TWI371235B - - Google Patents

Info

Publication number
TWI371235B
TWI371235B TW094117329A TW94117329A TWI371235B TW I371235 B TWI371235 B TW I371235B TW 094117329 A TW094117329 A TW 094117329A TW 94117329 A TW94117329 A TW 94117329A TW I371235 B TWI371235 B TW I371235B
Authority
TW
Taiwan
Prior art keywords
holes
suction
columns
column
ceramic
Prior art date
Application number
TW094117329A
Other languages
English (en)
Chinese (zh)
Inventor
Isamu Sato
Shinichi Nomoto
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Application granted granted Critical
Publication of TWI371235B publication Critical patent/TWI371235B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Ceramic Products (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Glass Compositions (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
TW094117329A 2004-11-04 2005-05-27 TWI371235B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2004/016321 WO2006048931A1 (ja) 2004-11-04 2004-11-04 カラム吸着ヘッドおよびカラム搭載方法

Publications (1)

Publication Number Publication Date
TWI371235B true TWI371235B (enExample) 2012-08-21

Family

ID=36318951

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094117329A TWI371235B (enExample) 2004-11-04 2005-05-27

Country Status (9)

Country Link
US (1) US7810772B2 (enExample)
EP (1) EP1688992B1 (enExample)
JP (1) JP4059514B2 (enExample)
KR (1) KR100932144B1 (enExample)
CN (1) CN100499087C (enExample)
AT (1) ATE495543T1 (enExample)
DE (1) DE602004031042D1 (enExample)
TW (1) TWI371235B (enExample)
WO (1) WO2006048931A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI919155B (zh) 2023-01-02 2026-03-21 南韓商高麗半導體系統股份有限公司 焊料體處理工具及利用其的焊料體處理方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2451951A1 (en) * 2003-12-03 2005-06-03 Ibm Canada Limited-Ibm Canada Limitee Apparatus for mounting columns for grid array electronic packages
CN101802967B (zh) * 2007-09-14 2013-08-28 国立大学法人东北大学 阴极体以及采用该阴极体的荧光管
CN102470493B (zh) 2010-01-22 2015-04-08 千住金属工业株式会社 焊锡柱制造方法、焊锡柱制造装置及焊锡柱
US8550525B2 (en) * 2011-06-30 2013-10-08 J.L. Souser & Associates, Inc. Tool and process for handling pliant comestibles
JP2013051393A (ja) * 2011-07-29 2013-03-14 Ngk Spark Plug Co Ltd 部品付き配線基板の製造方法
CN102569108B (zh) * 2011-12-27 2014-06-18 三星半导体(中国)研究开发有限公司 焊球贴装工具
US10405434B2 (en) 2013-03-22 2019-09-03 Fuji Electric Co., Ltd. Mounting jig for semiconductor device
JP6217101B2 (ja) * 2013-03-22 2017-10-25 富士電機株式会社 半導体装置の製造方法及び取り付け治具
CN103258748B (zh) * 2013-05-16 2015-11-04 无锡中微高科电子有限公司 柱栅阵列陶瓷封装用焊柱的组装方法
CN103394842B (zh) * 2013-07-23 2015-05-20 中国电子科技集团公司第五十八研究所 Ccga封装焊柱焊针排列装置
CN104779186B (zh) * 2014-12-31 2017-06-13 中国航天科技集团公司第五研究院第五一三研究所 一种用于ccga芯片植柱工艺的装置
GB2572016A (en) * 2018-03-16 2019-09-18 Maxwell Wade Colin Vacuum plate
KR20190114330A (ko) * 2018-03-29 2019-10-10 (주)포인트엔지니어링 마이크로 led 전사헤드
JP7195552B2 (ja) * 2021-05-19 2022-12-26 公立大学法人 富山県立大学 ピン固定方法及びピン固定装置
US12568821B2 (en) * 2022-07-29 2026-03-03 Google Llc Pin fin placement assembly for forming temperature control element utilized in device die packages
US20240121931A1 (en) * 2022-10-05 2024-04-11 Google Llc Methods and Structures for Coupling Thermal Dissipating Elements and Thermal Cooling Structures to Integrated Circuit Dies
KR102768674B1 (ko) * 2023-01-02 2025-02-18 주식회사 코세스 솔더체 처리툴 및 이를 이용한 솔더체 처리 방법
KR102868316B1 (ko) 2024-12-26 2025-10-14 (주)에스에스피 전도성 포스트 픽업 장치 및 전도성 포스트 픽업 방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5261157A (en) * 1991-01-22 1993-11-16 Olin Corporation Assembly of electronic packages by vacuum lamination
US5749614A (en) * 1995-12-04 1998-05-12 Motorola, Inc. Vacuum pickup tool for placing balls in a customized pattern
US5762258A (en) * 1996-07-23 1998-06-09 International Business Machines Corporation Method of making an electronic package having spacer elements
US6230963B1 (en) * 1997-01-28 2001-05-15 Eric L. Hertz Method and apparatus using colored foils for placing conductive preforms
TW524873B (en) * 1997-07-11 2003-03-21 Applied Materials Inc Improved substrate supporting apparatus and processing chamber
JP3003656B2 (ja) * 1997-12-24 2000-01-31 日本電気株式会社 微細金属球の搭載治具
US6102459A (en) * 1998-03-16 2000-08-15 Pabst; William V. Vacuum valve
JP3076305B2 (ja) * 1998-06-23 2000-08-14 九州日本電気株式会社 半田ボール搭載装置およびその方法
JP3212964B2 (ja) * 1999-03-19 2001-09-25 日本特殊陶業株式会社 ピン立て治具及びピン立設基板の製造方法
JP2000349220A (ja) * 1999-06-04 2000-12-15 Mitsubishi Electric Corp 電極ピン装着装置
US6818545B2 (en) * 2001-03-05 2004-11-16 Megic Corporation Low fabrication cost, fine pitch and high reliability solder bump
US6513802B2 (en) * 2001-03-07 2003-02-04 Tooling Technology Llc Quick change tooling system for a vacuum holding fixture for a thermoformed part
JP4626098B2 (ja) 2001-06-15 2011-02-02 イビデン株式会社 プリント配線板の製造方法
US20030062734A1 (en) * 2001-10-02 2003-04-03 Faris Sadeg M. Device and method for handling fragile objects, and manufacturing method thereof
JP2004221287A (ja) * 2003-01-15 2004-08-05 Senju Metal Ind Co Ltd カラム吸着治具
CA2451951A1 (en) * 2003-12-03 2005-06-03 Ibm Canada Limited-Ibm Canada Limitee Apparatus for mounting columns for grid array electronic packages
US20050196979A1 (en) * 2004-03-02 2005-09-08 Ironwood Electronics, Inc. Adapter apparatus with conductive elements mounted using curable material and methods regarding same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI919155B (zh) 2023-01-02 2026-03-21 南韓商高麗半導體系統股份有限公司 焊料體處理工具及利用其的焊料體處理方法

Also Published As

Publication number Publication date
US20070039998A1 (en) 2007-02-22
WO2006048931A1 (ja) 2006-05-11
DE602004031042D1 (de) 2011-02-24
JPWO2006048931A1 (ja) 2009-05-07
US7810772B2 (en) 2010-10-12
EP1688992B1 (en) 2011-01-12
JP4059514B2 (ja) 2008-03-12
ATE495543T1 (de) 2011-01-15
KR20070083240A (ko) 2007-08-24
WO2006048931A8 (ja) 2006-07-13
KR100932144B1 (ko) 2009-12-16
EP1688992A4 (en) 2008-12-17
CN1735966A (zh) 2006-02-15
CN100499087C (zh) 2009-06-10
EP1688992A1 (en) 2006-08-09

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Legal Events

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MK4A Expiration of patent term of an invention patent