WO2006048931A8 - カラム吸着ヘッドおよびカラム搭載方法 - Google Patents
カラム吸着ヘッドおよびカラム搭載方法Info
- Publication number
- WO2006048931A8 WO2006048931A8 PCT/JP2004/016321 JP2004016321W WO2006048931A8 WO 2006048931 A8 WO2006048931 A8 WO 2006048931A8 JP 2004016321 W JP2004016321 W JP 2004016321W WO 2006048931 A8 WO2006048931 A8 WO 2006048931A8
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- column
- columns
- suction head
- holes
- mounting jig
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 abstract 5
- 239000000758 substrate Substances 0.000 abstract 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
- H05K2201/10318—Surface mounted metallic pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Manipulator (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Glass Compositions (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
- Ceramic Products (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2004/016321 WO2006048931A1 (ja) | 2004-11-04 | 2004-11-04 | カラム吸着ヘッドおよびカラム搭載方法 |
JP2005512258A JP4059514B2 (ja) | 2004-11-04 | 2004-11-04 | カラム吸着ヘッドおよびカラム搭載方法 |
AT04821970T ATE495543T1 (de) | 2004-11-04 | 2004-11-04 | Säulensaugkopf |
EP04821970A EP1688992B1 (en) | 2004-11-04 | 2004-11-04 | Column suction head |
US10/546,574 US7810772B2 (en) | 2004-11-04 | 2004-11-04 | Column suction-holding head and column mounting method |
CNB2004800021271A CN100499087C (zh) | 2004-11-04 | 2004-11-04 | 柱状物吸附头和柱状物装载方法 |
DE602004031042T DE602004031042D1 (de) | 2004-11-04 | 2004-11-04 | Säulensaugkopf |
KR1020057011728A KR100932144B1 (ko) | 2004-11-04 | 2004-11-04 | 칼럼 흡착 헤드 및 칼럼 탑재방법 |
TW094117329A TWI371235B (ja) | 2004-11-04 | 2005-05-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2004/016321 WO2006048931A1 (ja) | 2004-11-04 | 2004-11-04 | カラム吸着ヘッドおよびカラム搭載方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006048931A1 WO2006048931A1 (ja) | 2006-05-11 |
WO2006048931A8 true WO2006048931A8 (ja) | 2006-07-13 |
Family
ID=36318951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/016321 WO2006048931A1 (ja) | 2004-11-04 | 2004-11-04 | カラム吸着ヘッドおよびカラム搭載方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7810772B2 (ja) |
EP (1) | EP1688992B1 (ja) |
JP (1) | JP4059514B2 (ja) |
KR (1) | KR100932144B1 (ja) |
CN (1) | CN100499087C (ja) |
AT (1) | ATE495543T1 (ja) |
DE (1) | DE602004031042D1 (ja) |
TW (1) | TWI371235B (ja) |
WO (1) | WO2006048931A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7195552B2 (ja) | 2021-05-19 | 2022-12-26 | 公立大学法人 富山県立大学 | ピン固定方法及びピン固定装置 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2451951A1 (en) * | 2003-12-03 | 2005-06-03 | Ibm Canada Limited-Ibm Canada Limitee | Apparatus for mounting columns for grid array electronic packages |
CN101802967B (zh) * | 2007-09-14 | 2013-08-28 | 国立大学法人东北大学 | 阴极体以及采用该阴极体的荧光管 |
KR101267182B1 (ko) | 2010-01-22 | 2013-05-24 | 센주긴조쿠고교 가부시키가이샤 | 땜납 칼럼의 제조 방법, 땜납 칼럼의 제조 장치 및 땜납 칼럼 |
US8550525B2 (en) * | 2011-06-30 | 2013-10-08 | J.L. Souser & Associates, Inc. | Tool and process for handling pliant comestibles |
JP2013051393A (ja) * | 2011-07-29 | 2013-03-14 | Ngk Spark Plug Co Ltd | 部品付き配線基板の製造方法 |
CN102569108B (zh) * | 2011-12-27 | 2014-06-18 | 三星半导体(中国)研究开发有限公司 | 焊球贴装工具 |
JP6217101B2 (ja) * | 2013-03-22 | 2017-10-25 | 富士電機株式会社 | 半導体装置の製造方法及び取り付け治具 |
US10405434B2 (en) | 2013-03-22 | 2019-09-03 | Fuji Electric Co., Ltd. | Mounting jig for semiconductor device |
CN103258748B (zh) * | 2013-05-16 | 2015-11-04 | 无锡中微高科电子有限公司 | 柱栅阵列陶瓷封装用焊柱的组装方法 |
CN103394842B (zh) * | 2013-07-23 | 2015-05-20 | 中国电子科技集团公司第五十八研究所 | Ccga封装焊柱焊针排列装置 |
CN104779186B (zh) * | 2014-12-31 | 2017-06-13 | 中国航天科技集团公司第五研究院第五一三研究所 | 一种用于ccga芯片植柱工艺的装置 |
GB2572016A (en) * | 2018-03-16 | 2019-09-18 | Maxwell Wade Colin | Vacuum plate |
KR20190114330A (ko) * | 2018-03-29 | 2019-10-10 | (주)포인트엔지니어링 | 마이크로 led 전사헤드 |
US20240121931A1 (en) * | 2022-10-05 | 2024-04-11 | Google Llc | Methods and Structures for Coupling Thermal Dissipating Elements and Thermal Cooling Structures to Integrated Circuit Dies |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5261157A (en) * | 1991-01-22 | 1993-11-16 | Olin Corporation | Assembly of electronic packages by vacuum lamination |
US5749614A (en) * | 1995-12-04 | 1998-05-12 | Motorola, Inc. | Vacuum pickup tool for placing balls in a customized pattern |
US5762258A (en) * | 1996-07-23 | 1998-06-09 | International Business Machines Corporation | Method of making an electronic package having spacer elements |
US6230963B1 (en) * | 1997-01-28 | 2001-05-15 | Eric L. Hertz | Method and apparatus using colored foils for placing conductive preforms |
TW524873B (en) * | 1997-07-11 | 2003-03-21 | Applied Materials Inc | Improved substrate supporting apparatus and processing chamber |
JP3003656B2 (ja) * | 1997-12-24 | 2000-01-31 | 日本電気株式会社 | 微細金属球の搭載治具 |
US6102459A (en) * | 1998-03-16 | 2000-08-15 | Pabst; William V. | Vacuum valve |
JP3076305B2 (ja) * | 1998-06-23 | 2000-08-14 | 九州日本電気株式会社 | 半田ボール搭載装置およびその方法 |
JP3212964B2 (ja) * | 1999-03-19 | 2001-09-25 | 日本特殊陶業株式会社 | ピン立て治具及びピン立設基板の製造方法 |
JP2000349220A (ja) * | 1999-06-04 | 2000-12-15 | Mitsubishi Electric Corp | 電極ピン装着装置 |
US6818545B2 (en) * | 2001-03-05 | 2004-11-16 | Megic Corporation | Low fabrication cost, fine pitch and high reliability solder bump |
US6513802B2 (en) * | 2001-03-07 | 2003-02-04 | Tooling Technology Llc | Quick change tooling system for a vacuum holding fixture for a thermoformed part |
JP4626098B2 (ja) * | 2001-06-15 | 2011-02-02 | イビデン株式会社 | プリント配線板の製造方法 |
US20030062734A1 (en) * | 2001-10-02 | 2003-04-03 | Faris Sadeg M. | Device and method for handling fragile objects, and manufacturing method thereof |
JP2004221287A (ja) * | 2003-01-15 | 2004-08-05 | Senju Metal Ind Co Ltd | カラム吸着治具 |
CA2451951A1 (en) * | 2003-12-03 | 2005-06-03 | Ibm Canada Limited-Ibm Canada Limitee | Apparatus for mounting columns for grid array electronic packages |
US20050196979A1 (en) * | 2004-03-02 | 2005-09-08 | Ironwood Electronics, Inc. | Adapter apparatus with conductive elements mounted using curable material and methods regarding same |
-
2004
- 2004-11-04 EP EP04821970A patent/EP1688992B1/en active Active
- 2004-11-04 KR KR1020057011728A patent/KR100932144B1/ko active IP Right Grant
- 2004-11-04 AT AT04821970T patent/ATE495543T1/de not_active IP Right Cessation
- 2004-11-04 DE DE602004031042T patent/DE602004031042D1/de active Active
- 2004-11-04 CN CNB2004800021271A patent/CN100499087C/zh active Active
- 2004-11-04 US US10/546,574 patent/US7810772B2/en active Active
- 2004-11-04 JP JP2005512258A patent/JP4059514B2/ja active Active
- 2004-11-04 WO PCT/JP2004/016321 patent/WO2006048931A1/ja active Search and Examination
-
2005
- 2005-05-27 TW TW094117329A patent/TWI371235B/zh active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7195552B2 (ja) | 2021-05-19 | 2022-12-26 | 公立大学法人 富山県立大学 | ピン固定方法及びピン固定装置 |
Also Published As
Publication number | Publication date |
---|---|
EP1688992B1 (en) | 2011-01-12 |
EP1688992A4 (en) | 2008-12-17 |
TWI371235B (ja) | 2012-08-21 |
EP1688992A1 (en) | 2006-08-09 |
JPWO2006048931A1 (ja) | 2009-05-07 |
ATE495543T1 (de) | 2011-01-15 |
KR20070083240A (ko) | 2007-08-24 |
CN1735966A (zh) | 2006-02-15 |
CN100499087C (zh) | 2009-06-10 |
US7810772B2 (en) | 2010-10-12 |
WO2006048931A1 (ja) | 2006-05-11 |
JP4059514B2 (ja) | 2008-03-12 |
KR100932144B1 (ko) | 2009-12-16 |
US20070039998A1 (en) | 2007-02-22 |
DE602004031042D1 (de) | 2011-02-24 |
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