WO2002060633A1 - Ajustage d'une resistance au moyen d'une tache laser uniforme faiblement dimensionnee emise par un laser ultraviolet a semi-conducteur - Google Patents

Ajustage d'une resistance au moyen d'une tache laser uniforme faiblement dimensionnee emise par un laser ultraviolet a semi-conducteur Download PDF

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Publication number
WO2002060633A1
WO2002060633A1 PCT/US2002/003006 US0203006W WO02060633A1 WO 2002060633 A1 WO2002060633 A1 WO 2002060633A1 US 0203006 W US0203006 W US 0203006W WO 02060633 A1 WO02060633 A1 WO 02060633A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
energy density
resistor
laser
gaussian
Prior art date
Application number
PCT/US2002/003006
Other languages
English (en)
Inventor
Edward J. Swenson
Richard S. Harris
Yunlong Sun
Original Assignee
Electro Scientific Industries, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries, Inc. filed Critical Electro Scientific Industries, Inc.
Priority to DE10295946T priority Critical patent/DE10295946B4/de
Priority to JP2002560816A priority patent/JP2004519095A/ja
Priority to GB0317857A priority patent/GB2389555A/en
Priority to KR1020037010234A priority patent/KR100894025B1/ko
Priority to CA002434969A priority patent/CA2434969A1/fr
Publication of WO2002060633A1 publication Critical patent/WO2002060633A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/08—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by electric discharge, e.g. by spark erosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Laser Beam Processing (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

On peut utiliser une tache laser uniforme, telle que celle d'une sortie gaussienne (118) d'image modelée ou une tache gaussienne découpée, dont le diamètre est inférieur à 20 νm, afin d'effectuer l'ajustage de résistances à couches minces ou à couches épaisses, de manière à limiter considérablement le fissurage microscopique. Ces taches peuvent être générées dans une longueur d'onde laser UV ablative non thermique afin de limiter le HAZ et/ou le déplacement dans TCR.
PCT/US2002/003006 2001-02-01 2002-01-31 Ajustage d'une resistance au moyen d'une tache laser uniforme faiblement dimensionnee emise par un laser ultraviolet a semi-conducteur WO2002060633A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE10295946T DE10295946B4 (de) 2001-02-01 2002-01-31 Verfahren zum Lasertrimmen eines Schichtwiderstandes
JP2002560816A JP2004519095A (ja) 2001-02-01 2002-01-31 固体ｕｖレーザによる小さい一定のスポットによる抵抗トリミング
GB0317857A GB2389555A (en) 2001-02-01 2002-01-31 Resistor trimming with small uniform spot from solid-state UV laser
KR1020037010234A KR100894025B1 (ko) 2001-02-01 2002-01-31 고체-상태 ｕｖ 레이저로부터의 작은 균일한 스폿을 이용한 저항기 트리밍을 위한 방법
CA002434969A CA2434969A1 (fr) 2001-02-01 2002-01-31 Ajustage d'une resistance au moyen d'une tache laser uniforme faiblement dimensionnee emise par un laser ultraviolet a semi-conducteur

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US26617201P 2001-02-01 2001-02-01
US60/266,172 2001-02-01
US30170601P 2001-06-28 2001-06-28
US60/301,706 2001-06-28

Publications (1)

Publication Number Publication Date
WO2002060633A1 true WO2002060633A1 (fr) 2002-08-08

Family

ID=26951663

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/003006 WO2002060633A1 (fr) 2001-02-01 2002-01-31 Ajustage d'une resistance au moyen d'une tache laser uniforme faiblement dimensionnee emise par un laser ultraviolet a semi-conducteur

Country Status (8)

Country Link
JP (1) JP2004519095A (fr)
KR (1) KR100894025B1 (fr)
CN (1) CN1232379C (fr)
CA (1) CA2434969A1 (fr)
DE (1) DE10295946B4 (fr)
GB (1) GB2389555A (fr)
TW (1) TW523837B (fr)
WO (1) WO2002060633A1 (fr)

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US7358157B2 (en) * 2002-03-27 2008-04-15 Gsi Group Corporation Method and system for high-speed precise laser trimming, scan lens system for use therein and electrical device produced thereby
TWI223284B (en) * 2002-03-28 2004-11-01 Gsi Lumonics Corp Method and system for high-speed, precise micromachining an array of devices
JP4664269B2 (ja) * 2006-12-05 2011-04-06 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
KR100858674B1 (ko) * 2007-06-08 2008-09-16 주식회사 이오테크닉스 레이저를 이용한 저항체의 트리밍방법
DE102009020272B4 (de) * 2009-05-07 2014-09-11 Tyco Electronics Amp Gmbh Laserschweißsystem
US8742288B2 (en) * 2011-06-15 2014-06-03 Asm Technology Singapore Pte Ltd Laser apparatus for singulation, and a method of singulation
JP6521859B2 (ja) * 2013-02-13 2019-05-29 住友化学株式会社 レーザー光照射装置及び光学部材貼合体の製造装置
CN103441102B (zh) * 2013-08-23 2015-08-26 华东光电集成器件研究所 利用陶瓷厚膜电阻器单元修复厚膜混合集成电路的方法
CN104091664B (zh) * 2014-06-12 2016-10-26 北京锋速精密设备有限公司 一种新型函数曲线跟随电阻修刻方法
LT6428B (lt) * 2015-10-02 2017-07-25 Uab "Altechna R&D" Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginys
CN109903943B (zh) * 2019-04-29 2021-06-22 深圳市杰普特光电股份有限公司 阻值调整方法、装置、存储介质及设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5104480A (en) * 1990-10-12 1992-04-14 General Electric Company Direct patterning of metals over a thermally inefficient surface using a laser
US5233327A (en) * 1991-07-01 1993-08-03 International Business Machines Corporation Active resistor trimming by differential annealing
US5675310A (en) * 1994-12-05 1997-10-07 General Electric Company Thin film resistors on organic surfaces
US5685995A (en) * 1994-11-22 1997-11-11 Electro Scientific Industries, Inc. Method for laser functional trimming of films and devices
US5753391A (en) * 1995-09-27 1998-05-19 Micrel, Incorporated Method of forming a resistor having a serpentine pattern through multiple use of an alignment keyed mask

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JPS63226005A (ja) 1987-03-13 1988-09-20 松下電器産業株式会社 膜抵抗体のレ−ザ−トリミング法
JPH0484686A (ja) * 1990-07-27 1992-03-17 Advantest Corp レーザ加工装置
JPH05347205A (ja) * 1992-06-15 1993-12-27 Tdk Corp 電子部品及び電子部品製造方法
JP3304130B2 (ja) * 1992-07-27 2002-07-22 松下電器産業株式会社 角形薄膜チップ抵抗器の製造方法
US5265114C1 (en) * 1992-09-10 2001-08-21 Electro Scient Ind Inc System and method for selectively laser processing a target structure of one or more materials of a multimaterial multilayer device
JPH06251914A (ja) * 1993-02-27 1994-09-09 Taiyo Yuden Co Ltd トリミング抵抗を有する回路基板の製造方法
DE4336482A1 (de) * 1993-10-26 1995-04-27 Bosch Gmbh Robert Verfahren zum Abgleichen eines magnetoresistiven Sensors
JPH0864407A (ja) * 1994-08-26 1996-03-08 Matsushita Electric Ind Co Ltd 抵抗部品の製造方法
JPH09232520A (ja) * 1996-02-28 1997-09-05 Matsushita Electric Works Ltd 半導体装置及びその製造方法
JPH09246023A (ja) * 1996-03-14 1997-09-19 Rohm Co Ltd 薄膜抵抗体の抵抗値調整方法、薄膜型サーマルプリントヘッドの発熱体抵抗値の調整方法、および、薄膜型サーマルプリントヘッド
US5864430A (en) * 1996-09-10 1999-01-26 Sandia Corporation Gaussian beam profile shaping apparatus, method therefor and evaluation thereof
JPH10149908A (ja) * 1996-11-19 1998-06-02 Rohm Co Ltd 薄膜抵抗体の抵抗値調整方法、薄膜型サーマルプリントヘッドの発熱部の抵抗値調整方法、および薄膜型サーマルプリントヘッド
JPH11162702A (ja) 1997-11-25 1999-06-18 Taiyo Yuden Co Ltd チップ部品
WO1999040591A1 (fr) * 1998-02-06 1999-08-12 Electro Scientific Industries, Inc. Technique d'ajustage par laser pour l'ablation de surface de composant resistif passif, dans laquelle un laser commute, solide et ultraviolet est utilise
JPH11320134A (ja) * 1998-05-06 1999-11-24 Canon Inc レーザトリミング加工装置および加工方法
JP3334684B2 (ja) * 1999-06-29 2002-10-15 松下電器産業株式会社 電子部品及び無線端末装置
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Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5104480A (en) * 1990-10-12 1992-04-14 General Electric Company Direct patterning of metals over a thermally inefficient surface using a laser
US5233327A (en) * 1991-07-01 1993-08-03 International Business Machines Corporation Active resistor trimming by differential annealing
US5685995A (en) * 1994-11-22 1997-11-11 Electro Scientific Industries, Inc. Method for laser functional trimming of films and devices
US5675310A (en) * 1994-12-05 1997-10-07 General Electric Company Thin film resistors on organic surfaces
US5849623A (en) * 1994-12-05 1998-12-15 General Electric Company Method of forming thin film resistors on organic surfaces
US5753391A (en) * 1995-09-27 1998-05-19 Micrel, Incorporated Method of forming a resistor having a serpentine pattern through multiple use of an alignment keyed mask

Also Published As

Publication number Publication date
DE10295946T5 (de) 2004-04-22
DE10295946B4 (de) 2013-09-26
TW523837B (en) 2003-03-11
CN1232379C (zh) 2005-12-21
CN1489504A (zh) 2004-04-14
KR100894025B1 (ko) 2009-04-22
CA2434969A1 (fr) 2002-08-08
JP2004519095A (ja) 2004-06-24
GB0317857D0 (en) 2003-09-03
GB2389555A (en) 2003-12-17
KR20030079981A (ko) 2003-10-10

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