WO2004044568A1 - Method for measuring amount of heat in metal foil, method for adjusting surface characteristics, laser drilling method, and apparatus for measuring amount of heat - Google Patents

Method for measuring amount of heat in metal foil, method for adjusting surface characteristics, laser drilling method, and apparatus for measuring amount of heat Download PDF

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Publication number
WO2004044568A1
WO2004044568A1 PCT/JP2003/013709 JP0313709W WO2004044568A1 WO 2004044568 A1 WO2004044568 A1 WO 2004044568A1 JP 0313709 W JP0313709 W JP 0313709W WO 2004044568 A1 WO2004044568 A1 WO 2004044568A1
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WO
WIPO (PCT)
Prior art keywords
metal foil
heat
amount
laser
measuring
Prior art date
Application number
PCT/JP2003/013709
Other languages
French (fr)
Japanese (ja)
Inventor
Masaru Sakamoto
Hideta Arai
Jiangtao Wang
Original Assignee
Nikko Materials Co., Ltd.
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Publication date
Application filed by Nikko Materials Co., Ltd. filed Critical Nikko Materials Co., Ltd.
Priority to KR1020057008280A priority Critical patent/KR100934160B1/en
Publication of WO2004044568A1 publication Critical patent/WO2004044568A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B23K2101/35—Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/005—Investigating or analyzing materials by the use of thermal means by investigating specific heat
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Definitions

  • the present invention relates to a technique for measuring the amount of heat absorbed by a small amount of laser light emitted to a metal foil, and in particular, a layer indirect through hole (through hole) of a printed circuit board is formed using this measured heat amount.
  • the present invention relates to a method capable of efficiently performing adjustment of the surface characteristics of metal foil and laser drilling of metal foil which are required for the purpose, and a suitable metal foil calorimeter for use for this.
  • the metal foil of the present invention is intended for copper foil, aluminum foil, etc., not only the metal foil itself but also a laminated plate of metal foil or all foils plated with metal directly on the laminated plate, etc. It shall be Background art
  • the surface of a copper foil or the like used for a conventional printed circuit board (the copper foil will be mainly described below, but is not limited to the copper foil) has a large reflectance, so the laser light There is a disadvantage that the processability is poor. Therefore, after a predetermined copper foil portion is etched and removed, laser light is irradiated and drilled there, or the copper foil is thinned by chemical polishing or the like. A laser-machining method is employed.
  • the process of etching removal or chemical polishing of the copper foil is inefficient, and the strict control of such processing operations is required, resulting in poor productivity and cost increase.
  • the surface of the copper foil may be covered with a material that is likely to be absorbed without reflection of laser light, or the surface of the copper foil or the mounting surface may be roughened. It has been carried out to improve the drilling ability of (see Patent No. 3 5 5 8 30 8).
  • the present invention has been made in view of the above problems, and its object is to provide a technique for measuring the amount of heat absorbed by a small amount of laser beam emitted to a metal foil. Using the measured heat quantity, efficiently adjust the surface characteristics of the metal foil, which is required particularly for forming the interlayer connection holes (through holes) of the printed circuit board, and perform laser drilling of the metal foil, etc. And a suitable metal foil calorimeter for this purpose. From the above, the present invention
  • a metal foil is irradiated with a small amount of laser light, and the amount of heat absorbed by the metal foil is measured by a sensor provided on the back of the metal foil.
  • the metal foil is irradiated with a small amount of laser light, the amount of heat absorbed by the metal foil is measured, and the calorific value is used to adjust the surface characteristics such as the glossiness and surface roughness of the metal foil.
  • Method of adjusting surface characteristics of metal foil 3 The metal foil is irradiated with a small amount of laser light, the amount of heat absorbed by the metal foil is measured, and the calorific value is used to adjust the hole diameter of the metal foil at the time of laser drilling.
  • a laser light introducing tube having a light reflecting surface on the inner surface, a device for installing a metal foil for measuring the heat quantity at the bottom of the laser beam introducing tube, and a heat quantity attached to the back surface of the metal foil.
  • Metal foil characterized by having a sensor to measure
  • the calorimeter according to the above 9 characterized in that the metal foil for measuring the heat quantity is a metal foil for laser drilling.
  • a laser beam introducing tube having a light reflecting surface on the inner surface, a device for installing a metal foil for measuring the amount of heat at the bottom of the laser beam introducing tube, and a heat amount attached to the back surface of the metal foil.
  • FIG. 1 is a cross-sectional explanatory view showing a calorimeter of the present invention.
  • FIG. 2 is a graph showing the correlation between the gloss of a copper foil and the amount of heat.
  • FIG. 3 is a view showing the correlation between the surface roughness (R z) of the copper foil and the amount of heat.
  • FIG. 4 is a graph showing the correlation between the hole diameter of the copper foil and the amount of heat absorbed by the copper foil.
  • a sample of metal foil for example, copper foil, is prepared in advance, and this copper foil is set in the calorimeter of the metal foil for laser drilling of the present invention.
  • this copper foil calorimeter is provided with a laser light introducing tube 1 having a light reflecting surface on the inner surface, and a copper foil 2 installed at the lower part of the laser light introducing tube 1 A sensor 13 is provided which is in close contact with the back of the foil 2 to measure the amount of heat.
  • symbol 4 shows a carbon dioxide gas laser beam.
  • the inner surface of the laser light introducing tube 1 a light reflecting surface, it is possible to prevent heat dissipation from the laser light introducing tube.
  • the heat dissipation from the laser beam introduction tube is only the flow of air in contact with the inner surface of the laser beam introduction tube, and the amount is small t
  • the amount of heat released from the edge of the copper foil 2 is that the copper foil is thin So the amount is small enough to ignore.
  • the copper foil is irradiated with a small amount of laser light, and the amount of heat absorbed by the copper foil is measured.
  • the relationship between the copper foil's glossiness and heat quantity is shown in Fig.2. As shown in FIG. 2, as the degree of gloss increases, the amount of heat absorbed by the copper foil decreases.
  • the surface roughness (R z) of the copper foil and the heat quantity there is a correlation between the surface roughness (R z) of the copper foil and the heat quantity, and the heat quantity absorbed by the copper foil can be increased by increasing the surface roughness. Therefore, the surface characteristics (gloss, surface roughness) of the copper foil can be adjusted by these calorific values.
  • a layer containing at least one of indium, tin, cobalt, zinc, cobalt alloy and nickel alloy is formed at a position where at least laser light of copper foil is irradiated to form an interlayer connection hole of a printed circuit board. By blackening the plating surface, it is possible to lower the reflectance of laser light and increase the amount of heat absorbed by the copper foil. Also, the surface roughness can be adjusted in the same manner.
  • such a plated surface can be formed on a copper foil sample to measure the amount of heat, which can be used to manage the surface characteristics of the copper foil in the production process.
  • the hole diameter of the copper foil there is a correlation between the hole diameter of the copper foil and the amount of heat absorbed by the copper foil as shown in FIG. Therefore, if the amount of heat absorbed is large, the hole diameter can be increased. Therefore, the sample of copper foil is irradiated with a small amount of laser light, and the amount of heat absorbed by the metal foil is measured. The hole diameter of the foil can be adjusted.
  • the sample of copper foil is irradiated with a small amount of laser light, the amount of heat absorbed by the metal foil is measured, and the calorific value determines the amount of heat corresponding to the required hole diameter of the metal foil.
  • Surface characteristics of the metal foil can also be adjusted.
  • the metal foil c used there is a large effect that the quality control of drilling of the copper foil can be easily, for example in terms of the copper foil, it can be applied to any of the electrolytic copper foil or rolled copper foil.
  • the thickness of the copper foil can be applied to less than 1 8 used as high density wiring.
  • the present invention is not limited to the thickness of such a metal foil, and naturally, it can be applied to a thickness greater than this.
  • These layers can be produced by plating.
  • the present invention is not limited to plating, and deposition, sputtering, and other coating methods can also be used.
  • the layer formed by the plating or the like can be partially or entirely applied to the laser beam irradiated surface of the metal foil. It goes without saying that these plating treatments and the like do not impair the characteristics of the copper foil applied to the circuit board, and the treatment of the present invention sufficiently satisfies these conditions.
  • a small amount of laser light is irradiated to a copper foil sample in advance, the amount of heat absorbed by the metal foil is measured, and the hole diameter of the copper foil by the laser is measured by this calorific value. Since it can be adjusted, it is possible to know in advance the optimum laser light output.
  • the hole diameter of the metal foil by the laser and the amount of heat absorbed by the metal foil have a similar relationship. That is, if the amount of heat absorbed is large, the hole diameter can be increased. Therefore, a small amount of laser light is irradiated to the sample of the metal foil in advance, the amount of heat absorbed by the metal foil is measured, and the diameter of the hole of the metal foil can be adjusted by the laser measurement value.
  • a metal foil sample is irradiated with a small amount of laser light, the amount of heat absorbed by the metal foil is measured, and the calorific value is used to determine the amount of heat corresponding to the required hole diameter of the metal foil. Can also control the surface characteristics of the metal foil.
  • the copper foil sample is irradiated with a small amount of laser light in advance, the amount of heat absorbed by the metal foil is measured, and the calorific value can be used to adjust the hole diameter of the copper foil by the laser.
  • the optimum laser-to-light output can be known in advance.
  • the method of measuring the calorific value of metal foil the method of adjusting the surface characteristics of metal foil, the method of laser perforating metal foil, and the preferable apparatus for measuring the calorimeter of metal foil for laser drilling used for this purpose It has the excellent feature of being able to efficiently form the interlayer connection holes (through holes) of the high-quality printed circuit board.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
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  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
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  • Laser Beam Processing (AREA)
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Abstract

A method for measuring amount of heat in metal foils wherein a small amount of laser light is directed to a metal foil and the amount of heat absorbed by the metal foil is measured by a sensor disposed on the back surface of the metal foil is disclosed. It is also disclosed an apparatus for measuring amount of heat in metal foils comprising a laser light introducing pipe having a light-reflective inner surface; a unit for placing a metal foil, which is subjected to measurement of amount of heat, on the bottom portion of the laser light introducing pipe; and a sensor for measuring amount of heat, which is in close contact with the back surface of the metal foil. A method for forming a small interlayer connection hole (through hole) in a printed circuit board wherein the amount of heat in a metal foil is measured for efficiently forming the interlayer connection hole and drilling with a laser can be conducted easily is disclosed. The resulting small interlayer connection hole (through hole) is excellent in quality and stable. An apparatus used therefor is also disclosed.

Description

明 細 書 金属箔の熱量測定方法、 表面特性の調整方法、 レーザー穴開け方法又は熱量 測定装置 技術分野  Description Method of measuring heat of metal foil, method of adjusting surface characteristics, laser drilling method or heat measuring device
本発明は、 金属箔に照射された微量のレーザ一光の吸収熱量を測定する技 術に関し、 この測定された熱量を利用して、 特にプリント回路基板の層間接 続孔 （スルーホール） を形成するために必要とされる金属箔の表面特性の調 整及び金属箔のレーザー穴開け等を効率良く行なうことができる方法及び このために使用する好適な金属箔の熱量測定装置に関する。  The present invention relates to a technique for measuring the amount of heat absorbed by a small amount of laser light emitted to a metal foil, and in particular, a layer indirect through hole (through hole) of a printed circuit board is formed using this measured heat amount. The present invention relates to a method capable of efficiently performing adjustment of the surface characteristics of metal foil and laser drilling of metal foil which are required for the purpose, and a suitable metal foil calorimeter for use for this.
なお、 本発明の金属箔は銅箔、 アルミニウム箔等を対象とするが、 これら の金属箔それ自体のみならず、 金属箔の積層板あるいは積層板に直接金属を めっきした箔等の全てを含むものとする。 背景技術  Although the metal foil of the present invention is intended for copper foil, aluminum foil, etc., not only the metal foil itself but also a laminated plate of metal foil or all foils plated with metal directly on the laminated plate, etc. It shall be Background art
従来、 プリント回路基板の層間に接続用の小径孔 （スルーホール） を形成 するのにドリルが使用されてきたが、 ドリルによる加工 （穴開け） ではバリ が発生し易く、 また微小径の開口には限界があるため、 近年レーザーによる 開口法が使用されるようになってきた。  Conventionally, drills have been used to form small-diameter holes (through holes) for connection between printed circuit board layers, but burrs are easily generated during drilling (drilling), and small diameter openings are formed. In recent years, the laser aperture method has come to be used because of its limitations.
しかしながら、 従来のプリント回路基板に使用される銅箔等 （以下につい ては、 主として銅箔について説明するが、 銅箔に限定するものではない。 ） の表面は反射率が大きいため、 レーザー光に対する加工性が悪いという欠点 があり、 このため所定の銅箔部をエッチング除去し、 そこにレーザー光を照 射して穴開けする方法を用いたり、 銅箔を化学研磨等により薄層化した後に レーザ一加工する方法が採用されている。  However, the surface of a copper foil or the like used for a conventional printed circuit board (the copper foil will be mainly described below, but is not limited to the copper foil) has a large reflectance, so the laser light There is a disadvantage that the processability is poor. Therefore, after a predetermined copper foil portion is etched and removed, laser light is irradiated and drilled there, or the copper foil is thinned by chemical polishing or the like. A laser-machining method is employed.
しかし、 この場合、 銅箔のエッチング除去又は化学研磨という工程が入る ため能率が悪く、 またこのような処理操作の厳密な管理が必要なため、 生産 性が悪くなりコ.スト高になるという欠点があった。 このようなことから、 銅箔の表面にレーザー光が反射されずに吸収し易い 材料をめつきしたり、 あるいは銅箔又はめつき面の表面を粗面にして、 レー ザ一光による銅箔の穴開け性を向上させることが行なわれている （特許第 3 2 5 8 3 0 8号公報参照） 。 However, in this case, the process of etching removal or chemical polishing of the copper foil is inefficient, and the strict control of such processing operations is required, resulting in poor productivity and cost increase. was there. Because of this, the surface of the copper foil may be covered with a material that is likely to be absorbed without reflection of laser light, or the surface of the copper foil or the mounting surface may be roughened. It has been carried out to improve the drilling ability of (see Patent No. 3 5 5 8 30 8).
しかし、 銅箔の表面性状を決定するための適当な評価あるいは管理するた めの有効な方法がなく、 すでに生産されている銅箔又はめつき面から、 経験 的にレーザーの穴開け性の良否を決め、 それに対応した銅箔の製造又はめつ き処理を行なっていた。  However, there is no appropriate method for evaluating or controlling the surface properties of copper foil, and empirically, it is empirically found that the drilling ability of the laser is good or not from the copper foil or plated surface which has already been produced. And copper foils were manufactured or treated accordingly.
このような従来の方法は、 求められる商品種類が変化した場合には、 迅速 な対応ができない。また、 レーザー光による穴径が変化した場合等において、 レーザー出力等を迅速に調整することができず、 経験で行なわざるを得なか つ 7こ。  Such conventional methods can not respond quickly when the type of product required changes. In addition, when the hole diameter is changed by laser light, laser output etc. can not be adjusted quickly, and it is necessary to do it by experience7.
以上から、 従来は品質に優れ安定したプリン卜回路基板の層間に接続用の 小径孔 （スル一ホール） を形成することができないと言う問題があった。 発明の開示】  From the above, conventionally, there has been a problem that it is not possible to form a small diameter hole (through hole) for connection between layers of a high quality and stable printed circuit board. Disclosure of the Invention]
本発明は上記のような問題点に鑑みてなされたものであり、 その目的とす るところは、 金属箔に照射された微量のレーザ一光の吸収熱量を測定する技 術を提供し、 この測定された熱量を利用して、 特にプリント回路基板の層間 接続孔 （スルーホール） を形成するために必要とされる金属箔の表面特性の 調整及び金属箔のレーザー穴開け等を効率良く行なうことができる方法及 びこのために使用する好適な金属箔の熱量測定装置を提供するものである。 以上から、 本発明は  The present invention has been made in view of the above problems, and its object is to provide a technique for measuring the amount of heat absorbed by a small amount of laser beam emitted to a metal foil. Using the measured heat quantity, efficiently adjust the surface characteristics of the metal foil, which is required particularly for forming the interlayer connection holes (through holes) of the printed circuit board, and perform laser drilling of the metal foil, etc. And a suitable metal foil calorimeter for this purpose. From the above, the present invention
1 . 金属箔に微量のレーザ一光を照射し、 金属箔の裏面に設けたセンサーに より、 金属箔が吸収する熱量を測定することを特徴とする金属箔の熱量測定 方法  1. A metal foil is irradiated with a small amount of laser light, and the amount of heat absorbed by the metal foil is measured by a sensor provided on the back of the metal foil.
2 .金属箔に微量のレーザー光を照射し、金属箔が吸収する熱量を測定して、 この熱量測定値により金属箔の光沢度、 表面粗さ等の表面特性を調整するこ とを特徴とする金属箔の表面特性の調整方法 3 .金属箔に微量のレーザ一光を照射し、金属箔が吸収する熱量を測定して、 この熱量測定値によりレーザー穴開けの際の、 金属箔の穴径を調節すること を特徴とする金属箔のレーザー穴開け方法 2. The metal foil is irradiated with a small amount of laser light, the amount of heat absorbed by the metal foil is measured, and the calorific value is used to adjust the surface characteristics such as the glossiness and surface roughness of the metal foil. Method of adjusting surface characteristics of metal foil 3. The metal foil is irradiated with a small amount of laser light, the amount of heat absorbed by the metal foil is measured, and the calorific value is used to adjust the hole diameter of the metal foil at the time of laser drilling. Laser drilling method of metal foil
4 . 金属箔が吸収する熱量と光沢度の相関から金属箔の光沢度を調整するこ とを特徵とする上記 2又は 3に記載の金属箔の表面特性の調整方法又は金 属箔のレーザ一穴開け方法  4. The method for adjusting the surface characteristics of metal foils according to 2 or 3 or the laser according to metal foils described in the above 2 or 3, which is characterized by adjusting the gloss of the metal foil from the correlation between the heat quantity absorbed by the metal foil and the degree of gloss. How to make a hole
5 . 金属箔が吸収する熱量と表面粗さの相関から金属箔の表面粗さを調整す ることを特徴とする上記 2又は 3に記載の金属箔の表面特性の調整方法又 は金属箔のレーザー穴開け方法  5. The method for adjusting the surface characteristics of the metal foil or the method according to 2 or 3 above, characterized in that the surface roughness of the metal foil is adjusted from the correlation between the amount of heat absorbed by the metal foil and the surface roughness. Laser drilling method
6 . 金属箔が吸収する熱量とドリリングの穴径の相関から金属箔の穴径を調 整することを特徴とする上記 2又は 3に記載の金属箔の表面特性の調整方 法又は金属箔のレーザー穴開け方法  6. The method for adjusting the surface characteristics of the metal foil or the method according to 2 or 3 above, characterized in that the hole diameter of the metal foil is adjusted from the correlation between the amount of heat absorbed by the metal foil and the hole diameter of drilling. Laser drilling method
7 . 金属箔が銅箔であることを特徴とする上記 1〜6のそれぞれに記載の金 属箔の熱量測定方法、 表面特性の調整方法又はレーザー穴開け方法 7. The method of measuring heat of metal foil according to each of the above 1 to 6, wherein the metal foil is a copper foil, the method of adjusting surface characteristics or the method of laser drilling
8 . 金属箔のレーザー光照射面にめっき層を備えることを特徴とする上記 1 〜 7のそれぞれに記載の金属箔の熱量測定方法、 表面特性の調整方法又はレ 一ザ一穴開け方法 8. A method of measuring heat of a metal foil according to each of the above 1 to 7, characterized in that a plating layer is provided on the laser beam irradiated surface of the metal foil, a method of adjusting surface characteristics or a method of drilling a laser.
9 . 内面に光反射面を持つレーザー光導入管、 このレーザー光導入管の底部 に、 熱量を測定するための金属箔を設置するための装置及びこの金属箔の裏 面に密着させて熱量を測定するセンサーを備えることを特徴とする金属箔 9. A laser light introducing tube having a light reflecting surface on the inner surface, a device for installing a metal foil for measuring the heat quantity at the bottom of the laser beam introducing tube, and a heat quantity attached to the back surface of the metal foil. Metal foil characterized by having a sensor to measure
1 0 . 熱量を測定する金属箔がレーザ一穴開け用金属箔であることを特徴と する上記 9記載の熱量測定装置 10. The calorimeter according to the above 9 characterized in that the metal foil for measuring the heat quantity is a metal foil for laser drilling.
1 1 . 内面に光反射面を持つレーザー光導入管、 このレーザー光導入管の底 部に、 熱量を測定するための金属箔を設置するための装置及びこの金属箔の 裏面に密着させて熱量を測定するセンサ一を備えることを特徴とする上記 1〜.8のそれぞれに記載の金属箔の熱量測定方法、 表面特性の調整方法、 レ 一ザ一穴開け方法に用いる熱量測定装置  1 1. A laser beam introducing tube having a light reflecting surface on the inner surface, a device for installing a metal foil for measuring the amount of heat at the bottom of the laser beam introducing tube, and a heat amount attached to the back surface of the metal foil. A method of measuring the calorific value of the metal foil as described in each of the above 1 to .8, characterized in that the method of adjusting the surface characteristics,
を提供する。 図面の簡単な説明 I will provide a. Brief description of the drawings
図 1は、 本発明の熱量測定装置を示す断面説明図である。 図 2は、 銅箔の 光沢度と熱量の相関を示す図である。 図 3は、 銅箔の表面粗さ （R z ) と熱 量との相関を示す図である。 図 4は、 銅箔の穴径と銅箔が吸収する熱量の相 関を示す図である。 発明の実施の形態  FIG. 1 is a cross-sectional explanatory view showing a calorimeter of the present invention. FIG. 2 is a graph showing the correlation between the gloss of a copper foil and the amount of heat. FIG. 3 is a view showing the correlation between the surface roughness (R z) of the copper foil and the amount of heat. FIG. 4 is a graph showing the correlation between the hole diameter of the copper foil and the amount of heat absorbed by the copper foil. Embodiment of the Invention
本発明は、 金属箔例えば銅箔のサンプルを予め作製し、 この銅箔を本発明 のレーザー穴開け用金属箔の熱量測定装置内にセットする。  In the present invention, a sample of metal foil, for example, copper foil, is prepared in advance, and this copper foil is set in the calorimeter of the metal foil for laser drilling of the present invention.
この銅箔の熱量測定装置は、 図 1に示すように、 内面に光反射面を持つレ 一ザ一光導入管 1、 このレーザー光導入管 1の低部に銅箔 2を設置し、 銅箔 2の裏面に密着させて熱量を測定するセンサ一 3が設けられている。 符号 4 は炭酸ガスレーザー光を示す。  As shown in FIG. 1, this copper foil calorimeter is provided with a laser light introducing tube 1 having a light reflecting surface on the inner surface, and a copper foil 2 installed at the lower part of the laser light introducing tube 1 A sensor 13 is provided which is in close contact with the back of the foil 2 to measure the amount of heat. The code | symbol 4 shows a carbon dioxide gas laser beam.
銅箔 2はセンサ一 3に密着させ、 エアギャップがないようにする。 エアギ ヤップがあると熱量測定の精度は低下する。  Make sure that the copper foil 2 is in close contact with the sensor 13 so that there is no air gap. The presence of an air gap reduces the accuracy of the heat measurement.
また、 レーザー光導入管 1の内面を光反射面とすることにより、 レーザー 光導入管からの熱の逸散が防止できる。 レーザー光導入管からの熱の逸散は， レーザー光導入管の内面に接触するエアの流動だけであり、 その量は小さい t また、 銅箔 2のエッジから流出する熱量は、 銅箔が薄いので、 その量は無 視できるほど少ない。 In addition, by making the inner surface of the laser light introducing tube 1 a light reflecting surface, it is possible to prevent heat dissipation from the laser light introducing tube. The heat dissipation from the laser beam introduction tube is only the flow of air in contact with the inner surface of the laser beam introduction tube, and the amount is small t The amount of heat released from the edge of the copper foil 2 is that the copper foil is thin So the amount is small enough to ignore.
このような装置を使用して、 銅箔に微量のレーザー光を照射し、 銅箔が吸 収する熱量を測定する。  Using such an apparatus, the copper foil is irradiated with a small amount of laser light, and the amount of heat absorbed by the copper foil is measured.
銅箔の光沢度と熱量の関係を図 2に示す。 図 2に示すように、 光沢度が大 きくなるに従って、 銅箔が吸収する熱量は小さくなる。  The relationship between the copper foil's glossiness and heat quantity is shown in Fig.2. As shown in FIG. 2, as the degree of gloss increases, the amount of heat absorbed by the copper foil decreases.
また、 図 3に示すように、 銅箔の表面粗さ （R z ) と熱量とには相関があ り、 表面粗さを大きくすることによって、 銅箔の吸収する熱量を上げること ができる。したがって、これらの熱量測定値により銅箔の表面特性（光沢度、 表面粗さ） を調整することができる。 一般に、 銅箔の少なくともレーザー光を照射してプリント回路基板の層間 接続孔を形成する位置に、 インジウム、 錫、 コバルト、 亜鉛、 コバルト合金 及びニッケル合金のいずれか一種以上を含有する層を形成し、 めっき面を黒 化することによって、 レーザー光の反射率を下げ、 銅箔が吸収する熱量を大 きくすることができる。 また、 表面粗さも同様に調整できる。 Further, as shown in FIG. 3, there is a correlation between the surface roughness (R z) of the copper foil and the heat quantity, and the heat quantity absorbed by the copper foil can be increased by increasing the surface roughness. Therefore, the surface characteristics (gloss, surface roughness) of the copper foil can be adjusted by these calorific values. Generally, a layer containing at least one of indium, tin, cobalt, zinc, cobalt alloy and nickel alloy is formed at a position where at least laser light of copper foil is irradiated to form an interlayer connection hole of a printed circuit board. By blackening the plating surface, it is possible to lower the reflectance of laser light and increase the amount of heat absorbed by the copper foil. Also, the surface roughness can be adjusted in the same manner.
したがって、 銅箔のサンプルに、 このようなめっき面を形成して熱量を測 定し、 生産工程における銅箔の表面特性の管理に利用することができる。 一方、 レーザ一による銅箔の穴径と銅箔が吸収する熱量には、 図 4に示す ように相関がある。 吸収する熱量が大きいと穴径を大きくすることができる < したがって、 銅箔のサンプルに微量のレーザー光を照射し、 金属箔が吸収 する熱量を測定して、 この熱量測定値によりレーザーによる銅箔箔の穴径を 調節することができる。  Therefore, such a plated surface can be formed on a copper foil sample to measure the amount of heat, which can be used to manage the surface characteristics of the copper foil in the production process. On the other hand, there is a correlation between the hole diameter of the copper foil and the amount of heat absorbed by the copper foil as shown in FIG. Therefore, if the amount of heat absorbed is large, the hole diameter can be increased. Therefore, the sample of copper foil is irradiated with a small amount of laser light, and the amount of heat absorbed by the metal foil is measured. The hole diameter of the foil can be adjusted.
他方、 銅箔のサンプルに微量のレーザー光を照射し、 金属箔が吸収する熱 量を測定して、 この熱量測定値により、 必要とする金属箔の穴径に対応する 熱量を求め、 この熱量から金属箔の表面特性を調整することもできる。 これ によって、 銅箔の穴開けの品質管理が容易にできるという大きな効果がある c 使用する金属箔は、 例えば銅箔で言えば、 電解銅箔又は圧延銅箔のいずれ にも適用できる。 また、 銅箔の厚みは高密度配線として使用する 1 8 以 下のものにも適用できる。 但し、 本発明はこのような金属箔の厚さに制限さ れるわけではなく、 これ以上の厚さにも当然適用できるものである。 On the other hand, the sample of copper foil is irradiated with a small amount of laser light, the amount of heat absorbed by the metal foil is measured, and the calorific value determines the amount of heat corresponding to the required hole diameter of the metal foil. Surface characteristics of the metal foil can also be adjusted. Thus, the metal foil c used there is a large effect that the quality control of drilling of the copper foil can be easily, for example in terms of the copper foil, it can be applied to any of the electrolytic copper foil or rolled copper foil. In addition, the thickness of the copper foil can be applied to less than 1 8 used as high density wiring. However, the present invention is not limited to the thickness of such a metal foil, and naturally, it can be applied to a thickness greater than this.
これらの層はめつき処理することにより製造することができる。 しかし、 めっきに限定されるものではなく、 蒸着やスパッタリング、 その他の被覆方 法を用いることもできる。  These layers can be produced by plating. However, the present invention is not limited to plating, and deposition, sputtering, and other coating methods can also be used.
これらのめっき等により形成される層は、 金属箔のレーザー光照射面へ部 分的に又は銅箔全面に施すことができる。 これらのめっき処理等は、 回路基 板に適用される銅箔としての特性を損なわないことが要求されるのは当然 であり、 本発明の処理はこれらの条件を十分に満たしている。 一般に、 低い開口率の場合に、 穴開けの際のレーザー出力 （エネルギー） を高くすることにより開口率を上げることは可能である。 しかし、 このレー ザ一エネルギーを必要以上に上げると、 基板 （積層板） の樹脂部分へのダメ ージが大きくなり、 銅箔 （層） の穴の径よりも樹脂の穴の径が大きくなると いった現象が起きる。 The layer formed by the plating or the like can be partially or entirely applied to the laser beam irradiated surface of the metal foil. It goes without saying that these plating treatments and the like do not impair the characteristics of the copper foil applied to the circuit board, and the treatment of the present invention sufficiently satisfies these conditions. In general, in the case of a low aperture ratio, it is possible to increase the aperture ratio by increasing the laser power (energy) at the time of drilling. However, if this laser energy is increased more than necessary, damage to the resin part of the substrate (laminate) will increase, and if the diameter of the resin hole is larger than the diameter of the copper foil (layer) hole. The phenomenon that
このように樹脂の穴が大きくなると、 穴の底部で樹脂と銅箔 （層） の剥離 が発生するなど、 レーザー穴開けの品質が低下、 またこのような品質低下を 防止するために処理条件の厳密な管理が必要となり、 工程や処理操作が複雑 化するなどの大きな問題となる。  When the resin hole becomes large in this way, peeling of the resin and copper foil (layer) occurs at the bottom of the hole, and the quality of laser drilling is reduced. Also, in order to prevent such deterioration, processing conditions Strict control is required, which leads to major problems such as process and processing operations becoming complicated.
しかし、 本発明のように、 事前に銅箔のサンプルに微量のレーザー光を照 射し、 金属箔が吸収する熱量を測定して、 この熱量測定値によりレーザーに よる銅箔箔の穴径を調整することができるので、 最適なレーザ一光出力を事 前に知ることができる。  However, as in the present invention, a small amount of laser light is irradiated to a copper foil sample in advance, the amount of heat absorbed by the metal foil is measured, and the hole diameter of the copper foil by the laser is measured by this calorific value. Since it can be adjusted, it is possible to know in advance the optimum laser light output.
したがって、 より品質に優れたプリント回路基板の層間接続孔 （スルーホ ール） を効率良く形成することができる特徴を有する。 発明の効果 '  Therefore, it has the feature of being able to efficiently form through holes (through holes) in the printed circuit board with higher quality. Effect of the invention '
金属箔の光沢度と熱量とには相関があり、 光沢度が大きくなるに従って金 属箔が吸収する熱量は小さくなる。 また、 金属箔の表面粗さ （R z ) と熱量 とにも相関があり、 表面粗さを大きくすることによって、 金属箔の吸収する 熱量を上げることができる。  There is a correlation between the gloss of the metal foil and the amount of heat, and the amount of heat absorbed by the metal foil decreases as the gloss increases. There is also a correlation between the surface roughness (R z) of the metal foil and the amount of heat, and the amount of heat absorbed by the metal foil can be increased by increasing the surface roughness.
これらを、 本発明の熱量測定装置により、 簡便な方法で事前に知ることに より、 レーザー光を照射してプリント回路基板の層間接続孔を形成する際の 品質管理に大きな影響を与え、 金属箔の表面特性 （光沢度、 表面粗さ） を的 確に調整し、 安定したレーザー穴開け用金属箔を製造できる。  By knowing these in advance by a simple method with the calorimeter of the present invention, it greatly affects the quality control when forming the interlayer connection hole of the printed circuit board by irradiating the laser light, metal foil By adjusting the surface characteristics (gloss, surface roughness) precisely, it is possible to produce a stable metal foil for laser drilling.
また、 レーザーによる金属箔の穴径と金属箔が吸収する熱量には同様に相 関がある。 すなわち、 吸収する熱量が大きいと穴径を大きくすることができ る。 したがって、 事前に金属箔のサンプルに微量のレーザー光を照射し、 金属 箔が吸収する熱量を測定して、 この熱量測定値によりレーザーによる金属箔 の穴径を調整することができる。 In addition, the hole diameter of the metal foil by the laser and the amount of heat absorbed by the metal foil have a similar relationship. That is, if the amount of heat absorbed is large, the hole diameter can be increased. Therefore, a small amount of laser light is irradiated to the sample of the metal foil in advance, the amount of heat absorbed by the metal foil is measured, and the diameter of the hole of the metal foil can be adjusted by the laser measurement value.
他方、 金属箔のサンプルに微量のレーザー光を照射し、 金属箔が吸収する 熱量を測定して、 この熱量測定値により、 必要とする金属箔の穴径に対応す る熱量を求め、 この熱量から金属箔の表面特性を制御することもできる。 また、 事前に銅箔のサンプルに微量のレーザー光を照射し、 金属箔が吸収 する熱量を測定して、 この熱量測定値によりレーザ一による銅箔箔の穴径を 調整することができるので、 最適なレーザ一光出力を事前に知ることができ る。  On the other hand, a metal foil sample is irradiated with a small amount of laser light, the amount of heat absorbed by the metal foil is measured, and the calorific value is used to determine the amount of heat corresponding to the required hole diameter of the metal foil. Can also control the surface characteristics of the metal foil. In addition, the copper foil sample is irradiated with a small amount of laser light in advance, the amount of heat absorbed by the metal foil is measured, and the calorific value can be used to adjust the hole diameter of the copper foil by the laser. The optimum laser-to-light output can be known in advance.
以上から、本発明の金属箔の熱量測定方法、金属箔の表面特性の調整方法、 金属箔のレーザ一穴開け方法及びこのために使用する好適なレーザー穴開 け用金属箔の熱量測定装置は、 品質に優れたプリン卜回路基板の層間接続孔 (スルーホール） を効率良く形成することができるという優れた特徴を有す る。  From the above, the method of measuring the calorific value of metal foil, the method of adjusting the surface characteristics of metal foil, the method of laser perforating metal foil, and the preferable apparatus for measuring the calorimeter of metal foil for laser drilling used for this purpose It has the excellent feature of being able to efficiently form the interlayer connection holes (through holes) of the high-quality printed circuit board.

Claims

請 求 の 範 囲 1 . 金属箔に微量のレーザー光を照射し、 金属箔の裏面に設けたセンサー により、 金属箔が吸収する熱量を測定することを特徴とする金属箔の熱量測 定方法。 Scope of request 1. A method of measuring the heat of metal foil, characterized in that the metal foil is irradiated with a small amount of laser light, and the amount of heat absorbed by the metal foil is measured by a sensor provided on the back of the metal foil. .
2 . 金属箔に微量のレーザー光を照射し、 金属箔が吸収する熱量を測定し て、 この熱量測定値により金属箔の光沢度、 表面粗さ等の表面特性を調整す ることを特徴とする金属箔の表面特性の調整方法。  2. The metal foil is irradiated with a small amount of laser light, the amount of heat absorbed by the metal foil is measured, and the calorific value is used to adjust the surface characteristics such as the glossiness and surface roughness of the metal foil. Method of adjusting the surface characteristics of metal foils
3 . 金属箔に微量のレーザー光を照射し、 金属箔が吸収する熱量を測定し て、 この熱量測定値によりレーザ一穴開けの際の、 金属箔の穴径を調節する ことを特徴とする金属箔のレ一ザ一穴開け方法。  3. The metal foil is irradiated with a small amount of laser light, the amount of heat absorbed by the metal foil is measured, and the calorific value is used to adjust the hole diameter of the metal foil at the time of laser drilling. Method of drilling metal foil by laser.
4 . 金属箔が吸収する熱量と光沢度の相関から金属箔の光沢度を調整する ことを特徴とする請求の範囲第 2項又は第 3項記載の金属箔の表面特性の 調整方法又は金属箔のレーザー穴開け方法。  4. The method of adjusting the surface characteristics of the metal foil or the metal foil according to claim 2 or 3, wherein the gloss of the metal foil is adjusted from the correlation between the heat quantity absorbed by the metal foil and the degree of gloss. Laser drilling method.
5 . 金属箔が吸収する熱量と表面粗さの相関から金属箔の表面粗さを調整 することを特徴とする請求の範囲第 2項又は第 3項記載の金属箔の表面特 性の調整方法又は金属箔のレーザー穴開け方法。  5. The method for adjusting the surface characteristics of a metal foil according to claim 2 or 3, wherein the surface roughness of the metal foil is adjusted from the correlation between the heat quantity absorbed by the metal foil and the surface roughness. Or the laser drilling method of metal foil.
6 . 金属箔が吸収する熱量とドリリングの穴径の相関から金属箔の穴径を 調整することを特徴とする請求の範囲第 2項又は第 3項記載の金属箔の表 面特性の調整方法又は金属箔のレーザー穴開け方法。 6. The method for adjusting the surface characteristics of a metal foil according to claim 2 or 3, characterized in that the hole diameter of the metal foil is adjusted from the correlation between the amount of heat absorbed by the metal foil and the hole diameter of drilling. Or the laser drilling method of metal foil.
7 . 金属箔が銅箔であることを特徴とする請求の範囲第 1項〜第 6項のそ れぞれに記載の金属箔の熱量測定方法、 表面特性の調整方法又はレーザー穴 開け方法。  7. The method for measuring heat of metal foil, method for adjusting surface characteristics or laser drilling method according to any one of claims 1 to 6, wherein the metal foil is a copper foil.
8 . 金属箔のレーザー光照射面にめっき層を備えることを特徴とする請求 の範囲第 1項〜第 7項のそれぞれに記載の金属箔の熱量測定方法、 表面特性 の調整方法又はレーザー穴開け方法。  8. The method for measuring heat of metal foil, method for adjusting surface characteristics or laser drilling according to any one of claims 1 to 7, characterized in that a plating layer is provided on the laser beam irradiated surface of the metal foil. Method.
9 . 内面に光反射面を持つレーザ一光導入管、 このレーザー光導入管の底 部に、 熱量を測定するための金属箔を設置するための装置及びこの金属箔の 裏面に密着させて熱量を測定するセンサ一を備えることを特徴とする金属 箔の熱量測定装置。 9. A laser-light introduction tube having a light reflection surface on the inner surface, a device for installing a metal foil for measuring the heat quantity at the bottom of the laser light introduction tube, and a heat quantity attached to the back surface of the metal foil. A calorimeter of metal foil, comprising a sensor for measuring.
1 0 . 熱量を測定する金属箔がレーザー穴開け用金属箔であることを特徴 とする請求の範囲第 9項記載の熱量測定装置。 10. A calorimeter according to claim 9, wherein the metal foil for measuring the amount of heat is a metal foil for laser drilling.
1 1 . 内面に光反射面を持つレーザー光導入管、 このレーザー光導入管の 底部に、 熱量を測定するための金属箔を設置するための装置及びこの金属箔 の裏面に密着させて熱量を測定するセンサーを備えることを特徴とする請 求の範囲第 1項〜第 8項のそれぞれに記載の金属箔の熱量測定方法、 表面特 性の調整方法、 レーザー穴開け方法に用いる熱量測定装置。  1 1. A laser beam introducing tube having a light reflecting surface on the inner surface, a device for installing a metal foil for measuring the amount of heat at the bottom of the laser beam introducing tube, and the heat energy attached to the back of this metal foil. The method of measuring the heat of a metal foil according to each of claims 1 to 8, comprising a sensor to be measured, a method of adjusting surface characteristics, and a calorimeter for use in a laser drilling method.
PCT/JP2003/013709 2002-11-12 2003-10-27 Method for measuring amount of heat in metal foil, method for adjusting surface characteristics, laser drilling method, and apparatus for measuring amount of heat WO2004044568A1 (en)

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