WO2003015154A1 - Procede et support de carte sonde - Google Patents
Procede et support de carte sonde Download PDFInfo
- Publication number
- WO2003015154A1 WO2003015154A1 PCT/JP2002/005216 JP0205216W WO03015154A1 WO 2003015154 A1 WO2003015154 A1 WO 2003015154A1 JP 0205216 W JP0205216 W JP 0205216W WO 03015154 A1 WO03015154 A1 WO 03015154A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probe card
- carrier
- carrying
- probe
- card carrier
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
- B23Q7/14—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting co-ordinated in production lines
- B23Q7/1426—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting co-ordinated in production lines with work holders not rigidly fixed to the transport devices
- B23Q7/1442—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting co-ordinated in production lines with work holders not rigidly fixed to the transport devices using carts carrying work holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020037004505A KR100886988B1 (ko) | 2001-08-07 | 2002-05-29 | 프로브 카드 반송 장치 및 방법 |
US10/380,966 US6838892B2 (en) | 2001-08-07 | 2002-05-29 | Probe card carrier and method of carrying probe card |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-239742 | 2001-08-07 | ||
JP2001239742A JP4798595B2 (ja) | 2001-08-07 | 2001-08-07 | プローブカード搬送装置及びプローブカード搬送方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003015154A1 true WO2003015154A1 (fr) | 2003-02-20 |
Family
ID=19070444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/005216 WO2003015154A1 (fr) | 2001-08-07 | 2002-05-29 | Procede et support de carte sonde |
Country Status (5)
Country | Link |
---|---|
US (1) | US6838892B2 (ja) |
JP (1) | JP4798595B2 (ja) |
KR (1) | KR100886988B1 (ja) |
TW (1) | TW544745B (ja) |
WO (1) | WO2003015154A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI396245B (zh) * | 2005-12-15 | 2013-05-11 | Tokyo Electron Ltd | A probe card loading method and a probe card transfer assisting device used in the present method |
TWI410632B (zh) * | 2005-09-21 | 2013-10-01 | Tokyo Electron Ltd | Probe card loading support device, testing equipment and detection methods |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4391744B2 (ja) * | 2002-12-27 | 2009-12-24 | 東京エレクトロン株式会社 | 移動式プローブカード搬送装置、プローブ装置及びプローブ装置へのプローブカードの搬送方法 |
US6833717B1 (en) * | 2004-02-12 | 2004-12-21 | Applied Materials, Inc. | Electron beam test system with integrated substrate transfer module |
JP2007147536A (ja) * | 2005-11-30 | 2007-06-14 | Tokyo Electron Ltd | プローブカード移載補助装置及び検査設備 |
US20100013508A1 (en) * | 2006-08-09 | 2010-01-21 | Shiro Nozaki | Probe card cassette and probe card |
JP4294684B2 (ja) * | 2006-12-26 | 2009-07-15 | 株式会社協同 | プローブ受渡し装置 |
KR100833285B1 (ko) * | 2006-12-27 | 2008-05-28 | 세크론 주식회사 | 프로브카드 운반장치 |
JP5088167B2 (ja) * | 2008-02-22 | 2012-12-05 | 東京エレクトロン株式会社 | プローブ装置、プロービング方法及び記憶媒体 |
US7683647B1 (en) * | 2008-09-05 | 2010-03-23 | Keithley Instruments, Inc. | Instrument per pin test head |
JP2010271655A (ja) * | 2009-05-25 | 2010-12-02 | Shimadzu Corp | プローバフレーム搬送台車およびプローバフレームハンドリングシステム |
KR101278890B1 (ko) * | 2009-07-30 | 2013-06-26 | 가부시키가이샤 아드반테스트 | 프로브카드 홀딩장치 및 프로버 |
JP5517344B2 (ja) * | 2010-02-12 | 2014-06-11 | 東京エレクトロン株式会社 | プローブカードの搬送機構、プローブカードの搬送方法及びプローブ装置 |
TW201237419A (en) * | 2011-03-09 | 2012-09-16 | Signality System Engineering Co Ltd | Testing board carrier |
KR20120110612A (ko) * | 2011-03-30 | 2012-10-10 | 삼성전자주식회사 | 핸들러 트레이 및 이를 포함하는 테스트 시스템 |
CN103008265A (zh) * | 2011-09-21 | 2013-04-03 | 旺矽科技股份有限公司 | 探针清洁装置以及使用其的在线探针清洁方法 |
KR20130044484A (ko) * | 2011-10-24 | 2013-05-03 | 삼성전자주식회사 | 프로브 카드 핸들링 대차 |
US20130200915A1 (en) * | 2012-02-06 | 2013-08-08 | Peter G. Panagas | Test System with Test Trays and Automated Test Tray Handling |
JP6116992B2 (ja) * | 2013-05-07 | 2017-04-19 | 日置電機株式会社 | 回路基板検査装置 |
DE102013109055A1 (de) * | 2013-08-21 | 2015-02-26 | Turbodynamics Gmbh | Ausrichteinrichtung und Handhabungsvorrichtung |
KR102338464B1 (ko) | 2015-01-08 | 2021-12-15 | 삼성전자주식회사 | 운반물 반송 유닛, 그를 포함하는 운반물 관리 장치 |
CN105417147B (zh) * | 2015-12-25 | 2017-10-10 | 福建联迪商用设备有限公司 | 一种二维码卡抓取存放装置及其方法 |
KR102568707B1 (ko) * | 2018-03-02 | 2023-08-22 | 삼성전자주식회사 | 다단적재 구조를 가지는 무인운반장치 |
JP7310345B2 (ja) * | 2019-06-17 | 2023-07-19 | ニデックアドバンステクノロジー株式会社 | 検査装置 |
KR102480726B1 (ko) * | 2020-12-31 | 2022-12-26 | 주식회사 쎄믹스 | 프로브 카드 체인저가 구비된 프로버 시스템 |
DE102023130896A1 (de) | 2022-11-08 | 2024-05-08 | Turbodynamics Gmbh | Handhabungsvorrichtung zum Transportieren von Schnittstelleneinheiten für eine Testvorrichtung zum Testen von Halbleitern |
TWI835675B (zh) * | 2023-06-20 | 2024-03-11 | 京元電子股份有限公司 | 自動化探針卡取放裝置及其控制方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62169341A (ja) * | 1986-01-21 | 1987-07-25 | Tokyo Electron Ltd | プロ−ブカ−ド自動交換プロ−バ |
JPH05136219A (ja) * | 1991-03-05 | 1993-06-01 | Tokyo Electron Ltd | 検査装置 |
JPH05175290A (ja) * | 1991-12-20 | 1993-07-13 | Tokyo Electron Ltd | プローブ装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4864227A (en) * | 1987-02-27 | 1989-09-05 | Canon Kabushiki Kaisha | Wafer prober |
JPH021141A (ja) | 1988-03-01 | 1990-01-05 | Tokyo Electron Ltd | プローブ装置 |
US5148103A (en) * | 1990-10-31 | 1992-09-15 | Hughes Aircraft Company | Apparatus for testing integrated circuits |
JP2868656B2 (ja) | 1991-11-08 | 1999-03-10 | 東京エレクトロン株式会社 | プローブ装置 |
JPH05136223A (ja) * | 1991-11-08 | 1993-06-01 | Tokyo Electron Yamanashi Kk | プローブ装置 |
JP2606554Y2 (ja) * | 1992-01-17 | 2000-11-27 | 株式会社東京精密 | プロービング装置 |
US5254939A (en) * | 1992-03-20 | 1993-10-19 | Xandex, Inc. | Probe card system |
US5550482A (en) * | 1993-07-20 | 1996-08-27 | Tokyo Electron Kabushiki Kaisha | Probe device |
US5528158A (en) * | 1994-04-11 | 1996-06-18 | Xandex, Inc. | Probe card changer system and method |
JPH11304884A (ja) * | 1998-04-24 | 1999-11-05 | Micronics Japan Co Ltd | 大型回路板用プローバ |
JP4104099B2 (ja) * | 1999-07-09 | 2008-06-18 | 東京エレクトロン株式会社 | プローブカード搬送機構 |
JP3783075B2 (ja) * | 2001-12-13 | 2006-06-07 | 東京エレクトロン株式会社 | プローブ装置及びローダ装置 |
-
2001
- 2001-08-07 JP JP2001239742A patent/JP4798595B2/ja not_active Expired - Fee Related
-
2002
- 2002-05-29 WO PCT/JP2002/005216 patent/WO2003015154A1/ja active Application Filing
- 2002-05-29 KR KR1020037004505A patent/KR100886988B1/ko active IP Right Grant
- 2002-05-29 US US10/380,966 patent/US6838892B2/en not_active Expired - Lifetime
- 2002-06-11 TW TW091112664A patent/TW544745B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62169341A (ja) * | 1986-01-21 | 1987-07-25 | Tokyo Electron Ltd | プロ−ブカ−ド自動交換プロ−バ |
JPH05136219A (ja) * | 1991-03-05 | 1993-06-01 | Tokyo Electron Ltd | 検査装置 |
JPH05175290A (ja) * | 1991-12-20 | 1993-07-13 | Tokyo Electron Ltd | プローブ装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI410632B (zh) * | 2005-09-21 | 2013-10-01 | Tokyo Electron Ltd | Probe card loading support device, testing equipment and detection methods |
TWI396245B (zh) * | 2005-12-15 | 2013-05-11 | Tokyo Electron Ltd | A probe card loading method and a probe card transfer assisting device used in the present method |
Also Published As
Publication number | Publication date |
---|---|
KR100886988B1 (ko) | 2009-03-04 |
US6838892B2 (en) | 2005-01-04 |
JP4798595B2 (ja) | 2011-10-19 |
US20030178987A1 (en) | 2003-09-25 |
JP2003051519A (ja) | 2003-02-21 |
KR20040020863A (ko) | 2004-03-09 |
TW544745B (en) | 2003-08-01 |
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