Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
  • H01G2/02—Mountings
  • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
  • H01G11/10—Multiple hybrid or EDL capacitors, e.g. arrays or modules
  • H01G11/12—Stacked hybrid or EDL capacitors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
  • H01G11/74—Terminals, e.g. extensions of current collectors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
  • H01G11/78—Cases; Housings; Encapsulations; Mountings
  • H01G11/82—Fixing or assembling a capacitive element in a housing, e.g. mounting electrodes, current collectors or terminals in containers or encapsulations
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
  • Y02E60/13—Energy storage using capacitors

Definitions

• the present invention relates to an electric double layer capacitor device comprising a cell group in which a plurality of electric double layer capacitor cells are stacked and arranged.
• Electric double layer capacitor devices are used as various power sources.
• the output voltage (withstand voltage) of one electric double layer capacitor cell (hereinafter referred to as “capacitor cell” as appropriate) itself is as low as several volts. Therefore, a cell group in which a plurality of capacitor cells are stacked is manufactured as a unit. In each capacitor cell, an electric double layer capacitor is formed in an aluminum laminate bag, and a pair of electrode plates is provided on the top.
• the cell group a plurality of capacitor cells are connected in series to obtain a desired voltage. Therefore, the electrode plates of the capacitor cells are sequentially connected to the electrode plates of the adjacent capacitor cells.
• charging / discharging of the cell group of the electric double layer capacitor device is basically performed by using electrodes at both ends of the cell group in which the electric double layer capacitor cells are connected in series.
• the charge / discharge state is not uniform in each capacitor cell.
• connection method using a cable is complicated and takes time.
• a space for bundling cables is necessary, which causes a problem that the apparatus becomes large.
• the present invention provides an electric double layer capacitor device including a cell group in which a plurality of electric double layer capacitor cells are stacked and a circuit board electrically connected to each electric double layer capacitor cell of the cell group.
• Each of the electric double layer capacitor cells includes an electrode plate formed by projecting an end force thereof and connected to a pair of electrodes of the electric double layer capacitor cell, and the plurality of electric double layer capacitor cells include: Adjacent electrode plates are connected in series or in parallel by appropriate connection, and the connection parts of the electrode plates of two adjacent electric double layer capacitor cells protrude from the connection piece, which is connected to the connection piece. It is connected to a circuit board.
• connection piece is a metal wire or plate.
• connection between two electrode plates adjacent to each other in the electric double layer capacitor cell is performed by ultrasonic welding.
• connection piece is bendable.
• connection piece is fixed on the surface of the electrode plate from the outside.
• connection piece is attached to another plate material, and the plate material is fixed to the electrode plate.
• the connecting piece is fixed to one end side of the plate material, and the other end side of the plate material is fixed to the electrode plate, so that the other end side of the plate material is movable with respect to the electrode plate.
• the connecting piece is fixed to one end side of the plate material, and the other end side of the plate material is fixed to the electrode plate, so that the other end side of the plate material is movable with respect to the electrode plate.
• connection piece is sandwiched and fixed between the two electrode plates.
• connection piece is protruded from the electrode plate, and the connection to the circuit board is performed using the connection piece.
• workability can be improved, and the size and weight can be reduced.
• FIG. 1 is a diagram showing a configuration of an embodiment.
• FIG. 2 is a diagram showing an example of a connection piece attached state.
• FIG. 3 is a diagram showing an example of a connection piece attached state.
• FIG. 4 is a diagram showing an example of a connection piece attached state.
• FIG. 5 is a diagram showing an example of a connection piece attached state.
• FIG. 6 is a diagram showing an example of a connection piece attached state.
• FIG. 7 is a diagram showing an example of a connection piece attached state.
• FIG. 8 is a diagram showing an example of a connection piece attached state.
• FIG. 9 is a diagram showing an example of a connection piece attached state.
• FIG. 10 is a view showing an example of a state in which a connection piece is attached to a connection copper plate.
• FIG. 11 is a diagram showing an example of a state in which a connection piece is attached to a connection copper plate.
• FIG. 12 is a diagram showing an example of a state in which a connection piece is attached to a connection copper plate.
• FIG. 13 is a diagram showing an example of a connection piece attached state.
• FIG. 14 is a diagram showing an example of a connection piece attached state.
• FIG. 15 is a diagram showing an example of a connection piece attached state.
• FIG. 16 is a diagram showing an example of a connection piece attached state.
• FIG. 17 is a view showing the movement of the connecting piece of FIG.
• FIG. 18 is a diagram showing the movement of the connection piece of FIG.
• FIG. 19 is a diagram showing the shape of a circuit board.
• FIG. 1 is a diagram showing a configuration of an electric double layer capacitor device according to an embodiment.
• the main body 10a has a thin rectangular parallelepiped shape with a main body 10a, and an upper portion that is closed in a mountain shape and has a plate shape as a whole. Then, a pair of aluminum or copper (or copper alloy) electrode plates 10b are formed so as to protrude from the plate-like upper end of the main body 10a.
• the main body 10a is composed of a multilayer sheet, and an electric double layer capacitor made of an activated carbon electrode, a separator, an electrolytic solution, and the like is accommodated therein.
• One electrode plate 10b of the capacitor cell 10 is connected to one electrode plate 10b of the adjacent capacitor cell 10.
• the two electrode plates 10b to be connected are bent so that they are close to each other, and are ultrasonically welded at the portion where they are overlapped. It may be connected by other means such as laser welding, resistance welding or soldering.
• the other electrode plate 10b of the capacitor cell 10 is connected to the electrode plate 10b of the adjacent capacitor cell 10 on the opposite side, and a plurality of stacked capacitor cells 10 are connected in series. Depending on the application, a plurality of capacitor cells 10 may be connected in parallel. Although not shown in the drawing, the electrode plate 10b is not connected to the electrode plate 10b of the capacitor cell 10 adjacent to the capacitor cell 10 at both ends, and the electrode plate 10b serves as both end electrodes of the cell group.
• Each electrode plate 10b is provided with a metal connection piece 20 that can stand upright, and the connection piece 20 also projects the upper end force of the electrode plate 10b.
• the connection piece 20 has a round bar shape, but can have various shapes such as a thin plate shape.
• connection piece 20 is connected by soldering or the like through a hole provided in the circuit board 30 disposed above the cell group of the capacitor cell 10 with a lower force.
• the connecting piece 20 can be easily deformed, and after being aligned with a hole provided in the circuit board 30 and passing therethrough, it is soldered to a copper pattern on the upper surface of the circuit board. It is also preferable to bend the front end of the connection piece 20 and solder it to the pattern on the circuit board 30.
• a rubber sheet between the capacitor cells 10 so as to laminate a plurality of capacitor cells 10.
• This rubber sheet can be made of silicon, EPDM, EPM (ethylene 'propylene rubber), NBR (-tril rubber), CR (chloroprene rubber), etc. Is preferred.
• connection piece 20 shows various examples of attachment of the connection piece 20.
• the lower portion of the connection piece 20 is soldered to the upper end portion of the electrode plate 10b, and the upper end force of the electrode plate 10b also protrudes from the upper portion of the connection piece 20.
• the connection piece 20 is bent in an L shape, and is soldered to the upper part of the electrode plate 10b so that one side thereof is parallel to the upper end of the electrode plate 10b. Therefore, the other side of the connection piece 20 also projects the upper end force of the electrode plate 10b.
• the welding is preferably ultrasonic welding, but may be laser welding, resistance welding, or the like.
• connection piece 20 is welded to the upper end of the electrode plate 10b, and the upper part of the connection piece 20 protrudes from the upper end of the electrode plate 10b.
• This welding may also be force laser welding, resistance welding, etc. for which ultrasonic welding is suitable.
• the two electrode plates 10b can be welded together.
• the connecting piece 20 is bent in an L shape and is welded to the upper part of the electrode plate 10b so that one side thereof is parallel to the upper end of the electrode plate 10b.
• connection piece 20 is inserted between the two electrode plates 10b.
• the connection piece 20 is fixed to the electrode plate 10b by welding the two electrode plates 10b including the portion where the connection piece 20 is inserted.
• connection piece 20 is bent in an L-shape, and one side of the connection piece 20 is inserted between the two electrode plates 10b so as to be parallel to the upper end from the side portion. 20 is welded.
• connection piece 20 is soldered to the connection copper plate 22, and the connection copper plate 22 is welded to the electrode plate 10 b.
• the connecting plate may be any plate that can be soldered to the connecting piece 20.
• ultrasonic welding is suitable for this welding, but laser welding, resistance welding, and the like may be used.
• the two electrode plates 10b can be welded at the same time for the bonding portion of the two electrode plates 10b.
• the connecting copper plate 22 is usually made of copper or a copper alloy.
• the connection piece 20 is bent in an L shape, and one side thereof is soldered to the connection copper plate 22.
• FIGS. 10, 11 and 12 show an example of how to connect the connection piece 20 to the connection copper plate 22.
• a material that can be welded to the electrode plate 10b (connecting copper plate 22) and the connecting piece 20 are welded in advance, and this is connected to the electrode plate 10b. Weld to b.
• the end of the connection copper plate 22 is rounded, the connection piece 20 is wound around this portion, and this portion is welded to fix the connection piece 20 to the connection copper plate 22.
• FIG. 10 shows an example of how to connect the connection piece 20 to the connection copper plate 22.
• the connecting piece 20 is L-shaped, and one side of the connecting piece 20 is positioned on the connecting copper plate 22, and this portion is covered with the extended portion 22a of the connecting copper plate 22, and these are welded for connection.
• the connecting piece 20 is fixed to the copper plate 22 by welding.
• FIG. 12 shows a connecting portion 22a that is formed by extending a part of the long side of the connecting copper plate 22 upward, and a connecting piece on the connecting portion 22a so as to be substantially parallel to the long side of the connecting copper plate 22.
• One end of 20 is positioned, this connecting portion 22a is wound, this portion is welded, and the connecting piece 20 is fixed to the connecting copper plate 22.
• Ultrasonic welding is suitable for fixing in FIGS. 10 to 12, but laser welding, resistance welding, soldering, and force squeezing are also possible.
• FIGS. 13 and 14 show an example in which the connection copper plate 22 of FIG. 12 is fixed to the electrode plate 10b.
• the elongated portion of the connecting copper plate 22 is welded and fixed to the electrode plate 10 b, and the other end fixed to the connecting copper plate 22 of the connecting piece 20 is bent upward to form an L shape. At this time, it may be bent into an L shape before welding.
• This welding is preferably ultrasonic welding, but may be laser welding or resistance welding.
• the two electrode plates 10b can be welded together.
• the connecting copper plate 22 may be fixed to the electrode plate 1 Ob by soldering.
• both ends of the connecting copper plate 22 are also wrapped with the side force of the electrode plate 10b and fixed, thereby facilitating positioning and improving workability.
• FIG. 14 shows an example in which the connection portion 22a to which one end of the connection copper plate 22 and the connection piece 20 is fixed is bent so as to overlap the connection copper plate 22.
• the connecting piece 20 is mainly movable.
• the connecting copper plate 22 can be fixed to the entire width of the electrode plate 10b, and the fixing range is widened, so that the contact resistance value can be lowered and the reliability of the cell is improved.
• FIGS. 15 and 16 show examples in which the connecting copper plate 22 of FIGS. 10 and 11 is fixed to the electrode plate 10b.
• the connecting copper plate 22 is elongated, and the connecting piece 20 is fixed to one end thereof. Then, only the side of the connection copper plate 22 where the connection piece 20 is not attached is welded and fixed to the electrode plate 10b.
• This welding is preferably ultrasonic welding, but may be laser welding, resistance welding, or the like.
• the two electrode plates 10b can be welded together.
• the connecting copper plate 22 may be fixed to the electrode plate 10b by soldering. Therefore, the connection of the connection copper plate 22 The side to which the connecting piece 20 is attached becomes a free end and is movable.
• connection piece 20 By making it possible to move both the connection piece 20 and the connection copper plate 22 and the connection piece 20, the upper end of the connection piece 20 can be easily positioned, and the upper end of the connection piece 20 Fixing to the circuit board 30 becomes easy. That is, in FIGS. 2 to 9, 13, and 14, the connecting piece 20 can be moved mainly, and in FIGS. 17 and 18, the connecting copper plate 2 2 that is only connected to the connecting piece 20 can be moved. The position of the upper end of the connection piece 20 can be adjusted freely.
• FIG. 19 shows another example of the circuit board 30.
• the circuit board 30 is not provided with a hole, but an arc-shaped cutout 32 is provided on the side of the circuit board 30. Therefore, the upper end portion of the connection piece 20 can be easily soldered to the conductive pad on the circuit board 30 by passing through the notch 32 and bending it upright or inward. In this example, the work becomes easier than the method in which a hole is formed in the circuit board 30 and the connection piece 20 is passed therethrough.

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• Engineering & Computer Science (AREA)
• Power Engineering (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Connection Of Batteries Or Terminals (AREA)
• Electric Double-Layer Capacitors Or The Like (AREA)

Priority Applications (3)

Applications Claiming Priority (2)

Publications (1)

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ID=37023860

Family Applications (1)

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Families Citing this family (5)

Citations (4)

Family Cites Families (8)

• 2005
  • 2005-03-24 JP JP2005087191A patent/JP2006269830A/ja not_active Ceased
• 2006
  • 2006-03-24 CN CN2006800094873A patent/CN101147218B/zh not_active Expired - Fee Related
  • 2006-03-24 WO PCT/JP2006/306019 patent/WO2006101208A1/ja not_active Ceased
  • 2006-03-24 US US11/909,576 patent/US7733630B2/en not_active Expired - Fee Related
  • 2006-03-24 EP EP06729967A patent/EP1883084A1/en not_active Withdrawn

Patent Citations (4)

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