Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0011—Working of insulating substrates or insulating layers
  • H05K3/0017—Etching of the substrate by chemical or physical means
  • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
  • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
  • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N25/00—Investigating or analyzing materials by the use of thermal means
  • G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
  • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/36—Removing material
  • B23K26/38—Removing material by boring or cutting
  • B23K26/382—Removing material by boring or cutting by boring
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/36—Removing material
  • B23K26/40—Removing material taking account of the properties of the material involved
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2101/00—Articles made by soldering, welding or cutting
  • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
  • B23K2101/35—Surface treated articles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2101/00—Articles made by soldering, welding or cutting
  • B23K2101/36—Electric or electronic devices
  • B23K2101/42—Printed circuits
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2103/00—Materials to be soldered, welded or cut
  • B23K2103/08—Non-ferrous metals or alloys
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2103/00—Materials to be soldered, welded or cut
  • B23K2103/08—Non-ferrous metals or alloys
  • B23K2103/10—Aluminium or alloys thereof
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2103/00—Materials to be soldered, welded or cut
  • B23K2103/08—Non-ferrous metals or alloys
  • B23K2103/12—Copper or alloys thereof
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2103/00—Materials to be soldered, welded or cut
  • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N25/00—Investigating or analyzing materials by the use of thermal means
  • G01N25/005—Investigating or analyzing materials by the use of thermal means by investigating specific heat
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/16—Inspection; Monitoring; Aligning
  • H05K2203/163—Monitoring a manufacturing process

Definitions

• the present invention relates to a technique for measuring the amount of heat absorbed by a small amount of laser light emitted to a metal foil, and in particular, a layer indirect through hole (through hole) of a printed circuit board is formed using this measured heat amount.
• the present invention relates to a method capable of efficiently performing adjustment of the surface characteristics of metal foil and laser drilling of metal foil which are required for the purpose, and a suitable metal foil calorimeter for use for this.
• the metal foil of the present invention is intended for copper foil, aluminum foil, etc., not only the metal foil itself but also a laminated plate of metal foil or all foils plated with metal directly on the laminated plate, etc. It shall be Background art
• the surface of a copper foil or the like used for a conventional printed circuit board (the copper foil will be mainly described below, but is not limited to the copper foil) has a large reflectance, so the laser light There is a disadvantage that the processability is poor. Therefore, after a predetermined copper foil portion is etched and removed, laser light is irradiated and drilled there, or the copper foil is thinned by chemical polishing or the like. A laser-machining method is employed.
• the process of etching removal or chemical polishing of the copper foil is inefficient, and the strict control of such processing operations is required, resulting in poor productivity and cost increase.
• the surface of the copper foil may be covered with a material that is likely to be absorbed without reflection of laser light, or the surface of the copper foil or the mounting surface may be roughened. It has been carried out to improve the drilling ability of (see Patent No. 3 5 5 8 30 8).
• the present invention has been made in view of the above problems, and its object is to provide a technique for measuring the amount of heat absorbed by a small amount of laser beam emitted to a metal foil. Using the measured heat quantity, efficiently adjust the surface characteristics of the metal foil, which is required particularly for forming the interlayer connection holes (through holes) of the printed circuit board, and perform laser drilling of the metal foil, etc. And a suitable metal foil calorimeter for this purpose. From the above, the present invention
• a metal foil is irradiated with a small amount of laser light, and the amount of heat absorbed by the metal foil is measured by a sensor provided on the back of the metal foil.
• the metal foil is irradiated with a small amount of laser light, the amount of heat absorbed by the metal foil is measured, and the calorific value is used to adjust the surface characteristics such as the glossiness and surface roughness of the metal foil.
• Method of adjusting surface characteristics of metal foil 3 The metal foil is irradiated with a small amount of laser light, the amount of heat absorbed by the metal foil is measured, and the calorific value is used to adjust the hole diameter of the metal foil at the time of laser drilling.
• a laser light introducing tube having a light reflecting surface on the inner surface, a device for installing a metal foil for measuring the heat quantity at the bottom of the laser beam introducing tube, and a heat quantity attached to the back surface of the metal foil.
• Metal foil characterized by having a sensor to measure
• the calorimeter according to the above 9 characterized in that the metal foil for measuring the heat quantity is a metal foil for laser drilling.
• a laser beam introducing tube having a light reflecting surface on the inner surface, a device for installing a metal foil for measuring the amount of heat at the bottom of the laser beam introducing tube, and a heat amount attached to the back surface of the metal foil.
• FIG. 1 is a cross-sectional explanatory view showing a calorimeter of the present invention.
• FIG. 2 is a graph showing the correlation between the gloss of a copper foil and the amount of heat.
• FIG. 3 is a view showing the correlation between the surface roughness (R z) of the copper foil and the amount of heat.
• FIG. 4 is a graph showing the correlation between the hole diameter of the copper foil and the amount of heat absorbed by the copper foil.
• a sample of metal foil for example, copper foil, is prepared in advance, and this copper foil is set in the calorimeter of the metal foil for laser drilling of the present invention.
• this copper foil calorimeter is provided with a laser light introducing tube 1 having a light reflecting surface on the inner surface, and a copper foil 2 installed at the lower part of the laser light introducing tube 1 A sensor 13 is provided which is in close contact with the back of the foil 2 to measure the amount of heat.
• symbol 4 shows a carbon dioxide gas laser beam.
• the inner surface of the laser light introducing tube 1 a light reflecting surface, it is possible to prevent heat dissipation from the laser light introducing tube.
• the heat dissipation from the laser beam introduction tube is only the flow of air in contact with the inner surface of the laser beam introduction tube, and the amount is small t
• the amount of heat released from the edge of the copper foil 2 is that the copper foil is thin So the amount is small enough to ignore.
• the copper foil is irradiated with a small amount of laser light, and the amount of heat absorbed by the copper foil is measured.
• the relationship between the copper foil's glossiness and heat quantity is shown in Fig.2. As shown in FIG. 2, as the degree of gloss increases, the amount of heat absorbed by the copper foil decreases.
• the surface roughness (R z) of the copper foil and the heat quantity there is a correlation between the surface roughness (R z) of the copper foil and the heat quantity, and the heat quantity absorbed by the copper foil can be increased by increasing the surface roughness. Therefore, the surface characteristics (gloss, surface roughness) of the copper foil can be adjusted by these calorific values.
• a layer containing at least one of indium, tin, cobalt, zinc, cobalt alloy and nickel alloy is formed at a position where at least laser light of copper foil is irradiated to form an interlayer connection hole of a printed circuit board. By blackening the plating surface, it is possible to lower the reflectance of laser light and increase the amount of heat absorbed by the copper foil. Also, the surface roughness can be adjusted in the same manner.
• such a plated surface can be formed on a copper foil sample to measure the amount of heat, which can be used to manage the surface characteristics of the copper foil in the production process.
• the hole diameter of the copper foil there is a correlation between the hole diameter of the copper foil and the amount of heat absorbed by the copper foil as shown in FIG. Therefore, if the amount of heat absorbed is large, the hole diameter can be increased. Therefore, the sample of copper foil is irradiated with a small amount of laser light, and the amount of heat absorbed by the metal foil is measured. The hole diameter of the foil can be adjusted.
• the sample of copper foil is irradiated with a small amount of laser light, the amount of heat absorbed by the metal foil is measured, and the calorific value determines the amount of heat corresponding to the required hole diameter of the metal foil.
• Surface characteristics of the metal foil can also be adjusted.
• the metal foil c used there is a large effect that the quality control of drilling of the copper foil can be easily, for example in terms of the copper foil, it can be applied to any of the electrolytic copper foil or rolled copper foil.
• the thickness of the copper foil can be applied to less than 1 8 used as high density wiring.
• the present invention is not limited to the thickness of such a metal foil, and naturally, it can be applied to a thickness greater than this.
• These layers can be produced by plating.
• the present invention is not limited to plating, and deposition, sputtering, and other coating methods can also be used.
• the layer formed by the plating or the like can be partially or entirely applied to the laser beam irradiated surface of the metal foil. It goes without saying that these plating treatments and the like do not impair the characteristics of the copper foil applied to the circuit board, and the treatment of the present invention sufficiently satisfies these conditions.
• a small amount of laser light is irradiated to a copper foil sample in advance, the amount of heat absorbed by the metal foil is measured, and the hole diameter of the copper foil by the laser is measured by this calorific value. Since it can be adjusted, it is possible to know in advance the optimum laser light output.
• the hole diameter of the metal foil by the laser and the amount of heat absorbed by the metal foil have a similar relationship. That is, if the amount of heat absorbed is large, the hole diameter can be increased. Therefore, a small amount of laser light is irradiated to the sample of the metal foil in advance, the amount of heat absorbed by the metal foil is measured, and the diameter of the hole of the metal foil can be adjusted by the laser measurement value.
• a metal foil sample is irradiated with a small amount of laser light, the amount of heat absorbed by the metal foil is measured, and the calorific value is used to determine the amount of heat corresponding to the required hole diameter of the metal foil. Can also control the surface characteristics of the metal foil.
• the copper foil sample is irradiated with a small amount of laser light in advance, the amount of heat absorbed by the metal foil is measured, and the calorific value can be used to adjust the hole diameter of the copper foil by the laser.
• the optimum laser-to-light output can be known in advance.
• the method of measuring the calorific value of metal foil the method of adjusting the surface characteristics of metal foil, the method of laser perforating metal foil, and the preferable apparatus for measuring the calorimeter of metal foil for laser drilling used for this purpose It has the excellent feature of being able to efficiently form the interlayer connection holes (through holes) of the high-quality printed circuit board.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Plasma & Fusion (AREA)
• Mechanical Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Life Sciences & Earth Sciences (AREA)
• Health & Medical Sciences (AREA)
• Chemical & Material Sciences (AREA)
• Analytical Chemistry (AREA)
• Biochemistry (AREA)
• General Health & Medical Sciences (AREA)
• General Physics & Mathematics (AREA)
• Immunology (AREA)
• Pathology (AREA)
• Laser Beam Processing (AREA)
• Investigating Or Analyzing Materials Using Thermal Means (AREA)

Priority Applications (1)

Applications Claiming Priority (2)

Publications (1)

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Family Applications (1)

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Citations (5)

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• 2002
  • 2002-11-12 JP JP2002327694A patent/JP3869352B2/ja not_active Expired - Fee Related
• 2003
  • 2003-10-27 CN CNB2003801013831A patent/CN100516851C/zh not_active Expired - Fee Related
  • 2003-10-27 WO PCT/JP2003/013709 patent/WO2004044568A1/ja active Application Filing
  • 2003-10-27 KR KR1020057008280A patent/KR100934160B1/ko not_active IP Right Cessation
  • 2003-10-27 CN CN2008101000357A patent/CN101306490B/zh not_active Expired - Fee Related
  • 2003-10-27 KR KR1020077022886A patent/KR20070116625A/ko not_active Application Discontinuation
  • 2003-11-03 TW TW092130651A patent/TWI246376B/zh not_active IP Right Cessation

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