CN101306490B - 金属箔的激光穿孔方法 - Google Patents
金属箔的激光穿孔方法 Download PDFInfo
- Publication number
- CN101306490B CN101306490B CN2008101000357A CN200810100035A CN101306490B CN 101306490 B CN101306490 B CN 101306490B CN 2008101000357 A CN2008101000357 A CN 2008101000357A CN 200810100035 A CN200810100035 A CN 200810100035A CN 101306490 B CN101306490 B CN 101306490B
- Authority
- CN
- China
- Prior art keywords
- metal forming
- heat
- laser
- drilling method
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
- B23K2101/35—Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/005—Investigating or analyzing materials by the use of thermal means by investigating specific heat
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Laser Beam Processing (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002327694A JP3869352B2 (ja) | 2002-11-12 | 2002-11-12 | 金属箔の熱量測定方法、表面特性の調整方法、レーザー穴開け方法又は熱量測定装置 |
JP2002-327694 | 2002-11-12 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2003801013831A Division CN100516851C (zh) | 2002-11-12 | 2003-10-27 | 金属箔的热量测量方法、表面特性的调整方法、激光穿孔方法以及热量测量装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101306490A CN101306490A (zh) | 2008-11-19 |
CN101306490B true CN101306490B (zh) | 2011-08-17 |
Family
ID=32310522
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2003801013831A Expired - Fee Related CN100516851C (zh) | 2002-11-12 | 2003-10-27 | 金属箔的热量测量方法、表面特性的调整方法、激光穿孔方法以及热量测量装置 |
CN2008101000357A Expired - Fee Related CN101306490B (zh) | 2002-11-12 | 2003-10-27 | 金属箔的激光穿孔方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2003801013831A Expired - Fee Related CN100516851C (zh) | 2002-11-12 | 2003-10-27 | 金属箔的热量测量方法、表面特性的调整方法、激光穿孔方法以及热量测量装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP3869352B2 (zh) |
KR (2) | KR20070116625A (zh) |
CN (2) | CN100516851C (zh) |
TW (1) | TWI246376B (zh) |
WO (1) | WO2004044568A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100969365B1 (ko) | 2007-11-15 | 2010-07-09 | 현대자동차주식회사 | 자동변속기의 변속 제어 방법 |
RU2519089C2 (ru) | 2008-08-05 | 2014-06-10 | Торэй Индастриз, Инк. | Способ обнаружения злокачественных опухолей |
CN104924078A (zh) * | 2015-06-22 | 2015-09-23 | 苏州璟瑜自动化科技有限公司 | 带热成像检测与定位的钣金冲孔装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1321408A (zh) * | 1999-08-24 | 2001-11-07 | 三井金属鉱业株式会社 | 敷铜层压板及使用了该敷铜层压板的激光加工方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62133345A (ja) * | 1985-12-06 | 1987-06-16 | Fuji Electric Co Ltd | 熱定数測定装置 |
JP2529851B2 (ja) * | 1987-05-27 | 1996-09-04 | 東芝セラミックス株式会社 | 高熱伝導性薄板の熱拡散率測定方法およびその装置 |
JPH07102283B2 (ja) * | 1990-03-06 | 1995-11-08 | 株式会社クボタ | 沈砂池構造 |
US5212540A (en) * | 1991-11-22 | 1993-05-18 | Micron Technology, Inc. | Method for measuring a thickness of a printed circuit board |
US5601733A (en) * | 1993-09-30 | 1997-02-11 | Cymer, Inc. | Full field mask illumination enhancement methods and apparatus |
JP3860879B2 (ja) * | 1997-05-09 | 2006-12-20 | 大日本印刷株式会社 | レーザ加工状態検出方法及びレーザ加工システム |
JP3330925B2 (ja) * | 2000-04-05 | 2002-10-07 | 株式会社日鉱マテリアルズ | レーザー穴開け用銅箔 |
JP3690962B2 (ja) * | 2000-04-26 | 2005-08-31 | 三井金属鉱業株式会社 | キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板 |
-
2002
- 2002-11-12 JP JP2002327694A patent/JP3869352B2/ja not_active Expired - Fee Related
-
2003
- 2003-10-27 WO PCT/JP2003/013709 patent/WO2004044568A1/ja active Application Filing
- 2003-10-27 KR KR1020077022886A patent/KR20070116625A/ko not_active Application Discontinuation
- 2003-10-27 CN CNB2003801013831A patent/CN100516851C/zh not_active Expired - Fee Related
- 2003-10-27 KR KR1020057008280A patent/KR100934160B1/ko not_active IP Right Cessation
- 2003-10-27 CN CN2008101000357A patent/CN101306490B/zh not_active Expired - Fee Related
- 2003-11-03 TW TW092130651A patent/TWI246376B/zh not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1321408A (zh) * | 1999-08-24 | 2001-11-07 | 三井金属鉱业株式会社 | 敷铜层压板及使用了该敷铜层压板的激光加工方法 |
Non-Patent Citations (1)
Title |
---|
JP昭62-133345A 1987.06.16 |
Also Published As
Publication number | Publication date |
---|---|
CN1705876A (zh) | 2005-12-07 |
JP2004163190A (ja) | 2004-06-10 |
KR20070116625A (ko) | 2007-12-10 |
CN101306490A (zh) | 2008-11-19 |
CN100516851C (zh) | 2009-07-22 |
TWI246376B (en) | 2005-12-21 |
JP3869352B2 (ja) | 2007-01-17 |
KR100934160B1 (ko) | 2009-12-29 |
KR20050086472A (ko) | 2005-08-30 |
WO2004044568A1 (ja) | 2004-05-27 |
TW200414851A (en) | 2004-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: JX NIPPON MINING + METALS CO., LTD. Free format text: FORMER OWNER: NIPPON MINING + METALS CO., LTD. Effective date: 20101216 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20101216 Address after: Tokyo, Japan, Japan Applicant after: JX Nippon Mining & Metals Co., Ltd. Address before: Tokyo, Japan, Japan Applicant before: Nippon Mining & Metals Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110817 Termination date: 20141027 |
|
EXPY | Termination of patent right or utility model |