WO2006048931A1 - カラム吸着ヘッドおよびカラム搭載方法 - Google Patents

カラム吸着ヘッドおよびカラム搭載方法 Download PDF

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Publication number
WO2006048931A1
WO2006048931A1 PCT/JP2004/016321 JP2004016321W WO2006048931A1 WO 2006048931 A1 WO2006048931 A1 WO 2006048931A1 JP 2004016321 W JP2004016321 W JP 2004016321W WO 2006048931 A1 WO2006048931 A1 WO 2006048931A1
Authority
WO
WIPO (PCT)
Prior art keywords
column
hole
ceramic substrate
alignment
jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2004/016321
Other languages
English (en)
French (fr)
Japanese (ja)
Other versions
WO2006048931A8 (ja
Inventor
Isamu Sato
Shinichi Nomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to DE602004031042T priority Critical patent/DE602004031042D1/de
Priority to KR1020057011728A priority patent/KR100932144B1/ko
Priority to EP04821970A priority patent/EP1688992B1/en
Priority to PCT/JP2004/016321 priority patent/WO2006048931A1/ja
Priority to JP2005512258A priority patent/JP4059514B2/ja
Priority to AT04821970T priority patent/ATE495543T1/de
Priority to US10/546,574 priority patent/US7810772B2/en
Priority to CNB2004800021271A priority patent/CN100499087C/zh
Priority to TW094117329A priority patent/TWI371235B/zh
Publication of WO2006048931A1 publication Critical patent/WO2006048931A1/ja
Publication of WO2006048931A8 publication Critical patent/WO2006048931A8/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a method for mounting a column on a ceramic column grid array substrate and a column adsorption head used for the mounting method.
  • Pole grid arrays such as PBGA, CBGA and TBGA have come to be used.
  • BGA substrate was distorted by the heat generated when using electronic equipment. Since the BGA substrate is distorted in this way, a type has emerged that further enhances the ability to absorb thermal stress between substrates by changing the connection terminal from a solder pole to a force ram.
  • This is a ceramic column grid-array (CGA).
  • CGA ceramic column grid-array
  • solder paste is applied to the printed circuit board, and the solder paste is melted in a reflow furnace after the CGA column is placed on the application part. .
  • solder poles when solder poles are mounted on a BGA substrate, the solder poles can be mounted on all the electrodes at once using a suction device or a mask.
  • the suction device the solder pole is mounted on the electrode by releasing the solder pole on the electrode after the solder pole is sucked on the suction jig having the suction hole formed at the same position as the electrode.
  • a solder pole can be mounted on the electrode by placing a mask with a hole drilled at the same position as the electrode on the BGA substrate, rolling the solder pole on the mask and inserting it into the mask hole. .
  • the column mounted on the CGA has a cylindrical shape, it cannot be easily adsorbed by an adsorption jig like a solder pole. Moreover, the CGA cannot function as an electronic component unless one of the many columns is mounted.
  • the present inventor has a long groove on the alignment plate that is engraved with the same number of electrodes on one side of the CGA ceramic substrate and the same width as the electrode width, and a column other than the grooves on the alignment plate.
  • the alignment plate is installed on the linear feeder, and a force ram supply device is installed in the vicinity of the alignment plate to supply the column on the alignment plate.
  • a column alignment apparatus is disclosed. (Japanese Patent Laid-Open No. 2 0 0 4-2 0 0 2 8 0)
  • the inventor of the present invention also provides a ceramic base of ceramic column grid array
  • a groove having the same number as the number of electrodes arranged on the plate and the same pitch as the column mounting pitch of the ceramic substrate is engraved, and a suction hole is formed in the groove, and the suction The hole is drilled in the same position as the electrode installed on the CGA ceramic substrate in the column adsorption head connected to the decompression device, and in the heat-resistant plate, and the plate is formed in the ceramic substrate.
  • a positioning part that aligns the positions of the holes with the electrodes of the ceramic substrate when placed, and a part of the spacer that can provide a predetermined gap between the back surface of the plate and the ceramic substrate are formed.
  • a column mounting jig is disclosed. (Japanese Patent Laid-Open No. 20 00 4- 2 2 1 2 8 7, Japanese Patent Laid-Open No. 20 00 4- 2 2 8 1 2 5)
  • Patent Document 1 Japanese Patent Laid-Open No. 2 00 4- 2 0 0 2 80
  • Patent Document 2 Japanese Patent Laid-Open No. 2000-4-2-2 1 2 8 7
  • Patent Document 3 Japanese Patent Application Laid-Open No. 2000-04-2 2 8 1 2 5
  • the present invention provides a column adsorption head and a column mounting method capable of adsorbing the same number of columns as the number of electrodes of a CGA ceramic substrate when adsorbing the column to an adsorption jig. It is in.
  • the present invention relates to ceramic substrate electrodes of ceramic columns, grids, and arrays.
  • a slot that can insert a force ram is drilled at the same position as the slot, and the slot has a suction hole that is smaller in diameter than the slot of the slot, and the suction hole Is a column adsorption head characterized by being connected to a suction chamber and having a suction pipe in communication with the outside.
  • Another invention is as follows.
  • the column is adsorbed by the force ram adsorbing head having the same number of elongated holes as the number of electrodes of the ceramic substrate of the CGA, so that all the electrodes of the ceramic substrate can be obtained by one operation.
  • This is an excellent effect that the conventional mounting method and mounting jig can be used to mount the column.
  • the column adsorption head of the present invention absorbs the column inserted into the alignment hole of the alignment jig. Since it is intended to be worn, the diameter of the slot must be slightly larger than the diameter of the force ram. If the gap between the long hole of the adsorption head and the column inserted in the long hole is too small, it will be difficult to adsorb the column, and if it is too large, the column cannot be adsorbed vertically.
  • the diameter of the slot is 0.0 from the column diameter.
  • the thickness is 1 0.0 3 mm, and more preferably 0.0 1 5 0. 0 25 mm.
  • the depth of the long hole of the column adsorption head is made shorter than the full length of the column, it becomes easy to insert the mounting jig into the mounting hole.
  • the depth of the long hole is 40.60%, more preferably 45.55%, with respect to the total length of the column.
  • the column adsorption head of the present invention can adsorb the column without any defects by tapering the inlet of the long hole.
  • the taper By tapering the slot entrance, the taper can be easily inserted into the slot by guiding the column.
  • the taper attached to the entrance of the long hole has an inclination angle of 5 5 6 5 degrees, preferably 60 degrees.
  • the alignment jig 10 has an alignment hole 1 1 ⁇ ⁇ ⁇ ⁇ formed at the same position as the electrode of the CGA ceramic substrate.
  • the depth of the alignment hole is substantially the same as the length of the column C, and a suction hole 13 communicating with the suction chamber 12 is formed at the bottom of the alignment hole 11.
  • the alignment jig should have a number of units corresponding to CGA—for example, 20 units 14 as shown in FIG.
  • Alignment jig 1 0 All units 1 4 ⁇ ⁇ Alignment holes 1 1 ⁇
  • To insert a column into ⁇ use a column alignment device (not shown).
  • the column aligning device is a device that tilts and swings like a seesaw while applying vibration to the aligning jig, and can perform suction from the suction chamber 12 of the aligning jig 10.
  • the alignment jig is installed in the column alignment apparatus, and a large number of columns are placed on the alignment jig. Then, when the column alignment device gives vibration and swing to the alignment jig and suction from the suction chamber, the column placed on the alignment jig is inserted into all alignment holes.
  • the alignment jig 10 has a large number of units 14 4 ⁇ ⁇ ⁇ , but the column suction heads are stacked so as to exactly match each unit.
  • the alignment jig 10 is placed on a precision XY table (not shown), and the column adsorption head is positioned on the unit of one alignment jig by accurately moving the XY table. Then lower the column suction head and place it on the alignment jig.
  • the column suction head used here moves up and down on the XY table, and further moves up and down on the mounting jig by moving to the mounting jig described later.
  • the column is mounted on the ceramic substrate after the column is sucked by the column suction head.
  • a mounting jig is required to mount the column accurately.
  • the mounting jig 15 is structured so as to cover the ceramic substrate 16 with a space from the ceramic substrate 1 6, and the surface of the mounting substrate 15 matches the electrode 1 7 ⁇ ⁇ ⁇ Mounting holes 1 8 ⁇ ⁇ ⁇ are drilled. All electrodes 1 7 ⁇ ⁇ ⁇ of ceramic substrate 1 6 are pre-coated with solder pace ⁇ ⁇ 19.
  • Fig. 1 is a partial cross-sectional enlarged perspective view with the column adsorption head facing upward
  • Fig. 2 is a partial enlarged cross-sectional view of the column adsorption head
  • Fig. 3 8 is a diagram for explaining the steps of the column mounting method of the present invention
  • FIG. 9 is a plan view of an alignment jig used in the method for mounting a power ram according to the present invention.
  • the column adsorption head 1 has a long hole 2 ⁇ ⁇ ⁇ formed at the same position as the electrode installed on the CGA ceramic substrate (not shown).
  • the depth D of the slot 2 is shorter than the length L of column C.
  • the diameter T1 of the long hole 2 is slightly thicker than the diameter T2 of the column to be adsorbed, so that the column C can easily enter and exit the long hole 2.
  • a taper 3 is attached to the entrance of the long hole 2.
  • a suction hole 5 having a diameter smaller than the diameter of the long hole 2 is formed in the bottom 4 of the long hole 2, and all the suction holes 5 ⁇ ⁇ and, communicate with the suction chamber 6.
  • Suction pipe 7 is inserted into suction chamber 6 from the side of body 1 Has been.
  • the suction pipe outside the suction head 1 is connected to a suction device (not shown).
  • Alignment jig 1 0 Alignment hole 1 1 Insert the column () ⁇ into ⁇ .
  • the column is inserted into the alignment jig using the alignment device as described above. In this way, an alignment jig is prepared in which the force ram is aligned vertically with the electrode of the ceramic substrate aligned.
  • the column suction head 1 with the column C ' ⁇ ' sucked into the long hole 2 ⁇ ⁇ ' is moved onto the mounting jig 15 by a moving device (not shown), and then the column suction head 1 is lowered. At this time, since the column slightly protrudes from the column adsorption head, the protruding portion is inserted into the mounting hole 1 8 of the mounting jig 15.
  • the column adsorption head of the present invention can always insert the column from the alignment device into all the grooves of the column adsorption head. It can be completely inserted into the hole of the mounting jig. Therefore, it is excellent in reliability that a CGA having no defects can be manufactured if the column is mounted on a ceramic substrate using the column adsorption head of the present invention.
  • FIG. 1 Partially enlarged perspective view with column adsorption head facing upward
  • FIG. 9 is a plan view of a column alignment jig used in the column mounting method of the present invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Ceramic Products (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Glass Compositions (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
PCT/JP2004/016321 2004-11-04 2004-11-04 カラム吸着ヘッドおよびカラム搭載方法 Ceased WO2006048931A1 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE602004031042T DE602004031042D1 (de) 2004-11-04 2004-11-04 Säulensaugkopf
KR1020057011728A KR100932144B1 (ko) 2004-11-04 2004-11-04 칼럼 흡착 헤드 및 칼럼 탑재방법
EP04821970A EP1688992B1 (en) 2004-11-04 2004-11-04 Column suction head
PCT/JP2004/016321 WO2006048931A1 (ja) 2004-11-04 2004-11-04 カラム吸着ヘッドおよびカラム搭載方法
JP2005512258A JP4059514B2 (ja) 2004-11-04 2004-11-04 カラム吸着ヘッドおよびカラム搭載方法
AT04821970T ATE495543T1 (de) 2004-11-04 2004-11-04 Säulensaugkopf
US10/546,574 US7810772B2 (en) 2004-11-04 2004-11-04 Column suction-holding head and column mounting method
CNB2004800021271A CN100499087C (zh) 2004-11-04 2004-11-04 柱状物吸附头和柱状物装载方法
TW094117329A TWI371235B (enExample) 2004-11-04 2005-05-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2004/016321 WO2006048931A1 (ja) 2004-11-04 2004-11-04 カラム吸着ヘッドおよびカラム搭載方法

Publications (2)

Publication Number Publication Date
WO2006048931A1 true WO2006048931A1 (ja) 2006-05-11
WO2006048931A8 WO2006048931A8 (ja) 2006-07-13

Family

ID=36318951

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/016321 Ceased WO2006048931A1 (ja) 2004-11-04 2004-11-04 カラム吸着ヘッドおよびカラム搭載方法

Country Status (9)

Country Link
US (1) US7810772B2 (enExample)
EP (1) EP1688992B1 (enExample)
JP (1) JP4059514B2 (enExample)
KR (1) KR100932144B1 (enExample)
CN (1) CN100499087C (enExample)
AT (1) ATE495543T1 (enExample)
DE (1) DE602004031042D1 (enExample)
TW (1) TWI371235B (enExample)
WO (1) WO2006048931A1 (enExample)

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WO2011089721A1 (ja) * 2010-01-22 2011-07-28 千住金属工業株式会社 はんだカラムの製造方法、はんだカラムの製造装置及びはんだカラム
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CN103258748B (zh) * 2013-05-16 2015-11-04 无锡中微高科电子有限公司 柱栅阵列陶瓷封装用焊柱的组装方法
CN104779186B (zh) * 2014-12-31 2017-06-13 中国航天科技集团公司第五研究院第五一三研究所 一种用于ccga芯片植柱工艺的装置
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Publication number Priority date Publication date Assignee Title
WO2011089721A1 (ja) * 2010-01-22 2011-07-28 千住金属工業株式会社 はんだカラムの製造方法、はんだカラムの製造装置及びはんだカラム
JP5408260B2 (ja) * 2010-01-22 2014-02-05 千住金属工業株式会社 はんだカラムの製造方法、はんだカラムの製造装置及びはんだカラム
US9283686B2 (en) 2010-01-22 2016-03-15 Senju Metal Industry Co., Ltd. Method for manufacturing solder column, apparatus for manufacturing solder column, and solder column
CN103394842A (zh) * 2013-07-23 2013-11-20 中国电子科技集团公司第五十八研究所 Ccga封装焊柱焊针排列装置
WO2022244667A1 (ja) * 2021-05-19 2022-11-24 公立大学法人富山県立大学 ピン固定方法、ピン固定装置及びピンが固定された基材
JP2022178283A (ja) * 2021-05-19 2022-12-02 公立大学法人 富山県立大学 ピン固定方法及びピン固定装置
JP7195552B2 (ja) 2021-05-19 2022-12-26 公立大学法人 富山県立大学 ピン固定方法及びピン固定装置

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DE602004031042D1 (de) 2011-02-24
JPWO2006048931A1 (ja) 2009-05-07
US7810772B2 (en) 2010-10-12
EP1688992B1 (en) 2011-01-12
TWI371235B (enExample) 2012-08-21
JP4059514B2 (ja) 2008-03-12
ATE495543T1 (de) 2011-01-15
KR20070083240A (ko) 2007-08-24
WO2006048931A8 (ja) 2006-07-13
KR100932144B1 (ko) 2009-12-16
EP1688992A4 (en) 2008-12-17
CN1735966A (zh) 2006-02-15
CN100499087C (zh) 2009-06-10
EP1688992A1 (en) 2006-08-09

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