GB0317857D0 - Resistor trimming with small uniform spot from solid-state UV laser - Google Patents

Resistor trimming with small uniform spot from solid-state UV laser

Info

Publication number
GB0317857D0
GB0317857D0 GBGB0317857.1A GB0317857A GB0317857D0 GB 0317857 D0 GB0317857 D0 GB 0317857D0 GB 0317857 A GB0317857 A GB 0317857A GB 0317857 D0 GB0317857 D0 GB 0317857D0
Authority
GB
United Kingdom
Prior art keywords
laser
solid
state
small uniform
resistor trimming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0317857.1A
Other versions
GB2389555A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of GB0317857D0 publication Critical patent/GB0317857D0/en
Publication of GB2389555A publication Critical patent/GB2389555A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/08Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by electric discharge, e.g. by spark erosion
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/242Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Laser Beam Processing (AREA)
  • Non-Adjustable Resistors (AREA)
GB0317857A 2001-02-01 2002-01-31 Resistor trimming with small uniform spot from solid-state UV laser Withdrawn GB2389555A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US26617201P 2001-02-01 2001-02-01
US30170601P 2001-06-28 2001-06-28
PCT/US2002/003006 WO2002060633A1 (en) 2001-02-01 2002-01-31 Resistor trimming with small uniform spot from solid-state uv laser

Publications (2)

Publication Number Publication Date
GB0317857D0 true GB0317857D0 (en) 2003-09-03
GB2389555A GB2389555A (en) 2003-12-17

Family

ID=26951663

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0317857A Withdrawn GB2389555A (en) 2001-02-01 2002-01-31 Resistor trimming with small uniform spot from solid-state UV laser

Country Status (8)

Country Link
JP (1) JP2004519095A (en)
KR (1) KR100894025B1 (en)
CN (1) CN1232379C (en)
CA (1) CA2434969A1 (en)
DE (1) DE10295946B4 (en)
GB (1) GB2389555A (en)
TW (1) TW523837B (en)
WO (1) WO2002060633A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7358157B2 (en) * 2002-03-27 2008-04-15 Gsi Group Corporation Method and system for high-speed precise laser trimming, scan lens system for use therein and electrical device produced thereby
TWI223284B (en) * 2002-03-28 2004-11-01 Gsi Lumonics Corp Method and system for high-speed, precise micromachining an array of devices
JP4664269B2 (en) * 2006-12-05 2011-04-06 住友重機械工業株式会社 Laser processing apparatus and laser processing method
KR100858674B1 (en) * 2007-06-08 2008-09-16 주식회사 이오테크닉스 Method for trimming resistor using laser
DE102009020272B4 (en) * 2009-05-07 2014-09-11 Tyco Electronics Amp Gmbh Laser welding system
US8742288B2 (en) * 2011-06-15 2014-06-03 Asm Technology Singapore Pte Ltd Laser apparatus for singulation, and a method of singulation
WO2014126137A1 (en) * 2013-02-13 2014-08-21 住友化学株式会社 Laser irradiation device and manufacturing method of laminate optical member
CN103441102B (en) * 2013-08-23 2015-08-26 华东光电集成器件研究所 Ceramic thick film resistor device unit is utilized to repair the method for thick film hybrid integrated circuit
CN104091664B (en) * 2014-06-12 2016-10-26 北京锋速精密设备有限公司 A kind of novel function curve follows resistor repair and carving method
LT6428B (en) * 2015-10-02 2017-07-25 Uab "Altechna R&D" Method and device for laser processing of transparent materials
CN109903943B (en) * 2019-04-29 2021-06-22 深圳市杰普特光电股份有限公司 Resistance value adjusting method and device, storage medium and equipment

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63226005A (en) 1987-03-13 1988-09-20 松下電器産業株式会社 Laser trimming of film resistor
JPH0484686A (en) * 1990-07-27 1992-03-17 Advantest Corp Laser beam machine
US5104480A (en) * 1990-10-12 1992-04-14 General Electric Company Direct patterning of metals over a thermally inefficient surface using a laser
US5233327A (en) * 1991-07-01 1993-08-03 International Business Machines Corporation Active resistor trimming by differential annealing
JPH05347205A (en) * 1992-06-15 1993-12-27 Tdk Corp Electronic component and manufacture thereof
JP3304130B2 (en) * 1992-07-27 2002-07-22 松下電器産業株式会社 Method of manufacturing rectangular thin film chip resistor
US5265114C1 (en) * 1992-09-10 2001-08-21 Electro Scient Ind Inc System and method for selectively laser processing a target structure of one or more materials of a multimaterial multilayer device
JPH06251914A (en) * 1993-02-27 1994-09-09 Taiyo Yuden Co Ltd Manufacturing method of circuit board having trimming resistance
DE4336482A1 (en) * 1993-10-26 1995-04-27 Bosch Gmbh Robert Method of trimming a magnetoresistive sensor
JPH0864407A (en) * 1994-08-26 1996-03-08 Matsushita Electric Ind Co Ltd Manufacture of resistance part
US5685995A (en) * 1994-11-22 1997-11-11 Electro Scientific Industries, Inc. Method for laser functional trimming of films and devices
US5675310A (en) * 1994-12-05 1997-10-07 General Electric Company Thin film resistors on organic surfaces
US5753391A (en) * 1995-09-27 1998-05-19 Micrel, Incorporated Method of forming a resistor having a serpentine pattern through multiple use of an alignment keyed mask
JPH09232520A (en) * 1996-02-28 1997-09-05 Matsushita Electric Works Ltd Semiconductor device and manufacturing method thereof
JPH09246023A (en) * 1996-03-14 1997-09-19 Rohm Co Ltd Resistance value adjusting method of thin film resistor, adjusting method of resistance value of heating element of thin film type thermal print head, and thin film type thermal print head
US5864430A (en) * 1996-09-10 1999-01-26 Sandia Corporation Gaussian beam profile shaping apparatus, method therefor and evaluation thereof
JPH10149908A (en) * 1996-11-19 1998-06-02 Rohm Co Ltd Method for adjusting resistance of thin film resistor, method for adjusting resistance of heat generating section of thin film thermal print head, and thin film thermal print head
JPH11162702A (en) 1997-11-25 1999-06-18 Taiyo Yuden Co Ltd Chip parts
WO1999040591A1 (en) * 1998-02-06 1999-08-12 Electro Scientific Industries, Inc. Passive resistive component surface ablation trimming technique using q-switched, solid-state ultraviolet wavelength laser
JPH11320134A (en) * 1998-05-06 1999-11-24 Canon Inc Laser trimming processing device and processing method
JP3334684B2 (en) * 1999-06-29 2002-10-15 松下電器産業株式会社 Electronic components and wireless terminals
TW482705B (en) * 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias

Also Published As

Publication number Publication date
TW523837B (en) 2003-03-11
WO2002060633A1 (en) 2002-08-08
KR100894025B1 (en) 2009-04-22
DE10295946T5 (en) 2004-04-22
DE10295946B4 (en) 2013-09-26
CN1232379C (en) 2005-12-21
GB2389555A (en) 2003-12-17
JP2004519095A (en) 2004-06-24
CN1489504A (en) 2004-04-14
KR20030079981A (en) 2003-10-10
CA2434969A1 (en) 2002-08-08

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)