WO2006075500A1 - Échangeur inorganique d'anions constitué d'un composé de l'yttrium et composition de résine pour l'enrobage d'un composant électronique laquelle utilise celui-ci - Google Patents

Échangeur inorganique d'anions constitué d'un composé de l'yttrium et composition de résine pour l'enrobage d'un composant électronique laquelle utilise celui-ci Download PDF

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Publication number
WO2006075500A1
WO2006075500A1 PCT/JP2005/023583 JP2005023583W WO2006075500A1 WO 2006075500 A1 WO2006075500 A1 WO 2006075500A1 JP 2005023583 W JP2005023583 W JP 2005023583W WO 2006075500 A1 WO2006075500 A1 WO 2006075500A1
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WIPO (PCT)
Prior art keywords
compound
anion exchanger
resin
inorganic anion
inorganic
Prior art date
Application number
PCT/JP2005/023583
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English (en)
Japanese (ja)
Inventor
Yasuharu Ono
Original Assignee
Toagosei Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toagosei Co., Ltd. filed Critical Toagosei Co., Ltd.
Priority to JP2006552877A priority Critical patent/JP5176323B2/ja
Publication of WO2006075500A1 publication Critical patent/WO2006075500A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J41/00—Anion exchange; Use of material as anion exchangers; Treatment of material for improving the anion exchange properties
    • B01J41/08—Use of material as anion exchangers; Treatment of material for improving the anion exchange properties
    • B01J41/10—Inorganic material
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/20—Compounds containing only rare earth metals as the metal element
    • C01F17/276—Nitrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • Inorganic anion exchanger made of yttrium compound and resin composition for encapsulating electronic components using the same
  • the present invention relates to an inorganic anion exchanger, and more particularly to an inorganic anion exchanger suitably used for a resin composition for encapsulating electronic components. Furthermore, the present invention relates to a resin composition for encapsulating electronic components containing the inorganic anion exchanger, a resin obtained by curing the resin composition, and an electronic component obtained by sealing an element with the composition. In addition, the present invention relates to a cornice, an adhesive and a paste containing the inorganic anion exchanger, and a product containing them.
  • Conventional inorganic anion exchangers include, for example, hydrated talcite, hydrous bismuth, hydrous magnesium oxide, hydrous aluminum oxide, and the like.
  • inorganic anion exchangers are blended in resins for encapsulating electronic components, resins for encapsulating electrical components, resins for electrical products, and the like.
  • LSIs, ICs, hybrid ICs, transistors, diodes, and thyristors are mostly sealed with epoxy resin.
  • Such an electronic component sealing material suppresses defects caused by ionic impurities in raw materials or moisture entering from the outside, as well as flame retardancy, high adhesion, crack resistance and high volume resistivity.
  • Various characteristics such as electrical characteristics are required.
  • Epoxy resins that are frequently used as encapsulants for electronic parts include epoxy compounds, which are the main components, as well as epoxy compound curing agents, curing accelerators, inorganic fillers, flame retardants, pigments, and silane coupling agents. Etc.
  • this compound already has anions such as hydroxide ions and carbonate ions as anions, the anion exchange performance is not sufficient.
  • an anion exchanger generally adsorbs anions well when the surrounding environment is acidic, but hardly adsorbs anions near neutral or alkaline. Depending on the additive added to the sealing material, the pH of the resin composition may be near neutral, and the effect of the anion exchanger may not be fully exhibited. [0009] As a countermeasure against this, a method has been proposed in which an anion exchanger is mixed with a cation exchanger, which is a solid acid, to lower the apparent pH and improve ion exchange (for example, patent documents). 8). However, when a solid acid is added to the resin, it can damage the resin properties. In addition, since many cation exchangers contain heavy metals, cation exchangers may not be used together due to environmental considerations.
  • an aramid fiber contains an epoxy resin or a polyphenylene oxide resin and an ion scavenger.
  • the ion scavenger include an ion exchange resin and an inorganic ion exchanger.
  • an antimony-bismuth-based material and a dinoleconium-based material are described (for example, see Patent Document 10). ).
  • An insulating varnish containing an ion scavenger is known, and a multilayer printed wiring board is produced using this insulating varnish.
  • ion scavenger examples include activated carbon, zeolite, silica gel, activated alumina, activated clay, hydrated antimony pentoxide, zirconium phosphate, and hydrated talcite (for example, patent documents). 11).
  • an inorganic ion adsorbent is blended in an adhesive film for a multilayer wiring board.
  • the inorganic ion adsorbent include activated carbon, zeolite, silica gel, activated alumina, activated clay, hydrated antimony pentoxide, dinoleconium phosphate, and hydrated talcite (see, for example, Patent Document 12).
  • An epoxy resin adhesive containing an ion trapping agent is known.
  • the ion trapping agent include an anion exchanger and a cation exchanger (see, for example, Patent Document 13).
  • a conductive epoxy resin paste containing an ion scavenger and silver powder is known.
  • the ion scavenger include hydrated bismuth nitrate, magnesium aluminum hydride talcite, and antimony oxide (see, for example, Patent Document 14).
  • ion exchangers' ion scavengers described in these documents, there are those which describe the use of hydrated talcite, but these are used as they are or as calcined bodies.
  • anodic talcite and hydrous bismuth oxide are used in various applications because they have high anion exchange properties and relatively high chemical resistance and heat resistance. For example, it is used for the purpose of improving the reliability of semiconductor components by mixing it with semiconductor sealing resin in the electronics industry.
  • Hyde mouth talcite is highly soluble under high temperature and high humidity such as hot water of 100 ° C or higher.
  • range of use is limited because it is highly hygroscopic and adversely affects the properties of the sealing resin.
  • bismuth compounds such as hydrated hydrous bismuth have excellent performance and can be used in a wide range.
  • copper and alloys can be easily produced, and their use may be limited in terms of recycling.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 63-252451
  • Patent Document 2 Japanese Patent Application Laid-Open No. 64-64243
  • Patent Document 3 JP-A-60-40124
  • Patent Document 4 JP-A-60-42418
  • Patent Document 5 Japanese Patent Laid-Open No. 63-060112
  • Patent Document 6 Japanese Patent Laid-Open No. 02-293325
  • Patent Document 7 Japanese Patent Laid-Open No. 02-294354
  • Patent Document 8 JP-A-60-23901
  • Patent Document 9 Japanese Patent Laid-Open No. 05-140419
  • Patent Document 10 Japanese Patent Application Laid-Open No. 09-314758
  • Patent Document 11 JP-A-10-287830
  • Patent Document 12 JP-A-10-330696
  • Patent Document 13 Japanese Patent Application Laid-Open No. 10-013011
  • Patent Document 14 Japanese Patent Laid-Open No. 10-007763
  • x, y, and z are 0 or a positive number
  • 2x + y + z 6
  • n is 0 or a positive number
  • Another aspect of the present invention is an electronic component sealing resin composition containing the inorganic anion exchanger of the present invention, which contains an inorganic cation exchanger as an optional component.
  • Yet another aspect of the present invention is the above-described resin composition for encapsulating electronic components, which contains an epoxy resin and a curing agent.
  • Another aspect of the present invention is a resin obtained by curing the resin composition for sealing an electronic component described above.
  • Another aspect of the present invention is an electronic component obtained by sealing an element with the above-described electronic component sealing resin composition.
  • Another aspect of the present invention is a varnish, adhesive or paste containing the inorganic anion exchanger of the present invention, which may contain an inorganic cation exchanger.
  • Yet another aspect of the present invention is a product containing the varnish, adhesive or paste described above.
  • a new inorganic anion exchanger that is environmentally friendly and has high performance can be provided.
  • an electronic component sealing resin composition it is possible to provide an electronic component sealing resin composition, an electronic component sealing resin, and an electronic component using the inorganic anion exchanger.
  • the varnish using the said inorganic anion exchanger, an adhesive agent, a base, and the product containing these can be provided.
  • the inorganic anion exchanger of the present invention is an inorganic anion exchanger composed of the yttrium compound represented by the above formula (1), it is environmentally friendly and has high performance. This is preferable because it can be suitably used in applications where site-based anion exchangers, bismuth-based anion exchangers, and the like cannot be used.
  • the yttrium compound in the present invention is represented by the above formula (1).
  • X in formula (1) is 0 or a positive number of 3 or less, preferably a positive number of 3 or less, more preferably a positive number of 2.5 or less.
  • Y in formula (1) is a positive number of 0 or 6 or less, preferably 0 or 5.5 or less, more preferably 5 or less.
  • Z in the formula (1) is a positive number of 0 or 6 or less, preferably 0 or a positive number of 4 or less, more preferably a positive number of 3 or less.
  • yttrium compounds in the present invention include Y (OH) (NO) ⁇ ⁇ 0, Y
  • the raw material for obtaining the yttrium compound in the present invention any raw material can be used as long as it is obtained by the formula (1) and has anion exchange properties.
  • the yttrium compound in the present invention can be obtained by adjusting the aqueous solution of yttrium nitrate to basic to produce a precipitate, which is dried and then heated.
  • yttrium oxide of the present invention can be obtained by solubilizing yttrium oxide with nitric acid and subjecting it to the treatment described above.
  • the yttrium compound in the present invention can be obtained, for example, by adjusting the aqueous solution of yttrium nitrate to basic to produce a precipitate, which is dried and then heated.
  • the pH is preferably pH 7.5 to 12 force S, more preferably pH 8 to 11 force S, and more preferably 8.5 to 10 force.
  • the water temperature when this treatment is performed is preferably:! To 80 ° C force S, more preferably 10 to 60 ° C force S, and further preferably 15 to 40 ° C.
  • alkali metal hydroxide, carbonate Preferred examples include a rucali metal salt, an alkali metal hydrogen carbonate salt, ammonia, and a compound that generates ammonia by heating (for example, urea, hexamethylenetetramine, etc.).
  • this alkali metal sodium and potassium are preferable.
  • More preferable examples of the pH-adjusting agent include ammonia and compounds that generate ammonia by heating (for example, urea, hexamethylenetetramine, etc.).
  • the yttrium compound in the present invention can be obtained by, for example, adjusting the aqueous solution of yttrium nitrate to basic to produce a precipitate, heat-treating it, then drying and heat-treating it. .
  • the heating temperature of this heat aging treatment has a preferable temperature depending on the heating time.
  • the heating temperature is preferably 100 to 300 ° C force S, more preferably 130 to 250 ° C, and even more preferably 150 to 200 ° C force S.
  • the heating time of the heat aging treatment varies depending on the heating temperature. The higher the temperature, the shorter the heating time, but generally 2 to 72 hours are preferred, 10 to 48 hours are more preferred, and 15 to 30 hours are more preferred.
  • Drying may be performed at room temperature or by heating in a drying furnace. That is, any treatment may be performed as long as excess water is removed from the precipitate.
  • the drying temperature in the present invention is preferably 80 to 250 ° C. force S, more preferably 110 to 200 ° C. Note that this drying and heating can be performed simultaneously. In this case, it is preferable to lower the temperature until moisture is removed, and then to raise the heating temperature.
  • the yttrium compound in the present invention can be obtained by drying the above precipitate and then heat-treating it.
  • This heating temperature has a preferable temperature depending on the heating time.
  • the caloric heat temperature 150 to: 1,000 ° C force S is preferable, 180 to 900 ° C force S is more preferable, 200 to
  • More preferred is 850 ° C.
  • the heating time for this heat treatment varies depending on the heating temperature. The higher the temperature, the shorter the heating time, but in general:!-72 hours are preferred, 2-48 hours are preferred, 3-30 hours are more preferred.
  • the yttrium compound in the present invention obtained as described above can be pulverized according to the purpose to obtain a desired particle size.
  • the particle size of the yttrium compound in the present invention is not particularly limited, but preferably the average particle size Diameter F. SO. 01 to 10 / im, more preferably ⁇ to 0.05 to 3 / im. Particle size force SO. 01 to: ⁇ ⁇ is preferable because the particles do not aggregate with each other and when added to the resin, the physical properties are not impaired.
  • the anion exchange capacity in the present invention is measured using hydrochloric acid.
  • lg sample and 50 ml of 0.1 M / liter hydrochloric acid are placed in a 100 ml polyethylene bottle, shaken at 40 ° C for 24 hours, and then the chloride ion concentration in the supernatant is measured by ion chromatography. Measured by topography.
  • the anion exchange capacity was calculated using the same procedure as described above for the sample without the sample, but measuring the chloride ion concentration as a blank value.
  • the anion exchange capacity of the inorganic anion exchanger of the present invention is preferably lmeq / g or more, more preferably 1.5 meqZg or more, more preferably 1.8 meqZg or more, and preferably 4.5 meqZg or less. Mashigu 4. Less than 3meq / g is more preferred 4meqZg or less is more preferred.
  • the ion exchange amount is within the above range, the performance of the resin blended with the anion exchanger of the present invention is hardly impaired, which is preferable.
  • the electrical conductivity of the supernatant is obtained by adding pure water to a specimen and stirring it, and measuring the electrical conductivity of the supernatant. In this measurement, 0.5 g of a sample and 50 ml of pure water were placed in a 100 ml polypropylene bottle, kept at 100 ° C. for 24 hours, and then the conductivity of the supernatant was measured.
  • the conductivity of the supernatant in the inorganic anion exchanger of the present invention is preferably 200 ⁇ S / cm or less, more preferably 150 ⁇ S / cm or less, force S, more preferably 100 ⁇ S / cm or less, force S, and even more preferably 1 ⁇ S / cm or more is preferred 3 ⁇ S / cm or more is more preferred 5 ⁇ SZcm or more is even more preferred.
  • the conductivity of the supernatant is within the above range, the performance of the resin containing the inorganic anion exchanger of the present invention is hardly impaired, which is preferable.
  • the inorganic anion exchanger of the present invention is preferably an inorganic anion exchanger having an anion exchange capacity of SlmeqZg or more and a supernatant conductivity of 200 ⁇ S / cm or less. Good.
  • Examples of the resin used in the resin composition for sealing an electronic component containing the inorganic anion exchanger of the present invention include a thermosetting resin such as a phenol resin, a urea resin, a melanin resin, an unsaturated polyester resin, and an epoxy resin.
  • a thermoplastic resin such as polyethylene, polystyrene, salted bull, and polypropylene may be used, and a thermosetting resin is preferable.
  • a phenol resin or an epoxy resin is preferable, and an epoxy resin is particularly preferable.
  • Epoxy resin composition for sealing electronic parts [0027] Epoxy resin composition for sealing electronic parts
  • the epoxy resin used in the present invention can be used without limitation as long as it can be used as an electronic component sealing resin.
  • any type can be used, such as phenol novolac type epoxy resin, bisphenol A type epoxy resin, alicyclic epoxy resin, etc.
  • Any material used as a molding material can be used.
  • the epoxy resin composition for sealing an electronic component preferably contains a curing agent and a curing accelerator.
  • any of those known as curing agents for epoxy resin compositions can be used, and preferred specific examples include acid anhydrides, amine-based curing agents, and nopolac-based curing agents. .
  • curing accelerator used in the present invention any of those known as curing accelerators for epoxy resin compositions can be used, and preferred specific examples include amine-based, phosphorus-based, and imidazole-based accelerators. is there.
  • the resin composition for electronic parts of the present invention can be blended with what is known as a component to be blended with the molding resin, if necessary.
  • this component include inorganic fillers, flame retardants, inorganic filler coupling agents, colorants, and release agents. These ingredients are known as components to be blended in the molding epoxy resin.
  • Specific examples of preferred inorganic fillers include crystalline silica powder, quartz glass powder, fused silica powder, alumina powder, and talc. Of these, crystalline silica powder, quartz glass powder, and fused silica powder are inexpensive. preferable.
  • flame retardants include antimony oxide, halogenated epoxy resins, magnesium hydroxide, aluminum hydroxide, red phosphorus compounds, phosphate ester compounds, etc.
  • Examples of coupling agents for inorganic fillers include silane
  • mold release agents include aliphatic paraffins and higher aliphatic alcohols.
  • a reactive diluent examples include butyl phenyl darisidino ether
  • examples of the solvent include methyl ethyl ketone
  • examples of the thixotropic agent include organically modified bentonite.
  • a preferred blending ratio of the inorganic anion exchanger of the present invention is 0.1 to 10 parts by weight, more preferably 1 to 5 parts by weight per 100 parts by weight of the resin composition for sealing an electronic component. .
  • a blending ratio of 0.1 part by weight or more is preferable because it has a large effect of improving the anion removability and moisture resistance reliability.
  • it is 10 parts by weight or less, it is preferable because it will not only lead to a sufficient effect and cost increase.
  • the anion scavenging ability of the inorganic anion exchanger of the present invention is increased and the effect of capturing cationic ions is improved.
  • the inorganic cation exchanger is an inorganic substance and has a cation exchange property.
  • the compounding ratio of the inorganic anion exchanger and inorganic cation exchanger of the present invention is not particularly limited, but is preferably 100: 0 to 20:80 by weight.
  • the inorganic anion exchanger and the inorganic cation exchanger according to the present invention may be blended separately when preparing the resin composition for sealing an electronic component, and these are mixed in advance. You can also. Preferably, a mixture is used. By doing so, the effect of using these components in combination can be further exhibited.
  • the inorganic cation exchanger include antimonic acid (antimony pentoxide hydrate), Examples include oxalic acid (niobium pentoxide hydrate), manganese oxide, zirconium phosphate, titanium phosphate, tin phosphate, cerium phosphate, zeolite, and clay minerals.
  • Antimonic acid (antimony pentoxide hydrate) Product) zirconium phosphate, and titanium phosphate.
  • the resin composition for sealing an electronic component of the present invention can be easily obtained by mixing the above raw materials by a known method.
  • the respective raw materials are appropriately blended, and the blend is kneaded.
  • the mixture is kneaded while heated in a machine to obtain a semi-cured resin composition, which is cooled to room temperature, pulverized by known means, and tableted as necessary.
  • the inorganic anion exchanger of the present invention can be used for various applications such as sealing, coating, and insulation of electronic components or electrical components.
  • the inorganic anion exchanger of the present invention can also be used for stabilizers, antifungal agents and the like for resins such as polyvinyl chloride.
  • a resin composition for electronic components containing the inorganic anion exchanger of the present invention is provided on a support member such as a lead frame, a wired tape carrier, a wiring board, glass, or a silicon wafer, on a semiconductor chip or transistor. It can be used for devices equipped with active elements such as diodes and thyristors, and passive elements such as capacitors, resistors and coils.
  • the resin composition for encapsulating electronic components of the present invention can also be used effectively for printed circuit boards.
  • An epoxy resin composition for encapsulating electronic components containing the inorganic anion exchanger of the present invention can be used in the same manner.
  • a low-pressure transfer molding method is the most common, but an injection molding method, A compression molding method or the like may be used.
  • a printed wiring board is formed using thermosetting properties such as an epoxy resin, and a copper foil or the like is bonded to the printed wiring board, and a circuit is produced by etching the film to produce a wiring board.
  • corrosion and insulation defects have become problems due to high density of circuits, lamination of circuits, and thinning of insulating layers.
  • Such corrosion can be prevented by adding the inorganic anion exchanger of the present invention when producing a wiring board.
  • corrosion of the wiring board can be prevented by adding the inorganic anion exchanger of the present invention to the insulating layer for the wiring board.
  • the wiring board containing the inorganic anion exchanger of the present invention can suppress the generation of defective products due to corrosion or the like. It is preferable to add 0.:! To 5 parts by weight of the inorganic anion exchanger of the present invention with respect to 100 parts by weight of the resin solid content in the wiring board or the insulating layer for the wiring board.
  • An inorganic cation exchanger may be contained therein.
  • the inorganic anion exchanger of the present invention By adding the inorganic anion exchanger of the present invention to a conductive adhesive or the like when connecting or wiring an electronic component to a wiring board, it is possible to suppress defects caused by corrosion etc. .
  • the conductive adhesive include those containing a conductive metal such as silver. It is preferable to add 0.:! To 5 parts by weight of the insoluble anion exchanger of the present invention with respect to 100 parts by weight of the resin solid content in the conductive adhesive. An inorganic cation exchanger may be contained here.
  • An electrical product, a printed wiring board, an electronic component, or the like can be produced using the varnish containing the inorganic anion exchanger of the present invention.
  • the varnish include those mainly composed of a thermosetting resin such as an epoxy resin. It is preferable to add from 0.5 to 5 parts by weight of the inorganic anion exchanger of the present invention to 100 parts by weight of the resin solid content. Inorganic cation exchangers may be included here.
  • the inorganic anion exchanger of the present invention can be added to a paste containing silver powder or the like.
  • Paste is used to improve the adhesion between connecting metals as an auxiliary agent for soldering. As a result, the generation of corrosive substances generated from the paste can be suppressed. It is preferable to add 0.:! To 5 parts by weight of the inorganic anion exchanger of the present invention with respect to 100 parts by weight of resin solids in the paste. Inorganic cation exchange here A substitute may be included.
  • the method includes a step of adjusting the aqueous solution of yttrium nitrate to basic to produce a precipitate, a step of drying the precipitate after heat aging, and a step of heating the dried product.
  • Comparative compound 1 synthesized in Comparative example 1 was further heated at 400 ° C. for 4 hours to obtain comparative compound 2.
  • this compound was analyzed, it was La 2 O 3 (NO 3).
  • Bismuth anion exchanger IXE-500 (manufactured by Toagosei Co., Ltd.) was used as reference compound 2.
  • a crushed sample of the resin kneaded body 2 was prepared in the same manner as in the preparation of the resin kneaded body 1 except that the compound 2 was used instead of the compound 1.
  • a pulverized sample of resin kneaded body 3 was prepared in the same manner as in the preparation of resin kneaded body 1 except that compound 3 was used instead of compound 1.
  • a pulverized sample of comparative resin kneaded body 2 was prepared in the same manner as in preparation of resin kneaded body 1 except that comparative compound 2 was used instead of compound 1.
  • a pulverized sample of comparative resin kneaded body 3 was prepared in the same manner as in preparation of resin kneaded body 1 except that comparative compound 3 was used instead of compound 1.
  • a pulverized sample of comparative resin kneaded body 0 was prepared in the same manner as in the preparation of resin kneaded body 1 except that compound 1 was not used. That is, the comparative resin kneaded product 0 is a product containing Compound 1.
  • a ground sample of reference resin kneaded body 1 was prepared in the same manner as in preparation of resin kneaded body 1 except that reference compound 1 was used instead of compound 1.
  • a ground sample of reference resin kneaded body 2 was prepared in the same manner as in preparation of resin kneaded body 1 except that reference compound 2 was used instead of compound 1.
  • Comparative Example 5 Comparative resin kneaded body 2 53 4,4
  • Comparative Example 6 Comparative resin kneaded body 3 50 4.3
  • Reference Example 4 Reference resin kneaded body 2 60 4.2
  • Compound 1 0.5 g was placed in a 100 ml polypropylene bottle, 50 ml of pure water was added, stoppered and kept at 100 ° C. for 24 hours.
  • the bottle has a small hole.
  • Compound 2 Compound 3, Reference Compound 1, and Reference Compound 2 were also operated in the same manner as described above to prepare Mixture 2, Mixture 3, Reference Mixture 4, and Reference Mixture 5. These materials were used to measure the ion exchange rate.
  • Reference mixture 1 Reference compound 1 + Zirconium oxalate 96%
  • the inorganic anion exchanger of the present invention has a low ion solubility and a low hygroscopic property even under high temperature and high humidity with a large ion exchange capacity.
  • the inorganic anion exchanger of the present invention has a low ion solubility and a low hygroscopic property even under high temperature and high humidity with a large ion exchange capacity.
  • the inorganic anion exchanger of the present invention is one made of an environment and excellent in anion exchange properties.
  • the inorganic anion exchanger of the present invention is an inorganic anion exchanger that does not use a high-mouth talcite or a bismuth compound, which is problematic in terms of hygroscopicity or recycling. Even if the inorganic anion exchanger of the present invention is added to the resin, there is an effect of suppressing the elution of this force of anions.
  • the inorganic anion exchanger of the present invention can be used for various purposes such as sealing, coating, and insulation of highly reliable electronic parts or electric parts over a wide range.
  • the inorganic anion exchanger of the present invention can also be used as a resin stabilizer such as bull chloride, an antifungal agent, and the like.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Sealing Material Composition (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Il est exposé un nouvel échangeur inorganique d'anions haute performance lequel est respectueux de l'environnement. Il est précisément exposé un échangeur inorganique d'anions représenté par la formule (1) suivante. Y2Ox(OH)y(NO3)z·nH2O (1) (Dans la formule (1), x, y et z représentent respectivement 0 ou un nombre positif satisfaisant à la relation : 2x + y + z = 6 et n représente 0 ou un nombre positif.) Il est également exposé une composition de résine pour l'enrobage d'un composant électronique laquelle contient l'échangeur inorganique d'anions représenté par la formule (1) ci-dessus, une résine d'enrobage d'un composant électronique et un composant électronique. Il est en plus exposé un vernis, un adhésif et une pâte contenant l'échangeur inorganique d'anions et des produits les contenant.
PCT/JP2005/023583 2005-01-11 2005-12-22 Échangeur inorganique d'anions constitué d'un composé de l'yttrium et composition de résine pour l'enrobage d'un composant électronique laquelle utilise celui-ci WO2006075500A1 (fr)

Priority Applications (1)

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JP2006552877A JP5176323B2 (ja) 2005-01-11 2005-12-22 イットリウム化合物による無機陰イオン交換体およびそれを用いた電子部品封止用樹脂組成物

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JP2005004181 2005-01-11
JP2005-004181 2005-01-11

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WO2006075500A1 true WO2006075500A1 (fr) 2006-07-20

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TW (1) TWI378827B (fr)
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008031190A (ja) * 2006-07-26 2008-02-14 Shin Etsu Chem Co Ltd Ｌｅｄ用蛍光物質入り硬化性シリコーン組成物およびその組成物を使用するｌｅｄ発光装置。
JP2009184869A (ja) * 2008-02-06 2009-08-20 National Institute For Materials Science 層状希土類水酸化物を製造する方法

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JP2009184869A (ja) * 2008-02-06 2009-08-20 National Institute For Materials Science 層状希土類水酸化物を製造する方法

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