KR100894025B1 - 고체-상태 ｕｖ 레이저로부터의 작은 균일한 스폿을 이용한 저항기 트리밍을 위한 방법 - Google Patents

고체-상태 ｕｖ 레이저로부터의 작은 균일한 스폿을 이용한 저항기 트리밍을 위한 방법 Download PDF

Info

Publication number
KR100894025B1
KR100894025B1 KR1020037010234A KR20037010234A KR100894025B1 KR 100894025 B1 KR100894025 B1 KR 100894025B1 KR 1020037010234 A KR1020037010234 A KR 1020037010234A KR 20037010234 A KR20037010234 A KR 20037010234A KR 100894025 B1 KR100894025 B1 KR 100894025B1
Authority
KR
South Korea
Prior art keywords
delete delete
substrate
laser
energy density
gaussian
Prior art date
Application number
KR1020037010234A
Other languages
English (en)
Korean (ko)
Other versions
KR20030079981A (ko
Inventor
에드워드 제이. 스웬슨
리차드 에스. 해리스
윤롱 선
Original Assignee
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 filed Critical 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Publication of KR20030079981A publication Critical patent/KR20030079981A/ko
Application granted granted Critical
Publication of KR100894025B1 publication Critical patent/KR100894025B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/08—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by electric discharge, e.g. by spark erosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Laser Beam Processing (AREA)
  • Non-Adjustable Resistors (AREA)
KR1020037010234A 2001-02-01 2002-01-31 고체-상태 ｕｖ 레이저로부터의 작은 균일한 스폿을 이용한 저항기 트리밍을 위한 방법 KR100894025B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US26617201P 2001-02-01 2001-02-01
US60/266,172 2001-02-01
US30170601P 2001-06-28 2001-06-28
US60/301,706 2001-06-28
PCT/US2002/003006 WO2002060633A1 (fr) 2001-02-01 2002-01-31 Ajustage d'une resistance au moyen d'une tache laser uniforme faiblement dimensionnee emise par un laser ultraviolet a semi-conducteur

Publications (2)

Publication Number Publication Date
KR20030079981A KR20030079981A (ko) 2003-10-10
KR100894025B1 true KR100894025B1 (ko) 2009-04-22

Family

ID=26951663

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037010234A KR100894025B1 (ko) 2001-02-01 2002-01-31 고체-상태 ｕｖ 레이저로부터의 작은 균일한 스폿을 이용한 저항기 트리밍을 위한 방법

Country Status (8)

Country Link
JP (1) JP2004519095A (fr)
KR (1) KR100894025B1 (fr)
CN (1) CN1232379C (fr)
CA (1) CA2434969A1 (fr)
DE (1) DE10295946B4 (fr)
GB (1) GB2389555A (fr)
TW (1) TW523837B (fr)
WO (1) WO2002060633A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7358157B2 (en) * 2002-03-27 2008-04-15 Gsi Group Corporation Method and system for high-speed precise laser trimming, scan lens system for use therein and electrical device produced thereby
TWI223284B (en) * 2002-03-28 2004-11-01 Gsi Lumonics Corp Method and system for high-speed, precise micromachining an array of devices
JP4664269B2 (ja) * 2006-12-05 2011-04-06 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
KR100858674B1 (ko) * 2007-06-08 2008-09-16 주식회사 이오테크닉스 레이저를 이용한 저항체의 트리밍방법
DE102009020272B4 (de) * 2009-05-07 2014-09-11 Tyco Electronics Amp Gmbh Laserschweißsystem
US8742288B2 (en) * 2011-06-15 2014-06-03 Asm Technology Singapore Pte Ltd Laser apparatus for singulation, and a method of singulation
WO2014126137A1 (fr) * 2013-02-13 2014-08-21 住友化学株式会社 Dispositif d'irradiation laser et procédé de fabrication d'un élément optique stratifié
CN103441102B (zh) * 2013-08-23 2015-08-26 华东光电集成器件研究所 利用陶瓷厚膜电阻器单元修复厚膜混合集成电路的方法
CN104091664B (zh) * 2014-06-12 2016-10-26 北京锋速精密设备有限公司 一种新型函数曲线跟随电阻修刻方法
LT6428B (lt) * 2015-10-02 2017-07-25 Uab "Altechna R&D" Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginys
CN109903943B (zh) * 2019-04-29 2021-06-22 深圳市杰普特光电股份有限公司 阻值调整方法、装置、存储介质及设备

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63226005A (ja) 1987-03-13 1988-09-20 松下電器産業株式会社 膜抵抗体のレ−ザ−トリミング法
JPH05347205A (ja) * 1992-06-15 1993-12-27 Tdk Corp 電子部品及び電子部品製造方法
JPH0645118A (ja) * 1992-07-27 1994-02-18 Matsushita Electric Ind Co Ltd 角形薄膜チップ抵抗器の製造方法
JPH06251914A (ja) * 1993-02-27 1994-09-09 Taiyo Yuden Co Ltd トリミング抵抗を有する回路基板の製造方法
JPH0864407A (ja) * 1994-08-26 1996-03-08 Matsushita Electric Ind Co Ltd 抵抗部品の製造方法
JPH09232520A (ja) * 1996-02-28 1997-09-05 Matsushita Electric Works Ltd 半導体装置及びその製造方法
US5685995A (en) 1994-11-22 1997-11-11 Electro Scientific Industries, Inc. Method for laser functional trimming of films and devices
JPH11162702A (ja) 1997-11-25 1999-06-18 Taiyo Yuden Co Ltd チップ部品
WO1999040591A1 (fr) * 1998-02-06 1999-08-12 Electro Scientific Industries, Inc. Technique d'ajustage par laser pour l'ablation de surface de composant resistif passif, dans laquelle un laser commute, solide et ultraviolet est utilise
JP2001015342A (ja) * 1999-06-29 2001-01-19 Matsushita Electric Ind Co Ltd 電子部品及び無線端末装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0484686A (ja) * 1990-07-27 1992-03-17 Advantest Corp レーザ加工装置
US5104480A (en) * 1990-10-12 1992-04-14 General Electric Company Direct patterning of metals over a thermally inefficient surface using a laser
US5233327A (en) * 1991-07-01 1993-08-03 International Business Machines Corporation Active resistor trimming by differential annealing
US5265114C1 (en) * 1992-09-10 2001-08-21 Electro Scient Ind Inc System and method for selectively laser processing a target structure of one or more materials of a multimaterial multilayer device
DE4336482A1 (de) * 1993-10-26 1995-04-27 Bosch Gmbh Robert Verfahren zum Abgleichen eines magnetoresistiven Sensors
US5675310A (en) * 1994-12-05 1997-10-07 General Electric Company Thin film resistors on organic surfaces
US5753391A (en) * 1995-09-27 1998-05-19 Micrel, Incorporated Method of forming a resistor having a serpentine pattern through multiple use of an alignment keyed mask
JPH09246023A (ja) * 1996-03-14 1997-09-19 Rohm Co Ltd 薄膜抵抗体の抵抗値調整方法、薄膜型サーマルプリントヘッドの発熱体抵抗値の調整方法、および、薄膜型サーマルプリントヘッド
US5864430A (en) * 1996-09-10 1999-01-26 Sandia Corporation Gaussian beam profile shaping apparatus, method therefor and evaluation thereof
JPH10149908A (ja) * 1996-11-19 1998-06-02 Rohm Co Ltd 薄膜抵抗体の抵抗値調整方法、薄膜型サーマルプリントヘッドの発熱部の抵抗値調整方法、および薄膜型サーマルプリントヘッド
JPH11320134A (ja) * 1998-05-06 1999-11-24 Canon Inc レーザトリミング加工装置および加工方法
TW482705B (en) * 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63226005A (ja) 1987-03-13 1988-09-20 松下電器産業株式会社 膜抵抗体のレ−ザ−トリミング法
JPH05347205A (ja) * 1992-06-15 1993-12-27 Tdk Corp 電子部品及び電子部品製造方法
JPH0645118A (ja) * 1992-07-27 1994-02-18 Matsushita Electric Ind Co Ltd 角形薄膜チップ抵抗器の製造方法
JPH06251914A (ja) * 1993-02-27 1994-09-09 Taiyo Yuden Co Ltd トリミング抵抗を有する回路基板の製造方法
JPH0864407A (ja) * 1994-08-26 1996-03-08 Matsushita Electric Ind Co Ltd 抵抗部品の製造方法
US5685995A (en) 1994-11-22 1997-11-11 Electro Scientific Industries, Inc. Method for laser functional trimming of films and devices
JPH09232520A (ja) * 1996-02-28 1997-09-05 Matsushita Electric Works Ltd 半導体装置及びその製造方法
JPH11162702A (ja) 1997-11-25 1999-06-18 Taiyo Yuden Co Ltd チップ部品
WO1999040591A1 (fr) * 1998-02-06 1999-08-12 Electro Scientific Industries, Inc. Technique d'ajustage par laser pour l'ablation de surface de composant resistif passif, dans laquelle un laser commute, solide et ultraviolet est utilise
JP2001015342A (ja) * 1999-06-29 2001-01-19 Matsushita Electric Ind Co Ltd 電子部品及び無線端末装置

Also Published As

Publication number Publication date
TW523837B (en) 2003-03-11
WO2002060633A1 (fr) 2002-08-08
DE10295946T5 (de) 2004-04-22
DE10295946B4 (de) 2013-09-26
CN1232379C (zh) 2005-12-21
GB2389555A (en) 2003-12-17
JP2004519095A (ja) 2004-06-24
CN1489504A (zh) 2004-04-14
KR20030079981A (ko) 2003-10-10
GB0317857D0 (en) 2003-09-03
CA2434969A1 (fr) 2002-08-08

Similar Documents

Publication Publication Date Title
US6534743B2 (en) Resistor trimming with small uniform spot from solid-state UV laser
EP1910015B1 (fr) Usinage de trou de raccordement pour circuits integres monolithiques
US8382943B2 (en) Method and apparatus for the selective separation of two layers of material using an ultrashort pulse source of electromagnetic radiation
KR100633343B1 (ko) 공간부를 형성할 고체 상태 자외선 가우시안 빔의 빔 성형 및 프로젝션 이미지 생성을 위한 시스템 및 방법
KR100894025B1 (ko) 고체-상태 ｕｖ 레이저로부터의 작은 균일한 스폿을 이용한 저항기 트리밍을 위한 방법
KR100735532B1 (ko) 기판 내에 팽창부를 포함하는 포토마스크 및 포토마스크의표면 평탄화 방법
TW525240B (en) Ultraviolet laser ablative patterning of microstructures in semiconductors
EP0622846A1 (fr) Fabrication de micro fusibles et coupure par laser
KR940007801B1 (ko) 레이저 스캐닝(scanning)을 사용하여 전자 구성 부품등을 제조하는 석판 인쇄 방법
JP6076601B2 (ja) レーザ加工方法、半導体デバイスの製造方法及びレーザ加工装置
JP7182456B2 (ja) レーザ加工方法、及び、半導体部材製造方法
TW202216333A (zh) 用於雷射鑽設盲通孔之方法及設備
US20160352070A1 (en) Laser ablation process for manufacturing submounts for laser diodes and laser diode units
Sikora et al. Picosecond laser micromachining prior to FIB milling for electronic microscopy sample preparation
WO1999040591A1 (fr) Technique d'ajustage par laser pour l'ablation de surface de composant resistif passif, dans laquelle un laser commute, solide et ultraviolet est utilise
JP2003290959A (ja) レーザ加工方法
US9440312B2 (en) Laser ablation process for manufacturing submounts for laser diode and laser diode units
KR20060098370A (ko) 레이저-기반의 수동 전자 소자 절단
Alafogianni An Investigation of Varying Laser Trim Pattern Characteristics on the Performance and Reliability of Discrete Resistive Components
Gu High-precision small geometry laser trimming for emerging microelectronics devices
Migliore et al. Laser choices for micromachining: drilling speed and quality comparison
JP2003285179A (ja) レーザ加工方法及び加工装置
JPH02151101A (ja) 薄膜混成集積回路
JP2008103574A (ja) トリミング抵抗および抵抗のトリミング方法
JP2014097508A (ja) レーザ加工方法および電子デバイスの製造方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130326

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20140326

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20160328

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee