TW201237419A - Testing board carrier - Google Patents

Testing board carrier Download PDF

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Publication number
TW201237419A
TW201237419A TW100107829A TW100107829A TW201237419A TW 201237419 A TW201237419 A TW 201237419A TW 100107829 A TW100107829 A TW 100107829A TW 100107829 A TW100107829 A TW 100107829A TW 201237419 A TW201237419 A TW 201237419A
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Taiwan
Prior art keywords
test board
test
disposed
guide
substrate
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TW100107829A
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Chinese (zh)
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TWI425214B (en
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Kun-Zhong Chen
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Signality System Engineering Co Ltd
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Publication of TWI425214B publication Critical patent/TWI425214B/zh

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Abstract

A testing board carrier comprises a substrate on which a fixing base is disposed for connection and installation of a testing board. A circular rotary ring is annularly disposed at the outer circumference of the fixing base and is rotatable relative to the fixing base. Around the circumference of the circular rotary ring, several guide grooves with openings and obliquely extended toward the fixing base are disposed, such that the circumference of the testing board can be correspondingly received in the opening of each guide groove. In addition, during the rotation of the circular rotary ring, the testing board is guided and pressed by each guide groove to move closer to the fixing base and then assembled together.

Description

201237419 六、發明說明: 【發明所屬之技術領域】 [0001] 本發明係有關一種測試板載具,尤指一種用於晶圓 ' [0002] 與I c封裝之測試板放置之測試板載具。 【先前技術】 在半導體領域中,不論是丨(:或晶片的半導體測試, 在製造過程中的不同階段都是必須的,而每一個IC在晶 圓與構裝型si都必須經過測試以嫁保其功能。測試的需 求來自兩個考量因素:晶片的新設計與單位產量的提高 〇 ,而隨著晶片功能更強更複雜,高速與精確的測試需求 也就更加重要。 ^ "Γ _ ' ' [0003] 在晶圓型態測試個別的晶片[其過程稱為晶圓探測 ,晶圓探測是在晶片與自動測試設備之間建立暫時的電 性接觸,此為1C設計與功能的重要測誠,以便於進行晶 片分離與昂貴之封裝前,篩選出良好的1C。 [0004] 而在進行晶圓測試^時,則需使用到測試板,俗稱探 〇 針卡(Probe Card),探針卡是由印刷電路板所構成, 其上通常包含有數百支探針,探針於測試時與晶圓上IC 的電子接點(金屬銲墊、墊片)作電性接觸以判斷良莠 〇 [0005] f· 並且,上述之探針卡係設置於一機台之上,且因不 同1C之設計,亦會有不同規格型態之探針卡存在,如此 造成不同的探針卡須於機台連接板上以人工頻繁作抽拔 100107829 ,其中探針卡與連接板之間一般係透過公、母插座來連 接,也因如此,常會使得公、母插座間之連接端子產生 表單編號A0101 第3頁/共22頁 1002013285-0 201237419 碰撞而毀損。 [0006] [0007] [0008] 100107829 此外,上述公、母插座之連接端子的數量係與探針 數量有關,當連接端子之數量較高時,即可設計出更高 數量之測試用探針,然而,在面積有限之探針卡上欲增 加連接端子之數量時,勢得加大探針卡面積或是讓連接 端子微小化,其中加大探針卡面積會產生與機台間組裝 相容性之問題,而微小化之結果亦更容易造成人工組接 按壓時之碰撞毁損問題發生。因此,大多只能將連接端 子之數量維持在一定數目,但如此同時也限制了探針數 量,而單次所能測試之產品數目(d i e的數量)亦隨之受限 。當然,上述間題亦是受到探針卡(測試板)與機台間 之組接關係所影響。 再者,當1C經過封裝後,為確保封裝之品質,仍是 需要進行1C封裝測試,其同樣係採用類似上述之方式, 係將封裝好的1C擺置於測試板上之測試座上,並以探針 作電性接觸測試。其中,亦類似於前述之問題,使得供 封裝1C擺放之測試座的數目受限。 【發明内容】 本發明之主要目的,在於解決上述的問題而提供一 種測試板載具,其係提供一個可與測試板作良好組接設 置之載具,以避免不同測試板於載具上頻繁更換所產生 之連接端子碰撞損毀問題,並可降低測試板設置時間, 而達到提高產能,降低成本之功效。 本發明之次一目的,係在於提供一可增加晶圓或封 裝IC檢測數量以及檢測效率之測試板載具。 表單編號A0101 第4頁/共22頁 1002013285-0 [0009] 201237419 [0010] [0011] [0012] [0013] Ο [0014] ❹ [0015] [0016] [0017] 為達前述之目的,本發明係提供一種測試板載具, 其包括有: 一基板; 一固定座,設於該基板上,該固定座頂面設有數個 可供接設一測試板之第一端子插座,以及數個呈等距設 置之導柱; 一圓形轉環,係環設於該固定座外周而可繞該固定 座旋轉,該圓形轉環一侧凸伸有一操作桿,並沿該圓形 轉環周緣設有數個與該各導柱位置相對之扣合單元,該 各扣合單元上分別設有一具開口且朝該固定座方向斜伸 之導溝,俾供該測試板之周緣可對應容設於該各導溝之 開口中,並於該圓形轉環旋轉時,該測試板即可受該各 導溝之導引壓抵而與該固定座兩兩相向靠近,並令該測 試板與該固定座上之第一端子插座相互組接。 本發明之上述及其他目的與優點,不難從下述所選 用實施例之詳細說明與附圖中,獲得深入了解。 當然,本發明在某些另件上,或另件之安排上容許 有所不同,但所選用之實施例,則於本說明書中,予以 詳細說明,並於附圖中展示其構造。 實施方式】 首先,請參閱第1圖〜第4圖,係本創作所提供之 一種測試板載具,其主要係由一基板1 1、一固定座2 1以及一圓形轉環3 1所組成,其中: 該基板1 1,其頂面設有六個排列呈圓周狀設置之 100107829 表單編號Α0101 第5頁/共22頁 1002013285-0 201237419 ‘輪1 2 ’該基板i i係設於一載台4 1頂面,並於該 載台4 1頂面與該基板1 1底面之間設有一平衡復歸機 構1 3以及一微調機構1 4,該平衡復歸機構1 3係由 數個橫向彈性件1 3 1所構成,且該各橫向彈性件1 3 1係分別以其一端接設於該載台4 i上,另一端勾持於 忒基板11以使該基板11可藉該各橫向彈性件131 所提供之彈力而維持水平定位,而該微調機構i 4則可 供該基板1 1進行位置微調之功效;另於該載台4 i底 面佈設有由數個直立彈性件4 2 ]_組成之避震機構4 2 ,且該載台4 1係藉該各直立彈牲件4 2j而接設於一 測試機底板5 1上,以可有效減鍰該基板Γ1於受力時 所產生之震動。 [0018] [0019] 該固定座2 1,係設於該基板i 1上且位於該各導 輪1 2所圈圍出之空間中,該固定座2 i頂面設有數個 可供接設-測試板6 1之第一端子插座2 2,以及四個 呈等距環向設置之定位部2 3,並於該各定位部2 3令 分別凸設有一導柱2 3 1。 該圓形轉環3 1 ’係環設於該固定座2 1外周,且 該圓形轉環3 1周緣絲與該各導輪丨2相互滑接另 於該圓形轉環3 1周邊設有與該各定位部2 ^置相對 之四個扣σ單①3 2 ’該各扣合單元3 2頂緣分別設有 -具開口3 3 1且逐漸朝該固定座2工方向斜伸之導溝 33 ’於本實施例中,該各導溝33分別自開口331 逐漸朝該固定座2 1方向斜下延伸形成有一傾斜段3 3 2,且該傾斜段3 3 2並延伸形成—水平段3 3 3。並 100107829 表單編號Α0101 第6頁/共22頁 1002013285-0 201237419 =0形轉環3 1-側更向外凸伸有—操作桿34,俾 /、:、作者對錢作桿3 4施力時,即可帶動該圓形轉環 1及°亥各扣合單元3 2同步繞著該固定座2 1旋轉。 [0020] Ο 再者,如第5圖所示,該操作桿3 4底部設有一擋 止件3 5 ’而該基w丄於㈣該操作桿“旋擺幅度 之兩端點處分別設有供該擋止件3 5旋擺後靠抵之兩稽 凹。卩1 5,並於該各擋止凹部1 5中分別設有一可對 應夾持於該擋止件3 5末端之定位機構} 6,俾供定位 該操作桿3 4於旋擺後之位置。於本實施例中,該定位 機構16係於該各擋止凹部15之兩相對侧上分別設有 一容室1 5 1 ’並於該容室1 5Ί中依序設有一彈性件 161以及一頂珠162,且該頂珠162係可受該彈 性件1 6 1之彈抵,而令旋擺進入該檔止四部1 5之擋 止件3 5外周緣得受該頂珠1 6 2之擋止而定位於該擋 止凹部1 5中◊ ;: [0021] 〇 而該測試板6 1,呈圓形且其一面為一測試面6 1 ’該測試板6 1另一面為一連接面6 2,該連接面6 2 上設有數個可與該等第一端子插座2 2相互對應插接之 第二端子插座6 3,並於該測試板6 1之連接面6 2周 緣環設有一以金屬材質所製成之補強環6 4,且於該補 強環6 4對應該固定座2 1之各定位部2 3處分別凸設 有一塊體6 5,該各塊鱧6 5外側設有一軸承6 5 1, 而該各軸承6 5 1係可分別對應容設於該各扣合單元3 2之導溝3 3開口 3 3 1中。另外,該各塊體6 5相對 各該導柱2 3 1位置係各設有一定位孔6 5 2,並藉由 100107829 表單編號A0101 第7頁/共22頁 1002013285-0 201237419 粗細、孔徑之差異來達到導引組接之防呆設計。 [0022] 並藉由於該職板6 1之連接面6 2職環設有由 金屬材質所製成之補強環6 4,而可有效提升該測試板 6 1之強度,以使該測試板6丄在與該固定座2丄相互 組接時,可有效減少該測試板6 li}受力而產生魅曲變 形之情形。 [0023] 接著請參閱第6〜8圖 ,於使用上,係先以該測試 板6 1補強環6 4上之四個軸承6 5 !分別卡入該各扣 合單元32之導溝3 3 , 3 3 !中,接著用手扳動該 操作桿3 4以帶動該圓形轉壤3 i旋轉,此時即會連動 設於該圓轉環3 1上之該各扣合單元3 2同步繞著該 固定座2 1旋轉,並藉由該各扣合單元3. 2上之導溝3 3傾斜段3 3 2之設計,使得該各軸承6 5 i受該傾斜 段3 3 2其斜下設計的結構所壓迫導引,而令該測試板 最終順勢向 6 1得逐漸與該固定座2玉兩兩相向靠近 下抵壓讓各該軸承6 5 1導人至該水平段3 3 3之部份 以完成組接,並且,因為本發明係將該各導溝3 3設計 成具有-落差導引距離(即傾斜段其兩端之高度落差的 距離),該落差導引距離係與該第一、第二端子插座2 2、6 3間之組接距離相等,藉此使該各軸承6 5丄於 扣合至該各導溝3 3之水平段3 3 3後即可完成測試板 6 1之組接,且本發明利用該圓形轉環3丄等距設置之 各扣合單元3 2導溝3 3係可沿該測試板6丄之圓周產 生一相當平均之向下壓力,並進而可確保該第一、第二 端子插座2 2、6 3之接觸平穩性與確實性。 100107829 表單編號A0101 第8頁/共22頁 1002013285-0 201237419 [0024] 综上所述,可知本發明透過該圓形轉環3丄上之才 合單元3 2之各導溝3 3的設計,讓測試板6 i之軸承 6 5 1於組接時受到各個導溝3 3之導勺壓迫最終讓 測試板6 1與固定座2 1能達到受力相當平均的組接效 果,如此,不僅可大幅降低傳統人工組接按壓時,第一 、第二端子插座2 2、6 3間之連接端子容易因碰撞而 毀損之機率。同時’藉由此改良後之優勢,可增加測試 板6 1 (例如探針卡)與固定座2 1之第一、第二端子 插座2 2、6 3之數目並適度微小化,如此,即可於測 Ο 試板6 1之測試面61增設較多之探針,亦即代表著可 同時對更多之晶圓1C元件進行作測試,並進—步提升晶 圓或封裝1C檢測時之數量與效率。 [0025] 惟,以上所述實施例之揭示係用以說明本發明,並 非用以限制本發明,故舉凡數值之變更或等效元件之置 換仍應隸屬本發明之範疇。201237419 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a test board carrier, and more particularly to a test board carrier for a test board placed on a wafer '[0002] and an Ic package) . [Prior Art] In the field of semiconductors, whether it is semiconductor testing of wafers or wafers, it is necessary at different stages in the manufacturing process, and each IC must be tested to marry wafers and structures. The need for testing comes from two considerations: the new design of the chip and the increase in unit yield, and as the chip becomes more powerful and complex, the need for high-speed and accurate testing is even more important. ^ "Γ _ ' ' [0003] Testing individual wafers in wafer type [The process is called wafer inspection. Wafer detection is a temporary electrical contact between the wafer and the automatic test equipment. This is important for 1C design and function. In order to facilitate wafer separation and expensive packaging, a good 1C is screened out. [0004] When performing wafer testing, a test board is required, commonly known as a Probe Card. The pin card is made up of a printed circuit board, which usually contains hundreds of probes. The probe is electrically contacted with the electronic contacts (metal pads, pads) of the IC on the wafer during the test to judge the good莠〇[000 5] f· Also, the probe card mentioned above is set on a machine table, and because of the different 1C design, there are different probe cards of different specifications, which causes different probe cards to be on the machine. The connecting plate on the table is manually pulled and pulled 100107829. The probe card and the connecting plate are generally connected through the male and female sockets. Therefore, the connection terminal between the male and female sockets often generates the form number A0101. 3 pages/total 22 pages 1002013285-0 201237419 Collision and damage. [0006] [0007] 100107829 In addition, the number of connection terminals of the above-mentioned male and female sockets is related to the number of probes, when the number of connection terminals is high At the same time, a higher number of test probes can be designed. However, when the number of connection terminals is increased on a probe card having a limited area, the probe card area is increased or the connection terminals are miniaturized. Increasing the probe card area will cause compatibility problems with the assembly between the machines, and the result of miniaturization will be more likely to cause collision and damage problems when the manual assembly is pressed. Therefore, most of the connection terminals can only be used. Maintaining a certain number, but it also limits the number of probes, and the number of products that can be tested in a single pass (the number of die) is also limited. Of course, the above questions are also subject to the probe card (test board) In addition, when 1C is packaged, in order to ensure the quality of the package, it is still necessary to carry out 1C package test, which is also similar to the above method, the packaged 1C pendulum It is placed on the test stand of the test board, and the probe is used for electrical contact test. Among them, similar to the foregoing problem, the number of test sockets for the package 1C is limited. [Invention] The main purpose is to solve the above problems and provide a test board carrier that provides a carrier that can be assembled with the test board to avoid collision of connection terminals generated by frequent replacement of different test boards on the carrier. Damage problems, and can reduce the test board setup time, and achieve the effect of increasing productivity and reducing costs. A second object of the present invention is to provide a test board carrier that increases the number of wafer or package IC inspections and detection efficiency. Form No. A0101 Page 4 / Total 22 Pages 1002013285-0 [0009] 201237419 [0010] [0012] [0014] [0016] [0016] [0017] For the purposes of the foregoing, this The invention provides a test board carrier, comprising: a substrate; a fixing base disposed on the substrate, the top surface of the fixing base is provided with a plurality of first terminal sockets for connecting a test board, and a plurality of a guide post arranged equidistantly; a circular swivel, the loop is disposed on the outer circumference of the mount and rotatable around the mount, the side of the circular swivel protrudes with an operating rod along the circular swivel The peripheral edge is provided with a plurality of fastening units opposite to the positions of the guide posts, and each of the fastening units is respectively provided with a guiding groove having an opening and extending obliquely toward the fixing seat, so that the circumference of the test board can be correspondingly accommodated In the opening of each guiding groove, and when the circular rotating ring rotates, the test board can be pressed against the guiding groove by the guiding of the guiding grooves, and the test board and the test board are The first terminal sockets on the mount are assembled to each other. The above and other objects and advantages of the present invention will become more apparent from the detailed description of the preferred embodiments illustrated herein Of course, the invention may be varied on certain components, or in the arrangement of the components, but the selected embodiments are described in detail in the specification and their construction is shown in the drawings. First, please refer to FIG. 1 to FIG. 4 , which is a test board carrier provided by the present invention, which mainly comprises a substrate 1 1 , a fixing base 2 1 and a circular rotating ring 3 1 . The composition, wherein: the substrate 1 1 has a top surface provided with six arranged circumferentially arranged 100107829 Form No. 1010101 Page 5 / Total 22 pages 1002013285-0 201237419 'Round 1 2 'The substrate ii is set in one A top surface of the stage 4 1 and a balance resetting mechanism 13 and a fine adjustment mechanism 14 are disposed between the top surface of the stage 4 1 and the bottom surface of the substrate 11. The balance resetting mechanism 13 is composed of a plurality of transverse elastic members. 1 3 1 is configured, and each of the transverse elastic members 1 3 1 is respectively connected to the loading table 4 i at one end thereof, and the other end is hooked on the cymbal substrate 11 so that the substrate 11 can be affixed to the lateral elastic members 131 provides the spring force to maintain the horizontal positioning, and the fine adjustment mechanism i 4 can be used for the fine adjustment of the position of the substrate 11; and the bottom surface of the stage 4 i is provided with a plurality of upright elastic members 4 2 ] The suspension mechanism 4 2 , and the stage 4 1 is connected to a test machine bottom plate by the vertical standing members 4 2j 5 1 is used to effectively reduce the vibration generated by the substrate Γ1 when subjected to a force. [0019] The fixing base 2 1 is disposed on the substrate i 1 and located in a space surrounded by the guide wheels 12 , and the top surface of the fixing base 2 i is provided with several connectors - a first terminal socket 2 2 of the test board 6-1, and four positioning portions 23 disposed equidistantly in the circumferential direction, and a guide post 2 3 1 is respectively protruded from the positioning portions 2 3 . The circular ring 3 1 'ring is disposed on the outer circumference of the fixing seat 2 1 , and the peripheral wire of the circular rotating ring 3 1 and the guiding wheel rim 2 are mutually slidably connected to each other and disposed around the circular rotating ring 3 1 There are four buckles σ 13 2 ′ opposite to the positioning portions 2 2 . The top edges of the fastening units 3 2 are respectively provided with a guide groove having an opening 3 3 1 and gradually extending obliquely toward the working direction of the fixing seat 2 . In the present embodiment, each of the guide grooves 33 gradually extends obliquely downward from the opening 331 toward the fixed seat 21 to form an inclined section 3 3 2 , and the inclined section 3 3 2 extends to form a horizontal section 3 3 3. And 100107829 Form No. 1010101 Page 6/Total 22 Pages 1002013285-0 201237419 =0-shaped swivel 3 1-side more outwardly protruding - operating lever 34, 俾 /, :, author to the money rod 3 4 force At this time, the circular swivel 1 and the respective snapping unit 3 2 can be rotated to rotate around the fixed seat 2 1 . [0020] Further, as shown in FIG. 5, the bottom of the operating rod 34 is provided with a stopping member 35', and the base is disposed at (four) the operating rod "the two ends of the swinging amplitude are respectively provided. The retaining member 35 is pivoted and then abutted against the two recesses 卩15, and each of the blocking recesses 15 is provided with a positioning mechanism corresponding to the end of the blocking member 35. The positioning mechanism 16 is provided with a chamber 1 5 1 ' on opposite sides of the respective blocking recesses 15 respectively. An elastic member 161 and a top bead 162 are sequentially disposed in the chamber 15 5 , and the top bead 162 is elastically resisted by the elastic member 116 to allow the swing to enter the stop of the four stops. The outer periphery of the piece 3 5 is positioned in the stop recess 15 by the stop of the top bead 162; [0021] The test plate 6-1 is circular and one side is a test surface 6 1 'the other side of the test board 6 1 is a connecting surface 6 2 , and the connecting surface 6 2 is provided with a plurality of second terminal sockets 6 3 which can be inserted into and corresponding to the first terminal sockets 2 2 , and Test board 6 A connecting ring 6 of 2 is provided with a reinforcing ring 64 made of a metal material, and a body 6 5 is respectively protruded from each positioning portion 23 of the reinforcing ring 6 4 corresponding to the fixing seat 2 1 . A bearing 615 is disposed on the outer side of each of the cymbals 65, and the bearings 615 are respectively accommodated in the openings 3 3 1 of the guide grooves 3 3 of the fastening units 32. Each of the blocks 65 is provided with a positioning hole 6 5 2 relative to each of the guide posts 2 3 1 , and is guided by the difference between the thickness and the aperture of 100107829 Form No. A0101 Page 7 / Total 22 Page 1002013285-0 201237419 The design of the test panel is improved by the reinforced ring 64 made of metal material. The strength is such that when the test board 6 is assembled with the fixed seat 2丄, the test piece 6 li} can be effectively reduced to cause a distortion of the charm. [0023] Next, please refer to the 6th to 8th. In the figure, the four bearings 6 5 on the reinforcing ring 64 of the test board 6 1 are respectively inserted into the guide grooves 3 3 , 3 3 ! of the fastening units 32, respectively. The operating lever 3 is pulled by hand to drive the circular turn 3 i to rotate. At this time, the fastening units 3 2 disposed on the circular ring 31 are synchronously wound around the fixed seat 2 1 is rotated, and by the design of the inclined section 3 3 2 of the guide groove 3 3 on each of the fastening units 3.2, the bearings 65 5 i are pressed by the inclined design of the inclined section 3 3 2 Guided, so that the test board finally has a tendency to gradually move toward the lower side of the fixed seat 2, and let the bearing 65 1 lead to the part of the horizontal section 3 3 3 to complete the group. And, because the present invention is designed to have the guide groove 3 3 having a drop-off guiding distance (ie, a distance of the height difference between the two ends of the inclined section), the drop guiding distance is the first and second The assembly distance between the terminal sockets 2, 6 and 3 is equal, thereby completing the assembly of the test boards 6 1 after the bearings 65 are snapped to the horizontal sections 3 3 3 of the guide grooves 3 3 . And the present invention utilizes the circular swivel 3 丄 equidistantly disposed fastening units 3 2 the guide groove 3 3 to generate a relatively average downward pressure along the circumference of the test plate 6 ,, and further The contact stability and the reliability of the first and second terminal sockets 2, 6 3 can be ensured. 100107829 Form No. A0101 Page 8 of 22 1002013285-0 201237419 [0024] In summary, it can be seen that the present invention transmits through the design of the guide grooves 3 3 of the unit 3 2 on the circular swivel 3丄, The bearing 6 5 1 of the test board 6 i is pressed by the guide vanes of the respective guide grooves 3 3 at the time of assembly, and finally the test board 6 1 and the fixed seat 2 1 can achieve a fairly even assembly effect, so that not only When the conventional manual assembly pressing is greatly reduced, the connection terminals between the first and second terminal sockets 2, 6 3 are easily damaged by collision. At the same time, by virtue of the improved advantage, the number of the first and second terminal sockets 2 2, 6 3 of the test board 6 1 (for example, the probe card) and the fixed seat 2 1 can be increased and moderately miniaturized, that is, More probes can be added to the test surface 61 of the test panel 61, which means that more wafer 1C components can be tested at the same time, and the number of wafers or package 1C inspections can be further improved. With efficiency. The disclosure of the above-described embodiments is intended to be illustrative of the present invention and is not intended to limit the scope of the present invention.

1 - ;.":!:I: I1 - ;.":!:I: I

[0026] 由以上詳細說明,可使熟知本項技藝者明瞭本發明 Q 的確可達成前述目的,實已符合專利法之規定,爱提出 專利申請。 【圖式簡單說明】 [0027] 第1圖係本發明載具與測試板之立體示意圖 [0028] 第2圖係本發明載具與測試板之局部放大示意圖 [0029] 第3圖係本發明載具之側視圖 [0030]第4圖係本發明載具之俯視圖,其中操作桿處於扳動前 之狀態 100107829 表單編號A0101 第9頁/共22頁 1002013285-0 201237419 [0031] 第5圖係本發明操作桿之擂止件與定位機構之結構示意 圖 [0032] 第6圖係本發明之使用狀態示意圖,係用以顯示當測試 板組設於載具基板上時之狀態 [0033] 第7圖係本發明之使用狀態示意圖,係用以顯示當扳動 操作桿時之狀態 [0034] 第8圖係本發明之使用狀態示意圖,係用以顯示完成測 試板組接時之狀態 【主要元件符號說明】 [0035] 基板1 1 導輪1 2 [0036] 平衡復歸機構13 微調機構14 [0037] 橫向彈性件1 3 1 擋止凹部1 5 [0038] 定位機構16 彈性件161 [0039] 頂珠1 6 2 固定座2 1 [0040] 第一端子插座2 2 定位部2 3 [0041] 導柱2 3 1 圓形轉環3 1 [0042] 扣合單元3 2 導溝3 3 [0043] 開口 3 3 1 傾斜段3 3 2 [0044] 水平段3 3 3 操作桿3 4 [0045] 擋止件3 5 載台4 1 [0046] 避震機構4 2 直立彈性件4 2 表單編號A0101 第10頁/共22頁 100107829 1002013285-0 201237419 [0047] 測試機底板51 測試板6 1 [0048] 測試面6 1 連接面6 2 [0049] 第二端子插座6 3 補強環6 4 [0050] 塊體6 5 軸承6 5 1 [0051] 定位孔6 5 2 Ο 1002013285-0 100107829 表單編號Α0101 第11頁/共22頁From the above detailed description, it will be apparent to those skilled in the art that the present invention can be achieved by the fact that Q of the present invention can achieve the aforementioned objectives, and that it has been in compliance with the provisions of the Patent Law and has filed a patent application. BRIEF DESCRIPTION OF THE DRAWINGS [0027] FIG. 1 is a perspective view showing a carrier and a test board of the present invention. [0028] FIG. 2 is a partially enlarged schematic view showing a carrier and a test board of the present invention. [0029] FIG. 3 is a view of the present invention. Side view of the vehicle [0030] Fig. 4 is a plan view of the carrier of the present invention, wherein the operating lever is in a state before being pulled 100107829 Form No. A0101 Page 9 / Total 22 pages 1002013285-0 201237419 [0031] Figure 5 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 6 is a schematic view showing the state of use of the present invention for displaying the state when the test board is assembled on the carrier substrate. [0033] No. 7 Figure is a schematic view showing the state of use of the present invention for displaying the state when the operating lever is pulled. [0034] Fig. 8 is a schematic view showing the state of use of the present invention for displaying the state when the test board is assembled [main components] DESCRIPTION OF SYMBOLS [0035] Substrate 1 1 Guide wheel 1 2 [0036] Balance reset mechanism 13 Fine adjustment mechanism 14 [0037] Transverse elastic member 1 3 1 Stop recess 1 5 [0038] Positioning mechanism 16 Elastic member 161 [0039] 1 6 2 Fixing seat 2 1 [0040] First terminal plug 2 2 Positioning part 2 3 [0041] Guide post 2 3 1 Round swivel 3 1 [0042] Fastening unit 3 2 Guide groove 3 3 [0043] Opening 3 3 1 Tilting section 3 3 2 [0044] Horizontal section 3 3 3 Operating lever 3 4 [0045] Stopper 3 5 Stage 4 1 [0046] Shock absorber 4 2 Upright elastic part 4 2 Form number A0101 Page 10 of 22 100107829 1002013285-0 201237419 [0047] Test Machine floor 51 Test board 6 1 [0048] Test surface 6 1 Connection surface 6 2 [0049] Second terminal socket 6 3 Reinforcement ring 6 4 [0050] Block 6 5 Bearing 6 5 1 [0051] Positioning hole 6 5 2 Ο 1002013285-0 100107829 Form No. 1010101 Page 11 of 22

Claims (1)

201237419 七、申請專利範圍: 1 . 一種測試板載具,其包括有. 一基板; 供接:=板=該基板上’該固定座頂面_個可 導柱 第〜插座,以及數個呈等距設置之 -圓形轉環,係環設於該固 旋轉’該圓形轉環-側凸伸有一操。而可一玄固定座 周緣設有數個與該各導_置相對沿該圓形轉環 單7"上分別設有-具開σ且朝該曾定座方:::=合 俾供該測試板之周緣可對絲設料各料w之導溝’ 於該圓形轉環旋轉時,該測試板即可受該各之開口中,並 抵而與該固定座兩兩相向靠近,並w &導溝之導引壓 上之第-端子插座相互组接。鳴別試板與該固定座 依申清專利範圍第1項所述之測試板栽具 面設有數個排列呈圓周狀設置之導輪,“= 係恰與該各導輪相互滑接。 释衣周緣 依申請專利範圍第1項所述之測試故栽具 設於一載台頂面,並於該載台頂面與誘武”中忒基板係 -平衡復歸機構以及一微調機構,t 板底面之間设有 個橫向彈性件所構成,且該錢向彈歸機構係由數 接設於該載台上’另一端勾持於該基板以使节=二: 各橫向彈性件所提供之彈力_持水平定f微= 構則可供該基板進行位置微調之功效。 依申請專利範圍第!項所述之測試板載具,其中該栽台底 100107829 表單編號A0101 第12頁/共22頁 1002013285-0 201237419 面佈設有由數個直立彈性件組成之避震機構,且該載台係 藉該各直立彈性件而接設於一測試機底板上。 5 .依申請專利範圍第1項所述之測試板載具,其中該操作桿 底部更設有一擋止件,且該基板於相對該操作桿旋擺幅度 之兩端點處分別設有供該擋止件旋擺後靠抵之兩擋止凹部 ,並於該各擋止凹部中分別設有一可對應夾持於該擋止件 末端之定位機構。 6 .依申請專利範圍第5項所述之測試板載具,其中該定位機 構係於該各擋止凹部之兩相對侧上分別設有一容室,並於 0 該容室中依序設有一彈性件以及一頂珠,且該頂珠係可受 該彈性件之彈抵而擋止於旋入該擋止凹部中之擋止件外周 緣上。 7.依申請專利範圍第1項所述之測試板載具,其中該各導溝 分別自開口逐漸朝該固定座方向斜下延伸形成有一傾斜段 ,且該傾斜段並延伸形成一水平段。 8 .依申請專利範圍第7項所述之測試板載具,其中該各導溝 之傾斜段兩端間係具有一落差導引距離,且該落差導引距 Q 離係與該測試板與該固定座間之組接距離相等。 9 .依申請專利範圍第1項所述之測試板載具,其中該測試板 呈圓形且其一面為一測試面,該測試板另一面為一連接面 ,該連接面上設有數個可與該等第一端子插座相互對應插 接之第二端子插座,並於該測試板之連接面周緣環設有一 補強環,且於該補強環對應該各定位部處分別凸設有一塊 體,該各塊體外側設有一軸承,而該各軸承係可分別對應 容設於該各扣合單元之導溝開口中。 10 .依申請專利範圍第9項所述之測試板載具,其中該各塊體 100107829 表單編號 A0101 第 13 頁/共 22 頁 1002013285-0 201237419 相對該固定座之各該導柱位置係各設有一定位孔。 100107829 表單編號A0101 第14頁/共22頁 1002013285-0201237419 VII. Patent application scope: 1. A test board carrier, which comprises: a substrate; a connection: = board = 'the top surface of the fixed seat _ a guide pillar ~ socket, and several Isometrically set - a circular swivel, the loop is set on the solid rotation 'the circular swivel - the side convex has a handle. And a plurality of circumferences of the shackle can be arranged opposite to the guides along the circular slewing ring 7" respectively, with the opening σ and toward the seat:::= for the test The circumference of the plate can be used to guide the groove of each material w of the wire. When the circular ring rotates, the test plate can be received by the openings, and the two sides of the plate are adjacent to each other, and The first terminal sockets of the guide groove of the guide groove are connected to each other. The sounding test board and the fixing seat are provided with a plurality of guide wheels arranged in a circumferential direction according to the test plate planting surface described in the first paragraph of the patent scope of the Shenqing, and the "= system is slidably coupled to the respective guide wheels. The garment circumference is tested on the top surface of a loading table according to the first item of the patent application scope, and on the top surface of the stage and the lure of the middle 忒 substrate system - balance reset mechanism and a fine adjustment mechanism, t board A transverse elastic member is disposed between the bottom surfaces, and the money is attached to the loading platform by the number of the rebounding mechanism. The other end is hooked on the substrate to make the knot=two: the elastic force provided by each transverse elastic member. _ Holding the horizontal setting f micro = structure can be used for the position of the substrate to fine-tune. According to the scope of the patent application! The test board carrier described in the item, wherein the platform bottom 100107829 Form No. A0101 Page 12 / Total 22 pages 1002013285-0 201237419 The surface cloth is provided with a shock absorber mechanism composed of a plurality of upright elastic members, and the stage is borrowed The upright elastic members are connected to a tester bottom plate. 5. The test board carrier according to claim 1, wherein the bottom of the operating rod is further provided with a stopping member, and the substrate is respectively provided at a position opposite to the swinging amplitude of the operating rod. The stopping member is pivoted to abut against the two stopping recesses, and a positioning mechanism corresponding to the end of the blocking member is respectively disposed in each of the blocking recesses. 6. The test board carrier according to claim 5, wherein the positioning mechanism is respectively provided with a chamber on opposite sides of the blocking recesses, and is sequentially disposed in the chamber. The elastic member and a top bead, and the top bead can be blocked by the elastic member to block the outer periphery of the stopper screwed into the blocking recess. 7. The test board carrier according to claim 1, wherein each of the guide grooves gradually extends obliquely downward from the opening toward the fixed seat to form an inclined section, and the inclined section extends to form a horizontal section. 8. The test board carrier according to claim 7, wherein the inclined sections of the guiding grooves have a drop guiding distance between the two ends, and the falling guiding distance Q and the test board are The assembly distance between the fixing seats is equal. 9. The test board carrier according to claim 1, wherein the test board has a circular shape and one side of the test board is a test surface, and the other side of the test board is a connecting surface, and the connecting surface is provided with a plurality of a second terminal socket that is inserted into the first terminal socket, and a reinforcing ring is disposed on the periphery of the connecting surface of the test board, and a body is respectively protruded from the positioning portion of the reinforcing ring. A bearing is disposed on the outer side of each of the blocks, and the bearing systems are respectively accommodated in the opening of the guide groove of each of the fastening units. 10. The test board carrier according to claim 9 of the patent application scope, wherein the blocks 100107829 form number A0101 page 13/22 pages 1002013285-0 201237419 each of the guide post positions of the fixed seat There is a positioning hole. 100107829 Form No. A0101 Page 14 of 22 1002013285-0
TW100107829A 2011-03-09 2011-03-09 Testing board carrier TW201237419A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110068711A (en) * 2018-01-24 2019-07-30 中华精测科技股份有限公司 Probe card device and rectangular probe

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5528158A (en) * 1994-04-11 1996-06-18 Xandex, Inc. Probe card changer system and method
JP3364401B2 (en) * 1996-12-27 2003-01-08 東京エレクトロン株式会社 Probe card clamp mechanism and probe device
JP4798595B2 (en) * 2001-08-07 2011-10-19 東京エレクトロン株式会社 Probe card transfer device and probe card transfer method
WO2003058768A1 (en) * 2001-12-28 2003-07-17 Nhk Spring Co., Ltd. Socket for inspection
TW201044497A (en) * 2009-06-12 2010-12-16 Signality System Engineering Co Ltd Test board and jig thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110068711A (en) * 2018-01-24 2019-07-30 中华精测科技股份有限公司 Probe card device and rectangular probe

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