side surface in contact with the casing.
  • the external dimensions of the housing are smaller than the external dimensions of the periphery of the housing.
  • Another embodiment of the present invention is an optical module including an optical element fixed to a casing, wherein the optical element is sealed by a lid that transmits light coupled to the optical element and the casing.
  • the casing is formed with a metal thin film on an upper peripheral portion and a side surface in contact with the lid
  • the lid is formed with a metal thin film on an outer peripheral portion in contact with the casing
  • the outer dimensions of the lid are the same as those of the casing. It is characterized by being larger than the outer peripheral dimension.
  • FIG. 1 is a perspective view showing a configuration of a conventional optical module.
  • FIG. 2 is an enlarged view showing a joint portion between the housing and the lid.
  • FIG. 3 is an enlarged view showing a joint portion between the housing and the lid of the optical module that is useful for the first embodiment of the present invention.
  • FIG. 4 is a top view showing an optical module that works on the first embodiment of the present invention.
  • Fig. 5 is an enlarged view showing a joint portion between a housing and a lid of an optical module that is useful for the second embodiment of the present invention.
  • Fig. 6 is an enlarged view showing a joint portion between a housing and a lid of an optical module that is useful for the third embodiment of the present invention.
  • FIG. 7 is an enlarged view showing a joint portion between a housing and a lid of an optical module that is useful in the fourth embodiment of the present invention.
  • FIG. 3 shows a joint between the housing and the lid of the optical module that works according to the first embodiment of the present invention
  • FIG. 4 shows a top view of the optical module.
  • the optical module 51 includes an optical element 55 sealed by a box-shaped casing 52 and a lid 53 having a sapphire glass force.
  • As the material of the casing 52 for example, alumina ceramics are used.
  • a metal thin film 62 is deposited or plated on the upper peripheral edge where the casing 52 contacts the lid 53.
  • a metal thin film 63 is also deposited or plated on the outer peripheral portion where the lid 53 is in contact with the housing 52. Furthermore, the metal thin film 63 is also deposited or plated on the side surface of the lid 53.
  • a metal solder 61 is used as a bonding agent for bonding the housing 52 and the lid 53. Since the optical element 55 is hermetically sealed by the casing 52 and the lid 53 with high airtightness and protected from the external environment, the reliability of the optical element 55 can be improved.
  • the outer dimension of the peripheral edge of the casing 52 is 6000 mX 2000 ⁇ m.
  • the outer dimensions of the lid 53 are 200 ⁇ m / J each in length and width compared to the outer dimensions of the periphery of the casing 52. Accordingly, the outer edge of the lid 53 is at the inner edge J of 100 ⁇ m from the outer edge force of the casing 52. Since the thickness of the peripheral edge of the casing 52 is 600 m, the dimension of the portion facing the outer peripheral portion of the lid 53 is 500 / z m. With such a shape, the metal solder 61 forms a fillet from the outer edge of the metal thin film 62 formed on the housing 52 toward the metal thin film 63 formed on the side surface of the lid 13.
  • the fillet of the metal solder 61 is formed on the four sides of the lid 53, it has sufficient strength against an impact from the side of the optical module. Further, the fillets formed on the four sides equalize the stress applied to the side of the lid 53 at the time of reflow. Therefore, due to the self-alignment effect, the relative positions of the casing 52 and the lid 53 in the lateral direction are difficult to shift. This facilitates the alignment of the casing 52 and the lid 53. In addition, since the fillet is formed around the lid 53, it is possible to visually confirm the sealed state of the four sides of the casing 52 and the lid 53, thereby simplifying the airtightness test process. Can do.
  • the thickness of the metal solder 61 is about 50 m, so the outer edge of the lid 53 is 50 m or more from the outer edge of the housing 52. Inside Just be on the side. In order for the metal solder 61 to adhere to the side surface of the lid 53, it is more preferable that the outer edge of the lid 53 is at least 100 m inside the outer edge of the housing 52. If the thickness of the lid 53 is about 200 ⁇ m, the outer edge of the lid 53 does not need to be more than 200 ⁇ m inside the outer edge of the housing 52.
  • the material of the housing is not limited to alumina ceramics, and other ceramics such as silicon carbide, silicon nitride, aluminum nitride, and zircoure may be used. Further, glass such as quartz or sapphire may be used. Further, the bonding agent is not limited to metal solder such as gold tin, gold germanium, and tin lead, and for example, low melting point glass or brazing agent can be used.
  • the material of the lid is not limited to sapphire described above, and for example, quartz glass, borate glass, or the like can be used.
  • FIG. 5 shows a joint portion between the housing and the lid of the optical module that is useful in the second embodiment of the present invention.
  • the difference from the optical module according to the first embodiment resides in the metal thin film 64 deposited or plated on the lid 53.
  • the metal thin film 64 is vapor deposited or plated not only on the outer peripheral portion in contact with the housing 52 but also on the inner side from the side surface of the lid 53 and the peripheral edge of the housing 52.
  • the outer dimensions of the casing 52 and the lid 53 are the same as those in the first embodiment.
  • the metal solder 61 forms a fillet from the outer edge of the metal thin film 62 formed on the casing 52 toward the metal thin film 63 formed on the side surface of the lid 13.
  • the fillet is formed from the inner edge of the metal thin film 62 formed in the casing 52 toward the inside of the metal thin film 64, the bonding strength and the air tightness can be improved.
  • FIG. 6 shows a joint between the housing and the lid of the optical module that works according to the third embodiment of the present invention.
  • the optical element is sealed by a box-shaped casing 72 and a lid 73.
  • a metal thin film 82 is deposited or plated on the upper peripheral edge where the casing 72 is in contact with the lid 73. Further, the metal thin film 82 is deposited or plated on the side surface of the casing 52.
  • a metal thin film 83 is also deposited or plated on the outer periphery where the lid 73 is in contact with the casing 72.
  • a metal solder 81 is used as a bonding agent for bonding the casing 72 and the lid 73.
  • the outer dimension of the peripheral edge of the casing 72 is 6000 mX 2000 ⁇ m.
  • the outer dimensions of the lid 73 are 200 ⁇ m each in length and width compared to the outer dimensions of the periphery of the casing 72! /. Therefore, the outer edge of the lid 73 and the outer edge force of the casing 72 are 100 ⁇ m. Since the thickness of the peripheral edge of the casing 72 is 600 m, the dimension of the portion facing the outer peripheral portion of the lid 73 is 600 m.
  • the metal solder 81 forms a fillet from the outer edge of the metal thin film 83 formed on the lid 73 toward the metal thin film 82 formed on the side surface of the casing 72. .
  • the fillets of the metal solder 81 are formed on the four sides of the lid 73, they have sufficient strength against impact from the side of the optical module. Also, the fillets formed on the four sides equalize the stress applied to the side of the lid 73 at the time of reflow. Therefore, due to the self-alignment effect, the lateral positions of the casing 72 and the lid 73 are difficult to shift. This facilitates the alignment of the casing 72 and the lid 73. Further, since the fillet is formed around the lid 73, the sealing state of the four sides by the casing 72 and the lid 73 can be visually confirmed, and the airtightness test process can be simplified.
  • the thickness of the metal solder 81 is about 50 ⁇ m, so the outer edge of the lid 73 is 50 ⁇ m from the outer edge of the housing 72. It should be on the outside more than m. In order for the metal solder 81 to adhere to the side surface of the housing 72, it is more preferable that the outer edge of the lid 73 is at least 100 m outside the outer edge of the housing 72. If the thickness of the lid 73 is about 200 ⁇ m, the outer edge of the lid 73 does not need to be more than 200 ⁇ m outside the outer edge of the casing 72.
  • FIG. 7 shows a joint portion between the housing and the lid of the optical module that is useful in the fourth embodiment of the present invention.
  • the difference from the optical module according to the third embodiment lies in the metal thin film 84 deposited or plated on the lid 73.
  • the metal thin film 84 is deposited or plated not only on the outer peripheral portion in contact with the housing 72 but also on the inner side from the periphery of the housing 72.
  • the outer dimensions of the casing 72 and the lid 73 are the same as those in the third embodiment.
  • the metal solder 81 forms a fillet from the outer edge of the metal thin film 83 formed on the lid 73 toward the metal thin film 82 formed on the side surface of the housing 72. .
  • the fillet is formed from the inner edge of the metal thin film 82 formed in the casing 72 toward the inside of the metal thin film 84, the bonding strength and the air tightness can be improved.
  • the optical module since the metal solder forms the fillet on the metal thin film, the optical module The air tightness of the yule increases, the long-term reliability increases, the positioning becomes easy, and the manufacturing process can be simplified.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Light Receiving Elements (AREA)
  • Semiconductor Lasers (AREA)
  • Led Device Packages (AREA)

Abstract

L’invention concerne un module optique offrant une excellente étanchéité à l’air et susceptible d’être fabriqué à l’aide d’un procédé simplifié. Le module optique comporte un élément optique fixé à un boîtier (52) et un couvercle (53) rattaché à l’élément optique et laissant passer la lumière. Une couche métallique mince (62) est déposée au niveau de la partie supérieure du bord périphérique du boîtier (52) qui vient au contact du couvercle (53). Une couche métallique mince (63) est également déposée au niveau de la périphérie extérieure et de la face latérale du couvercle (53) qui viennent au contact du boîtier (52). Les dimensions extérieures du couvercle (53) sont inférieures à celles du bord périphérique du boîtier (52).
PCT/JP2006/319450 2005-09-29 2006-09-29 Module optique WO2007037365A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005285065A JP2007096093A (ja) 2005-09-29 2005-09-29 光モジュール
JP2005-285065 2005-09-29

Publications (1)

Publication Number Publication Date
WO2007037365A1 true WO2007037365A1 (fr) 2007-04-05

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PCT/JP2006/319450 WO2007037365A1 (fr) 2005-09-29 2006-09-29 Module optique

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JP (1) JP2007096093A (fr)
WO (1) WO2007037365A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015018872A (ja) * 2013-07-09 2015-01-29 日機装株式会社 窓部材、半導体モジュールおよび窓部材の製造方法
JP2015018873A (ja) * 2013-07-09 2015-01-29 日機装株式会社 半導体モジュール
EP3509114A4 (fr) * 2016-09-01 2020-04-22 Nikkiso Co., Ltd. Dispositif à semi-conducteur optique et procédé de production de dispositif à semi-conducteur optique
JP2020154285A (ja) * 2019-03-18 2020-09-24 センサーズ・アンリミテッド・インコーポレーテッド 光学アセンブリおよび方法
JP2021034612A (ja) * 2019-08-27 2021-03-01 京セラ株式会社 電子部品パッケージおよび電子装置
WO2021070587A1 (fr) * 2019-10-09 2021-04-15 ソニー株式会社 Dispositif électroluminescent

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6140670B2 (ja) * 2014-11-17 2017-05-31 株式会社フジクラ 半導体レーザ装置及びその製造方法
JP7108179B2 (ja) * 2018-05-31 2022-07-28 日亜化学工業株式会社 キャップの製造方法と、発光装置及びその製造方法
WO2023238775A1 (fr) * 2022-06-07 2023-12-14 日本電気硝子株式会社 Élément de fenêtre à transmission de lumière, son procédé de fabrication, prisme et équipement électronique

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02180053A (ja) * 1988-12-30 1990-07-12 Narumi China Corp 半導体パッケージ用リード基板
JPH10189797A (ja) * 1996-12-27 1998-07-21 Sumitomo Kinzoku Electro Device:Kk セラミックリッド及びその製造方法
JP3218483B2 (ja) * 1992-11-27 2001-10-15 日本特殊陶業株式会社 半導体パッケージ用セラミックリッド、及び半導体パッケージの製造方法
JP3359517B2 (ja) * 1996-12-13 2002-12-24 京セラ株式会社 光モジュール
JP2003110036A (ja) * 2001-09-28 2003-04-11 Kinseki Ltd 電子部品の封止構造
JP2005203669A (ja) * 2004-01-19 2005-07-28 Kyocera Corp 電子部品収納用パッケージおよび電子装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02180053A (ja) * 1988-12-30 1990-07-12 Narumi China Corp 半導体パッケージ用リード基板
JP3218483B2 (ja) * 1992-11-27 2001-10-15 日本特殊陶業株式会社 半導体パッケージ用セラミックリッド、及び半導体パッケージの製造方法
JP3359517B2 (ja) * 1996-12-13 2002-12-24 京セラ株式会社 光モジュール
JPH10189797A (ja) * 1996-12-27 1998-07-21 Sumitomo Kinzoku Electro Device:Kk セラミックリッド及びその製造方法
JP2003110036A (ja) * 2001-09-28 2003-04-11 Kinseki Ltd 電子部品の封止構造
JP2005203669A (ja) * 2004-01-19 2005-07-28 Kyocera Corp 電子部品収納用パッケージおよび電子装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015018872A (ja) * 2013-07-09 2015-01-29 日機装株式会社 窓部材、半導体モジュールおよび窓部材の製造方法
JP2015018873A (ja) * 2013-07-09 2015-01-29 日機装株式会社 半導体モジュール
EP3509114A4 (fr) * 2016-09-01 2020-04-22 Nikkiso Co., Ltd. Dispositif à semi-conducteur optique et procédé de production de dispositif à semi-conducteur optique
US10840414B2 (en) 2016-09-01 2020-11-17 Nikkiso Co., Ltd. Optical semiconductor apparatus and method of manufacturing optical semiconductor apparatus
JP2020154285A (ja) * 2019-03-18 2020-09-24 センサーズ・アンリミテッド・インコーポレーテッド 光学アセンブリおよび方法
JP7325315B2 (ja) 2019-03-18 2023-08-14 センサーズ・アンリミテッド・インコーポレーテッド 光学アセンブリおよび方法
JP2021034612A (ja) * 2019-08-27 2021-03-01 京セラ株式会社 電子部品パッケージおよび電子装置
JP7166997B2 (ja) 2019-08-27 2022-11-08 京セラ株式会社 電子部品パッケージおよび電子装置
WO2021070587A1 (fr) * 2019-10-09 2021-04-15 ソニー株式会社 Dispositif électroluminescent

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