WO2005019231A8 - ホスファゼン化合物、及び感光性樹脂組成物並びにその利用 - Google Patents

ホスファゼン化合物、及び感光性樹脂組成物並びにその利用

Info

Publication number
WO2005019231A8
WO2005019231A8 PCT/JP2004/007719 JP2004007719W WO2005019231A8 WO 2005019231 A8 WO2005019231 A8 WO 2005019231A8 JP 2004007719 W JP2004007719 W JP 2004007719W WO 2005019231 A8 WO2005019231 A8 WO 2005019231A8
Authority
WO
WIPO (PCT)
Prior art keywords
compound
resin composition
photosensitive resin
phenoxyphosphazene
phosphazene compound
Prior art date
Application number
PCT/JP2004/007719
Other languages
English (en)
French (fr)
Other versions
WO2005019231A1 (ja
Inventor
Koji Okada
Toshio Yamanaka
Original Assignee
Kaneka Corp
Koji Okada
Toshio Yamanaka
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp, Koji Okada, Toshio Yamanaka filed Critical Kaneka Corp
Priority to JP2005513241A priority Critical patent/JP4695512B2/ja
Priority to US10/559,737 priority patent/US8063245B2/en
Publication of WO2005019231A1 publication Critical patent/WO2005019231A1/ja
Publication of WO2005019231A8 publication Critical patent/WO2005019231A8/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G79/00—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule
    • C08G79/02—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule a linkage containing phosphorus
    • C08G79/025—Polyphosphazenes
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02—Phosphorus compounds
    • C07F9/06—Phosphorus compounds without P—C bonds
    • C07F9/062—Organo-phosphoranes without P-C bonds
    • C07F9/065—Phosphoranes containing the structure P=N-
    • C07F9/067—Polyphosphazenes containing the structure [P=N-n]
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02—Phosphorus compounds
    • C07F9/547—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom
    • C07F9/6564—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms
    • C07F9/6581—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and nitrogen atoms with or without oxygen or sulfur atoms, as ring hetero atoms
    • C07F9/65812—Cyclic phosphazenes [P=N-]n, n>=3
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
PCT/JP2004/007719 2003-06-05 2004-06-03 ホスファゼン化合物、及び感光性樹脂組成物並びにその利用 WO2005019231A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005513241A JP4695512B2 (ja) 2003-06-05 2004-06-03 ホスファゼン化合物、及び感光性樹脂組成物並びにその利用
US10/559,737 US8063245B2 (en) 2003-06-05 2004-06-03 Phosphazene compound, photosensitive resin composition and use thereof

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2003-161079 2003-06-05
JP2003161079 2003-06-05
JP2003204036 2003-07-30
JP2003204023 2003-07-30
JP2003-204023 2003-07-30
JP2003-204036 2003-07-30

Publications (2)

Publication Number Publication Date
WO2005019231A1 WO2005019231A1 (ja) 2005-03-03
WO2005019231A8 true WO2005019231A8 (ja) 2005-10-20

Family

ID=34222138

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/007719 WO2005019231A1 (ja) 2003-06-05 2004-06-03 ホスファゼン化合物、及び感光性樹脂組成物並びにその利用

Country Status (3)

Country Link
US (1) US8063245B2 (ja)
JP (1) JP4695512B2 (ja)
WO (1) WO2005019231A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7088004B2 (ja) 2017-03-21 2022-06-21 東レ株式会社 感光性樹脂組成物、感光性樹脂組成物フィルム、絶縁膜および電子部品

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110002500A (ko) 2005-07-05 2011-01-07 히다치 가세고교 가부시끼가이샤 감광성 접착제, 및 이것을 이용하여 얻어지는 접착 필름, 접착 시트, 접착제층 부착 반도체 웨이퍼, 반도체장치 및 전자부품
KR101256332B1 (ko) * 2007-04-04 2013-04-18 히타치가세이가부시끼가이샤 감광성 접착제 조성물, 필름상 접착제, 접착 시트, 접착제 패턴, 접착제층 부착 반도체 웨이퍼, 반도체 장치, 및, 반도체 장치의 제조방법
JP5179843B2 (ja) * 2007-07-31 2013-04-10 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びそれを用いた感光性フィルム
JP5239661B2 (ja) * 2007-09-13 2013-07-17 東レ株式会社 カバーレイフィルム
JP4901687B2 (ja) * 2007-10-17 2012-03-21 日東電工株式会社 感光性樹脂組成物およびそれを用いて得られるカバー絶縁層を有するフレキシブルプリント配線回路基板
US8163439B2 (en) * 2008-06-03 2012-04-24 The University Of Akron Electrolyte membranes and methods of use
JP5136239B2 (ja) * 2008-06-26 2013-02-06 住友ベークライト株式会社 感光性樹脂組成物、接着フィルムおよび受光装置
JP5043775B2 (ja) * 2008-08-07 2012-10-10 太陽ホールディングス株式会社 難燃性光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5301915B2 (ja) * 2008-08-07 2013-09-25 太陽ホールディングス株式会社 難燃性光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5521800B2 (ja) * 2010-06-08 2014-06-18 Ｊｓｒ株式会社 感放射線性樹脂組成物、硬化膜、硬化膜の形成方法、及び表示素子
KR101669396B1 (ko) 2012-01-20 2016-10-25 아사히 가세이 이-매터리얼즈 가부시키가이샤 수지 조성물, 적층체, 다층 프린트 배선판 및 다층 플렉시블 배선판 및 그 제조 방법
US9394483B2 (en) 2012-05-24 2016-07-19 Sabic Global Technologies B.V. Flame retardant polycarbonate compositions, methods of manufacture thereof and articles comprising the same
US9023922B2 (en) 2012-05-24 2015-05-05 Sabic Global Technologies B.V. Flame retardant compositions, articles comprising the same and methods of manufacture thereof
US20150175811A1 (en) * 2012-07-20 2015-06-25 Hitachi Chemical Company, Ltd. Silver-sulfidation-preventing material and method for forming silver-sulfidation-preventing film, and method for producing light-emitting device and light-emitting device
JP6462983B2 (ja) * 2014-01-28 2019-01-30 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板
CN106832764A (zh) * 2015-12-04 2017-06-13 广东生益科技股份有限公司 一种无卤环氧树脂组合物以及含有它的预浸料、层压板和印制电路板
TWI580714B (zh) 2016-03-10 2017-05-01 台燿科技股份有限公司 樹脂組合物及其應用
JP6819854B2 (ja) * 2016-08-26 2021-01-27 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、積層樹脂シート、樹脂シート、及びプリント配線板
CN110231754B (zh) * 2019-04-23 2023-05-02 苏州瑞红电子化学品有限公司 一种杂环多官光致产酸剂及其制备方法和制得的化学增幅型光刻胶
CN111848963B (zh) * 2020-07-14 2022-05-27 北京化工大学 一种可重复加工且高温热固的阻燃树脂的制备方法
CN114517043B (zh) * 2022-01-27 2022-12-16 福建泓光半导体材料有限公司 含有有机刚性笼状化合物的底部抗反射涂料组合物及其制备方法和微电子结构的形成方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3711389A (en) * 1969-07-15 1973-01-16 Moleculon Res Corp Process for treating polymeric substrates with high-energy radiation
JPS54145394A (en) 1978-05-04 1979-11-13 Otsuka Chem Co Ltd Preparation of phosphazen oligomer
JPS5819604B2 (ja) 1978-05-04 1983-04-19 大塚化学薬品株式会社 ホスフアゼンオリゴマ−の製造法
JPS58219190A (ja) 1982-06-15 1983-12-20 Otsuka Chem Co Ltd ホスホニトリル酸エステル類及びその製造法
JP3193468B2 (ja) 1992-07-09 2001-07-30 東芝ケミカル株式会社 プリント回路板の製造方法
JP3014578B2 (ja) 1994-03-08 2000-02-28 住友ベークライト株式会社 高温時の物性が改良された樹脂組成物
TW294702B (ja) 1994-03-08 1997-01-01 Sumitomo Bakelite Co
JP3646410B2 (ja) 1996-06-18 2005-05-11 宇部興産株式会社 積層基板
DE19645340C1 (de) 1996-11-04 1998-02-12 Daimler Benz Ag Aushärtbare Zusammensetzungen mit Phosphazenderivat und Vernetzer
CA2275247C (en) * 1997-10-15 2005-01-11 Otsuka Chemical Co., Ltd. Crosslinked phenoxyphosphazene compounds, flame retardant, flame-retardant resin compositions, and moldings of flame-retardant resins
JPH11181268A (ja) 1997-12-25 1999-07-06 Kanegafuchi Chem Ind Co Ltd 難燃性熱可塑性樹脂組成物
JP2001040219A (ja) 1999-05-26 2001-02-13 Nec Corp 難燃性樹脂組成物
JP3810954B2 (ja) 1999-07-12 2006-08-16 京セラケミカル株式会社 難燃性接着剤組成物、フレキシブル銅張積層板、カバーレイおよび接着剤フィルム
JP4309518B2 (ja) 1999-07-30 2009-08-05 ケミプロ化成株式会社 難燃性樹脂組成物
JP2001049090A (ja) 1999-08-11 2001-02-20 Toshiba Chem Corp ビルドアップ型多層プリント配線板とそれに用いる樹脂組成物および樹脂フィルム
JP2001335619A (ja) 1999-12-28 2001-12-04 Kanegafuchi Chem Ind Co Ltd エポキシ変性ポリイミドおよび、これを用いた感光性組成物、カバーレイフィルム、ソルダーレジスト、プリント配線板
TW567198B (en) 1999-12-28 2003-12-21 Kaneka Corp Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide
JP3637277B2 (ja) 2000-03-21 2005-04-13 大塚化学ホールディングス株式会社 難燃剤、及び難燃性樹脂組成物、及び成形物、及び電子部品
JP5318306B2 (ja) 2001-02-09 2013-10-16 東洋紡株式会社 耐熱性組成物
KR20030097780A (ko) * 2001-07-04 2003-12-31 쇼와 덴코 가부시키가이샤 레지스트 경화성 수지 조성물 및 그 경화물
JP2003302751A (ja) * 2002-04-09 2003-10-24 Kanegafuchi Chem Ind Co Ltd 感光性樹脂組成物およびそれを用いたドライフィルムレジスト

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7088004B2 (ja) 2017-03-21 2022-06-21 東レ株式会社 感光性樹脂組成物、感光性樹脂組成物フィルム、絶縁膜および電子部品

Also Published As

Publication number Publication date
JP4695512B2 (ja) 2011-06-08
WO2005019231A1 (ja) 2005-03-03
US20060142542A1 (en) 2006-06-29
JPWO2005019231A1 (ja) 2007-10-04
US8063245B2 (en) 2011-11-22

Similar Documents

Publication Publication Date Title
WO2005019231A8 (ja) ホスファゼン化合物、及び感光性樹脂組成物並びにその利用
CN101643570B (zh) 无卤阻燃型树脂组合物及用其制成的预浸料、层压板与印制电路用层压板
KR101184139B1 (ko) 수지 조성물, 수지 부착 금속박, 기재 부착 절연시트 및다층 프린트 배선판
CN101323773B (zh) 一种用于柔性覆铜箔基板的耐高温无卤阻燃胶粘剂及其制备方法
CN102127290B (zh) 环氧树脂组合物以及使用其制备的挠性覆铜板
TW200611927A (en) Prepreg, method for producing the same, laminated sheet and printed circuit board
US20100240811A1 (en) Thermosetting Resin Composition and Application Thereof
CN101892027B (zh) 低卤素含量的阻燃胶粘剂以及用其制备的挠性覆铜板
WO2003038526A1 (fr) Composition de resine photosensible et films et stratifies photosensibles ainsi obtenus
CN101643650B (zh) 含磷阻燃剂及其制备方法
CN102051022A (zh) 环氧树脂组合物及使用其制作的半固化片与层压板
WO2005103822A3 (en) Photosensitive resin composition, cured product thereof and production method of printed circuit board using the same
US20120024580A1 (en) Epoxy resin composition, and prepreg and printed circuit board using the same
CN105585821B (zh) 一种无卤树脂组合物及使用其制作的不流胶半固化片及其制作方法
WO2016119356A1 (zh) 一种无卤树脂组合物及用其制作的预浸料和层压板
WO2008111489A1 (ja) 難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム
CN108410132A (zh) 一种低介电无卤树脂组合物及其低流动度半固化片
EP1310525A4 (en) COPPER FILM WITH RESIN AND PRINTED PCBS MANUFACTURED THEREFOR
CN102304273B (zh) 热固性环氧树脂组合物及使用其制作的环氧玻纤布基覆铜板
CN101948668B (zh) 用于制备软式覆铜板材料的无卤阻燃胶粘剂及其制备方法
WO2008133246A1 (ja) エポキシ樹脂組成物、樹脂フィルム、プリプレグ、及び多層プリント配線板
CN102936468A (zh) 一种阻燃环氧树脂胶黏剂及利用该黏剂制作的挠性覆铜板
TW200500413A (en) Resin composition for printed wiring board, prepreg, and laminate using the same
CN101808466B (zh) 一种覆铜板的制作方法及覆铜板用胶液
EP0138609A2 (en) Resin compositions for laminated boards

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
CFP Corrected version of a pamphlet front page

Free format text: REVISED ABSTRACT RECEIVED BY THE INTERNATIONAL BUREAU AFTER COMPLETION OF THE TECHNICAL PREPARATIONS FOR INTERNATIONAL PUBLICATION

WWE Wipo information: entry into national phase

Ref document number: 2005513241

Country of ref document: JP

ENP Entry into the national phase

Ref document number: 2006142542

Country of ref document: US

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 10559737

Country of ref document: US

WWP Wipo information: published in national office

Ref document number: 10559737

Country of ref document: US

122 Ep: pct application non-entry in european phase