WO2005064413A1 - 凸版印刷用水現像感光性樹脂版 - Google Patents
凸版印刷用水現像感光性樹脂版 Download PDFInfo
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- WO2005064413A1 WO2005064413A1 PCT/JP2004/019115 JP2004019115W WO2005064413A1 WO 2005064413 A1 WO2005064413 A1 WO 2005064413A1 JP 2004019115 W JP2004019115 W JP 2004019115W WO 2005064413 A1 WO2005064413 A1 WO 2005064413A1
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- photosensitive resin
- resin plate
- modified silicone
- compound
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Definitions
- the present invention relates to a water-developable photosensitive resin plate for letterpress printing and a method for producing the same.
- a general photosensitive resin plate for letterpress printing is manufactured through exposure, development and post-exposure steps as described in, for example, Patent Documents 13 to 13.
- ink is supplied to the surface of the convex portion of the resin plate having irregularities by an ink supply roll or the like, and then the resin plate is printed on a printing medium.
- the ink on the surface of the convex portion is transferred to the printing medium by contact with the printing medium.
- plate surface contamination In such flexographic printing, ink often adheres to the shoulders of the convex portions of the resin plate or ink enters the concave portions during printing for a long time (hereinafter, plate surface contamination). .
- plate surface contamination a portion other than the original pattern may be printed. In such a case, it is necessary to stop printing and wipe the surface of the resin plate with a cloth or the like using a cleaning solution such as alcohol, which is economically disadvantageous.
- a method in which a polar group-based polymer is introduced into the polymer that is the main component in composition, or a method in which a polymer containing a polar group and a hydrophobic polymer are mixed and dispersed and used are used.
- the latter method is preferably used because the durability of the plate is good and a high-definition plate surface can be formed.
- a water-developable photosensitive resin plate for letterpress printing is more likely to be compared with a solvent-developable photosensitive resin plate mainly composed of a hydrophobic polymer such as a thermoplastic elastomer.
- the polarity of the plate surface is increased.
- the affinity for ink is excessively increased. I will.
- the above-mentioned ink adheres to the shoulder portion of the convex portion of the resin plate, and if the ink enters the convex portion, the ivy phenomenon is more likely to occur!
- Patent Document 8 describes a technique for applying an organofluorine compound to a plate surface by brushing or spraying.
- the effect is only obtained in the case of halftone dot printing with a low screen ruling, and the sustaining effect is also insufficient.
- Patent Document 9 describes a method in which a material selected from a silane coupling agent, a silicone oil, and a silicone grease is internally added to a photosensitive resin and then transferred onto the photosensitive resin surface.
- the purpose of the present method is a method for preventing the occurrence of tears in plate making operations and the like, and is basically a method for bleeding the silicone conjugate. Therefore, it is removed from the surface during printing, and the durability of the hydrophobicity effect of the surface by silicone cannot be expected at all.
- Patent Document 10 discloses an aqueous emulsion of a silicone compound or a fluorine compound and water. There has been proposed a method of applying a mixture of properties resins. However, since a water-based solution having low permeability is applied, the effect of preventing plate surface contamination is not always sufficient. In particular, in long-run or repeat printing, these effects need to be repeatedly applied in order to maintain a reproducible effect.
- Patent Document 11 proposes a method for increasing the contact angle of the plate surface by internally adding a hydrophobic compound containing fluorine, chlorine, and silicon that can be copolymerized with a polymerizable material in a water-developable composition. I have. This method is excellent in that the hydrophobicity of the plate surface is fixed to the resin by copolymerizing with the photosensitive resin component.
- applicable resins are homogeneous liquid or paste resin such as polyurethane resin, polyvinyl alcohol resin, polyester resin or nylon resin.
- Patent document 1 JP-A-10-171111
- Patent Document 2 JP-A-63-088555
- Patent Document 3 JP 05-134410 A
- Patent Document 4 Patent No. 3508788
- Patent Document 5 Japanese Patent Publication No. 58-33884
- Patent Document 6 Patent No. 2940006
- Patent Document 7 Patent No. 2985655
- Patent Document 8 JP-A-51-40206
- Patent Document 9 JP-A-60-191238
- Patent Document 10 Japanese Patent Application Laid-Open No. 2002-292985
- Patent Document 11 JP-A-6-186740
- An object of the present invention is to provide a water-developable photosensitive resin plate for letterpress printing, which enables printing with a good balance between high definition without deteriorating the image formability and high density of solid portions, and ink stains on the plate surface.
- An object of the present invention is to provide a method for producing a photosensitive resin plate, which can prevent the printing operation for a long period of time and can prevent complicated operations such as wiping of a plate during printing operation.
- the present inventors have diligently studied to solve the above problems. As a result, they have found that the problem can be solved by bringing the plate surface of the resin plate into contact with a liquid containing a silicone-based compound and a Z or fluorine-based compound after the exposure step, and completed the present invention.
- the configuration of the present invention is as follows.
- a method for producing a water-developable photosensitive resin plate for letterpress printing including an exposure step, a development step, and a post-exposure step, comprising a liquid containing a modified silicone resin conjugate and a Z or fluorine compound after the exposure step.
- the above method comprising contacting a photosensitive resin plate.
- the photosensitive resin contains a binder polymer containing a polar group-containing polymer and a hydrophobic polymer; an ethylenically unsaturated compound; and a photopolymerization initiator.
- modified silicone compound and Z or the fluorine compound are a hydroxyl group, a carbinol group, an epoxy group, a (meth) acrylate group, a carboxyl group, a carboxylate group
- (1) to (3) which comprises irradiating the liquid containing the modified silicone compound and the liquid containing Z or a fluorine compound with the photosensitive resin plate and then irradiating the liquid with actinic rays. The method described in.
- a developer for producing a water-developable photosensitive resin plate for letterpress printing comprising a modified silicone resin conjugate and a Z or fluorine compound.
- the modified silicone conjugate is selected from the group consisting of a hydroxyl group, a carbinol group, an epoxy group, a (meth) acrylate group, a carboxyl group, a carboxylate group, an amino group, and a (poly) ether group.
- a water-developable photosensitive resin plate for letterpress printing prepared by the method according to any one of (1) to (9).
- a water-developable photosensitive resin plate for letterpress printing in which silicon is present at a relative element concentration of at least 0. lat% on the surface.
- the water-developable photosensitive resin plate for letterpress printing according to (13) or (14), which has a surface wetting before and after treatment with a solvent of ethyl acetate Z isopropyl alcohol 20Z80 (weight ratio).
- high definition without deteriorating image formability and high density of solid portions can be printed in a well-balanced manner, and ink stains on the plate surface can be prevented for a long time, and printing operations such as plate wiping can be performed. It is possible to provide a water-developable photosensitive resin plate for letterpress printing, which can prevent complicated operations as much as possible.
- the water-developable photosensitive resin plate for letterpress printing of the present invention is produced through exposure, development and post-exposure steps.
- the resin before exposure may be fluid or solid at room temperature.
- the thickness of the plate is usually in the range of 0.5 to 10 mm.
- Known resins can be used as the water-developable photosensitive resin plate.
- the resins proposed in Patent Literature 4, Patent Literature 5, Patent Literature 6, Patent Literature 7, and the like are examples.
- the basic structure is composed of an oligomer or polymer component, a polymerizable monomer component, a photoinitiator and a stabilizer.
- Polymer-containing polymers and hydrophobic polymers can be selected from polyurethane, polybutyl alcohol, polyester resin or nylon resin.
- a mixed-dispersed resin system binder polymer
- those using a resin-based system in which a polar group-containing polymer and a hydrophobic polymer are mixed and dispersed It is excellent in high-definition plate surface formability and is a useful resin with high versatility in printing. Examples of such a resin system include the following.
- the polar group-containing polymer examples include a water-soluble or water-dispersible copolymer having a hydrophilic group such as a carboxyl group, an amino group, a hydroxyl group, a phosphate group, a sulfonate group, or a salt thereof. More specifically, carboxyl group-containing NBR and carboxyl group-containing SBR described in Japanese Patent No. 2128098; JP-A-5-7705, JP-A-61-128243, JP-A-6-128 No. 194837, JP-A-7-134411, etc., a polymer of an aliphatic conjugated gen containing a carboxyl group;
- These hydrophilic polymers may be used alone or in combination of two or more.
- the hydrophobic polymer used in combination with the polymer may be a polymer obtained by polymerizing a conjugated hydrocarbon or a copolymer obtained by polymerizing a conjugated hydrocarbon and a monoolefinic unsaturated compound.
- a polymer obtained by polymerizing a conjugated hydrocarbon or a copolymer obtained by polymerizing a conjugated hydrocarbon and a monoolefinic unsaturated compound such as butadiene polymer, isoprene polymer, chloroprene polymer, styrene-butadiene copolymer, styrene-butadiene-styrene copolymer, styrene-isoprene copolymer, styrene-isoprene-styrene copolymer, and styrene-chloroprene copolymer.
- Copolymer acrylonitrile butadiene copolymer, acrylonitrile isoprene copolymer, methyl methacrylate butadiene copolymer, methyl methacrylate-isoprene copolymer, acrylonitrile butadiene styrene copolymer, acrylonitrile isoprene styrene copolymer, and the like.
- These hydrophobic polymers may be used alone or in combination of two or more.
- polymerizable monomer used in combination with these oligomers or polymer components.
- polymerizable monomer used in combination with these oligomers or polymer components.
- esterified compound of an ethylenically unsaturated acid and an alcohol and a compound described in a document “Photocuring Technology Data Book (published by Technonet)” can be used.
- photopolymerization initiators used as other components include those described in documents such as "Photocuring Technology Data Book (published by Technonet)” and "UV Curing System (published by General Technology Center)”. .
- additives such as a polymerization inhibitor, a plasticizer, a dye, an ultraviolet absorber, and an ozone-resistant agent can be added.
- a polymerization inhibitor Liquid 1, 2 (or 1, 4) polybutadi Benzene, 1,2 (or 1,4) -polyisoprene, or terminal-modified products thereof, and hydrocarbon oils such as naphthenic oil and paraffin oil.
- the polymerization inhibitor include phenols such as hydroquinone, P-methoxyphenol, 2,4-di-tert-butylcresol, catechol, and t-butylcatechol.
- a solid photosensitive resin In the case of a solid photosensitive resin, it is usually formed into a plate shape using a polyethylene terephthalate support (a material having an antihalation effect as required) and a film having an anti-adhesion layer. I do.
- a digital plate In the case of a digital plate called flexo CTP, it is formed into a plate shape using the above support and a film having a layer having a laser ablation function.
- the resin is put between a support and a film on a commercially available plate making machine for liquid photosensitive resin, and is exposed.
- a water-developable photosensitive resin plate is manufactured through an exposure step (actinic ray exposure step), a development step (a step of cleaning and removing unexposed portions), and a post-exposure step.
- an exposure step actinic ray exposure step
- a development step a step of cleaning and removing unexposed portions
- a post-exposure step it is necessary to bring the liquid containing the silicone compound and the Z or fluorine compound into contact with the light-sensitive resin plate after the exposure step.
- silicone conjugate refers to an oligomer or polymer having an alkyl siloxane having an alkyl group represented by a methyl group as a main skeleton, and is a substance generally referred to as silicone oil or the like.
- fluorine compound refers to a compound obtained by substituting part or all of the hydrogen groups of a hydrocarbon compound with fluorine.
- the silicone conjugate and the Z or fluorine compound used in the present invention have a functional group that interacts with the resin component and has a Z or a reactive functional group.
- Preferred are those having a functional group such as a hydrocarbon group substituted with an aromatic hydrocarbon, an aromatic hydrocarbon group substituted with a hydroxyl group containing a hydroxyphenyl group, an alkoxyl group, a (poly) ether group, or a urethane group.
- modified silicone conjugates and Z or fluorine compounds having one or more types of modifying groups are referred to as modified silicone conjugates and Z or fluorine compounds.
- one or more of the modifying groups described above is combined with a Si atom and a Z or F atom. It may be directly bonded, or may be substituted by one or more hydrogen atoms of a hydrocarbon group bonded to a Si atom or an F atom.
- Photosensitive silicone compounds having no modifying group for example, silicone oil having dimethylsiloxane as a main chain, and Z or fluorine compound, for example, fluorine oil such as perfluorocarbon, hide-opening fluoroether, and hide-opening fluorocarbon are used.
- fluorine oil such as perfluorocarbon, hide-opening fluoroether, and hide-opening fluorocarbon
- the modified silicone compound and the Z or fluorine compound may be brought into contact with the plate surface by any method.
- a processing solution dissolved in an organic solvent or alcohol, preferably alcohol having 6 carbon atoms, more preferably ethanol, methanol, isopropyl alcohol or the like is prepared in advance.
- the plate can be immersed in the processing liquid, or the processing liquid can be applied to the plate surface using an atomizer, a brush, or the like.
- concentration of the silicone-based compound and the Z or fluorine-based compound in such a treatment solution is usually used in the range of 0.001% to 50% by weight, preferably 0.01% to 20% by weight.
- the modified silicone resin conjugate and the Z or fluorine compound are dissolved or dispersed in a developer used in the photosensitive resin development step, and the photosensitive resin plate after the exposure step is developed. It can also be brought into contact with a surface. This method is preferred and an embodiment because it can be carried out without increasing the step of newly contacting the modified silicone compound and the Z or fluorine compound with the plate surface.
- a known method may be used as a developing method. Specifically, the plate is immersed in the cleaning liquid, and the unexposed portion is dissolved or wiped off using a brush. A developing method in which an unexposed portion is dissolved or wiped off with a brush while sprinkling a cleaning liquid, and the like.
- the developer for the water-developable photosensitive resin plate a known developer can be used. Usually, it contains a surfactant as an active ingredient. Examples of the surfactant include an anionic surfactant, an amphoteric surfactant, and a nonionic surfactant. These may be used alone or in combination of two or more.
- ar-one-based surfactants examples include sulfates, higher alcohol sulfates, higher alkyl ether sulfates, sulfated olefins, alkylbenzene sulfonates, ⁇ -olefin sulfonates, Phosphate salts and dithiophosphate salts are exemplified.
- amphoteric surfactant examples include an amino acid-type amphoteric surfactant, a betain-type amphoteric surfactant, and the like.
- non-ionic surfactants include higher alcohol ethylene oxide-containing kneads, alkylphenol ethylene oxide-containing carohydrates, fatty acid ethylene oxide adducts, polyhydric alcohol fatty acid ester ethylene oxide adducts, and higher alkylamines.
- Polyethylene glycol-type surfactants such as ethylene oxide adducts, fatty acid amide ethylene oxide adducts, and polypropylene glycol ethylene oxide adducts ⁇ glycerol fatty acid esters, pentaerythritol fatty acid esters, sorbitol and sorbitan fatty acid esters, polyhydric alcohols And polyhydric alcohol surfactants such as fatty acid amides of alkanolamines.
- a water-miscible organic solvent such as alkyldaricol ether is used as a penetrant to improve the cleaning properties of the plate, the cleaning properties of the plate, and the permeability of the silicone compound into the plate.
- the penetrant can be selected according to the composition of the resin to be washed. For example, mono- or polyethylene glycol ether type nonionic penetrants such as dibutyl diglycol ether and the like can be mentioned.
- Alkali builder which may be used as an alkali builder as another component, may be an organic builder or an inorganic material, and it is desirable that the builder can adjust ⁇ to 9 or more.
- Examples include sodium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, sodium succinate and the like.
- the amount of the surfactant is 1 part by weight to 50 parts by weight, more preferably 3 parts by weight to 20 parts by weight, based on the weight of the developing solution.
- the penetrant is usually used in a range of 0.2 part by weight or more and 20 parts by weight or less based on the weight of the developer. More preferably, the amount is 0.2 parts by weight or more and 10 parts by weight or less.
- the alkali builder is usually used in the range of 0.1 to 10 parts by weight based on the weight of the developer. If the amount of these components is less than the above range, there are disadvantages such as the time required for development being too long, and if the amount is larger than the above range, it is not preferable from the viewpoint of cost.
- the modified silicone resin conjugate and Z are dissolved or dispersed in a developer used in the photosensitive resin developing step and developed while the photosensitive resin plate having undergone the exposure step is developed.
- a fluorine compound can be brought into contact with the plate surface.
- the viewpoint of the stability of dissolution or dispersion in a developing solution also includes a hydroxyl group, a carbinol group, an epoxy group, a (meth) acrylate group, a carboxyl group, a carboxylate group, an amino group.
- (Poly) ether group strength Modified silicone compounds having one or more selected two or more modifying groups, and z or fluorine compounds are particularly preferred. In these modified silicone compounds and Z or fluorine compounds, one or more of the above modifying groups are present.
- the concentration of the modified silicone compound and the Z or fluorine compound in the developer is preferably from 0.01 to 20 parts by weight, more preferably from 0.1 to 5 parts by weight. At a concentration lower than this range, it is difficult to obtain a sufficient hydrophobizing effect. On the other hand, if the concentration is higher than this range, only the cost for processing increases, and in some cases, there is an adverse effect such as lowering the developing speed of the developer, which is not preferable.
- the ratio between the drugs may be arbitrary, but the total amount is desirably within the above range.
- the surface of the photosensitive resin has a silicone molecule or fluorine which expresses hydrophobicity at a high concentration due to the effect of the modifying group of the modified silicone compound and the Z or fluorine compound.
- Molecules can be present. ⁇ ⁇ Since it is fixed on the surface by interaction and reaction with the components in the resin, it effectively and continuously solves various printing problems. It is estimated that they can be evaded. Therefore, the type and amount of the modifying group of the modified silicone compound and the Z or fluorine compound should be appropriately selected depending on the type of the photosensitive resin used.
- a phenomenon in which the hydrophobic effect is gradually reduced is observed.
- the present inventors have found that the durability of the hydrophobizing effect is improved by irradiating with an actinic ray after being brought into contact with the modified silicone conjugate and Z or a fluorine compound.
- the actinic ray as used herein has at least light having a wavelength of 300 nm or less. If necessary, actinic light having a wavelength of 300 nm or more may be used in combination.
- the modified silicone and the Z or fluorine compound may be brought into contact with the photosensitive resin plate to perform the post-exposure and the irradiation of the actinic ray at the same time.
- a method in which post-exposure and irradiation with actinic rays are performed at once in a state where modified silicone and Z or a fluorine compound are dispersed in water may be used.
- the irradiation with actinic rays may be performed in an appropriate step separately from the post-exposure step.
- the type of actinic ray source and the amount of light irradiation should be selected under conditions that produce an appropriate effect.
- the present inventors have prepared a photosensitive resin prepared by contacting a liquid containing a modified silicone resin conjugate and a Z or fluorine compound with a photosensitive resin plate according to the method of the present invention.
- the effect of the stencil was examined in more detail.
- the photosensitive resin plate according to the present invention be exhibited in actual printing.
- the plate is a plate that is immersed in a solvent in which ethyl acetate and isopropyl alcohol used in the solvent ink are mixed at a weight ratio of 20:80 at 20 ° C for 4 hours, and further dried at 60 ° C for 4 hours or more.
- This is a method of comparing the surface wettability of the surface with the surface wettability of the photosensitive resin plate before the present treatment.
- the method for measuring the surface wettability here is that a standard solution for 30 dyne Zcm wetting tension test used in the test method of JIS K6768 is placed on a solid plate surface in an atmosphere of 20 ° C and a humidity of 70% at an atmosphere of 70% humidity.
- the present inventors have studied variously a method of scientifically analyzing the surface of the processed photosensitive resin plate.
- the measured value of the relative element concentration of silicon present on the surface of the photosensitive resin plate by XPS was particularly high when the modified silicone resin conjugate was used.
- a photosensitive resin plate having a content of 0.5 lat% or more, more preferably 0.5 at% or more can achieve the practical durability of the effect in actual printing.
- “at%” indicates the ratio of the number of atoms on the surface of the photosensitive resin plate (relative element concentration).
- a water-developable photosensitive resin plate in which the silicon concentration of the surface of the photosensitive resin plate that has been brought into contact with the modified silicone resin conjugate after the treatment with the alcohol mixed solvent is not less than 0.1 lat% is also an aspect of the present invention.
- the modification used in contact with the photosensitive resin plate after the exposure step of the photosensitive resin plate by the method of the present invention does not work.
- the photosensitive resin plate becomes turbid and causes light scattering at the time of exposure, and adverse effects such as poor image formation such as defective formation of fine lines and defective shape of dots are caused. Don't get up!
- the surface may be rough, and the effect of improving the slipperiness of the photosensitive resin plate by printing paper and suppressing the fraying phenomenon may be expected, and may be added as necessary. it can.
- the method of contacting the modified silicone resin conjugate to the photosensitive resin plate and the step of exposing the Z or fluorine compound after the exposure step is also one of the embodiments of the present invention.
- 125 parts by weight of water and an emulsifier (a-sulfo (1- (noylphenoxy) methyl-2- (2-prob-ethoxy) ethoxypoly (oxy-1,1)) are placed in a pressure-resistant reaction vessel equipped with a stirrer and a temperature control jacket.
- ammonium salt (trade name: Adecaria Soap, manufactured by Asahi Denka Kogyo Co., Ltd.) of 2-ethanediyl)
- the internal temperature was raised to the polymerization temperature of 80 ° C, 2 parts by weight of acrylic acid and methacrylic acid 5 parts by weight of acid, 60 parts by weight of butadiene, 10 parts by weight of styrene, 23 parts by weight of butyl acrylate, 28 parts by weight of water, 1.2 parts by weight of sodium peroxodisulfate, emulsifier (product Name Adecaria Soap (Asahi Denka Kogyo) 1 part by weight of an aqueous solution was added at a constant flow rate for 5 hours and 6 hours, respectively, and then maintained for 1 hour to complete polymerization, followed by cooling.
- Ink fill is used AI- 3 type flexographic printing machine (Iyo Kikai), ⁇ in 600LPI (capacity 3. 8c mVm 2) - was performed using Rocks roll.
- the ink used was a water-based ink “HW571AQP Process Cyan (trade name: TOYO INK)” adjusted to a viscosity of 15 seconds (Zhan viscometer # 4).
- Coated paper (trade name: Pearl Coat Oji Paper, basis weight: 106 gZm 2 ) was used as the printing medium. The printing speed was set at 100 mZmin.
- the aerial pressure was increased by 0.02 mm from an appropriate value.
- the printing pressure was increased by 0.15 mm from the appropriate value to increase the deformation of the relief surface and accelerate ink entanglement.
- the halftone dots to be evaluated are 100, 133, 150, and 175 LPI lines arranged in the image, and the number of lines is designed with the area ratio of 1, 2, 3, and 5%, respectively, and there are 16 evaluation images in total. I do.
- the evaluation was made based on the number of halftone dots with ink entangled in more than 30% of the image area among these 16 halftone dots. In the case of a suitable plate material in which ink is hardly entangled, entanglement is small and the highest rating is 0. On the other hand, in the case of a plate material that is easily entangled with ink, the number of halftone dots involving the ink is inevitably increased, and the ink is entangled at up to 16 halftone dots.
- the surface wettability of the photosensitive resin plate was evaluated by the following method. At room temperature of 20 ° C and humidity of 70%, 30dyneZcm wet tension test mixture No. 30.0 (manufactured by Wako Pure Chemical Industries, Ltd.) was also dropped by 0.5 ml with a height of 20 mm on the solid plate surface. After 30 seconds, the diameter (unit; mm) of the droplet was measured and evaluated. The average diameter in the X and Y directions of the droplet diameter was measured three times for each sample, and the average value was used as the result. The droplet diameter of the photosensitive resin plate in which the ink is easily entangled, that is, the photosensitive resin plate having good wettability, is greatly increased.
- the persistence of the treatment effect referred to here relates to the durability to the solvent and the UV ink as described below, and the evaluation of the surface wettability of each photosensitive resin plate is performed by the above method.
- Evaluation example 1 Treatment effect solvent resistance test (immersion test 1)
- Evaluation example 2 Treatment effect UV ink test (immersion test 2)
- the prepared photosensitive resin plate was immersed in UV ink for flexo "UFL639 Ai” (manufactured by Inktec) at 20 ° C for 4 hours, and then washed with isopropyl alcohol. After drying this photosensitive resin plate at 60 ° C. for 4 hours, the surface wettability of the photosensitive resin plate was evaluated.
- the relative element concentration of silicon present on the surface of the photosensitive resin plate was measured by XPS.
- the measurement conditions are as described below.
- Narrow Scan Cls, 01s, Si2p, S2p, Nals (Quantitative analysis, chemical state analysis
- the relative element concentration was calculated using the area intensity of Cls, 01s, Si2p, S2p, and Nals, and the relative sensitivity coefficient, and the unit was expressed as at%.
- the relative sensitivity coefficients used were as follows. Cls: l. 00 01s: 2.72 Si2p: 0.93 S2p: l. 67 Nals: 8.52
- Solvent-based FB King (blue, manufactured by Toyo Ink) was used as the ink, and low-density polyethylene was used for the printing substrate. 50,000 copies were printed at a speed of 200 mZ using 8001 pi (cell volume 3.8 cm 3 / m 2 ) for the ax roll and 3M1020 (3M) for the cushion tape.
- the photosensitive resin plate to be evaluated has solid areas, independent points independent lines, white lines and 100, 133, 150, and 1751 pi lines in the image, and the area ratio of 1, 2, 3, and 5% lines, respectively. The one designed in was used. "C” indicates that ink is entangled in the dot area before printing and printing must be stopped.
- this composition was applied to a polyethylene terephthalate film support having a urethane-based adhesive layer and a film having an anti-adhesion layer made of polybutyl alcohol and cellulose. 1. Molded to a thickness of 14 mm. In this photosensitive resin plate, almost no turbidity was observed, and transparency was maintained. This photosensitive resin plate was first exposed to the entire surface of the support side using a JET A2-HSS exposure machine (manufactured by JEOL Ltd.) at 600 mJ, and then the film on the opposite side was peeled off. Image exposure of 5000mi.
- Leocol SC-80 (manufactured by Lion), which is a 5 mol adduct of ethylene oxide of a secondary alcohol having 12 to 14 carbon atoms, as a surfactant, 1 part by weight of dibutyldiethylene glycol as a penetrant, and 0 parts by weight of sodium carbonate Unexposed areas were washed out with a flat type washer (manufactured by Robo Electronics) using an aqueous developer solution containing 0.4 parts by weight. 15 at 60 ° C After drying for a minute, post-exposure was performed using a chemical lamp and a germicidal lamp.
- Example 1 The same procedure as in Example 1 was repeated, except that the methylstyryl-modified silicone compound KF-410 (manufactured by Shin-Etsu Iridaku) was used in place of the methacryl-modified silicone compound X-22-174DX. A photosensitive resin plate was obtained. Table 1 shows the evaluation results.
- Example 1 The photosensitive resin described in Example 1 was subjected to molding, exposure and washing steps under the same conditions to obtain a photosensitive resin plate. After drying this photosensitive resin plate at 60 ° C for 15 minutes, it is post-exposed at the same exposure using a chemical lamp and a germicidal lamp! (4) A predetermined photosensitive resin plate was obtained. Table 1 shows the evaluation results.
- the photosensitive resin described in Example 1 was subjected to molding, exposure and washing steps under the same conditions to obtain a photosensitive resin plate.
- the photosensitive resin plate was dried at 60 ° C for 15 minutes, immersed in a 1% by weight ethanol solution of a methacryl-modified silicone compound X—22—164A (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) for 1 minute, and then dried for 5 minutes. Dried for minutes.
- This photosensitive resin plate was subjected to post-exposure using a chemical lamp and a germicidal lamp to obtain an intended photosensitive resin plate. Table 1 shows the evaluation results.
- An objective photosensitive resin plate was obtained in the same manner as in Example 4 except that a phenol-modified silicone compound X-221621 (manufactured by Shin-Etsu Chemical) was used instead of X-22-164A. Table 1 shows the evaluation results. [Example 6]
- the desired photosensitive resin plate was obtained in the same manner as in Example 4 except that an epoxy-modified silicone compound X22-163A (manufactured by Shin-Etsu Chemical) was used instead of X-22-164A. Table 1 shows the evaluation results.
- the photosensitive resin described in Example 1 was subjected to molding, exposure and washing steps under the same conditions to obtain a photosensitive resin plate.
- This photosensitive resin plate was dried at 60 ° C. for 15 minutes.
- Asahigard AG5850 manufactured by Asahi Glass Co., Ltd., a mineral spirit dilution of polyfluorinated styrene and an acrylic copolymer having a perfluoroalkyl group
- Post-exposure was performed using a chemical lamp and a germicidal lamp to obtain the desired light-sensitive resin plate. Table 1 shows the evaluation results.
- the photosensitive resin described in Example 1 was subjected to molding, exposure and washing steps under the same conditions to obtain a photosensitive resin plate.
- This photosensitive resin plate was dried at 60 ° C. for 15 minutes.
- a chemical lamp was immersed in a 1/9 (weight ratio) ethanol Z aqueous solution containing 0.1 part by weight of a silicone compound X-22-22 (modified by Shin-Etsu Chemical Co., Ltd.) modified with a higher fatty acid ester.
- a germicidal lamp to obtain the desired photosensitive resin plate. Table 1 shows the evaluation results.
- the desired photosensitive resin plate was prepared in the same manner as in Example 8, except that a carbinol-modified silicone compound X—22—160A S (trade name, manufactured by Shin-Etsu Iridaku) was used instead of X—22—715. Obtained. Table 1 shows the evaluation results.
- Example 10 The photosensitive resin described in Example 1 was subjected to molding, exposure and washing steps under the same conditions to obtain a photosensitive resin plate.
- This photosensitive resin plate was dried at 60 ° C. for 15 minutes. Then, it was immersed in a 1% by weight ethanol solution of dimethyl silicone oil having no functional group other than a methyl group for 1 minute, and then dried for 5 minutes.
- This photosensitive resin plate was subjected to post-exposure using a chemical lamp and a germicidal lamp to obtain an intended photosensitive resin plate. Table 1 shows the evaluation results.
- Example 10 Example 10
- the photosensitive resin described in Example 1 was molded and exposed under the same conditions. After that, 5 parts by weight of Leocol SC-80 (manufactured by Lion), a 5-mol adduct of a secondary alcohol ethylene oxide having 12 to 14 carbon atoms, as a surfactant, 1 part by weight of dibutyldiethylene glycol as a penetrant, Polyethylene glycol-polypropylene glycol-modified silicone oil TSF4452 (GE Toshiba Silicone) 0.2 parts by weight, sodium carbonate 0.4 parts by weight Using a water-based developer with a flat type washing machine (Robo Electronics) Unexposed areas were washed out. The photosensitive resin plate was dried at 60 ° C. for 30 minutes. This photosensitive resin plate was subjected to post-exposure using a chemical lamp and a germicidal lamp to obtain an intended photosensitive resin plate. Table 1 shows the evaluation results.
- Example 1 The photosensitive resin described in Example 1 was molded and exposed under the same conditions. Thereafter, the desired photosensitive resin was prepared in the same manner as in Example 10 except that the silicone compound added to the aqueous developer was changed to a carbinol-modified silicone compound X-22-160AS (manufactured by Shin-Etsu Chemical Co., Ltd.). Got a version. Table 1 shows the evaluation results.
- Example 1 The photosensitive resin described in Example 1 was molded and exposed under the same conditions. Thereafter, the desired photosensitivity was obtained in the same manner as in Example 10 except that the silicone compound to be added to the aqueous developer was changed to a methacryl-modified silicone compound X-22-164A (manufactured by Shin-Etsu-Dagaku). A fat plate was obtained. Table 1 shows the evaluation results.
- Example 1 The photosensitive resin described in Example 1 was molded and exposed under the same conditions. Thereafter, the desired photosensitive resin plate was prepared in the same manner as in Example 10 except that the silicone compound added to the aqueous developer was changed to a carboxyl-modified silicone compound X-22-162C (manufactured by Shin-Etsu Chemical Co., Ltd.). Got. Table 1 shows the evaluation results.
- Example 1 The photosensitive resin described in Example 1 was molded and exposed under the same conditions. Then, the silicone compound to be added to the aqueous developer is converted to an amino group-modified silicone compound.
- a target light-sensitive resin plate was obtained in the same manner as in Example 10 except that the compound was changed to KF-393 (manufactured by Shin-Etsu Chemical Co., Ltd.). Table 1 shows the evaluation results.
- the composition was applied to a polyethylene terephthalate film support having a urethane-based adhesive layer and a film having an anti-adhesion layer made of polybutyl alcohol and cellulose. 1. Molded to a thickness of 14 mm. In this photosensitive resin plate, almost no turbidity was observed, and transparency was maintained. This photosensitive resin plate was first exposed to the entire surface of the support side using a JET A2-HSS exposure machine (manufactured by JEOL Ltd.) at 600 mJ, and then the film on the opposite side was peeled off. Image exposure of 5000mi.
- Leocol SC-80 (manufactured by Lion), which is a 5-mol adduct of a secondary alcohol ethylene oxide having 12 to 14 carbon atoms, as a surfactant, 1 part by weight of dibutyldiethylene glycol as a penetrant, and 0 parts by weight of sodium carbonate
- a flat type washer manufactured by Robo Electronics
- post-exposure was performed using a chemical lamp and a germicidal lamp to obtain a target plate photosensitive resin.
- the above composition was molded to a thickness of 1.14 mm in the same manner as in Comparative Reference Example 1, except that the amount of the higher fatty acid ester-modified silicone compound X-22-715 was changed to 2.0 parts by weight. .
- the photosensitive resin plate was turbid, and the white lines of the photosensitive resin plate obtained by performing the same exposure, washing and post-exposure steps as in Comparative Reference Example 1 were filled in. And the image reproducibility was significantly deteriorated.
- Example 15 Using a photosensitive resin plate molded to a thickness of 14 mm obtained in the same manner as in Comparative Reference Example 1, exposure, washing, and post-exposure were performed in the same manner as in Example 12 to obtain the desired photosensitive resin. A fat plate was obtained. In the evaluation of ink entanglement, no entanglement occurred, and the actual printing evaluation was "A". A small amount of silicone is internally added to the photosensitive resin, and a small amount of ink entanglement occurs, resulting in poor performance even in actual printing evaluation. That was confirmed.
- a commercially available water-developable solid plate AQS (manufactured by DuPont) was used as the photosensitive resin plate, and the desired photosensitive resin plate was produced in the same manner as in Example 4 except that exposure was performed by selecting the exposure amount at which an image was formed. Got.
- the AQS was exposed, washed and post-exposed in the same manner as in Comparative Example 1, and the evaluation of ink entanglement was compared with that of the photosensitive resin plate, treatment with the modified silicone prevented ink entanglement from occurring. It was confirmed.
- a commercially available water-developable solid-state cosmolite (manufactured by Toyobo) was used as the photosensitive resin plate, and the desired photosensitive resin plate was prepared in the same manner as in Example 4 except that exposure was performed by selecting the exposure amount at which an image was formed. Got.
- the evaluation of the ink entanglement of the sensitized resin plate exposed and washed and post-exposed to cosmolite in the same manner as in Comparative Example 1 showed that no ink entanglement was caused by the treatment with the modified silicone. I confirmed the thing.
- the film was then sandwiched to a thickness of 2.84 mm, and a full-side exposure of 150 mJ was performed on the base film. Thereafter, image exposure was performed at 500 mj via a negative film containing halftone dots of 30, 45, and 651 pi with a solid image placed outside the cover film.
- the present invention can be used as a plate making method for improving the printing performance of a water-developable photosensitive resin plate for letterpress printing and reducing troubles during printing.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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EP04807472.8A EP1698942B1 (en) | 2003-12-26 | 2004-12-21 | Water-developable photopolymer plate for letterpress printing |
US10/584,628 US8445180B2 (en) | 2003-12-26 | 2004-12-21 | Water-developable photopolymer plate for letterpress printing |
JP2005516594A JP4439473B2 (ja) | 2003-12-26 | 2004-12-21 | 凸版印刷用水現像感光性樹脂版 |
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JP2003-433220 | 2003-12-26 | ||
JP2003433220 | 2003-12-26 | ||
JP2004-001318 | 2004-01-06 | ||
JP2004001318 | 2004-01-06 |
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WO2005064413A1 true WO2005064413A1 (ja) | 2005-07-14 |
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PCT/JP2004/019115 WO2005064413A1 (ja) | 2003-12-26 | 2004-12-21 | 凸版印刷用水現像感光性樹脂版 |
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US (1) | US8445180B2 (ja) |
EP (1) | EP1698942B1 (ja) |
JP (4) | JP4439473B2 (ja) |
WO (1) | WO2005064413A1 (ja) |
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WO2007116941A1 (ja) | 2006-04-07 | 2007-10-18 | Asahi Kasei Chemicals Corporation | フレキソ印刷用感光性樹脂組成物 |
WO2008126606A1 (ja) | 2007-03-20 | 2008-10-23 | Asahi Kasei E-Materials Corporation | 凹凸形状を持つ感光性樹脂版および凸版印刷版の製造方法、ならびに当該製造方法に用いる版面用処理液 |
WO2008133055A1 (ja) | 2007-04-19 | 2008-11-06 | Asahi Kasei E-Materials Corporation | 凹凸形状を有する感光性樹脂版及び凸版印刷版の製造方法、並びに当該製造方法に用いる版面用処理液 |
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JP2010072130A (ja) * | 2008-09-17 | 2010-04-02 | Asahi Kasei E-Materials Corp | 感光性樹脂凸版印刷版の製造方法 |
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JP2011197103A (ja) * | 2010-03-17 | 2011-10-06 | Asahi Kasei E-Materials Corp | 感光性樹脂凸版印刷版の製造方法 |
WO2014157064A1 (ja) | 2013-03-28 | 2014-10-02 | 東洋紡株式会社 | フレキソ印刷版の製造方法 |
JP2015528642A (ja) * | 2012-09-04 | 2015-09-28 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングMerck Patent Gesellschaft mit beschraenkter Haftung | 有機電子デバイスにおける誘電体構造の表面改変方法 |
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US11975556B2 (en) | 2018-11-21 | 2024-05-07 | Toyobo Mc Corporation | Water-developable flexographic printing original plate |
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US20140216285A1 (en) * | 2011-09-09 | 2014-08-07 | Toyobo Co., Ltd. | Flexographic printing original plate and water-developable laminate of photosensitive resin |
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US8114566B2 (en) | 2006-04-07 | 2012-02-14 | Asahi Kasei Chemicals Corporation | Photosensitive resin composition for flexographic printing |
WO2008126606A1 (ja) | 2007-03-20 | 2008-10-23 | Asahi Kasei E-Materials Corporation | 凹凸形状を持つ感光性樹脂版および凸版印刷版の製造方法、ならびに当該製造方法に用いる版面用処理液 |
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JP2010072130A (ja) * | 2008-09-17 | 2010-04-02 | Asahi Kasei E-Materials Corp | 感光性樹脂凸版印刷版の製造方法 |
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JP5751492B2 (ja) * | 2009-12-29 | 2015-07-22 | 東洋紡株式会社 | フレキソ印刷版の製造方法およびフレキソ印刷版 |
US9937524B2 (en) | 2009-12-29 | 2018-04-10 | Toyo Boseki Kabushiki Kaisha | Method for manufacturing flexographic printing plate and flexographic printing plate |
JP2011197103A (ja) * | 2010-03-17 | 2011-10-06 | Asahi Kasei E-Materials Corp | 感光性樹脂凸版印刷版の製造方法 |
JP2015528642A (ja) * | 2012-09-04 | 2015-09-28 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングMerck Patent Gesellschaft mit beschraenkter Haftung | 有機電子デバイスにおける誘電体構造の表面改変方法 |
WO2014157064A1 (ja) | 2013-03-28 | 2014-10-02 | 東洋紡株式会社 | フレキソ印刷版の製造方法 |
JP5601606B1 (ja) * | 2013-03-28 | 2014-10-08 | 東洋紡株式会社 | フレキソ印刷版の製造方法 |
US9358771B2 (en) | 2013-03-28 | 2016-06-07 | Toyobo Co., Ltd. | Method for producing flexographic printing plate |
WO2020105259A1 (ja) | 2018-11-21 | 2020-05-28 | 東洋紡株式会社 | 水現像性フレキソ印刷原版 |
US11975556B2 (en) | 2018-11-21 | 2024-05-07 | Toyobo Mc Corporation | Water-developable flexographic printing original plate |
JP2021043401A (ja) * | 2019-09-13 | 2021-03-18 | 旭化成株式会社 | 感光性樹脂用水性現像液組成物、及び製版方法 |
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JPWO2005064413A1 (ja) | 2007-07-19 |
US8445180B2 (en) | 2013-05-21 |
JP4439588B2 (ja) | 2010-03-24 |
EP1698942A4 (en) | 2010-03-10 |
JP2009244909A (ja) | 2009-10-22 |
EP1698942A1 (en) | 2006-09-06 |
EP1698942B1 (en) | 2016-04-13 |
US20070160933A1 (en) | 2007-07-12 |
JP2009244911A (ja) | 2009-10-22 |
JP2009244910A (ja) | 2009-10-22 |
JP4548860B2 (ja) | 2010-09-22 |
JP4548859B2 (ja) | 2010-09-22 |
JP4439473B2 (ja) | 2010-03-24 |
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