WO2007037365A1 - Optical module - Google Patents

Optical module Download PDF

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Publication number
WO2007037365A1
WO2007037365A1 PCT/JP2006/319450 JP2006319450W WO2007037365A1 WO 2007037365 A1 WO2007037365 A1 WO 2007037365A1 JP 2006319450 W JP2006319450 W JP 2006319450W WO 2007037365 A1 WO2007037365 A1 WO 2007037365A1
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WO
WIPO (PCT)
Prior art keywords
lid
housing
casing
optical module
thin film
Prior art date
Application number
PCT/JP2006/319450
Other languages
French (fr)
Japanese (ja)
Inventor
Takaharu Ohyama
Ikuo Ogawa
Akimasa Kaneko
Yoshiyuki Doi
Katsutoshi Takatoi
Yuichi Suzuki
Yuji Akahori
Original Assignee
Nippon Telegraph And Telephone Corporation
Ntt Electronics Corporation
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Publication date
Application filed by Nippon Telegraph And Telephone Corporation, Ntt Electronics Corporation filed Critical Nippon Telegraph And Telephone Corporation
Publication of WO2007037365A1 publication Critical patent/WO2007037365A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/166—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers

Abstract

An optical module that has high air-tightness and that can be produced by a simplified process. The optical module includes an optical element fixed to a housing (52) and is sealed by the housing (52) and a lid (53) that is joined to the optical element and through which light transmits. A thin metal film (62) is formed on the housing (52), at the upper part of the peripheral edge of the housing (52), and the upper part is in contact with the lid (53). Also, a thin metal film (63) is formed on the lid (53), at both the outer periphery and side face of the lid that are in contact with the housing (52). Outside dimensions of the lid (53) are smaller than those of the peripheral edge of the housing (52).

Description

明 細 書  Specification
光モシユール  Light Mossyur
技術分野  Technical field
[0001] 本発明は、複数の光素子を封止した光モジュールに関する。  The present invention relates to an optical module in which a plurality of optical elements are sealed.
背景技術  Background art
[0002] 近年、光ファイバ伝送の普及に伴い、多数の光機能素子を高密度に集積する技術 が求められている。その中にあって、波長分割多重伝送技術を適用した光送受信器 においては、複数の発光素子または受光素子 (以下、光素子という）を内蔵する光モ ジュールが用いられて 、る。  In recent years, with the widespread use of optical fiber transmission, a technique for integrating a large number of optical functional elements at a high density is required. Among them, an optical module incorporating a plurality of light-emitting elements or light-receiving elements (hereinafter referred to as optical elements) is used in an optical transceiver to which wavelength division multiplexing transmission technology is applied.
[0003] 図 1に、従来の光モジュールの構成を示す。光モジュール 11は、一例として、発光 面または受光面 (以下、受発光面という） 14を有する 4つの発光素子または受光素子 (以下、光素子という） 15を備えている。光モジュール 11は、箱型の筐体 12とサフアイ ァガラス力もなる蓋 13とにより封止された光素子 15を有する（例えば、非特許文献 1 参照)。光素子 15は、ボンディングワイヤ 16により、筐体 12の底面の金属配線 17に 接続されている。金属配線 17は、筐体 12を貫通して、筐体 12の裏面および側面に まで延長されている。  FIG. 1 shows a configuration of a conventional optical module. As an example, the optical module 11 includes four light emitting elements or light receiving elements (hereinafter referred to as optical elements) 15 having a light emitting surface or a light receiving surface (hereinafter referred to as a light receiving / emitting surface) 14. The optical module 11 has an optical element 15 sealed by a box-shaped housing 12 and a lid 13 having a sapphire glass force (see, for example, Non-Patent Document 1). The optical element 15 is connected to a metal wiring 17 on the bottom surface of the housing 12 by a bonding wire 16. The metal wiring 17 extends through the housing 12 to the back and side surfaces of the housing 12.
[0004] 筐体 12が蓋 13と接する周縁上部 18と、蓋 13が筐体 12と接する外周部 19とに、金 属薄膜が蒸着またはメツキされている。筐体 12と蓋 13とを接合するための接合剤は 、金属半田が用いられている。  [0004] A metal thin film is vapor-deposited or plated on the peripheral upper portion 18 where the casing 12 contacts the lid 13 and the outer peripheral portion 19 where the lid 13 contacts the casing 12. A metal solder is used as a bonding agent for bonding the casing 12 and the lid 13.
[0005] 図 2に、筐体と蓋との接合部の詳細を示す。筐体 12の周縁の外形寸法と、蓋 13の 外形寸法とは等しぐ筐体 12に形成されている金属薄膜 22と蓋 13に形成されている 金属薄膜 23とが対向し、金属半田 21により接合されている。金属半田 21は、筐体 1 2と蓋 13との間の間隙にしか形成されないために、光モジュールの側方からの衝撃、 例えば、図 2の左方からの衝撃に対する強度が弱い。これは、接合面が破壊されたり 、金属薄膜が剥離する可能性があるためである。  FIG. 2 shows details of the joint between the housing and the lid. The metal thin film 22 formed on the housing 12 and the metal thin film 23 formed on the lid 13 are opposed to each other by the metal solder 21 and the outer dimension of the peripheral edge of the casing 12 is equal to the outer dimension of the lid 13. It is joined by. Since the metal solder 21 is formed only in the gap between the casing 12 and the lid 13, the strength against the impact from the side of the optical module, for example, the impact from the left in FIG. This is because the joint surface may be broken or the metal thin film may be peeled off.
[0006] また、半田溶融時においては、筐体 12と蓋 13と横方向の相対位置がずれやすぐ 位置合わせが困難であるという問題もあった。 [0007] 本発明の目的は、気密性が高ぐ長期的な信頼性が高ぐかつ、製造工程を簡略 化することのできる光モジュールを提供することにある。 [0006] Further, when the solder is melted, there has been a problem that the relative positions of the casing 12 and the lid 13 in the lateral direction are shifted and alignment is difficult. An object of the present invention is to provide an optical module that has high airtightness, high long-term reliability, and can simplify the manufacturing process.
[0008] 非特干文献 1： A. Kaneko, et al, Ultra small and low power consumption 8ch variabl e optical attenuator multiplexer (V- AWu) using multi-chip PLC integration technol ogy", Proc. OFC'2005, OTuD3 [0008] Non-patent document 1: A. Kaneko, et al, Ultra small and low power consumption 8ch variable optical attenuator multiplexer (V- AWu) using multi-chip PLC integration technol ogy ", Proc. OFC'2005, OTuD3
発明の開示  Disclosure of the invention
[0009] このような目的を達成するために、本発明の一実施態様は、筐体に固定された光 素子を含み、該光素子と結合する光を透過する蓋と前記筐体とにより前記光素子を 封止した光モジュールにおいて、前記筐体は、前記蓋と接する周縁上部に金属薄膜 が形成され、前記蓋は、前記筐体と接する外周部および側面に金属薄膜が形成され 、前記蓋の外形寸法は、前記筐体の周縁の外形寸法よりも小さいことを特徴とする。  In order to achieve such an object, an embodiment of the present invention includes an optical element fixed to a casing, and includes a lid that transmits light coupled to the optical element and the casing. In the optical module in which the optical element is sealed, the casing is formed with a metal thin film on a peripheral upper portion in contact with the lid, and the lid is formed with a metal thin film on an outer peripheral portion and a side surface in contact with the casing. The external dimensions of the housing are smaller than the external dimensions of the periphery of the housing.
[0010] 本発明の他の実施態様は、筐体に固定された光素子を含み、該光素子と結合する 光を透過する蓋と前記筐体とにより前記光素子を封止した光モジュールにおいて、 前記筐体は、前記蓋と接する周縁上部および側面に金属薄膜が形成され、前記蓋 は、前記筐体と接する外周部に金属薄膜が形成され、前記蓋の外形寸法は、前記 筐体の周縁の外形寸法よりも大きいことを特徴とする。  [0010] Another embodiment of the present invention is an optical module including an optical element fixed to a casing, wherein the optical element is sealed by a lid that transmits light coupled to the optical element and the casing. The casing is formed with a metal thin film on an upper peripheral portion and a side surface in contact with the lid, the lid is formed with a metal thin film on an outer peripheral portion in contact with the casing, and the outer dimensions of the lid are the same as those of the casing. It is characterized by being larger than the outer peripheral dimension.
図面の簡単な説明  Brief Description of Drawings
[0011] [図 1]図 1は従来の光モジュールの構成を示す斜視図である。 FIG. 1 is a perspective view showing a configuration of a conventional optical module.
[図 2]図 2は筐体と蓋との接合部を示す拡大図である。  FIG. 2 is an enlarged view showing a joint portion between the housing and the lid.
[図 3]図 3は本発明の第 1の実施形態に力かる光モジュールの筐体と蓋との接合部を 示す拡大図である。  FIG. 3 is an enlarged view showing a joint portion between the housing and the lid of the optical module that is useful for the first embodiment of the present invention.
[図 4]図 4は本発明の第 1の実施形態に力かる光モジュールを示す上面図である。  [FIG. 4] FIG. 4 is a top view showing an optical module that works on the first embodiment of the present invention.
[図 5]図 5は本発明の第 2の実施形態に力かる光モジュールの筐体と蓋との接合部を 示す拡大図である。  [Fig. 5] Fig. 5 is an enlarged view showing a joint portion between a housing and a lid of an optical module that is useful for the second embodiment of the present invention.
[図 6]図 6は本発明の第 3の実施形態に力かる光モジュールの筐体と蓋との接合部を 示す拡大図である。  [Fig. 6] Fig. 6 is an enlarged view showing a joint portion between a housing and a lid of an optical module that is useful for the third embodiment of the present invention.
[図 7]図 7は本発明の第 4の実施形態に力かる光モジュールの筐体と蓋との接合部を 示す拡大図である。 発明を実施するための最良の形態 [FIG. 7] FIG. 7 is an enlarged view showing a joint portion between a housing and a lid of an optical module that is useful in the fourth embodiment of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION
[0012] 以下、図面を参照しながら本発明の実施形態について詳細に説明する。  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0013] 図 3に、本発明の第 1の実施形態に力かる光モジュールの筐体と蓋との接合部を示 し、図 4に、光モジュールの上面図を示す。光モジュール 51は、箱型の筐体 52とサフ アイァガラス力もなる蓋 53とにより封止された光素子 55を有する。筐体 52の材質とし て、例えば、アルミナ系セラミックスが使用される。筐体 52が蓋 53と接する周縁上部 には、金属薄膜 62が蒸着またはメツキされている。蓋 53が筐体 52と接する外周部に も、金属薄膜 63が蒸着またはメツキされている。さらに、金属薄膜 63は、蓋 53の側面 にも蒸着またはメツキされている。筐体 52と蓋 53とを接合するための接合剤は、金属 半田 61が用いられている。光素子 55は、筐体 52と蓋 53とにより高い気密性で気密 封止され、外部環境から保護されるので、光素子 55の信頼性を向上することができ る。 [0013] FIG. 3 shows a joint between the housing and the lid of the optical module that works according to the first embodiment of the present invention, and FIG. 4 shows a top view of the optical module. The optical module 51 includes an optical element 55 sealed by a box-shaped casing 52 and a lid 53 having a sapphire glass force. As the material of the casing 52, for example, alumina ceramics are used. A metal thin film 62 is deposited or plated on the upper peripheral edge where the casing 52 contacts the lid 53. A metal thin film 63 is also deposited or plated on the outer peripheral portion where the lid 53 is in contact with the housing 52. Furthermore, the metal thin film 63 is also deposited or plated on the side surface of the lid 53. A metal solder 61 is used as a bonding agent for bonding the housing 52 and the lid 53. Since the optical element 55 is hermetically sealed by the casing 52 and the lid 53 with high airtightness and protected from the external environment, the reliability of the optical element 55 can be improved.
[0014] 筐体 52の周縁の外形寸法は、 6000 mX 2000 μ mである。第 1の実施形態にお いては、蓋 53の外形寸法は、筐体 52の周縁の外形寸法と比較して、縦横それぞれ 200 μ m/J、さい。従って、蓋 53の外縁は、筐体 52の外縁力ら 100 μ m内佃 Jにある。 筐体 52の周縁の厚さは 600 mであるから、蓋 53の外周部と対向する部分の寸法 は、 500 /z mとなる。このような形状とすることにより、金属半田 61は、筐体 52に形成 されている金属薄膜 62の外縁から、蓋 13の側面に形成されている金属薄膜 63に向 つて、フィレットを形成する。  [0014] The outer dimension of the peripheral edge of the casing 52 is 6000 mX 2000 μm. In the first embodiment, the outer dimensions of the lid 53 are 200 μm / J each in length and width compared to the outer dimensions of the periphery of the casing 52. Accordingly, the outer edge of the lid 53 is at the inner edge J of 100 μm from the outer edge force of the casing 52. Since the thickness of the peripheral edge of the casing 52 is 600 m, the dimension of the portion facing the outer peripheral portion of the lid 53 is 500 / z m. With such a shape, the metal solder 61 forms a fillet from the outer edge of the metal thin film 62 formed on the housing 52 toward the metal thin film 63 formed on the side surface of the lid 13.
[0015] 金属半田 61のフィレットは、蓋 53の四辺に形成されるので、光モジュールの側方か らの衝撃に対しても、十分な強度を有する。また、四辺に形成されるフィレットにより、 リフロー時に蓋 53の側方に力かる応力が均等になるので、セルファライメント効果に より、筐体 52と蓋 53と横方向の相対位置がずれにくくなる。これにより、筐体 52と蓋 5 3との位置合わせが容易になる。また、蓋 53の周囲にフィレットが形成されることによ り、筐体 52と蓋 53とによる四辺の封止状態を目視で確認することができ、気密性試 験工程を簡略ィ匕することができる。  [0015] Since the fillet of the metal solder 61 is formed on the four sides of the lid 53, it has sufficient strength against an impact from the side of the optical module. Further, the fillets formed on the four sides equalize the stress applied to the side of the lid 53 at the time of reflow. Therefore, due to the self-alignment effect, the relative positions of the casing 52 and the lid 53 in the lateral direction are difficult to shift. This facilitates the alignment of the casing 52 and the lid 53. In addition, since the fillet is formed around the lid 53, it is possible to visually confirm the sealed state of the four sides of the casing 52 and the lid 53, thereby simplifying the airtightness test process. Can do.
[0016] なお、金属半田 61のフィレットの傾きをおよそ 45度とすると、金属半田 61の厚さは 、およそ 50 m程度であるので、蓋 53の外縁は、筐体 52の外縁から 50 m以上内 側にあればよい。蓋 53の側面に金属半田 61が付着するためには、蓋 53の外縁は、 筐体 52の外縁から 100 m以上内側にあればなお好ましい。また、蓋 53の厚さが 2 00 μ m程度ならば、蓋 53の外縁は、筐体 52の外縁から 200 μ m以上内側にする必 要はない。 If the inclination of the fillet of the metal solder 61 is about 45 degrees, the thickness of the metal solder 61 is about 50 m, so the outer edge of the lid 53 is 50 m or more from the outer edge of the housing 52. Inside Just be on the side. In order for the metal solder 61 to adhere to the side surface of the lid 53, it is more preferable that the outer edge of the lid 53 is at least 100 m inside the outer edge of the housing 52. If the thickness of the lid 53 is about 200 μm, the outer edge of the lid 53 does not need to be more than 200 μm inside the outer edge of the housing 52.
[0017] 筐体の材質は、アルミナ系セラミックスに限らず、例えば、炭化珪素、窒化珪素、窒 化アルミ、ジルコユア等の他のセラミックスを用いてもよい。また、石英、サファイア等 のガラスを用いてもよい。また、接合剤は、金錫や金ゲルマニウム、錫鉛といった金属 半田に限らず、例えば、低融点ガラスやロウ剤などを用いることができる。蓋の材質は 、上述したサファイアに限らず、例えば、石英ガラス、ホウ酸塩ガラスなどを用いること ができる。  [0017] The material of the housing is not limited to alumina ceramics, and other ceramics such as silicon carbide, silicon nitride, aluminum nitride, and zircoure may be used. Further, glass such as quartz or sapphire may be used. Further, the bonding agent is not limited to metal solder such as gold tin, gold germanium, and tin lead, and for example, low melting point glass or brazing agent can be used. The material of the lid is not limited to sapphire described above, and for example, quartz glass, borate glass, or the like can be used.
[0018] 図 5に、本発明の第 2の実施形態に力かる光モジュールの筐体と蓋との接合部を示 す。第 1の実施形態に力かる光モジュールとの相違は、蓋 53に蒸着またはメツキされ ている金属薄膜 64にある。金属薄膜 64は、筐体 52と接する外周部のみならず、蓋 5 3の側面および筐体 52の周縁からさらに内側にも蒸着またはメツキされている。筐体 52および蓋 53の外形寸法は第 1の実施形態と同じである。このような形状とすること により、金属半田 61は、筐体 52に形成されている金属薄膜 62の外縁から、蓋 13の 側面に形成されている金属薄膜 63に向って、フィレットを形成する。さらに、筐体 52 に形成されている金属薄膜 62の内縁から、金属薄膜 64の内側に向ってフィレットが 形成されるので、接合強度ならびに気密性を高めることができる。  [0018] FIG. 5 shows a joint portion between the housing and the lid of the optical module that is useful in the second embodiment of the present invention. The difference from the optical module according to the first embodiment resides in the metal thin film 64 deposited or plated on the lid 53. The metal thin film 64 is vapor deposited or plated not only on the outer peripheral portion in contact with the housing 52 but also on the inner side from the side surface of the lid 53 and the peripheral edge of the housing 52. The outer dimensions of the casing 52 and the lid 53 are the same as those in the first embodiment. With this shape, the metal solder 61 forms a fillet from the outer edge of the metal thin film 62 formed on the casing 52 toward the metal thin film 63 formed on the side surface of the lid 13. Furthermore, since the fillet is formed from the inner edge of the metal thin film 62 formed in the casing 52 toward the inside of the metal thin film 64, the bonding strength and the air tightness can be improved.
[0019] 図 6に、本発明の第 3の実施形態に力かる光モジュールの筐体と蓋との接合部を示 す。光モジュールは、箱型の筐体 72と蓋 73とにより光素子を封止する。筐体 72が蓋 73と接する周縁上部には、金属薄膜 82が蒸着またはメツキされている。さらに、金属 薄膜 82は、筐体 52の側面にも蒸着またはメツキされている。蓋 73が筐体 72と接する 外周部にも、金属薄膜 83が蒸着またはメツキされている。筐体 72と蓋 73とを接合す るための接合剤は、金属半田 81が用いられている。  FIG. 6 shows a joint between the housing and the lid of the optical module that works according to the third embodiment of the present invention. In the optical module, the optical element is sealed by a box-shaped casing 72 and a lid 73. A metal thin film 82 is deposited or plated on the upper peripheral edge where the casing 72 is in contact with the lid 73. Further, the metal thin film 82 is deposited or plated on the side surface of the casing 52. A metal thin film 83 is also deposited or plated on the outer periphery where the lid 73 is in contact with the casing 72. A metal solder 81 is used as a bonding agent for bonding the casing 72 and the lid 73.
[0020] 筐体 72の周縁の外形寸法は、 6000 mX 2000 μ mである。第 2の実施形態にお いては、蓋 73の外形寸法は、筐体 72の周縁の外形寸法と比較して、縦横それぞれ 200 μ m大さ!/、。従って、蓋 73の外縁 ίま、窗体 72の外縁力ら 100 μ m外佃】にある。 筐体 72の周縁の厚さは 600 mであるから、蓋 73の外周部と対向する部分の寸法 は、 600 mとなる。このような形状とすることにより、金属半田 81は、蓋 73に形成さ れている金属薄膜 83の外縁から、筐体 72の側面に形成されている金属薄膜 82に向 つて、フィレットを形成する。 [0020] The outer dimension of the peripheral edge of the casing 72 is 6000 mX 2000 μm. In the second embodiment, the outer dimensions of the lid 73 are 200 μm each in length and width compared to the outer dimensions of the periphery of the casing 72! /. Therefore, the outer edge of the lid 73 and the outer edge force of the casing 72 are 100 μm. Since the thickness of the peripheral edge of the casing 72 is 600 m, the dimension of the portion facing the outer peripheral portion of the lid 73 is 600 m. By adopting such a shape, the metal solder 81 forms a fillet from the outer edge of the metal thin film 83 formed on the lid 73 toward the metal thin film 82 formed on the side surface of the casing 72. .
[0021] 金属半田 81のフィレットは、蓋 73の四辺に形成されるので、光モジュールの側方か らの衝撃に対しても、十分な強度を有する。また、四辺に形成されるフィレットにより、 リフロー時に蓋 73の側方に力かる応力が均等になるので、セルファライメント効果に より、筐体 72と蓋 73と横方向の相対位置がずれにくくなる。これにより、筐体 72と蓋 7 3との位置あわせが容易になる。また、蓋 73の周囲にフィレットが形成されることにより 、筐体 72と蓋 73とによる四辺の封止状態を目視で確認することができ、気密性試験 工程を簡略ィ匕することができる。  [0021] Since the fillets of the metal solder 81 are formed on the four sides of the lid 73, they have sufficient strength against impact from the side of the optical module. Also, the fillets formed on the four sides equalize the stress applied to the side of the lid 73 at the time of reflow. Therefore, due to the self-alignment effect, the lateral positions of the casing 72 and the lid 73 are difficult to shift. This facilitates the alignment of the casing 72 and the lid 73. Further, since the fillet is formed around the lid 73, the sealing state of the four sides by the casing 72 and the lid 73 can be visually confirmed, and the airtightness test process can be simplified.
[0022] なお、金属半田 81のフィレットの傾きをおよそ 45度とすると、金属半田 81の厚さは 、およそ 50 μ m程度であるので、蓋 73の外縁は、筐体 72の外縁から 50 μ m以上外 側にあればよい。筐体 72の側面に金属半田 81が付着するためには、蓋 73の外縁は 、筐体 72の外縁から 100 m以上外側にあればなお好ましい。また、蓋 73の厚さが 200 μ m程度ならば、蓋 73の外縁は、筐体 72の外縁から 200 μ m以上外側にする 必要はない。  Note that if the inclination of the fillet of the metal solder 81 is about 45 degrees, the thickness of the metal solder 81 is about 50 μm, so the outer edge of the lid 73 is 50 μm from the outer edge of the housing 72. It should be on the outside more than m. In order for the metal solder 81 to adhere to the side surface of the housing 72, it is more preferable that the outer edge of the lid 73 is at least 100 m outside the outer edge of the housing 72. If the thickness of the lid 73 is about 200 μm, the outer edge of the lid 73 does not need to be more than 200 μm outside the outer edge of the casing 72.
[0023] 図 7に、本発明の第 4の実施形態に力かる光モジュールの筐体と蓋との接合部を示 す。第 3の実施形態に力かる光モジュールとの相違は、蓋 73に蒸着またはメツキされ ている金属薄膜 84にある。金属薄膜 84は、筐体 72と接する外周部のみならず、筐 体 72の周縁からさらに内側にも蒸着またはメツキされている。筐体 72および蓋 73の 外形寸法は第 3の実施形態と同じである。このような形状とすることにより、金属半田 8 1は、蓋 73に形成されている金属薄膜 83の外縁から、筐体 72の側面に形成されて いる金属薄膜 82に向って、フィレットを形成する。さらに、筐体 72に形成されている 金属薄膜 82の内縁から、金属薄膜 84の内側に向ってフィレットが形成されるので、 接合強度ならびに気密性を高めることができる。  [0023] FIG. 7 shows a joint portion between the housing and the lid of the optical module that is useful in the fourth embodiment of the present invention. The difference from the optical module according to the third embodiment lies in the metal thin film 84 deposited or plated on the lid 73. The metal thin film 84 is deposited or plated not only on the outer peripheral portion in contact with the housing 72 but also on the inner side from the periphery of the housing 72. The outer dimensions of the casing 72 and the lid 73 are the same as those in the third embodiment. With this shape, the metal solder 81 forms a fillet from the outer edge of the metal thin film 83 formed on the lid 73 toward the metal thin film 82 formed on the side surface of the housing 72. . Further, since the fillet is formed from the inner edge of the metal thin film 82 formed in the casing 72 toward the inside of the metal thin film 84, the bonding strength and the air tightness can be improved.
産業上の利用可能性  Industrial applicability
[0024] 本実施形態によれば、金属薄膜上に金属半田がフィレットを形成するので、光モジ ユールの気密性が高くなり、長期的な信頼性が高くなるとともに、位置合わせが容易 となり、製造工程を簡略ィ匕することが可能となる。 [0024] According to this embodiment, since the metal solder forms the fillet on the metal thin film, the optical module The air tightness of the yule increases, the long-term reliability increases, the positioning becomes easy, and the manufacturing process can be simplified.

Claims

請求の範囲 The scope of the claims
[1] 筐体に固定された光素子を含み、該光素子と結合する光を透過する蓋と前記筐体 とにより前記光素子を封止した光モジュールにおいて、  [1] In an optical module including an optical element fixed to a housing, wherein the optical element is sealed with a lid that transmits light coupled to the optical element and the housing.
前記筐体は、前記蓋と接する周縁上部に金属薄膜が形成され、  The casing is formed with a metal thin film on the upper peripheral edge in contact with the lid,
前記蓋は、前記筐体と接する外周部および側面に金属薄膜が形成され、前記蓋の 外形寸法は、前記筐体の周縁の外形寸法よりも小さ 、ことを特徴とする光モジュール  The optical module is characterized in that a metal thin film is formed on an outer peripheral portion and a side surface of the lid in contact with the casing, and an outer dimension of the lid is smaller than an outer dimension of a peripheral edge of the casing
[2] 筐体に固定された光素子を含み、該光素子と結合する光を透過する蓋と前記筐体 とにより前記光素子を封止した光モジュールにおいて、 [2] In an optical module including an optical element fixed to a housing, wherein the optical element is sealed with a lid that transmits light coupled to the optical element and the housing.
前記筐体は、前記蓋と接する周縁上部および側面に金属薄膜が形成され、 前記蓋は、前記筐体と接する外周部に金属薄膜が形成され、前記蓋の外形寸法 は、前記筐体の周縁の外形寸法よりも大き 、ことを特徴とする光モジュール。  The casing is formed with a metal thin film on a peripheral upper portion and a side surface in contact with the lid, the lid is formed with a metal thin film on an outer peripheral portion in contact with the casing, and an outer dimension of the lid is a peripheral edge of the casing An optical module characterized in that it is larger than the outer dimensions of
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