JPH0864407A - Manufacture of resistance part - Google Patents

Abstract

PURPOSE: To reduce irregularity of resistance value and to acquire a specified resistance value readily without processing of a resistor itself such as laser trimming by reducing irregularity of resistance value when manufacturing a plurality of resistance parts inside a substrate. CONSTITUTION: A first electrode 13a and a second electrode 13b are formed on a substrate 12 to make a length of a resistor formed therebetween shorter in a peripheral part of a substrate than in a substrate central part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a rectangular chip resistor, a resistor network, a resistor component combined with a capacitor or a coil, a resistor component used for a resistor of a hybrid IC, or the like.

[0002]

2. Description of the Related Art In recent years, there has been an increasing demand for cost reductions for resistance components such as hybrid ICs and chip resistors due to the influence of the yen's appreciation.

A conventional rectangular chip resistor will be described below as an example. 10 (a) and 10 (b) show a conventional chip resistance component, and a protective layer of a resistor and an external electrode for mounting are omitted for clarity.

In FIGS. 10 (a) and 10 (b), 1 is a resistor, 2 is a substrate made of ceramic or the like, and 3a and 3b are first and second electrodes. In FIG. 10A, both ends of the resistor 1 are formed above the first electrode 3a and the second electrode 3b, and in FIG. 10B, both ends of the resistor 1 are formed on the first electrode 3a. , And is formed under the second electrode 3b. In this way, as the resistance component, the structure shown in FIGS. 10A and 10B can be selected as needed.

Next, with reference to FIGS. 11 to 13, the manner of manufacturing a plurality of resistor components from one substrate will be described.
In FIG. 11, reference numeral 2 is a substrate made of ceramic or the like, and a plurality of break lines 4 are vertically and horizontally formed inside the substrate 2. A plurality of first electrodes 3a and second electrodes 3b are formed on the substrate 2 as shown in FIG. Further, as shown in FIG. 13, a plurality of first electrodes 3a
The resistor 1 is formed so as to connect to the second electrode 3b. Finally, the resistance value is adjusted by laser trimming the resistor 1, a protective layer is formed on the surface, and the break line 4 is divided into individual pieces to form external electrodes.
The rectangular chip resistor component as shown in FIGS. 10A and 10B can be manufactured. Since the first electrode 3a and the second electrode 3b are formed under the resistor 1 in FIG. 12, the completed resistance component corresponds to that of FIG. 10 (a).

FIG. 14 shows the distribution of the resistance value of the sample shown in FIG. 13 measured in the substrate before laser trimming. It can be seen from FIG. 12 that the resistor 1 formed in the center of the substrate 2 is lower by about 5% to 10% than the resistor 1 formed in the peripheral portion.
However, since the laser trimming is usually performed after this, the variation in the resistance value is not a problem.

The trimming referred to here is to change the resistance value by processing the resistor 1 itself, and a laser trimming method and rarely a blast trimming method have been put into practical use. But this trimming method
The resistance value can be adjusted only in the high direction. For this reason, in practice, the initial resistance value is set to a significantly low value in consideration of variations in the resistor 1, and then trimming is performed largely.

[0008]

In the above-mentioned conventional structure, the resistance value is set to a low value and the target resistance value is adjusted by laser trimming. For this reason, laser trimming cost is generated, and at the same time, microcracks are generated in the resistor 1 during laser trimming, which deteriorates noise characteristics and reduces reliability. Further, since the resistance value can be adjusted only in the high direction, the trimming amount is inevitably increased and the laser trimming cost is required.

The present invention solves the above-mentioned conventional problems. By reducing the variation in the resistance value of the resistor before laser trimming, the amount of laser trimming can be reduced or a predetermined resistance can be obtained without laser trimming. It is an object to provide a resistance component that can obtain a value.

[0010]

In order to achieve this object, a method of manufacturing a resistance component according to the present invention includes a first method provided on a substrate.
When manufacturing a plurality of resistance components on the substrate, each of which includes a first electrode and a second electrode, and a resistor that connects the first and second electrodes, the first electrode and the second electrode Is formed in the central part of the substrate so as to be longer than the peripheral part in the range of 0.2% or more and 20% or less, and the resistor body is connected between the first and second electrodes. After being formed, it is divided into individual pieces.

[0011]

According to this method, it is possible to reduce the variation in the resistance value in the substrate before laser trimming, reduce the amount of laser trimming, and even omit laser trimming itself.

[0012]

【Example】

(Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows an example of a method of manufacturing a resistance component according to the first embodiment of the present invention. In FIG. 1, a large-sized substrate made of ceramic or the like having break lines 14 formed on its surface in vertical and horizontal directions. A first electrode 13a and a second electrode 13b, which are indicated by hatching, are formed on the reference numeral 12.
From FIG. 1, the first electrode 13a and the second electrode 13a provided on the substrate 12
The distance between the electrode 13b and the electrode 13b is longer in the range of 0.2% or more and 20% or less in the central portion of the substrate than in the peripheral portion.

A more detailed description will be given. First, an alumina substrate having the break line 14 formed so that 3000 pieces of 1.6 mm × 0.8 mm chip parts having the shape shown in FIG. 1 can be formed from one substrate 12 was produced. As shown in FIG. 1, the first electrode 13a and the second electrode 13b were formed by printing in a shape such that the electrode interval was longer in the central portion of the substrate than in the peripheral portion of the substrate. Here, silver is used as the electrode material,
By firing after printing, the one equivalent to FIG. 1 was produced. On the other hand, as a conventional example for comparison, the first electrode 3a and the second electrode 3b were similarly formed on the same alumina substrate in the shape shown in FIG.

Next, how the resistor is formed will be described with reference to FIG. FIG. 2 is a partially enlarged view of FIG. 1, in which a resistor 15 having the same width is formed so as to connect a plurality of first electrodes 13a and second electrodes 13b. In FIG. 2, the resistor 15 is a first electrode 13a and a second electrode 1
If the electrode spacing on the substrate center side is L1 and the electrode spacing on the substrate peripheral side is L2, then L1>
The relationship of L2 is established. Thus, the example of the present invention was formed as shown in FIG. On the other hand, the prototype of the conventional example is the first in FIG.
The electrode 3a and the second electrode 3b were manufactured so that the distance between them was the same in the central portion and the peripheral portion of the substrate 2.

Further explanation will be given with reference to FIG. FIG. 3 shows the results of measuring the variation in the resistance value in the substrate of the resistance component of the present invention produced in this way. As described above, in the example of the present invention, the first and second electrode intervals on the center side of the substrate are formed longer than those on the periphery of the substrate, so that in the conventional example (see FIG. 11), the resistance value is lower on the center side of the substrate. There was a problem, but Fig. 3
As shown in (1), the resistance value variation in the substrate can be reduced by using the method of manufacturing the resistance component of the present invention.

A method of designing the patterns of the first electrode 13a and the second electrode 13b will be described. Here, the first electrode 13
The distance between a and the second electrode 13b can be easily obtained by calculating based on the rate of change of the relative resistance value in the substrate of FIG. Here, the rate of change of the relative resistance value in FIG. 13 varies depending on the type and warp of the alumina substrate used, the temperature distribution of the firing furnace, the firing temperature, etc.
Once the manufacturing specifications are decided, the degree of change can be stabilized. Thus, in this example, the distance between the first electrode 13a and the second electrode 13b was calculated and calculated in accordance with the conditions used.

First, a conventional resistor having a constant electrode interval corresponding to FIGS. 12 to 13 was prototyped, and the resistance value distribution in this substrate was measured for 2000 substrates.
In the substrate of 7% or more, the difference in resistance between the peripheral portion of the substrate and the central portion of the substrate was 4% to 6% (result corresponding to FIG. 14).

Therefore, an experiment was carried out to correct the electrode interval with respect to the occurrence of the difference in resistance value of 4% to 6%. In the experiment, a 850 ° C. firing type thick film resistor material mainly composed of ruthenium and an 850 ° C. firing type thick film electrode material mainly composed of silver palladium were used. First, the sensitivity of the resistance value change with the change of the electrode spacing was determined by making a prototype resistor. When the electrode spacing was changed to 5 mm and the electrode spacing was changed by 0.005 mm, no effect was observed in the actual sample, probably due to the influence of the roughness of the alumina substrate surface.

On the other hand, when 0.01 mm was changed, a clear change was recognized in the actual sample. Therefore, we decided to adjust the electrode interval by setting the minimum adjustment range to 0.2% (that is, 0.01 mm / 5 mm), and this electrode interval was 5 mm → 4.5.
When a large change was made in the order of mm → 4.0 mm → 3.5 mm → 3.0 mm, the resistance value greatly changed, but a problem sometimes occurred during laser trimming in the subsequent process. When the electrode interval was 4.0 mm, the laser cutting margin was not a problem, but when it was 3.5 mm or less, the cutting margin might be insufficient.

As a result of considering the above, the electrode interval is centered at 5 mm and the minimum fine adjustment width is 0.01 mm within a range of ± 1 mm (0.2
% Or more and 20% or less), it was found that there is no problem in practice. Further, the chip size was changed in the range of 1.0 mm × 0.5 mm to 6.3 mm × 3.2 mm, but similarly, if it is in the range of 0.2% or more and 20%, it does not adversely affect the subsequent processes and characteristics. It was

On the basis of the above results, a product was manufactured as a trial with electrode intervals so that the resistance value was constant in the substrate. Figure 1
A thick film electrode was formed by using the silver-palladium material on 2000 substrates using a pattern in which the electrode interval was designed to be longer by about 5% in the peripheral portion of the substrate as shown in FIG. Next, when the ruthenium resistor was formed on this and the resistance value in the substrate was measured, the resistance value distribution in the substrate was 99.7% or more of the resistance values of the peripheral portion and the central portion of the substrate. The difference is 1
% (Result corresponding to FIG. 3).
Next, when this substrate was laser-trimmed, the laser processing time could be shortened and the cost could be reduced due to the small variation in the resistance value.

Next, a protective layer mainly containing glass or resin was printed on this substrate, and after marking the resistance value, the substrate was divided into chips. After forming the end face electrodes by printing and plating, the resistance value was separated by a separating device, and the chip resistors were set in a taping or bulk case for an automatic mounting machine. The chip resistor thus formed has a conventional electrode having a constant electrode spacing in terms of characteristics and mounting, even though the electrode spacing varies within the range of 0.2% to 20%. There was no difference with the resistor.

Next, the first electrode 13a and the second electrode 13b
The shape of will be described. As shown in FIG. 4, the shape of the first electrode 13a and the second electrode 13b is such that the first electrode 13a and the second electrode 13b intersect perpendicularly to the resistor 15, and the first electrode 13a
The second electrode 13b and the second electrode 13b are
In the center part of 2, the interval may be gradually increased.

(Embodiment 2) FIG. 5 shows a method of manufacturing a resistance component showing a second embodiment of the present invention. In FIG. 5, the width of the resistor 15 is made narrower in the central portion of the substrate than in the peripheral portion of the substrate. On the other hand, since the distance between the first electrode 13a and the second electrode 13b is constant, as a result, the substrate 1
It is possible to reduce the variation in the resistance value within 2. Here, the range of change of the width of the resistor 15 was obtained by combining dozens of types of alumina substrates and their surface roughness, types of electrode materials and resistor materials, firing conditions, etc.
It was found that the resistance value can be made constant by adjusting the width of the resistor 15 in the range of 0.2% or more and 20% or less in the central portion of the substrate as compared with the periphery of the substrate. Moreover, it was found that most of these combinations fall within the range of 2% to 8%.

In addition to the width of the resistor 15, the thickness of the resistor may be changed. As shown in FIG. 6, by making the thickness of the resistor 15 thinner in the central portion of the substrate than in the peripheral portion of the substrate, it is possible to reduce variations in resistance value within the substrate 12. Here, the rate of change in the thickness of the resistor 15 was determined by combining dozens of types of alumina substrates and their surface roughness, types of electrode materials and resistor materials, firing conditions, etc. 0.2% in the center of the board compared to
It was found that the resistance value can be made constant by adjusting the thickness of the resistor 5b within the range of 20% or less. It was also found that most of the combinations fall within the range of 2% to 8%.

(Embodiment 3) FIG. 7 shows the structure of a resistance component showing a third embodiment of the present invention. FIG. 7 (a) is a perspective view and FIG. 7 (b) is a sectional view of a finished product. It is a figure. In FIG. 7, 16 is an adjust electrode, 17 is an end face electrode, and 18 is a protective layer. In FIG. 7A, the protective layer 18 and the end face electrode 17 are omitted.

In FIG. 7, by adjusting the distance between the first electrode 13a and the adjusting electrode 16, the resistance value of the resistor 15 can be set to a predetermined value without laser trimming.

Here, as the material of the adjusting electrode 16, a thick film conductor such as silver, palladium, gold, platinum, etc., or other metal as a thin film conductor is formed by vapor deposition or sputtering to a thickness of 2 μm.
It can also be formed of a thin film having a thickness of less than m. Further, it is also possible to print an organic metal ink such as gold, nickel, palladium or the like and then fire it to obtain a thin film conductor material.

Alternatively, the metal thin film may be directly attached to the substrate, sprayed, or formed by plating or the like. The patterning of these electrode materials can be highly accurately formed on the substrate by using a photolithography technique.

Thus, for example, 1
1.0mm × 0.5 on a ceramic substrate of 00mm square or more
It is possible to make 10,000 or more small resistance parts of mm or less at a time. Here, the resistance value distribution corresponding to FIG. 13 due to firing of the resistors in the substrate is measured in advance,
The distance between the first electrode 13a and the adjustment electrode 16 can be corrected so that the resistance value becomes constant within the substrate as shown in FIG.

Next, with reference to FIG. 8, a method of manufacturing a resistance component corresponding to the third embodiment (FIG. 7) will be described. Figure 8
FIG. 7 shows an example of a method of manufacturing a corresponding resistance component. In FIG. 8, the resistor 15 is connected in a state of covering the first electrode 13a and submerged under the adjustment electrode 16. ing. In FIG. 8, the distance between the first electrode 13a on the substrate center side and the adjustment electrode 16 is L.
3, the first electrode 13a on the substrate peripheral side and the adjustment electrode 1
When the interval of 6 is L4, the relationship of L3> L4 is established. By doing so, it is possible to reduce the variation in the resistance value of the resistance component in the substrate as shown in FIG.

In the case of this embodiment, the first electrode 13a
Since the adjustment electrode 16 and the adjustment electrode 16 are formed in separate steps,
While maintaining the relation of 3> L4, the first electrode 13a
The distance between the adjusting electrode 16 and the adjusting electrode 16 is, for example, 0.4 mm → 0.4
It can be freely set from 2 mm to 0.44 mm to 0.46 mm. Thus, assuming that the resistance value is 0.4 mm as 100, 0.
105 at 42 mm, 110, 0.4 at 0.44 mm
It can be changed to 115 at 6 mm. By using this principle, it is possible to adjust the resistance value by changing the position (overlap length with the resistor 15) where the adjustment electrode 16 is formed in a batch process of the resistance component of the entire substrate without laser trimming. You can

Next, the method of manufacturing the resistance component of the present embodiment will be described in detail with reference to a prototype of a chip resistance component having a resistance value of 1.5 KΩ.

First, as the first electrode 13a, a silver-palladium ink for high-temperature firing was experimentally manufactured based on a commercially available electrode material for ceramic capacitors. This was printed on an alumina substrate with a break line, dried, and then baked at 950 ° C. The electrode thickness after firing was 5 μm. Next, a resistor ink was printed on this. This resistor ink is a commercially available 8
50K ℃ type thick film resistor ink 10.0KΩ /
Blend so that it becomes □, print and dry it, then 850
The resistor 15 was formed by firing at ° C. Resistor 15
The sheet resistance of was measured to be 11.3 KΩ / □. The reason for selecting the resistor ink of 10 KΩ / □ is that the resistor ink in the resistance value region has a larger variation in the resistance value than other low resistance and high resistance materials. Is.

Then, as a result of obtaining the length of the resistor 15 by calculation, it was found that 15 KΩ was obtained when L = 0.43 mm was set. Therefore, the adjust electrode 16 was formed with this specification. In the calculation here, the first experimentally
The influence of the overlapped portion of the electrode 13a and the resistor 15 and the blurring of the adjustment electrode 16 was obtained, and the correction coefficient was added to the calculation formula. Further, for the adjustment electrode 16, an organic metal ink fired at 400 ° C. was used in order to prevent the resistance value from fluctuating due to re-fired of the resistor 15.

After that, a protective layer composed mainly of resin and an external electrode were formed on the resistor 15 at 300 ° C. or lower. As a result of measuring the resistance value of the chip-shaped resistance component thus formed, 15 KΩ as calculated was obtained, and it was not necessary to perform laser trimming.

Next, the chip resistance component was similarly prototyped by changing the resistance value to be obtained from 100Ω to 1MΩ, and similar results were obtained. Further, in terms of the composition of the resistor material, the result that the variation in the resistance value is further reduced was obtained.

Further, the difference in the blending of the resistor ink, the lot, and the variation factors such as the firing furnace, the printing machine, the alumina substrate, and the chip size were also investigated. In the case of this embodiment, after the resistor was formed. In order to hit the resistance value with,
These fluctuation factors did not affect the resistance value. Alumina substrates used are 99.9% alumina and 9
There was no particular problem even with 9% and 96% alumina.

Next, for comparison, FIG. 10 (a) and FIG.
The conventional structure shown in (b) was prototyped using the same substrate, electrode material, and resistor material as in this example. Regarding the resistor ink, I changed the blend.
When the resistance value of the finished product was measured, the resistance value was 7 KΩ to 19 KΩ, and a large number of those separated from the target 15 KΩ were obtained. When this result is illustrated, a considerable result is obtained in FIG. Therefore, if the resistance value is lower than 15 KΩ, it is 15 KΩ by laser trimming.
Adjusted to.

However, laser trimming cannot be performed for the target having a value higher than 15 KΩ, resulting in a defect and an increase in cost. In addition, the laser-trimmed product deteriorated over time and had poor noise characteristics. In addition, analysis of the cause of this resistance value variation revealed that it was due to differences in firing furnaces and printers, etc., and this resistance value variation was suppressed even if the resistor dimensions and thickness were formed with high precision. I knew I couldn't.

On the other hand, the one manufactured according to this embodiment is
The variation in the resistance value in the substrate is shown in FIG. 3, and a value equivalent to that in FIG. 3 is obtained. Further, by increasing or decreasing the interval between the first electrode 13a and the adjusting electrode 16, the resistance value is suppressed while suppressing the variation in the resistance value. I was able to adjust the value. Thus, 15
It was possible to manufacture KΩ with a high yield.

Even when the laser trimming is performed in the present embodiment, in the present embodiment, the laser trimming is started from the state in which the variation in the resistance value is small, so that the laser trimming amount can be reduced and the cutting margin of the resistor 15 is also small. By doing so, it is possible to manufacture a higher performance resistance component.

(Fourth Embodiment) Next, as a fourth embodiment of the present invention, an example of highly accurate adjustment of the resistance value will be described with reference to FIG. FIG. 9 shows a resistance component whose resistance value can be adjusted with higher accuracy. In FIG. 9, the resistor 15 is the first
Is formed wider on the side contacting the adjusting electrode 16 than on the side contacting the electrode 13a. By changing the pattern of the resistor 15 in this manner, the resistance value can be adjusted with high accuracy depending on the position where the adjust electrode 16 is formed.

Further, as shown in FIG. 9, the first side of the substrate center side
When the distance between the electrode 13a and the adjusting electrode 16 is L3 and the distance between the first electrode 13a on the substrate peripheral side and the adjusting electrode 16 is L4, the relationship of L3> L4 is established. By doing so, it is possible to reduce the variation in the resistance value of the resistance component in the substrate as shown in FIG.

Also, in the case of this embodiment, as in the case of the third embodiment, the first electrode 13a and the adjusting electrode 16 are formed in separate steps, so that the first electrode 13a is maintained while maintaining the relationship of L3> L4. The distance between 13a and the adjusting electrode 16 can be freely set, for example, 0.4 mm → 0.42 mm → 0.44 mm → 0.46 mm. By doing so, the width of the resistor 15 is partially changed, so that when the resistance value is 0.4 mm, the resistance value is 100. When the resistance value is 0.42 mm, the resistance value is 102.
It is changed to 106 at 04 and 0.46 mm. In this way, the resistance value can be adjusted to a predetermined value with higher accuracy than in the third embodiment. By using this principle, the position where the adjusting electrode 16 is formed by the batch processing of the resistance components of the entire substrate without laser trimming (resistor 1
The resistance value can be adjusted with higher accuracy by changing the overlapping length with 5.

Further, by combining this embodiment with laser trimming, it is possible to manufacture a highly accurate resistance component at low cost.

The present invention can also be applied to the production of resistors for resistor arrays and hybrid ICs.
Here, as the ceramic substrate, aluminum nitride, a dielectric ceramic, a ferrite ceramic, or the like can be used in addition to alumina. Further, by using a metal core substrate in which a metal plate is covered with an insulator containing a ceramic material, it is possible to manufacture a resistance component that is hard to break and has improved heat dissipation.

It is also easy to combine the structure of the resistance component with a multilayer ceramic capacitor, a chip coil, a chip inductor, a chip ceramic module, or the like to form a composite. Particularly in the case of ordinary capacitors and inductors, since trimming is structurally difficult, it is easier to achieve higher precision by making such adjustments in the resistance part.

As the material for the resistor, besides the thick film resistor material such as ruthenium oxide, a thin film resistor such as nichrome can be formed by a thin film method such as vapor deposition or sputtering. Further, the resistor material can be formed by using electroless plating or matrix plating. Further, the resistor material can be formed by directly adhering it to the substrate or spraying it.

[0051]

As described above, according to the present invention, it is possible to collectively manufacture a large number of resistors on a single substrate in a state in which there is little variation in resistance value, thereby reducing the laser trimming amount and laser trimming. It is also possible to omit steps.
Then, while eliminating complicated variable elements of the resistance value due to the lot-to-lot variation of the resistor material and the influence of the substrate, the resistance component can obtain the resistance value with a high yield without performing the laser resistance trimming of the target resistance value. Can be manufactured.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of a method of manufacturing a resistance component according to a first embodiment of the present invention.

FIG. 2 is a partially enlarged perspective view of FIG.

FIG. 3 is an explanatory diagram in which the resistance value variation in the substrate of the resistance component of the example of the present invention is measured.

FIG. 4 is a perspective view showing an example of the shape of the electrode.

FIG. 5 is a perspective view showing a method of manufacturing a resistance component showing a second embodiment of the present invention.

FIG. 6 is a cross-sectional view showing a configuration for changing the thickness of a resistor according to another embodiment.

FIG. 7A is a perspective view showing a structure of a resistance component showing a third embodiment of the present invention, and FIG. 7B is a sectional view of the same.

FIG. 8 is a perspective view illustrating a method of manufacturing the resistor component according to the third embodiment.

FIG. 9 is a perspective view showing a resistance component capable of adjusting the resistance value of the fourth embodiment with higher accuracy.

10A and 10B are perspective views showing a conventional chip resistance component, respectively.

FIG. 11 is a perspective view for explaining a process of manufacturing a plurality of resistor parts from a conventional single board.

FIG. 12 is a perspective view of the conventional manufacturing process.

FIG. 13 is a perspective view of the conventional manufacturing process.

[Fig. 14] Same resistance distribution map

[Explanation of symbols]

 12 Substrate 13a, 13b Electrode 14 Breakline 15 Resistor 16 Adjust Electrode 17 End Face Electrode 18 Protective Layer

Claims (4)

[Claims] 1. When manufacturing a plurality of resistive components on a substrate, the resistive component including a first electrode and a second electrode provided on the substrate, and a resistor connecting the first and second electrodes. The first electrode and the second electrode are formed so that the distance between the first electrode and the second electrode is 0.2% or more and 20% or less in the central portion of the substrate as compared with the peripheral portion. A method of manufacturing a resistance component, in which a resistor is formed so as to be connected between two electrodes and then divided into individual pieces. 2. When manufacturing a plurality of resistance components on the substrate, the resistance component including a first electrode and a second electrode provided on the substrate and a resistor connecting the first and second electrodes. , The cross-sectional area of the resistor in the central portion of the substrate compared to the peripheral portion,
The thin film is formed in the range of 0.2% to 20%.
And a second electrode, a resistor is formed so as to be connected between the second electrode and the second electrode, and the resistor is divided into individual pieces. 3. A first electrode and a second electrode provided on a substrate, and a resistor connecting the first and second electrodes, wherein one end of the resistor is the first electrode. The method for manufacturing a resistance component according to claim 1, wherein the other end portion is formed above and below the second electrode. 4. A first electrode and a second electrode provided on a substrate, and a resistor connecting the first and second electrodes, wherein one end of the resistor is the first electrode. 3. The resistance component manufacturing method according to claim 1, wherein the other end is formed under the adjustment electrode, and the adjustment electrode is formed on the resistor at a position where the resistor has a target resistance value. Method.