WO2006132093A1 - 硬化性樹脂組成物 - Google Patents
硬化性樹脂組成物 Download PDFInfo
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- WO2006132093A1 WO2006132093A1 PCT/JP2006/310467 JP2006310467W WO2006132093A1 WO 2006132093 A1 WO2006132093 A1 WO 2006132093A1 JP 2006310467 W JP2006310467 W JP 2006310467W WO 2006132093 A1 WO2006132093 A1 WO 2006132093A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/36—Hydroxylated esters of higher fatty acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/44—Polycarbonates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/58—Epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1477—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing nitrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Definitions
- the present invention relates to a curable resin composition, and more specifically, includes urethane-modified epoxy resin, block urethane, and a latent curing agent, and has excellent adhesion to a substrate and low cured product.
- the present invention relates to a curable resin composition that can be suitably used as a structural adhesive because it has flexibility in a wide temperature range from a high temperature to a high temperature.
- Structural adhesives are widely used as bonding agents for metal members in a wide range of fields such as automobiles, ships, aviation, space, civil engineering, and construction.
- structural adhesives thermosetting structural adhesives based on epoxy resin and modified with an elastomer are widely used.
- Patent Document 1 proposes an epoxy resin, a blocked isocyanate compound, and a latent curing agent. A curable epoxy block urethane composition is obtained, but this composition has poor adhesion. It is enough.
- Patent Document 2 also discloses a bisphenol-type epoxy resin, a urethane-modified epoxy resin containing a block isocyanate, a carboxyl group-containing butadiene 'acryl-tolyl liquid rubber and a structural adhesive composed of a curing agent.
- An epoxy resin composition has been proposed, but this composition also has poor adhesion.
- Patent Document 3 proposes an epoxy resin-based adhesive composition containing 10% by weight or more of block isocyanate-modified epoxy resin in the total epoxy resin. This composition is also bonded. Insufficient sex.
- Patent Document 1 Japanese Patent Laid-Open No. 5-155973
- Patent Document 2 JP-A-5-148337
- Patent Document 3 Japanese Patent Laid-Open No. 7-41750
- the object of the present invention is to provide excellent curability suitable as a structural adhesive with excellent adhesion to a substrate, wide temperature range from low to high temperature, and excellent flexibility in the temperature range. Decide to provide a rosin composition.
- the present invention provides a curable resin composition
- a curable resin composition comprising (A) a urethane-modified epoxy resin, (B) a block urethane, and (C) a latent curing agent. To do.
- the urethane-modified epoxy resin as component (A) used in the present invention includes (A1) a polyepoxy compound, (A2) (a-1) a polyhydroxyl compound and an excess of (A-2) Polyisocyanate compound strength
- the urethane-modified epoxy resin obtained by reacting polyurethane with an isocyanate (NCO) content of 0.1 to 10% by mass is preferably used.
- Examples of the (A1) polyepoxy compound include polyglycidyl ether compounds of mononuclear polyhydric phenol compounds such as hydroquinone, resorcin, pyropower techol, and phloroglucinol; dihydroxynaphthalene, biphenol, methylene bisphenol (Bisphenol F), methylene bis (orthocresol), ethylidene bisphenol, isopropylidene bisphenol (bisphenol A), isopropylidene bis (orthocresol), tetra Bromobisphenol A, 1,3 bis (4 hydroxycumylbenzene), 1,4 bis (4-hydroxycumylbenzene), 1, 1,3 tris (4 hydroxyphenol) butane, 1, 1, 2 , 2-tetra (4 hydroxyphenol) ethane, thiobisphenol, sulfobisphenol, oxybisphenol, phenol novolak, orthocresol novolak, ethyl phenol novolak, but
- these polyepoxy compounds may be those internally crosslinked by terminal isocyanate prepolymers, or those having a high molecular weight with polyvalent active hydrogen compounds (polyhydric phenol, polyamine, polyphosphoric acid ester, etc.). Yo ...
- the (a-1) polyhydroxy compound used in the (A2) polyurethane includes, for example, polyether polyol, polyester polyol, polycarbonate polyol, polyester amide polyol, acrylic polyol, polyurethane polyol and the like. It is possible.
- polyether polyol an adduct of polyalkylene glycol (molecular weight of about 100 to 5500) of polyhydric alcohol is preferably used.
- polyhydric alcohol examples include aliphatic dihydric alcohols such as ethylene glycol, propylene glycol, 1,4-butylene glycol (tetramethylene glycol), and neopentanda glycol; glycerin, trioxyisobutane, 1 , 2, 3 Butanetriol, 1, 2, 3 Pentanetriol, 2-Methyl-1, 2, 3 Propanetriol, 2-Methyl-2, 3,4 Butanetriol, 2 Ethyl 1, 2, 3 Butanetriol, 2, 3 , 4 Pentanetriol, 2, 3, 4 Hexanetriol, 4 Propyl — 3, 4, 5 Heptanetriol, 2, 4 Dimethyl 2, 3, 4 Pentanetriol, Pentamethylglycerin, Pentaglyserin, 1, 2, 4 Trivalent alcohols such as butanetriol, 1, 2, 4 pentanetriol, trimethylolpropane; erythritol, pentaerythritol 1, 2, 3, 4 pentane
- polyhydric alcohols preferred are polyhydric alcohols, and propylene glycol, 1,4-butylene glycol, and glycerin are particularly preferred.
- the polyether polyol can be produced by adding an alkylene oxide having 2 to 4 carbon atoms to a polyhydric alcohol having a desired molecular weight by a conventional method.
- alkylene oxide having 2 to 4 carbon atoms for example, ethylene oxide, propylene oxide, butylene oxide (tetramethylene oxide) and the like.
- propylene oxide and butylene oxide are preferably used.
- polyester polyol examples include polycarboxylic acids and polyhydric alcohols. Examples thereof include conventionally known polyesters manufactured by Kato, polyesters obtained from ratatas, and the like.
- Examples of powerful polycarboxylic acids include benzenetricarboxylic acid, adipic acid, oxalic acid, suberic acid, sebacic acid, oxalic acid, methyl adipic acid, glutaric acid, pimelic acid, azelaic acid, phthalic acid, terephthalic acid, and isophthalic acid.
- Thiodipropionic acid, maleic acid, fumaric acid, citraconic acid, itaconic acid, or any suitable carboxylic acid similar thereto can be used.
- Examples of powerful polyhydric alcohols include ethylene glycol, propylene glycol, 1,4 butanediol, 1,3 butanediol, 1,5 pentanediol, 1,6-hexanediol, bis (hydroxymethyl chrono) Rehexane), diethylene glycol, 2,2 dimethylpropylene glycol, 1,3,6 hexanetriol, trimethylol bread, pentaerythritol, sorbitol, glycerin or any suitable polyhydric alcohol I can do it.
- polyhydric alcohol besides these, polyhydroxy compounds such as polytetramethylene glycol and poly-force prolataton glycol can also be used.
- polycarbonate polyol examples include those obtained by dephenol reaction of diol and diphenyl carbonate, dealcohol reaction of diol and dialkyl carbonate, or deglycolization reaction of diol and alkylene carbonate.
- Examples of powerful diols include ethylene glycol, 1,2-propylene glycol, 1,3 propylene glycol, 1,2 butanediol, 1,3 butanediol, 1,4 butanediol, 1,5 pentanediol, 1,6-hexanediol, 1,4-cyclohexanediol, 1,4-cyclohexanedimethanol, 1,7 heptane diol, 1,8 octanediol, 1,9-nonanediol, 1,10 decandiol, neopentyl glycol , 3-methyl-1,5 pentanediol, 3,3 dimethylol heptane and the like.
- the (a-2) polyisocyanate compound used in the (A2) polyurethane is, for example, propane-1,2 diisocyanate, 2,3 dimethylbutane-2,3 diisocyanate. 2-methylpentane-1,4 diisocyanate, octane-1,6 diisocyanate, 3,3 dinitropentane 1,5 diisocyanate, octane 1,6 diisocyanate, 1,6 hexamethylene diisocyanate ( HDI), trimethylhexamethylene diisocyanate, lysine diisocyanate, tolylene diisocyanate (TDI), xylylene diisocyanate, metatetramethylxylylene diisocyanate, isophorone diisocyanate (3-isocyanate 1,3- or 1,4-bis (isocyanate methyl) cyclohexane, diphenylmethane 4,4'-diisocyanate (MDI) , Dicyclophorone di
- 1,6 hexamethylene diisocyanate, tolylene diisocyanate, isophorone diisocyanate, and 1,6 hexamethylene diisocyanate are also strong in the isocyanur strength.
- Use at least one selected Power Strong against metal bases ⁇ Preferable because it provides a curable resin composition that exhibits adhesive properties ⁇
- (a-1) polyhydroxy compound and (a-2) polyisocyanate compound (A2) polyurethane can be produced by a conventional method. it can.
- the amount of the component (a-1) and the component (a-2) used is the amount that the component (a-2) is excessive with respect to the component (a-1), specifically, 1)
- the amount of one or more isocyanate groups of (a-2) with respect to one hydroxyl group of the component preferably 1.2 to 5 in amount, particularly preferably 1.5 to 2.5
- the amount is an individual quantity.
- Isoshianeto content obtaining polyurethane is from 0.1 to 10 weight 0/0.
- the isocyanate content of the obtained polyurethane is preferably 1 to 8% by mass.
- reaction temperature for producing the above (A2) polyurethane is usually 40 to 140 ° C, preferably
- the temperature is 60 to 130 ° C.
- known urethane polymerization catalysts such as dioctyltin dilaurate, dibutyltin dilaurate, stannous succinate, stannous octoate, lead octylate, lead naphthenate, zinc octylate, etc.
- tertiary compounds such as metal compounds, triethylenediamine, and triethylamine. It is also possible.
- the production of the (A1) polyepoxy compound and the (A2) urethane-modified epoxy resin can be performed by a conventional method.
- the use amount of the component (A1) and the component (A2) is preferably 50Z50 to 90ZlO, more preferably 65 to 35 to 85 to 25 in terms of mass ratio (the former Z and the latter).
- the reaction temperature for producing the urethane-modified epoxy resin is usually 40 to 140 ° C, preferably 60 to 130 ° C.
- known urethane polymerization catalysts for accelerating the reaction such as dioctyltin dilaurate, dibutyltin dilaurate, stannous succinate, stannous octoate, lead octylate, lead naphthenate, octyl acid
- organic metal compounds such as zinc and tertiary amine compounds such as triethylenediamine and triethylamine.
- the (A) urethane-modified epoxy resin used in the present invention includes, in addition to the urethane-modified epoxy resin obtained by reacting the components (A1) and (A2), a polyepoxy compound. It is possible to use a modified epoxy resin obtained by modifying (for example, those exemplified as the component (A1)) with a polyisocyanate compound (for example, those exemplified as the component (a2)). .
- the block urethane used as the component (B) for use in the present invention includes (Bl) (b-1) polyhydroxy compound and excess (b-2) polyisocyanate compound.
- a block urethane obtained by blocking a polyurethane having a content of 0.1 to 10% by mass with (B2) a blocking agent is preferably used.
- Examples of the (b-1) polyhydroxyl compound include the compounds exemplified as the (a-1) polyhydroxyl compound.
- polyether polyol power such as propylene oxide adduct of glycerin, propylene oxide adduct of castor oil, polytetramethylene glycol, etc. should be used.
- polyether polyol power such as propylene oxide adduct of glycerin, propylene oxide adduct of castor oil, polytetramethylene glycol, etc.
- Examples of the (b-2) polyisocyanate compound include the polyisocyanate compound as exemplified as the (a-2) polyisocyanate compound.
- the (b-2) polyisocyanate compound is selected from the group consisting of 1,6-hexamethylene diisocyanate, tolylene diisocyanate and isophorone diisocyanate. It is preferable to use a curable resin composition that exhibits strong adhesion to a metal substrate.
- (B1) polyurethane from the (b-1) polyhydroxy compound and the (b-2) polyisocyanate compound can be carried out by a conventional method.
- the amount of component (b-1) and component (b-2) used is the amount that component (b-2) is excessive relative to component (b-1).
- the amount of one or more isocyanate groups of (b-2) per one hydroxyl group of the component preferably 1.2 to 5 in amount, particularly preferably 1.5 to 2.5
- the amount is an individual quantity.
- the reaction temperature for producing the (B1) polyurethane is usually 40 to 140 ° C, preferably 60 to 130 ° C.
- known urethane polymerization catalysts such as dioctyltin dilaurate, dibutyltin dilaurate, stannous succinate, stannous octoate, lead octylate, lead naphthenate, zinc octylate, etc.
- Tertiary amine compounds such as metal compounds, triethylenediamine and triethylamine can also be used.
- Examples of the blocking agent (B2) include, for example, active methylene compounds such as malonic acid diester (eg, ethyl malonate), acetylacetone, acetoacetic acid ester (eg, acetoacetic acid ethyl), etc .; Oxime compounds such as oxime (MEK oxime), methyl isobutyrketo oxime (MIBK oxime); methyl alcohol, ethyla norconole, propinoreanoreconole, butinoleanoreconole, heptinoreanoreconole, hexinoreanoreconole, octyl alcohol , 2-ethyl hexyl alcohol, mono-alcohol, stearyl alcohol and other monohydric alcohols or isomers thereof; methyl darconol, ethinoreglycolanol, ethinoresiglycanol, ethin
- blocking agents use one or more dicyclohexamines, diphenols, ⁇ -caplatataton and ⁇ -force prolatatum force as well as a selected group force. I like it because I can definitely get it.
- the blocking reaction for obtaining the ( ⁇ ) block polyurethane from the (B1) polyurethane and the ( ⁇ 2) blocking agent can be carried out by a known reaction method.
- the amount of ( ⁇ ⁇ ⁇ ⁇ 2) blocking agent added is usually 1 to 2 equivalents, preferably 1.05 to 1.5 equivalents, relative to the free isocyanate groups in (B1) polyurethane.
- Block polyurethane can be obtained at any stage of the polymerization of polyurethane by (ii) adding a blocking agent and reacting.
- the blocking agent may be added at the end of a predetermined polymerization, added at the beginning of the polymerization, or partially added at the beginning of the polymerization and the remainder added at the end of the polymerization. Although the method is possible, it is preferably added at the end of the polymerization. In this case, as the measure of the time a given end of the polymerization, Isoshianeto 0/0 (for example, "Polyurethane" ⁇ shop, 1960 issue, can be measured by the method of the 21 pages described) may be referenced to.
- the reaction temperature for adding the blocking agent is usually 50 to 150 ° C, preferably 60 to 120 ° C.
- the reaction time is usually about 1-7 hours.
- the known urethane polymerization catalyst described above can be added to accelerate the reaction. Add any amount of plasticizer to the reaction.
- the (B) block urethane used in the present invention includes, in addition to the above block urethane obtained by reacting the components (B1) and (B2), a polyisocyanate compound (for example, , (A2), those exemplified as the component, especially isocyanuric form) are blocked with a blocking agent (for example, (B2) component It is also possible to use a block isocyanate obtained by modification with those exemplified in the above.
- a polyisocyanate compound for example, (A2), those exemplified as the component, especially isocyanuric form
- a blocking agent for example, (B2) component
- modified polyamine examples include epoxy-modified products, amidation-modified products, and Mannich-modified products of polyamines.
- polyamines used in the modified polyamine include, for example, ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, 1,2-diaminobutane bread, polyoxypropylenediamine, polyoxy Aliphatic polyamines such as propylene triamine; isophorone diamine, mensendiamine, bis (4 amino-3-methyldicyclohexyl) methane, diaminodicyclohexylmethane, bis (aminomethyl) cyclohexane, N-aminoethylpiperazine 3, 9 Bis (3aminopropyl) 1, 2, 8, 8, 10-Tetraoxaspiro (5.5) Uncyclodecane and other alicyclic polyamines; m-phene-diamine, p-phene-diamine, tolylene 2,4-diamine , Tolylene 2,6 Diamine, Mesitylene 2, 4 — Diamine, Mesitylene 2,6
- the epoxy addition-modified product includes the above polyamines, glycidyl ethers such as phenol glycidyl ether, butyral dicidyl ether, bisphenol A-diglycidyl ether, bisphenol F diglycidyl ether, or carboxylic acid. It is produced by reacting various types of epoxy resin such as glycidyl ester with conventional methods. be able to.
- the amido-modified product can be produced by reacting the polyamines with carboxylic acids such as adipic acid, sebacic acid, phthalic acid, isophthalic acid, and dimer acid by a conventional method.
- carboxylic acids such as adipic acid, sebacic acid, phthalic acid, isophthalic acid, and dimer acid
- the Mannich modified product includes the polyamines, aldehydes such as formaldehyde, and at least one aldehyde-reactive site in the nucleus such as phenol, cresol, xylenol, tert-butylphenol, and resorcin. It can be produced by reacting with a phenol having a odor by a conventional method.
- hydrazides examples include oxalic acid dihydrazide, malonic acid dihydrazide, succinic acid dihydrazide, glutaric acid dihydrazide, adipic acid dihydrazide, suberic acid dihydrazide, azelaic acid dihydrazide, sebacic acid dihydrazide, and the like. It is done.
- ureas examples include 3- (3,4-dichlorophenol) -1,1,1-dimethylurea, isophorone diisocyanate-dimethylurea, tolylene diisocyanate-dimethylurea, and the like.
- dicyandiamide together with a modified polyamine using imidazoles as polyamines (that is, modified imidazoles) and one or more selected from the group power of ureas.
- imidazoles that is, modified imidazoles
- group power of ureas that is, modified imidazoles
- the use ratio of the dicyandiamide to the modified imidazoles and Z or ureas is preferably 9Zl to 7Z3 on a mass basis.
- the curable resin composition of the present invention contains the component (A), the component (B) and the component (C).
- the amount of these components used is preferably 10 to the component (A). 95% by mass, particularly preferably 20 to 80% by mass, component (B) is preferably 4 to 89% by mass, particularly preferably 10 to 50% by mass, and component (C) is preferably 1 to 30%. % By mass, particularly preferably 3 to 20% by mass. If it exceeds the above range, curability may be lowered or satisfactory physical properties may not be obtained.
- the curable resin composition of the present invention requires additives that can be used in conventional curable resin compositions. Depending on the situation, it may be added as appropriate!
- the curable resin composition of the present invention has excellent flexibility in a wide range from low temperature to high temperature. Therefore, in a wide range of fields such as automobiles, ships, aviation, space, civil engineering, and construction fields, it can be suitably used as a structural adhesive used for joining metal members, etc. It can be suitably used as an adhesive for use. Further, the curable resin composition of the present invention can be used for various paints, various adhesives, various molded products and the like in addition to the structural adhesive.
- Ade force polyether G-3000 (manufactured by Asahi Denka Kogyo Co., Ltd .; polypropylene glycol glyceryl ether) was degassed under reduced pressure for 1 hour at 100 to 110 ° C. and 30 mmHg or less. After cooling this to 60 ° C, add 174 parts by mass of tolylene diisocyanate and react at 90-100 ° C for 3 hours under a nitrogen stream. The NCO content should be 3.6% by mass. After confirming the reaction, the reaction was completed to obtain a urethane prepolymer.
- Adeka Resin EP-4100E (Asahi Denka Kogyo Co., Ltd .; bisphenol type epoxy resin, epoxy equivalent 190), 2800 parts by mass of the urethane prepolymer obtained above, and dioctyltin dilaurate 0.075 parts by mass And reacted at 80 to 90 ° C for 2 hours.
- Ade force polyether G-1500 (Asahi Denki Kogyo Co., Ltd .; polypropylene glycol glyceryl ether) 500 parts by mass was degassed under reduced pressure at 100 to 110 ° C. and 30 mmHg or less for 1 hour. After cooling to 60 ° C, 221 parts by weight of isophorone diisocyanate and 0.075 part by weight of dioctyltin dilaurate were added, and the mixture was reacted for 90 hours at 90 to LOO ° C under a nitrogen stream. After confirming that the NCO content was 5.9% by mass, the reaction was terminated to obtain a urethane prepolymer.
- Positive mass methylene glycolate (average molecular weight 2000) 1000 mass% was degassed under reduced pressure at 100-: L 10 o C, 3 OmmHg or less for 1 hour. After cooling to 60 ° C, 221 parts by mass of isophorone diisocyanate and 0.025 part by mass of dioctyltin dilaurate were added and reacted at 90-100 ° C for 3 hours under a nitrogen stream to contain NCO. After confirming that the amount was 3.6% by mass, the reaction was completed to obtain a urethane prepolymer.
- Adeka Resin EP-4100E (Asahi Denka Kogyo Co., Ltd .; bisphenol type epoxy resin, epoxy equivalent 190), 2800 parts by mass of the urethane prepolymer obtained above, and dioctyltin dilaurate 0.075 parts by mass And reacted at 80 to 90 ° C for 2 hours.
- Adeka Resin EP-4100E (Asahi Denka Kogyo Co., Ltd .; bisphenol type epoxy resin, epoxy equivalent 190), 2800 parts by mass of the urethane prepolymer obtained above, and dioctyltin dilaurate 0.075 parts by mass And reacted at 80 to 90 ° C for 2 hours.
- P-2010 manufactured by Kuraray Co., Ltd .; polyester polyol 1000 parts by mass, 100-110. C, deaerated under reduced pressure at 30 mmHg or less for 1 hour. After cooling to 60 ° C, 221 parts by mass of isophorone diisocyanate and 0.025 part by mass of dioctyltin dilaurate were added and reacted at 90-100 ° C for 3 hours under a nitrogen stream to contain NCO. After confirming that the amount was 3.6% by mass, the reaction was completed to obtain a urethane prepolymer.
- Adeka Resin EP-4100E (Asahi Denka Kogyo Co., Ltd .; bisphenol type epoxy resin, epoxy equivalent 190), 2800 parts by mass of the urethane prepolymer obtained above, and dioctyltin dilaurate 0.075 parts by mass And reacted at 80 to 90 ° C for 2 hours.
- URICH-57 (Ito Oil Co., Ltd .; castor oil propylene oxide adduct) 560 parts by mass were degassed under reduced pressure at 100 to 110 ° C. under 30 mmHg for 1 hour. After cooling to 60 ° C, 221 parts by mass of isophorone diisocyanate and 0.075 parts by mass of dioctyltin dilaurate were added and reacted at 90-100 ° C for 3 hours under a nitrogen stream. Content is 5.4 mass After confirming that the content was%, the reaction was completed to obtain a urethane prepolymer.
- Adeka Resin EP-4100E (Asahi Denka Kogyo Co., Ltd .; bisphenol-type epoxy resin, epoxy equivalent 190) Add 2580 parts by mass of 580 parts by mass of acrylic-tolyl butadiene rubber and add 5 to 130-150 ° C. Reacted for hours.
- the curable resin composition comprising the rubber-modified epoxy resin and the latent curing agent is inferior in flexibility (Comparative Example 3).
- a curable resin composition comprising a urethane-modified epoxy resin and a latent curing agent has improved flexibility at around room temperature, but is inferior in flexibility at low temperatures (Comparative Examples 1 and 2). ).
- a curable resin composition comprising a urethane-modified epoxy resin, a block urethane, and a latent curing agent is excellent in flexibility in a wide range of low temperature power and high temperature and in a wide temperature range. (Examples 1 to 7).
- the curable resin composition of the present invention is excellent in adhesion to various substrates, and the cured product has flexibility in a wide temperature range from low temperature to high temperature. In particular, it can be suitably used as an adhesive for automobile structures.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Polyurethanes Or Polyureas (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2007520058A JP5258290B2 (ja) | 2005-06-09 | 2006-05-25 | 硬化性樹脂組成物 |
KR1020077028241A KR101246153B1 (ko) | 2005-06-09 | 2006-05-25 | 경화성 수지 조성물 |
US11/921,900 US20090131605A1 (en) | 2005-06-09 | 2006-05-25 | Hardenable resin composition |
EP06746846.2A EP1900774B2 (en) | 2005-06-09 | 2006-05-25 | Hardenable resin composition |
CN2006800204765A CN101193975B (zh) | 2005-06-09 | 2006-05-25 | 固化性树脂组合物 |
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JP2005169130 | 2005-06-09 | ||
JP2005-169130 | 2005-06-09 |
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WO2006132093A1 true WO2006132093A1 (ja) | 2006-12-14 |
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ID=37498296
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PCT/JP2006/310467 WO2006132093A1 (ja) | 2005-06-09 | 2006-05-25 | 硬化性樹脂組成物 |
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---|---|
US (1) | US20090131605A1 (ja) |
EP (1) | EP1900774B2 (ja) |
JP (1) | JP5258290B2 (ja) |
KR (1) | KR101246153B1 (ja) |
CN (1) | CN101193975B (ja) |
WO (1) | WO2006132093A1 (ja) |
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JP2008239890A (ja) * | 2007-03-28 | 2008-10-09 | Adeka Corp | 硬化性樹脂組成物及びそれを含有してなる自動車構造用接着剤 |
JP2011506283A (ja) * | 2007-12-06 | 2011-03-03 | ビーエーエスエフ ソシエタス・ヨーロピア | アロファネート基含有ポリイソシアネート |
JP2011517721A (ja) * | 2008-04-16 | 2011-06-16 | シーカ・テクノロジー・アーゲー | 両親媒性ブロックコポリマーをベースとするポリウレタンポリマーおよび衝撃靱性改良剤としてのその使用 |
JP2017226717A (ja) * | 2016-06-20 | 2017-12-28 | Dic株式会社 | ポリカーボネート変性エポキシ樹脂及び接着剤 |
KR20190035688A (ko) | 2016-07-29 | 2019-04-03 | 가부시키가이샤 아데카 | 경화성 수지 조성물, 및 그 조성물을 이용한 구조 재료 접합용 접착제 |
WO2021060226A1 (ja) * | 2019-09-27 | 2021-04-01 | 日鉄ケミカル&マテリアル株式会社 | エポキシ樹脂組成物および硬化物 |
US20220290018A1 (en) * | 2018-04-27 | 2022-09-15 | Kaneka Corporation | Adhesion method employing polymer microparticle-containing curable resin composition having excellent workability, and laminate obtained using said adhesion method |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008239890A (ja) * | 2007-03-28 | 2008-10-09 | Adeka Corp | 硬化性樹脂組成物及びそれを含有してなる自動車構造用接着剤 |
JP2011506283A (ja) * | 2007-12-06 | 2011-03-03 | ビーエーエスエフ ソシエタス・ヨーロピア | アロファネート基含有ポリイソシアネート |
JP2011517721A (ja) * | 2008-04-16 | 2011-06-16 | シーカ・テクノロジー・アーゲー | 両親媒性ブロックコポリマーをベースとするポリウレタンポリマーおよび衝撃靱性改良剤としてのその使用 |
JP2017226717A (ja) * | 2016-06-20 | 2017-12-28 | Dic株式会社 | ポリカーボネート変性エポキシ樹脂及び接着剤 |
KR20190035688A (ko) | 2016-07-29 | 2019-04-03 | 가부시키가이샤 아데카 | 경화성 수지 조성물, 및 그 조성물을 이용한 구조 재료 접합용 접착제 |
US11208579B2 (en) | 2016-07-29 | 2021-12-28 | Adeka Corporation | Curable resin composition and adhesive for bonding structural material using composition |
US20220290018A1 (en) * | 2018-04-27 | 2022-09-15 | Kaneka Corporation | Adhesion method employing polymer microparticle-containing curable resin composition having excellent workability, and laminate obtained using said adhesion method |
US11781047B2 (en) * | 2018-04-27 | 2023-10-10 | Kaneka Corporation | Adhesion method employing polymer microparticle-containing curable resin composition having excellent workability, and laminate obtained using said adhesion method |
WO2021060226A1 (ja) * | 2019-09-27 | 2021-04-01 | 日鉄ケミカル&マテリアル株式会社 | エポキシ樹脂組成物および硬化物 |
Also Published As
Publication number | Publication date |
---|---|
CN101193975A (zh) | 2008-06-04 |
US20090131605A1 (en) | 2009-05-21 |
KR20080013991A (ko) | 2008-02-13 |
CN101193975B (zh) | 2011-01-12 |
JPWO2006132093A1 (ja) | 2009-01-08 |
KR101246153B1 (ko) | 2013-03-20 |
JP5258290B2 (ja) | 2013-08-07 |
EP1900774A1 (en) | 2008-03-19 |
EP1900774B2 (en) | 2017-07-19 |
EP1900774A4 (en) | 2012-01-11 |
EP1900774B1 (en) | 2012-10-31 |
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