EP1197988A3 - Multiple wafer lift apparatus and method therefor - Google Patents

Multiple wafer lift apparatus and method therefor Download PDF

Info

Publication number
EP1197988A3
EP1197988A3 EP01122207A EP01122207A EP1197988A3 EP 1197988 A3 EP1197988 A3 EP 1197988A3 EP 01122207 A EP01122207 A EP 01122207A EP 01122207 A EP01122207 A EP 01122207A EP 1197988 A3 EP1197988 A3 EP 1197988A3
Authority
EP
European Patent Office
Prior art keywords
substrate
cell
method therefor
lift apparatus
multiple wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP01122207A
Other languages
German (de)
French (fr)
Other versions
EP1197988A2 (en
EP1197988B1 (en
Inventor
William Nixon Taylor Jr.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US686211 priority Critical
Priority to US09/686,211 priority patent/US6485248B1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of EP1197988A2 publication Critical patent/EP1197988A2/en
Publication of EP1197988A3 publication Critical patent/EP1197988A3/en
Application granted granted Critical
Publication of EP1197988B1 publication Critical patent/EP1197988B1/en
Application status is Expired - Fee Related legal-status Critical
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/136Associated with semiconductor wafer handling including wafer orienting means

Abstract

An apparatus and associated method for transporting a first substrate and a second substrate relative to a cell. The cell contains a pedestal that is configured to interact with a single substrate. When swapping wafers in a cell, a first substrate is displaced from the pedestal to a remote location and a second substrate is inserted into the cell and onto the pedestal. The first substrate is then removed from the cell.
EP20010122207 2000-10-10 2001-09-17 Multiple wafer lift apparatus and method therefor Expired - Fee Related EP1197988B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US686211 1996-07-23
US09/686,211 US6485248B1 (en) 2000-10-10 2000-10-10 Multiple wafer lift apparatus and associated method

Publications (3)

Publication Number Publication Date
EP1197988A2 EP1197988A2 (en) 2002-04-17
EP1197988A3 true EP1197988A3 (en) 2006-02-08
EP1197988B1 EP1197988B1 (en) 2010-10-20

Family

ID=24755389

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20010122207 Expired - Fee Related EP1197988B1 (en) 2000-10-10 2001-09-17 Multiple wafer lift apparatus and method therefor

Country Status (6)

Country Link
US (1) US6485248B1 (en)
EP (1) EP1197988B1 (en)
JP (1) JP4386603B2 (en)
KR (1) KR100857660B1 (en)
DE (1) DE60143282D1 (en)
TW (1) TW501967B (en)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1401617A1 (en) * 2000-09-01 2004-03-31 Asyst Technologies, Inc. Edge grip aligner with buffering capabilities
KR100394576B1 (en) * 2001-06-12 2003-08-14 삼성전자주식회사 Device for monitoring speed and operating time of wafer lift of semiconductor product device
US6767176B2 (en) * 2001-06-29 2004-07-27 Applied Materials, Inc. Lift pin actuating mechanism for semiconductor processing chamber
JP2003037146A (en) * 2001-07-24 2003-02-07 Asm Japan Kk Semiconductor manufacturing apparatus having buffer mechanism and method
US6824343B2 (en) 2002-02-22 2004-11-30 Applied Materials, Inc. Substrate support
JP4244555B2 (en) 2002-02-25 2009-03-25 東京エレクトロン株式会社 Support mechanism for workpiece
JP3956350B2 (en) * 2002-03-25 2007-08-08 東京エレクトロン株式会社 Substrate processing apparatus having positioning function and substrate processing method having positioning function
SG115629A1 (en) 2003-03-11 2005-10-28 Asml Netherlands Bv Method and apparatus for maintaining a machine part
SG115631A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Lithographic projection assembly, load lock and method for transferring objects
JP4121413B2 (en) * 2003-03-31 2008-07-23 大日本スクリーン製造株式会社 High-pressure processing equipment for plate-like products
US7044476B2 (en) * 2003-11-25 2006-05-16 N&K Technology, Inc. Compact pinlifter assembly integrated in wafer chuck
JP4568231B2 (en) * 2003-12-01 2010-10-27 株式会社日立国際電気 Substrate processing apparatus and semiconductor device manufacturing method
KR100549273B1 (en) * 2004-01-15 2006-02-03 주식회사 테라세미콘 Wafer-Holder for Semiconductor Manufacturing Process
WO2005069352A1 (en) * 2004-01-16 2005-07-28 Icos Vision Systems N.V. Lifting device and method for lifting and changing wafers
JP4559801B2 (en) * 2004-09-06 2010-10-13 東京エレクトロン株式会社 Wafer chuck
KR100596327B1 (en) 2004-09-08 2006-07-06 주식회사 에이디피엔지니어링 Apparatus for processing substrate with plasma
US20060182589A1 (en) * 2005-01-20 2006-08-17 Pi-Tang Chiu Plate support having movable ribs for adjusting and guiding a wafer
US7438175B2 (en) * 2005-06-10 2008-10-21 Applied Materials, Inc. Linear vacuum deposition system
JP4664142B2 (en) 2005-07-21 2011-04-06 住友重機械工業株式会社 Stage equipment
US8322299B2 (en) * 2006-05-17 2012-12-04 Taiwan Semiconductor Manufacturing Co., Ltd. Cluster processing apparatus for metallization processing in semiconductor manufacturing
US7690881B2 (en) * 2006-08-30 2010-04-06 Asm Japan K.K. Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus
US8057153B2 (en) * 2006-09-05 2011-11-15 Tokyo Electron Limited Substrate transfer device, substrate processing apparatus and substrate transfer method
US8041450B2 (en) * 2007-10-04 2011-10-18 Asm Japan K.K. Position sensor system for substrate transfer robot
US7963736B2 (en) * 2008-04-03 2011-06-21 Asm Japan K.K. Wafer processing apparatus with wafer alignment device
WO2010046975A1 (en) * 2008-10-22 2010-04-29 川崎重工業株式会社 Prealigner
US8666551B2 (en) * 2008-12-22 2014-03-04 Asm Japan K.K. Semiconductor-processing apparatus equipped with robot diagnostic module
JP5295095B2 (en) 2008-12-29 2013-09-18 ケー.シー.テック カンパニー リミテッドK.C.Tech Co.,Ltd. Atomic layer deposition equipment
US9859141B2 (en) 2010-04-15 2018-01-02 Suss Microtec Lithography Gmbh Apparatus and method for aligning and centering wafers
US8267143B2 (en) * 2009-04-16 2012-09-18 Suss Microtec Lithography, Gmbh Apparatus for mechanically debonding temporary bonded semiconductor wafers
US9837295B2 (en) 2010-04-15 2017-12-05 Suss Microtec Lithography Gmbh Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
KR101135853B1 (en) * 2009-05-29 2012-04-16 주식회사 케이씨텍 Atomic layer deposition apparatus
AT11604U1 (en) * 2009-08-20 2011-01-15 Aichholzer Johann Ing Carrier for wafer
DE102011050324A1 (en) * 2011-05-12 2012-11-29 Roth & Rau Ag Substrate transport module, loading and unloading system and transport method for substrates in a substrate processing plant
JP5847298B2 (en) * 2012-04-12 2016-01-20 三菱電機株式会社 Wire electrical discharge machining apparatus and semiconductor wafer manufacturing method using the same
US9016998B2 (en) * 2013-03-14 2015-04-28 Varian Semiconductor Equipment Associates, Inc. High throughput, low volume clamshell load lock
JP2015061049A (en) * 2013-09-20 2015-03-30 日本電産リード株式会社 Processing object conveyance system, and substrate inspection system
CN103496574B (en) * 2013-10-12 2015-06-10 四川蓝彩电子科技有限公司 Clamping and conveying device and method for wafer pin electroplating
JP2016082216A (en) * 2014-10-09 2016-05-16 東京エレクトロン株式会社 Temperature control mechanism for workpiece, and method for selectively etching nitride film from multilayer film
JP6456712B2 (en) * 2015-02-16 2019-01-23 東京エレクトロン株式会社 Substrate holding mechanism and substrate processing apparatus using the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5664254A (en) * 1995-02-02 1997-09-02 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
DE29716440U1 (en) * 1997-09-12 1997-12-11 Balzers Hochvakuum sputtering station
WO1999018601A1 (en) * 1997-10-08 1999-04-15 Applied Materials, Inc. Robot blade with dual offset wafer supports
US5989346A (en) * 1995-12-12 1999-11-23 Tokyo Electron Limited Semiconductor processing apparatus
WO2000060414A1 (en) * 1999-04-02 2000-10-12 Silicon Valley Group, Thermal Systems Llc Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5100502A (en) * 1990-03-19 1992-03-31 Applied Materials, Inc. Semiconductor wafer transfer in processing systems
US5879128A (en) * 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber
US6190113B1 (en) * 1997-04-30 2001-02-20 Applied Materials, Inc. Quartz pin lift for single wafer chemical vapor deposition/etch process chamber
US5899653A (en) * 1997-06-23 1999-05-04 Applied Materials, Inc. Two-stage vacuum bellows
US6309163B1 (en) * 1997-10-30 2001-10-30 Applied Materials, Inc. Wafer positioning device with storage capability
US6151446A (en) * 1999-07-06 2000-11-21 Applied Materials, Inc. Apparatus and method for thermally processing substrates including a processor using multiple detection signals

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5664254A (en) * 1995-02-02 1997-09-02 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
US5989346A (en) * 1995-12-12 1999-11-23 Tokyo Electron Limited Semiconductor processing apparatus
DE29716440U1 (en) * 1997-09-12 1997-12-11 Balzers Hochvakuum sputtering station
WO1999018601A1 (en) * 1997-10-08 1999-04-15 Applied Materials, Inc. Robot blade with dual offset wafer supports
WO2000060414A1 (en) * 1999-04-02 2000-10-12 Silicon Valley Group, Thermal Systems Llc Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system

Also Published As

Publication number Publication date
TW501967B (en) 2002-09-11
EP1197988B1 (en) 2010-10-20
JP4386603B2 (en) 2009-12-16
DE60143282D1 (en) 2010-12-02
EP1197988A2 (en) 2002-04-17
JP2002198418A (en) 2002-07-12
KR100857660B1 (en) 2008-09-08
KR20020028841A (en) 2002-04-17
US6485248B1 (en) 2002-11-26

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