WO2003014426A1 - Procede de production de particules electro-conductrices - Google Patents

Procede de production de particules electro-conductrices Download PDF

Info

Publication number
WO2003014426A1
WO2003014426A1 PCT/JP2002/007794 JP0207794W WO03014426A1 WO 2003014426 A1 WO2003014426 A1 WO 2003014426A1 JP 0207794 W JP0207794 W JP 0207794W WO 03014426 A1 WO03014426 A1 WO 03014426A1
Authority
WO
WIPO (PCT)
Prior art keywords
particles
plated
barrel
plating layer
plating
Prior art date
Application number
PCT/JP2002/007794
Other languages
English (en)
French (fr)
Inventor
Yoshiaki Tanaka
Nobuyuki Okinaga
Manabu Matsubara
Original Assignee
Sekisui Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co., Ltd. filed Critical Sekisui Chemical Co., Ltd.
Priority to KR10-2004-7001429A priority Critical patent/KR20040019089A/ko
Priority to DE10296936T priority patent/DE10296936T5/de
Priority to US10/485,369 priority patent/US7045050B2/en
Publication of WO2003014426A1 publication Critical patent/WO2003014426A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/006—Nanoparticles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18—Non-metallic particles coated with metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/18—Apparatus for electrolytic coating of small objects in bulk having closed containers
    • C25D17/20—Horizontal barrels
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemically Coating (AREA)
  • Powder Metallurgy (AREA)
PCT/JP2002/007794 2001-07-31 2002-07-31 Procede de production de particules electro-conductrices WO2003014426A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR10-2004-7001429A KR20040019089A (ko) 2001-07-31 2002-07-31 도전성 미립자의 제조 방법
DE10296936T DE10296936T5 (de) 2001-07-31 2002-07-31 Verfahren zur Herstellung von elektroleitfähigen Teilchen
US10/485,369 US7045050B2 (en) 2001-07-31 2002-07-31 Method for producing electroconductive particles

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001-231927 2001-07-31
JP2001231927 2001-07-31
JP2002022115 2002-01-30
JP2002-22115 2002-01-30

Publications (1)

Publication Number Publication Date
WO2003014426A1 true WO2003014426A1 (fr) 2003-02-20

Family

ID=26619678

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/007794 WO2003014426A1 (fr) 2001-07-31 2002-07-31 Procede de production de particules electro-conductrices

Country Status (6)

Country Link
US (1) US7045050B2 (ja)
KR (1) KR20040019089A (ja)
CN (1) CN1261621C (ja)
DE (1) DE10296936T5 (ja)
TW (1) TW554350B (ja)
WO (1) WO2003014426A1 (ja)

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KR100720895B1 (ko) * 2005-07-05 2007-05-22 제일모직주식회사 농도 구배를 갖는 이종(異種) 복합 금속층이 형성된 전도성미립자, 그 제조방법 및 이를 이용한 이방 전도성 접착제조성물
ES2422455T3 (es) 2005-08-12 2013-09-11 Modumetal Llc Materiales compuestos modulados de manera composicional y métodos para fabricar los mismos
US7713859B2 (en) * 2005-08-15 2010-05-11 Enthone Inc. Tin-silver solder bumping in electronics manufacture
KR100765363B1 (ko) * 2005-10-31 2007-10-09 전자부품연구원 도전성 입자의 제조 방법
US7521128B2 (en) * 2006-05-18 2009-04-21 Xtalic Corporation Methods for the implementation of nanocrystalline and amorphous metals and alloys as coatings
KR100693132B1 (ko) * 2006-06-23 2007-03-14 동해전장 주식회사 정션박스내에 삽입된 릴레이의 동작 검사 장치
US8226807B2 (en) 2007-12-11 2012-07-24 Enthone Inc. Composite coatings for whisker reduction
US20090145764A1 (en) * 2007-12-11 2009-06-11 Enthone Inc. Composite coatings for whisker reduction
JP5765606B2 (ja) * 2009-02-20 2015-08-19 日立金属株式会社 電子部品用複合ボールの製造方法
WO2010144509A2 (en) 2009-06-08 2010-12-16 Modumetal Llc Electrodeposited, nanolaminate coatings and claddings for corrosion protection
JP5435355B2 (ja) * 2009-09-04 2014-03-05 日立金属株式会社 メッキ装置
EP2783517A2 (en) * 2011-10-03 2014-10-01 Tyco Electronics Raychem BVBA Aggregation enclosure for elevated, outdoor locations
GB201212489D0 (en) 2012-07-13 2012-08-29 Conpart As Improvements in conductive adhesives
CA2905575C (en) 2013-03-15 2022-07-12 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
EA032264B1 (ru) 2013-03-15 2019-05-31 Модьюметл, Инк. Способ нанесения покрытия на изделие, изделие, полученное вышеуказанным способом, и труба
EA201500949A1 (ru) 2013-03-15 2016-02-29 Модьюметл, Инк. Способ формирования многослойного покрытия, покрытие, сформированное вышеуказанным способом, и многослойное покрытие
EA201790643A1 (ru) 2014-09-18 2017-08-31 Модьюметал, Инк. Способ и устройство для непрерывного нанесения нанослоистых металлических покрытий
AR102068A1 (es) 2014-09-18 2017-02-01 Modumetal Inc Métodos de preparación de artículos por electrodeposición y procesos de fabricación aditiva
BR112017009761B1 (pt) 2014-11-14 2022-04-19 Ykk Corporation Método para tratamento eletrolítico de superfície de parte de acessório de vestuário
US10626515B2 (en) 2014-11-14 2020-04-21 Ykk Corporation Surface electrolytic treatment apparatus for garment accessory part
CA3036191A1 (en) * 2016-09-08 2018-03-15 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
CA3060619A1 (en) 2017-04-21 2018-10-25 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
CN108085734B (zh) * 2017-12-26 2019-11-05 石家庄铁道大学 试验用小型滚镀装置
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN111155163B (zh) * 2020-01-14 2022-04-29 北京大学东莞光电研究院 一种小型零部件的电镀装置及其电镀方法
CN115595652A (zh) * 2022-09-28 2023-01-13 广东微容电子科技有限公司（Cn） 一种mlcc大高产品电镀的滚筒搅拌方法

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Publication number Priority date Publication date Assignee Title
JPS55119197A (en) * 1979-03-02 1980-09-12 Tipton Mfg Corp Vibrating plating device with plating liquid circulating device
US5167779A (en) * 1990-08-17 1992-12-01 Henig Hans J Process and apparatus for electrolyte exchange
JPH09137289A (ja) * 1995-04-03 1997-05-27 Sekisui Finechem Co Ltd 導電性微粒子の製造方法
WO1998046811A1 (en) * 1997-04-17 1998-10-22 Sekisui Chemical Co., Ltd. Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
JPH10331000A (ja) * 1997-05-30 1998-12-15 Mitsui High Tec Inc 電気めっき液の濃度安定化方法
JPH1136099A (ja) * 1997-07-16 1999-02-09 Kizai Kk めっき装置およびそれによるめっき方法
US5965820A (en) * 1995-07-14 1999-10-12 Murata Manufacturing Co., Ltd. Vibrational processing apparatus and method
JP2001032097A (ja) * 1999-07-23 2001-02-06 Nec Corp めっき装置とその置換析出防止方法
JP2002121699A (ja) * 2000-05-25 2002-04-26 Nippon Techno Kk めっき浴の振動流動とパルス状めっき電流との組み合わせを用いた電気めっき方法

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JP3872201B2 (ja) 1998-03-25 2007-01-24 ディップソール株式会社 錫−銀系合金酸性電気めっき浴
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Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55119197A (en) * 1979-03-02 1980-09-12 Tipton Mfg Corp Vibrating plating device with plating liquid circulating device
US5167779A (en) * 1990-08-17 1992-12-01 Henig Hans J Process and apparatus for electrolyte exchange
JPH09137289A (ja) * 1995-04-03 1997-05-27 Sekisui Finechem Co Ltd 導電性微粒子の製造方法
US5965820A (en) * 1995-07-14 1999-10-12 Murata Manufacturing Co., Ltd. Vibrational processing apparatus and method
WO1998046811A1 (en) * 1997-04-17 1998-10-22 Sekisui Chemical Co., Ltd. Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
JPH10331000A (ja) * 1997-05-30 1998-12-15 Mitsui High Tec Inc 電気めっき液の濃度安定化方法
JPH1136099A (ja) * 1997-07-16 1999-02-09 Kizai Kk めっき装置およびそれによるめっき方法
JP2001032097A (ja) * 1999-07-23 2001-02-06 Nec Corp めっき装置とその置換析出防止方法
JP2002121699A (ja) * 2000-05-25 2002-04-26 Nippon Techno Kk めっき浴の振動流動とパルス状めっき電流との組み合わせを用いた電気めっき方法

Also Published As

Publication number Publication date
US7045050B2 (en) 2006-05-16
DE10296936T5 (de) 2004-07-29
CN1261621C (zh) 2006-06-28
CN1537180A (zh) 2004-10-13
US20040234683A1 (en) 2004-11-25
KR20040019089A (ko) 2004-03-04
TW554350B (en) 2003-09-21

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