1378827 r " 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種無機陰離子交換體，特別是適當使 . 用於電子零件密封用樹脂組成物中的無機陰離子交換體。 再者，關於含有該無機陰離子交換體之電子零件密封用樹 脂組成物、使其硬化所成之樹脂及該藉由組成物封印元件 所成之電子零件。又，本發明係關於含有該無機陰離子交 換體之清漆、黏著劑、及糊劑以及含彼等之製品。 •【先前技術】 以往以來，無機陰離子交換體已知有水滑石、含氫氧 化鉍、含氫氧化鎂、及含氫氧化鋁等。 近年來，無機陰離子交換體係摻混於電子零件密封用 樹脂' 電氣零件密封用樹脂、及電氣製品用樹脂等。 例如’多數的LSI、1C、混合式1C、電晶體、二極體、 及閘流電晶體或此等混合式零件係使用環氧樹脂來加以密 封。如此的電子零件密封材係在抑制起因於由於原材料中 鲁的離子性雜質或外部侵入之水分的不良時，同時要求難燃 性、高黏合性、耐龜裂性及高體積電阻率等的電氣特性等、 * 各種的特性。 作爲電子零件密封材所使用的環氧樹脂係主要成分爲 . 環氧化合物以外’由環氧化合物硬化劑、硬化促進劑、無 機充塡物、難燃劑、顔料、及矽烷偶合劑等所構成。 更且’隨著近年半導體的高積體化，藉由縮小1C晶片 上的銘配線寬’使得鋁的腐蝕變得早期發生。該腐蝕係藉 1378827 舞 由主要浸入作爲密封材使用的環氧樹脂中之水分而使其助 長者。又，由於配線寬的縮小，爲了使在使用中發生的熱 變多，該環氧樹脂中係大量摻混氧化銻、溴化環氧樹脂、 , 及無機氫氧化物等的難燃劑，藉由此等難燃劑成分，可進 " 一步助長鋁等配線的腐蝕。 .[Technical Field] The present invention relates to an inorganic anion exchanger, and particularly to an inorganic anion exchanger for use in a resin composition for sealing electronic parts. Further, the resin composition for sealing an electronic component containing the inorganic anion exchanger, the resin obtained by curing the resin, and the electronic component formed by the composition sealing member. Further, the present invention relates to a varnish, an adhesive, and a paste containing the inorganic anion exchange, and a product containing the same. • [Prior Art] Conventionally, inorganic anion exchangers have been known to include hydrotalcite, hydrazine hydroxide, magnesium hydroxide, and aluminum hydroxide. In recent years, an inorganic anion exchange system has been blended with a resin for sealing electronic parts, a resin for electrical component sealing, and a resin for electrical products. For example, 'many LSI, 1C, hybrid 1C, transistor, diode, and thyristor or these hybrid parts are sealed with an epoxy resin. Such an electronic component sealing material is required to prevent electrical failure due to ionic impurities or external intrusion of moisture in the raw material, and also requires electrical resistance such as flame retardancy, high adhesion, crack resistance, and high volume resistivity. Characteristics, etc. * Various characteristics. The main component of the epoxy resin used as the electronic component sealing material is: other than the epoxy compound, which consists of an epoxy compound curing agent, a curing accelerator, an inorganic filler, a flame retardant, a pigment, and a decane coupling agent. . Furthermore, with the high integration of semiconductors in recent years, corrosion of aluminum has occurred early by reducing the width of the wiring on the 1C wafer. This corrosion is promoted by the 1378827 dance by the moisture in the epoxy resin which is mainly immersed in the sealing material. Further, in order to reduce the amount of heat generated during use, a large amount of a flame retardant such as cerium oxide, brominated epoxy resin, or inorganic hydroxide is blended in the epoxy resin. Such a flame retardant component can be used to promote corrosion of wiring such as aluminum. .
P 爲了防止上述的腐蝕，對於環氧樹脂係要求進一步提 收耐濕可靠性。實際上因爲根據提高該耐濕可靠性之要 求’捕捉成爲問題的雜質離子、特別是鹵素離子爲其目的， ® 無機陰離子交換體之水滑石類係配合環氧樹脂等係爲提案 (例如參照專利文獻1、專利文獻2、及專利文獻3等）。 ' 該化合物係幾乎含有作爲陰離子的氫氧離子及碳酸離 子等的陰離子，所以陰離子交換性能並不認爲是充分的。 藉由燒成水滑石化合物，構造内的陰離子脫離，而形 成水滑石燒成物。由於水滑石燒成物在化合物内不含有陰 離子’因此相較於水滑石化合物在陰離子交換性能方面係 爲優異。彼等係吸收水可再形成層狀構造。 ^ 該水滑石燒成物配合於環氧樹脂等亦爲提案（參照例如 專利文獻4)。彼等係雖然陰離子交換性能優異，提升電子 ' 零件的耐濕可靠性係爲有效，但是由於吸濕性非常高、且 在空氣中容易吸濕之故，因此於電子零件中會吸濕、及隨 著吸濕而體積增加。因而，使其在焊錫浴或回流裝置處理 等高溫中處理時等，因基板等的熱膨張係數不同所發生的 熱應力、或藉由汽化吸濕水分所產生的蒸氣壓，在元件、 引線框等的嵌件品與密封用成形材料之間產生剝離，恐會 1378827 β ' 成爲封裝體龜裂、晶片損傷等的原因。 已知有鉍化合物爲陰離子交換體（例如參照 5、專利文獻6)。配合陰離子交換體之鉍化合物的 , 封用環氧樹脂組成物係爲已知（參照例如專利文獻 ， 又’陰離子交換體係一般在周圍環境爲酸性 " 好地吸附陰離子’但是在中性附近或者鹼性附近 附陰離子。藉由配合密封材之添加劑使樹脂組成瑕 中性附近，會有陰離子交換體的效果無法充分發3 • 其對策已提案有在陰離子交換體中混合固體 子交換體以降低表觀pH，使離子交換性提升之使』 ' 如參照專利文獻8)。但是，在將固體酸添加至樹 中，會損及樹脂的物性。又，陽離子交換體中大 金屬，由於最近對環境的關懷，所以亦有無法倂 交換體之情形。 在使用於印刷配線板之環氧樹脂中，摻混陽 體、陰離子交換體、及兩離子交換體等的無機離 ^ 者係爲已知（例如參照專利文獻9)。 已知有在芳香族聚醯胺繊維含有環氧樹脂或 . 樹脂與離子捕捉劑之印刷基板。該離子捕捉劑係 子交換樹脂或無機離子交換體，無機離子交換體 有錄-秘系者或銷系者（例如參照專利文獻1 0)。 含有離子捕捉劑之絶緣清漆係爲已知，且使 '凊 '漆以製作多層印刷配線板。該離子捕捉劑係例 碳、沸石、二氧化矽凝膠、活性氧化鋁、活性白 專利文獻 半導體密 7)。 附近能良 責難以吸 ]的pH在 [的情形。 酸之陽離 有方法（例 脂之情形 多含有重 用陽離子 離子交換 子交換體 者聚苯醚 例示有離 係已記載 用該絶緣 示有活性 土、水合 1378827 五氧化銻、磷酸鉻、及水滑石等（例如參照專利文獻]彳）。 在多層配線板用的接著薄膜中摻混無機離子吸著體者 .係爲已知。該無機離子吸著劑係例示有活性碳、沸石、二 , 氧化矽凝膠 '活性氧化鋁、活性白土'水合五氧化銻、碟 酸锆、及水滑石等（例如參照專利文獻1 2)。 " 含有離子補集劑之環氧樹脂黏著劑係爲已知。該離子 補集劑係例示有陰離子交換體或陽離子交換體（例如參照專 利文獻1 3 )。 ® 含有離子捕捉劑與銀粉等之導電性環氧樹脂糊劑係爲 已知。該離子捕捉劑係例示有水合硝酸鉍、鎂鋁水滑石、 ' 氧化銻等（例如參照專利文獻1 4)。 彼等中記載之離子交換體.離子捕捉劑之中，係有使用 水滑石之記載，彼等可使用原樣或燒成體。 此等之中，水滑石或含氫氧化鉍係由於陰離子交換性 高’且耐藥品性或耐熱性也比較優異，可利用於各式各樣 的用途。例如混入電子產業區域中的半導體密封樹脂，以 ® 提升半導體零件等的可靠性之目的而使用。 但是’水滑石係在1 00 °c以上的熱水中等高溫高濕下溶 • 解性大。又，由於對吸濕性高的密封樹脂物性會給予惡影 , 響之故，其使用範圍係受到限制。 另一方面，含氫氧化鉍等的鉍化合物係具有優異的性 會I ’所以可在廣泛範圍內使用，但是從容易造成與銅的合 金之回收面等而言，亦限制其使用。 【專利文獻1】特開昭63-25245 1號公報 1378827 【專利文獻2】特開昭64-64243號公報 【專利文獻3】特開昭60-40124號公報 【專利文獻4】特開昭60-42418號公報 【專利文獻5】特開昭63-060112號公報 【專利文獻6】特開平02-293325號公報 【專利文獻7】特開平02-294354號公報 【專利文獻8】特開昭60-23901號公報 【專利文獻9】特開平05-140419號公報 【專利文獻10】特開平09-314758號公報 【專利文獻11】特開平1 0-287830號公報 【專利文獻12】特開平10-330696號公報 【專利文獻13】特開平10-013011號公報 【專利文獻141】特開平10-007763號公報 【發明內容】 【發明所欲解決之課題】 現在已知的高性能無機陰離子交換體係有如上述的問 題等。本發明所欲解決之課題係提供一種在環境方面優異 且高性能新穎的無機陰離子交換體。 【解決課題之手段】 本發明者係爲了發現可使用於電子產業區域中的半導 體密封劑等之新穎無機陰離子交換體，而進行專心一意檢 討之結果，發現下述式（1 )所示之釔化物具有高陰離子交換 性，而完成本發明。 Y2〇x(OH)y(N03)2· nH2〇 1 1378827 式（1)的X、y、及z爲〇或正數，2x + y + z = 6，η爲0或 正數。 本發明的另一態樣係爲含有作爲任意成分之無機陽離 . 子交換體，及含有本發明的無機陰離子交換體之電子零件 " 密封用樹脂組成物》 - 本發明的另一態樣係爲含有環氧樹脂及硬化劑之上述 記載的電子零件密封用樹脂組成物。 本發明的另一態樣係爲使上述記載的電子零件密封用 • 樹脂組成物硬化所構成之電子零件密封用樹脂。 本發明的另一態樣係爲藉由上述記載的電子零件密封 ' 用樹脂組成物使元件密封所構成之電子零件。. 本發明的另一態樣係爲含有無機陽離子交換體，及含 有上述記載的無機陰離子交換體之清漆、黏著劑、或糊劑。 本發明的另一態樣係爲含有上述記載的清漆、黏著 劑、或糊劑之製品。 【發明效果】 ® 根據本發明，可提供一種環境方面優異且高性能的新 穎無機陰離子交換體。 * 又，根據本發明，可提供使用上述無機陰離子交換體 , 之電子零件密封用樹脂組成物、電子零件密封用樹脂，及 電子零件。 再者，根據本發明，可提供使用於上述無機陰離子交 換體之清漆、黏著劑、糊劑，以及含有彼等之製品。 【實施發明之最佳形態】 -10- 1378827 本發明的無機陰離子交換體係因爲是由上述式（1)所示 之釔化物所構成之無機陰離子交換體’所以環境方面優異 且高性能，又，即使在不能使用水滑石系陰離子交換體或 . 鉍系陰離子交換體等之用途亦可適當使用而爲較佳。 ·_ 〇釔化物 ·' 本發明中的釔化物係如上述式（1 )所示者。 式（1)的X係爲〇或3以下的正數，較佳係3以下的正 數，更較佳係2.5以下的正數。 • 式（1)的y係爲〇或6以下的正數，較佳係0或5.5以 下的正數，更較佳係5以下的正數。 式（1)的z係爲0或6以下的正數，較佳係0或4以下 的正數，更較佳係3以下的正數。P In order to prevent the above corrosion, it is required to further improve the moisture resistance reliability of the epoxy resin. In fact, it is a proposal to capture the problematic impurity ions, particularly halogen ions, according to the requirement of improving the reliability of the moisture resistance. The hydrotalcite of the inorganic anion exchanger is formulated with an epoxy resin, etc. (for example, refer to the patent) Document 1, Patent Document 2, and Patent Document 3, etc.). Since this compound contains almost an anion such as a hydroxide ion and an anion ion as an anion, the anion exchange performance is not considered to be sufficient. By firing the hydrotalcite compound, the anions in the structure are detached to form a hydrotalcite-fired product. Since the hydrotalcite-fired product does not contain an anion in the compound, it is superior in anion exchange performance to the hydrotalcite compound. They absorb water to form a layered structure. It is also proposed that the hydrotalcite-fired material is blended with an epoxy resin or the like (see, for example, Patent Document 4). These systems are excellent in anion exchange performance and improve the moisture resistance reliability of electronic parts. However, they are highly hygroscopic and absorb moisture in the air, so they absorb moisture in electronic parts. The volume increases as moisture absorbs. Therefore, when it is processed in a high temperature such as a solder bath or a reflow apparatus, thermal stress generated by a difference in thermal expansion coefficient of a substrate or the like, or vapor pressure generated by vaporizing moisture absorption, in a component, a lead frame If the inserts and the molding materials for sealing are peeled off, the 1378827 β ' may cause cracks in the package or wafer damage. The ruthenium compound is known as an anion exchanger (see, for example, Patent Document 5). The encapsulating epoxy resin composition is known as an anion exchanger, and the encapsulating epoxy resin composition is known (refer to, for example, the patent literature, and the 'anion exchange system is generally acidic in the surrounding environment'; goodly adsorbing anions' but near neutral or An anion is added in the vicinity of the alkali. The resin is formed in the vicinity of the neutral phase by the addition of the additive of the sealing material, and the effect of the anion exchanger is insufficient. 3 The countermeasure has been proposed to reduce the solid sub-exchanger in the anion exchanger to reduce The apparent pH is such that the ion exchange property is improved as described in Patent Document 8). However, when a solid acid is added to a tree, the physical properties of the resin are impaired. Further, since the large metal in the cation exchanger has recently been concerned with the environment, there is a case where the exchanger cannot be exchanged. In the epoxy resin used for the printed wiring board, an inorganic developer such as a blend of a positive electrode, an anion exchanger, and a two ion exchanger is known (for example, see Patent Document 9). A printed substrate containing an epoxy resin or a resin and an ion scavenger in an aromatic polyamine is known. The ion scavenger is a series exchange resin or an inorganic ion exchanger, and the inorganic ion exchanger is recorded or secreted (see, for example, Patent Document 10). Insulating varnishes containing ion scavengers are known, and '凊' lacquers are used to make multilayer printed wiring boards. Examples of the ion trapping agent are carbon, zeolite, cerium oxide gel, activated alumina, and reactive white. Patent Document Semiconductor 7). It is the case that the pH is in the case. There are methods for the cation of acid (in the case of the case of a lipid, the polyphenylene ether containing a cation ion exchanger is re-expressed. It is exemplified that it has been described that the insulation shows active soil, hydrated 1378827 pentoxide, chromium phosphate, and hydrotalcite. Etc. (for example, refer to the patent document) 彳). It is known to incorporate an inorganic ion sorbent into a film for a multilayer wiring board. The inorganic ion sorbent is exemplified by activated carbon, zeolite, and oxidation.矽 Gel 'activated alumina, activated clay' hydrated osmium tetroxide, zirconium silicate, and hydrotalcite (for example, refer to Patent Document 12). " Epoxy resin adhesive containing ion-acquisition agent is known The ion-accepting agent is exemplified by an anion exchanger or a cation exchanger (for example, see Patent Document 13). A conductive epoxy resin paste containing an ion trapping agent and silver powder is known. Examples of the hydrated cerium nitrate, magnesium aluminum hydrotalcite, and cerium oxide (see, for example, Patent Document 14). Among the ion exchangers described in the ion traps, the use of hydrotalcite is described. These may be used as they are or in a fired body. Among them, hydrotalcite or yttrium hydroxide containing yttrium has high anion exchangeability and is excellent in chemical resistance and heat resistance, and can be used for various purposes. For example, semiconductor sealing resins that are incorporated into the electronics industry are used for the purpose of improving the reliability of semiconductor components, etc. However, 'the hydrotalcite is soluble in hot water of medium temperature and high humidity above 100 °C. In addition, since the physical properties of the sealing resin having high hygroscopicity are adversely affected, the range of use is limited. On the other hand, the ruthenium compound containing ruthenium hydroxide or the like has excellent properties I'. It can be used in a wide range of applications, but it is also limited to the use of a copper-recovery surface, etc. [Patent Document 1] JP-A-63-25245 No. 13781 [Patent Document 2] [Patent Document 3] JP-A-60-42418 (Patent Document 5) JP-A-63-060112 (Patent Document 6) Kaiping 02-293325 Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. [Patent Document No. 1] [Patent Document No. 10] [Patent Document No. 10-330763] SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] The high-performance inorganic anion exchange system known at present has the above problems and the like. The object of the present invention is to provide an inorganic anion exchanger which is excellent in the environment and novel in high performance. [Means for Solving the Problem] The inventors of the present invention found a flaw shown in the following formula (1) as a result of intensive review of the novel inorganic anion exchanger which can be used for a semiconductor sealant or the like in the electronic industry region. The compound has high anion exchangeability, and the present invention has been completed. Y2〇x(OH)y(N03)2· nH2〇 1 1378827 X, y, and z of the formula (1) are 〇 or a positive number, and 2x + y + z = 6, η is 0 or a positive number. Another aspect of the present invention is an inorganic cation exchanger as an optional component, and an electronic component containing the inorganic anion exchanger of the present invention " resin composition for sealing" - another aspect of the present invention The resin composition for sealing an electronic component described above containing an epoxy resin and a curing agent. Another aspect of the present invention is a resin for sealing an electronic component comprising the resin composition for sealing an electronic component described above. Another aspect of the present invention is an electronic component in which the component is sealed with a resin composition by the electronic component sealing described above. Another aspect of the present invention is a varnish, an adhesive, or a paste containing an inorganic cation exchanger and an inorganic anion exchanger as described above. Another aspect of the present invention is a product comprising the varnish, the adhesive, or the paste described above. [Effect of the Invention] According to the present invention, it is possible to provide a novel inorganic anion exchanger which is excellent in environment and high in performance. In addition, according to the present invention, a resin composition for sealing an electronic component, a resin for sealing an electronic component, and an electronic component using the above inorganic anion exchanger can be provided. Further, according to the present invention, a varnish, an adhesive, a paste, and a product containing the same, which are used in the above inorganic anion exchange, can be provided. [Best Mode for Carrying Out the Invention] -10- 1378827 The inorganic anion exchange system of the present invention is excellent in environmental efficiency and high in performance because it is an inorganic anion exchanger composed of the telluride represented by the above formula (1). The use of a hydrotalcite-based anion exchanger or a quinone anion exchanger can be suitably used, and it is preferably used. - 〇钇 Telluride · ' The telluride in the present invention is as shown in the above formula (1). The X system of the formula (1) is a positive number of 〇 or 3 or less, preferably a positive number of 3 or less, and more preferably a positive number of 2.5 or less. • The y of the formula (1) is a positive number of 〇 or 6 or less, preferably a positive number of 0 or less, more preferably a positive number of 5 or less. The z-form of the formula (1) is a positive number of 0 or less, preferably a positive number of 0 or less, more preferably a positive number of 3 or less.
本發明中釔化物的具體例可舉例如：YaiOHh.jNOJo. 9·η2ο、υ2ο2(νο3)2、Y203、等，又，亦可例示如 y2(〇h)6、 Υ2(〇Η)4(Ν03)2、Y2(0H)3(N03)3、Y2(0H>2(N03)4、y2(oh) (no3)5、y2〇(〇h)4、y2o(oh)3(no3)、Y20(0H)2(N03)2、Y • 2〇(〇H)(N〇3)3、Y20(N03)4、Y2〇2(〇H)2、Y2〇2(〇H)(N03)、 Y2〇2(N03)2 等。 • 用於得到本發明中釔化物的原料，若能得到具有式（υ _-所示之陰離子交換.性者的話，無論爲何者均可使用。例如， 本發明中的釔化物係藉由將硝酸釔的水溶液調整成鹼性、 使其生成沈殿，將其乾燥後加熱而可得到。又，例如氧化 釔係使用硝酸而可溶化，藉由將其進行上述記載的處理， 可得到本發明的釔化物。 1378827 本發明中的釔化物係藉由將硝酸釔的水溶液調整成鹼 性' 使其生成沈殿，將其乾燥後加熱而可得到。該pH係以 pH7.5〜12爲佳、pH8〜11爲較佳、更佳爲pH8.5〜10◊進 . 行該處理時的水溫係以1〜8CTC爲佳、10〜6(TC爲較佳' ·· 15〜40°C爲更佳。作爲調整pH者，可例示如氫氧化鹼金 - 屬、碳酸鹼金屬鹽、碳酸氫鹼金屬鹽、氨、及藉由加熱而 產生氨之化合物（例如脲或六亞甲基四胺等）等爲佳。該鹼金 屬係以鈉及鉀爲佳。作爲調整p Η者更佳係氨及經由加熱而 • 產生氨之化合物（例如脲或六亞甲基四胺等）等。 本發明中的釔化物係藉由例如將硝酸釔的水溶液調整 _ 成、使沈殿生成，將其進行加熱熟成處理之後，經由乾燥、 加熱處理而可得到。該加熱熟成處理的加熱溫度係隨著加 熱時間而有理想溫度。例如，加熱溫度係以1 〇〇〜300°C爲 佳、130〜250 °C爲較佳、150〜200 °C爲更佳。 加熱熟成處理的加熱時間係因加熱溫度，而較佳時間 有所不同。以高溫程度加熱時間短爲佳，一般而言，2〜72 ® 小時爲佳、10〜48小時爲較佳、15〜30小時爲更佳。 乾燥可在室溫下進行，亦可在乾燥爐内進行加熱。亦 ' 即，若能從沈殿物除去多餘水分，進行什麼樣的處理均可。 .. 例如，本發明的乾燥溫度係以80〜250°C爲佳、110〜200 °C爲更佳。此外，該乾燥與加熱亦可同時進行。該情形中， 到達直至除去的稍低溫度，之後上昇至加熱溫度爲佳。 本發明中的釔化物係藉由將上述沈殿乾燥後，進行加 熱處理而可得到。該加熱溫度係隨著加熱時間而定的較佳 -12- 1378827 溫度。例如，加熱溫度係以1 5 0〜1 , Ο Ο 0 °c爲佳、1 8 0〜9 Ο Ο °(：爲較佳、200〜850°C爲更佳。 該加熱處理的加熱時間係因加熱溫度，而較佳時間有 . 所不同。以高溫程度加熱時間短爲佳，一般而言，1〜72小 ·· 時爲佳、2〜48小時爲較佳、3〜30小時爲更佳。 : 如上述所得之本發明中的釔化物，係視其目的進行粉 碎處理，而可得到形成所希望的粒子徑。 本發明中的釔化物的粒徑係沒有限制，惟較佳係平均 • 粒徑爲0.01〜10μηι'更較佳係0_05〜3μΓτι。粒徑爲0.01 〜10pm時，粒子彼此係不會凝集，又，添加至樹脂之情形 中不會損及物性之故而爲佳。 〇陰離子交換容量 本發明中的陰離子交換容量係使用鹽酸加以測定者。 該測定係將1g的試樣與50ml的0.1Μ/公升濃度之鹽酸裝入 1 00ml的聚乙烯製的瓶子中，於4 0〇C下振盪·24小時，之後， 上清的氯離子濃度係以離子層析法加以測定。將不裝入試 ® 樣且進行同樣操作而測定氯離子濃度者作爲空白試驗値， 算出陰離子交換容量》 • 本發明無機陰離子交換體的陰離子交換容量係以 . 1meq/g以上爲佳、1.5meq/g以上爲較佳、更較佳係 1.8meq/g以上，又4.5meq/g以下爲佳、4.3meq/g以下爲 較佳、4meq/g以下爲更佳。 離子交換容量在上述範圍時，由於不會損及摻混本發 明陰離子交換體之樹脂性能而爲佳》 1378827 〇導電度 上清的導電度係在試樣中裝入純水、進行攪拌，測定 其上清的導電度者。該測定係將〇.5g的試樣與50ml的純 • 水裝入1〇〇ml的聚丙烯製的瓶子中，於1〇0 下保持24小 . 時，之後，測定其上清的導電度。 ； 本發明無機陰離子交換體中的上清導電度係以 200pS/cm以下爲佳' i50pS/cm以下爲較佳、l〇〇pS/cm以 下爲更佳’又1pS/cm以上爲佳、3pS/cm以上爲較佳、 β SpS/cm以上爲更佳。 上清的導電度在上述範圍時，由於不會損及摻混本發 明無機陰離子交換體之樹脂性能而爲佳。 例如’本發明的無機陰離子交換體係以陰離子交換容 量爲1meq/g以上，且上清的導電度爲200pS/cm以下的無 機陰離子交換體爲佳。 〇電子零件密封用樹脂組成物 摻混本發明無機陰離子交換體之電子零件密封用樹脂 ® 組成物中所使用的樹脂，可爲苯酚樹脂、脲樹脂、三聚氰 胺樹脂 '不飽和聚酯樹脂、及環氧樹脂等的熱固性樹脂， ' 亦可爲聚乙烯、聚苯乙烯、氯乙烯、及聚丙烯等的熱塑性 : 樹脂’較佳係熱固性樹脂。本發明的電子零件密封用樹脂 組成物中所使用的熱固性樹脂係以苯酚樹脂或環氧樹脂爲 佳、特較佳係環氧樹脂。 〇電子零件密封用環氧樹脂組成物 本發明中所使用的環氧樹脂若爲可使用於電子零件密 -14- 1378827 封用樹脂的話，可沒有限制地使用。例如，若1分 有2個以上的環氧基、可硬化者的話，特別是不論 苯酚酚醛清漆型環氧樹脂、雙酚A型環氧樹脂、脂 . 氧樹脂等中任一者亦可作爲成形材料使用。又，爲 本發明組成物的耐濕性，環氧樹脂係使用氯化物離 : 爲1〇ppm以下，加水分解性氯含量爲1,000ppm以 佳。. 本發明中，電子零件密封用環氧樹脂組成物含 • 劑及硬化促進劑爲佳。 本發明中所使用的硬化劑可使用已知作爲環氧 成物的硬化劑中之任一者，較佳具體例係爲酸酐、 化劑及酚醛清漆系硬化劑等。 本發明中所使用的硬化促進劑係可使用已知作 樹脂組成物的硬化促進劑中之任一者，較佳具體例 系、磷系、及咪唑系的促進劑等。 本發明的電子零件用樹脂組成物，亦可視需要 ® 知作爲摻混成形用樹脂之成分者。該成分可例示如 塡物、難燃劑、無機充塡物用偶合劑、著色劑、及 ' 等。此等成分係已知爲作爲摻混任何成形用環氧樹 :分者。無機充塡物的理想具體例可舉例如結晶性二 粉、石英玻璃粉、熔融二氧化矽粉、氧化鋁粉及滑 其中尤以結晶性二氧化矽粉、石英玻璃粉及熔融二 粉因爲便宜而爲佳。難燃劑之例係有氧化銻、鹵化 月旨、氫氧化鎂、氫氧化鋁、紅燐系化合物、磷酸醋 子中具 種類， 環族環 了提高 子含量 下者爲 有硬化 樹脂組 胺系硬 爲環氧 係爲胺 摻混已 無機充 脫膜劑 脂之成 氧化矽 石等， 氧化矽 環氧樹 系化合 1378827 物等，無機塡充物用偶合劑之例係有矽烷系及鈦系等，脫 膜劑之例係有脂肪族石蠟、高級脂肪族醇類等的蠟。 除了上述的成分之外，亦可含有反應性稀釋劑、溶劑 . 或觸變劑等。具體而言，反應性稀釋劑可例示如丁基苯基 '' 縮水甘油醚、溶劑可例示如甲基乙基酮、觸變劑可例示如 - 有機改質膨潤土。 本發明無機陰離子交換體的理想配合比例，係每100 重量份的電子零件密封用樹脂組成物，爲0.1〜10重量份， • 更較佳係1〜5重量份。配合比例係爲0.1重量份以上時， 由於提升陰離子除去性或耐濕可靠性的效果大而爲佳。另 —方面，10重量份以下時，得到充分效果的同時，由於不 會妨礙成本提升而爲佳。 藉由對於本發明的無機陰離子交換體，倂用無機陽離 子交換體，能增加本發明無機陰離子交換體的陰離子捕捉 能，且可追加陽離子性離子的捕捉效果。無機陽離子交換 體係爲無機物，且具有陽離子交換性之物質。 ® 本發明的無機陰離子交換體與無機陽離子交換體的配 合比係沒有特別地限制，惟重量比以1 0 0 : 0〜2 0 : 8 0爲佳。 ' 本發明的無機陰離子交換體與無機陽離子交換體的配合， : 可在做電子零件密封用樹脂組成物之際各別配合，亦可藉 由將彼等預先均勻混合而進行。較佳係使用混合物者。藉 由如上述般進行，可因而進一步發揮倂用此等成分的效果。 無機陽離子交換體的具體例可舉例如銻酸（五氧化銻水 合物）、鈮酸（五氧化鈮水合物）、錳氧化物、磷酸銷、磷酸 -16- 1378827 駄、隣酸錫、磷酸铈、沸石、及滑石礦物等，以銻酸（五氧 化錄水合物）、磷酸鉻、及磷酸鈦爲佳。 本發明的電子零件密封用樹脂組成物可藉由眾所周知 的方法混合上述原料而容易得到，例如適當摻混上述各原 料’將該配合物在捏合機於加熱狀態進行捏合，形成半硬 化狀的樹脂組成物’將其冷卻至室溫後，經由眾所周知的 手段加以粉碎，視情況打錠而可得到者。 本發明的無機陰離子交換體可使用於電子零件或電氣 零件的密封 '被覆、及絶緣等的各式各樣用途。 再者’聚氯乙烯等的樹脂安定劑、防銷劑等中亦可使 用本發明的無機陰離子交換體。 摻混本發明無機陰離子交換體的電子零件用樹脂組成 物，可使用於在引線框、配線結束的輸送用膠帶、配線板、 玻璃、砂晶圓等的支持構件中，搭載半導體晶片、電晶體、 一極體、閘流電晶體等的能動元件、電容器、電阻體、線 圏等的受動元件等的元件者等。又，印刷電路板中亦可有 效使用本發明的電子零件密封用樹脂組成物。亦可同樣地 使用慘混本發明無機陰離子交換體的電子零件密封用環氧 樹脂組成物。 使用本發明的電子零件密封用樹脂組成物或電子零件 密封用環氧樹脂組成物而密封元件之方法，低壓轉移成形 法爲最一般的，可使用注射成形法、壓縮成形法等。 〇關於配線板的應用 使用環氧樹脂等的熱固性作爲印刷配線基板，於其上 1378827 黏著銅箔等，將其進行蝕刻加工等來製作電路，以製作配 線板。然而近年來，由於電路的高密度化、電路的積層化 及絶緣層的薄膜化等，而有腐蝕或絶緣不良的問題》在製 . 作配線板時，藉由添加本發明的無機陰離子交換體，可防 ' 止如此的腐蝕。又，藉由在配線板用的絶緣層中添加本發 - 明的無機陰離子交換體，可防止配線板的腐蝕等。藉此， 含有本發明無機陰離子交換體之配線板，可抑制起因於腐 蝕等之不良品發生。相對於該配線板或配線板用絶緣層中 ^ 的樹脂固體成分1〇〇重量份，添加0.1〜5重量份的本發明 無機陰離子交換體爲佳。此處含有無機陽離子交換體爲佳。 ' 〇關於黏著劑的摻混 在配線板等的基板上使用黏著劑來封裝電子零件等。 此時藉由在所使用的黏著劑中添加本發明的無機陰離子交 換體，可抑制起因於腐蝕等的不良品發生。相對於該黏著 劑中的樹脂固體成分100重量份，添加〇·1〜5重量份的本 發明的無機陰離子交換體爲佳。此處含有無機陽離子交換 籲體爲佳。 藉由在配線板連接或配線電子零件等時所使用的傳導 • 性黏著劑等中，添加本發明的無機陰離子交換體，可抑制 : 起因於腐蝕等的不良品發生。該傳導性黏著劑可例示如含 有銀等的傳導性金屬者。相對於該傳導性黏著劑中的樹脂 固體成分100重量份，添加0.1〜5重量份的本發明無機陰 離子交換體爲佳。此處含有無機陽離子交換體爲佳。 〇關於清漆的摻混 1378827 使用含有本發明無機陰離子交換體的清漆，可製作電 氣製品、印刷配線板、或i子零件等。該清漆可例示如環 氧樹脂等的熱固性樹脂爲主要成分者。相對於該樹脂固體 . 成分100重量份’添加〇‘1〜5重量份的本發明的無機陰離 _ 子交換體爲佳。此處含有無機陽離子交換體爲佳。 = 〇關於糊劑的摻混 在含有銀粉等之糊劑中，可添加本發明的無機陰離子 交換體。糊劑係作爲賦予圖案等的補助劑，用於使連接金 • 屬彼此的黏著良好者。藉此，可抑制因糊劑所產生之腐蝕 性物質的發生。相對於該糊劑中的樹脂固體成分1〇〇重量 " 份’添加〇·1〜5重量份的本發明無機陰離子交換體爲佳。 此處含有無機陽離子交換體爲佳。 關於釔化物之無機陰離子交換體之製法，較佳實施態 樣之例係如以下所示。 (1 ) 一種具有陰離子交換活性之釔化物製法，其特徵係 包括以下步驟： ® 將硝酸釔的水溶液調整成鹼性，使沈殿生成之步驟， 使該沈殿物經加熱熟成處理後進行乾燥、加熱該乾燥 ' 物之步驟，或 :直接乾燥該沈澱物，加熱該乾燥物之步驟。 (2)—種具有陰離子交換活性之釔化物製法，其特徵係 包括以下步驟： 將硝酸釔的水溶液調整成鹼性，使沈殿生成之步驟， 使該沈殿物經加熱熟成處理後進行乾燥之步驟， -19- 1378827 加熱該乾燥物之步驟。 (3) —種具有陰離子交換活性之釔化物製法，其特徵係 包括以下步驟： 將硝酸釔的水溶液調整成鹼性，使沈殿生成之步驟， 使該沈殿物直接乾燥之步驟、 加熱該乾燥物之步驟。 (4) 一種具有陰離子交換活性之釔化物製法，其特徵係 包括以下步驟： 將硝酸釔的水溶液調整成PH7.5〜12、於1〜80 °C的水 溫下使沈殿之步驟， 在該沈殿物於1 〇〇〜300°C下經加熱熟成處理後乾燥、 將該乾燥物於150〜1,000 °C下進行加熱之步驟，或 使沈殿物直接乾燥、將該乾燥物於150〜1,000°C下進 行加熱之步驟。 (5) —種具有陰離子交換活性之釔化物製法，其特徵係 包括以下步驟： 將硝酸釔的水溶液調整成PH7.5〜12、於1〜80 °C的水 溫下使沈殿之步驟， 使該沈殿物於1〇〇〜300°C下經加熱熟成處理後在80 〜250 °C下被乾燥、該乾燥物於150〜1,000 °C下進行加熱之 步驟，或 使該沈殿物直接於80〜250°C下乾燥、該乾燥物於150 〜1,00 0°C下進行加熱之步驟。 —種釔化物，其特徵係具有以上述（1)〜（5)中任一項中 -20 - 1378827 記載之製造方法所得之陰離子交換活性。 【實施方式】 <實施例> . 以下，列舉實施例及比較例以進一步詳細說明本發 _ 明，惟本發明係爲不受其限制。此外，％爲重量％，份爲重 : 量份。 實施例1 —邊將1 〇 g的硝酸紀溶解於1 0 0 m I的純水中、使該溶 ® 液保持於25°C，一邊以氨水溶液調整成pH9。而且·，攪拌 該溶液1小時後，過濾沈殿物，以純水洗淨。 將該沈殿物裝入乾燥機，於200°C下加熱24小時。之 後，粉碎以得到釔化物（化合物1 )。進行該化合物1的分析 時，爲 YziOHh.HNOJo.g. H20。 實施例2 實施例1所合成的化合物1係進一步在4 0 0 °C下加熱4 小時，以得到化合物 2。進行該化合物的分析時，爲 ® Υ2〇2(Ν03)2。 實施例3 • —邊將1 〇 g的硝酸配溶解於1 0 0 m I的純水中、使該溶 :液保持於25 °C，一邊以氨水溶液調整成pH9。然後，攪拌 該溶液1小時後，裝入聚四氟乙烯製的密閉容器內，於180 '°C下進行24小時加熱處理。之後，放冷至室溫，過濾沈殿 物，以純水洗淨。 將其放入乾燥機，於2 00 °C下加熱24小時，然後於500 1378827 °C下加熱4小時。接著，粉碎以得到釔化物（化合物3)。進 行該化合物3的分析時，爲Y2〇3。 <比較例1 > . —邊將10g的硝酸鑭溶解於100ml的純水中、使該溶 : 液保持於25°C，一邊以氨水溶液調整成pH9。而且，攪拌 : 1小時後，過濾沈殿物，以純水洗淨。 將該沈殿物裝入乾燥機，於200°C下加熱24小時。之 後，粉碎以得到鑭化合物（比較化合物1 )。進行該比較化合 •物 1 的分析時，爲 La2(0H)4(N03)2 · 2H20。 <比較例2 > ' 比較例1所合成的比較化合物1係進一步在400°C下加 熱4小時，以得到比較化合物2。進行該化合物的分析時， 爲 La2〇2(N〇3)2。 <比較例3 > —邊將1〇g的硝酸鑭溶解於100ml的純水中、使該溶 液保持於25 °C，一邊以氨水溶液調整成pH9。然後攪拌該 ® 溶液1小時後，裝入聚四氟乙烯製的密閉容器內，於180 °C下進行24小時加熱處理。之後，放冷至室溫，過濾沈殿 ' 物，以純水洗淨。 - 將其放入乾燥機，於200°C下加熱24小時，更C於 5 〇 〇 °C下加熱4小時。接著粉碎，以得到鑭化合物（比較化 合物3)。進行該比較化合物3的分析時，爲La203。 <參考化合物1 > 使用三氧化鉍Bi203作爲參考化合物1 » -22- 1378827 <參考化合物2 > 使用鉍系陰離子交換體ΙΧΕ-500(東亞合成股份有限公 司製）作爲參考化合物2。 . <離子交換容量測定試驗> 將1.〇g的化合物1陰離子交換體1裝入100ml的聚乙 - 烯製的瓶子內’然後再投入50ml的0.1M /公升濃度的鹽 酸’密栓且於40°C下振盪24小時。之後，以孔尺寸〇.1 的膜濾器過濾該溶液，濾液中的氯離子濃度係以離子層析 Φ 法來加以測定。沒有放入任何固體成分也進行同樣的操 作，與經測定的氯離子濃度者比較，以測定陰離子交換容 量（m e q/g )。其結果係如表1中所示。 化合物2、3、比較化合物1〜3、及參考化合物1、2 亦進行同樣地操作，測定離子交換容量。彼等結果係如表1 中所示。 【表1】 化學式等____ 陰離子交換量（meq/g) 實施例1 V2(〇H)5.l(N〇3)〇.9-H20 2 實施例2 Υ2〇2(Ν〇3)2 2.5 實施例3 Υ2〇3 _ _ 3.6 比較例1 La2(〇H)4(N〇3)2-2H2〇 0.2 比較例2 La2〇2(N〇3)2 0.4 比較例3 La2〇3 1 參考例1 Bi2〇3 3.9 參考例2 IXE-500 3.9 -23 - 1378827 ’ 實施例4 摻混80份的甲苯酚酚醛清漆型環氧樹脂（環氧當量 235)、20份的溴化苯酚酚醛清漆型環氧樹脂（環氧當量 • 275)、50份的苯酚酚醛清漆樹脂（分子量700〜1,〇〇0)、2 \ 份的三苯膦、1份的巴西棕櫚蠟、1份的碳黑、370份的溶 : 融二氧化矽、及2份的化合物1，將其以8 01〜9 01的熱 輥捏合3〜5分鐘。之後，冷却、粉碎，以得到粉末狀環氧 樹脂組成物A。而且，該組成物a係用1 0 0網目的篩進行 • 舖選，以製作1 0 0餘孔的試料。 使用該1 0 0篩孔的試料，使其於1 7 〇。(：下硬化，以製作 樹脂混入體1。將該樹脂混入體1粉碎成2〜3mm的大小。 使用該粉碎試料來進行氯離子的洗析試驗。 實施例5 除了使用化合物2取代化合物1以外，進行與樹脂混 入體1的製作同樣地操作，以製作樹脂混入體2的粉碎試 料。 ® 實施例6 除了使用化合物3取代化合物1以外，進行與樹脂混 • 入體1的製作同樣地操作，以製作樹脂混入體3的粉碎試 ，料。 <比較例4 > 除了使用比較化合物1取代化合物1以外，進行與樹 脂混入體1的製作同樣地操作，以製造比較樹脂混入體1 的粉碎試料。 -24 - 1378827 <比較例5 > 除了使用比較化合物2取代化合物1以外，進行與樹 脂混入體1的製作同樣地操作，以製造比較樹脂混入體2 的粉碎試料。 <比較例6 > 除了使用比較化合物3取代化合物1以外，進行與樹 脂混入體1的製作同樣地操作，以製造比較樹脂混入體3 的粉碎試料。 <比較例7 > 除了不使用化合物1以外，進行與樹脂混入體1的製 作同樣地操作，以製造比較樹脂混入體0的粉碎試料。亦 即，比較樹脂混入體0係爲不含有化合物1者。 <參考例3 > 除了使用參考化合物1取代化合物1以外，進行與樹 脂混入體1的製作同樣地操作，參考樹脂混入體1的粉碎 試料。 <參考例4 > 除了使用參考化合物2取代化合物1以外，進行與樹 脂混入體1的製作同樣地操作，參考樹脂混入體2的粉碎 試料。 <由樹脂混入體的氯離子抽出試驗> 將上述所製作的5g的各樹脂混入體、比較樹脂混入體 或參考樹脂混入體與5 0ml的純水裝入聚四氟乙嫌製耐壓容 器加以密閉’於1 2 5 °C下加熱1 〇 〇小時。冷却後，取出水， -25- 1378827 於水中所洗析的氯離子濃度係以離子層析法加以測定。又 測定該水的Ρ Η。彼等結果係如表2中所示。 【表2】 試驗試料 氯離子濃度（ppm) pH 實施例4 樹脂混入體1 19 4.3 實施例5 樹脂混入體2 19 4.3 !施例6 樹脂混入體3 20 4.3 比較例4 比較樹脂混入體1 56 4.3 比較例5 比較樹脂混入體2 53 4.3 比較例6 比較樹脂混入體3 50 4.3 比較例7 比較樹脂混入體4 19 4.3 參考例3 — —— 參考樹脂混入體1 18 4.3 參考例4 參考樹脂混入體2 60 4.2 <吸濕性的測定> 將2.0g實施例1所製作的化合物1裝入氧化鋁製容 器，在35°C、濕度90 %的恆溫恆濕器内放置24小時。然後 測定24小時後的重量，以求得增加率。其結果係如表3中 所示。 化合物2及3、比較化合物1〜3、參考化合物1及2 亦進行同樣地試驗。其結果係如表3中所示。 <上清的導電度的測定> 將0.5g的化合物1裝入1〇〇ml的聚丙烯製的瓶子內， 再投入50ml的純水，拴緊，於1〇〇 °C下保持24小時。此外， -26 - 1378827 瓶中設有小孔。 2 4小時後’冷却、以〇 . 1 μ m的膜濾器過濾該溶液，測 定濾液的導電度。其結果係如表3中所示。 化合物2及3、比較化合物1〜3、參考化合物1及2 亦進行同樣地試驗。其結果係如表3中所示。 【表3】 吸濕性（wt%) 導電度（ps/cm) 實施例1 4.1 26 實施例2 2.7 35 實施例3 0.5 10 比較例1 >10 > 100 比較例2 >10 > 100 比較例3 >10 > 100 參考例4 0.5 8 參考例5 0.5 10 <與陽離子交換體的摻混> 實施例1所合成的化合物1與陽離子交換體之α磷酸 锆係以重量比1 : 1進行充分地混合，以製作混合物1。使 用該混合物1用於離子交換率的測定。 化合物2、化合物3、參考化合物1、及參考化合物2 亦進行與上述同樣地操作，以製作混合物2、混合物3、參 考混合物4、及參考混合物5。關於此等物係使用於離子交 換率的測定。 -27 - 1378827 <離子交換率測定試驗> 將1.0g的混合物1裝入100ml的聚丙烯製的瓶子內， 投入50ml的0.02M氯化鈉水溶液，密检且於4〇 〇c下振盪 • 2 4小時。之後’以孔尺寸〇 · 1 μ m的膜濾器過濾溶液，測定 : 濾液中的氯離子濃度。對僅含有氯化鈉水溶液者亦進行同 '' 樣的操作，來測定氯離子濃度。混合物1的陰離子交換率 係藉由此等所測定之値來算出，如表4所示。 混合物2、混合物3、參考混合物1、及參考混合物2 ® 亦進行同樣地操作，以算出離子交換率，其係如表4所示。 又，化合物1、化合物2、化合物3、參考化合物1、及參 " 考化合物2亦進行同樣地操作，以算出離子交換率，其係 如表4所示。 【表4】 離子交換率 混合物1 化合物1 + α碟酸銷 98% 混合物2 化合物2+α隣酸結 99% 混合物3_ 化合物3+ α磷酸锆 95% 參考混合物1 參考化合物1 + α磷酸锆 96% 參考混合物2 參考化合物2 + α磷酸锆 99% 化合物1 Y2(〇H)5 9·Η2〇 20% 化合物2 Υ202(Ν03)2 40% 化合物3 2% _ . ^—3— 參考化合物1 Β Ϊ2〇3 5% 參考化合物2 ΙΧΕ-500 _---- 70% • 28- 1378827 * 根據表1〜4可明顯得知，本發明的無機陰離子交換體 係離子交換容量大，即使在高溫高濕下溶解性也低’再者 吸濕性低。又，添加至密封材樹脂中，亦具有抑制氯離子 洗析的效果。據此，可提供廣泛範圍且可靠性高的密封材 φ 組成物。 -- 又，藉由形成含陽離子交換體之樹脂組成物，可表現 出更高的離子交換率。 【產業上的可利用性】 ® 本發明的無機陰離子交換體係在環境性或陰離子交換 ' 性方面優異。又，本發明的無機陰離子交換體係爲不使用 * 在吸濕性或再循環面有問題的水滑石或鉍化合物的無機陰 離子交換體。而且，在樹脂中摻混本發明的無機陰離子交 換體，亦可有抑制陰離子洗析之效果。因此，本發明的無 機陰離子交換體可使用於廣泛範圍且可靠性高的電子零件 或電氣零件的密封、被覆、及絶緣等的各式各樣用途。又， 本發明的無機陰離子交換體亦可使用於氯乙烯等的樹脂安 ® 定劑、防錡劑等。 【圖式簡單說明】：無》 -29-Specific examples of the telluride in the present invention include, for example, YaiOHh.jNOJo. 9·η2ο, υ2ο2 (νο3) 2, Y203, and the like, and may also be exemplified as y2(〇h)6, Υ2(〇Η)4( Ν03)2, Y2(0H)3(N03)3, Y2(0H>2(N03)4, y2(oh)(no3)5, y2〇(〇h)4, y2o(oh)3(no3), Y20(0H)2(N03)2, Y • 2〇(〇H)(N〇3)3, Y20(N03)4, Y2〇2(〇H)2, Y2〇2(〇H)(N03) Y2〇2(N03)2, etc. • The raw material for obtaining the telluride of the present invention can be used regardless of the anion exchange property of the formula (υ _-). For example, The telluride in the present invention is obtained by adjusting an aqueous solution of cerium nitrate to a basic state to form a phlegm, drying it, and heating it. Further, for example, cerium oxide is solubilized by using nitric acid, and is carried out by using it. The telluride of the present invention can be obtained by the treatment described above. 1378827 The telluride of the present invention can be obtained by adjusting the aqueous solution of cerium nitrate to be alkaline to form a sag, drying it and heating it. Preferably, the pH is 7.5 to 12, the pH is preferably 8 to 11, and more preferably the pH is 8.5 to 10. The water temperature at the time of the treatment is preferably 1 to 8 CTC, and 10 to 6 (TC is preferably '15. 40 to 40 ° C. More preferably. As the pH adjustment, an alkali metal such as alkali metal hydroxide or carbonate is exemplified. A metal salt, an alkali metal hydrogencarbonate, ammonia, and a compound which generates ammonia by heating (for example, urea or hexamethylenetetramine), etc., preferably sodium and potassium are used as the adjustment p. The latter is more preferably ammonia and a compound which generates ammonia by heating (for example, urea or hexamethylenetetramine), etc. The telluride in the present invention is adjusted by, for example, an aqueous solution of cerium nitrate. It is produced and heated and matured, and then obtained by drying and heat treatment. The heating temperature of the heating and ripening treatment has a desired temperature depending on the heating time. For example, the heating temperature is 1 〇〇 to 300 ° C. Preferably, 130 to 250 ° C is preferred, and 150 to 200 ° C is more preferable. The heating time of the heating and ripening treatment is different depending on the heating temperature, and the preferred time is different. The heating time is preferably short at a high temperature, generally Words, 2~72 ® hours are better, 10~48 hours is better, 15~3 0 hours is more preferable. Drying can be carried out at room temperature or in a drying oven. That is, if any excess water can be removed from the sediment, what kind of treatment can be performed.. For example, the present invention The drying temperature is preferably 80 to 250 ° C, more preferably 110 to 200 ° C. Further, the drying and heating may be simultaneously performed. In this case, reaching a slightly lower temperature until removal, and then rising to the heating temperature It is better. The telluride in the present invention can be obtained by drying the above-mentioned shoal and then performing heat treatment. The heating temperature is preferably -12 to 1378827 depending on the heating time. For example, the heating temperature is preferably 1 500 to 1, Ο Ο 0 °c, and 1 800 to 9 Ο Ο ° (: preferably, 200 to 850 ° C is more preferable. The heating time of the heat treatment is The heating time is preferably different depending on the heating temperature. The heating time is preferably short at a high temperature. Generally, it is preferably 1 to 72 hours, preferably 2 to 48 hours, and more preferably 3 to 30 hours. Preferably, the telluride in the present invention obtained as described above is pulverized according to the purpose, and a desired particle diameter can be obtained. The particle size of the telluride in the present invention is not limited, but is preferably average. • The particle size is 0.01 to 10 μm, which is more preferably 0 to 05 to 3 μΓτι. When the particle diameter is 0.01 to 10 pm, the particles do not aggregate with each other, and it is preferable that the resin is added to the resin without impairing the physical properties. Anion exchange capacity The anion exchange capacity in the present invention is measured using hydrochloric acid. The measurement is carried out by charging 1 g of a sample with 50 ml of a 0.1 liter/liter hydrochloric acid into a 100 ml polyethylene bottle at 40 Oscillation at 〇C for 24 hours, after which the chloride ion concentration of the supernatant is ionized The measurement method is carried out. The ion exchange capacity is calculated as a blank test 不 without measuring the chloride ion concentration in the same manner as in the test sample. The anion exchange capacity of the inorganic anion exchanger of the present invention is preferably 1 meq/g or more. Preferably, it is more than 1.5 meq/g, more preferably 1.8 meq/g or more, more preferably 4.5 meq/g or less, more preferably 4.3 meq/g or less, and more preferably 4 meq/g or less. In the above range, it is preferable that the conductivity of the resin of the anion exchanger of the present invention is not impaired. 1378827 The conductivity of the conductive supernatant is filled with pure water in a sample, stirred, and the supernatant is measured. For the measurement, the sample of 〇.5g and 50ml of pure water were placed in a 1ml bottle of polypropylene and kept at 24 hours under 1〇0. The conductivity of the supernatant is as follows: The conductivity of the supernatant in the inorganic anion exchanger of the present invention is preferably 200 pS/cm or less, preferably less than i50 pS/cm, and more preferably l〇〇pS/cm or less, and further 1 pS/cm. The above is preferable, 3 pS/cm or more is preferable, and β SpS/cm or more is more preferable. When the conductivity of the clearness is in the above range, it is preferable that the resin property of the inorganic anion exchanger of the present invention is not impaired. For example, the inorganic anion exchange system of the present invention has an anion exchange capacity of 1 meq/g or more, and It is preferable that the inorganic anion exchanger having a conductivity of 200 pS/cm or less is used. The resin used for the electronic component sealing resin composition of the inorganic anion exchanger of the present invention may be a resin composition for encapsulating the electronic component. Phenolic resin, urea resin, melamine resin 'unsaturated polyester resin, and thermosetting resin such as epoxy resin, 'may also be thermoplastics such as polyethylene, polystyrene, vinyl chloride, and polypropylene: resin' is preferred Thermosetting resin. The thermosetting resin used in the resin composition for encapsulating electronic parts of the present invention is preferably a phenol resin or an epoxy resin, particularly preferably an epoxy resin.环氧树脂 Epoxy resin composition for sealing electronic parts The epoxy resin used in the present invention can be used without limitation if it can be used as a sealing resin for electronic parts. For example, if there are two or more epoxy groups in one part and can be cured, any one of phenol novolak type epoxy resin, bisphenol A type epoxy resin, fat, oxygen resin, etc. can be used as Use of forming materials. Further, in the moisture resistance of the composition of the present invention, the epoxy resin is preferably used in an amount of 1 〇 ppm or less and a water-decomposable chlorine content of 1,000 ppm. In the present invention, it is preferred that the epoxy resin composition for electronic component sealing contains a curing agent and a curing accelerator. As the curing agent used in the present invention, any one of curing agents known as epoxy resins can be used, and preferred examples thereof are an acid anhydride, a chemical agent, and a novolac-based curing agent. The hardening accelerator used in the present invention may be any one of a curing accelerator known as a resin composition, preferably a specific example, a phosphorus-based, and an imidazole-based accelerator. The resin composition for electronic parts of the present invention may also be known as a component of a resin for blending molding, as needed. The component may, for example, be a sputum, a flame retardant, a coupling agent for inorganic sputum, a coloring agent, and the like. These components are known to be blended as any epoxy resin for forming: Preferable specific examples of the inorganic filler include, for example, crystalline two powder, quartz glass powder, molten cerium oxide powder, alumina powder, and slippery, especially crystalline cerium oxide powder, quartz glass powder, and molten granules, which are inexpensive. And better. Examples of the flame retardant include yttrium oxide, halogenated moon, magnesium hydroxide, aluminum hydroxide, red lanthanum compound, and phosphoric acid vinegar, and the ring-shaped ring has an enhanced sub-content. Hard epoxy is an amine-doped inorganic chelating agent, yttrium oxide, etc., yttrium oxide epoxide, 1378, 827, etc., and examples of coupling agents for inorganic ruthenium are decane and titanium. Etc., examples of the release agent are waxes of aliphatic paraffin, higher aliphatic alcohols, and the like. In addition to the above components, a reactive diluent, a solvent, a thixotropic agent, or the like may be contained. Specifically, the reactive diluent may, for example, be butylphenyl ''glycidyl ether, the solvent may be exemplified by methyl ethyl ketone, and the thixotropic agent may be exemplified by, for example, an organically modified bentonite. The inorganic compounding agent of the present invention is preferably used in an amount of 0.1 to 10 parts by weight, more preferably 1 to 5 parts by weight, per 100 parts by weight of the resin composition for sealing electronic parts. When the blending ratio is 0.1 part by weight or more, the effect of improving anion removal property or moisture resistance reliability is high. On the other hand, when it is 10 parts by weight or less, a sufficient effect is obtained, and it is preferable because it does not hinder the cost increase. By using the inorganic anion exchanger of the inorganic anion exchanger of the present invention, the anion trapping ability of the inorganic anion exchanger of the present invention can be increased, and the trapping effect of the cationic ions can be added. The inorganic cation exchange system is an inorganic substance and has a cation exchange property. The ratio of the inorganic anion exchanger to the inorganic cation exchanger of the present invention is not particularly limited, but the weight ratio is preferably from 1 0 0 : 0 to 2 0 : 80. The blending of the inorganic anion exchanger of the present invention and the inorganic cation exchanger can be carried out separately when the resin composition for electronic component sealing is used, or by uniformly mixing them in advance. It is preferred to use a mixture. By carrying out as described above, the effect of using these components can be further exerted. Specific examples of the inorganic cation exchanger include citric acid (ruthenium pentoxide hydrate), citric acid (ruthenium pentoxide hydrate), manganese oxide, phosphoric acid pin, phosphoric acid-16-1378827 hydrazine, tin orthophosphate, strontium phosphate. Zeolite, talc minerals, etc., preferably decanoic acid (pentoxide oxide hydrate), chromium phosphate, and titanium phosphate. The resin composition for sealing an electronic component of the present invention can be easily obtained by mixing the above-mentioned raw materials by a known method. For example, the above-mentioned respective raw materials are appropriately blended. The complex is kneaded in a kneading machine in a heated state to form a semi-hardened resin. After the composition is cooled to room temperature, it is pulverized by a well-known means, and it can be obtained by ingot. The inorganic anion exchanger of the present invention can be used for various applications such as sealing, coating, and insulation of electronic parts or electrical parts. Further, the inorganic anion exchanger of the present invention may be used in a resin stabilizer such as polyvinyl chloride or the like. The resin composition for an electronic component of the inorganic anion exchanger of the present invention can be used for mounting a semiconductor wafer or a transistor in a support member such as a lead frame or a transfer tape for wiring, a wiring board, a glass, or a sand wafer. An element such as an active element such as a one-pole or a thyristor, a component such as a capacitor, a resistor, or a coil, or the like. Further, the resin composition for electronic component sealing of the present invention can be effectively used in a printed circuit board. The epoxy resin composition for sealing electronic parts of the inorganic anion exchanger of the present invention can also be used in the same manner. The method of sealing the element by using the resin composition for electronic component sealing of the present invention or the epoxy resin composition for sealing electronic parts, the low pressure transfer molding method is the most common, and an injection molding method, a compression molding method, or the like can be used. 〇In the application of the wiring board, a thermosetting property such as an epoxy resin is used as a printed wiring board, and a copper foil or the like is adhered to the upper layer 1378827, and an electric circuit is formed by etching to prepare a wiring board. However, in recent years, there has been a problem of corrosion or poor insulation due to high density of circuits, lamination of circuits, thinning of an insulating layer, etc., by adding the inorganic anion exchanger of the present invention when manufacturing a wiring board. Can prevent 'such corrosion. Further, by adding the inorganic anion exchanger of the present invention to the insulating layer for a wiring board, it is possible to prevent corrosion of the wiring board and the like. As a result, the wiring board containing the inorganic anion exchanger of the present invention can suppress the occurrence of defective products caused by corrosion or the like. It is preferable to add 0.1 to 5 parts by weight of the inorganic anion exchanger of the present invention to 1 part by weight of the resin solid content in the insulating layer of the wiring board or the wiring board. It is preferred to contain an inorganic cation exchanger here. 〇Abding the adhesive The electronic components are packaged on the substrate such as the wiring board using an adhesive. At this time, by adding the inorganic anion exchange of the present invention to the adhesive to be used, it is possible to suppress the occurrence of defective products due to corrosion or the like. The inorganic anion exchanger of the present invention is preferably added in an amount of from 1 to 5 parts by weight based on 100 parts by weight of the resin solid content in the adhesive. It is preferred to include an inorganic cation exchange body here. By adding the inorganic anion exchanger of the present invention to a conductive adhesive or the like which is used when the wiring board is connected or wired to an electronic component or the like, it is possible to suppress the occurrence of defective products due to corrosion or the like. The conductive adhesive can be exemplified by a conductive metal containing silver or the like. It is preferred to add 0.1 to 5 parts by weight of the inorganic anion exchanger of the present invention to 100 parts by weight of the resin solid content in the conductive adhesive. It is preferred to contain an inorganic cation exchanger here.掺Incorporation of varnish 1378827 A varnish containing the inorganic anion exchanger of the present invention can be used to produce an electric product, a printed wiring board, or an i sub-part. The varnish can be exemplified by a thermosetting resin such as an epoxy resin. The inorganic anion-exchanger of the present invention is preferably added in an amount of from 1 to 5 parts by weight based on 100 parts by weight of the component of the resin solids. It is preferred to contain an inorganic cation exchanger here. = 掺 About blending of paste The inorganic anion exchanger of the present invention can be added to a paste containing silver powder or the like. The paste is used as a supplementary agent for imparting a pattern or the like, and is used for adhering gold to each other. Thereby, the occurrence of corrosive substances by the paste can be suppressed. The inorganic anion exchanger of the present invention is preferably added in an amount of from 1 to 5 parts by weight based on 1 part by weight of the resin solid content in the paste. It is preferred to contain an inorganic cation exchanger here. The preferred embodiment of the method for producing the inorganic anion exchanger of the telluride is as follows. (1) A method for preparing a telluride having anion exchange activity, comprising the steps of: adjusting an aqueous solution of cerium nitrate to a basicity to form a step of forming a shovel, and drying and heating the shovel after heating and aging treatment; The step of drying the product, or the step of directly drying the precipitate and heating the dried product. (2) A method for preparing a telluride having an anion exchange activity, comprising the steps of: adjusting an aqueous solution of cerium nitrate to be alkaline, forming a step of forming a temple, and drying the shovel after heating and aging treatment , -19- 1378827 The step of heating the dried product. (3) A method for preparing a telluride having anion exchange activity, comprising the steps of: adjusting an aqueous solution of cerium nitrate to be alkaline, forming a step of forming a temple, directly drying the shovel, and heating the dried product The steps. (4) A method for preparing a telluride having anion exchange activity, comprising the steps of: adjusting an aqueous solution of cerium nitrate to a pH of 7.5 to 12, and at a water temperature of 1 to 80 ° C, The shoji is dried at a temperature of 1 〇〇300 ° C, dried by heating, and the dried product is heated at 150 to 1,000 ° C, or the dried matter is directly dried, and the dried product is 150 to 1,000 °. The step of heating is carried out under C. (5) A method for preparing a telluride having anion exchange activity, comprising the steps of: adjusting an aqueous solution of cerium nitrate to a pH of 7.5 to 12, and at a water temperature of 1 to 80 ° C, The shovel is dried at 80 to 250 ° C after being heated and cooked at 1 to 300 ° C, and the dried product is heated at 150 to 1,000 ° C, or the structure is directly heated to 80. The mixture is dried at -250 ° C, and the dried product is heated at 150 to 1,100 ° C. And an anion exchange activity obtained by the production method described in any one of the above (1) to (5). [Embodiment] <Examples> The following examples and comparative examples are given to further illustrate the present invention, but the present invention is not limited thereto. In addition, % is % by weight and parts are by weight: parts by weight. Example 1 - 1 〇 g of nitric acid was dissolved in 100 μm of pure water, and the solution was kept at 25 ° C, and adjusted to pH 9 with an aqueous ammonia solution. Further, after stirring the solution for 1 hour, the sediment was filtered and washed with pure water. The shovel was placed in a dryer and heated at 200 ° C for 24 hours. Thereafter, it was pulverized to obtain a telluride (Compound 1). When the analysis of the compound 1 was carried out, it was YziOHh.HNOJo.g. H20. Example 2 The compound 1 synthesized in Example 1 was further heated at 400 ° C for 4 hours to obtain a compound 2. For the analysis of this compound, it is ® Υ2〇2(Ν03)2. Example 3 • A 1 〇 g nitric acid solution was dissolved in 100 μm of pure water, and the solution was kept at 25 ° C while being adjusted to pH 9 with an aqueous ammonia solution. Then, the solution was stirred for 1 hour, and then placed in a sealed container made of polytetrafluoroethylene, and heat-treated at 180 °C for 24 hours. After that, let it cool to room temperature, filter the sediment, and wash it with pure water. It was placed in a dryer, heated at 200 ° C for 24 hours, and then heated at 500 1378827 ° C for 4 hours. Next, it was pulverized to obtain a telluride (compound 3). When the analysis of the compound 3 was carried out, it was Y2〇3. <Comparative Example 1 > - While dissolving 10 g of cerium nitrate in 100 ml of pure water and maintaining the solution at 25 ° C, it was adjusted to pH 9 with an aqueous ammonia solution. Moreover, stirring: After 1 hour, the sediment was filtered and washed with pure water. The shovel was placed in a dryer and heated at 200 ° C for 24 hours. Thereafter, it was pulverized to obtain a hydrazine compound (Comparative Compound 1). When the comparative compound 1 was analyzed, it was La2(0H)4(N03)2 · 2H20. <Comparative Example 2 > 'Comparative Compound 1 synthesized in Comparative Example 1 was further heated at 400 ° C for 4 hours to obtain Comparative Compound 2. When the compound was analyzed, it was La2〇2(N〇3)2. <Comparative Example 3 > - 1 〇g of cerium nitrate was dissolved in 100 ml of pure water, and the solution was adjusted to pH 9 with an aqueous ammonia solution while maintaining the solution at 25 °C. Then, the ® solution was stirred for 1 hour, and then placed in a sealed container made of polytetrafluoroethylene, and heat-treated at 180 ° C for 24 hours. After that, let it cool to room temperature, filter the sediment, and wash it with pure water. - Place it in a dryer, heat at 200 ° C for 24 hours, and heat C at 5 ° C for 4 hours. Then, it was pulverized to obtain a hydrazine compound (Comparative Compound 3). When the comparative compound 3 was analyzed, it was La203. <Reference compound 1 > Using ruthenium teoxide Bi203 as a reference compound 1 » -22- 1378827 <Reference compound 2 > A ruthenium anion exchanger ΙΧΕ-500 (manufactured by Toagosei Co., Ltd.) was used as the reference compound 2. <Ion exchange capacity measurement test> 1.1 g of the compound 1 anion exchanger 1 was placed in a 100 ml bottle made of polyethylene-ene. Then, 50 ml of a 0.1 M / liter hydrochloric acid 'tight plug was added. Shake at 40 ° C for 24 hours. Thereafter, the solution was filtered with a membrane filter having a pore size of 11, and the chloride ion concentration in the filtrate was measured by an ion chromatography Φ method. The same operation was carried out without any solid component, and the anion exchange capacity (m e q/g ) was measured in comparison with the measured chloride ion concentration. The results are shown in Table 1. Compounds 2 and 3, Comparative Compounds 1 to 3, and Reference Compounds 1 and 2 were also treated in the same manner, and the ion exchange capacity was measured. Their results are shown in Table 1. [Table 1] Chemical formula etc. Anion exchange amount (meq/g) Example 1 V2 (〇H) 5.l (N〇3)〇.9-H20 2 Example 2 Υ2〇2(Ν〇3)2 2.5 Example 3 Υ2〇3 _ _ 3.6 Comparative Example 1 La2(〇H)4(N〇3)2-2H2〇0.2 Comparative Example 2 La2〇2(N〇3)2 0.4 Comparative Example 3 La2〇3 1 Reference Example 1 Bi2〇3 3.9 Reference Example 2 IXE-500 3.9 -23 - 1378827 'Example 4 80 parts of cresol novolac type epoxy resin (epoxy equivalent 235), 20 parts of brominated phenol novolac type Epoxy resin (epoxy equivalent • 275), 50 parts of phenol novolac resin (molecular weight 700~1, 〇〇0), 2 parts of triphenylphosphine, 1 part of carnauba wax, 1 part of carbon black, 370 parts of the solution: enthalpy dioxide, and 2 parts of compound 1, which were kneaded by a hot roll of 8 01 to 9 01 for 3 to 5 minutes. Thereafter, it was cooled and pulverized to obtain a powdery epoxy resin composition A. Further, the composition a was subjected to a shop selection using a 100 mesh screen to prepare a sample of more than 100 holes. The sample of the 100 mesh was used to make it at 17 Torr. (: Hardening to prepare a resin mixed body 1. The resin mixed body 1 was pulverized to a size of 2 to 3 mm. The chloride sample was subjected to a elution test using the pulverized sample. Example 5 In addition to the use of the compound 2 in place of the compound 1 In the same manner as the production of the resin mixed body 1, the pulverized sample of the resin mixed body 2 was produced. Example 6 The same procedure as the production of the resin mixed body 1 was carried out except that the compound 3 was used instead of the compound 1. In the same manner as the production of the resin mixed body 1, the pulverization of the comparative resin mixed body 1 was carried out in the same manner as in the production of the resin mixed body 1 except that the comparative compound 1 was used instead of the compound 1. -24 - 1378827 <Comparative Example 5 > A pulverized sample of the comparative resin mixed body 2 was produced in the same manner as in the production of the resin mixed body 1 except that the compound 1 was used instead of the compound 1. 6 > In addition to the use of the comparative compound 3 in place of the compound 1, the same operation as in the production of the resin mixed body 1 was carried out to produce a comparative resin mixed body. (3) The pulverized sample of Comparative Example 7 <Comparative Example 7 > The pulverized sample of the comparative resin mixed body 0 was produced in the same manner as in the production of the resin mixed body 1 except that the compound 1 was not used. In the same manner as the production of the resin mixed body 1, the pulverized sample of the resin mixed body 1 is referred to. Reference Example 3 < Reference Example 1 < Reference Example 1 4 > In addition to the use of the reference compound 2 in place of the compound 1, the same procedure as in the production of the resin mixed body 1 was carried out, and the pulverized sample of the resin mixed body 2 was referred to. <Chlorine ion extraction test from the resin mixed body> 5 g of each of the resin admixture, the comparative resin admixture or the reference resin admixture and 50 ml of pure water were placed in a polytetrafluoroethylene pressure-resistant container to be sealed and heated at 1 2 5 ° C for 1 hour. After cooling, water was taken out, and the concentration of chloride ions eluted in water of -25-1378827 was measured by ion chromatography. The enthalpy of the water was measured. The results are shown in Table 2. [Table 2] Test sample Chloride ion concentration (ppm) pH Example 4 Resin mixed body 1 19 4.3 Example 5 Resin mixed body 2 19 4.3 ! Example 6 Resin mixed body 3 20 4.3 Comparative Example 4 Comparative resin mixed body 1 56 4.3 Comparative Example 5 Comparative resin mixed body 2 53 4.3 Comparative Example 6 Comparative resin mixed body 3 50 4.3 Comparative Example 7 Comparative resin mixed body 4 19 4.3 Reference Example 3 ——— Reference resin mixed body 1 18 4.3 Reference Example 4 Reference resin mixed in Body 2 60 4.2 <Measurement of hygroscopicity> 2.0 g of the compound 1 produced in Example 1 was placed in a container made of alumina, and placed in a thermo-hygrostat at 35 ° C and a humidity of 90% for 24 hours. Then, the weight after 24 hours was measured to determine the increase rate. The results are shown in Table 3. Compounds 2 and 3, Comparative Compounds 1 to 3, and Reference Compounds 1 and 2 were also tested in the same manner. The results are shown in Table 3. <Measurement of Conductivity of Supernatant> 0.5 g of Compound 1 was placed in a 1 ml polypropylene bottle, and 50 ml of pure water was added thereto, and the mixture was kneaded and kept at 1 ° C for 24 hours. hour. In addition, -26 - 1378827 bottles have small holes in them. After 2 hours, 'cooling, the solution was filtered with a 1 μm membrane filter, and the conductivity of the filtrate was measured. The results are shown in Table 3. Compounds 2 and 3, Comparative Compounds 1 to 3, and Reference Compounds 1 and 2 were also tested in the same manner. The results are shown in Table 3. [Table 3] Hygroscopicity (wt%) Conductivity (ps/cm) Example 1 4.1 26 Example 2 2.7 35 Example 3 0.5 10 Comparative Example 1 > 10 > 100 Comparative Example 2 > 10 > 100 Comparative Example 3 > 10 > 100 Reference Example 4 0.5 8 Reference Example 5 0.5 10 < Blending with a Cation Exchanger> The compound 1 synthesized in Example 1 and the α-zirconium phosphate of the cation exchanger were weight-based Mix well to a ratio of 1:1 to make a mixture 1. This mixture 1 was used for the measurement of the ion exchange rate. Compound 2, Compound 3, Reference Compound 1, and Reference Compound 2 were also treated in the same manner as above to prepare a mixture 2, a mixture 3, a reference mixture 4, and a reference mixture 5. These systems are used for the measurement of ion exchange rate. -27 - 1378827 <Ion exchange rate measurement test> 1.0 g of the mixture 1 was placed in a 100 ml polypropylene bottle, and 50 ml of a 0.02 M sodium chloride aqueous solution was placed, and the mixture was sealed and shaken at 4 °c. • 24 hours. Thereafter, the solution was filtered through a membrane filter having a pore size of 1 1 μm, and the concentration of chloride ions in the filtrate was measured. The same operation was carried out for those containing only aqueous sodium chloride solution to determine the chloride ion concentration. The anion exchange ratio of the mixture 1 was calculated from the enthalpy measured by the above, as shown in Table 4. The mixture 2, the mixture 3, the reference mixture 1, and the reference mixture 2 ® were also subjected to the same operation to calculate the ion exchange rate as shown in Table 4. Further, Compound 1, Compound 2, Compound 3, Reference Compound 1, and Reference Compound 2 were also subjected to the same operation to calculate an ion exchange ratio, which is shown in Table 4. [Table 4] Ion exchange ratio mixture 1 Compound 1 + α-acid acid pin 98% Mixture 2 Compound 2+α-o-acidate 99% Mixture 3_ Compound 3+ α-zirconium phosphate 95% Reference mixture 1 Reference compound 1 + α-zirconium phosphate 96 % Reference mixture 2 Reference compound 2 + α zirconium phosphate 99% Compound 1 Y2(〇H)5 9·Η2〇20% Compound 2 Υ202(Ν03)2 40% Compound 3 2% _ . ^—3—Reference compound 1 Β Ϊ2〇3 5% Reference compound 2 ΙΧΕ-500 _---- 70% • 28- 1378827 * It is apparent from Tables 1 to 4 that the inorganic anion exchange system of the present invention has a large ion exchange capacity even at high temperature and high humidity. The lower solubility is also low, and the hygroscopicity is low. Further, it is also added to the sealing material resin to suppress the elution of chloride ions. According to this, a wide range and high reliability of the sealing material φ composition can be provided. Further, by forming a resin composition containing a cation exchanger, a higher ion exchange ratio can be exhibited. [Industrial Applicability] The inorganic anion exchange system of the present invention is excellent in environmental properties or anion exchange properties. Further, the inorganic anion exchange system of the present invention is an inorganic anion exchanger which does not use * hydrotalcite or a ruthenium compound which has problems in hygroscopicity or recirculation surface. Further, the inorganic anion exchange of the present invention may be blended in the resin to suppress the anion elution. Therefore, the inorganic anion exchanger of the present invention can be used for various applications such as sealing, coating, and insulation of electronic parts or electrical parts of a wide range and high reliability. Further, the inorganic anion exchanger of the present invention can also be used as a resin stabilizer such as vinyl chloride or an anti-caries agent. [Simple description of the map]: None" -29-