WO2006009308A1 - 硬化性組成物 - Google Patents
硬化性組成物 Download PDFInfo
- Publication number
- WO2006009308A1 WO2006009308A1 PCT/JP2005/013791 JP2005013791W WO2006009308A1 WO 2006009308 A1 WO2006009308 A1 WO 2006009308A1 JP 2005013791 W JP2005013791 W JP 2005013791W WO 2006009308 A1 WO2006009308 A1 WO 2006009308A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- liquid crystal
- parts
- group
- isocyanate
- weight
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 33
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 124
- -1 benzoyl compound Chemical class 0.000 claims abstract description 81
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 55
- 239000003822 epoxy resin Substances 0.000 claims abstract description 54
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 39
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 38
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 35
- 239000012948 isocyanate Substances 0.000 claims abstract description 35
- 150000001875 compounds Chemical class 0.000 claims abstract description 19
- 239000004593 Epoxy Substances 0.000 claims abstract description 16
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 15
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 14
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 8
- 125000005113 hydroxyalkoxy group Chemical group 0.000 claims abstract description 6
- 239000003999 initiator Substances 0.000 claims description 28
- 229920001187 thermosetting polymer Polymers 0.000 claims description 25
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 10
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 8
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 claims description 4
- 239000005057 Hexamethylene diisocyanate Substances 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004615 ingredient Substances 0.000 claims description 3
- IENUPKUGTZAUFK-UHFFFAOYSA-N 1-ethyl-2h-1,3,5-triazine Chemical compound CCN1CN=CN=C1 IENUPKUGTZAUFK-UHFFFAOYSA-N 0.000 claims 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 23
- 238000003860 storage Methods 0.000 abstract description 15
- 239000007788 liquid Substances 0.000 abstract description 8
- 239000003505 polymerization initiator Substances 0.000 abstract description 5
- 230000002093 peripheral effect Effects 0.000 abstract description 3
- 239000003566 sealing material Substances 0.000 abstract 1
- 239000000565 sealant Substances 0.000 description 62
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 37
- 239000000853 adhesive Substances 0.000 description 27
- 230000001070 adhesive effect Effects 0.000 description 27
- 239000000047 product Substances 0.000 description 23
- 230000000052 comparative effect Effects 0.000 description 21
- 230000015572 biosynthetic process Effects 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 19
- 238000011109 contamination Methods 0.000 description 19
- 238000003786 synthesis reaction Methods 0.000 description 19
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 18
- 238000001723 curing Methods 0.000 description 18
- 238000011156 evaluation Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 13
- 239000002253 acid Substances 0.000 description 12
- 239000001294 propane Substances 0.000 description 12
- 239000003054 catalyst Substances 0.000 description 11
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 11
- 150000003254 radicals Chemical class 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N dimethylmethane Natural products CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 9
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 8
- 239000004721 Polyphenylene oxide Substances 0.000 description 8
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 8
- 239000000945 filler Substances 0.000 description 8
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate Chemical compound [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- 229920000728 polyester Polymers 0.000 description 8
- 229920000570 polyether Polymers 0.000 description 8
- 238000005886 esterification reaction Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- 229910052623 talc Inorganic materials 0.000 description 7
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 7
- FYELSNVLZVIGTI-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-5-ethylpyrazol-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C=1C=NN(C=1CC)CC(=O)N1CC2=C(CC1)NN=N2 FYELSNVLZVIGTI-UHFFFAOYSA-N 0.000 description 6
- 239000005062 Polybutadiene Substances 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 239000007822 coupling agent Substances 0.000 description 6
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 6
- 150000002513 isocyanates Chemical class 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229920002857 polybutadiene Polymers 0.000 description 6
- 229920001296 polysiloxane Polymers 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 5
- 125000005442 diisocyanate group Chemical group 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 239000003112 inhibitor Substances 0.000 description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 5
- 229920005862 polyol Polymers 0.000 description 5
- 239000000454 talc Substances 0.000 description 5
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 4
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 4
- XTKDAFGWCDAMPY-UHFFFAOYSA-N azaperone Chemical compound C1=CC(F)=CC=C1C(=O)CCCN1CCN(C=2N=CC=CC=2)CC1 XTKDAFGWCDAMPY-UHFFFAOYSA-N 0.000 description 4
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- 239000005056 polyisocyanate Substances 0.000 description 4
- 229920001228 polyisocyanate Polymers 0.000 description 4
- 150000003077 polyols Chemical class 0.000 description 4
- 235000013824 polyphenols Nutrition 0.000 description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical group CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000000862 absorption spectrum Methods 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000003085 diluting agent Substances 0.000 description 3
- 230000032050 esterification Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- DGTNSSLYPYDJGL-UHFFFAOYSA-N phenyl isocyanate Chemical compound O=C=NC1=CC=CC=C1 DGTNSSLYPYDJGL-UHFFFAOYSA-N 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 150000003457 sulfones Chemical class 0.000 description 3
- 150000003673 urethanes Chemical class 0.000 description 3
- VDOIZUWXKARYAM-UHFFFAOYSA-N 1,3,5-triazinane-2,4,6-trione;1,3,5-triazine Chemical compound C1=NC=NC=N1.O=C1NC(=O)NC(=O)N1 VDOIZUWXKARYAM-UHFFFAOYSA-N 0.000 description 2
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical compound C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- QCBSYPYHCJMQGB-UHFFFAOYSA-N 2-ethyl-1,3,5-triazine Chemical compound CCC1=NC=NC=N1 QCBSYPYHCJMQGB-UHFFFAOYSA-N 0.000 description 2
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- QDZXJOMXPRWGFG-UHFFFAOYSA-N CCC1=NC=NC=N1.O=C1NC(=O)NC(=O)N1 Chemical compound CCC1=NC=NC=N1.O=C1NC(=O)NC(=O)N1 QDZXJOMXPRWGFG-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 239000004386 Erythritol Substances 0.000 description 2
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 101001012040 Pseudomonas aeruginosa (strain ATCC 15692 / DSM 22644 / CIP 104116 / JCM 14847 / LMG 12228 / 1C / PRS 101 / PAO1) Immunomodulating metalloprotease Proteins 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000000378 calcium silicate Substances 0.000 description 2
- 229910052918 calcium silicate Inorganic materials 0.000 description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 229910052570 clay Inorganic materials 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 229910002026 crystalline silica Inorganic materials 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- 238000010828 elution Methods 0.000 description 2
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 2
- 229940009714 erythritol Drugs 0.000 description 2
- 235000019414 erythritol Nutrition 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- YDNLNVZZTACNJX-UHFFFAOYSA-N isocyanatomethylbenzene Chemical compound O=C=NCC1=CC=CC=C1 YDNLNVZZTACNJX-UHFFFAOYSA-N 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 230000002194 synthesizing effect Effects 0.000 description 2
- ZSUXOVNWDZTCFN-UHFFFAOYSA-L tin(ii) bromide Chemical compound Br[Sn]Br ZSUXOVNWDZTCFN-UHFFFAOYSA-L 0.000 description 2
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- VNDYJBBGRKZCSX-UHFFFAOYSA-L zinc bromide Chemical compound Br[Zn]Br VNDYJBBGRKZCSX-UHFFFAOYSA-L 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 1
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 description 1
- FYWJWWMKCARWQG-UHFFFAOYSA-N 1,2-dichloro-3-isocyanatobenzene Chemical compound ClC1=CC=CC(N=C=O)=C1Cl FYWJWWMKCARWQG-UHFFFAOYSA-N 0.000 description 1
- GSYUYIOROOKTAN-UHFFFAOYSA-N 1,2-difluoro-3-isocyanatobenzene Chemical compound FC1=CC=CC(N=C=O)=C1F GSYUYIOROOKTAN-UHFFFAOYSA-N 0.000 description 1
- WZSYKGHOYGNHKS-UHFFFAOYSA-N 1,2-ditert-butyl-4-methylcyclohexa-2,4-dien-1-ol Chemical compound CC1=CCC(O)(C(C)(C)C)C(C(C)(C)C)=C1 WZSYKGHOYGNHKS-UHFFFAOYSA-N 0.000 description 1
- NGVBAZXOCBEMDK-UHFFFAOYSA-N 1,3,5-tribromo-2-isocyanatobenzene Chemical compound BrC1=CC(Br)=C(N=C=O)C(Br)=C1 NGVBAZXOCBEMDK-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- NGERFOVPRCLZNT-UHFFFAOYSA-N 1,4-diethyl-2-isocyanatobenzene Chemical compound C(C)C1=C(C=C(C=C1)CC)N=C=O NGERFOVPRCLZNT-UHFFFAOYSA-N 0.000 description 1
- SNHIIFOXCRYGGY-UHFFFAOYSA-N 1,4-difluoro-2-isocyanatobenzene Chemical compound FC1=CC=C(F)C(N=C=O)=C1 SNHIIFOXCRYGGY-UHFFFAOYSA-N 0.000 description 1
- DKBHJZFJCDOGOY-UHFFFAOYSA-N 1,4-diisocyanato-2-methylbenzene Chemical compound CC1=CC(N=C=O)=CC=C1N=C=O DKBHJZFJCDOGOY-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- JASTZOAHAWBRLM-UHFFFAOYSA-N 1-(3-isocyanatophenyl)ethanone Chemical compound CC(=O)C1=CC=CC(N=C=O)=C1 JASTZOAHAWBRLM-UHFFFAOYSA-N 0.000 description 1
- OJQSISYVGFJJBY-UHFFFAOYSA-N 1-(4-isocyanatophenyl)pyrrole-2,5-dione Chemical compound C1=CC(N=C=O)=CC=C1N1C(=O)C=CC1=O OJQSISYVGFJJBY-UHFFFAOYSA-N 0.000 description 1
- JCUQBSLBFAVVOS-UHFFFAOYSA-N 1-(isocyanatomethyl)-3-methylbenzene Chemical compound CC1=CC=CC(CN=C=O)=C1 JCUQBSLBFAVVOS-UHFFFAOYSA-N 0.000 description 1
- GONOHGQPZFXJOJ-SNVBAGLBSA-N 1-[(1r)-1-isocyanatoethyl]naphthalene Chemical compound C1=CC=C2C([C@H](N=C=O)C)=CC=CC2=C1 GONOHGQPZFXJOJ-SNVBAGLBSA-N 0.000 description 1
- CZQIJQFTRGDODI-UHFFFAOYSA-N 1-bromo-4-isocyanatobenzene Chemical compound BrC1=CC=C(N=C=O)C=C1 CZQIJQFTRGDODI-UHFFFAOYSA-N 0.000 description 1
- AULVDVFFHZBVDO-UHFFFAOYSA-N 1-chloro-2,4-diisocyanato-5-methylbenzene Chemical compound CC1=CC(Cl)=C(N=C=O)C=C1N=C=O AULVDVFFHZBVDO-UHFFFAOYSA-N 0.000 description 1
- HHIRBXHEYVDUAM-UHFFFAOYSA-N 1-chloro-3-isocyanatobenzene Chemical compound ClC1=CC=CC(N=C=O)=C1 HHIRBXHEYVDUAM-UHFFFAOYSA-N 0.000 description 1
- COSVEXSXJCUYOT-UHFFFAOYSA-N 1-chloro-5-isocyanato-2,4-dimethoxybenzene Chemical compound COC1=CC(OC)=C(N=C=O)C=C1Cl COSVEXSXJCUYOT-UHFFFAOYSA-N 0.000 description 1
- VZNCSZQPNIEEMN-UHFFFAOYSA-N 1-fluoro-2-isocyanatobenzene Chemical compound FC1=CC=CC=C1N=C=O VZNCSZQPNIEEMN-UHFFFAOYSA-N 0.000 description 1
- DSVGFKBFFICWLZ-UHFFFAOYSA-N 1-fluoro-4-isocyanatobenzene Chemical compound FC1=CC=C(N=C=O)C=C1 DSVGFKBFFICWLZ-UHFFFAOYSA-N 0.000 description 1
- SAEKPOPATLXKFE-UHFFFAOYSA-N 1-iodo-3-isocyanatopropane Chemical compound ICCCN=C=O SAEKPOPATLXKFE-UHFFFAOYSA-N 0.000 description 1
- WRAZHLRMDRTLOZ-UHFFFAOYSA-N 1-isocyanato-2,4-dimethoxybenzene Chemical compound COC1=CC=C(N=C=O)C(OC)=C1 WRAZHLRMDRTLOZ-UHFFFAOYSA-N 0.000 description 1
- SUVCZZADQDCIEQ-UHFFFAOYSA-N 1-isocyanato-2-methoxybenzene Chemical compound COC1=CC=CC=C1N=C=O SUVCZZADQDCIEQ-UHFFFAOYSA-N 0.000 description 1
- JRVZITODZAQRQM-UHFFFAOYSA-N 1-isocyanato-2-nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1N=C=O JRVZITODZAQRQM-UHFFFAOYSA-N 0.000 description 1
- IHHUGFJSEJSCGE-UHFFFAOYSA-N 1-isocyanato-2-phenylbenzene Chemical compound O=C=NC1=CC=CC=C1C1=CC=CC=C1 IHHUGFJSEJSCGE-UHFFFAOYSA-N 0.000 description 1
- NRSSOFNMWSJECS-UHFFFAOYSA-N 1-isocyanato-3,5-bis(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC(N=C=O)=CC(C(F)(F)F)=C1 NRSSOFNMWSJECS-UHFFFAOYSA-N 0.000 description 1
- BKJABLMNBSVKCV-UHFFFAOYSA-N 1-isocyanato-3-methylsulfanylbenzene Chemical compound CSC1=CC=CC(N=C=O)=C1 BKJABLMNBSVKCV-UHFFFAOYSA-N 0.000 description 1
- VBHCPGFCIQDXGZ-UHFFFAOYSA-N 1-isocyanatoadamantane Chemical compound C1C(C2)CC3CC2CC1(N=C=O)C3 VBHCPGFCIQDXGZ-UHFFFAOYSA-N 0.000 description 1
- JJSCUXAFAJEQGB-UHFFFAOYSA-N 1-isocyanatoethylbenzene Chemical compound O=C=NC(C)C1=CC=CC=C1 JJSCUXAFAJEQGB-UHFFFAOYSA-N 0.000 description 1
- RFXBSYPBSRSQDU-UHFFFAOYSA-N 1-isocyanatoheptane Chemical compound CCCCCCCN=C=O RFXBSYPBSRSQDU-UHFFFAOYSA-N 0.000 description 1
- BDQNKCYCTYYMAA-UHFFFAOYSA-N 1-isocyanatonaphthalene Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1 BDQNKCYCTYYMAA-UHFFFAOYSA-N 0.000 description 1
- QWDQYHPOSSHSAW-UHFFFAOYSA-N 1-isocyanatooctadecane Chemical compound CCCCCCCCCCCCCCCCCCN=C=O QWDQYHPOSSHSAW-UHFFFAOYSA-N 0.000 description 1
- DYQFCTCUULUMTQ-UHFFFAOYSA-N 1-isocyanatooctane Chemical compound CCCCCCCCN=C=O DYQFCTCUULUMTQ-UHFFFAOYSA-N 0.000 description 1
- VRVUKQWNRPNACD-UHFFFAOYSA-N 1-isocyanatopentane Chemical compound CCCCCN=C=O VRVUKQWNRPNACD-UHFFFAOYSA-N 0.000 description 1
- OQURWGJAWSLGQG-UHFFFAOYSA-N 1-isocyanatopropane Chemical compound CCCN=C=O OQURWGJAWSLGQG-UHFFFAOYSA-N 0.000 description 1
- JXAYHHMVMJVFPQ-UHFFFAOYSA-N 1-isocyanatoundecane Chemical compound CCCCCCCCCCCN=C=O JXAYHHMVMJVFPQ-UHFFFAOYSA-N 0.000 description 1
- KUZVTLFONHAKEG-UHFFFAOYSA-N 1-phenyl-2-(3-trimethoxysilylpropyl)hydrazine Chemical compound C1(=CC=CC=C1)NNCCC[Si](OC)(OC)OC KUZVTLFONHAKEG-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- SPSPIUSUWPLVKD-UHFFFAOYSA-N 2,3-dibutyl-6-methylphenol Chemical compound CCCCC1=CC=C(C)C(O)=C1CCCC SPSPIUSUWPLVKD-UHFFFAOYSA-N 0.000 description 1
- KNHJIEOCVVIBIV-UHFFFAOYSA-N 2,3-dimethylphenyl isocyanate Chemical compound CC1=CC=CC(N=C=O)=C1C KNHJIEOCVVIBIV-UHFFFAOYSA-N 0.000 description 1
- SOXVXJQIQVOCAY-UHFFFAOYSA-N 2,5-dimethylphenyl isocyanate Chemical compound CC1=CC=C(C)C(N=C=O)=C1 SOXVXJQIQVOCAY-UHFFFAOYSA-N 0.000 description 1
- LELKUNFWANHDPG-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxymethyl)oxirane;prop-2-enoic acid Chemical compound OC(=O)C=C.C1OC1COCC1CO1 LELKUNFWANHDPG-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- XNQBFHMCUNRKPM-UHFFFAOYSA-N 2-isocyanato-1,4-dimethoxybenzene Chemical compound COC1=CC=C(OC)C(N=C=O)=C1 XNQBFHMCUNRKPM-UHFFFAOYSA-N 0.000 description 1
- VXVWIRKAABQIGS-UHFFFAOYSA-N 2-isocyanatooxane Chemical compound O=C=NC1CCCCO1 VXVWIRKAABQIGS-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- MFUVCHZWGSJKEQ-UHFFFAOYSA-N 3,4-dichlorphenylisocyanate Chemical compound ClC1=CC=C(N=C=O)C=C1Cl MFUVCHZWGSJKEQ-UHFFFAOYSA-N 0.000 description 1
- KNTKCYKJRSMRMZ-UHFFFAOYSA-N 3-chloropropyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCl KNTKCYKJRSMRMZ-UHFFFAOYSA-N 0.000 description 1
- JUXZNIDKDPLYBY-UHFFFAOYSA-N 3-ethyl-3-(phenoxymethyl)oxetane Chemical compound C=1C=CC=CC=1OCC1(CC)COC1 JUXZNIDKDPLYBY-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- OIORBBLUSMONPW-UHFFFAOYSA-N 4-isocyanato-1-methyl-2-nitrobenzene Chemical compound CC1=CC=C(N=C=O)C=C1[N+]([O-])=O OIORBBLUSMONPW-UHFFFAOYSA-N 0.000 description 1
- 125000004172 4-methoxyphenyl group Chemical group [H]C1=C([H])C(OC([H])([H])[H])=C([H])C([H])=C1* 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- JMGZEFIQIZZSBH-UHFFFAOYSA-N Bioquercetin Natural products CC1OC(OCC(O)C2OC(OC3=C(Oc4cc(O)cc(O)c4C3=O)c5ccc(O)c(O)c5)C(O)C2O)C(O)C(O)C1O JMGZEFIQIZZSBH-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- PMCOZUKCSAKSMC-UHFFFAOYSA-N CCC(O)=O.N#CO Chemical compound CCC(O)=O.N#CO PMCOZUKCSAKSMC-UHFFFAOYSA-N 0.000 description 1
- DYXWUNOYPLPVQR-UHFFFAOYSA-N CCCCO[SiH3].N=C=O.N=C=O.N=C=O Chemical compound CCCCO[SiH3].N=C=O.N=C=O.N=C=O DYXWUNOYPLPVQR-UHFFFAOYSA-N 0.000 description 1
- QWYLJCGHISHWNZ-UHFFFAOYSA-N CNCCCCCCN(C)C.N=C=O.N=C=O Chemical compound CNCCCCCCN(C)C.N=C=O.N=C=O QWYLJCGHISHWNZ-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- BHHNBSCTXCOVAW-UHFFFAOYSA-N ClC(=O)O.CN=C=O Chemical compound ClC(=O)O.CN=C=O BHHNBSCTXCOVAW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- 101001099381 Homo sapiens Peroxisomal biogenesis factor 19 Proteins 0.000 description 1
- 235000019687 Lamb Nutrition 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- SPTUBPSDCZNVSI-UHFFFAOYSA-N N=C=O.N=C=O.COC1=CC=CC=C1C1=CC=CC=C1OC Chemical compound N=C=O.N=C=O.COC1=CC=CC=C1C1=CC=CC=C1OC SPTUBPSDCZNVSI-UHFFFAOYSA-N 0.000 description 1
- YVTVFZKHLXIJEY-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.C1OC1COCC1CO1 Chemical compound OC(=O)C=C.OC(=O)C=C.C1OC1COCC1CO1 YVTVFZKHLXIJEY-UHFFFAOYSA-N 0.000 description 1
- 102100038883 Peroxisomal biogenesis factor 19 Human genes 0.000 description 1
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 229910021623 Tin(IV) bromide Inorganic materials 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- VZTQQYMRXDUHDO-UHFFFAOYSA-N [2-hydroxy-3-[4-[2-[4-(2-hydroxy-3-prop-2-enoyloxypropoxy)phenyl]propan-2-yl]phenoxy]propyl] prop-2-enoate Chemical compound C=1C=C(OCC(O)COC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCC(O)COC(=O)C=C)C=C1 VZTQQYMRXDUHDO-UHFFFAOYSA-N 0.000 description 1
- JFBZPFYRPYOZCQ-UHFFFAOYSA-N [Li].[Al] Chemical compound [Li].[Al] JFBZPFYRPYOZCQ-UHFFFAOYSA-N 0.000 description 1
- ZZEZBJYXRZZMMS-UHFFFAOYSA-N [isocyanato(diphenyl)methyl]benzene Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(N=C=O)C1=CC=CC=C1 ZZEZBJYXRZZMMS-UHFFFAOYSA-N 0.000 description 1
- QVTMGLKIERGFFS-UHFFFAOYSA-N acetic acid;isocyanatoethane Chemical compound CC(O)=O.CCN=C=O QVTMGLKIERGFFS-UHFFFAOYSA-N 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000007718 adhesive strength test Methods 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 125000003158 alcohol group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- UDDGYKGCIIVQHJ-UHFFFAOYSA-N benzene-1,4-diol;4-methoxyphenol Chemical compound OC1=CC=C(O)C=C1.COC1=CC=C(O)C=C1 UDDGYKGCIIVQHJ-UHFFFAOYSA-N 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- KXHPPCXNWTUNSB-UHFFFAOYSA-M benzyl(trimethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1=CC=CC=C1 KXHPPCXNWTUNSB-UHFFFAOYSA-M 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- XKQTZYDZYSXGBD-UHFFFAOYSA-N chloro(isocyanato)methane Chemical compound ClCN=C=O XKQTZYDZYSXGBD-UHFFFAOYSA-N 0.000 description 1
- HXVPUKPVLPTVCQ-UHFFFAOYSA-N chloro-dimethyl-propylsilane Chemical compound CCC[Si](C)(C)Cl HXVPUKPVLPTVCQ-UHFFFAOYSA-N 0.000 description 1
- WRJWRGBVPUUDLA-UHFFFAOYSA-N chlorosulfonyl isocyanate Chemical compound ClS(=O)(=O)N=C=O WRJWRGBVPUUDLA-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- KQWGXHWJMSMDJJ-UHFFFAOYSA-N cyclohexyl isocyanate Chemical compound O=C=NC1CCCCC1 KQWGXHWJMSMDJJ-UHFFFAOYSA-N 0.000 description 1
- MAWOHFOSAIXURX-UHFFFAOYSA-N cyclopentylcyclopentane Chemical group C1CCCC1C1CCCC1 MAWOHFOSAIXURX-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- IVTMALDHFAHOGL-UHFFFAOYSA-N eriodictyol 7-O-rutinoside Natural products OC1C(O)C(O)C(C)OC1OCC1C(O)C(O)C(O)C(OC=2C=C3C(C(C(O)=C(O3)C=3C=C(O)C(O)=CC=3)=O)=C(O)C=2)O1 IVTMALDHFAHOGL-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WUDNUHPRLBTKOJ-UHFFFAOYSA-N ethyl isocyanate Chemical compound CCN=C=O WUDNUHPRLBTKOJ-UHFFFAOYSA-N 0.000 description 1
- UAIZDWNSWGTKFZ-UHFFFAOYSA-L ethylaluminum(2+);dichloride Chemical compound CC[Al](Cl)Cl UAIZDWNSWGTKFZ-UHFFFAOYSA-L 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000001815 facial effect Effects 0.000 description 1
- 229960002089 ferrous chloride Drugs 0.000 description 1
- ZUOVYDZZCSMZBJ-UHFFFAOYSA-N formic acid;isocyanatobenzene Chemical compound OC=O.O=C=NC1=CC=CC=C1 ZUOVYDZZCSMZBJ-UHFFFAOYSA-N 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-UHFFFAOYSA-N hexane-1,2,3,4,5,6-hexol Chemical compound OCC(O)C(O)C(O)C(O)CO FBPFZTCFMRRESA-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- ANJPRQPHZGHVQB-UHFFFAOYSA-N hexyl isocyanate Chemical compound CCCCCCN=C=O ANJPRQPHZGHVQB-UHFFFAOYSA-N 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 description 1
- JNFUJVWWFWBAFI-UHFFFAOYSA-N isocyanato(triphenyl)silane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(N=C=O)C1=CC=CC=C1 JNFUJVWWFWBAFI-UHFFFAOYSA-N 0.000 description 1
- DBBRJAWSDTYYBM-UHFFFAOYSA-N isocyanatocyclopropane Chemical compound O=C=NC1CC1 DBBRJAWSDTYYBM-UHFFFAOYSA-N 0.000 description 1
- XJRAOMZCVTUHFI-UHFFFAOYSA-N isocyanic acid;methane Chemical compound C.N=C=O.N=C=O XJRAOMZCVTUHFI-UHFFFAOYSA-N 0.000 description 1
- YPQKTLPPOXNDMC-UHFFFAOYSA-N isocyanic acid;methylcyclohexane Chemical compound N=C=O.CC1CCCCC1 YPQKTLPPOXNDMC-UHFFFAOYSA-N 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- HAMGRBXTJNITHG-UHFFFAOYSA-N methyl isocyanate Chemical compound CN=C=O HAMGRBXTJNITHG-UHFFFAOYSA-N 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- IFZUFHWISBKFJP-UHFFFAOYSA-N n'-[4-[dimethoxy(methyl)silyl]oxybutyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)OCCCCNCCN IFZUFHWISBKFJP-UHFFFAOYSA-N 0.000 description 1
- UJYAZVSPFMJCLW-UHFFFAOYSA-N n-(oxomethylidene)benzenesulfonamide Chemical compound O=C=NS(=O)(=O)C1=CC=CC=C1 UJYAZVSPFMJCLW-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000889 poly(m-phenylene isophthalamide) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000002954 polymerization reaction product Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000137 polyphosphoric acid Chemical class 0.000 description 1
- 125000000075 primary alcohol group Chemical group 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- WHULDTBQXVKIHX-UHFFFAOYSA-N propan-2-yl cyanate Chemical compound CC(C)OC#N WHULDTBQXVKIHX-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- FDRQPMVGJOQVTL-UHFFFAOYSA-N quercetin rutinoside Natural products OC1C(O)C(O)C(CO)OC1OCC1C(O)C(O)C(O)C(OC=2C(C3=C(O)C=C(O)C=C3OC=2C=2C=C(O)C(O)=CC=2)=O)O1 FDRQPMVGJOQVTL-UHFFFAOYSA-N 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- IKGXIBQEEMLURG-BKUODXTLSA-N rutin Chemical compound O[C@H]1[C@H](O)[C@@H](O)[C@H](C)O[C@@H]1OC[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](OC=2C(C3=C(O)C=C(O)C=C3OC=2C=2C=C(O)C(O)=CC=2)=O)O1 IKGXIBQEEMLURG-BKUODXTLSA-N 0.000 description 1
- ALABRVAAKCSLSC-UHFFFAOYSA-N rutin Natural products CC1OC(OCC2OC(O)C(O)C(O)C2O)C(O)C(O)C1OC3=C(Oc4cc(O)cc(O)c4C3=O)c5ccc(O)c(O)c5 ALABRVAAKCSLSC-UHFFFAOYSA-N 0.000 description 1
- 235000005493 rutin Nutrition 0.000 description 1
- 229960004555 rutoside Drugs 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 150000003333 secondary alcohols Chemical class 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- LTSUHJWLSNQKIP-UHFFFAOYSA-J tin(iv) bromide Chemical compound Br[Sn](Br)(Br)Br LTSUHJWLSNQKIP-UHFFFAOYSA-J 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- OXBFBRZWBIXFGO-UHFFFAOYSA-N trichloro(isocyanato)methane Chemical compound ClC(Cl)(Cl)N=C=O OXBFBRZWBIXFGO-UHFFFAOYSA-N 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- HVYVMSPIJIWUNA-UHFFFAOYSA-N triphenylstibine Chemical compound C1=CC=CC=C1[Sb](C=1C=CC=CC=1)C1=CC=CC=C1 HVYVMSPIJIWUNA-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229940102001 zinc bromide Drugs 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
- C08G59/1461—Unsaturated monoacids
- C08G59/1466—Acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C271/00—Derivatives of carbamic acids, i.e. compounds containing any of the groups, the nitrogen atom not being part of nitro or nitroso groups
- C07C271/06—Esters of carbamic acids
- C07C271/08—Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms
- C07C271/10—Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms with the nitrogen atoms of the carbamate groups bound to hydrogen atoms or to acyclic carbon atoms
- C07C271/20—Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms with the nitrogen atoms of the carbamate groups bound to hydrogen atoms or to acyclic carbon atoms to carbon atoms of hydrocarbon radicals substituted by nitrogen atoms not being part of nitro or nitroso groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/68—Unsaturated polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
Definitions
- the present invention relates to a curable composition, and more particularly to a curable composition suitable as a sealant or adhesive for liquid crystal display devices used in devices such as notebook PCs, televisions, and mobile phones, and more particularly, a dropping method.
- the present invention relates to a curable composition suitable for manufacturing a liquid crystal display device by (ODF).
- liquid crystal display devices have been used in devices such as notebook PCs and televisions, and the size of liquid crystal display devices has been increasing.
- ODF liquid crystal dropping method
- it is applied to one substrate to form a frame with a liquid crystal sealant, and after the liquid crystal material is dropped inside the frame in an uncured state of the sealant, the other substrate is bonded together, and the sealant is applied.
- This is a method of manufacturing a liquid crystal display device by curing.
- the sealant is not cured and remains as an uncured part in the light-shielding part that is not exposed to light due to the presence of the metal wiring part of the TFT substrate of the liquid crystal display and the black matrix part of the color filter substrate. There arises a problem of degrading the display quality of the liquid crystal display device.
- the liquid crystal sealant proposed by JP 9-5759 A is mainly composed of acrylic acid ester or methacrylic acid ester and is superposed by radical polymerization mechanism. Under the atmosphere, the adhesive strength is greatly reduced, and there is a problem in reliability compared to the thermosetting type. Therefore, the sealant that uses (meth) acrylic acid ester and epoxy resin as the main components together with the two-stage curing type by light and heat is used.
- any of the conventional sealing agents described above comes into contact with the liquid crystal material when uncured, and therefore, the influence of some components in the sealing agent composition eluting into the liquid crystal material is inevitable. Since the sealant is in constant contact with the liquid crystal after curing, it is necessary to consider the elution of the cured product into the liquid crystal material. In addition, since the liquid crystal display device encloses the liquid crystal material through a sealant between two plates such as glass as described above, the sealant is required to have a high degree of adhesive performance.
- an object of the present invention is to solve the above-mentioned problems, and in particular, even after applying a liquid crystal sealant as a frame to one substrate and dropping the liquid crystal material inside the frame in an uncured state of the sealant.
- An alignment film which is a liquid crystal material and a peripheral member particularly suitable for a method of manufacturing a liquid crystal display device (liquid crystal dropping method) by bonding the other substrate and curing the sealant Liquid crystal display device with low contamination and good adhesion
- Another object of the present invention is to provide a curable composition suitable for a liquid crystal display device having a high display quality of the device and good storage stability in a liquid state before curing.
- Another object of the present invention is to provide a novel photopolymerization initiator.
- the first of the present invention is a first of the present invention.
- a latent thermosetting agent is contained as an essential component, and the radical photopolymerization initiator comprises (c—l) general formula (1):
- the curable composition of the present invention further comprises (e) a fully esterified bisphenol A type and / or bisphenol F type epoxy (meth) acrylate resin.
- a curable composition of the present invention further comprises (e) a fully esterified bisphenol A type and / or bisphenol F type epoxy (meth) acrylate resin.
- a) 40 to 60 parts by weight per 100 parts by weight of component is contained.
- the curable composition of the present invention has the characteristics that it is excellent in coating workability to a substrate, has good storage stability, and has low liquid crystal stainability. By using this in a liquid crystal dropping method, the yield is improved. This makes it possible to manufacture liquid crystal display devices with improved productivity and display quality.
- the urethanization reaction product of the component (c-1) is a novel photopolymerization initiator.
- a urethane of a hydroxyl group-containing benzoyl compound and an isocyanate compound It is a photopolymerization initiator characterized by comprising a polymerization reaction product.
- Partially esterified bisphenol A type and Z or bisphenol F type epoxy (meth) acrylate resin (a) used in the curable composition of the present invention is an epoxy resin
- bisphenol A type is F Either or both of the molds are used, and this is esterified with either or both of acrylic acid or methacrylic acid (hereinafter referred to as (meth) acrylic acid), and a part of the epoxy groups in the epoxy resin molecule
- An esterified reaction product typically a reaction product obtained by esterifying one of the epoxy groups present at both molecular terminals of the epoxy resin and leaving the other unreacted.
- the fully esterified bisphenol A type and Z or bisphenol F type epoxy (meth) acrylate resin (e) used in the preferred embodiment of the present invention is either bisphenol A type or F type as an epoxy resin. Reacting one or both with (meth) acrylic acid to produce substantially all of the epoxy groups in the epoxy resin molecule, typically Means a reaction product obtained by esterifying both of the epoxy groups present at both molecular terminals.
- the partially esterified epoxy (meth) acrylate resin as the component (a) can be produced by esterifying a predetermined epoxy resin and (meth) acrylic acid according to a conventionally known method.
- epoxy resin used for the esterification reaction a commercially available bisphenol A type or F type epoxy resin can be used as appropriate. Among these, it is preferable to use a liquid at room temperature in consideration of handling during handling, ease of use, and the like. These epoxy resins may be used alone or in combination of two or more.
- the (meth) acrylic acid that partially esterifies these epoxy resins is acrylic acid, methacrylic acid or a mixture thereof. These are preferably subjected to an esterification reaction in an equivalent relationship to form a partial ester.
- Ordinary commercially available epoxy resins have epoxy groups at both ends of the molecule, so the theoretical amount that one of them esterifies, that is, about one mole of epoxy resin.
- esterification reaction usually involves an esterification catalyst (for example, benzyldimethylamine, triethylamine, benzyltrimethylammonium chloride, triphenylphosphine, triphenylstibine, etc.) and a polymerization inhibitor (for example, methoquinone, hydroxy).
- esterification catalyst for example, benzyldimethylamine, triethylamine, benzyltrimethylammonium chloride, triphenylphosphine, triphenylstibine, etc.
- a polymerization inhibitor for example, methoquinone, hydroxy
- the (b) component epoxy resin used in the present invention includes (a) the bisphenol A type epoxy resin and / or the bisphenol F type epoxy resin used when synthesizing the component, Nopolac type epoxy resin, cycloaliphatic epoxy resin, and the like.
- the oxetane resin include 3-ethyl-3-hydroxymethyloxetane, 1,4 monobis ⁇ [((3-ethyl-3-oxenanyl) methoxy] methyl ⁇ benzene, 3— Ethyl 3- (phenoxymethyl) oxetane, di [1 -ethyl (3-oxenyl)] methyl ether, and the like.
- the component (b) epoxy resin is 90 to 200 parts by weight, preferably 100 to 1 to 1 part by weight based on 100 parts by weight of the partially esterified epoxy (meth) acrylate resin (a). 50 parts by weight are used.
- (a) component partially esterified epoxy (meth) acrylic When synthesizing the rate resin, the product mixture usually contains an unreacted epoxy resin and a completely esterified product in addition to the partially esterified product.
- the amount of epoxy resin (b) is counted as the amount of epoxy resin (b).
- the amount of the component epoxy resin is less than 90 parts by weight, sufficient adhesive strength cannot be obtained, and if it exceeds 200 parts by weight, it will not be obtained during the thermosetting process after UV pre-curing. The cured epoxy resin will elute into the liquid crystal material and cause problems such as poor display.
- Component epoxy resin and Z or oxetane resin are polyfunctional at 10 to 100% by weight (more preferably 50 to 100% by weight) with respect to the total amount of component (b). More preferably, it is an epoxy resin (b).
- the polyfunctional epoxy resins include phenol nopolac type epoxy resins, cresol nopolac type epoxy resins, trisphenol methane type epoxy resins, dicyclopentagen type epoxy resins, and naphthalene type epoxy resins.
- the bisphenol F-type epoxy (meth) acrylate resin (e) is preferably allowed to coexist, and the amount thereof is preferably 40 to 6′0 parts by weight per 100 parts by weight of component (a).
- the radical polymerization initiator (c) used in the present invention is represented by the general formula (1):
- radical-generating photopolymerization initiators are preferably used in the present invention because they generate little gas during photocuring and have very low contamination to liquid crystal materials.
- 1 ⁇ is a hydroxyalkoxy group such as a hydroxy group, a hydroxymethoxy group, a hydroxyethoxy group, and a hydroxypropyl group
- R 2 and R 3 are alkyl groups such as a methyl group, an ethyl group, and a propyl group. Kill group.
- the carbon number of the alkyl group is not particularly limited, but is preferably 6 or less.
- 1 ⁇ may be attached to any position of ortho, meta, and para.
- hydroxyl group-containing benzoyl compound represented by the general formula (1) examples include 1 _ [4 1 2-hydroxy ethoxy] —phenyl] _ 2 -hydroxy 2 -methyl 1 1 -propane 1 1-one, 1-[4— (2 -Hydroxymethoxy) -phanyl] 1 2-Hydroxy 1 -Methyl 1 -Propane 1-one, 1 — [4 — (2 -Hydroxypropoxy) —Fanyl] 1 2-hydroxy Examples include 2-methyl-1-propane-1-one, 1- [41- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-ethyl-1--1-propane-1-one, and the like.
- examples of the isocyanate compound used for the urethanation reaction with the hydroxyl group-containing benzoyl compound include known monoisocyanate compounds, diisocyanate compounds, and tri- or higher polyisocyanate compounds used as raw materials for urethane compounds.
- diisocyanate compounds, polyisocyanate compounds and modified products thereof are used.
- isocyanate compounds are divided into aliphatic (including cyclic) isocyanates and aromatic isocyanates.
- aliphatic isocyanates include methyl Isocyanate, Chloromethyl isocyanate, Ethyl isocyanate, 2-Proethyl isocyanate, n-Propyl isocyanate, n-Putyl isocyanate, t-Putyl isocyanate, Pentyl isocyanate, Heptyl isocyanate, ethyl isocyanate acetate, octadecyl isocyanate, allylic isocyanate, cyclohexyl isocyanate, trichloromethyl isocyanate, chlorosulfonyl isocyanate, 3-isocyanate Propyldimethylchlorosilane, octyl isocyanate, 3-iodopropyl isocyanate, hexyl isocyan
- Aromatic isocyanates include, for example, phenyl isocyanate, 2-fluorophenyl isocyanate, 2,5-difluorophenyl isocyanate, 2-chloro-isocyanate, 2,3-dichloro-phenyl isocyanate, 2,5-dichloro Methyl phenylisocyanate, 2-methoxyphenyl isocyanate, 2,4-dimethoxyphenyl isocyanate, 2,5-dimethoxyphenyl isocyanate, 2-trifluorophenyl isocyanate, 2,5-dimethylphenyl isocyanate, 3-promoisocyanate , 3-chlorophenyl isocyanate, 3, 4-dichlorophenyl isocyanate, 3-trifluorophenyl isocyanate, 4-bromophenyl isocyanate, 4-fluorophenyl isocyanate, 4-methoxyphenyl cios Aneto, P- tolyl is
- Benzyl isocyanate 4 1-cyclobenzenylsulfonyl isocyanate, 3, 5-bis (trifluoromethyl) phenyl isocyanate, 2, 4, 6-tribromophenyl isocyanate, 2, 5 1 difluorophenyl isocyanate, methyl 2-isocyanate benzoate,
- the urethanization reaction can be carried out according to the known urethanization reaction between hydroxy groups (OH groups) and isocyanate groups (NCO groups).
- the hydroxyl group-containing benzoyl compound represented by the general formula (1) has an OH group bonded to the carbon atom to which R 2 and R 3 are bonded in addition to the OH group of the substituent represented by in the general formula. Because it is an alcohol, the reactivity is poor, and the urea ionization reaction with an isocyanate group is a primary or secondary alcohol R! The OH group reacts preferentially.
- the urethanization reaction is a stoichiometric reaction as is well known.
- the urethanization reaction product used as the component (c- l) is composed of the R-H group and the isocyanate group of the hydroxyl group-containing benzoyl compound, and R 2 and R of the hydroxyl group-containing benzoyl compound.
- the reaction product is preferably a state in which the OH group bonded to the carbon to which 3 is bonded substantially remains.
- the urethanization reaction is performed by adjusting the isocyanate group equivalent of the hydroxyl group-containing benzoyl compound and the isocyanate compound, mixing them together, and using organic acids, organic tins, and other well-known hydrous acids commonly used in the urethanization reaction. It can be carried out easily by heating in the presence of a cracking catalyst.
- the formation of the photopolymerization initiator by urethanization can be easily confirmed by the disappearance of the isocyanate group peak due to IR (infrared absorption spectrum).
- n means the degree of polymerization, and is a value of 1-10.
- the component (c-12) is a derivative of oligomer obtained by polymerizing methylstyrene with a radical or an acid catalyst.
- Commercially available products include the product names “ESACURE KIP 150” and “ESACURE KKJ” manufactured by Lamb erti.
- the compounding ratio of (a) component to (c) component photoradical polymerization initiator, ie, radical generating photopolymerization initiator, is (a) component 100 parts by weight.
- the amount is preferably 0.1 to 30 parts by weight, particularly preferably 0.5 to 20 parts by weight Photoradical
- the amount of the polymerization initiator is less than 0.1 parts by weight, the photocuring reaction becomes insufficient, and 30
- the amount exceeds 50 parts by weight the amount of the initiator is too large, and the contamination of the initiator with respect to the liquid crystal becomes a problem (d)
- the latent thermosetting agent (d) used in the present invention is mainly used in the present composition.
- One of the latent thermosetting agents used in the present invention is a conventionally known curing agent that is activated by heat, specifically, a) metaphenylenediamine, Aromatic amines such as diaminodiphenylmethane, diaminodiphenylsulfone, etc.) dicyandiamide, c) cuazole OR, cuazol CN, cuazole AZ INE (manufactured by Shikoku Kasei Kogyo Co., Ltd.)
- Other examples include thermal acid polymerization initiators such as Lewis acids (for example, boron trifluoride, titanium chloride, titanium chloride, ferrous chloride, chloride chloride).
- Ferric zinc chloride, zinc bromide, stannous chloride, stannic chloride, stannous bromide, stannic bromide, dibutyl dibutyl dichloride , Dibromide butyl second tin, Tetoraechi Rutin, tetraptyltin, triethylaluminum, jetylaluminum chloride, ethylaluminum dichloride, etc.) and electron-donating compounds (eg, N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone) , Complexes with hexamethylphosphoric triamide, dimethyl sulfoxide, trimethyl phosphate, triethyl phosphate, etc .; protonic acids (eg, halogenocarboxylic acids, sulfonic acids, sulfate monoesters, phosphate monoesters, phosphate) Diesters, polyphosphoric acid esters, boric
- a sulfonium salt-based acid-generating cation curing catalyst (mouth) a sodium salt-based acid-generating cation curing catalyst, (8) a phosphonium salt-based acid-generating cation curing catalyst, (2) Diazonium salt-based acid-generating cationic curing catalyst, (e) Ammonium salt-based acid-generating cationic curing catalyst, (f) Huekousen-based acid-generating cationic curing catalyst, etc.
- a photoacid-generating force cheon curing catalyst can also be used.
- the liquid crystal sealant for the liquid crystal dropping method can be used quickly and uniformly when the liquid crystal sealant does not contaminate the liquid crystal when heated after light irradiation, and it can be used with little change in viscosity at room temperature when used. It is important that the time is good.
- 2,4-diamino-6- (2, -methyl imidazoliriru (which is poorly soluble in resins at room temperature and has excellent curability in the medium temperature range (120 to 150 ° C)) 1,))
- Monoethyl-s-triazine or 2,4-diamino-6- (2'-methylimidazolyl (1,))-ethyl-s-triazine isocyanuric acid adduct is particularly preferred.
- the compounding ratio of the component (d) in the hard composition of the present invention is preferably 1 to 100 parts by weight, particularly preferably 10 to 40 parts by weight with respect to 100 parts by weight of the component (a). Parts by weight. (D) If the amount of the component is less than 1 part by weight, the thermosetting reaction is not sufficient, and if it exceeds 100 parts by weight, the amount of the thermosetting agent is too large and the liquid crystal is contaminated with the thermosetting agent. Is a problem.
- additives are suitable for the curable composition of the present invention as long as the properties are not impaired. An amount may be blended.
- other additives include colorants such as sensitizers, pigments and dyes, polymerization inhibitors, facial agents, antifoaming agents, coupling agents, radical polymerizable compounds, organic and inorganic fillers, and the like.
- the fillers include fused silica, crystalline silica, silicon power mono-bide, silicon nitride, boron nitride, calcium carbonate, magnesium carbonate, palium sulfate, calcium sulfate, my strength, talc, clay, alumina, magnesium oxide, oxidation Zirconium, aluminum hydroxide, magnesium hydroxide, calcium silicate, aluminum silicate, lithium aluminum silicate, zirconium silicate, barium titanate, glass fiber, carbon fiber, molybdenum disulfide, asbestos, etc., preferably molten Silica, crystalline silica, silicon nitride, boron nitride, calcium carbonate, barium sulfate, calcium sulfate, my strength, talc, clay, alumina, aluminum hydroxide, calcium silicate, aluminum silicate, more preferably molten silica Portugal, crystal strength, talc.
- radical polymerizable compound examples include radical polymerizable monomers and oligomers having a (meth) acryloyl group at the molecular end or side chain. Specific examples include polyester acrylates, epoxy acrylates, urethane acrylates, polyether acrylates, polybutadiene acrylates, silicone acrylates and various polymerizable oligomers. .
- polyester acrylate oligomer for example, by esterifying the hydroxyl group of a polyester oligomer having hydroxyl groups at both ends obtained by condensation of a polyvalent carboxylic acid and a polyvalent alcohol with (meth) acrylic acid, Alternatively, it can be obtained by esterifying a hydroxyl group at the terminal of an oligomer obtained by adding alkylene oxide to polyvalent carboxylic acid with (meth) acrylic acid.
- Epoxy acrylate oligomers can be obtained, for example, by esterifying (meth) acrylic acid with an oxysilane ring of a relatively low molecular weight bisphenol type epoxy resin or nopolac type epoxy resin.
- a force-loxyl-modified epoxy acrylate oligomer obtained by partially modifying this epoxy acrylate oligomer with a dibasic carboxylic acid anhydride can also be used.
- Urethane acrylate oligomers include, for example, polyurethane oligomers obtained by reaction of polyether polyols or polyester polyols with polyisocyanates, (meth) acrylic acid.
- Polyol acrylate-based oligomers can be obtained by esterifying the hydroxyl groups of polyether polyols with (meth) acrylic acid.
- oligomers are appropriately selected according to the use of the photocurable material.
- epoxy acrylate systems are mainly used
- flexibility, toughness, wear resistance, chemical resistance, etc. are required
- Mainly urethane acrylate system is used.
- polyester acrylates and polyether acrylates are mainly used, such as solder resists that require alkali developability, hardness, heat resistance, etc.
- carboxyl-modified epoxy acrylate systems are mainly used.
- photopolymerizable oligomers include polybutadiene oligomers with high hydrophobicity having acrylate groups in the side chains of polybutadiene oligomers, silicone acrylate oligomers with polysiloxane bonds in the main chain, and small intramolecular structures.
- One of these photopolymerizable oligomers may be used alone, or two or more thereof may be used in combination.
- the photopolymerizable oligomers are all relatively high in viscosity, and the viscosity increases as the molecular weight increases.
- a monofunctional or polyfunctional photopolymerizable monomer can be used in combination for adjusting the viscosity, promoting the photocrosslinking reaction, adjusting the crosslink density of the cured product, and the like.
- the average particle size of the filler used in the present invention is preferably 5 m or less. This is because the thickness of the liquid crystal layer is often designed to be 5 m or less in order to reduce the thickness of the display device and increase the response speed of the liquid crystal. In the case of such a thin liquid crystal layer, it is more preferable that the maximum particle size of the filler is 15 im or less, and if the amount of the filler exceeding 20 is increased, There is an increased risk of derailing the conductive wiring (aluminum, copper, or alloys thereof) under the liquid crystal (when bonded). Further, the curable composition of the present invention may be added with a coupling agent for improving adhesiveness, an additive, a spacer agent for ensuring a predetermined clearance, etc. in addition to the above-described components. Good.
- silane coupling agents include 3-glycidoxypropyltrimethoxy silane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyl pyrmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyl ⁇ Limethoxysilane, N-phenylaminoaminopropyl trimethoxysilane, N- (2-aminoethyl) 3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) 3-aminopropyl Methyl-trimethoxysilane, 3-aminopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, vinyltrimethoxysilane, N— (2- (vinylpentylamino) ethyl) 3-aminopropyltrimethoxysilane hydrochloride, 3- Methacryloxypropyl
- the components (b) and (c) are first dissolved and mixed in the component (a).
- a predetermined amount of the component (d) and the above-described force-pulling agent, filler, etc. are added to this mixture as a thermosetting agent, and the mixture is evenly mixed using a known mixing device such as a three-roll, sand mill, or pole mill.
- a known mixing device such as a three-roll, sand mill, or pole mill.
- the component (c 1 1) which is one of the radical photopolymerization initiators used in the present invention, is a novel component and can be effectively used as one component of the curable composition of the present invention.
- photopolymerizable oligomers and photopolymerizable monomers can be used for polymerization.
- the photopolymerizable oligomer and / or photopolymerizable monomer is a compound having an ethylenic double bond at the end or side chain of the molecule, and particularly a radical polymerizable compound having a (meth) acryloyl group at the end of the molecule or side chain. Is preferred.
- Radical polymerizable oligomer having (meth) acryloyl group at molecular end or side chain Specific examples of these include, for example, polyester acrylate, epoxy acrylate, urethane acrylate, polyether acrylate, polybutadiene acrylate, and silicone acrylate various polymerizable oligomers. Can be mentioned.
- polyester acrylate oligomer for example, by esterifying with a hydroxyl group (meth) acrylic acid of a polyester oligomer having a hydroxyl group at both ends obtained by condensation of a polyvalent carboxylic acid and a polyvalent alcohol, or It can be obtained by esterifying the terminal hydroxyl group of an oligomer obtained by adding an alkylene oxide to a polyvalent carboxylic acid with (meth) acrylic acid.
- Epoxy acrylate oligomers can be obtained, for example, by esterification by reacting (meth) acrylic acid with the oxysilane ring of a relatively low molecular weight bisphenol type epoxy resin or nopolac type epoxy resin.
- a carboxyl-modified epoxy acrylate oligomer obtained by partially modifying this epoxy acrylate oligomer with a dibasic carboxylic acid anhydride can also be used.
- Urethane acrylate oligomers can be obtained, for example, by esterifying a polyurethane oligomer obtained by reaction of polyether polyol or polyester polyol with polyisocyanate with (meth) acrylic acid.
- the system oligomer can be obtained by esterification with a hydroxyl group (meth) acrylic acid of a polyether polyol.
- oligomers are appropriately selected according to the use of the photocurable material.
- epoxy acrylate systems are mainly used, and in fields where flexibility, toughness, wear resistance, chemical resistance, etc. are required, Mainly urethane arylate is used.
- polyester acrylate-based polyether acrylate systems are mainly used, such as solder resists that require alkali developability, hardness, heat resistance, etc.
- power ruboxyl-modified epoxy acrylate systems are mainly used.
- photopolymerizable oligomers include polybutadiene oligomers with high hydrophobicity having acrylate groups in the side chain of polybutadiene oligomers, silicone acrylate oligomers with polysiloxane bonds in the main chain, There are amino blast resin acrylate oligomers modified from amino blast resin having many reactive groups in the core, and they are used in fields where each characteristic can be exhibited.
- One of these photopolymerizable oligomers may be used alone, or two or more thereof may be used in combination.
- the photopolymerizable oligomers are all relatively high in viscosity, and the viscosity increases as the molecular weight increases.
- a monofunctional or polyfunctional photopolymerizable monomer can be used in combination for adjusting the viscosity, promoting the photocrosslinking reaction, adjusting the crosslink density of the cured product, and the like.
- radical polymerizable monomer having a (meth) acryloyl group at the molecular terminal or side chain examples include cyclohexyl (meth) acrylate, 2-ethylhexyl (methyl) acrylate, lauryl (meth) aterelate, stearyl.
- Monofunctional acrylates such as (meth) acrylate, isoponyl (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopen Tildaricoldi (meth) acrylate, polyethylene dallicoldi (meth) acrylate, neopentyldalicol adipate di (meth) acrylate, hydroxypivalic acid neopentyl alcoholici (meth) acrylate, dicyclopentyl di (meth) Acrylate, force-prolactone-modified dicyclopenteni Rudi (meth) acrylate, ethyleneoxide-modified di (meth) acrylate, arylated cyclohexyldi (meth) acrylate, isocyanurate di
- (Meth) acrylate force prolactone-modified dipentaerythritol hexa (meth) acrylate, and the like.
- One kind of these photopolymerizable monomers may be used. Two or more types may be used in combination.
- the part in an Example is a weight part with respect to 100 weight part of epoxy (meth) acrylate resin and acid pendant type epoxy (meth) acrylate resin.
- the acid value in the synthesis examples indicates the acid value of epoxy (meth) acrylate resin and acid pendant type epoxy (meth) acrylate resin.
- Synthesis Example 1 a photopolymerization initiator PI-4 was obtained in the same manner as in Example 1 except that the diluent solvent was replaced with methyl ethyl ketone and toluene was used.
- Example 1 the latent thermosetting agent was replaced with 2,4-diamino-6- (2′-methylimidazolyl (1 ′)) etheryl s-triazine isodianuric acid adduct.
- the liquid crystal sealant of the present invention was obtained in the same manner as in Example 1 as 6- (2′-methylimidazolyl (1,))-ethyl s-triazine (2MZA-PW manufactured by Shikoku Kasei Co., Ltd.).
- Example 1 5 parts of a silane coupling agent (KBM-4033 manufactured by Shin-Etsu Chemical Co., Ltd.) was added to obtain the liquid crystal sealant of the present invention in the same manner as in Example 1.
- a silane coupling agent KBM-4033 manufactured by Shin-Etsu Chemical Co., Ltd.
- photopolymerization initiator obtained by urethanation of 1- [4 mono (2-hydroxyethoxy) -phenyl] —2 —hydroxy-1-methyl-1-one-propane-11-one and hexamethylene disoocyanate.
- a liquid crystal sealant of the present invention was obtained in the same manner as in Example 1 except that the photopolymerization initiator P1-2 was used.
- Example 1 a liquid crystal seal was added in the same manner as in Example 1 without adding the phenolic nopolac type epoxy resin (trade name EP I CLON N-770, manufactured by Dainippon Ink & Chemicals, Inc.), which is a polyfunctional epoxy resin. An agent was obtained.
- phenolic nopolac type epoxy resin trade name EP I CLON N-770, manufactured by Dainippon Ink & Chemicals, Inc.
- Example 1 the photoinitiator was changed to PI-1, and 1-hydroxy-cyclohexyl roof enyl-ketone (Irgacure 1 manufactured by Ciba Specialty Chemicals) 84) As in Example 1, a liquid crystal sealant was obtained.
- Example 1 in place of P 1-1, the photoinitiator was 2-hydroxy-2-methyl-1-1-phenyl-propane 1-one (Ciba Specialty Chemical Co., Ltd. Daguchi Cure 1173), A liquid crystal sealant was obtained in the same manner as in Example 1.
- Example 1 instead of the photoinitiator PI-1, 1- [4- (2-hydroxyethoxy) monophenyl] 1-2-hydroxy1-2-methyl-1-propane-1-one (Ciba A liquid crystal sealant was obtained in the same manner as in Example 1 as Irgagiyu 2959) manufactured by Charity Chemicals.
- Example 1 2,4-diamino 6- (2, -methylimidazolyl (1 ')) monoethyl-s-triazine isocyanuric acid adduct (Chiazol 2MAOK-PW, manufactured by Shikoku Kasei Co., Ltd.) Instead of Amicure I VDH (manufactured by Ajinomoto Fine Techno Co., Ltd.) 25 parts, the liquid crystal sealant of the present invention was obtained in the same manner as in Example 1.
- Example 6 2,4-diamino 6- (2, -methylimidazolyl (1 ')) monoethyl-s-triazine isocyanuric acid adduct (Chiazol 2MAOK-PW, manufactured by Shikoku Kasei Co., Ltd.) 25 parts, the liquid crystal sealant of the present invention was obtained in the same manner as in Example 1.
- Example 6 2,4-diamino 6- (2, -methylimidazolyl (1 ')) monoethy
- Example 1 4-Diamino-6- (2'-methylimidazoliriru (1 '))-ethyl s-triazine isocyanuric acid adduct (Chuazol manufactured by Shikoku Kasei Co., Ltd. 2 MAO K —Liquid sealing agent of the present invention was obtained in the same manner as in Example 1 except that 25 parts of bis [4- (4-aminophenoxy) phenyl] sulfone was used instead of PW).
- Example 7 4-Diamino-6- (2'-methylimidazoliriru (1 '))-ethyl s-triazine isocyanuric acid adduct (Chuazol manufactured by Shikoku Kasei Co., Ltd. 2 MAO K —Liquid sealing agent of the present invention was obtained in the same manner as in Example 1 except that 25 parts of bis [4- (4-aminophenoxy) phenyl] sulfone was used instead of PW).
- Example 1 the liquid crystal sealant of the present invention was obtained in the same manner as in Example 1 except that the amount of photoinitiator PI 1 added was 0.05 part.
- Example 1 the liquid crystal sealant of the present invention was obtained in the same manner as in Example 1 except that the addition amount of the photoinitiator PI-1 was 30 parts.
- Example 1 the latent thermosetting agent 2, 4-diaminole 6— (2 ′ monomethylimi
- the liquid crystal sealant of the present invention was prepared in the same manner as in Example 1, except that the amount of daziriru (1 ')) ether s-triazine isocyanuric acid adduct (Curesol 2MAOK-PW, manufactured by Shikoku Kasei Co., Ltd.) Obtained.
- Example 1 the latent thermosetting agent 2, 4-diamino 6- (2, methyl imidazolyl (1,)) — ethyl s-triazine isosialic acid adduct (Chiazole 2MAOK, manufactured by Shikoku Kasei Co., Ltd.)
- the liquid crystal sealant of the present invention was obtained in the same manner as in Example 1 except that the amount of PW) added was 60 parts.
- BP-1 of component (a) synthesized in Example 1 Phenolic novolak type epoxy resin (trade name EP I CLON N-77 0) 2 5 parts by 100 parts as a photoinitiator Oligo [2-Hydroxyl 2-Methyl-1- 1_ ⁇ 4- (1-Methylbuyl) phenol ⁇ Propane] (1 amb erti product name ES ACURE KIP 1 50) Add 3 parts, 70 Stirring was continued for 30 minutes at ° C to obtain a uniformly dissolved resin solution.
- Example 1 the amount of the photoinitiator oligo [2-hydroxy_2_methyl_1- ⁇ 4- (1-methylvinyl) phenol ⁇ propane] (1 amb erti, trade name E SACURE KIP 1 50)
- the liquid crystal sealant of the present invention was obtained in the same manner as in Example 11 as 10 parts.
- Example 1 the latent thermosetting agent was replaced with 2,4-diamino-6- (2'-methylimidazolyl (1,))-ethyl-1-s-triazine isocyanuric acid 2,4-Diamino-6— (2, Monomethylimidazolyl (1 ')) —Ethylu
- the liquid crystal sealant of the present invention was obtained in the same manner as Example 11 as s-triazine (2MZA-PW manufactured by Shikoku Kasei Co., Ltd.).
- Example 12 the latent thermosetting agent was replaced with 2,4-diamino 6- (2, monomethylimidazolyl (1,))-ethyl s-triazine isocyanuric acid adduct.
- 2, -Methylimidazolyl- (1,)) A liquid crystal sealant of the present invention was obtained in the same manner as in Example 11 as ethyl s-triazine (2MZA-PW manufactured by Shikoku Kasei Co., Ltd.). ;
- Example 11 the latent thermosetting agent 2, 4-diamino-6- (2'-methylimidazolyl (1,))-ethyl s-triazine isocyanuric acid adduct (Chiazole 2MAOK, manufactured by Shikoku Kasei Co., Ltd.)
- the liquid crystal sealant of the present invention was obtained in the same manner as in Example 11 with the addition amount of PW) being 30 parts.
- Example 11 2 parts of a silica coupling agent (KBM-403 manufactured by Shin-Etsu Chemical Co., Ltd.) was added to obtain the liquid crystal sealant of the present invention in the same manner as in Example 11.
- KBM-403 manufactured by Shin-Etsu Chemical Co., Ltd.
- Example 11 20 parts of bisphenol A type epoxy acrylate (Eb ecryl 3700 (completely esterified product) manufactured by Daicel UCB Co., Ltd.) was further added, and the present invention was conducted in the same manner as in Example 11. A liquid crystal sealant was obtained.
- Eb ecryl 3700 completely esterified product manufactured by Daicel UCB Co., Ltd.
- Example 11 instead of 2, 4-diamino-6- (2'-methylimidazolyl (1 '))-ethyl s-triazine isocyanuric acid adduct (Cureazole 2MAOK-PW, manufactured by Shikoku Kasei Co., Ltd.)
- the liquid crystal sealant of the present invention was obtained in the same manner as in Example 11 with 25 parts of Amicure VDH (manufactured by Ajinomoto Fine Techno Co., Ltd.).
- Example 19 4-diamino-6- (2'-methylimidazolyl (1 '))-ethyl s-triazine isocyanuric acid adduct
- Example 11 4-diamino-6- (2, -methylimidazoliriru (1 ')) monoethyl-s-triazine isocyanuric acid adduct (manufactured by Shikoku Kasei Co., Ltd.) W 200
- the liquid crystal sealant of the present invention was obtained in the same manner as in Example 11 except that 25 parts of bis [41- (aminophenoxy) phenyl] sulfone was used instead of 24 cuazol 2MAOK-PW).
- Example 1 the liquid crystal was the same as in Example 1 without adding the phenolic nopolac epoxy resin (trade name EP I CLON N-770, manufactured by Dainippon Ink & Chemicals, Inc.), which is a polyfunctional epoxy resin. A sealant was obtained.
- phenolic nopolac epoxy resin trade name EP I CLON N-770, manufactured by Dainippon Ink & Chemicals, Inc.
- Example 11 the photoinitiator was replaced with oligo [2-hydroxy-2-methyl-11 ⁇ 4- (1-methylvinyl) phenyl ⁇ propane] (1 amb erti, trade name ESACURE KIP 150), A liquid crystal sealant was obtained in the same manner as in Example 1 as 1-hydroxy-cyclohexyl hexaphenylone (Irgacure 18 4 manufactured by Ciba Specialty Chemicals).
- Example 1 the photoinitiator was replaced with oligo [2-hydroxy-2-methyl-11 ⁇ 4- (1-methylvinyl) phenyl ⁇ propane] (1 amb erti, trade name ESACURE KIP 150), A liquid crystal sealant was obtained in the same manner as in Example 11 as 2-hydroxy-2-methyl-11-one propane propane-11-one (Ciba 'speciality', Daroki Your 1173).
- Example 1 the photoinitiator was oligo [2-hydroxy-2-methyl-1-one ⁇ 4- (1-methylvinyl) phenyl ⁇ propane] (1 amb erti, trade name ESACURE KIP 150) Instead, 1- [4 (2-hydroxyethoxy) monophenyl] 1-hydroxy-2-methyl-1-propane-1-one (Chipa 'Specialty' Irgacure 2959, manufactured by Chemicals) 1 A liquid crystal sealant was obtained in the same manner as in 1.
- Example 11 photoinitiator oligo [2-hydroxy-2-methyl-1] ⁇ 4 Liquid crystal sealant of the present invention was obtained in the same manner as in Example 1 1 except that the amount of 1 (1-methylvinyl) phenyl ⁇ propane] (1 amb erti, trade name E SACURE KIP 150) was 0.05 parts. .
- Example 11 the addition amount of the photoinitiator oligo [2-hydroxy-2-methyl_1 mono ⁇ 4 one (1-methylvinyl) phenyl ⁇ propane] (1 amb erti, trade name E SACURE KIP 150) was added to 40 parts. As in Example 11, a liquid crystal sealant was obtained.
- Example 11 the latent thermosetting agent 2,4-diamino-6— (2, monomethylimidazolyl mono (1,))-ethyl s-triazine dissocyanuric acid adduct (Chiazole 2MAOK manufactured by Shikoku Kasei Co., Ltd.)
- the liquid crystal sealant of the present invention was obtained in the same manner as in Example 11 with the addition amount of PW) being 0.5 part.
- Example 1 the latent thermosetting agent 2,4-diamino-6— (2′—methylimidazolyl— (1,))-ethyl s-triazine disanocyanuric acid adduct (Chiazole 2MAOK manufactured by Shikoku Kasei Co., Ltd.)
- the liquid crystal sealant of the present invention was obtained in the same manner as in Example 11 with the addition amount of PW) being 120 parts.
- Specimen preparation method A photocurable material was applied to a glass plate and bonded to the other glass plate. Using a high pressure mercury lamp with a lamp height of 15 cm and 8 OWZcm, an ultraviolet ray with an integrated light intensity of 300 Om J / cm 2 was irradiated. Thereafter, a sample heated at 120 ° CX for 1 hour was used for evaluation as a test piece.
- Evaluation method Fix both ends of the test piece to the chuck and pull at a tensile speed of 5 Omm / min. A shear load was applied, the maximum load until the specimen was broken, and the tensile shear bond strength was calculated from the following formula. The tensile shear bond strength in the case of only UV curing is also shown.
- test piece prepared by the above-described test piece preparation method was allowed to stand for 12 hours in a PCT (121 ° C, 2 atm) atmosphere, and the shear bond strength was measured in the same manner as described above.
- liquid crystal sealant To measure the specific resistance of contact liquid crystals, which is one of the evaluation methods for contamination of liquid crystals, 0.15 g of liquid crystal sealant is put in a sample bottle, and 1.5 g of liquid crystal (Merck ZLI-4792) is added. After that, put it in a 120 ° C oven for 1 hour without UV irradiation, and then leave it at room temperature for 1 hour. Remove the liquid crystal material, which is the supernatant liquid, from the processed sample bottle and place it in the liquid electrode LE 21 (manufactured by Ando Electric). Toyo Tech Niriki liquid crystal resistivity measurement system and KE I THLEY electrometer. A was used to measure the specific resistance of the liquid crystal after 5 seconds at a measurement voltage of 10 V.
- the number of digits of the specific resistance value of the contact liquid crystal is Those that did not decrease by more than one digit were rated as ⁇ , those that decreased by two digits or more were marked as ⁇ , and others that were judged as X.
- Each liquid crystal sealant obtained was allowed to stand at 25 ° C., and the change with time in viscosity was measured. The time for the viscosity to double or more was measured.
- Table 1 shows the evaluation results of Examples 1 to 10 and Comparative Examples 1 to 4, and Table 2 shows the evaluation results of Examples 1 to 24 and Comparative Examples 5 to 7. table 1
- Example 21 Example 22
- Example 23 “Example 24”
- Example 9 since the amount of the latent thermosetting agent is small and the epoxy resin is not sufficiently cured, there is a concern about liquid crystal contamination, and the final adhesive strength is slightly low. In Example 10, the amount of the latent thermosetting agent is large and there is a concern about the liquid crystal contamination, and the storage stability is slightly poor.
- Example 1 1 to 17 have viscosities that do not cause any problems in operation, high adhesive strength, low liquid crystal contamination, and very good storage stability. It can be seen that Example 20 has a slightly low adhesive strength after moisture resistance reliability, and Comparative Examples 5 to 7 have a problem with liquid crystal contamination. From Examples 18 and 19, it can be seen that the storage stability is affected by the type of latent thermosetting agent. In Example 21, the adhesive strength at the time of UV temporary curing is low and the glass substrate may be peeled off. Example 22 has a large amount of the photopolymerization initiator and is liable to be contaminated with liquid crystal.
- Example 23 since the amount of the latent thermosetting agent is small and the epoxy resin is not sufficiently cured, the liquid crystal contamination is slightly high and the final adhesive strength is slightly low. In Example 24, the amount of the latent thermosetting agent is large, the liquid crystal contamination is slightly high, and the storage stability is slightly poor.
- Example 2 5
- photopolymerization initiator of the component (c-1) is used for photopolymerization of other polymerizable components.
- a photocurable material was obtained in the same manner using PI 2 instead of PI 1 described above.
- the curable composition of the present invention is suitable as a liquid crystal display device, a sealing agent or an adhesive used in devices such as notebook PCs, televisions and mobile phones.
- a liquid crystal display device a sealing agent or an adhesive used in devices such as notebook PCs, televisions and mobile phones.
- it can be suitably used when producing a liquid crystal display device by a dropping method (O D F).
- O D F dropping method
- It can also be applied to other display devices such as organic EL display devices other than liquid crystal display devices.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Sealing Material Composition (AREA)
- Epoxy Resins (AREA)
Description
Claims
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CN2005800243820A CN1989164B (zh) | 2004-07-22 | 2005-07-21 | 固化性组合物 |
KR1020077004100A KR101158316B1 (ko) | 2004-07-22 | 2005-07-21 | 경화성 조성물 |
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JP2004213782A JP4802461B2 (ja) | 2004-07-22 | 2004-07-22 | 光重合開始剤及びそれを用いた光硬化性材料 |
JP2004-213782 | 2004-07-22 | ||
JP2004217127A JP4639684B2 (ja) | 2004-07-26 | 2004-07-26 | 液晶表示装置のシール剤 |
JP2004-217127 | 2004-07-26 | ||
JP2004293371A JP4645804B2 (ja) | 2004-10-06 | 2004-10-06 | 液晶表示装置用硬化性組成物 |
JP2004-293371 | 2004-10-06 |
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Cited By (8)
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CN101657478B (zh) * | 2007-03-08 | 2011-07-27 | Dic株式会社 | 活性能量射线固化型树脂组合物、活性能量射线固化型涂料及保护层的形成方法 |
WO2012103338A1 (en) * | 2011-01-26 | 2012-08-02 | M-I L.L.C. | Wellbore strengthening composition |
CN103087641A (zh) * | 2013-01-23 | 2013-05-08 | 深圳市华星光电技术有限公司 | 一种边框胶材、液晶显示面板以及相应的液晶显示器 |
CN103562786A (zh) * | 2012-03-30 | 2014-02-05 | 积水化学工业株式会社 | 液晶滴下工艺用密封剂、上下导通材料及液晶显示元件 |
WO2018062168A1 (ja) * | 2016-09-29 | 2018-04-05 | 積水化学工業株式会社 | 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子 |
US11193049B2 (en) * | 2016-11-25 | 2021-12-07 | Lg Chem, Ltd. | Curable composition |
US11208526B2 (en) * | 2016-11-25 | 2021-12-28 | Lg Chem, Ltd. | Curable composition |
WO2023120683A1 (ja) * | 2021-12-24 | 2023-06-29 | 積水化学工業株式会社 | 液晶表示素子用シール剤、液晶表示素子、及び、多価ヒドラジド化合物 |
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KR101490484B1 (ko) | 2008-09-26 | 2015-02-05 | 삼성디스플레이 주식회사 | 액정 표시 장치 및 그 제조 방법 |
WO2013002177A1 (ja) * | 2011-06-28 | 2013-01-03 | 積水化学工業株式会社 | 液晶滴下工法用シール剤、液晶滴下工法用シール剤の製造方法、上下導通材料、及び、液晶表示素子 |
KR102161333B1 (ko) * | 2016-12-28 | 2020-09-29 | 주식회사 엘지화학 | 양이온성 중합성 조성물의 포장 용기 및 이를 사용한 포장 방법 |
KR102154442B1 (ko) * | 2019-09-27 | 2020-09-09 | 강준기 | 항균성이 우수한 철재가구 및 이의 제조방법 |
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CN101657478B (zh) * | 2007-03-08 | 2011-07-27 | Dic株式会社 | 活性能量射线固化型树脂组合物、活性能量射线固化型涂料及保护层的形成方法 |
EA031898B1 (ru) * | 2011-01-26 | 2019-03-29 | Эм-Ай Эл.Эл.Си. | Скважинная упрочняющая композиция |
WO2012103338A1 (en) * | 2011-01-26 | 2012-08-02 | M-I L.L.C. | Wellbore strengthening composition |
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CN103562786A (zh) * | 2012-03-30 | 2014-02-05 | 积水化学工业株式会社 | 液晶滴下工艺用密封剂、上下导通材料及液晶显示元件 |
CN103562786B (zh) * | 2012-03-30 | 2015-03-25 | 积水化学工业株式会社 | 液晶滴下工艺用密封剂、上下导通材料及液晶显示元件 |
CN103087641A (zh) * | 2013-01-23 | 2013-05-08 | 深圳市华星光电技术有限公司 | 一种边框胶材、液晶显示面板以及相应的液晶显示器 |
WO2018062168A1 (ja) * | 2016-09-29 | 2018-04-05 | 積水化学工業株式会社 | 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子 |
CN108780251A (zh) * | 2016-09-29 | 2018-11-09 | 积水化学工业株式会社 | 液晶显示元件用密封剂、上下导通材料和液晶显示元件 |
JPWO2018062168A1 (ja) * | 2016-09-29 | 2019-07-11 | 積水化学工業株式会社 | 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子 |
JP7000159B2 (ja) | 2016-09-29 | 2022-01-19 | 積水化学工業株式会社 | 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子 |
US11193049B2 (en) * | 2016-11-25 | 2021-12-07 | Lg Chem, Ltd. | Curable composition |
US11208526B2 (en) * | 2016-11-25 | 2021-12-28 | Lg Chem, Ltd. | Curable composition |
WO2023120683A1 (ja) * | 2021-12-24 | 2023-06-29 | 積水化学工業株式会社 | 液晶表示素子用シール剤、液晶表示素子、及び、多価ヒドラジド化合物 |
JP7389304B2 (ja) | 2021-12-24 | 2023-11-29 | 積水化学工業株式会社 | 液晶表示素子用シール剤、液晶表示素子、及び、多価ヒドラジド化合物 |
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TW200613422A (en) | 2006-05-01 |
KR20070044029A (ko) | 2007-04-26 |
TWI378965B (ja) | 2012-12-11 |
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