WO2021070587A1 - Dispositif électroluminescent - Google Patents

Dispositif électroluminescent Download PDF

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Publication number
WO2021070587A1
WO2021070587A1 PCT/JP2020/035055 JP2020035055W WO2021070587A1 WO 2021070587 A1 WO2021070587 A1 WO 2021070587A1 JP 2020035055 W JP2020035055 W JP 2020035055W WO 2021070587 A1 WO2021070587 A1 WO 2021070587A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
accommodating member
emitting device
emitting element
spacer
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PCT/JP2020/035055
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English (en)
Japanese (ja)
Inventor
久良 本林
享宏 小山
宮原　宏之
秀和 川西
Original Assignee
ソニー株式会社
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Publication of WO2021070587A1 publication Critical patent/WO2021070587A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser

Definitions

  • the present technology relates to a light emitting device having a light emitting element such as a semiconductor laser element.
  • the light emitting element is hermetically sealed in the package by, for example, solder.
  • solder is applied to the inside of the cover member as a technique for preventing the occurrence of a short circuit due to the spread of the solder and improving reliability. It is disclosed that a solder adsorption film to be attached is provided.
  • the first light emitting device includes a light emitting element, a first accommodating member and a second accommodating member accommodating the light emitting element, and a first accommodating member and a second accommodating member. On the joint surface between the first accommodating member and the second accommodating member, at least a part of the solder joint portion for joining the first accommodating member and the second accommodating member is in contact with a plurality of spacers. It is prepared.
  • the second light emitting device includes a light emitting element, a first accommodating member accommodating the light emitting element, a second accommodating member, and a second accommodating member of the first accommodating member.
  • the first accommodating member and the second accommodating member are joined to each other through the metal film, and the end portion on the first accommodating member side and the end portion on the second accommodating member side are made of the first metal, respectively.
  • At least a part of the joint surface between the end of the film and the solder joint existing at or inside the end of the second metal film and the first accommodating member and the second accommodating member is the first. It is provided with a plurality of spacers in contact with the accommodating member and the second accommodating member.
  • the first light emitting device In the first light emitting device according to the embodiment of the present disclosure and the second light emitting device according to the first embodiment, at least a part of the first accommodating member accommodating the light emitting element and the second accommodating member is used. Soldered using a plurality of spacers in contact with both the joint surfaces of the first accommodating member and the second accommodating member. As a result, the distance between the first accommodating member and the second accommodating member at the joint surface is controlled, and solder dripping is prevented.
  • FIG. 1 It is a plan schematic diagram for demonstrating the main part of the light emitting device which concerns on 1st Embodiment of this disclosure. It is a schematic diagram which shows an example of the cross-sectional structure of the main part of the light emitting device in line I (I) shown in FIG. It is a schematic diagram which shows an example of the cross-sectional structure of the main part of the light emitting device in line II-II shown in FIG. It is an exploded perspective view which shows an example of the structure of the light emitting device shown in FIG. It is a plane schematic diagram which shows an example of the structure of the light emitting device shown in FIG. It is an exploded perspective view which shows an example of the structure of the accommodating member shown in FIG.
  • FIG. 3 is a schematic cross-sectional view of a light emitting device for IV-IV rays shown in FIG. It is sectional drawing of the light emitting device in the VV line shown in FIG. It is a schematic diagram explaining an example of the shape of the solder joint part in the light emitting device shown in FIG. It is a schematic diagram explaining another example of the shape of the solder joint part in the light emitting device shown in FIG. It is a schematic diagram explaining another example of the shape of the solder joint part in the light emitting device shown in FIG. It is sectional drawing which explains the solder joining of the cover and the accommodating member of this disclosure.
  • FIG. 3 is a schematic cross-sectional view of a light emitting device for IV-IV rays shown in FIG. It is sectional drawing of the light emitting device in the VV line shown in FIG. It is a schematic diagram explaining an example of the shape of the solder joint part in the light emitting device shown in FIG. It is a schematic diagram explaining another example of the shape of the solder joint
  • FIG. 5 is a schematic cross-sectional view illustrating solder joining between the cover and the accommodating member following FIG. 7A.
  • FIG. 5 is a side schematic view showing an example of a schematic configuration of a light emitting device including the light emitting device shown in FIG. 1. It is an exploded perspective view which shows the typical structure of the light emitting device shown in FIG.
  • FIG. 5 is a perspective view for explaining the connection between the light emitting device shown in FIG. 8 and the terminal portion of the lens holding member. It is sectional drawing explaining the solder bonding of a lid member and a package member as a reference example.
  • FIG. 5 is a schematic cross-sectional view illustrating solder joining between a lid member and a package member following FIG. 11A.
  • FIG. 12A It is a plane schematic diagram for demonstrating the main part of the light emitting device which concerns on the 2nd Embodiment of this disclosure. It is a schematic diagram which shows an example of the cross-sectional structure of the main part of the light emitting device in the VI-VI line shown in FIG. 12A. It is a schematic diagram which shows another example of the arrangement of the spacer in the light emitting device shown in FIG. 12A. It is a schematic diagram which shows another example of the arrangement of the spacer in the light emitting device shown in FIG. 12A. It is a schematic diagram which shows another example of the cross-sectional shape of the spacer shown in FIG. 12A. It is a schematic diagram which shows another example of the cross-sectional shape of the spacer shown in FIG. 12A.
  • FIG. 12A It is a schematic diagram which shows another example of the cross-sectional shape of the spacer shown in FIG. 12A. It is a schematic diagram which shows another example of the cross-sectional shape of the spacer shown in FIG. 12A. It is a top view which shows the other example of the main part of the light emitting device which concerns on 2nd Embodiment of this disclosure. It is a schematic diagram which shows an example of the cross-sectional structure of the main part of the light emitting device in the VII-VII line shown in FIG. 15A. It is sectional drawing for demonstrating the main part of the light emitting device which concerns on modification 1 of this disclosure.
  • FIG. 16A It is a schematic diagram which shows an example of the cross-sectional structure of the main part of the light emitting device in the line VIII-VIII shown in FIG. 16A. It is sectional drawing which shows an example of the structure of the light emitting device which concerns on the modification 2 of this disclosure. It is sectional drawing which shows the other example of the structure of the light emitting device which concerns on the modification 2 of this disclosure. It is sectional drawing which shows the other example of the structure of the light emitting device which concerns on the modification 2 of this disclosure. It is an exploded perspective view which shows an example of the structure of the light emitting device which concerns on the modification 3 of this disclosure. It is a figure which shows an example of the structure of the projection type display device to which the light emitting device shown in FIG. 8 or the like is applied.
  • Deformation example 1 (Example of providing a recess on the cover side) 3-2.
  • Modification 2 (Example using a vertical resonator surface emitting laser) 3-3.
  • Modification 3 (Other examples of display device configuration) 3-4.
  • Modification 4 (Other examples of display device configuration) 4.
  • Application example (example of projection type display device)
  • FIG. 1A is a schematic plan view for explaining a main configuration of a light emitting device (light emitting device 10A) according to the first embodiment of the present disclosure.
  • FIG. 1B schematically shows an example of the cross-sectional configuration of the main part of the light emitting device 10A in the line II shown in FIG. 1A.
  • FIG. 1C schematically shows an example of the cross-sectional configuration of the main part of the light emitting device 10A in the line II-II shown in FIG. 1A.
  • FIG. 2 is an exploded perspective view showing an example of the configuration of the light emitting device 10A shown in FIG. 1A.
  • FIG. 3 shows an example of the planar configuration of the light emitting device 10A shown in FIG. 1A.
  • the light emitting device 10A is a packaged surface mount device (SMD).
  • the light emitting device 10A includes a light emitting element 11, a housing member 14, and a cover 15.
  • the accommodating member 14 has a recess 14C, and the light emitting element 11 is accommodated in the recess 14C.
  • the accommodating member 14 and the cover 15 are joined via a solder joint portion 21, whereby the light emitting element 11 is hermetically sealed.
  • the solder joint portion 21 is formed of solder 22 in which a plurality of spacers 23 are mixed.
  • the accommodating member 14 corresponds to a specific example of the "first accommodating member" of the present disclosure
  • the cover 15 corresponds to a specific example of the "second accommodating member” of the present disclosure.
  • the solder joint portion 21 corresponds to a specific example of the “solder joint portion” of the present disclosure
  • the spacer 23 corresponds to a specific example of the “spacer” of the present disclosure.
  • the light emitting element 11 is housed in the recess 14C of the housing member 14 together with, for example, the submount 12 and the mirror 13.
  • the accommodating member 14 is joined to the cover 15 via a solder joint portion 21, and together with the cover 15, the light emitting element 11, the submount 12, and the mirror 13 are hermetically sealed.
  • a wiring structure for electrically connecting the light emitting element 11 and the outside may be further provided.
  • the solder joint portion 21 is electrically connected to this wiring structure, and together with the wiring structure, constitutes a conductive path that electrically connects the light emitting element 11 and the outside.
  • the light emitting element 11 is composed of, for example, a semiconductor laser element such as an LD (Laser Diode).
  • the light emitting element 11 contains, for example, a gallium nitride (GaN) -based semiconductor material, and emits, for example, blue light in a wavelength band of, for example, 500 nm or less or 470 nm or less.
  • a wavelength conversion member such as a phosphor may be arranged in the optical path of the light emitted from the light emitting element 11.
  • the light emitting element 11 may contain, for example, a semiconductor material such as gallium arsenide (GaAs).
  • One of the anode and the cathode (for example, the anode) of the light emitting element 11 is connected to a wiring structure provided in the accommodating member 14 described later by wire bonding using, for example, a wire W, and is taken out by, for example, an electrode extraction portion 14E2. ..
  • the wire W is made of, for example, gold (Au).
  • One of the anode and the cathode (for example, the cathode) of the light emitting element 11 does not use the wire W when the conductive submount 12 described later is used, for example, via the wiring structure provided in the accommodating member 14. For example, it is taken out by the electrode taking-out part 14E1.
  • the sub-mount 12 is for mounting the light emitting element 11, and is provided between the light emitting element 11 and the bottom surface of the recess 14C of the accommodating member 14.
  • the sub-mount 12 is, for example, a plate-shaped member, and the position of the light emitting element 11 in the Z-axis direction may be adjusted according to the thickness of the sub-mount 12 (the size in the Z direction in FIG. 1).
  • the submount 12 is made of an insulating material such as aluminum nitride (AlN), silicon (Si), silicon carbide (SiC), diamond or beryllium oxide (BeO).
  • the metal pattern (not shown) on the sub-mount 12 is wire-connected to the metal pattern 143M1 or the metal pattern 141M1.
  • the electrode extraction portion 14E1 and the light emitting element 11 are electrically connected (see FIGS. 4 and 5A to 5C).
  • the submount 12 may be configured by using a conductive material such as copper tungsten (Cu-W), copper molybdenum (Cu-Mo), copper diamond and graphite.
  • a conductive material such as copper tungsten (Cu-W), copper molybdenum (Cu-Mo), copper diamond and graphite.
  • the light emitting element 11 is eutectic bonded to the submount 12 by, for example, AuSn (gold-tin), and the submount 12 is eutectic bonded to the bottom surface of the recess 14C of the accommodating member 14 by, for example, AuSn.
  • the submount 12 may be joined to the bottom surface of the recess 14C of the accommodating member 14 with, for example, silver (Ag) paste, sintered gold, sintered silver, or the like.
  • the mirror 13 is for reflecting the light emitted from the light emitting element 11.
  • the light emitted from the light emitting element 11 is reflected by the mirror 13 and emitted from the cover 15 side.
  • the mirror 13 is provided in the recess 14C of the accommodating member 14 together with the light emitting element 11 mounted on the submount 12. For example, a step is provided in the recess 14C, and the mirror 13 is arranged at a position lower than that of the light emitting element 11.
  • the mirror 13 has, for example, an inclined surface, and the inclined surface is arranged so as to face the light emitting surface of the light emitting element 11.
  • the inclined surface of the mirror 13 is inclined by 45 ° with respect to the bottom surface of the accommodating member 14, for example.
  • the light reflected by the inclined surface of the mirror 13 can be taken out in the direction perpendicular to the bottom surface of the accommodating member 14. It is also possible to change the light extraction direction by adjusting the angle of the inclined surface of the mirror 13.
  • the mirror 13 is made of, for example, glass, synthetic quartz, silicon, sapphire, copper, aluminum and the like.
  • a reflective film such as a metal film or a dielectric multilayer film may be provided on the inclined surface of the mirror 13. This reflective film has, for example, a reflectance of 90% or more with respect to the light emitted from the light emitting element 11.
  • the reflective film preferably has a reflectance of 99% or more.
  • FIG. 4 is an exploded perspective view showing an example of the configuration of the accommodating member 14 shown in FIG. 5A-5C schematically show the cross-sectional configuration of the accommodating member 14 in the lines III-III, IV-IV and VV shown in FIG.
  • the accommodating member 14 has a recess 14C for accommodating the light emitting element 11 mounted on the submount 12 and the mirror 13, and seals these together with the cover 15 via the solder joint portion 21. That is, the recess 14C of the accommodating member 14 constitutes an airtight accommodating space S by the cover 15 and the solder joint portion 21.
  • the recess 14C has, for example, a rectangular planar shape.
  • the accommodating member 14 is made of, for example, glass or ceramic, and includes, for example, a sintered body such as aluminum nitride (AlN), aluminum oxide (alumina), or silicon carbide (SiC).
  • the accommodating member 14 is composed of a first layer 141 forming the bottom surface of the recess 14C and a second layer 142 forming the side surface of the recess 14C.
  • the second layer 142 is composed of a bonding layer 144 bonded to the cover and an intermediate layer 143 arranged between the first layer 141 and the bonding layer 144.
  • Metal patterns 141M, 143M, and 144M are formed in the first layer 141 and the second layer 142 (specifically, the intermediate layer 143 and the bonding layer 144), respectively, and are appropriately electrically connected to each other.
  • the metal patterns 141M, 143M, 144M contain, for example, gold (Au) and the like.
  • the first layer 141 constitutes the bottom surface of the recess 14C.
  • the first layer 141 has, for example, a plate-shaped member having a rectangular planar shape, and has an upper surface 141S1 and a lower surface 141S2 facing each other.
  • the upper surface 141S1 constitutes a part of the lower surface of the recess 14C
  • the lower surface 141S2 constitutes the back surface 14S2 of the accommodating member 14.
  • a metal pattern 141M1 is provided on the upper surface 141S1.
  • the metal pattern 141M1 is used for mounting the mirror 13, for example, and is partially provided so as to correspond to the opening 143H provided in the intermediate layer 143, which will be described later, in a plane (XY plane) view, for example. ..
  • the metal pattern 141M1 is provided so as to be exposed in the opening 143H.
  • the metal pattern 141M2 also functions as a heat radiating member, and the heat generated by the light emitting element 11 can be efficiently radiated to the base plate 31. That is, by providing the metal pattern 141M2 on the back surface 14S2 of the accommodating member 14, the light emitting device 10A and the base plate 31 can be electrically and thermally connected.
  • the intermediate layer 143 forms a part of the side surface of the recess 14C, and is arranged between the first layer 141 and the bonding layer 144.
  • the intermediate layer 143 has, for example, a plate-shaped member having a rectangular planar shape, and has an upper surface 143S1 and a lower surface 143S2 facing each other.
  • the upper surface 143S1 and the upper surface 141S1 of the first layer 141 form the bottom surface of the recess 14C.
  • the intermediate layer 143 is provided with an opening 143H in which the mirror 13 is arranged.
  • a metal pattern 141M1 provided on the upper surface of the first layer 141 is exposed in the opening 143H, and the mirror 13 is mounted via the metal pattern 141M1.
  • the upper surface 143S1 of the intermediate layer 143 is provided with metal patterns 143M1 and metal patterns 143M2 that are independent of each other.
  • the metal pattern 143M1 is used, for example, for mounting the submount 12, and for example, in a plan view, at least one of the metal pattern 141M1 provided on the first layer 141 and the metal pattern 144M1 provided on the bonding layer 144 described later. It is patterned so that at least a part of it overlaps with one of them. Further, the metal pattern 143M1 is provided so as to be partially exposed in the opening 144H provided in the bonding layer 144, and the submount 12 is mounted.
  • the metal pattern 143M2 is patterned so as to overlap at least a part of the metal pattern 144M2 provided on the bonding layer 144, for example, in a plan view.
  • the intermediate layer 143 is further provided with a via V1 that penetrates the intermediate layer 143 in the Z-axis direction.
  • the via V1 is provided at an overlapping position between the metal pattern 143M1 and the metal pattern 141M1 on the first layer 141, and connects the metal pattern 141M1 and the metal pattern 143M1.
  • the electrolytic plating process becomes easy in the gold plating process described later.
  • the via V1 when an insulating material is used for the sub mount 12, the metal pattern (not shown) on the sub mount 12 is connected to the metal pattern 141M1 by wire, for example, with the electrode take-out portion 14E1.
  • the light emitting element 11 can be electrically connected.
  • the bonding layer 144 constitutes a part of the side surface of the recess 14C and is bonded to the cover 15.
  • the bonding layer 144 has, for example, a plate-shaped member having a rectangular planar shape, and has an upper surface 144S1 and a lower surface 144S2 facing each other.
  • the upper surface 144S1 constitutes a joint surface 14S1 with the cover 15 of the accommodating member 14.
  • the joint layer 144 is provided with an opening 144H in which the submount 12 is arranged.
  • a part of the metal pattern 143M1 and the metal pattern 143M2 provided on the upper surface of the intermediate layer 143 is exposed in the opening 144H, and the submount 12 is mounted via the metal pattern 143M1.
  • the metal pattern 143M2 is electrically connected to one electrode (for example, an anode) of the light emitting element 11 mounted on the submount 12 via a wire W.
  • the opening 144H includes an opening 143H provided in the intermediate layer 143. That is, the recess 14C is composed of an opening 143H and an opening 144H, whereby the bottom surface of the recess 14C has a step.
  • the upper surface 144S1 of the bonding layer 144 is provided with a metal pattern 144M1 that surrounds the opening 144H in a frame shape and partially projects outside the frame.
  • This frame-shaped portion (metal pattern 14MC) is used for joining with the cover 15 (specifically, the metal pattern 151M described later).
  • This frame-shaped metal pattern 14MC corresponds to a specific example of the "first metal film” of the present disclosure.
  • the overhanging portion (metal pattern 14ME) is exposed from the cover 15 and constitutes an electrode taking-out portion 14E1 that electrically connects the light emitting element 11 and the outside. That is, the metal pattern 144M1 has a metal pattern 14MC and a metal pattern 14ME.
  • a metal pattern 144M2 independent of the metal pattern 144M1 is provided next to, for example, an overhanging portion (metal pattern 14ME) of the metal pattern 144M1.
  • the metal pattern 144M2 is exposed from the cover 15 together with the metal pattern 14ME, and constitutes an electrode extraction portion 14E2 that electrically connects the light emitting element 11 and the outside.
  • the electrode take-out part 14E1 and the electrode take-out part 14E2 are portions where electrodes are pulled out from the anode and cathode of the light emitting element 11.
  • the joint layer 144 is further provided with, for example, three vias V2 and one via V3 that penetrate the joint layer 144 in the Z-axis direction.
  • the three vias V2 are provided at overlapping positions of the metal pattern 144M1 and the metal pattern 143M1 on the intermediate layer 143.
  • two vias V2 are provided directly under the metal pattern 14MC, and one via V2 is provided directly under the metal pattern 14ME. That is, the metal pattern 14MC is connected to the metal pattern 143M1 by two vias V2, and the metal pattern 14ME is connected to the metal pattern 143M1 by one via V2.
  • One via V3 is provided at an overlapping position between the metal pattern 144M2 and the metal pattern 143M2 on the intermediate layer 143, and connects the metal pattern 143M2 and the metal pattern 144M2.
  • the anode and cathode of the light emitting element 11 are electrode extraction portions exposed from the cover 15 via the metal patterns 141M, 143M, 144M and vias V1, V2, V3 provided on the first layer 141 and the second layer 142. It is pulled out to 14E1 and the electrode extraction portion 14E2.
  • the cathode of the light emitting element 11 is, for example, via the metal pattern 141M1, the via V1, the metal pattern 143M1 and one via V2, and the metal pattern 141M1, the via V1, the metal pattern 143M1, and the two vias V2. And it is drawn out to the electrode extraction portion 14E1 via the metal pattern 14MC.
  • the anode of the light emitting element 11 is led out to the electrode extraction portion 14E2 via, for example, a wire W, a metal pattern 143M2, and a via V3.
  • the metal pattern 14MC is a part of the metal pattern 144M1, and the metal pattern 144M1 has a metal pattern 14ME constituting the electrode extraction portion 14E1 in addition to the metal pattern 14MC.
  • the metal pattern 14MC and the metal pattern 14ME are formed in the same metal pattern (metal pattern 144M1) and are electrically connected to each other.
  • the metal pattern 14MC is connected to the metal pattern 143M1 via two vias V2.
  • the metal pattern 143M1 is electrically connected to, for example, the cathode of the light emitting element 11 via, for example, a submount 12.
  • the metal pattern 14MC together with the solder joint portion 21 described later, constitutes a part of the conductive path between, for example, the cathode and the electrode extraction portion 14E1 of the light emitting element 11.
  • the cross-sectional area of the conductive path that electrically connects the light emitting element 11 and the outside is increased, and the internal resistance is reduced.
  • the surface coating film can be formed using, for example, a dielectric material.
  • the dielectric material include aluminum nitride (AlN), aluminum oxide (Al 2 O 3 ), silicon oxide (SiO 2 ), silicon nitride (SiN) and the like.
  • the cover 15 is designed to take out the light emitted from the light emitting element 11.
  • the cover 15 is, for example, a plate-shaped member having a rectangular planar shape, and has an upper surface 15S1 and a lower surface 15S2 facing each other.
  • the cover 15 covers at least the recess 14C of the accommodating member 14.
  • the cover 15 is made of a material having a light transmitting property at least in a portion covering the recess 14C.
  • the cover 15 is made of, for example, glass or the like.
  • a metal pattern 151M containing chromium (Cr), titanium (Ti), gold (Au), or the like is formed on the lower surface 15S2 of the cover 15.
  • This metal pattern 151M corresponds to a specific example of the "second metal film" of the present disclosure.
  • the metal pattern 151M has substantially the same planar shape as, for example, a metal pattern 14MC portion for joining formed on the joining surface 14S1 of the accommodating member 14.
  • the metal pattern 151M has a frame-like shape surrounding the recess 14C, and has a width substantially equal to or smaller than that of the metal pattern 14MC for joining formed on the upper surface of the accommodating member 14.
  • the solder joint portion 21 is for joining the accommodating member 14 and the cover 15.
  • the solder joint portion 21 is composed of, for example, a solder 22 and a plurality of spacers 23, and is provided in a frame shape, like the metal pattern 14MC and the metal pattern 151M formed in a frame shape, for example.
  • the spacer 23 is for maintaining a distance between the joint surface 14S1 of the accommodating member 14 and the lower surface 15S2 of the cover 15 which is the joint surface with the accommodating member 14, and is inside the solder 22 constituting the solder joint portion 21. It is distributed in.
  • the density of the spacers 23 in the solder joint portion 21 is preferably three or more so that the distance between the accommodating member 14 and the cover 15 becomes substantially constant when the accommodating member 14 and the cover 15 are joined. .. Further, in general, the accommodating member 14 formed by using the sintered body has surface irregularities. Therefore, the joint surface 14S1 of the accommodating member 14 has irregularities as shown in FIG. 1C. Therefore, it is more preferable that one or more, about 10 in total, are contained in each side of the frame-shaped solder joint 21. At least a part of the plurality of spacers 23 dispersed in the solder joint portion 21 is, for example, as shown in FIG.
  • the joint surfaces of the accommodating member 14 and the cover 15 (to be exact, the metal pattern 14MC and the metal pattern 151M). Is in contact with. As a result, a space of 23 minutes is secured between the joint surface 14S1 of the accommodating member 14 and the lower surface 15S2 of the cover 15.
  • the amount of the solder 22 including the spacer 23 forming the solder joint portion 21 satisfies, for example, the following formula (1).
  • Number 1 S ⁇ R ⁇ (W A + W B) / 2 ⁇ (1)
  • S the area of the solder joint comprising a spacer
  • R a spacer having a diameter
  • W A the width of the first metal layer
  • W B the width of the second metal film
  • the "area S of the solder joint including the spacer" in the above formula (1) corresponds to the cross-sectional area of the solder joint 21 shown in FIG. 1B. Since the solder 22 at the time of melting the solder has surface tension, the side surface shape of the solder joint 21 between the accommodating member 14 and the cover 15 is, for example, as shown in FIG. 6A, the metal pattern 14MC. And the shape bulges outward from the end of the metal pattern 151M, but in equation (1), the side surface of the solder joint 21 is represented as a linear shape.
  • the ends of the solder joints 21 in contact with the metal pattern 14MC and the metal pattern 151M coincide with the ends of the metal pattern 14MC and the metal pattern 151M, respectively, or the metal pattern 14MC and the metal pattern This includes the case where it is inside the end of 151M.
  • the cross-sectional shape of the solder joint portion 21 satisfying the above formula (1) in the direction of the II line shown in FIG. 1 is any of those shown in FIGS. 6A to 6C.
  • Width of the second metal film (metal pattern 151M) W B is smaller than the width (metal pattern 14MC) W A of the first metal film (W A> W B), and a metal pattern 14MC and the metal pattern 151M
  • the solder joint 21 is shown in FIG. 6B. It has the cross-sectional shape shown in.
  • Width of the second metal film (metal pattern 151M) W B is smaller than the width (metal pattern 14MC) W A of the first metal film (W A> W B), and a metal pattern 14MC and the metal pattern 151M
  • the solder joint 21 is shown in FIG. 6C. It has the cross-sectional shape shown in.
  • the amount of the solder 22 including the spacer 23 forming the solder joint 21 can also be expressed by the following formula (2).
  • the "volume V of the solder joint including the spacer” in the following formula (2) corresponds to the volume of the solder joint 21 formed in the frame shape shown in FIG. 1, and the formula (2) is the above formula (1). Is virtually synonymous with. (Number 2) V ⁇ R ⁇ (S A + S B) / 2 ⁇ (2) (V: volume of the solder joints containing spacer, R: a spacer having a diameter, S A: the area of the first metal film, S B: the area of the second metal film)
  • solder 22 for example, SnAgCu (tin-silver-copper) -based solder can be used.
  • solder 22 may be any solder that can be hermetically sealed, and for example, AuSn (gold-tin) -based, Sn (tin) -based, or In (indium) -based solder may be used.
  • beads made of, for example, an insulator, a conductor, a resin material or a ceramic material can be used. Specifically, glass beads, stainless beads, resin beads made of polyimide, polyetheretherketone (PEEK), etc., ceramic beads such as aluminum oxide (alumina) and silicon oxide (SiO 2 ), or copper (Cu), Conductive beads such as aluminum (Al) or carbon (C) can be used.
  • the shape of the spacer 23 is preferably, for example, a substantially spherical shape. As a result, the variation in height due to the dispersion angle of the spacer 23 in the solder 22 is reduced.
  • the diameter of the spacer 23 is preferably 1/5 or less, more preferably 1/10 or less of the width of the metal pattern 14MC and the metal pattern 151M, for example.
  • the widths of the metal pattern 14MC and the metal pattern 151M are different from each other, it is preferably 1/5 or less, more preferably 1/10 or less of the width of the narrower metal pattern. This is because as the thickness (h) of the solder joint portion 21 increases, the leak path inside the solder joint portion 21 increases by that amount, and the airtightness may decrease.
  • the spacer 23 preferably has elasticity, for example, preferably has a Young's modulus of 41.4 MPa or less. As a result, the occurrence of cracks around the spacer 23 due to the difference in linear expansion coefficient between the solder 22 and the spacer 23, which occurs during cooling, is reduced. For this reason, it is preferable to use resin beads for the spacer 23.
  • the light emitting device 10A is manufactured, for example, as follows. Specifically, the metal pattern 141M and the metal pattern 141M2 are formed on the upper surface 141S1 and the lower surface 141S2 of the first layer 141. Next, the second layer 142 is formed. First, an opening 143H forming the recess 14C and a through hole (not shown) for the via V1 are formed in the intermediate layer 143. Subsequently, for example, tungsten paste, copper (Cu) or silver (Ag) is embedded in the through holes to form the via V1, and then the metal pattern 143M1 and the metal pattern 143M2 are formed on the upper surface 143S1 of the intermediate layer 143.
  • an opening 144H forming the recess 14C and a through hole (not shown) for vias V2 and V3 are formed in the joint layer 144.
  • tungsten paste, copper (Cu) or silver (Ag) is embedded in the through holes to form vias V2 and V3, and then metal patterns 144M1 and metal patterns 144M2 are formed on the upper surface 144S1 of the bonding layer 144. .. Then, it is sintered, the exposed portion is gold-plated, and then it is separated into pieces to form the accommodating member 14.
  • the light emitting element 11 and the mirror 13 in the recess 14C of the accommodating member 14, for example, the anode and the metal pattern 143M2 of the light emitting element 11 are connected to a wire using, for example, a gold wire (wire W). Connect by bonding.
  • a gold wire wire W
  • the metal pattern (not shown) on the sub mount 12 is wire-connected to the metal pattern 143M1 or the metal pattern 141M1.
  • the electrode extraction portion 14E1 and the light emitting element 11 are electrically connected.
  • the melting temperature of the bonding agent in the three steps of mounting the mirror 13, mounting the light emitting element 11 and the submount 12, and joining the accommodating member 14 and the cover 15 is important.
  • the mirror 13 is preferably bonded using AuSn solder or a sintering Ag paste as a bonding agent.
  • the light emitting element 11 and the submount 12 are preferably bonded using AuSn solder as a bonding agent. It is preferable to use SnAgCu solder as a bonding agent for joining the accommodating member and the cover 15.
  • the cover 15 is joined to the accommodating member 14.
  • a metal pattern 151M is formed on the lower surface 15S2 of the cover 15S.
  • a paste-like solder 22 pre-filled with a plurality of spacers 23 is applied onto the metal pattern 151M.
  • the accommodating member 14 and the cover 15 are combined and heated at a temperature several tens of degrees higher than the melting temperature of the solder 22, for example.
  • the light emitting element 11 is hermetically sealed, and the light emitting device 10A is completed.
  • the light emitting device 10A for example, light is extracted as follows.
  • the light emitted from the light emitting element 11 (for example, the light in the blue wavelength band) is reflected by the mirror 13, passes through the cover 15, and is taken out from the light emitting device 10A.
  • FIG. 8 shows the configuration of a schematic side surface of the light emitting device (light emitting device 1) provided with the light emitting device 10A shown in FIG. 1A
  • FIG. 9 shows the disassembly of the light emitting device 1 shown in FIG. It is a perspective view.
  • the light emitting device 1 includes a light emitting device 10A, a base plate 31, a lens holding member 32, and an array lens 33.
  • the array lens 33 has a lens 331 corresponding to each light emitting device 10A.
  • the base plate 31 is a member on which the light emitting device 10A is placed.
  • the base plate 31 is, for example, a flat plate-shaped member, and has a front surface 31A and a back surface 31B that face each other.
  • a plurality of light emitting devices 10A are provided on the front surface 31A, and the back surface 31B is thermally connected to, for example, a heat sink or the like (not shown).
  • the base plate 31 is made of, for example, a ceramic material or a metal material.
  • the base plate 31 made of a metal material can improve heat dissipation.
  • the metal material include iron (Fe), iron alloy, copper (Cu), aluminum (Al), and copper alloy.
  • the copper alloy include copper tungsten (Cu-W) and the like.
  • the ceramic material include aluminum nitride (AlN) and the like.
  • the base plate 31 may be provided with a cooling water channel.
  • the base plate 31 may be provided with a recess for mounting the light emitting device 10A. By providing the light emitting device 10A in the recess of the base plate 31, the light emitting device 10A can be protected.
  • a plurality of light emitting devices 10A are placed on the surface 31A of the base plate 31.
  • the plurality of light emitting devices 10A are arranged in a matrix on the surface 31A of the base plate 31, for example (X direction and Y direction in FIG. 9).
  • a part of the light emitting devices 10A arranged in a matrix may be omitted.
  • the part of the light emitting device 10A is removed for the purpose of removing defective products or lowering the power density of a part of the surface.
  • the arrangement of the light emitting device 10A may be another arrangement such as a substantially hexagonal shape or a staggered shape.
  • the distance between the plurality of light emitting devices 10A arranged in a matrix on the surface 31A of the base plate 31 is smaller in the ⁇ // direction than in the ⁇ direction, for example. Since the FFP (Far Field Pattern) half width in the ⁇ // direction is narrower than the FFP half width in the ⁇ direction, it is possible to reduce the interval between the light emitting devices 10A in the ⁇ // direction. This makes it possible to improve the light density.
  • a plurality of light emitting devices 10A may be arranged in a row.
  • the lens holding member 32 provided between the base plate 31 and the array lens 33 has, for example, a frame-like shape surrounding a plurality of light emitting devices 10A mounted on the surface 31A of the base plate 31 (FIG. 9). ). That is, a plurality of light emitting devices 10A are provided inside the frame-shaped lens holding member 32.
  • the planar shape of the lens holding member 32 is, for example, a quadrangular shape.
  • the lens holding member 32 has, for example, a holding portion 321 having a quadrangular frame shape, and an expanding portion 322 extended inside and outside the holding portion 321.
  • the expansion portion 322 is provided on, for example, two opposing sides of the quadrangular holding portion 321.
  • the lens holding member 32 may not be provided over the entire circumference of the base plate 31, and may be provided on three sides of the rectangular base plate 31, for example. Alternatively, the lens holding member 32 may be provided on two opposite sides of the rectangular base plate 31.
  • the lens holding member 32 is fixed to the base plate 31 using, for example, screws or the like (not shown).
  • the method of fixing the lens holding member 32 to the base plate 31 may be any method, and for example, the lens holding member 32 may be fixed to the base plate 31 using an adhesive.
  • the adhesive is made of, for example, a resin material.
  • the lens holding member 32 and the base plate 31 may be collectively molded by using an insert molding process or the like.
  • the thickness of the holding portion 321 (the size in the Z direction in FIG. 9) is larger than the thickness of the expansion portion 322, for example.
  • the holding portion 321 is in contact with the base plate 31 and the array lens 33. Therefore, the size of the distance between each light emitting device 10A and the lens 331 is adjusted by the thickness of the holding portion 321.
  • the thickness of the holding portion 321 is preferably such that a space having a size that allows gas flow can be maintained between the cover 15 and the array lens 33 and between the base plate 31 and the array lens 33.
  • the size at which gas can flow is, for example, 0.01 mm, which is a processing tolerance by a mechanism, or about 0.5 mm, which is a tolerance in resin molding.
  • the thickness of the holding portion 321 is, for example, about 1 mm to 30 mm.
  • the thickness of the holding portion 321 may be adjusted according to, for example, the focal length of the lens 331, the optical path length in the light emitting device 10A, and the like.
  • the holding portion 321 is made of, for example, a resin material.
  • the expansion unit 322 is provided with, for example, a terminal unit 322E.
  • the terminal portion 322E is for electrically connecting the light emitting device 10A (light emitting element 11) and the outside via the wiring WA, for example, and is provided in plurality from the inside to the outside of the expansion portion 322.
  • the terminal portion 322E is made of a conductive metal material such as aluminum (Al).
  • the expansion portion 322 of the portion other than the terminal portion 322E is made of, for example, the same resin material as the holding portion 321.
  • the expansion portion 322 and the holding portion 321 may be made of different resin materials.
  • the holding portion 321 and the expanding portion 322 may be individually fixed to the base plate 31. Further, in the holding portion 321 and the expanding portion 322, the holding portion 321 may be fixed to the expanding portion 322.
  • the holding portion 321 is made of resin or metal
  • the expansion portion 322 and the terminal portion 322E are made of PCB (Printed Circuit Board), so that the holding portion 321 can be expanded to the base plate 31 or expanded by using UV adhesive or solder. It can be adhered to the portion 322.
  • the array lens 33 and the holding portion 321 may be integrally molded by using an insert molding method.
  • the lens holding member 32 may be made of a metal material such as aluminum (Al), SUS (Steel Use Stainless), iron (Fe), and copper (Cu).
  • the lens holding member 32 may be made of a ceramic material or the like.
  • the shape of the lens holding member 32 may be formed by machining such as cutting, or may be formed by die casting or sintering.
  • the lens holding member 32 including the terminal portion 322E is preferably composed of, for example, one component integrated by integral molding. This makes it possible to reduce costs.
  • the array lens 33 faces the base plate 31 with a plurality of light emitting devices 10A in between.
  • the array lens 33 has, for example, an array portion 33A in a central portion and a frame portion 33F surrounding the array portion 33A.
  • a plurality of lenses 331 are provided at positions facing each light emitting device 10A.
  • Each lens 331 is arranged at a position overlapping the light emitting element 11 and the mirror 13 in a plan view, for example.
  • the lens 331 is composed of, for example, a convex lens.
  • the lens 331 may be composed of a plano-convex lens, a biconvex lens, a meniscus lens, and the like.
  • the array lens 33 may have different configurations on the lower surface (for example, the surface facing the base plate 31) side and the upper surface side.
  • one surface side of the array lens 33 may have an FAC (Fast Axis Collimator) function, and the other surface side may have a SAC (Slow Axis Collimator) function.
  • the array lens 33 is composed of, for example, lenticular lenses arranged in a direction orthogonal to each other, for example, a biconvex single lens or two plano-convex lenses bonded together on a flat surface. ..
  • the array lens 33 is configured such that the two plano-convex lenses are aligned so that the plane side faces the light emitting device 10A side, and are held and integrated by the frame portion 33F of the array lens 33.
  • the frame portion 33F around the array portion 33A has, for example, a quadrangular planar shape, and the frame portion 33F is fixed to the holding portion 321 of the lens holding member 32 by, for example, an adhesive (not shown).
  • an adhesive not shown
  • a photocurable resin such as a UV (Ultra Violet) curable resin can be used.
  • a resin material having a curing shrinkage amount of about several% or less, and 1% or less. It is more preferable to use a resin material having a curing shrinkage amount.
  • the array lens 33 may be fixed to the lens holding member 32 by, for example, a screw or the like. Alternatively, the array lens 33 and the lens holding member 32 may be collectively molded by an insert molding process or the like. As described above, a space having a size capable of gas flow is provided between the array unit 33A and the base plate 31 and between the array unit 33A and the light emitting device 10A.
  • the array lens 33 is made of, for example, borosilicate glass or the like.
  • FIG. 10 shows the light emitting device 10A shown in FIG. 1 together with the terminal portion 322E of the lens holding member 32.
  • the electrode extraction portion 14E1 and the electrode extraction portion 14E2 provided on the upper surface of each of the plurality of light emitting devices 10A are connected to each other via, for example, a wire (wiring WA).
  • the electrode extraction portion 14E2 of the light emitting device 10A arranged at the position closest to the terminal portion 322E of the lens holding member 32 is connected to the terminal portion 322E via the wiring WA.
  • the cover 15 is omitted.
  • the metal pattern 141M2 provided on the back surface of the adjacent light emitting devices 10A may be made continuous via, for example, a silver paste.
  • the metal patterns 141M2 of the adjacent light emitting devices 10A are thermally connected, and the heat dissipation path is widened.
  • light is extracted as follows.
  • the light extracted from each light emitting device 10A placed on the base plate 31 passes through the lens 331 at the position corresponding to each light emitting device 10A, and becomes collimated light. Therefore, the traveling directions of the light passing through each lens 331 are parallel to each other and are taken out from the light emitting device 1.
  • a plurality of spacers 23 are dispersed in the solder 22 constituting the solder joint portion 21 to join the accommodating member 14 and the cover 15.
  • the distance between the joint surfaces of the accommodating member 14 and the cover 15 can be controlled to adjust the amount of solder constituting the solder joint portion 21, and the accommodating space S in which the light emitting element 11 and the like are accommodated and the accommodating member can be adjusted. It is possible to prevent solder dripping to the outside of 14. This will be described below.
  • siloxane in the atmosphere reacts with light near the light emitting point, and a reactant is likely to be deposited on the end face of the light emitting element.
  • This reactant may cause a change in end face reflectance, resulting in deterioration of optical characteristics and destruction of the light emitting element.
  • a problem caused by siloxane in the atmosphere is likely to occur.
  • a technique is used in which a semiconductor laser device or the like is hermetically sealed in a package to suppress the occurrence of defects caused by siloxane in the atmosphere.
  • solder is used to hermetically seal the light emitting element inside the package.
  • metal films 1011M and 1012M are provided as bases at positions facing each other on the joining surfaces, for example.
  • the paste-like solder 1022 is applied to the metal film 1012M on the lid member 1012 side.
  • the joining surfaces 1011S and 1012S are arranged to face each other, and the solder 1022 is melted by heating to perform joining.
  • FIG. 11B when the package member 1011 and the lid member 1012 come into contact with each other by pressing from the lid member 1012 side, the solder 1022 overflows inside and outside the package member 1011 and causes solder dripping.
  • solder 1022 overflowing inside the package member 1011 comes into contact with, for example, a wire connecting the light emitting element and the electrode, it causes a characteristic defect such as an electrical short circuit.
  • a characteristic defect such as an electrical short circuit.
  • the amount of solder is reduced to prevent solder dripping, the airtightness inside the package is lowered.
  • a method of adjusting the mounting height of the lid member 1012 at the time of joining can be considered by the manufacturing equipment, but there is a concern that the cost will increase significantly. Further, since the shapes of the package member 1011 and the lid member 1012 vary from product to product, it is necessary to individually adjust the height, which may complicate the manufacturing process.
  • the solder joint portion 21 for joining the accommodating member 14 and the cover 15 is formed by using the solder 22 in which a plurality of spacers 23 are dispersed in advance.
  • the distance between the joint surface 14S1 of the accommodating member 14 and the lower surface 15S2 of the cover 15 can be controlled by a simpler method without using manufacturing equipment. Therefore, it is possible to perform airtight sealing and adjust the amount of solder that does not cause solder dripping.
  • the light emitting device 10A of the present embodiment it is possible to prevent the occurrence of solder dripping and the falling of the solder in the accommodation space S accommodating the light emitting element 11 and the like. Therefore, it is possible to prevent the occurrence of a short circuit due to contact between the solder dripping and, for example, the wire W that electrically connects the light emitting element 11 and the wiring structure provided in the accommodating member 14. In addition, the manufacturing yield can be improved. That is, it is possible to provide a light emitting device 10A having high reliability.
  • FIG. 12A is a schematic plan view for explaining the main configuration of the light emitting device (light emitting device 10B) according to the second embodiment of the present disclosure.
  • FIG. 12B schematically shows an example of the cross-sectional configuration of the main part of the light emitting device 10B in the VI-VI line shown in FIG. 12A.
  • the light emitting device 10B is a packaged surface mount device (SMD) like the light emitting device 10A in the first embodiment.
  • SMD packaged surface mount device
  • a spacer for maintaining a distance between the joint surface 14S1 of the accommodating member 14 and the lower surface 15S2 of the cover 15 is provided by a convex portion 14X provided on the joint surface 14S1 of the accommodating member 14. It is different from the first embodiment in that it is configured.
  • the convex portion 14X corresponds to a specific example of the "spacer" of the present disclosure.
  • the convex portion 14X is for maintaining the distance between the accommodating member 14 and the cover 15 on the joint surface. As described above, the convex portion 14X is formed on the joint surface 14S1 of the accommodating member 14, and is included in the solder 22 constituting the solder joint portion 21. The surface of the convex portion 14X is covered with, for example, a metal pattern 14MC.
  • the density of the convex portions 14X in the solder joint portion 21 is formed to be three or more so that the distance between the accommodating member 14 and the cover 15 becomes substantially constant when the accommodating member 14 and the cover 15 are joined. Is preferable.
  • one may be provided at each of the four corners of the frame-shaped solder joint 21.
  • the cover 15 can be stably supported at the time of solder joining between the accommodating member 14 and the cover 15.
  • one may be provided for each side of the frame-shaped solder joint 21. As a result, the amount of solder that can be held at the corners is secured, and it is possible to reduce the occurrence of solder dripping at the corners. Further, as shown in FIG.
  • the shape of the convex portion 14X is preferably a shape that narrows toward the tip of the convex portion. This facilitates shape transfer when the accommodating member 14 having the convex portion 14X is integrally formed, for example, by using a mold.
  • Specific shapes of the convex portion 14X include, for example, in addition to the triangle shown in FIG. 12B, for example, a semicircle shown in FIG. 14A, a shape combining a rectangle and a semicircle shown in FIG. 14B, and FIG. 14C. Examples thereof include the trapezoidal shape shown or a cross-sectional shape having a shape obtained by combining the rectangle and the triangular diameter shown in FIG. 14D.
  • the planar shape of the convex portion 14X is not limited to a circle, but may be a triangular shape, a quadrangle, or a polygonal shape having more than that.
  • the convex portion 14X may be provided on, for example, the lower surface 15S2 of the cover 15, or may be provided on both the joint surface 14S1 of the accommodating member 14 and the lower surface 15S2 of the cover 15.
  • FIG. 12A and the like an example in which a plurality of convex portions 14X independent of each other are used as the convex portions 14X is shown, but the convex portions 14X are frame-shaped solders, for example, as shown in FIGS. 15A and 15B.
  • the shape may be continuous in the joint portion 21 in substantially the same manner.
  • the amount of the solder 22 including the convex portion 14X forming the solder joint portion 21 satisfies the above-mentioned equations (1) and (2).
  • the spacer diameter (R) in the formulas (1) and (2) corresponds to the height of the convex portion 14X.
  • the housing member 14 and the cover 15 may be joined by using the convex portion 14X provided on the joint surface 14S1 of the housing member 14 as a spacer.
  • the spacer (convex portion 14X) in the solder joint portion 21 can be arranged at a desired position and a desired density. Play.
  • FIG. 16A is a schematic plan view for explaining the main configuration of the light emitting device (light emitting device 10C) according to the first modification of the present disclosure.
  • FIG. 16B schematically shows an example of the cross-sectional configuration of the main part of the light emitting device 10C in the VII-VII line shown in FIG. 16A.
  • the light emitting device 10C is a packaged surface mount device (SMD) like the light emitting device 10A in the first embodiment.
  • the accommodating member 44 is a plate-shaped member having a rectangular planar shape
  • the cover 45 has a recess 45C for accommodating the light emitting element 11 and the like on the lower surface 45S2. Is different.
  • the cover 45 may be made of, for example, a material having a light-transparent portion covering the mirror 13, and other parts such as the side surface of the cover 45 are made of a non-transparent material. May be configured using.
  • the solder joint portion 21 may be formed by dispersing substantially spherical spacers 23 in the solder 22 as in the first embodiment, or, for example, as in the second embodiment, for example.
  • a convex portion may be provided on the accommodating member 54, and this may be used as a spacer.
  • FIG. 17 schematically shows an example of the cross-sectional configuration of the light emitting device (light emitting device 10D) according to the second modification of the present disclosure.
  • the light emitting element for example, a vertical resonator surface emitting laser may be used as in the light emitting element 51 shown in FIG.
  • the light emitting device 10D may be provided with the lens 153 on the upper surface 15S1 side of the cover 15. This makes it possible to control the emission angle of the light emitted from the light emitting element 51.
  • the lens 153 may be provided on the lower surface 15S2 side of the cover 15. Alternatively, it may be provided on both the upper surface 15S1 side and the lower surface 15S2 side of the cover 15. However, as shown in FIG. 18, by providing the lens 153 on the upper surface 15S1 side of the cover 15, the size can be reduced as compared with the case where the lens 153 is provided on the lower surface 15S2 side of the cover 15.
  • the light emitting device 10D may be provided with a diffraction element 154 on the upper surface 15S1 side of the cover 15.
  • a diffraction element 154 By providing the diffraction element 154, it is possible to convert the light emitted from the light emitting element 51 into a desired output such as a random dot pattern.
  • FIG. 20 is a schematic exploded perspective view of a main part of the light emitting device (light emitting device 2) according to the third modification of the present disclosure.
  • the light emitting device 2 has a base plate 31, a light emitting device (for example, a light emitting device 10A), and an array lens 33 in this order. That is, the light emitting device 2 is not provided with a lens holding member (for example, the lens holding member 32 in FIG. 8).
  • the base plate 31 of the light emitting device 2 has, for example, a plate portion 311 and a holding portion 312 and a terminal portion 313E. Except for this point, the light emitting device 2 of the present modification has the same configuration as the light emitting device 1 of the first embodiment, and its action and effect are also the same.
  • the plate portion 311 of the base plate 31 is, for example, a plate-shaped member having a quadrangular planar shape.
  • a plurality of light emitting devices 10A are placed on the plate portion 311 in a matrix, for example.
  • the holding portion 312 has a quadrangular frame-shaped planar shape surrounding the plurality of light emitting devices 10A arranged in the central portion of the plate portion 311.
  • the holding portion 312 is in contact with the plate portion 311 and the array lens 33 (frame portion 33F), and the size of the distance between each light emitting device 10A and the lens 331 is adjusted by the size of the thickness of the holding part 312. It is supposed to be done.
  • the terminal portion 313E has, for example, a strip-shaped planar shape extending in one direction (Y direction in FIG. 20), and is provided on the plate portion 311.
  • the terminal portion 313E extends from the inside to the outside of the holding portion 312.
  • the plate portion 311 and the holding portion 312 and the terminal portion 313E are integrated, for example.
  • the plate portion 311 is made of, for example, aluminum
  • the holding portion 312 is made of, for example, PEEK (polyetheretherketone)
  • the terminal portion 313E is made of a metal material.
  • the plate portion 311 and the holding portion 312 are collectively molded by, for example, insert injection molding or the like.
  • the plate portion 311 is made of, for example, aluminum (Al), copper (Cu), copper tungsten (Cu-W), aluminum nitride (AlN), or the like
  • the holding portion 312 is made of, for example, alumina, aluminum nitride, Kovar, or the like. It may be configured.
  • the plate portion 311 and the holding portion 312 and the terminal portion 313E are insulated by, for example, low melting point glass or the like.
  • a plurality of light emitting devices 10A mounted on the base plate 31 include, for example, a light emitting device 10A including a light emitting element 11 that emits light in the red wavelength band and a light emitting device 10A including a light emitting element 11 that emits light in the blue wavelength band. And a light emitting device 10A including a light emitting element 11 that emits light in the green wavelength band.
  • the ratio and arrangement of the light emitting devices 10A for each color are adjusted from the luminous efficiency curve and the output (mW, Im).
  • the light emitting device 1 has a diffuser plate or the like, and the light emitted from the light emitting device 10A passes through the lens 331 and the diffuser plate or the like.
  • the light emitting device 10A (light emitting element 11) that emits light having different wavelength bands can be easily placed on the base plate 31 at a desired ratio and a desired arrangement. Therefore, the overall light balance can be easily adjusted.
  • the light emitting element 11 can be configured by an LED (Light Emitting Diode) or the like, but the light emitting element 11 composed of a semiconductor laser element has a higher light intensity than the case where the light emitting element 11 is composed of an LED. It becomes possible to recognize light at a farther position.
  • LED Light Emitting Diode
  • the light emitting devices 1 and 2 described in the first embodiment and the third modification can be applied to, for example, a projection type display device.
  • FIG. 21 is a diagram showing a configuration example of a projection type display device (projection type display device 200) to which the light emitting devices 1 and 2 are applied as a light source.
  • the projection type display device 200 is, for example, a display device that projects an image on a screen.
  • the projection display device 200 is connected to an external image supply device such as a computer such as a PC or various image players via an I / F (interface), and is based on an image signal input to the I / F.
  • the image is projected onto a screen or the like.
  • the configuration of the projection type display device 200 described below is an example, and the projection type display device according to the present technology is not limited to such a configuration.
  • the projection type display device 200 includes light emitting devices 1, 2, multi-lens array 212, PBS array 213, focus lens 214, mirrors 215a, 215c to 215e, dichroic mirrors 216, 217, light modulation elements 218a to 218c, and dichroic prism 219. And a projection lens 220.
  • the light emitted from the light emitting element 11 passes through the array lens 33 and is taken out as collimated light.
  • This light is incident on the multi-lens array 212.
  • the multi-lens array 212 has a structure in which a plurality of lens elements are provided in an array, and collects the light emitted from the light emitting devices 1 and 2.
  • the PBS array 213 polarizes the light focused by the multi-lens array 212 into light in a predetermined polarization direction, for example, a P-polarized wave.
  • the focus lens 214 collects the light converted into light in a predetermined polarization direction by the PBS array 213.
  • the dichroic mirror 216 transmits the red light R among the light incident through the focus lens 214 and the mirror 215e, and reflects the green light G and the blue light B.
  • the red light R transmitted by the dichroic mirror 216 is guided to the light modulation element 218a via the mirror 215a.
  • the dichroic mirror 217 transmits the blue light B of the light reflected by the dichroic mirror 216 and reflects the green light G.
  • the green light G reflected by the dichroic mirror 217 is guided to the light modulation element 218b.
  • the blue light B transmitted by the dichroic mirror 217 is guided to the light modulation element 218c via the mirror 215d and the mirror 215c.
  • Each of the light modulation elements 218a to 218c photomodulates each incident color light, and each light-modulated color light is incident on the dichroic prism 219.
  • the dichroic prism 219 synthesizes each color light that has been light-modulated and incident on one optical axis.
  • Each of the combined colored lights is projected onto a screen or the like via the projection lens 220.
  • the projection type display device 200 In the projection type display device 200, three light modulation elements 218a to 218c corresponding to the three primary colors of red, green, and blue are combined to display all colors. That is, the projection type display device 200 is a so-called three-plate type projection type display device.
  • the present technology has been described above with reference to the first and second embodiments, modified examples 1 to 4, and application examples, the present technology is not limited to the above-described embodiments and can be variously modified. is there.
  • the wiring structure provided on the accommodating member 14 described in the first embodiment is an example.
  • the electrode extraction portions 14E1 and 14E2 provided on the surface of the accommodating member 14 are provided on the upper surface 15S1 of the cover 15. You may do so.
  • solder joint portion 21 is used as a conductive path between the cathode of the light emitting element 11 and the electrode extraction portion 14E1 is shown, but the present invention is not limited to this.
  • the solder joint portion 21 may be used as a conductive path between the anode of the light emitting element 11 and the electrode extraction portion 14E2.
  • one light emitting element 11 is housed in the recess 14C is shown, but two or more light emitting elements 11 having different wavelengths are housed in the recess 14C. May be good.
  • the light emitted from the light emitting element 11 is taken out from the upper cover 15
  • the light emitted from the side surface of the accommodating member 14, that is, from the lateral direction is taken out. You may.
  • a metal plate or the like can be used as the cover 15.
  • the components, arrangements, numbers, etc. of the light emitting devices 1 and 2 illustrated in the first embodiment and the like are merely examples, and it is not necessary to include all the components, and other components may be included. Further may be provided.
  • terminal portions 322E and 313E for electrically connecting the light emitting element 11 and the outside are provided on the lens holding member 32 or the base plate 31 .
  • a terminal portion may be provided separately from the base plate 31.
  • the present technology can also have the following configurations.
  • a plurality of spacers having a first accommodating member and a second accommodating member, at least in part, in contact with both the joint surfaces of the first accommodating member and the second accommodating member. Since the solder is joined by using the solder, it is possible to prevent the solder from dripping at the time of joining. Therefore, it is possible to reduce the occurrence of a short circuit due to solder falling off or the like. That is, it is possible to improve the reliability.
  • the first accommodating member includes a first metal film provided on a joint surface with the second accommodating member.
  • the second accommodating member further has a second metal film provided on a joint surface with the first accommodating member.
  • the spacer is formed on any one of (1) to (3), which is a convex portion formed on at least one of the joint surfaces of the first accommodating member and the second accommodating member.
  • the light emitting device described.
  • the light emitting device according to any one of (1) to (8) above, wherein the spacer is formed by containing a resin material. (12) The light emitting device according to any one of (1) to (8) above, wherein the spacer is formed of a ceramic material. (13) The light emitting device according to any one of (2) to (12), wherein the height of the spacer is 1 ⁇ 5 or less of the width of the first metal film and the second metal film. .. (14) The first accommodating member and the second accommodating member have a recess in at least one of which forms an accommodating space for accommodating the light emitting element. The light emitting device according to any one of (1) to (13), wherein the light emitting element is hermetically sealed in the accommodation space.
  • the light emitting element is composed of a semiconductor laser.
  • the semiconductor laser includes a gallium nitride (GaN) -based semiconductor.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

Un dispositif électroluminescent selon un mode de réalisation de la présente invention comprend : un élément électroluminescent (11) ; un premier élément de réception (14) et un second élément de réception (15) qui reçoivent l'élément électroluminescent (11) ; une partie de joint de brasure (21) se joignant au premier élément de réception (14) avec le second élément de réception (15) ; et une pluralité d'éléments d'espacement (23) au moins certains sont en contact avec le premier élément de réception (14) et le second élément de réception (15) au niveau d'une surface de jonction du premier élément de réception (14) et du second élément de réception (15).
PCT/JP2020/035055 2019-10-09 2020-09-16 Dispositif électroluminescent WO2021070587A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019185808 2019-10-09
JP2019-185808 2019-10-09

Publications (1)

Publication Number Publication Date
WO2021070587A1 true WO2021070587A1 (fr) 2021-04-15

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WO (1) WO2021070587A1 (fr)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004317840A (ja) * 2003-04-17 2004-11-11 Seiko Instruments Inc 光デバイスおよびその製造方法
JP2005301124A (ja) * 2004-04-15 2005-10-27 Seiko Epson Corp 電気光学装置および電子機器
US20060164631A1 (en) * 2005-01-21 2006-07-27 Samsung Electronics Co., Ltd. Optical scanner package having heating dam
WO2007037365A1 (fr) * 2005-09-29 2007-04-05 Nippon Telegraph And Telephone Corporation Module optique
JP2008015434A (ja) * 2006-07-10 2008-01-24 Nippon Telegr & Teleph Corp <Ntt> 光モジュールおよびその製造方法
JP2008277395A (ja) * 2007-04-26 2008-11-13 Kyocera Corp 光素子用窓部材ならびに光素子収納用パッケージおよび光モジュール
JP2009238695A (ja) * 2008-03-28 2009-10-15 Pioneer Electronic Corp 有機ｅｌパネル
US20130039374A1 (en) * 2010-03-24 2013-02-14 Osram Opto Semiconductors Gmbh Semiconductor Laser Light Source
JP2013065642A (ja) * 2011-09-16 2013-04-11 Mitsubishi Electric Corp 発光装置の製造方法
JP2016066798A (ja) * 2014-09-25 2016-04-28 山村フォトニクス株式会社 光デバイス装置および光デバイスを覆うための保護カバー
JP2018037581A (ja) * 2016-09-01 2018-03-08 日機装株式会社 光半導体装置および光半導体装置の製造方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004317840A (ja) * 2003-04-17 2004-11-11 Seiko Instruments Inc 光デバイスおよびその製造方法
JP2005301124A (ja) * 2004-04-15 2005-10-27 Seiko Epson Corp 電気光学装置および電子機器
US20060164631A1 (en) * 2005-01-21 2006-07-27 Samsung Electronics Co., Ltd. Optical scanner package having heating dam
WO2007037365A1 (fr) * 2005-09-29 2007-04-05 Nippon Telegraph And Telephone Corporation Module optique
JP2008015434A (ja) * 2006-07-10 2008-01-24 Nippon Telegr & Teleph Corp <Ntt> 光モジュールおよびその製造方法
JP2008277395A (ja) * 2007-04-26 2008-11-13 Kyocera Corp 光素子用窓部材ならびに光素子収納用パッケージおよび光モジュール
JP2009238695A (ja) * 2008-03-28 2009-10-15 Pioneer Electronic Corp 有機ｅｌパネル
US20130039374A1 (en) * 2010-03-24 2013-02-14 Osram Opto Semiconductors Gmbh Semiconductor Laser Light Source
JP2013065642A (ja) * 2011-09-16 2013-04-11 Mitsubishi Electric Corp 発光装置の製造方法
JP2016066798A (ja) * 2014-09-25 2016-04-28 山村フォトニクス株式会社 光デバイス装置および光デバイスを覆うための保護カバー
JP2018037581A (ja) * 2016-09-01 2018-03-08 日機装株式会社 光半導体装置および光半導体装置の製造方法

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