WO2005116306A1 - ナノクリスタルダイヤモンド膜、その製造方法、及びナノクリスタルダイヤモンド膜を用いた装置 - Google Patents
ナノクリスタルダイヤモンド膜、その製造方法、及びナノクリスタルダイヤモンド膜を用いた装置 Download PDFInfo
- Publication number
- WO2005116306A1 WO2005116306A1 PCT/JP2004/007642 JP2004007642W WO2005116306A1 WO 2005116306 A1 WO2005116306 A1 WO 2005116306A1 JP 2004007642 W JP2004007642 W JP 2004007642W WO 2005116306 A1 WO2005116306 A1 WO 2005116306A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- electrode
- substrate
- nanocrystalline
- diamond film
- Prior art date
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 305
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 300
- 238000000034 method Methods 0.000 title claims abstract description 101
- 239000002159 nanocrystal Substances 0.000 title claims abstract description 58
- 230000008569 process Effects 0.000 title claims description 17
- 239000010408 film Substances 0.000 claims abstract description 397
- 239000007789 gas Substances 0.000 claims abstract description 95
- 239000001257 hydrogen Substances 0.000 claims abstract description 53
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 53
- 238000005268 plasma chemical vapour deposition Methods 0.000 claims abstract description 53
- 239000013078 crystal Substances 0.000 claims abstract description 49
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000003054 catalyst Substances 0.000 claims abstract description 35
- 239000010409 thin film Substances 0.000 claims abstract description 28
- 239000000446 fuel Substances 0.000 claims abstract description 19
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 17
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 17
- 238000000018 DNA microarray Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 219
- 238000004519 manufacturing process Methods 0.000 claims description 42
- 239000004065 semiconductor Substances 0.000 claims description 39
- 239000011521 glass Substances 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 30
- 239000002245 particle Substances 0.000 claims description 29
- 238000009832 plasma treatment Methods 0.000 claims description 29
- 239000012535 impurity Substances 0.000 claims description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 24
- 238000006243 chemical reaction Methods 0.000 claims description 24
- 229910052710 silicon Inorganic materials 0.000 claims description 24
- 239000010703 silicon Substances 0.000 claims description 24
- 229920000307 polymer substrate Polymers 0.000 claims description 23
- 239000002994 raw material Substances 0.000 claims description 16
- 239000012528 membrane Substances 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 15
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims description 14
- 229910000037 hydrogen sulfide Inorganic materials 0.000 claims description 13
- 239000000919 ceramic Substances 0.000 claims description 10
- 125000006575 electron-withdrawing group Chemical group 0.000 claims description 10
- 229910052760 oxygen Inorganic materials 0.000 claims description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- 239000003792 electrolyte Substances 0.000 claims description 8
- 229910052731 fluorine Inorganic materials 0.000 claims description 8
- 238000001459 lithography Methods 0.000 claims description 8
- 150000002431 hydrogen Chemical class 0.000 claims description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 6
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 6
- 229910052796 boron Inorganic materials 0.000 claims description 6
- -1 diborane Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 239000011593 sulfur Substances 0.000 claims description 6
- 229910052717 sulfur Inorganic materials 0.000 claims description 6
- 125000000524 functional group Chemical group 0.000 claims description 5
- 230000005525 hole transport Effects 0.000 claims description 5
- 239000002105 nanoparticle Substances 0.000 claims description 5
- 238000003487 electrochemical reaction Methods 0.000 claims description 4
- 239000002923 metal particle Substances 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 230000005684 electric field Effects 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims description 2
- 239000002113 nanodiamond Substances 0.000 claims description 2
- 238000006479 redox reaction Methods 0.000 claims description 2
- 239000004575 stone Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 4
- 108020003215 DNA Probes Proteins 0.000 claims 2
- 239000003298 DNA probe Substances 0.000 claims 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- ANMFXAIWZOZAGV-UHFFFAOYSA-N [N].[Si].[Si] Chemical compound [N].[Si].[Si] ANMFXAIWZOZAGV-UHFFFAOYSA-N 0.000 claims 1
- AFCIMSXHQSIHQW-UHFFFAOYSA-N [O].[P] Chemical compound [O].[P] AFCIMSXHQSIHQW-UHFFFAOYSA-N 0.000 claims 1
- 125000003277 amino group Chemical group 0.000 claims 1
- 238000002485 combustion reaction Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 125000004093 cyano group Chemical group *C#N 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 125000002560 nitrile group Chemical group 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-L sulfate group Chemical group S(=O)(=O)([O-])[O-] QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 23
- 239000010410 layer Substances 0.000 description 46
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 29
- 239000002344 surface layer Substances 0.000 description 22
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 20
- 230000015572 biosynthetic process Effects 0.000 description 18
- 230000000704 physical effect Effects 0.000 description 15
- 125000004429 atom Chemical group 0.000 description 13
- 238000005229 chemical vapour deposition Methods 0.000 description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 10
- 238000001020 plasma etching Methods 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000010453 quartz Substances 0.000 description 8
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 7
- 230000003197 catalytic effect Effects 0.000 description 7
- 239000007772 electrode material Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 5
- 229910052729 chemical element Inorganic materials 0.000 description 5
- 239000011737 fluorine Substances 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 4
- 239000002956 ash Substances 0.000 description 4
- 239000012495 reaction gas Substances 0.000 description 4
- 238000006722 reduction reaction Methods 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000012018 catalyst precursor Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 229910021423 nanocrystalline silicon Inorganic materials 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- TXKMVPPZCYKFAC-UHFFFAOYSA-N disulfur monoxide Inorganic materials O=S=S TXKMVPPZCYKFAC-UHFFFAOYSA-N 0.000 description 2
- 238000005566 electron beam evaporation Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 238000005546 reactive sputtering Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 238000004611 spectroscopical analysis Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical compound S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 description 2
- 238000004402 ultra-violet photoelectron spectroscopy Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 235000002918 Fraxinus excelsior Nutrition 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- 229920000557 Nafion® Polymers 0.000 description 1
- 229910000629 Rh alloy Inorganic materials 0.000 description 1
- 241000283984 Rodentia Species 0.000 description 1
- XGCTUKUCGUNZDN-UHFFFAOYSA-N [B].O=O Chemical compound [B].O=O XGCTUKUCGUNZDN-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 239000012491 analyte Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- XUVKPUBMPTVUTD-UHFFFAOYSA-N carbon dioxide phosphane Chemical compound C(=O)=O.P XUVKPUBMPTVUTD-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004033 diameter control Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 238000000313 electron-beam-induced deposition Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000001272 nitrous oxide Substances 0.000 description 1
- FYBALDPTDGUXDG-UHFFFAOYSA-N platinum;tetrahydrate Chemical compound O.O.O.O.[Pt] FYBALDPTDGUXDG-UHFFFAOYSA-N 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/16—Controlling or regulating
- C30B25/165—Controlling or regulating the flow of the reactive gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
- C23C16/278—Diamond only doping or introduction of a secondary phase in the diamond
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
- C30B25/105—Heating of the reaction chamber or the substrate by irradiation or electric discharge
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/04—Diamond
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
- C30B29/605—Products containing multiple oriented crystallites, e.g. columnar crystallites
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02527—Carbon, e.g. diamond-like carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02595—Microstructure polycrystalline
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1602—Diamond
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
Definitions
- Nanocrystalline film method of manufacturing the same, and device using nanocrystalline film
- the present invention relates to a nanocrystalline diamond film made of fine diamond crystal crystals on the order of nanometers, a method for manufacturing the same, and a method for manufacturing the same.
- ⁇ >-It is now possible to form films by and.
- a thermal film CVD or a micro-wave CVD method is generally used as a method of forming a film.
- a diamond substrate A single-crystal diamond film can be formed on a natural or high-pressure synthetic diamond (homogeneous film), while a polycrystalline diamond film can be formed on a silicon, metal or quartz substrate.
- a film can be formed.
- polycrystalline diamonds and films can be formed on relatively large-area substrates such as silicon, but since they are polycrystalline, the surface irregularities are significantly large. Since the crystal grains constituting the diamond and the film have a large particle size of 1 to 10 ⁇ m, the surface roughness of the film is large.
- nano-V star film with a smooth surface consisting of nanometer-order fine crystal grains formed on a large-area substrate of various materials at a low temperature is desired.
- rare, such films and their deposition methods have not yet been found.o
- the present invention relates to a nano-scale V-star diamond having a nanometer-order fine crystal particle capable of forming a film on a body of various materials at an appropriate temperature on each substrate and comprising a nanometer-order fine crystal particle. To provide a membrane and a method for producing the same.
- the nanocrystalline diamond film having a particle size of 1 nm or more and less than 1000 nm as a main component is a nanocrystalline diamond film.
- the second aspect of the present invention has at least one pair of electrodes, and is used for detecting the type of the substance to be measured and measuring its concentration by utilizing the oxidation-reduction reaction on the surface of the i-electrode.
- at least one electrode is provided with a substrate and the above-mentioned nanocrystal film formed on the surface of the substrate.
- At least one of the Ife electrode and the negative electrode is used for electrolyzing a liquid or gas by utilizing an electrochemical reaction.
- An electrochemical electrode comprising: a substrate; and the nanocrystalline diamond film formed on a surface of the substrate.
- a substrate and the nanocrystalline diamond film and the nanocrystalline diamond film having a functional group for carrying DNA on the surface formed on the substrate.
- a DNA chip comprising a supported DNA chip is provided.
- a first electrode transporting layer, an organic light emitting layer, an electron transporting layer, and a second electrode are sequentially laminated on a substrate, and the first electrode is formed. And second, the number of electrodes
- the organic electroluminescent device including the nanocrystalline layer and the film is provided in contact with the BU-transport layer or the electron-transport layer.
- a first electrode a first electrode, a first electrode,
- An organic semiconductor layer of a first conductivity type, an organic semiconductor layer of a second conductivity type, and a second electrode are sequentially laminated, and at least one of the first electrode and the second electrode is of the first conductivity type.
- an organic electroluminescent device including the nanocrystalline film in contact with an organic semiconductor layer or a second conductivity type organic semiconductor layer.
- a base, a gate electrode formed on the base, a gate insulating film covering the gate electrode, and a gap formed on the gate insulating film are formed.
- At least one of the source electrode, the drain electrode, and the drain electrode is provided on at least one surface of the source electrode and the drain electrode.
- an organic thin-film transistor on which the above-mentioned nano V standard photo-dam film is formed.
- a base a conductive layer formed on the base, an insulating layer having an opening, a good electrode formed on the conductive layer, and a BU. And a heater formed on the conductive layer exposed in the opening, and the nano V-star diamond film is formed on the surface of the heater.
- a cold electron emission device is provided.o
- a first electrode a second electrode, and an electrolyte layer sandwiched between the first and second electrodes,
- At least one side of the first and second electrodes ⁇ supports a catalyst on the side in contact with the electrolyte ⁇
- a fuel cell having the above Nano X V Star Damon membrane is formed.
- a metal-supported nanocrystal comprising: a carrier comprising the nanocrystalline catalyst film described above; and catalytic metal particles having a particle size on the order of nm supported on the carrier.
- a stadium catalyst is provided.
- a nanocrystal is formed on a substrate outside a plasma region by a plasma CVD method using a source gas containing hydrocarbons and hydrogen.
- a method for manufacturing a stadium diamond film is provided.o
- FIG. 1 is a cross-sectional view showing a nanocrystalline diamond film according to one embodiment of the present invention.
- FIG. 2A is a perspective view showing a main part of an electrode terminal of the electrochemical device according to one embodiment of the present invention.
- FIG. 2B is a perspective view showing an electrode pattern of the electrochemical device according to one embodiment of the present invention.
- 3A to 3E are cross-sectional views showing a process of manufacturing a main part of an electrode of an electrochemical device according to an embodiment of the present invention.
- FIGS. 4A to 4C show cross sections of an electrochemical electrode having a nanocrystalline diamond film adhered to the surface.
- FIG. 5 is a cross-sectional view showing a DNA chip according to an application example of the present invention.
- FIG. 6 is a sectional view showing an organic electroluminescent device according to an application example of the present invention.
- FIG. 7 is a sectional view showing an organic solar cell according to an application example of the present invention.
- FIG. 8 is a cross-sectional view showing an organic thin-film transistor according to an application example of the present invention.
- FIG. 9 is a cross-sectional view showing a cold electron-emitting device according to an application example of the present invention.
- FIG. 10 is a cross-sectional view showing a fuel cell according to an application example of the present invention.
- FIGS. 11A to 11C are cross-sectional views illustrating a process for manufacturing a nano-taristor / redmond and a film according to an embodiment of the present invention.
- FIGS. 12A to 12E are cross-sectional views illustrating a manufacturing process of a cold electron emitting device according to an application example of the present invention.
- the nanocrystalline diamond film of the present invention has a nanometer order of crystal grain size. However, since each nanoparticle is a diamond crystal, it can be formed into a single crystal or polycrystalline diamond. It shows the same physical properties. That is, the nanocrystalline diamond film of the present invention has various physical properties peculiar to diamond while having nanosize crystals.
- doping of the impurity element is possible, and semiconductor control can be performed by adjusting the type and amount of the doping. Furthermore, the surface treatment is effective It is also possible to modify the surface properties by adding species functional groups.
- the nanocrystalline diamond film of the present invention has at least one selected from the group consisting of sulfur, boron, oxygen, adjacent nitrogen and silicon as impurities, which can dope impurities. O It is desirable to use
- n-type or ⁇ -type impurity conductivity is exhibited, and semiconductor properties are obtained, and ift electrical conductivity can be obtained.
- the substrate on which the nanocrystalline silicon film of the present invention is formed is selected from the group consisting of a silicon substrate, a silicon substrate, a ceramic substrate, a metal substrate, a glass substrate, and a polymer substrate. It can be at least one kind. That is, the nanocrystalline diamond film of the present invention can be formed on a practical substrate other than the diamond substrate as a film having the same physical properties as the diamond.
- a silicon substrate, a quartz substrate, a metal substrate, or a ceramic substrate can be used as a practical substrate for a high-temperature process of 500 ° C. to 900 ° C. On the other hand, there is no 300 ° C or 50
- a glass substrate is used as a practical substrate for a low-temperature process at 0 ° C, and a polymer substrate is used as a practical substrate for a temperature of 100 ° C to 300 ° C. And can be done.
- the nanocrystalline diamond film of the present invention can be terminated by the surface force of the film.
- an electron-donating group-terminated structure on the surface of the nanocrystalline film as described above, conductivity can be imparted to the surface of the film. 3;
- the surface of the nanocrystalline diamond film of the present invention has low work. Because it has a function, it is possible to obtain practical characteristics such as high electron emission characteristics and electron injection characteristics, especially in applications to various electrodes.
- the surface of the film can be terminated with an electron withdrawing group.
- the electron-withdrawing group-terminated structure on the surface of the nanocrystalline diamond film as described above, the surface of the nanocrystalline diamond film has a high work function. In application to electrodes, practical characteristics such as high hole injection characteristics can be obtained.
- the surface of the nanocrystalline diamond film of the present invention when the nanocrystalline diamond film of the present invention is terminated with a halogen atom such as fluorine or chlorine, the surface of the nanocrystalline diamond film has a low friction coefficient, so that the microcrystalline diamond film has a low friction coefficient.
- a halogen atom such as fluorine or chlorine
- a method for producing a nanocrystalline metal film wherein a film is formed outside a plasma region on a substrate by a plasma CVD method using a raw material gas containing hydrogen and an incinerated water surface.
- the film formation temperature can be kept at a lower temperature, and the particle size can be controlled.
- the degree of clothing is 20 ° C or more and 900 ° C or less.
- the film forming temperature of single crystal and polycrystalline diamond films is 800 ° C. or higher, but the method of the present invention can significantly reduce the film forming temperature.
- the particle size of the crystal particles constituting the nanocrystalline V-star diamond film can be controlled, and various structures and physical properties can be controlled.
- the nano-crystal diamond film is formed by using a micro-mouth-wave plasma, which is a dense plasma source desirably formed by a micro-mouth-wave plasma CVD method. It is possible to more efficiently decompose hydrocarbons as a raw material gas, thereby improving the film quality and the throughput of film formation.
- the nanocrystalline diamond film has a C
- ions By placing the substrate downstream of the reaction gas, ions can be easily incident on the surface of the substrate, and good film quality can be obtained.
- the raw material gas contains at least one member selected from the group consisting of hydrogen sulfide or sulfur oxide, diborane, oxygen, carbon dioxide-phosphine, ammonia or nitrogen, and silane. It is also possible to add additional gas. By controlling the type and additive of the added gas, it is possible to obtain a diamond film having different structures such as crystallinity and physical properties such as conductivity. O Easy to control physical property improvement o
- the nanocrystalline diamond and the film are:
- the substrates used in the method of the present invention include a silicon substrate and a quartz substrate. It can be at least one selected from the group consisting of ceramics, glass substrates, metal substrates, glass substrates, and polymer substrates. 0 According to the method of the present invention, there is no practical use other than diamond and substrates. It is possible to form a nanocrystalline diamond film having the same physical properties as a diamond on a typical substrate. For example, ⁇ 500 ° C to 900 ° C
- a silicon substrate, a substrate, a metal substrate, or a ceramic substrate can be used as a practical substrate used for the plate process.
- a glass substrate is used as a practical substrate for a further 20 ° C to 300 ° C.
- a polymer substrate can be used.
- the surface of the nanocrystal diamond K film is subjected to hydrogen plasma treatment using a mark mouth wave or high frequency.
- hydrogen plasma treatment the surface of the Nanoc V Star Diamond film can be terminated with hydrogen, which is an electron donor, and a very chemically stable surface state can be obtained. Furthermore, it is possible to show high conductivity and negative electron affinity due to the surface m conduction phenomenon, and to obtain a low work function surface ⁇
- the nanocrystalline V star is formed by plasma CVD.
- the surface of the nanocrystalline diamond film can be subjected to plasma treatment with fluorine or chlorine gas using microwave or high-frequency waves. Therefore, the nanocrystalline diamond film surface can be terminated with a ro-nogen atom, which is an electron-withdrawing group, and a very stable surface state can be obtained. In addition, it is possible to obtain a low friction coefficient and a high work function surface.
- a high-quality diamond can be formed on a practical substrate at a wide range of substrate temperatures. Also, since the crystal particles have the same size as nanometers,
- the surface shape is flat, and it is possible to produce a film that has been used for practical use. Furthermore, it becomes possible to control impurities and to control the surface. It is possible to easily and practically impart various types of practically suitable shading to the surface of the nanocrystalline diamond film.
- semiconductor characteristics can be obtained by controlling impurities, and the film can be applied to a wide range of applications as a diamond film having high electron mobility and high hole mobility.
- a charged particle beam mask can be used. Hard mask for lithography, micro-machines, coating materials for tools and magnetic heads, cold-cathode electron sources, electroluminescent elements, and liquid mills
- FIG. 1 is a cross-sectional view illustrating a nanocrystalline diamond film according to one embodiment of the present invention, ⁇ .
- a silicon substrate As the support substrate (substrate) 1, a silicon substrate, a quartz substrate, a ceramic substrate, a metal substrate, a glass substrate, a polymer substrate, or the like can be used.
- a flat substrate is illustrated here, it may be fixed by a 1L-shaped body, for example, a cylindrical body or a sphere o
- the crystal grain size ratio E is 1 to 10
- the nanocrystalline diamond film of the present invention is not intended to completely remove day B particles having a particle diameter of less than 1 nm and exceeding 100 nm. 1 nm not droplets, 100 nm nm, crystallites having a crystal grain size exceeding 3 ⁇ 4r are slightly present, and the effect of the present invention can be sufficiently filled. That is, nanocrystal diamond, It is sufficient that at least 80% of the film has a crystal grain diameter of 1 n or more and less than 100 nm. 3
- the nanocrystalline diamond and film of the present invention contain impurities, in particular, sulfur, boron, oxygen and nitrogen. These impurities, which can be doped with one or more of ⁇ and silicon, can be doped and doped. For example, sulfur, nitrogen, and Boron, which functions as a semiconductor, can improve the conductivity of the film itself by impurity conduction, and can also obtain semiconductor characteristics.
- the concentration of impurities implanted in the nanocrystalline diamond film may be within a range that does not impair the properties of the nanocrystalline diamond film.
- the concentration may be 10 16 to 10 21 cm °.
- the thickness of the nano-star diamond film is not particularly limited, and may be appropriately selected according to the application.
- the surface of the Nano V V star film is terminated with an electron donating group.
- a surface chemisorption structure such as R (R is H or alkyl group)
- R is H or alkyl group
- a surface conductive layer is formed and high conductivity is obtained.
- a method of terminating the surface of the nanocrystalline diamond film with ⁇ there is a method of performing hydrogen plasma treatment on the surface of the nanocrystalline diamond film after film formation by plasma CVD.
- a method of terminating the surface of the nanocrystalline V-star diamond film with an OR group a method of forming a film by plasma CVD, There is a method in which the surface of the nanocrystalline diamond film is treated by the Williamson method.
- the surface of the nanocrystal diamond film can be terminated with an electron-withdrawing group.
- F group C 1 group can be mentioned.
- a surface chemisorption structure By adopting such a surface chemisorption structure, it is possible to obtain a nanocrystalline diamond film having low friction characteristics and a high work function surface.
- a film is formed by plasma CVD, and then the surface of the nanocrystalline diamond film is coated with fluorine. Or a plasma treatment using a chlorine-based gas.
- a fluorine-based gas C F 4 S F 6, and as a salt s yarn gas, ⁇ C 12, C
- nanocrystalline diamond film according to the present embodiment which is configured such that C14 is used in such a manner that ⁇ or more, by controlling the particle size or adding an impurity, 0 fez.
- Diameter control can be achieved by controlling the substrate temperature during film formation. 0
- the film characteristics can be controlled by adding impurities. Controls the type of impurities,
- the nanocrystal diamond and the film according to the present embodiment are as follows.
- the nanocrystalline diamond film according to the present embodiment can be formed by a CVD method using a source gas containing hydrogen ashes and hydrogen.
- hydrogen is considered to play both a role as a diluent gas for hydrogen ash and a role for promoting crystallization.
- the ratio of hydrogen ash to hydrogen depends on the type of hydrocarbon, but it is usually from 199 to 550, particularly preferably from 5 to 950: 80. If the proportion of hydrogen is too small, it becomes a morphomorphic ponder, and if it is too large, it becomes a diamond film with a large number of particles with a particle diameter of more than 100 nm.
- hydrocarbon methane, methamptan, ethylene, acetylene, etc.
- methane is the most preferable.
- the source gas containing hydrocarbons and hydrogen may include at least one selected from the group consisting of hydrogen sulfide or sulfur oxide, dipolane oxygen, oxygen dioxide phosphine, ammonia or nitrogen, and silane.
- the ratio of the added gas it is possible to form a diamond film having different crystalline structures and physical properties such as conductivity. And the control of the improvement of the physical properties becomes easy.
- the nanocrystalline diamond of the present invention has a film thickness of ⁇ 20 ° C. or higher. It is desirable that the film is formed at a substrate temperature in the range of not more than 1000 ° C., preferably in the range of not less than 300 ° C. and not more than 600 ° C. As a result, the L diameter can be controlled by the substrate temperature.
- the nanocrystalline diamond film of the present invention can be formed by a micro-wave plasma CVD method or an EC that is a high-density plasma source.
- the film can be formed using the R plasma method. According to these methods, the raw material hydrocarbons can be more efficiently decomposed, and the film quality and throughput can be improved.
- the nanocrystalline diamond film of the present invention needs to be formed outside the plasma region. Outside the plasma region, the deposition temperature can be kept lower and the use of radicals can be effectively used, so that nano-particles with a particle size of 1 nm or more and less than 100 nm can be used. A V star diamond film can be obtained.
- the nanocrystalline diamond film of the present invention be prepared by placing a substrate downstream of a reaction gas flow in a CVD chamber. By placing it downstream of the reaction gas, it becomes easier to enter the radial force, and good film quality can be obtained.
- the nanocrystalline diamond film is 500. C to 90
- a silicon substrate, a metal plate, a ceramic substrate, or a metal substrate can be used. Also, 300 ° C ⁇ 5
- the glass substrate other than the self-substrate
- a polymer substrate At a substrate temperature of 0 ° C to 300 ° C-, a polymer substrate can be used.
- the charged particle beam It is possible to obtain nanocrystalline diamond films suitable for applications such as hard masks for 7 masks and V-sographs, micro-machines, etc.o
- Nanocrystalline film can be obtained.o
- a metal three-dimensional shape is not limited to the substrate
- a mond film can be obtained.
- the nanocrystal layer and the diamond film according to one embodiment of the present invention include an s1 ⁇ 4 chemical element, an electrochemical electrode DNA chip, an organic electroluminescent element, an organic electroluminescent element, an organic thin film transistor, and a cold electron emitting element.
- the nanocrystalline diamond film according to one embodiment of the present invention has a pair of electrodes or more including a detection electrode and is used for measuring the composition and concentration of a solution. It can be applied to electrochemical elements that use the sapphire reaction to identify the analyte and detect the concentration. 8 That is, by using the nanocrystalline diamond film according to one embodiment of the present invention He on at least one electrode surface, it has at least one pair of poles and oxidizes the electrode surface. An electrochemical element used for detecting and measuring the type and concentration of the substance to be measured by utilizing a reduction reaction is provided.
- the chemical element by using a diamond film as an electrode, the chemical element has unparalleled chemical and physical stability due to strong diamond bonding, and has other properties. It shows very high reliability and reliability as compared to the electrode materials of the above. In addition, it has a wide potential window, a small background, and current, which are the electrochemical characteristics unique to diamond, making it possible to measure a wider range of unmeasured substances. In addition, it exhibits a high S / ⁇ ⁇ ratio and can achieve high sensitivity.
- the electrochemical device according to this application example is ⁇ fcfc
- the diamond is a nanocrystal Vstar diamond film having a particle size of 1 nm or more and less than 1000 nm.
- the surface flatness (root-mean-square roughness) of the nanocrystalline diamond film is 10 nm or less.
- a BU-described diamond film or a nanocrystalline film is formed in a given pattern on the same substrate, and the microscopic or nanoscale film is formed. It is preferable that a plurality of minute poles is formed.
- nanocrystalline diamonds have nanometer order particle size, but individual nanoparticles are diamond-bonded. Since it is 9 crystals, it exhibits the same physical properties as a single crystal or polycrystalline diamond. O In other words, it has various physical properties unique to a diamond while being a nano-sized crystal.
- the oxide film has a very flat surface structure.o These make it possible to apply semiconductor lithography technology, and even to fabricate patterns of nanoscale Enables fabrication of small electrodes and achieves high sensitivity o
- the substrate on which the nanocrystalline diamond film is formed is, in particular, a silicon substrate, a quartz substrate, a sera, a box substrate, a metal substrate, a glass substrate, or the like.
- a small ⁇ selected from the group consisting of polymer substrates can also be a kind. That is, nano-click re Sutarudaiyamo down de film of the present invention is ⁇ Daiyamo down de, on practical substrate other than the substrate, t may be deposited as a film having a diamond emissions equivalent properties; for example, 5 0
- a silicon substrate, a quartz substrate, a metal substrate, or a ceramic substrate can be used as a practical substrate for use in a high-temperature process at 0 ° C or 900 ° C.
- a glass substrate is used as a practical substrate for use in low-temperature processes at 0 ° C or 900 ° C.
- Polymer substrate can be used as a practical substrate for 0 ° C o
- Port A1 is low-cost and is an insulating substrate, so there is no need to insert an insulating layer, which is necessary for conductive substrates. Owing to miniaturization of parts, it becomes easy to perform element isolation o
- impurity elements in the case of a diamond film or a nanocrystalline diamond, and in the case of a film, impurity elements can be K-grouped, and the kind, amount and amount of impurities can be controlled. Enables semiconductor control.
- the diamond film or the nanocrystalline diamond or the film is preferably doped with an impurity.
- at least one selected from the group consisting of sulfur, boron, oxygen, neighbors, nitrogen and silicon is used.o
- Type impurity conduction '1' shows semiconductor properties and high
- the electrochemical device according to this application example can be manufactured by a method including a step of forming at least a small amount of a diamond film or a nanocrystal star film on a body. It is preferable that the substrate is a glass substrate or a polymer substrate, and that the film forming temperature of the diamond, the film, or the nano-star crystal film is 500 ° C. or less. .
- the film in the case of the nano V star diamond film, the film can be formed at a low temperature of 500 ° C. or less, which was impossible with the conventional diamond film. Therefore, it is possible to form a film on a glass substrate or a polymer substrate having a low melting point. 0 In other words, it can be formed on a low-cost and insulating substrate. Therefore, the element structure can be simplified and the process can be reduced. 2
- the electrochemical device according to this application example is applied to the V-sograffy method following the step of forming at least a diamond film or a nanocrystalline film on the body.
- a diamond or a nanocrystal diamond can be manufactured by a method including a step of patterning a film into an arbitrary shape.
- a nanocrystal diamond is used. Since the semiconductor layers have a very flat surface structure, it is easy to apply semiconductor microfabrication technology, that is, the application of lithography technology using light, laser, electron beam, etc. It becomes possible. This makes it possible to realize ultra-fine processing of the element or the terminal portion, and to increase the sensitivity of the element.
- the electrochemical device according to this application example uses a diamond film having extremely high physical and chemical stability on the surface of the device electrode, so that it has excellent durability and improves the reliability of the device. Long life can be achieved.
- the semiconductor lithography technology has a crystal grain size smaller than nano-order and has a very flat surface structure. Can be used, and submicron-order ultra-fine processing becomes possible. As a result, miniaturization of the element and miniaturization of the terminal section can be realized, the surface area of the element sensing section can be increased, and the sensitivity of the element can be increased.
- such a nano V-star diamond film has a 5
- FIG. 2A is a perspective view showing a main part of an electrode terminal of the electrochemical device according to one embodiment of the present invention.
- a silicon substrate As the substrate 11, a silicon substrate, a quartz substrate, a ceramics substrate, a metal substrate, a glass substrate, a polymer substrate, or the like can be used.
- a planar substrate is not illustrated here, a three-dimensional substrate such as a cylindrical body or a sphere may be used.
- the diamond film 12 formed on the support substrate 1 is more preferably a nano-quantum-residum film, and has a crystal grain size of at least 1 nm or more. Includes diamond crystal grains of less than nm. At this time, if the crystal diameter of the nanocrystalline diamond film is less than 1 nm, the diamond has a unique characteristic that the diamond has a large number of grain boundaries or a large amount of amorphous components. I can't get it. In addition, if the particle size force is S100 nm or more, the surface irregularities become large, which is unsuitable for processes such as puttering, etc., and a laminated structure with other materials is manufactured. It is unsuitable for practical use such as difficulty. The preferred range of crystal grain size is 1 to lOOnm.
- the nanocrystal V star diamond film in the present invention is:
- the effect of the present invention can be sufficiently achieved even if there is a small number of crystals having a crystal grain size exceeding 0 nm.In other words, 80% or more of the nanocrystalline diamond film has crystal grains. Diameter 1 nm or more, 100 000 It is sufficient if the crystal is diamond K with m ⁇ .
- the nanocrystalline diamond film of the present invention is doped with impurities, in particular, at least one of fl / k yellow, boron oxygen, nitrogen and silicon.
- impurities for example, sulfur, nitrogen, which functions as a donor, and boron, which functions as an acceptor, can improve the transparency of a film white body by impurity conduction. I can do it.
- the nanocrystalline diamond and the film thickness are not particularly limited and can be appropriately selected according to the application.
- the nanocrystal V star diamond film has various physical properties such as diamond due to its high crystallinity, and has a very flat surface. ⁇ Application of semiconductor lithography technology , And it is possible to easily form ultra-fine structures in the sub-channel
- 3A to 3E are cross-sectional views illustrating respective manufacturing steps of a main part of an electrode m of an electrochemical device according to an embodiment of the present invention.
- a nanocrystalline V-star film is formed on the substrate 21 by a CVD method using a raw material gas containing incinerated water and hydrogen (FIG. 3A).
- the resist film is patterned by photolithography or electron beam lithography to form a resist pattern 24 (see FIG.
- the node mask node Using the turn 23 'as an etching mask, the nano-crystal transistor film 22 is applied by RIE using oxygen gas as a main component, and the electrochemical element detector pattern 2 is applied. Get 2 '( Figure 3D) o
- the nanocrystalline diamond film according to one embodiment of the present invention is used to purify or detoxify a liquid or gas containing impurities, environmental pollutants, and the like by using an electrochemical reaction. It can be applied to an electrochemical electrode that enables the decomposition of substances that are difficult to electrolyze, such as silicon.
- Diamond has been attracting attention as an electrode material.
- Diamond is composed of crystals by covalent bonds of strong four-coordinate SP3 hybrid orbitals between carbon atoms. ⁇ ⁇ Shows unparalleled physical and chemical stability.
- (1) chemical stability that is, chemical resistance and corrosion resistance are indispensable characteristics as a high-performance, r-reliable electrode material.
- further conductivity is required.
- Diamond is a good insulator with a bandgap of 5.5 eV.o
- silicon by doping with impurities, the conductivity by impurity conduction is increased. Properties can be imparted. What is most commonly known at present is a boron-doped diamond, which can be manufactured with a specific resistance of several ⁇ c or less.
- the electrode made of the nanocrystal diamond film according to one embodiment of the present invention has the following features.
- the nanocrystalline diamond film can be formed uniformly regardless of the surface irregularities. Head shape), and it is possible to increase the surface area.
- FIGS. 4A and 4C are cross-sectional views of an electrochemical electrode having a nanocrystal diamond film adhered to the surface. Each of the cross sections has a shape with an increased surface area. That is, FIG. 4A shows a zigzag shape. An electrode having a nanocrystalline diamond film formed on both surfaces of a substrate 31 of FIG. 4 and a film 32 formed thereon. FIG. 4B shows a nanocrystalline diamond film formed on both surfaces of a meandering substrate 41. FIG. 4C shows an electrode in which a nanocrystalline diamond film 52 is formed on both surfaces of a substrate 51 having saw-toothed surfaces.
- a nanocrystalline diamond film is formed on both surfaces of the base in each of the electrochemical electrodes used. However, it may be formed on only one side.
- the nanocrystal diamond film according to one embodiment of the present invention can be applied to a DNA chip.
- the conventional diamond DNA chip uses a diamond film
- the HO protrusion is large, a polishing step is required, which results in a high cost, crystal defects on the surface, and poor carrying characteristics. Further, the substrate is limited to heat-resistant silicon or the like, and it has been difficult to increase the cost and the area.
- the DNA step according to this application example uses a nanocrystalline diamond film that can be formed at a low temperature, so that it can be formed on a glass or a polymer material. Low cost is possible.
- nanocrystalline diamond films There is an advantage that polishing is not required because the surface is flat and the DNA is not detached by hydrolysis, and the DNA retention performance is extremely high.
- FIG. 5 is a cross-sectional view showing a DNA chip according to the application example.
- a nanocrystalline diamond film 62 is formed on a substrate 61, and the surface of the nanocrystalline diamond film 62 is aminated and carboxylated. DNA is immobilized via amino and carboxyl groups.
- the nanocrystalline diamond film according to one embodiment of the present invention can be applied to an organic electroluminescent device.
- a nanocrystalline diamond or film is used as an anode or cathode, or an anode surface layer or a force cathode surface layer of an organic electroluminescent device. 2.8 eV to 6.8 eV by using and terminating the surface with an electron withdrawing group or an electron donating group.
- the nanocrystalline silicon film is formed by a plasma CVD method using a source gas containing hydrocarbons and hydrogen, and then the surface of the nanocrystalline silicon film is formed.
- a plasma CVD method using a source gas containing hydrocarbons and hydrogen
- the work function can be controlled with the same material, and a high work function and a high work function can be obtained. A low work function is obtained. Therefore, nano-crystal lasers and diamond films such as By using an electrode thin film made of an organic electroluminescent device, a highly efficient organic electroluminescent device can be obtained.
- All of the above methods utilize low-temperature plasma, and are suitable for large-area devices such as displays, capable of forming large-area and low-temperature films, and are effective methods for practical use.
- FIG. 6 is a cross-sectional view showing an organic electroluminescent device according to this application example.
- an anode 72, an anode surface layer 73, a hole transport layer 74, an organic light emitting layer 75, an electron transport layer 76, a power source 7 7 are stacked sequentially, the organic electricity
- the anode surface layer 73 is formed by a nanocrystalline diamond film. That is, for example, the surface of the anode 72 made of ITO force contains hydrocarbons and hydrogen.
- a nanocrystalline diamond film was formed by a plasma CVD method using a source gas, and then a gas containing electron-withdrawing atoms was used on the surface of the nanocrystalline diamond film.
- a high ui work function is obtained by performing the plasma treatment.
- the nanocrystalline diamond film according to one embodiment of the present invention can be applied to an organic solar cell.
- a nanocrystalline diamond film is used as an anode or a cathode, or an anode surface layer or a force source surface layer of an organic solar cell, and its surface is used. Is terminated with an electron-withdrawing group or an electron-donating group, thereby reducing the 2.8 eV force to 6.
- a nanocrystalline diamond film is formed by a plasma CVD method using a source gas containing hydrocarbons and hydrogen, and then the surface of the nanocrystalline diamond film is exposed to electron-attracting atoms.
- a plasma treatment using a gas containing gas or a gas containing electron-donating atoms, it is possible to control the work function with the same material and obtain a r ⁇ i work function and a low work function.
- a highly efficient organic solar cell can be obtained by using an electrode thin film composed of such a nano-cluster-like diamond film.
- FIG. 7 is a cross-sectional view showing an organic solar cell according to the application example.
- an anode 82, an anode surface layer 83, a p-type organic semiconductor layer 84, an n-type organic semiconductor layer 85, and a power source 86 are sequentially laminated on an insulating substrate 81.
- the anode surface layer 83 is formed by a nano-crystal diamond film. That is, a nanocrystalline film is formed on the surface of an anode 82 made of, for example, ITO by a plasma CVD method using a source gas containing hydrocarbons and hydrogen, and then the nanocrystalline film is formed.
- a high surface work function is obtained by subjecting the surface of the crystallized diamond film to plasma treatment using a gas containing electron-withdrawing atoms. 6.
- the nanocrystalline diamond film according to one embodiment of the present invention can be applied to an organic thin film transistor.
- a nano-crystal / red diamond film is used as the source or drain or source or drain surface layer of an organic thin film transistor, and the surface of the nano-crystal / diamond is used as an electron. From 2.8 eV by terminating with an attractive or electron donating group
- the nanocrystalline layer film is formed by a plasma CVD method using a source gas containing hydrocarbons and hydrogen, and then the surface of the nanocrystalline layer film is made to have an electron-attracting property.
- the work function can be controlled with the same material, and a high work function and a low work function can be obtained.
- an electrode thin film composed of such a nanocrystalline diamond film an organic thin film transistor having high switching characteristics can be obtained.
- FIG. 8 is a cross-sectional view showing an organic thin-film transistor according to this application example.
- a gate electrode 92 and a gate insulating film 93 are formed on an insulating substrate 91, and are formed on the gate insulating film 93.
- a source electrode 94 and a drain electrode 95 are formed opposite to the source electrode 3, and the surface of the source electrode 94 and the drain electrode 95 is formed on the source electrode surface layer 96 and the drain electrode surface layer.
- a negative organic semiconductor layer 98 is formed on the source electrode surface layer 96, the drain electrode layer surface layer 37, and the gate insulating film 93 to form an organic thin film transistor 97.
- the transistor is configured ⁇
- the source electrode surface layer 96 and the drain electrode surface HI are formed by a nanocrystalline diamond film. That is, for example, the source electrode 94 and the drain electrode 95 made of A1 color have a plasma C using a raw material gas containing hydrocarbons and water.
- a nanocrystalline diamond film is formed by the VD method, and then the surface of the nanocrystalline diamond film is subjected to a plasma treatment using a gas containing an electron-attracting atom. And obtain a high surface work function.
- the nanocrystalline diamond film according to one embodiment of the present invention can be used for cold electron-emitting devices.
- the ED replaces the conventional CRT's thermionic emission device by applying semiconductor microfabrication technology and providing a minute field emission type electron emission device (cold electron emission device) for each pixel. It achieves a thin display while utilizing the same principle of cathode luminescence as the CR II, which has excellent brightness and high speed display.
- Cold electron-emitting devices emit electrons from a solid surface into a vacuum by field emission (field emission). The characteristics of these devices are the structure and work function of the emitting material surface (electron emission). (Affinity).
- the hydrogen-terminated surface of the diamond has a negative electron affinity (NEA), which means that if left in a vacuum, a large amount of electrons are released without applying an electric field. It has unique properties not found in materials.
- NAA negative electron affinity
- a diamond (hydrogen-terminated surface) is useful as an electron-emitting device material, but it has been used as a substrate for a display, especially for large-area, low-area devices. Since high temperature (800 ° C) was required on the cost glass substrate, it could not be applied. In addition, the conventional diamond has large crystal grains, and it has been difficult to uniformly coat the microstructured surface in a thin film form.
- the nanocrystalline diamond film of the present invention can be uniformly formed in a thin film on a microstructured surface at a low temperature, it is necessary to apply a diamond, which is an ideal material, to a cold electron-emitting device. Made it possible.
- a nano-crystal diamond film as the emitter surface layer of the cold electron-emitting device and terminating the surface with an electron-donating group, the negative electron affinity (lower) can be obtained.
- a work function of 2.8 eV) can be realized, and thereby a high-efficiency, low-voltage driven cold electron-emitting device can be realized.
- a nanocrystalline diamond film is formed by a plasma CVD method using a source gas containing hydrocarbons and hydrogen. By subjecting the surface of the nanocrystalline diamond film to plasma treatment using a gas containing electron-donating atoms, the material can be used to control the work function of the surface. , Low work function
- nanocrystalline diamond film As an emitter surface layer, it is possible to obtain a high-efficiency, low-voltage driven cold electron-emitting device.
- FIG. 9 is a cross-sectional view showing a cold electron emitting device according to this application example.
- an insulating layer 10 3 is formed on an insulating substrate 10 1 on which an emitter wiring 10 2 is formed.
- the gate electrode 54 is formed next so as to have an opening, and the emitter wiring exposed in the opening is formed.
- a cone-type emitter 106 is formed on 102, and a nano-crystal diamond film 107 is formed on the emitter 106 to form a cold electron-emitting device. Have been.
- the microwave plasma C V is applied to the surface of the metal emitter 106.
- the nanocrystal diamond and the membrane according to one embodiment of the present invention can be applied to an electrode catalyst for a fuel cell.
- Nanocrystalline diamond is extremely small and By controlling the secondary structure, it is extremely thin while having an extremely thin film, and has a very large surface area, which is the most important electrode for a fuel cell.
- ⁇ It has the advantage that it can be used, and has the advantage that gas and liquid easily penetrate into the inside.
- the electrodes made of activated carbon or carbon black, which have been used so far, have a high surface area as primary particles because they are formed by mixing them with high molecular weight powders and powders to form an electrode structure. Although the material is used, many parts are very wastefully used as a result, and as a result, a large amount of precious metal such as Pt as a catalyst is required.
- activated carbon and carbon black mainly have a graphite structure, so the percentage of the graphite surface (called the Beisel Plane) is large in spite of the apparent surface area.
- Beisel Plane the percentage of the graphite surface
- the nanocrystalline diamond film has its surface c,.
- FIG. 10 is a cross-sectional view showing one cell of the fuel cell according to this application example.
- the electrolyte 1 is placed so that the nanocrystalline diamond and the membranes 11 and 13 face each other between 11
- one sensor of the fuel cell Is configured.
- the nanocrystal diamond film according to one embodiment of the present invention can be applied to catalysts for various reactions.
- the nanocrystalline diamond, the carrier composed of the membrane, and the catalytic metal particles of the order of nm in size supported on the carrier constitute a metal-supported nanocrystalline diamond catalyst.
- the catalyst according to this application example can support a nanometer-order catalytic metal because the crystal diameter of the crystal constituting the nanocrystalline diamond film serving as a carrier is as fine as nanometers. Can achieve an increase in reaction rate
- a nanocrystalline diamond film 122 was formed on a single-crystal silicon substrate 121 with a thickness of 2525 ⁇ m using a microwave plasma CVD apparatus. Filmed.
- the conditions of the microphone mouth-wave plasma C V D are as follows:
- Source gas methane (flow rate 2 scc), hydrogen (flow rate 18 sccm)
- Doping gas hydrogen sulfide (0.01 to 5 volume% with respect to source gas)
- the film thickness was 50
- a nanocrystalline diamond film 122 of 0 nm was formed.
- a hydrogen plasma treatment was performed for 5 minutes on the surface of the film 122, a Nanox V-star standard.
- Nanocrystalline diamond film 1 fabricated as above
- the conditions for Mike mouthwave plasma CVD are as follows.
- Doping gas hydrogen sulfide (. 0 relative to the starting material gas 0 1-5 body product 0/0)
- Substrate temperature 300 ° C
- the film thickness was 50
- a 0 nm nanocrystalline diamond film 132 was formed. At the end of the film formation, a hydrogen plasma treatment was applied to the surface of the nanocrystal film 13 for 5 minutes.
- a nanocrystalline diamond film 142 was formed on a polymer substrate 141 having a thickness of 1 mm using a microwave plasma CVD apparatus.
- the conditions of the microwave plasma CVD are as follows.
- Source gas methane (flow rate 2 S C C m) ⁇ ⁇ hydrogen (flow rate 18 s c c m
- Doping gas Hydrogen sulfide (0.01 to 5 volume 0 relative to source gas)
- Microwave thickness CVD under the above conditions showed a film thickness of 30
- a 0-nm nanocrystalline diamond and a film 142 were formed. At the end of the film formation, hydrogen plasma treatment was applied to the surface of the nanocrystalline diamond film 142 for 5 minutes. As a result, a nanocrystal film 142 similar to that obtained in Example 1 was obtained even when the present example was used.
- Example applied to an electrochemical device will be described with reference to FIGS. 3A to 3E.
- a nano-crystal crystal film 22 was formed on a glass substrate 21 having a thickness of 1 mm by using a magic mouth wave plasma CVD apparatus.
- the conditions of the microwave plasma cVD are as follows.
- a hydrogen plasma treatment was applied to the surface of the nano V-star diamond film 22 for 5 minutes.
- a silicon oxide film was formed using a mixed gas of silane, ammonia and hydrogen using a high-frequency plasma cVD device.
- the conditions for high-frequency plasma CVD are as follows.
- a silicon nitride film having a photodiode mask 23 as a mask using the photo resist pattern 24 as a mask is formed using C 2 F 6 and water surface gas.
- RIE processed it to obtain a mask pattern 2 3 ' ⁇
- the nano mask V 23 is formed by RIE using an oxide gas as a main component using a node mask pattern 23 made of silicon nitride as a mask.
- C membrane 2
- Substrate temperature room temperature
- the node mask pattern 22 ′ was peeled off by etching to obtain an electrochemical device.
- a nanocrystalline diamond film 32 is formed on both sides of a zigzag substrate 31 formed by processing a glass substrate with a thickness of lmmt using a Mic mouth wave plasma CVD apparatus. did.
- the conditions of the microwave plasma CVD are as follows.
- Doping gas Hydrogen sulfide (0.01 to 5% by volume based on source gas)
- a mond film 32 was formed.
- nano crystal die Hydrogen plasma treatment was applied to the surface of the diamond film 32 for 5 minutes to obtain a sensor electrode having a shape as shown in FIG. 4A.
- a nanocrystalline diamond was formed on both sides of a meandering substrate 41 on which a polymer substrate with a thickness of 100 / imt was added using a microwave plasma CVD apparatus.
- the film 42 was formed.
- the conditions of the microwave plasma CVD are as follows.
- Doping gas hydrogen sulfide (0.01 to 5 volume% with respect to source gas)
- a mond film 42 was formed. At the end of the film formation, the surface of the nanocrystalline diamond film 42 was subjected to a hydrogen plasma treatment for 5 minutes to obtain a sensor electrode having a shape as shown in FIG. 4B.
- FIG. 4C An example applied to an electrochemical electrode will be described with reference to FIG. 4C.
- a nano-crystal diamond was formed on both sides of a saw-tooth-shaped substrate 51 formed by processing a silicon substrate with a thickness of 5.25 mt using a micro-wave plasma CVD system.
- the film 52 was formed.
- the conditions of the microwave plasma CVD are as follows.
- Doping gas hydrogen sulfide (. 0 relative to the starting material gas 0 1-5 body product 0/0)
- a mond film 52 was formed. At the end of the film formation, a hydrogen plasma treatment was applied to the surface of the nanocrystalline diamond film 52 for 5 minutes to obtain a sensor electrode having a shape as shown in FIG. 4C.
- a nanocrystalline diamond film 62 was formed on a glass substrate 61 having a thickness of l mm by using a microwave plasma CVD apparatus.
- the conditions of the microwave plasma CVD are as follows.
- Source gas methane (flow rate 2 sccm), hydrogen (flow rate 18 seem)
- Doping gas hydrogen sulfide (0.01 to 5 volume% with respect to the source gas)
- microcrystalline plasma CVD under the above conditions produced a 1 ⁇ m-thick nanocrystalline diamond.
- a mond film 62 was formed. At the end of the film formation, the surface of the nanocrystalline diamond film 62 was subjected to a hydrogen plasma treatment for 5 minutes.Then, the nanocrystalline diamond film 62 was irradiated with UV light in chlorine gas. The hydrogenated surface was chlorinated.
- the nanocrystalline diamond film 62 was irradiated with UV in an ammonia gas to aluminize the surface.
- an ITO film was formed on a 1 mm-thick glass substrate as an insulating substrate 71 by a DC reactive sputter method and a tin was formed by a DC reactive sputter method.
- the film was formed at room temperature by the sputtering method. At this time, the film thickness is 200 ⁇ m did
- a nanocrystal layer film 73 was formed on the anode 72 by using a magic mouth wave plasma CVD apparatus as the anode surface layer 73.
- micro-wave plasma CVD The conditions of the micro-wave plasma CVD are as follows
- Source gas methane (flow rate 2 sccm) ⁇ hydrogen (flow rate 18
- a 50 nanometer thick nanocrystalline film 73 was formed by the micro-wave plasma CVD under the above conditions.
- CF 4 gas was introduced, and high-frequency plasma treatment was performed using an RIE apparatus having parallel plate type electrodes. DOO-out plasma processing conditions This, CF 4 gas 3 5 sccm, the reaction pressure 0. 0 3 T orr, high frequency Bruno. The temperature was 300 W, and the processing time was 3 minutes.
- a nanocrystalline diamond film 83 was formed on the anode 82 as an anode surface layer 83 by using a microwave microwave plasma CVD device.
- the conditions of the microwave plasma CVD are as follows.
- Doping gas Hydrogen sulfide (0.01-5 volume 0 relative to source gas)
- a 50 nm-thick nanocrystalline diamond film 83 was formed by microwave plasma CVD under the above conditions.
- high-frequency plasma treatment was performed using a RIE apparatus having a parallel plate type electrode into which CF 4 gas was introduced.
- the plasma treatment conditions were CF 4 gas 35 sccm, reaction pressure 0.03 T rr, high frequency power 300 W, and treatment time 3 minutes.
- a P-type organic semiconductor layer 84 and an n-type organic semiconductor layer 85 are successively vapor-deposited on the nano V-star diamond film 83, and finally a force source, 87 As a result, an A1 thin film was formed to a thickness of 200 nm by an electron beam deposition method, and an organic solar cell as shown in FIG. 7 was completed.
- a Ta thin film having a thickness of 200 nm was formed as a gate electrode 92 by sputtering on a glass substrate having a thickness of 1 mm as an insulating substrate 91.
- the Ta thin film was patterned by photo-Vography.
- An SO 2 film 93 was formed by the CVD method at a substrate temperature of 300 ° C. and a reaction pressure of 1 T rr r ⁇ r f, with a power of 180 W.
- the film thickness was 1 ⁇ m
- an A1 thin film was formed to a thickness of 200 nm by electron beam evaporation, and then photolithographically applied. I did a training at
- nanocrystalline plasma diamond films 96 and 97 were formed using a microwave plasma CVD apparatus.
- the conditions of the microwave plasma CVD are as follows.
- Source gas methane (flow rate 2 sccm) ⁇ ⁇ hydrogen (flow rate 18 sccm)
- a 50 nm-thick nanocrystalline diamond film 96997 was formed by microwave plasma CVD under the above conditions.Next, CF 4 gas was introduced to convert the parallel plate type poles. Having RI
- High-frequency plasma treatment was performed using the E apparatus. At this time, the plasma treatment conditions were as follows: CF 4 gas 35 sccm, reaction pressure 0.
- fluorine-terminated surface structure was fabricated on the surface of the nanocrystalline diamond films 96 and 97, which are 4 mm thick. This fluorine-terminated structure is compatible with X-ray photoelectron spectroscopy. Further analysis revealed that the C: -F structure was confirmed. The surface potential of the fluorine-terminated surface was measured using a Kelvin probe microscope (KFM) and converted to 6.5 e.
- KFM Kelvin probe microscope
- a p-type organic semiconductor layer 98 is formed into a predetermined shape by a printing method, and an organic thin film as shown in FIG. The transistor is completed.
- an insulating layer 153 and a good electrode 1554 are provided on a glass substrate 151 on which a jitter line 152 has been formed in advance.
- the layers are sequentially formed by a vacuum method or a vacuum evaporation method.
- the insulating layer 1553 and the get electrode were formed using the photolithography method and the reactive ion etching method (RIE).
- V foot-off material 155 is formed only on the gate electrode 154 by oblique evaporation.
- A1 and MgO are used as the material for V foot-off material 155.
- a normal anisotropic vapor deposition is performed on the substrate 151 for the emitter 1556 from the vertical direction. Change the metal material.
- the opening P of the get hole becomes narrower, and at the same time, a cone-shaped conductor and a rectifier 1556 are formed in a self-aligned manner on the radiator wiring 152.
- ⁇ Vapor deposition is performed until the gate hole is finally closed.
- MO ⁇ N1 etc. is used as the material of the emitter.
- the V-photon material 155 is peeled off by etching, and the gate electrode 154 is patterned as needed.
- the conditions of the microwave plasma CVD are as follows.
- Doping gas hydrogen sulfide (0.01 to 5 volume% with respect to the source gas)
- a 30 nm-thick nanocrystalline diamond film 157 was formed by the microwave plasma CVD under the above conditions. After film formation, hydrogen plasma treatment was performed for 5 minutes.
- Power source one cathode electrode 1 1 0 to was example, if fiber system 1 0 mu m, and 1 0 0 mu m Kabonpe 1 Pas one surface present invention by Runano click Li Sutarudiyamon de of the membrane 1 1 2 was deposited. At this time, the average crystal grain size of the nanocrystalline diamond particles is 1 to 2 nm, and the crystal grains are formed of particles having a maximum size of b 5 nm or less.
- Platinum fine particles were supported by an impregnation method on the electrode material having the nanocrystalline diamond deposited on the surface. Specifically, an alkaline aqueous solution adjusted with sodium bicarbonate is slowly added dropwise to an aqueous chloroplatinic acid (H2PtC16) solution to form a nanocrystalline diamond film. On the surface of No. 2, fine particles of platinum hydroxide (Pt (OH) 4) were deposited. This electrode material was reduced at 100 to 700 ° C in a hydrogen stream, and then used as a force source electrode 110.
- H2PtC16 aqueous chloroplatinic acid
- Pt (OH) 4 platinum hydroxide
- an electrode material with a nanocrystalline diamond film 113 formed on the surface of a carbon fiber paper of 1 ⁇ in thickness and 100 O / zm in thickness is used.
- the surface of the nanocrystalline diamond film 113 was 30 wt% Pt Five
- Fine particles consisting of Rh alloy were supported by the impregnation method to form anode electrodes 1 1 1
- a sulfonic acid-containing resin such as Nafion 117 manufactured by DuPont as the electrolyte membrane 114 (for example, a film thickness of 150 to 200 ⁇ m)
- a fuel cell as shown in Fig. 10 was fabricated by integrating the fuel cell shown below in Fig. 10 (for example, when the electrode area is 10 cm 2).
- a mixed solution fuel of water and water was supplied, dry air was supplied to the force electrode 110, and power was generated as a fuel cell.
- the power generation temperature was 60.
- the result is 70 m
- the output was 100 mW / cm2.
- a solution containing a metal salt of a metal serving as a catalyst and a solvent of the metal salt is prepared.o
- the nanocrystal diamond film obtained by the same method as described above is placed in this solution.
- Immersion 0 After immersion for an appropriate time, evaporate the solvent with the nanocrystalline diamond film immersed in the solution. As a result, a catalyst precursor in which the catalyst metal atoms adhere to the nanocrystalline diamond film surface with a high degree of dispersion is obtained.
- the catalyst precursor is calcined in an inert gas such as nitrogen or in the air.
- an inert gas such as nitrogen or in the air.
- 400 to 80 A condition of 3 to 5 hours at 0 ° C is preferred. If the calcination temperature is lower than 400 ° C, the remaining impurities such as nitric acid cannot be sufficiently removed, and the catalytic activity does not appear or decreases.
- the destruction temperature is 80
- a pitting process is performed in order to impart catalytic activity.
- the pitting process is performed in a reducing gas, for example, in a flow of a reducing gas such as hydrogen.
- the reduction temperature is suitably from 300 to 500 ° C., and if the temperature is lower than 300 ° C., the metal cannot sufficiently fall off.
- the nanocrystal diamond and a part of the film react with the catalyst metal, forming a graphite composed of the catalyst metal and ash, and the catalyst activity may be lost. ⁇ Not desirable.
- any of nickel, cobalt, iron, non-reducible dime, no, radium, iridium, and platinum or a combination thereof can be used.
- nanocrystalline diamond film having a crystal grain size of about 8 nm is used as a carrier, and nickel is used as a catalytic metal.
- a star diamond catalyst was prepared.
- a predetermined amount of a nanocrystal diamond film was added to a saturated aqueous solution of nickel nitrate, left overnight, and then dried by evaporating water. After drying, the catalyst precursor was reduced to 400 to 500. c in nitrogen gas By firing, the nitric acid and the remaining nickel nitrate were removed to obtain a metal-carrying nanocrystalline diamond catalyst.
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Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2004/007642 WO2005116306A1 (ja) | 2004-05-27 | 2004-05-27 | ナノクリスタルダイヤモンド膜、その製造方法、及びナノクリスタルダイヤモンド膜を用いた装置 |
EP11169512.8A EP2365111B1 (en) | 2004-05-27 | 2004-05-27 | Method of manufacturing of a fuel cell and a catalyst comprising a nano-crystal diamond film |
EP11193484.0A EP2431504B1 (en) | 2004-05-27 | 2004-05-27 | Method for manufacturing an organic thin fim transistor using a nano-crystalline diamond film |
EP11193482A EP2431503A1 (en) | 2004-05-27 | 2004-05-27 | Method of manufacturing an organic electroluminescent device or an organic photoelectric receiving device using a nano-crystalline diamond film |
JP2006513796A JP4719909B2 (ja) | 2004-05-27 | 2004-05-27 | ナノクリスタルダイヤモンド膜の製造方法 |
EP04735108A EP1752566A4 (en) | 2004-05-27 | 2004-05-27 | NANOCRYSTALLINE DIAMOND-CONTAINING FILM, MANUFACTURING METHOD AND DEVICE THEREFOR |
CN2004800431613A CN1957116B (zh) | 2004-05-27 | 2004-05-27 | 纳米晶体金刚石薄膜、其制造方法及使用纳米晶体金刚石薄膜的装置 |
KR1020067024843A KR101268272B1 (ko) | 2004-05-27 | 2004-05-27 | 나노 크리스탈 다이아몬드막, 그 제조 방법, 및 나노크리스탈 다이아몬드막을 이용한 장치 |
US11/598,680 US8420043B2 (en) | 2004-05-27 | 2006-11-14 | Nano-crystal diamond film, manufacturing method thereof, and device using nano-crystal diamond film |
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Country Status (6)
Country | Link |
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US (1) | US8420043B2 (ja) |
EP (4) | EP1752566A4 (ja) |
JP (1) | JP4719909B2 (ja) |
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CN1957116A (zh) | 2007-05-02 |
JPWO2005116306A1 (ja) | 2008-04-03 |
CN1957116B (zh) | 2010-04-28 |
EP1752566A1 (en) | 2007-02-14 |
EP2431504A1 (en) | 2012-03-21 |
US20100084634A1 (en) | 2010-04-08 |
JP4719909B2 (ja) | 2011-07-06 |
EP1752566A4 (en) | 2009-09-23 |
EP2365111A3 (en) | 2011-11-23 |
EP2431503A1 (en) | 2012-03-21 |
US8420043B2 (en) | 2013-04-16 |
KR20070020465A (ko) | 2007-02-21 |
EP2365111A2 (en) | 2011-09-14 |
EP2431504B1 (en) | 2014-01-01 |
KR101268272B1 (ko) | 2013-05-31 |
EP2365111B1 (en) | 2013-11-27 |
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