WO2004028228A1 - 部品実装装置及び部品実装方法 - Google Patents
部品実装装置及び部品実装方法 Download PDFInfo
- Publication number
- WO2004028228A1 WO2004028228A1 PCT/JP2002/009660 JP0209660W WO2004028228A1 WO 2004028228 A1 WO2004028228 A1 WO 2004028228A1 JP 0209660 W JP0209660 W JP 0209660W WO 2004028228 A1 WO2004028228 A1 WO 2004028228A1
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- WIPO (PCT)
- Prior art keywords
- component
- suction nozzle
- force
- suction
- transport speed
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Definitions
- the present invention relates to a component mounting apparatus and a component mounting method for mounting components stably on a circuit-forming body such as a resin substrate, and more particularly, to holding the components by suction using a suction nozzle and transporting the components.
- the present invention relates to a component mounting apparatus and a component mounting method. Background art
- a component mounting apparatus for mounting a component on a circuit formed body such as a resin substrate
- the component recognition operation is performed until the component is mounted on the circuit formed body
- the circuit formation is performed based on a result of the recognition operation. It is important to determine the correction amount for the mounting position on the circuit forming body when mounting the component on the body in order to improve the mounting accuracy and the mounting rate when mounting the component.
- FIG. 10 shows a conventional component mounting apparatus 100 for mounting a component 1 on a resin substrate 2 which is an example of a circuit forming body.
- the resin substrate 2 is a printed circuit board on which a circuit pattern is formed for mounting the component 1 as an electronic component, and is held by an XY table 8.
- the parts cassette 4 provided in the parts supply device 3 stores the parts 1 by taping, and the parts 1 are drawn along the circular movement path 12 at the parts suction position 9.
- the suction is performed one by one from the parts cassette 4 by the suction nozzle 5 provided in the nozzle unit 6 performing the one-way intermittent rotation in the clockwise direction at 10.
- the nozzle unit 6 moves to the component recognition position 10 along the movement path 12 and is suctioned by the suction nozzle 5 of the nozzle cut 6.
- the component recognition device 7 recognizes the suction state of the component 1 in a predetermined space.
- the control device 20 to which the recognition information of the component 1 obtained by the component recognition device 7 has been input is used at the time of mounting based on the component recognition information.
- the correction amount is calculated, and the correction amount is stored in the correction amount storage unit 20c.
- the nozzle unit 6 moves to the component mounting position 11 along the movement path 12.
- the control device 20 stores the coordinates on the substrate 2 registered in the NC data read from the NC data storage unit 20a and the correction amount storage unit 20c.
- the coordinates of the mounting position on the resin substrate 2 are calculated based on the correction amount, and the rotation angle of the suction nozzle 5 for performing the angle correction is calculated based on the correction amount.
- the control device 20 rotates the suction nozzle 5 around the central axis based on the calculated rotation angle, and the XY table based on the calculated coordinates of the mounting position on the resin substrate 2. 8 is operated to move the resin substrate 2.
- the nozzle unit 6 is arranged at the component mounting position 11, the component 1 sucked by the suction nozzle 5 of the nozzle unit 6 is mounted on the resin substrate 2.
- FIG. 11 shows a deviation amount ⁇ L and a slope ⁇ of the component 1 sucked by the suction nozzle 5 from the normal suction state 1 b.
- the normal suction state 1b of the component 1 refers to a state where the center of gravity 1a of the component 1 and the center axis 5b of the suction nozzle 5 overlap as shown by a broken line in FIG. Say.
- the component mounting apparatus 100 holds the component 1 by suction of the suction nozzle 5 and mounts the component 1 on the resin substrate 2.
- the parts 1 may vary within the taping cavities provided in the parts cassette 4 and / or the assembling state of the suction nozzles 5 in the component mounting apparatus 100 may vary.
- the component 1 When the component 1 is sucked by the suction nozzle 5, even if the center of gravity 1 a of the component 1 is shifted from the center axis 5 b of the suction nozzle 5, the component 1 moves along the movement path 12 shown in FIG. 10. It is transported by the nozzle unit 6 at the initially set transport speed. Therefore, when the inertia force is applied to the part 1 in accordance with the acceleration at the time of the movement of the nozzle unit 6, when the displacement shown in FIG. 11 is large, the moment acting on the part 1 is reduced. growing. As a result, the part recognition unit 7 recognizes the part 1 and corrects it.
- the nozzle unit 6 moves from when the amount is calculated to when the above-mentioned part 1 is mounted at the part mounting position 1 1, the moment force for shifting the above-mentioned part 1 from the central axis 5 of the above-mentioned suction nozzle 5 becomes the above-mentioned part 1.
- the component 1 may further deviate from the state at the time of component recognition at the lower end 5 a of the suction nozzle 5. Therefore, in the conventional component mounting apparatus 100, when the component 1 is mounted on the resin substrate 2 only by the position correction based on the correction amount, the position on the resin substrate 2 where the component 1 is mounted is determined. However, there is a possibility that the position may deviate from the mounting position on the resin substrate 2 based on the NC data and the component recognition information.
- the rotary type component mounting apparatus 100 has been described.
- the nozzle unit 6 including the suction nozzle 5 can move freely on the XY plane.
- the present invention has been made to solve the above-described problems, and has as its object to provide a component mounting apparatus and a component mounting method that improve the mounting accuracy and the mounting rate of components on a circuit formed body. . Disclosure of the invention
- the present invention is configured as follows to achieve the above object.
- a component mounting apparatus including a suction nozzle for holding a component to be mounted on a circuit forming body by suction, wherein the component is sucked by the suction nozzle from the suction position.
- a component transport device that transports the component sucked by the suction nozzle to a component mounting position where the component sucked by the nozzle is mounted on the circuit forming body;
- a component recognition device for recognizing the component sucked by the suction nozzle at a component recognition position existing on the movement path of the suction nozzle by the component transport device from the component suction position to the component mounting position;
- a deviation amount of the component from the normal suction state of the component at the suction nozzle is determined, and the component transport device from the component recognition to the component mounting after the component recognition.
- a control device that performs control based on the magnitude.
- the control of the transport speed of the component by the control device may be control for obtaining the transport speed by reducing or maintaining the initially set speed.
- the controller is a force generated on the component by conveying the component at the set speed after the component recognition, and attempts to shift the component from a suction position at the time of component recognition of the component by the suction nozzle.
- the transfer speed can be determined based on the displacement amount, and the transfer speed can be controlled based on the result of comparison between the component shifting force and the component holding force of the suction nozzle.
- the setting is performed when the shift amount exceeds the threshold value.
- the transport speed can be obtained by reducing the speed.
- the control device includes a component information storage unit that stores information related to the property of the component held by the suction nozzle, and according to the component holding force and the property of the component read from the component data storage unit.
- the transport speed can be controlled based on the result of comparison with the force that shifts the component.
- the component transport device includes a plurality of suction nozzles of different types
- the control device includes a suction nozzle storage unit that stores information indicating a relationship between the type of each suction nozzle and the component holding force, and the suction device that suctions the component recognized by the component recognition device. Based on a comparison result between the component holding force read from the suction nozzle storage unit of the nozzle and the force acting on the component sucked by the suction nozzle to shift the component, the transfer is performed. Speed can be controlled.
- a component to be mounted on a circuit forming body is suctioned by a suction nozzle, and the component sucked by the suction nozzle is transported until the component is mounted on the circuit forming body.
- the component mounting method a component to be mounted on a circuit forming body is suctioned by a suction nozzle, and the component sucked by the suction nozzle is transported until the component is mounted on the circuit forming body.
- the transfer speed of the component from the component recognition to the component mounting is based on the magnitude of the quantity.
- control of the transport speed may be control for obtaining the transport speed by reducing or maintaining the initially set speed.
- the control of the transport speed based on the deviation amount is a force generated in the component by transporting the component at the set speed after the component recognition, and controlling the component by the suction nozzle.
- the force for shifting the component from the suction position at the time of component recognition is determined based on the deviation amount, and based on the comparison result between the force for shifting the component and the component holding force of the suction nozzle.
- the control of the transport speed based on the amount of deviation is performed by setting a threshold value, which is an amount of deviation based on a force for shifting the part balanced with the component holding force, to the component recognition information. If the deviation amount calculated based on the above is exceeded, the set speed can be reduced to obtain the transport speed.
- control of the transport speed based on the shift amount can be controlled in consideration of a force for shifting the component, which changes according to the property of the component.
- the control of the transport speed based on the displacement amount changes according to the type of the suction nozzle that suctions the component.
- the control can be performed in consideration of the component holding force.
- the suction nozzle that moves along the movement path from the component suction position to the component mounting position is provided.
- the component recognition is performed based on the magnitude of the shift amount.
- the transport speed from later to component mounting was determined. As a result, by transferring the component from the component recognition to the component mounting at the determined transfer speed, it is possible to suppress a further change in the deviation amount after the component recognition. It is possible to improve the mounting accuracy and the mounting rate of the component on the body.
- the above-mentioned transport speed is obtained by decelerating or maintaining the initially set speed, it is considered as one of the methods for obtaining the above-mentioned transport speed from the above-mentioned deviation amount.
- the transfer speed can be determined more finely.
- the force acting on the component by transporting the component at the set speed after the component recognition and the component attempts to shift the component from the suction position when the component is recognized by the suction nozzle.
- the transfer speed can be obtained based on a comparison result between the force for shifting the component and the component holding force of the suction nozzle. Therefore, it is possible to suppress the adsorption instability due to the force for displacing the component exceeding the component holding force due to the large displacement amount, and to further increase the displacement amount after the component recognition. Changes can be suppressed.
- the deviation of the component when the component holding force and the force for shifting the component are balanced is set as a threshold, the deviation of the component from the normal suction state is the above threshold.
- the set speed may be reduced to obtain the transport speed. According to this configuration, it is possible to omit obtaining a force for shifting the component when the displacement amount does not exceed the threshold value.
- the transfer speed can be strictly controlled in response to a change in the force for shifting the component in accordance with the speed. Therefore, even when a plurality of components having different masses, volumes, and heights are mounted on the circuit-formed body, the mounting accuracy and the mounting rate can be improved.
- the above-described transport speed is controlled based on a comparison result of the component holding force, which changes according to the type of the suction nozzle, and the force for shifting the component.
- the transfer speed can be controlled. Therefore, it is possible to improve the mounting accuracy and the mounting ratio of the component on the circuit forming body.
- FIG. 1 is a perspective view of a component mounting apparatus according to a first embodiment of the present invention
- FIG. 2 is an explanatory diagram showing a connection state of a control device in the component mounting apparatus shown in FIG.
- FIG. 3 is a perspective view showing component recognition by a component recognition device provided in the component mounting apparatus shown in FIG. 1,
- FIG. 4 is a rough diagram showing a relationship between a force for shifting a component with respect to a predetermined component holding force and a deviation amount of the component.
- FIG. 5 is a flowchart showing a component mounting method according to the first embodiment of the present invention.
- FIG. 6 is a graph showing a relationship between a force for shifting a component with respect to a predetermined component holding force and the mass of the component.
- FIG. 7 is an explanatory diagram showing a connection state of a control device in the component mounting apparatus according to the second embodiment of the present invention.
- FIG. 8 is a graph showing the relationship between the component holding force of the suction nozzle and the force for shifting the component.
- FIG. 9 is an explanatory diagram showing a connection state of a control device in the component mounting apparatus according to the third embodiment of the present invention.
- FIG. 10 is an explanatory diagram showing a connection state of a control device in a conventional component mounting apparatus.
- FIG. 11 is an explanatory diagram showing a deviation amount and a tilt from a normal suction state of a component.
- a resin board, a paper phenol board, a ceramic board, a glass board (glass epoxy) board, a circuit board such as a film board, a circuit board such as a single-layer board or a multilayer board, a component, Circuit type such as housing or frame Electronic components, mechanical components, optical components, and other components are mounted on the adult.
- the same members are denoted by the same reference numerals.
- the component mounting apparatus and the component mounting method the component is held by suction by a suction nozzle. As shown by a broken line in FIG. 11, the center of gravity 1a of the component 1 and the suction nozzle 5 The state 1b where the center axis 5b overlaps the part 1b is regarded as the normal suction state of the component 1.
- FIG. 1 is a perspective view showing the overall configuration of the component mounting apparatus 200 according to the first embodiment of the present invention
- FIG. 2 is a diagram showing the connection state of the control device 30 in the component mounting apparatus 200. It is shown.
- the component mounting apparatus 200 includes 16 nozzles 6 each having the suction nozzle 5 at regular intervals along an annular moving path 12.
- Component mounting apparatus As shown in FIG. 1, the component mounting apparatus 200 includes a component transport device 13, a component supply device 3, a component recognition device 7, and an XY table 8.
- the component transport device 13, the component supply device 3, the component recognition device 7, and the XY tape holder 8 are each connected to a control device 30.
- the component transport device 13 includes the above-described nozzle cuts 6, and is operated based on the control of the control device 30.
- a clockwise unidirectional intermittent rotational movement along the movement path 12 is performed. Therefore, the component 1 sucked by the suction nozzle 5 is conveyed by the one-way intermittent rotation of the nozzle unit 6.
- the rotation angle in the one-way intermittent rotation is 22.5 °.
- the suction nozzle 5 is rotatable around a central axis 5 b shown in FIG. 11, and the rotation is controlled by the control device 30.
- the component supply device 3 is disposed below the nozzle unit 6 as shown in FIG. 1 at a component suction position 9 on the movement path 12 shown in FIG.
- the component recognition device 7 is configured such that, at the component recognition position 10 on the movement path 12 moved 90 ° clockwise along the movement path 12 from the component suction position 9 shown in FIG. As shown in FIG. 1, it is arranged below the nozzle unit 6.
- the XY tape 8 moves at 90 ° clockwise from the component recognition position 10 shown in FIG. 2 on the movement route 12 at 90 ° at the component mounting position 11 on the movement route 12.
- the nozzle unit 6 stops at the component suction position 9, the component recognition position 10, and the component mounting position 11 shown in FIG. 2 due to the one-way intermittent rotation by the component transport device 13. .
- the component supply device 3 supplies the component 1 to be suctioned by the suction nozzle 5 disposed at the component suction position 9, and controls the X-axis direction in FIG. 1 under the control of the control device 30. It has a component supply table 3a capable of reciprocating movement and a plurality of parts cassettes 4 assembled on the component supply table 3a.
- the type, shape, size, etc. of the parts 1 stored in the taping wound on the linole 14 attached to each of the above-mentioned parts cassettes 4 depend on the part cassette 4 to which the reel 14 is attached. To each other.
- the selection of the component 1 by the component supply device 3 is performed by operating the component supply table 3 a by the control device 30 and drawing the suction nozzle 5 provided in the nozzle unit 6 arranged at the component supply position 9. This is performed by making the lower end portion 5a shown in 11 face the parts cassette 4 for supplying the parts 1 to be sucked.
- the component recognition device 7 recognizes a suction position and a suction state of the component 1 conveyed to the component recognition position 10 by the suction nozzle 5 described above. Also, the component recognition information of the component 1 in the suction position and the component suction state recognized by the component recognition device 7 is calculated from the component recognition device 7 in order to calculate a correction amount when the component 1 is mounted. It is output to the control device 30.
- a monitor 7a is connected to the component recognition device 7 as shown in FIG. Then, the monitor 7a can display a suction position and a suction state of the component 1 in a predetermined space recognized by the component recognition device 7 as shown in FIG. The specific factors of the component 1 recognized by the component recognition device 7 deviating from the normal suction state 1b shown in FIG.
- the XY table 8 holds a substrate 2 which is an example of a circuit forming body on which the component 1 is mounted.
- the resin substrate 2 is controlled by the control device 30 to move the X-axis in FIG. Direction and ⁇ axis direction. Accordingly, by moving the resin board 2 on the table 8, the mounting position on the resin board 2 where the component 1 transferred to the component mounting position 11 is mounted (not shown). Can be arranged below the component mounting position 11.
- the control device 30 includes an NC data storage unit 30a, a correction amount calculation unit 30b, a correction amount storage unit 30c, and a nozzle center axis storage unit 30d. And a shift amount calculation unit 30 e and a threshold value storage unit 30 f.
- the NC data storage section 30a is set in the order in which the parts 1 are supplied from the parts supply device 3 and is set to transport the parts 1 from the parts supply position 9 to the parts mounting position 11 NC data for registering the speed, the coordinates on the resin board 2 where the component 1 is to be mounted, and the like are stored. Further, the correction amount calculation unit 30b is obtained based on the NC data read from the NC data storage unit 30a and the component recognition information input from the component recognition and recognition device 7. A correction amount for mounting the component 1 on the resin substrate 2 is calculated based on the position data of the center of gravity 1a and the angle data of the inclination ⁇ ⁇ ⁇ of the component 1 shown in FIG.
- the correction amount storage unit 30 c temporarily stores the correction amount calculated by the correction amount calculation unit 3 Ob, and the control device 30 stores the NC data and the correction value.
- the position of the resin substrate 2 can be determined by operating the XY table 8 based on the correction amount from the amount storage unit 30c. Further, the control device 30 rotates the suction nozzle 5 around the central axis 5a in FIG. 11 based on the correction amount read from the correction amount storage unit 30c, thereby controlling the angle of the component 1. Corrections can be made.
- the nozzle center axis storage unit 30 d shown in FIG. 2 is the center axis 5 b shown in FIG. 11 of the suction nozzle 5 in a predetermined space recognized and recognized by the component recognition device 7 shown in FIG. 3. It stores the position.
- the position data of the central axis 5b of the suction nozzle 5 can be obtained by recognizing the suction nozzle 5 in a state where the component 1 is not suctioned by the component recognition device 7 shown in FIG.
- the shift amount calculating section 30 e calculates the shift amount ⁇ L shown in FIG.
- the displacement amount is determined by the position data of the central axis 5b read from the nozzle central axis storage unit 30d shown in FIG. 2 and the position of the center of gravity 1a of the component 1 based on the component recognition information. It is calculated based on the data.
- the threshold value storage section 30f shown in FIG. 2 stores the threshold value for the deviation amount ⁇ L shown in FIG. Then, the control device 30 shown in FIG. 2 compares the threshold value read from the threshold value storage section 30 f with the deviation amount AL. When the deviation ⁇ L exceeds the threshold value based on the comparison result, the control device 30 reduces the initially set speed to reduce the speed of the component 1 from component recognition to component mounting. The transport speed is determined, and operation control of the component transport device 13 shown in FIG. 1 is performed based on the determined transport speed. Then, the component transport device 13 transports the component 1 from the component recognition position 10 to the component mounting position 11 at the transport speed described above.
- the control device 30 sets the set speed as the transfer speed from the component recognition to the component mounting, and based on the set speed in FIG. By performing the operation control of the component transport device 13 shown, the component transport device 13 transports the component 1 from the component recognition position 10 to the component mounting position 11 at the set speed.
- FIG. 4 is a graph showing the relationship between the suction nozzle 5 and the component holding force F 0.
- the horizontal axis in this figure is the above-mentioned displacement amount A L, and the vertical axis is the above-mentioned parts.
- the component holding force F 0 is uniquely determined by the vacuum pressure, the opening diameter, and the like at the lower end 5 a of the suction nozzle 5 shown in FIG. 11. Therefore, the component holding force F 0 takes a constant value as shown in FIG. 4 by determining the type of the suction nozzle 5 to be used.
- the force Fm for shifting the component 1 is applied from the outside of the component 1 due to the acceleration of the transport speed from the recognition of the component to the mounting of the component, etc., and increases in proportion to the transport speed. . Further, as shown in FIG.
- the force F m for shifting the component 1 when the transport speed is the set speed is balanced with the component holding force F 0. . That is, when the above-mentioned set speed is set as the above-mentioned conveyance speed, the above-mentioned gap and the value are the amount of shift based on the force F m that tries to shift the above-mentioned component 1 and balances with the above-mentioned component holding force F 0 Become. Therefore, in the component mounting apparatus 200 shown in FIG. 1, when the displacement amount ⁇ L exceeds the threshold value, the force F m for shifting the component 1 when the transport speed is the set speed is used. Since the component holding force exceeds the component holding force FO, suction by the suction nozzle 5 becomes unstable, and the component 1 further shifts after component recognition.
- the control device 30 determines to determine the transport speed from component recognition to component mounting by reducing the set speed.
- the following operation is performed in order to obtain the value of the transport speed according to the determination. That is, first, the control device 30 calculates a force F m for shifting the component 1 when the transport speed is the set speed based on the magnitude of the deviation amount AL. Next, the control device 30 compares the calculated result of the force Fm for shifting the component 1 with the previously set component holding force F0.
- the threshold value is a value corresponding to a state in which the force F m for shifting the component 1 and the component holding force F 0 are in equilibrium.
- the operation is to find the difference between the force F m for shifting the component 1 exceeding the component holding force F 0 and the component holding force F 0. Then, the amount to be decelerated from the set speed is obtained based on the comparison result, and the transport speed is obtained.
- the force F m for shifting the component 1 increases in proportion to the transport speed, and the force F m for shifting the component 1 is Since the deviation amount is approximately proportional to the deviation amount, when the deviation amount exceeds the threshold value, as the difference between the deviation amount and the threshold value increases, the amount to be decelerated is increased. increase.
- the amount to be decelerated is obtained based on the comparison result, and the above-described transport speed is obtained by subtracting the amount to be decelerated from the set speed.
- the transport speed is obtained based on the comparison result, the transport speed is the highest speed among the speeds at which further change in the displacement L can be suppressed.
- the amount to be decelerated is changed in proportion to the difference between the deviation amount ⁇ L and the threshold value.
- the amount to be decelerated is set as a constant value in advance, and when the deviation amount AL exceeds the threshold value, the above-mentioned constant value is subtracted from the set speed to obtain the transport speed. Is also good.
- the constant value is a value to be subtracted from the set speed. For example, even when any part 1 is conveyed, the deviation amount ⁇ L does not further change! / ⁇ Value at which the transfer speed can be determined from the above set speed.
- the fixed value is a single value regardless of the magnitude of the difference between the deviation amount ⁇ L and the threshold value.
- it is necessary to obtain the above-mentioned constant value in advance through experiments or the like and set the obtained constant value as one of the NC data. Since it is not necessary to perform a comparison operation with the force Fm that attempts to shift the transfer speed, the operation process for obtaining the transport speed in the control device 30 is easier than in the above-described embodiment.
- the method of controlling the transfer speed from component recognition to component mounting is limited to the method of controlling the transfer speed by decelerating from the initially set speed when the deviation exceeds the threshold value.
- the corresponding speed corresponding to the magnitude of the deviation amount is set in advance by the NC data in the first data.
- the corresponding speed corresponding to the deviation ⁇ L is derived from the magnitude of the deviation ⁇ L of the component 1 recognized by the component recognition device 7 at the time of component recognition.
- the speed may be the transfer speed from component recognition to component mounting. That is, each corresponding speed corresponds to the transport speed.
- the corresponding speed is a speed that does not cause a further change in the shift amount ⁇ L for the component 1 during the conveyance from the component recognition to the component mounting.
- the above-mentioned corresponding speed is obtained in advance by an experiment or the like, and the obtained corresponding speed is used as one of the NC data.
- the processing for obtaining the transport speed in the control device 30 is easier than in the above-described embodiment.
- the corresponding speeds are set in accordance with the magnitudes of the individual deviation amounts AL, it is possible to control the transport speed more strictly than in the case of the first modification described above.
- the second modification is a method for obtaining the transport speed when the set speed is not used as described above, and is not a method for obtaining the transport speed by subtraction as in the above-described embodiment.
- the transport speed is obtained by decelerating from the set speed as in the above-described embodiment
- the comparison operation process is performed based on the deviation amount, and the transport operation is performed. Since the speed is calculated, the transport speed can be obtained more strictly than in the above-described second modification.
- the control device 30 controls the operation of the component transport device 13.
- the component transport device 13 moves the nozzle jet 6 along the moving path 12 at the determined transport speed. Due to the movement of the nozzle unit 6, the component 1 is transported from the component recognition position 10 to the component mounting position 11 at the transport speed determined by reducing the set speed.
- the force F m for shifting the component 1 becomes the component holding force as shown in FIG. It decreases with respect to F0, and the suction of the component 1 by the suction nozzle 5 shown in FIG. 1 is stabilized. Further, since the suction of the component 1 by the suction nozzle 5 is stabilized, it is possible to prevent the deviation amount ⁇ L of the component 1 from being changed when the component 1 is conveyed after the component recognition. it can. As a result, the position correction in positioning the resin substrate 2 can be performed only by the correction amount, and the component 1 can be accurately mounted on the resin substrate 2.
- FIG. 5 is a flowchart showing a series of mounting operations in the component mounting apparatus 200.
- step (denoted by "S" in the figure) 1 in a state where all the suction nozzles 5 shown in FIG. The position of the center axis 5b shown in FIG. 11 of all the suction nozzles 5 is recognized. The position of the central axis 5b shown in FIG. 11 recognized by the component recognition device 7 shown in FIG. 1 is stored as data in the nozzle central axis storage unit 30d of the control device 30 shown in FIG. Is done.
- the control device 30 activates the component supply table 3a based on the NC data read from the NC data storage unit 30a, and supplies the component 1 that can supply the component 1 indicated by the NC data.
- the cassette 4 is arranged below the nozzle unit 6 arranged at the component suction position 9. Then, the component 1 is suctioned from the parts cassette 4 by the suction nozzle 5 provided in the nozzle cut 6.
- the suction nozzle 5 sucks the component 1 with a fixed component holding force during a period from component suction to component mounting.
- the component 1 is conveyed to the component recognition position 10 by the movement of the nozzle unit 6 shown in FIG. 2, as shown in Step 3 shown in FIG.
- Step 4 shown in FIG. 5 at the component recognition position 10 the component 1 is recognized by the component recognition device 7 shown in FIG. Then, as shown in step 5 shown in FIG. 5, the control device 30 shown in FIG. 1 calculates the center of gravity 1a of the component 1 shown in FIG. 11 based on the component recognition information obtained by the recognition. Calculate the position and inclination ⁇ . Then, based on the position data of the center of gravity 1a of the component 1 and the angle data of the inclination ⁇ , the control device 30 shown in FIG. 2 calculates a correction amount as shown in step 6 of FIG. The correction amount is stored in the correction amount storage unit 30c shown in FIG.
- the correction amount is calculated, and as shown in step 7 in FIG. 5, the control device 30 shown in FIG. 2 reads the suction nozzle shown in FIG. 11 from the nozzle center axis storage unit 30 d.
- the shift amount ⁇ L is calculated based on the position data of the center axis 5b of the step 5 and the position data of the center of gravity 1a of the part 1 calculated in step 5 shown in FIG.
- the control device 30 shown in FIG. 2 compares the threshold V read from the value storage unit 30 f with the threshold V, Then, based on the result of the comparison, it is determined that the transport speed of the component 1 from the component recognition to the component mounting is controlled to be reduced or equal to the set speed.
- the control device 30 determines the deviation amount ⁇ L based on the magnitude of the deviation amount ⁇ L.
- a force Fm for shifting the component 1 when the transport speed is the set speed is calculated.
- the control device 30 compares the component holding force FO of the suction nozzle 5 with the force F m for shifting the component 1 and the force F m for shifting the component 1 and the component holding force FO. The difference between the force F 0 and the force F m for shifting the component 1 and the component holding force F 0 are used to determine the amount to be decelerated from the set speed. Determine the transport speed of component 1 until component mounting.
- the control device 30 After determining the transport speed, the control device 30 operates the component transport device 13 shown in FIG. 1 so that the transport speed takes the value determined in step 8 shown in FIG. 5, and performs component recognition.
- the nozzle unit 6 is moved along the moving path 12 shown in FIG. By the movement of the nozzle unit 6, the component 1 is transported to the component mounting position 11 shown in FIG. 2, as shown in step 9 in FIG.
- the control device 30 moves the suction nozzle 5 based on the correction amount from the correction amount storage unit 30c to the central axis 5a shown in FIG. Rotate around to correct the angle of part 1 above.
- the control device 30 shown in FIG.
- the position of the resin substrate 2 held by the XY table 8 is determined based on the NC data from 30a and the correction amount from the correction amount storage unit 30c.
- the component 1 When the component 1 is placed in the component mounting position 11 in a state where the positioning of the resin substrate 2 and the angle correction of the component 1 are completed, the component 1 is moved to the step 11 shown in FIG. As shown in the figure, it is mounted at the mounting position on the resin substrate 2 shown in FIG. 1 registered in the NC data. After the mounting of the component 1 is completed, the nozzle cut 6 having the suction nozzle 5 is moved to the component suction position 9 along the movement path 12 shown in FIG. And repeat the steps from step 2 to step 11 shown in Fig. 5 again.
- the component mounting apparatus 200 determines the shift amount ⁇ L based on the component recognition information of the component 1 obtained by the component recognition device 7, and determines the magnitude of the shift amount ⁇ . Then, the transport speed of the above component 1 from component recognition to component mounting is obtained based on the above. As a result, by transporting the component 1 at the determined transport speed, it is possible to prevent the component 1 from further deviating from the state at the time of component recognition after the component recognition and before the component mounting. . Therefore, by preventing the component 1 from further shifting from component recognition to component mounting, when the component 1 is mounted on the resin board 2, the component 1 is actually placed on the resin board 2.
- the component mounting apparatus 200 improves the mounting accuracy and the mounting rate of the component 1 on the resin substrate 2. Can be done.
- the component It is possible to suppress the adsorption instability caused by the force F m for shifting 1 exceeding the component holding force F 0.
- the relationship between the set speed of the component 1 and the displacement AL is determined in advance by experiments.
- the data of the set speed obtained in the above experiment may be registered in advance by adding it to the NC data. Therefore, the control device 30 can control the transport speed of the component 1 from component recognition to component mounting by reading the data of the set speed.
- the magnitude of the force for shifting the component 1 is approximately proportional to the magnitude of the displacement shown in FIG. Based on this, the control of the transport speed of component 1 from component recognition to component mounting is performed.
- the control device 30 sets the mass, volume, and volume of the component 1 in advance so as to be able to respond to the change in the mass of the component 1.
- a part information storage unit 30 g in which information on properties such as height is registered can be provided.
- the control device 30 reads out the displacement amount ⁇ L obtained based on the component recognition information of the component 1 obtained by the component recognition device 7 and the component information storage unit 30 g.
- the force F m for shifting the component 1 can be obtained.
- the control device 30 controls the transfer speed from component recognition to component mounting based on the result of comparison between the force F m for shifting the component 1 and the component holding force F 0 described above. be able to.
- the force F m that shifts the component 1 depending on the property of the component 1 is changed from the component recognition to the component mounting. It is possible to more strictly control the transport speed of the component 1. If the mass of the component 1 is unknown and cannot be registered in the component information storage unit 30 g, the volume of the component 1 is registered in advance in the component information storage unit 30 g as the property of the component 1. Then, register the density of the part 1 and register it in the part information storage unit 30 g assuming the force to calculate the mass of the part 1 or the general specific gravity of iron as an example. By calculating the temporary mass of the component 1 in this way, the transport speed can be determined based on the mass.
- the suction nozzle 5 has a constant component holding force.
- the shape and the opening diameter of the lower end portion 5 a of the suction nozzle 5 shown in FIG. 11 change according to the type of the suction nozzle 5. Since the suction area of the component 1 with respect to the suction nozzle 5 changes according to the change in the shape and the opening diameter of the lower end portion 5a, the component holding force of the suction nozzle 5 according to the change in the suction area. F 0 increases or decreases. Then, as shown in FIG. 8, with the increase or decrease of the component holding force F 0, the suction stable region of the deviation amount with respect to the component holding force F 0 also increases or decreases. Therefore, it is necessary to control the transport speed of the component 1 corresponding to the change in the component holding force.
- the control device 30 controls the suction nozzle 5 for storing information indicating the relationship between the type of the suction nozzle 5 and the component holding force.
- a storage unit 30 h can be provided.
- the control device 30 shifts the component 1 shown in FIG. 8 based on the displacement amount shown in FIG. 11 obtained based on the component recognition information of the component 1 obtained by the component recognition device 7.
- the component mounting apparatus 400 and the component mounting method according to the third embodiment even when the magnitude of the component holding force F 0 changes according to the type of the suction nozzle 5 that suctions the component 1, the component is mounted.
- the transport speed after recognition can be controlled, and the mounting accuracy and the mounting rate of the component 1 on the resin substrate 2 can be improved.
- the component holding force F 0 is determined arbitrarily according to the type of the suction nozzle 5, the setting is easier than registering the property for each component 1 as in the second embodiment. .
- each nozzle unit 6 When the nozzle unit 6 provided in the component mounting apparatus 400 is a multi-nozzle unit in which a plurality of suction nozzles 5 of different types can be selected, each nozzle unit 6 has Each suction nozzle 5 is assigned a registration number, and the registration number of the suction nozzle 5 is registered in the component library data in advance. Many. Therefore, if the type of the suction nozzle 5 is derived using the component library data and the component holding force of the suction nozzle 5 is calculated, the component holding force F 0 of the suction nozzle 5 is stored in the suction nozzle storage unit 30. This can be easier than registering h again.
- first to third embodiments it is possible to further improve the mounting accuracy and the mounting ratio as compared with the case where the first to third embodiments are used alone, and it is more preferable.
- the rotary type component mounting apparatus 200, 300, 400 has been described.
- the nozzle unit 6 including the suction nozzle 5 is located on the XY plane.
- the component mounting method according to the first to third embodiments can be used, and a change in the deviation ⁇ L after component recognition can be suppressed. Can be.
- the present invention has been fully described in connection with the preferred embodiments thereof with reference to the accompanying drawings, c such variations and modifications that various changes and modifications will be apparent to those skilled in the art To the extent that the scope of the invention does not depart from the scope of the invention as set forth in the appended claims, it should be considered as included therein.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001174187A JP2002368495A (ja) | 2001-06-08 | 2001-06-08 | 部品実装装置及び部品実装方法 |
US10/501,218 US7185422B2 (en) | 2001-06-08 | 2002-09-20 | Part mounting apparatus and part mounting method |
PCT/JP2002/009660 WO2004028228A1 (ja) | 2001-06-08 | 2002-09-20 | 部品実装装置及び部品実装方法 |
DE60233444T DE60233444D1 (de) | 2001-06-08 | 2002-09-20 | Teileanbringvorrichtung und teileanbringverfahren |
EP02772868A EP1545181B1 (en) | 2001-06-08 | 2002-09-20 | Part mounting apparatus and part mounting method |
CNB028269683A CN1278594C (zh) | 2001-06-08 | 2002-09-20 | 元件安装装置和元件安装方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2001174187A JP2002368495A (ja) | 2001-06-08 | 2001-06-08 | 部品実装装置及び部品実装方法 |
PCT/JP2002/009660 WO2004028228A1 (ja) | 2001-06-08 | 2002-09-20 | 部品実装装置及び部品実装方法 |
Publications (1)
Publication Number | Publication Date |
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WO2004028228A1 true WO2004028228A1 (ja) | 2004-04-01 |
Family
ID=32715267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2002/009660 WO2004028228A1 (ja) | 2001-06-08 | 2002-09-20 | 部品実装装置及び部品実装方法 |
Country Status (6)
Country | Link |
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US (1) | US7185422B2 (ja) |
EP (1) | EP1545181B1 (ja) |
JP (1) | JP2002368495A (ja) |
CN (1) | CN1278594C (ja) |
DE (1) | DE60233444D1 (ja) |
WO (1) | WO2004028228A1 (ja) |
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JP2002368495A (ja) | 2001-06-08 | 2002-12-20 | Matsushita Electric Ind Co Ltd | 部品実装装置及び部品実装方法 |
CN101209007A (zh) * | 2005-06-27 | 2008-06-25 | 松下电器产业株式会社 | 贴装条件确定方法 |
JP4733499B2 (ja) * | 2005-10-31 | 2011-07-27 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
KR101228315B1 (ko) * | 2005-11-10 | 2013-01-31 | 삼성테크윈 주식회사 | 부품 실장기용 헤드 어셈블리 |
JP4237766B2 (ja) * | 2006-02-10 | 2009-03-11 | パナソニック株式会社 | 部品実装機制御方法、部品実装機およびプログラム |
US8151449B2 (en) * | 2007-01-05 | 2012-04-10 | Universal Instruments Corporation | Component placement machine |
KR20100121491A (ko) * | 2008-02-21 | 2010-11-17 | 파나소닉 주식회사 | 실장 조건 결정 방법 |
JP4582181B2 (ja) | 2008-04-08 | 2010-11-17 | ソニー株式会社 | 部品実装装置、実装品の製造方法 |
JP5131069B2 (ja) * | 2008-07-17 | 2013-01-30 | ソニー株式会社 | ノズルユニット及び部品実装装置 |
US20100122456A1 (en) * | 2008-11-17 | 2010-05-20 | Chen-Hua Yu | Integrated Alignment and Bonding System |
JP5562659B2 (ja) * | 2010-01-21 | 2014-07-30 | オリンパス株式会社 | 実装装置および実装方法 |
JP2012019112A (ja) * | 2010-07-08 | 2012-01-26 | Sony Corp | 部品実装装置、部品実装方法および基板製造方法 |
CN101907772B (zh) * | 2010-07-12 | 2011-12-28 | 南京理工大学 | 红外与微光多光谱融合前端光机结构 |
JP5434884B2 (ja) * | 2010-10-27 | 2014-03-05 | パナソニック株式会社 | 電子部品実装装置および電子部品実装方法 |
JP5440486B2 (ja) * | 2010-12-17 | 2014-03-12 | パナソニック株式会社 | 部品実装装置および部品実装装置における機種切替え方法 |
US8590143B2 (en) * | 2011-05-25 | 2013-11-26 | Asm Technology Singapore Pte. Ltd. | Apparatus for delivering semiconductor components to a substrate |
JP5795882B2 (ja) * | 2011-06-03 | 2015-10-14 | ヤマハ発動機株式会社 | 演算装置、部品実装装置、及びプログラム |
CN102556410A (zh) * | 2012-01-17 | 2012-07-11 | 邹建炀 | 新型旋转90度等分料装置 |
CH707934B1 (de) * | 2013-04-19 | 2017-04-28 | Besi Switzerland Ag | Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat. |
JP5758976B2 (ja) * | 2013-12-20 | 2015-08-05 | ファナック株式会社 | 数値制御装置付き工作機械 |
WO2015128945A1 (ja) * | 2014-02-25 | 2015-09-03 | 富士機械製造株式会社 | 部品装着装置 |
JP5972941B2 (ja) * | 2014-08-06 | 2016-08-17 | ファナック株式会社 | 数値制御装置付き工作機械 |
EP3220730B1 (en) * | 2014-11-11 | 2020-12-23 | FUJI Corporation | Control device for electronic component attaching device |
US10712729B2 (en) * | 2015-04-09 | 2020-07-14 | Panasonic Intellectual Property Management Co., Ltd. | Setting support system for setting operational parameter |
WO2018138815A1 (ja) * | 2017-01-25 | 2018-08-02 | 株式会社Fuji | 制御装置、実装装置及び制御方法 |
US11924976B2 (en) * | 2018-10-11 | 2024-03-05 | Fuji Corporation | Work machine |
CN114473433B (zh) * | 2022-04-15 | 2022-07-08 | 杭州泰尚智能装备有限公司 | 一种xy筋微型密封圈寻角装配装置以及装配方法 |
CN115847073B (zh) * | 2023-02-28 | 2023-05-09 | 广州市德鑫运动用品有限公司 | 一种多自由度镜片加工安装系统 |
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- 2002-09-20 WO PCT/JP2002/009660 patent/WO2004028228A1/ja active Application Filing
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Also Published As
Publication number | Publication date |
---|---|
CN1278594C (zh) | 2006-10-04 |
JP2002368495A (ja) | 2002-12-20 |
EP1545181B1 (en) | 2009-08-19 |
EP1545181A4 (en) | 2006-04-05 |
US20050060883A1 (en) | 2005-03-24 |
US7185422B2 (en) | 2007-03-06 |
EP1545181A1 (en) | 2005-06-22 |
DE60233444D1 (de) | 2009-10-01 |
CN1613284A (zh) | 2005-05-04 |
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