200414851 狄、發明說明： [發明所屬之技術領域] 本發明係關於一種對於金屬箱上所照射之微量 收熱量進行敎之技術，並關於—種可_此_ …夏’來針對特別是印刷電路基板之層間連接孔（貫通孔 形成上所必須之金屬箱之表面特性進行高效率的調整並 =效率地進行雷射穿孔等之方法以及為了施行此方法所 便用之金屬箔之熱量測定裝置。 又’本發明之金屬箔雖以銅箔、鋁箔等為對象，惟 ^月不僅包括該等荡本身，亦包括所有的金屬箱之積層板 或是金屬直接鍍敷於積層板上之箔等。 [先前技術] /以往，為了在印刷電路基板之層間形成連接用之小直 杈孔（貫通孔）係使用著鑽頭，但鑽頭所進行之加工（穿孔）容 易發生毛邊，且微小直徑之開口有其極限，是以近年來乃 逐漸使用雷射開口法。 但是，以往之印刷電路基板所使用之銅箔等（以下主要 針對銅箔做說明，惟本發明並不侷限於銅箔）之表面的反射 率大’所以有對雷射光之加工性差之缺點，是以乃採用將 既疋之銅箔部分以蝕刻去除，然後對該處照射雷射光以進 仃穿孔之方法，或是將銅箔以化學研磨等來薄層化之後再 進行雷射加工之方法。 但是，前述情況下，必須加入銅箔之蝕刻去除或是化 學研磨此等製程，效率不佳，且必須對此等處理操作進行 200414851 嚴格的管理，所以生產性差且價格也高，是其缺點。 基於前述情況，乃對銅箱表面鑛敷上不易反射雷射光 反而容易吸收雷射光之材料，或是將銅箱或是鑛敷面之表 面予以粗化，藉以提昇雷射光對㈣之穿孔性（參見 利第3258308號公報）。 專 但是’並沒有用以決定銅落之表面性質之適當的評價 或是用以管理之有效的方法，而S 1 , 、 <令双扪万忐，而疋從已經生產之銅箔或鍍 敷面以經驗來決定雷射穿孔柯 +、疋由^職之良窥，來進行相對應之銅 箱的製造或是鍍敷處理。 前述習知方法’當需求產品種類出現變化的情況，益 法迅速地做因應。X，當雷射光所形成之孔徑變化的情況 :’無法迅速地調整雷射輸出’僅能以經驗法則來進行調 如上所述，以往未能形成品質優異、安定之印刷電路 土板之層間連接用的小直徑孔（貫通孔），是其問題。 [發明内容] +發明鑒於上述問題 々 η M W圾伢一種可對於 冷^戶斤照射之微量的雷射光之吸收熱量進行測定之技 路ίΓ供—種可利用此敎之熱量，來針對特別是印刷 土反之層間連接孔(貫通孔)的形成上所必須之金屬箔 又面特性進行高效率的調整並可高效率地進行雷射穿孔 方去以及為了施行此方法所使用之金屬落之熱量測定裝 基於以上情況，本發明係提供： 200414851 1·一種金屬箔之熱量測定方法，其特徵在於，對金屬 箔照射微量之雷射光，藉由金屬箔之背面所設置之感熱器 來測定金屬箔所吸收之熱量。 ° 2. —種金屬猪之表面特性之調整方法，其特徵在於， 對金屬箔照射微量之雷射光，測定金屬箔所吸收之熱量， 依據此熱量測定值來調整金屬箔之光澤度、表面粗度等之 表面特性。 3. -種金屬箱之雷射穿孔方法，其特徵在於，對金屬 箔照射微量之雷射光’測定金屬箔所吸收之熱量，依據此 熱篁測定值來調整雷射穿孔之際之金屬箔的孔徑。 4. 如上述2記載之金屬箔之表面特性之調整方法，係 由金屬箱所吸收之熱量與光澤度之相關性來調整金屬羯之 光澤度。 5. 如上述3記載之金屬箱之雷射穿孔方法，係由金屬 箱所吸收之熱量與光澤度之相關性來調整金屬猪之光澤度 〇 6. 如上述2 5己載之金屬箔之表面特性之調整方法，係 由金屬ϋ所吸收之熱量與表面粗度之相關性來調整金屬荡 之表面粗度。 7·如上述3記載之金屬羯之雷射穿孔方法，係由金屬 箔所吸收之熱量與表面粗度之相關性來調整金屬箔之表面 粗度。 8·如上述2 δ己載之金屬箱之表面特性之調整方法，係 由金屬泊所吸收之熱量與鑽頭孔徑之相關性來調整金屬箔 200414851 之孔徑。 9’如上述3纪載之金屬箔之雷射穿孔方法，係由金屬 羯所吸收之熱量與鑽頭孔徑之相關性來調整金μ之孔徑 10·如上述1記載之金屬箔 屬猪為銅箱。 之熱量測定方法，其中，金 11·如上述2記載之金屬箔之表面特性之調整方法，其 中，金屬箔為銅箔。 12_如上述3記載之金屬箔之雷射穿孔方法，其中，金 屬猪為銅箱。 如上述1或1 〇 §己載之金屬箔之熱量測定方法，其 中’金屬、冶之雷射光照射面具備鑛敷層。 14_如上述2、4、6或8記載之金屬落之表面特性之調 整方法，其中，金屬络之雷射光照射面具備鍍敷層。 15.如上述3、5、7或9記載之金屬箔之雷射穿孔方法 ’其中’金屬箔之雷射光照射面具備鍍敷層。 16· —種金屬之熱量測定裝置，其特^在於，具備： 内面具有光反射面之雷射光導人管、用以對該雷射光導入 管之底部設置熱量測定對象之金屬箱的袭置、以及與金屬 箔之背面密合而可測定熱量之感熱器。 其中，受熱量測 箱）之樣品，將此 17 ·如上述16記載之熱量測定裝置 定之金屬箔為雷射穿孔用金屬箔。 [實施方式] 本發明係事先製作出金屬箔（例如鋼 200414851 銅ί自安置於本發明之雷射穿孔用金屬箔之熱量測定裝置内 〇 此銅猪之熱量測定裝置，如圖丨所示般，設置有··内 面具備光反射面之雷射光導入管i(底部設有銅箔2)以及與 銅箔2之背面密合而可測定熱量之感熱器3。符號4係表 不 '一氧化雷射光。 銅/1 2係岔合於感熱器3 ,中間並無空氣間隔。若存 在著空氣間隔則熱量測定之精度會降低。 又，藉由將雷射光導入管丨之内面做成光反射面，則 可防止熱量自雷射光導入管散失。熱量自雷射光導入管之 散失僅有與雷射光導入管内面接觸之空氣的流動，其量甚 少〇 又，由於銅箔2很薄，所以自銅箔2之邊緣所流出之 熱量可忽視不計。 使用前述裝置，對銅落照射微量之雷射光，測定銅箔 所吸收之熱量。 銅箱之光澤度與熱量之關係如圖2所示。圖2中顯示 光澤度愈高銅箔所吸收之熱量愈少。 又，如圖3所示般，銅箱之表面粗度（Rz)與熱量有相 關性，表面粗度愈大’則銅箔所能吸收之熱量愈多。是以 ’藉由此等熱量測定值可對銅落之表面特性（光澤度、表面 粗度）進行調整。 般，可至少於銅箔之照射雷射光來形成印刷電路基 板之層間連接孔的位置形成含有銦、錫、鈷十鈷合金 200414851 以及鎳合金中至少一種的層體，將鍍敷面予以黑化來降低 雷射光反射率，增加銅箔所吸收之熱量。X，表面粗度亦 可同樣地進行調整。 疋X可於鋼箔之樣品形成此種鍍敷面並測定熱量， 利用於生產製程中之銅箔的表面特性之管理上。 另一方面，雷射所形成之銅箔之孔徑與銅箔所吸收之 熱量有圖4所示之相關性。吸收熱量愈多則孔徑可愈大。 是以，可對鋼箱樣品照射微量之雷射光，測定金屬荡 所吸收之熱量，利用此熱量測定值來調整雷射所形成之銅 箔之孔徑。 另-方面，亦可對銅箱樣品照射微量之雷射光，測定 金屬箱所吸收之熱量，_此熱量測定值，算出與所需金 屬猪之孔徑相對應之熱量，從該熱量來調整金屬箱之表面 特性。藉此，彳簡單進行㈣之穿孔的品質管理，此為一 大效果。 ”所使用之金屬4，若以銅箱而言，可使用電解銅落或200414851 D. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a technique for performing a small amount of heat radiated on a metal box, and relates to-a kind of _this_ ... Xia 'to target printed circuits in particular The interlayer connection holes of the substrate (the surface characteristics of the metal box necessary for the formation of the through-holes are adjusted with high efficiency and the method of efficient laser perforation, etc., and the heat measurement device of the metal foil used to implement this method. Also, although the metal foil of the present invention is targeted at copper foil, aluminum foil, etc., the month includes not only the oscillation itself, but also all laminated plates of metal boxes or foils directly plated with metal on the laminated plates. [Prior art] / In the past, a drill was used to form a small straight branch hole (through hole) for connection between layers of a printed circuit board. However, the processing (perforation) of the drill is prone to burrs, and the openings with small diameters have The limit is the laser opening method that has been gradually used in recent years. However, copper foils used in printed circuit boards in the past (the following are mainly for copper foil) It is clear that the present invention is not limited to copper foil. The surface has a high reflectivity. Therefore, it has the disadvantage of poor processability to laser light. Therefore, the existing copper foil portion is removed by etching and then irradiated there. Laser light is used for perforation, or copper foil is thinned by chemical polishing, etc., and then laser processing is performed. However, in the foregoing case, copper foil must be etched away or chemically polished. The manufacturing process is not efficient, and these processing operations must be strictly managed by 200414851, so poor productivity and high price are its disadvantages. Based on the foregoing, it is difficult to reflect the laser light on the surface of the copper box, but it is easy to absorb The material of the laser light, or the surface of the copper box or the ore-covered surface, is roughened, so as to improve the perforation of the laser light to the concrete (see Bulletin No. 3258308). It is not used to determine the copper drop. Appropriate evaluation of the surface properties or effective methods for management, and S 1, < make a lot of mistakes, and 疋 decide empirically from the copper foil or plated surface that has been produced The perforation ke + and 疋 are used to make the corresponding copper box manufacturing or plating. The aforementioned conventional method 'When the type of the required product changes, Yifa quickly responds. X When the aperture formed by laser light changes: 'Cannot quickly adjust the laser output', it can only be adjusted based on the rule of thumb. As mentioned above, in the past, it has not been possible to form a high-quality, stable printed circuit soil board for interlayer connection. [Summary of the invention] + In view of the above problems, 发明 MW waste is a technical method that can measure the absorbed heat of a small amount of laser light irradiated by cold households. -A kind of heat that can be used to efficiently adjust the surface characteristics of the metal foil, which is necessary for the formation of interlayer connection holes (through holes), especially for printing soil, and to efficiently perform laser perforation. And the heat measurement device for metal falling used for implementing this method Based on the above, the present invention provides: 200414851 1. A method for measuring the heat of metal foil, characterized in that Trace metal foil is irradiated with the laser beam, is provided by sensible heat of the back surface of the metal foil is determined absorbed heat of the metal foil. ° 2. —A method for adjusting the surface characteristics of a metal pig, which is characterized by irradiating a small amount of laser light to a metal foil, measuring the heat absorbed by the metal foil, and adjusting the gloss and surface roughness of the metal foil based on the heat measurement value. Surface characteristics. 3. A laser perforation method for a metal box, characterized in that a small amount of laser light is irradiated on the metal foil to measure the heat absorbed by the metal foil, and the metal foil at the time of the laser perforation is adjusted based on the measured value of the thermal threshold. Aperture. 4. The method for adjusting the surface characteristics of the metal foil as described in 2 above, is to adjust the gloss of the metal tin by the correlation between the heat absorbed by the metal box and the gloss. 5. The laser perforation method of the metal box as described in 3 above, is to adjust the glossiness of the metal pig by the correlation between the heat absorbed by the metal box and the gloss. The method of adjusting the characteristics is to adjust the surface roughness of the metal slab by the correlation between the heat absorbed by the metal grate and the surface roughness. 7. The method of laser perforation of metal tin as described in 3 above, the surface roughness of the metal foil is adjusted by the correlation between the heat absorbed by the metal foil and the surface roughness. 8. The method for adjusting the surface characteristics of the metal box with 2 δ load as described above is to adjust the aperture of the metal foil 200414851 by the correlation between the heat absorbed by the metal poise and the aperture of the drill. 9 'The method of laser perforation of the metal foil contained in the above three periods is to adjust the aperture of gold μ according to the correlation between the heat absorbed by the metal grate and the drill's hole diameter. 10. The metal foil as described in 1 above is a copper box. . The method for measuring the calorific value is gold 11. The method for adjusting the surface characteristics of the metal foil as described in the above 2, wherein the metal foil is a copper foil. 12_ The laser perforation method for metal foil as described in 3 above, wherein the metal pig is a copper box. As described in 1 or 10 above, the method for measuring the calorific value of the already-laden metal foil, wherein the laser light irradiation surface of the 'metal and metallurgy is provided with a mineral coating. 14_ The method for adjusting the surface characteristics of a metal drop as described in 2, 4, 6, or 8 above, wherein the laser light irradiation surface of the metal network is provided with a plating layer. 15. Laser perforation method for metal foil according to 3, 5, 7, or 9 above, wherein the laser light irradiation surface of the metal foil is provided with a plating layer. 16. A heat measurement device for a metal, comprising: a laser light guide tube having a light reflecting surface on the inner surface; a metal box for installing a heat measurement object on the bottom of the laser light introduction tube; And a heat sensor which can be closely adhered to the back surface of the metal foil to measure heat. Among them, the sample of heat-receiving box), the metal foil set by the heat measuring device described in 16 above is the metal foil for laser perforation. [Embodiment] The present invention is made in advance of a metal foil (such as steel 200414851 copper) which is placed in the calorimeter of the laser perforation metal foil of the present invention. The calorimeter of the copper pig is as shown in Figure 丨A laser light introduction tube i (with a copper foil 2 at the bottom) provided with a light reflecting surface on the inner surface and a heat sensor 3 which is in close contact with the back surface of the copper foil 2 and can measure the heat. The symbol 4 indicates 'oxidation'. Laser light. The copper / 1 2 series is connected to the heat sensor 3, and there is no air gap in the middle. If there is an air gap, the accuracy of the heat measurement will be reduced. In addition, the inner surface of the laser light introduction tube will be light reflected. Surface, it can prevent heat from being lost from the laser light introduction tube. The heat loss from the laser light introduction tube is only the air flowing in contact with the inner surface of the laser light introduction tube, and its amount is very small. Also, because the copper foil 2 is very thin, so The amount of heat flowing from the edge of the copper foil 2 is negligible. Using the aforementioned device, a small amount of laser light is irradiated to the copper fall to measure the heat absorbed by the copper foil. The relationship between the gloss and heat of the copper box is shown in Figure 2. Light is shown in Figure 2 The higher the degree, the less heat is absorbed by the copper foil. Also, as shown in Figure 3, the surface roughness (Rz) of the copper box is related to the heat. The greater the surface roughness, the more heat the copper foil can absorb. The more it is, the surface characteristics (gloss, surface roughness) of the copper drop can be adjusted based on the heat measurement values. Generally, the interlayer connection of the printed circuit board can be formed at least by irradiating laser light on the copper foil. A layer containing at least one of indium, tin, cobalt decabalon alloy 200414851 and nickel alloy is formed at the position of the hole, and the plating surface is blackened to reduce the laser light reflectance and increase the heat absorbed by the copper foil. X, the surface is rough The degree can also be adjusted in the same way. 疋 X can be used to form such a plated surface on a sample of steel foil and measure the heat, which can be used to manage the surface characteristics of the copper foil in the production process. On the other hand, the laser formed The aperture of the copper foil has a correlation with the heat absorbed by the copper foil as shown in Figure 4. The more heat is absorbed, the larger the aperture can be. Therefore, a small amount of laser light can be irradiated to the steel box sample to determine the amount absorbed by the metal. Heat, use this heat to measure Set the value to adjust the aperture of the copper foil formed by the laser. On the other hand, you can also irradiate a small amount of laser light on the copper box sample to determine the heat absorbed by the metal box. The heat corresponding to the hole diameter adjusts the surface characteristics of the metal box from this heat. This makes it easy to carry out the quality control of the perforation of the metal. This is a great effect. "For the metal 4 used, if it is a copper box , You can use electrolytic copper or
壓延銅猪之任一絲 XJ 種。又，銅箱之厚度可採用做為高密度配 線使用之18 // m以下之％ 桌处 , 。虽；、、'、，本毛明並不受限於此金 屬箔之厚度，可適用於更厚的銅箔。 該等層體可藉由鑛敷處理來形成。但是，本發明並不 限定於鍍敷’亦可採用蒸鍍或濺鍍、其他被覆方法。 該等藉鍍敷所形# 成之層體，可於金屬箔之雷射光昭 面做部分形成或是於鋼箱全 尤…、射 J /白王面形成。當然，該等 必須不致損及適用於雷改茸^ 地 、用於電路基板之銅箔本身的特性，本發明 200414851 之處理可充分滿足此等條件。 可藉由提高穿孔之際之雷 但是’若雷射能量提昇至 一般，數值孔徑低的情況， 射輸出（能量）來提昇數值孔徑。 所需以上，則對於基板（積層板）之樹脂部分所造成之損傷 會變大，會發生樹脂孔徑較銅箔（層）之孔徑為大的現象。 一树月a孔冑A ’則在孔底部之樹脂與銅箱（層）的剝 離等會造成雷射穿孔之品質降低，為了防止此種品質降低Rolled copper pigs of any type XJ. In addition, the thickness of the copper box can be used as a high-density distribution line at a table below 18 // m. Although ;, ',, this Maoming is not limited to the thickness of this metal foil, and can be applied to thicker copper foil. These layers can be formed by mineral deposit treatment. However, the present invention is not limited to the plating method, and vapor deposition, sputtering, or other coating methods may be used. These layered bodies formed by plating can be partially formed on the laser light surface of the metal foil or formed on the steel box, etc., or J / White King surface. Of course, these must not impair the characteristics of the copper foil itself suitable for lightning modification and used for circuit substrates. The processing of the present invention 200414851 can fully meet these conditions. It is possible to increase the laser aperture at the time of perforation. However, if the laser energy is increased to a normal value and the numerical aperture is low, the output (energy) of the laser is used to increase the numerical aperture. If it is more than necessary, the damage caused to the resin part of the substrate (laminated board) will become larger, and the pore diameter of the resin will be larger than that of the copper foil (layer). Yishuyue a hole 胄 A ', the peeling of the resin and copper box (layer) at the bottom of the hole will cause the quality of the laser perforation to be reduced.
2須對處理條件進行嚴格的管理，結果製程與處理操作變 得複雜，此為一大問題。 但是，如本發明般事先對銅猪樣品照射微量之雷射光 ，測定金屬所吸收之熱量，以此熱量測定值來調整雷射 所形成之銅fg孔徑’可事先得知最適當的雷射光輸出。 是以’可高效率地形成品質優異之印刷電路基板之層 間連接孔（貝通孔），此為本發明之特徵所在。 發明效果 金屬猪之光澤度與熱量有相關性，光澤度愈大則金屬 箱所吸收之熱量愈少。X，金^!荡之表面粗度（Rz)與#量籲 也有相關性，表面粗度愈大則金屬箔所吸收之熱量會增加 此可藉由本發明之熱量測定裝置以簡便之方法事先得 知，藉此，可確實地調整對照射雷射光來形成印刷電路基 板之層間連接孔之際之品質管理有很大影響之金屬箱之表 面特性（光澤度、表面粗度），可安定地製造出雷射穿孔用 金屬箔。 12 200414851 又’雷射所形成之金屬箔之孔徑與金屬箱所吸收之熱 量同樣地有相關性。亦即，所吸收之熱量愈大則孔徑也愈 大。 疋以，可事先對金屬箔之樣品照射微量之雷射光，測 疋金屬4所吸收之熱量，以此熱量測定值來調整雷射所形 成之金屬箱之孔徑。 另方面，亦可對金屬箔之樣品照射微量之雷射光， 測定金屬落所吸收之熱量’利用此熱量測定值，算出與所 需金屬箔之孔徑相對應之熱量，從該熱量來調整金屬箔之 表面特性。 再者，由於可事先對銅箔之樣品照射微量之雷射光， 測定金屬所吸收之熱量，以此熱量測定值來調整雷射所 形成之銅箱之孔徑，故可事先知道最適當之雷射光輸出。 基於以上說明，本發明之金屬箔之熱量測定方法、金 屬箱之表面特性之調整方法、金屬羯之雷射穿孔方法以及 :匕穿孔方法所使用之適當的雷射穿孔用金屬猪之熱量測定 裝置，可高效率地形成品質優異之印刷電路基板之層間連 接孔（貫通孔），此為優異特徵所在。 【圖式簡單說明】 (一）圖式部分 圖1所示係本發明之熱量測定裝置之截面說明圖。 圖2所示係銅绪之光澤度與熱量之相關性之圖。 圖3所示係銅羯之表面粗度（Rz)與熱量之相關性之圖 13 200414851 圖4所示係銅箔之孔徑與銅箔所吸收之熱量的相關性 之圖。 (二）元件代表符號 1 雷射光導入管 2 銅f白 3 感熱器 4 二氧化碳雷射光2 Strict management of processing conditions is required. As a result, the manufacturing process and processing operations become complicated, which is a major problem. However, as in the present invention, a copper pig sample is irradiated with a small amount of laser light in advance, and the heat absorbed by the metal is measured. Based on the heat measurement value, the copper fg aperture formed by the laser can be adjusted. . The feature of the present invention is that the interlayer connection holes (beit hole) of the printed circuit board with excellent quality can be efficiently formed. Effects of the Invention The gloss of metal pigs is related to heat. The greater the gloss, the less heat is absorbed by the metal box. The surface roughness (Rz) of X, gold ^! Swing is also related to the amount of #. The larger the surface roughness, the more heat absorbed by the metal foil will increase. This can be obtained in advance by a simple method using the heat measuring device of the present invention. It is known that the surface characteristics (gloss, surface roughness) of a metal box which has a great influence on the quality management when forming interlayer connection holes of a printed circuit board by irradiating laser light can be reliably adjusted, and can be manufactured stably. Metal foil for laser perforation. 12 200414851 Also, the aperture of the metal foil formed by the laser is similarly related to the heat absorbed by the metal box. That is, the larger the heat absorbed, the larger the pore diameter. Therefore, a sample of metal foil can be irradiated with a small amount of laser light in advance, and the heat absorbed by the metal 4 can be measured. The measured value of the heat can be used to adjust the aperture of the metal box formed by the laser. On the other hand, it is also possible to irradiate a sample of metal foil with a small amount of laser light and measure the heat absorbed by the metal drop. 'Using this heat measurement value, calculate the heat corresponding to the pore diameter of the desired metal foil, and adjust the metal foil from the heat. Surface properties. In addition, since a small amount of laser light can be irradiated on a copper foil sample in advance, the heat absorbed by the metal can be measured, and the aperture value of the copper box formed by the laser can be adjusted based on this heat measurement value, so the most appropriate laser light can be known in advance Output. Based on the above description, the method for measuring the caloric value of the metal foil, the method for adjusting the surface characteristics of the metal box, the method for laser piercing of the metal puppet, and the appropriate caloric measuring device for the metal pig for laser piercing used in the method of piercing Interlayer connection holes (through holes) of printed circuit boards with excellent quality can be efficiently formed, which is an excellent feature. [Brief description of the drawings] (I) Schematic part Fig. 1 is a sectional explanatory view of the calorimeter of the present invention. Figure 2 is a graph showing the correlation between the gloss and heat of the copper thread. Figure 3 shows the correlation between the surface roughness (Rz) and heat of the copper foil. 20042004851 Figure 4 shows the correlation between the hole diameter of the copper foil and the heat absorbed by the copper foil. (II) Symbols for components 1 Laser light introduction tube 2 Copper f white 3 Thermal sensor 4 Carbon dioxide laser light