WO2001058978A1 - Composition de resine, materiau de moulage et objet moule - Google Patents
Composition de resine, materiau de moulage et objet moule Download PDFInfo
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- WO2001058978A1 WO2001058978A1 PCT/JP2001/000809 JP0100809W WO0158978A1 WO 2001058978 A1 WO2001058978 A1 WO 2001058978A1 JP 0100809 W JP0100809 W JP 0100809W WO 0158978 A1 WO0158978 A1 WO 0158978A1
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- resin composition
- phenol
- molding material
- formaldehyde
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
- C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
- C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
- C08G14/12—Chemically modified polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08L61/14—Modified phenol-aldehyde condensates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2361/04—Condensation polymers of aldehydes or ketones with phenols only
- C08J2361/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2971—Impregnation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Definitions
- the present invention relates to a resin composition used for, for example, an impregnating material, a binder, a paint, an adhesive, and the like, and a molding material and a molded product using the resin composition.
- phenolic resins have been used as impregnating materials such as fiber sheets, wood chips, binders such as fiber materials, paints, adhesives, and the like.
- Formaldehyde and / or curing agents for curing the phenolic resins are used as curing agents.
- formaldehyde donors such as hexamethylenetetramine.
- an object of the present invention is to provide a resin composition that does not release formaldehyde during and after curing. . Disclosure of the invention
- the present invention provides a resin composition comprising a mixture of a phenol resin aqueous solution and an epoxy compound.
- the epoxy compound acts as a curing agent for the phenol resin
- the phenolic resin may be co-condensed with an amino resin monomer and / or an initial condensate, and the mixture may further contain an amino resin and / or an amino resin alone.
- the body may be mixed.
- the epoxy compound is previously dispersed in water or mixed with the aqueous solution of the phenol resin, and then a part or all of the phenol resin is a sulfoalkyl. And / or sulfalkylated.
- the epoxy compound is preferably an epoxy resin.
- the epoxy resin has an aromatic ring, and a part or all of the aromatic ring is sulfoalkylated and / or sulfialkylated. It is desirable that
- the present invention provides a molding material comprising a porous material impregnated with the resin composition, and a molded product obtained by heat molding the molding material into a predetermined shape and thermosetting the resin composition in the molding material. Is also provided.
- the phenolic resin in the resin composition be in the B state.
- the present invention provides a molding material comprising a chip and / or a powder and / or a fiber material obtained by mixing the above resin composition as a binder, and heat molding the molding material into a predetermined shape, and further comprising: It also provides a molded product obtained by thermosetting the resin composition of the above.
- 1 to 3 show one embodiment of the present invention.
- FIG. 1 is an explanatory view showing an example of a process for producing a molded material of the present invention.
- FIG. 2 is an explanatory view showing an example of a process for producing a molded material of the present invention.
- FIG. 3 is an explanatory view showing an example of a process for producing the molded material of the present invention. 11 Base material
- the essential constituent components of the resin composition in the present invention are a phenol resin aqueous solution and an epoxy compound dispersed or dissolved in the phenol resin aqueous solution.
- the phenolic resin is obtained by condensing a phenolic compound with an aldehyde and / or aldehyde donor.
- As the 7K-soluble phenolic resin it is preferable to use a sulfoalkylated and / or sulfyalkylated version of the above phenolic resin in order to improve stability.
- the present invention is not limited to the above-mentioned phenolic resin, and for example, a novolak resin obtained by subjecting a cresol consisting of m-cresol and p-cresol to a condensation reaction with a compound of phenolic acid. (Japanese Patent Application Laid-Open No. 11-322874) can also be used as a water-soluble phenol resin.
- the phenolic compound used in the phenolic resin may be a monovalent phenol, a polyvalent phenol, or a mixture of a monovalent phenol and a polyvalent phenol.
- a monohydric phenol when only a monohydric phenol is used, formaldehyde is easily released at the time of curing and after the curing, so that a polyhydric phenol or a mixture of a monohydric phenol and a polyhydric phenol is preferably used.
- Examples of the above monovalent phenol include phenol, 0-cresol, m-cresol, p_cresol, ethylphenol, isopropylphenol, xylenol, 3,5-xylenol, butylphenol and t-butylphenol.
- Penol Nonyl Alkylphenols such as phenol, 0-fluorophenol, m-fluorophenol, p-fluorophenol, 0-chlorophenol, m-chlorophenol, thread, p-chlorophenol, 0-bromophenol, m- , Romophenol, p-bromophenol, 0-odophenol, m-dophenol, p-dophenol, 0-aminophenol, m-aminophenol, p-aminophenol, 0-nitrophenol, m- Substituted monovalent phenols such as nitrophenol, p-ditrophenol, 2,4-dinitrophenol, 2,4,6-trinitrophenol, and polycyclic monovalent phenols such as naphthol are listed. Phenols can be used alone or in combination of two or more.
- polyvalent phenol examples include resorcinol, alkyl resorcinol, pyrogallol, catechol, alkyl alcohol, hydroquinone, alkylhydroquinone, phloroglucin, bisphenol, dihydroxynaphthalene, and the like. They can be used alone or in combination of two or more.
- Preferred among polyhydric phenols are resorcinol and alkylresorcinol, and particularly preferred is alkylresorcinol, which has a higher reaction rate with aldehyde than resorcinol.
- alkyl resorcinol examples include 5-methyl resorcin, 5-ethyl resorcin, 5-propyl resorcin, 5-n-butyl resorcin, 4,5-dimethyl resorcin, 2,5-dimethyl resorcin, 4,5-dimethyl resorcin, 2,5-dimethyl resorcin, 2 , 5-Detylresorcin, 4,5-dipropylresorcin, 2,5-dipropylresorcin, 4-methyl-5-ethyl resorcinol, 2-methyl-5-ethyl resorcinol, 1-methyl-5-propyl resorcinol, 2,4 , 5-trimethylresorcin, 2,4,5-triethylresorcin and the like.
- Polyvalent phenol mixture obtained by dry distillation of Estonian oil shale is inexpensive and contains a large amount of various highly reactive alkylresorcinols in addition to 5-methylresorcin, and is therefore a particularly preferred polyvalent phenol raw material in the present invention.
- the above-mentioned phenolic compound is condensed with an aldehyde and / or an aldehyde donor (aldehydes).
- the above-mentioned aldehyde donor means a compound capable of generating and providing an aldehyde when decomposed or a mixture thereof. I do.
- aldehydes examples include formaldehyde, acetaldehyde, propionaldehyde, chloral, furfural, glyoxal, n-butyraldehyde, force proaldehyde, arylaldehyde, benzaldehyde, crotonaldehyde, acrolein, and phenylacetaldehyde.
- aldehyde donors include, for example, ⁇ , 'formaldehyde, trioxane, hexamethylenetetramine, tetraoxymethylene and the like.
- Sulfoalkylating agents that can be used to improve the stability of soluble phenolic resins include, for example, sulfurous acid, bisulfite or metabisulfite, alkali metals or trimethylamine or benzyltrimethylammonium.
- examples thereof include water-soluble sulfites obtained by reacting quaternary amines or quaternary ammoniums, and aldehyde adducts obtained by reacting these water-soluble sulfites with aldehydes.
- the aldehyde adduct includes formaldehyde, acetaldehyde, propionaldehyde, chloral, furfural, glyoxal, n-butyl aldehyde, force proaldehyde, acrylaldehyde, benzaldehyde, crotonaldehyde, acrolein, and phenylacetate.
- an addition reaction of an aldehyde such as aldehyde, o_tolualdehyde, salicylaldehyde and the above water-soluble sulfite for example, an aldehyde adduct composed of formaldehyde and sulfite is a hydroxy It is a cimethane sulfonate.
- Alkali metals such as sulfoxylates, sodium hydrosulfite, magnesium hydrosulfite, and hydroxyalkanes such as alkaline earth metal hydrosulfites (dithionites) and hydroxymethane sulfinate Examples thereof include sulfinic acid salts.
- Hydrochloride aniline hydrochloride Hydrochlorides of amines, urea salicylate, urea stearate, urea heptanoate, etc., acidic substances such as N-trimethyltaurine, zinc chloride, ferric chloride, ammonia, amines, 7 oxidation Sodium, 7K potassium oxide, barium oxide, hydroxide of alkaline metal such as calcium calcium hydroxide, hydroxide of alkaline earth metal such as lime, oxide of alkaline earth metal such as lime, sodium carbonate, sodium sulfite, acetic acid An alkaline substance such as a weak acid salt of an alkaline metal such as sodium or sodium phosphate may be mixed as a catalyst or a pH adjuster.
- the above phenol resin (initial condensate) can be produced by a conventional method. Specifically, (a) — (a method of condensing a plane phenol and / or a polyhydric phenol with an aldehyde, (b) A method of condensing an initial condensate obtained by condensing a polyhydric phenol with an aldehyde and / or an initial condensate obtained by condensing a polyvalent phenol and an aldehyde with a monovalent phenol and / or a polyvalent phenol, (c ) A method of condensing an initial condensate obtained by condensing a monovalent phenol with a polyvalent phenol and an aldehyde, and a method of condensing a monovalent phenol and / or a polyvalent phenol, (d) with a divalent phenol and an aldehyde (E) condensing a monovalent phenol
- Manufactured by condensing an initial condensate and / or an initial condensate obtained by condensing a polyhydric phenol with an aldehyde, and an initial condensate obtained by condensing a monovalent phenol, a polyvalent phenol and an aldehyde. can do.
- the above-mentioned acidic substance or an alkaline substance is used as a catalyst.
- a novolak type phenol is used by using an acidic substance. It is desirable to use resin. Novolak-type phenolic resins use less formaldehyde and have good reactivity with epoxy compounds.
- a sulfoalkylating agent and / or a sulfalkylation agent is added to the precondensate at an optional stage to form a phenol.
- the sulfoalkylated compound and / or the initial condensate are sulfoalkylated and / or sulfalkylated.
- the addition of the sulfoalkylidizing agent and / or the sulfialkylating agent may be performed at any stage before, during, or after the condensation reaction.
- the total addition amount of the sulfoalkylating agent and / or the sulfialkylating agent is usually 0.01 to 1.5 mol per 1 mol of the phenolic compound.
- the amount is less than 0.001 mol, the hydrophilicity of the phenol resin is not sufficient, and when the amount is more than 5 mol, the water resistance of the phenol resin deteriorates.
- the amount is preferably about 0.01 to 0.8 mol.
- the sulfoalkylating agent and / or sulfylalkylating agent added for sulfoalkylation and / or sulfalkylation of the precondensate is preferably a methylol group of the precondensate and / or a fragrance of the precondensate.
- the aqueous solution of the precondensate of the phenol resin sulfoalkylated and / or sulfalkylated in this manner is stable in a wide range of acidic (pH 1.0) to alkaline properties, and is acidic, neutral and acidic. It can be cured in both alkaline and alkaline regions. In particular, when cured on the acidic side, residual methylol groups are reduced, and there is no possibility that the cured product is decomposed to formaldehyde.
- the water-insoluble epoxy compound is mixed with the sulfomethylated and / or sulfimethylated phenol resin aqueous solution of the initial condensate to form the water-insoluble epoxy compound. It has the advantage that it can be easily dispersed in the aqueous solution and a stable epoxy compound dispersion can be obtained.
- urea, thiourea, melamine, thiomelamine, dicyandiamine, guanidine, guanamine, acetoguanamine, benzoguanamine, amino resin monomer of 2,6-diamine 1,3-diamine And / or an initial condensate comprising the amino resin monomer may be added to co-condense with the phenolic compound and / or the initial condensate.
- epoxy compound in the present invention has at least an epoxy group in one molecule.
- Such epoxy compounds include, for example, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, tripropylene glycol diglycidyl ether, and polypropylene glycol diglycidyl ether.
- Polyepoxy compounds such as fatty acid-modified epoxy, bisphenol A-type epoxy resin, tetrabromobisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, bisphenol B-type epoxy resin, naphthalene-type epoxy resin, nopolak-type epoxy resin, epoxy resin with fluorene skeleton, epoxy resin made
- the epoxy derivative has high reactivity with the phenol resin, and when the epoxy derivative is resorcin, alkyl resorcin, sier oil resorcin or the like among the polyhydric phenols, the reactivity with the phenol resin is high. And it is preferably used as an epoxy compound.
- the epoxy compound is preferably 7j-soluble or water-dispersible in consideration of the ease of dissolution and dispersion in the aqueous phenol resin solution, the uniformity of the mixture, and the like. It is preferable to mix the phenolic resin solution with the aqueous solution of the phenol resin after using a suitable surfactant. However, water-insoluble epoxy compounds If a surfactant is dissolved in an aqueous solution of a phenol resin, the surfactant can be dissolved or dispersed and emulsified by dissolving it in an organic solvent, and the phenol resin can be sulfoalkylated and / or dispersed.
- the phenol resin When sulfialkylated, the phenol resin itself acts as a dispersant, so that even if the epoxy compound is water-insoluble, it can be dispersed and emulsified without using a surfactant.
- the resin composition of the present invention gives a high-strength cured product.
- the epoxy resin has an aromatic ring, part or all of the aromatic ring is sulfoalkylated and / or sulfalkylated in the same manner as the phenol resin to improve the affinity for water. Is also good.
- the sulfoalkylidizing agent and / or sulfyalkylating agent is used in an amount of 0.01 to 1.5 mol, preferably 0.01 to 0.8 mol, based on an ethoxy resin monomer such as bisphenol. Degree.
- the amount is less than 0.001 mol, the hydrophilicity of the epoxy resin is not sufficient, and when the amount is more than 1.5 mol, the water resistance of the epoxy resin deteriorates.
- One or two or more monoepoxy compounds may be added to the epoxy compound for the purpose of improving flexibility or a reactive diluent.
- a monoepoxy compound include higher alcohol glycidyl ether, butyl glycidyl ether, phenyl glycidyl ether, cresyl glycidyl ether, nonylphenyl glycidyl ether, glycidyl methacrylate and the like.
- the resin composition of the present invention contains the water-soluble phenol resin and an epoxy compound, and in the resin composition, the epoxy compound acts as a curing agent for the phenol resin. Therefore, it is not necessary to use a formaldehyde donor such as formaldehyde or hexamethylenetetramine as a curing agent for the phenol resin, and the resin composition has a low free formaldehyde content during and after curing. No risk of polluting the environment. Further, since the epoxy compound also reacts with free phenol present in the resin composition, the content of free phenol in the resin composition is reduced, and the generation of offensive odor due to the free phenol can be stopped.
- a formaldehyde donor such as formaldehyde or hexamethylenetetramine
- the amount of the epoxy compound to be added to 100 parts by weight of the phenol resin is preferably from 2 to 150 parts by weight, more preferably from 5 to 100 parts by weight, as solids. If the compounding amount of the epoxy resin compound is less than 2 parts by weight, the phenolic resin is not sufficiently cured, and if the compounding amount of the epoxy compound exceeds 150 parts by weight, the amount of the epoxy compound which does not bind to the phenolic resin increases. Adversely affect strength.
- the resin composition is usually provided as an aqueous solution of a precondensate.
- thermoplastic resin microcapsules are encapsulated in thermoplastic resin microcapsules; Shirasu balloon, parlite, glass balloon, foamed glass, hollow ceramics, etc. Hollow granules; plastic foam or foam such as expanded polyethylene, expanded polystyrene, expanded polypropylene; pigments, dyes, flame retardants, flame retardants, water repellents, oil repellents, insect repellents, preservatives, antiaging agents, UV absorbers; DBP, DOP, phthalate esters such as dicyclohexyl phthalate
- the phenol resin and / or the epoxy compound may be modified by co-condensation or mixing with a third component such as a system plasticizer or another plasticizer such as tricresyl phosphate. .
- a reaction between a phenolic hydroxyl group in a phenol resin and an epoxy group in an epoxy compound occurs.
- a resin composition When formaldehyde is present in the phenolic resin, or when the phenol component in the phenolic resin has a methylol group, etc., the aromatic ring of the phenolic resin and the aromatic ring of the epoxy compound having an aromatic ring are A reaction in which a methylene bond is formed also occurs.
- the resin composition described above may be impregnated into a porous body such as a fiber sheet or a plastic foam sheet to impart rigidity or moldability, or may be mixed with a piece of wood or fiber material as a binder, Alternatively, it can be used for various purposes such as paints and adhesives.
- the resin composition of the present invention is impregnated into a porous material as an impregnating agent, or is mixed with a chip, powder or fiber as a binder.
- a porous material (molding material (1)) impregnated with the resin composition of the present invention, or a chip, powder or fiber (molding material (2)) mixed with the resin composition of the present invention has moldability. It is useful as a molding material.
- Examples of the porous material used for the molding material (1) of the present invention include a fiber aggregate, a plastic foam having continuous bubbles, and a sintered plastic bead.
- the fibers constituting the fiber aggregate include natural fibers such as cotton, hemp, wool, silk, kenaf, coconut fiber, bamboo fiber, polyamide fiber, polyester fiber, acrylic fiber, viscose fiber, acetate fiber, and salt fiber.
- Use organic fibers such as danibul fiber and vinylidene chloride fiber, inorganic fibers such as asbestos fiber, glass fiber, carbon fiber, ceramic fiber, metal fiber, steel fiber, rock wool, and rock wool.
- Recycled fibers obtained by defibrating scraps of recycled fiber products, or these fibers Or a mixture of these fibers with a low-melting fiber such as polyester fiber, polypropylene fiber, polyethylene fiber, or polyamide fiber having a melting point of 200 ° C. or less.
- the fiber aggregate includes a web, a nonwoven fabric, a filter, a knitted fabric, a laminate thereof, and the like.
- plastic foam examples include polyurethane foams having an open-cell structure, polyolefin foams such as polyethylene and polypropylene, polyvinyl chloride foams, polystyrene foams, and amino resin foams such as melamine resin and urea resin. And phenol resin foams.
- the plastic foam is usually provided in the form of a sheet when used as a raw material for a base material of an automobile interior material.
- the molding material (1) of the present invention can be produced by impregnating the above-mentioned porous material with the resin composition of the present invention, and heating and drying the resin at a temperature not higher than the curing temperature of the resin composition.
- a known method such as an immersion method or a spray method is applied.
- the porous material is immersed in an impregnation tank filled with the resin composition, and then the porous material to which the resin composition has adhered is pressed with a squeezing roll or a press machine. Thereby, a predetermined amount of the resin composition can be impregnated into the porous material.
- the resin composition filled in the impregnation tank may be foamed and / or foamed.
- the porous material impregnated with the resin composition is subjected to a heating and drying step.
- the phenol resin precondensate contained in the resin composition may be brought into the B state.
- the heating temperature, the heating time, and the like may be adjusted.
- the heating temperature is set to be equal to or lower than the curing temperature of the resin composition, and is usually about 50 to 180 ° C.
- the heating time is about 0.1 to 5 hours.
- For the heating and drying usually hot air drying, far-infrared drying, high-frequency heating drying and the like are applied.
- the phenolic resin precondensate in the resin composition thus impregnated in the porous material By bringing into the B state, the stability of the resin composition is improved and the molding material can be stored for a long period of time, and the moisture content of the resin composition is reduced, so that the molding time is shortened, Also, there is no puncture caused by moisture vapor when molded by hot pressing. Further, after the molding material is subjected to hot press molding, the resin composition is completely cured, so that a molded product excellent in shape retention and heat resistance can be obtained.
- the molding material (1) of the present invention is impregnated with a phenol resin and an epoxy resin, which are thermosetting resins, it has moldability and usually comprises a lower mold and an upper mold having a desired mold surface shape. Molded by hot pressing using The hot pressing conditions are set to a temperature and a time at which the resin composition is completely cured, and the pressing pressure is usually set to 1 to 10 kg / cm 2 . At this time, it may be superimposed on another sheet and hot-pressed to form a laminate.
- the molding material (1) of the present invention is impregnated with the above resin composition which does not use a formaldehyde donor such as formaldehyde or hexamethylene tetraamine as a curing agent, it does not release formaldehyde during hardening and after curing. There is no danger of polluting the environment.
- a formaldehyde donor such as formaldehyde or hexamethylene tetraamine
- the molded product obtained from the molding material (1) of the present invention is particularly suitable for vehicles such as door trims, dash pads, ceiling materials, hoods, dash inners, dash outers, engine undercovers, and trunk side trims. It is useful as an interior material for building, a base material or a skin material of the interior material, or a building material such as a floor material, a wall material, and a roof base material.
- the molded article of the present invention When the molded article of the present invention is used as a skin material, it may be lined with a plastic foam or a padding material such as a nonwoven fabric, and the base material to which the skin material is adhered is, for example, a polyurethane foam, Polyolefin foams such as polyethylene and polypropylene, plastic foams such as polychlorinated vinyl foam, polystyrene foam, melamine resin foam, urea resin foam, dampol, resin felt, plywood, particle board, wood cement board, etc. There is.
- the obtained molded article When the obtained molded article is used as a skin material, it is usually adhered to a substrate by the following three methods. In the first method, as shown in FIG.
- the base material (11) is formed into a predetermined shape, and the sheet-shaped molding material (1) is cured and formed into a shape conforming to the shape of the base material (11). And a method of sticking the formed cured sheet (12) to the surface of the substrate (11).
- an adhesive described later a hot-melt type adhesive, or a hot melt sheet may be used.
- a hot-melt type adhesive When it is made of a plastic material, it may be heated and fused.
- a sheet-shaped molding material (12a) and an original body (11a) before molding of a base material are overlapped, and an upper mold (13) having a predetermined shape and a lower mold (13) are stacked.
- the base material (11a) and the molding material (12a) are simultaneously molded by hot press molding with a mold (), and the resin composition in the molding material (12a) is cured.
- an adhesive such as a hot menoleto sheet, natural resin, natural rubber, synthetic resin, or synthetic rubber may be provided between the molding material (12a) and the base material body (11a).
- An agent may be interposed.
- a sheet-shaped molding material is cured and molded in a predetermined shape in advance, and the molded cured sheet (12) is set on a mold surface (151) of a molding die (15).
- foamed resin liquid R examples include, for example, polyurethane foam resin, polyethylene, polyolefin foam resin such as polypropylene, polyvinyl chloride foam resin, polystyrene foam resin, melamine foam resin, urea foam resin, and the like.
- polyurethane foam resin polyethylene
- polyolefin foam resin such as polypropylene
- polyvinyl chloride foam resin polyvinyl chloride foam resin
- polystyrene foam resin polystyrene foam resin
- melamine foam resin urea foam resin
- the skin material of the present invention is obtained by impregnating and curing the above resin composition which does not use a formaldehyde donor such as formaldehyde or hexamethylenetetramine as a curing agent, the molding material comprises formaldehyde. No release and no risk of environmental pollution. Further, since the skin material of the present invention has high rigidity, the obtained interior material is provided with good shape stability, and the shape can be maintained for a long time.
- a formaldehyde donor such as formaldehyde or hexamethylenetetramine
- a surface material is usually adhered to the surface thereof.
- the skin material examples include artificial leather, leather, fiber knitted and woven fabrics, nonwoven fabrics, and plastic foams such as polyurethane foam, polyethylene foam, polypropylene foam, polystyrene foam, and polychlorinated vinyl foam. And laminated materials.
- the skin material is adhered to the base material with an adhesive, a hot-melt adhesive, a hot-melt sheet, or the like.
- the adhesive examples include an acrylic adhesive, a synthetic rubber adhesive, an elastomer adhesive, a butyl acetate adhesive, a butyl chloride adhesive, a urea resin adhesive, a melamine resin adhesive,
- An epoxy resin-based adhesive or the like, or an adhesive based on the resin composition of the present invention is used, and the skin material is impregnated with a thermosetting synthetic resin in the form of a solution of an initial condensate as the adhesive, or
- the skin material can be adhered to the base material by superimposing the base material on the base material and simultaneously molding the base material in the state B, and furthermore, the impregnation of the thermosetting synthetic resin and the bonding It can be used in combination with application of an agent.
- the thermosetting synthetic resin the resin composition of the present invention can be used.
- hot methanol type adhesive examples include polyolefin resins such as polyethylene, polypropylene, ethylene monoacetate copolymer, and ethylene ethyl acrylate copolymer, or modified products of the polyolefin resins, and polyurethane adhesives.
- polyolefin resins such as polyethylene, polypropylene, ethylene monoacetate copolymer, and ethylene ethyl acrylate copolymer, or modified products of the polyolefin resins, and polyurethane adhesives.
- a single resin or a mixture of two or more resins, polyester resins, polyamide resins and the like are used.
- the hot melt adhesive is provided as a solution type or emulsion type, and is also provided as a dispersion type in which the hot melt adhesive powder is dispersed in water. Further, the hot melt adhesive is formed into a sheet and used as a hot melt sheet.
- the adhesive is formed into an adhesive layer by coating or the like, it may be preferable that the adhesive layer is scattered in a dotted manner on the bonding surface of the skin material and / or the base material. In this way, if the skin material and the base material are bonded by the adhesive layer scattered in a dot-like manner, the rigidity of the adhesive layer does not affect the molding shape of the interior material or the uneven shape of the surface. Shape of interior material ⁇ ! Sharply shaped dogs and irregularities. When the skin material has air permeability, the adhesive layer also has air permeability, so that an interior material having excellent soundproofing properties can be obtained.
- a spray coating method for example, a letterpress printing method, a silk screen printing method or the like is applied.
- a method of applying an adhesive with a spray, a knife coater, a mouth coater, a floor coater and the like, and then peeling off the masking sheet may be applied.
- a desirable method of scattering the adhesive layer in a dotted manner on the surface of the skin material and / or the adhesive surface of the base material is a method of spray coating a hot melt adhesive powder dispersion.
- the skin material is adhered to the surface of the base material by the adhesive layer.
- the adhesive is of a solution type or an emulsion type
- the adhesive layer formed on the bonding surface is completely dried. And stick them together.
- the adhesive layer is of a hot-melt type
- the adhesive surface is heated to soften the adhesive layer formed on the adhesive surface, and then the two are laminated.
- the molding of the base material may be performed before bonding the skin material, at the same time as bonding the skin material, or at any time after bonding the skin material.
- the molding is performed after the skin material is bonded to the base material, the air contained in the base material passes through the point-like adhesive layer during molding and is smoothly discharged from the skin material to the outside world.
- the puncture phenomenon does not occur in the manufactured interior material.
- the base material of the interior material comprising the molding material (1) of the present invention is obtained by impregnating with the above resin composition which does not use a formaldehyde donor such as formaldehyde or hexamethylenetetramine as a curing agent. Therefore, the interior material does not emit formaldehyde and does not pollute the environment.
- the interior material using the molding material (1) of the present invention as a base material has high rigidity and can be used for various applications.
- it is suitable as an interior material for a car trunk and an interior material for a dashboard. is there.
- the rigidity of the adhesive layer depends on the molding shape of the interior material and the uneven shape of the surface. It has no effect, and therefore, the molding shape and uneven shape of the interior material are sharply molded.
- the adhesive layer also has air permeability, so that the obtained interior material has excellent soundproofing properties.
- the chips used for the molding material (2) of the present invention are mainly wood chips, such as wood chips, wood wool, and wood fiber bundles, but plastic chips, plastic foam pieces and the like can also be used.
- the powder used for the molding material (2) of the present invention is a woody material such as wood powder. Although there is no alternative, plastic powder is also used.
- the fibers used in the molding material (2) of the present invention include the above-mentioned natural fibers, organic fibers, inorganic fibers, regenerated fibers, and wood fibers such as pulp.
- the chips, powders, and fibers may be used in combination of two or more and / or two or more of each other.
- the molding material (2) of the present invention comprises a method of immersing the above chips, powders, and fibers in the resin composition of the present invention, and stirring the chips, powders, and fibers, and adding the resin composition with a spray or the like.
- the resin composition is added to the chips, powders and fibers by a method or the like and mixed. Then, if desired, the mixture is dried at a temperature lower than the curing temperature of the resin composition.
- the phenol resin initial condensate in the resin composition may be in the B state.
- the molding material (2) of the present invention is dried without drying or after it has been dried, and is usually sprayed on a lower mold having a desired mold surface shape of a press molding machine to form the mat. Hot press with upper mold.
- the pressing conditions are the same as those for the molding material (1), and may be superimposed on other sheets and hot-pressed to form a laminated molded product.
- the molding material (2) of the present invention also contains the above-mentioned resin composition which does not use a formaldehyde donor such as formaldehyde or hexamethylene tetraamine as a curing agent. There is no risk of contamination.
- a formaldehyde donor such as formaldehyde or hexamethylene tetraamine
- the molded product obtained from the molding material (2) of the present invention is useful as an interior material similar to the molding material ⁇ or a base material of the interior material, or a building material such as a floor material, a wall material, and a roof base material. Ah .
- the resin composition of the present invention is also useful as an adhesive or a paint vehicle in addition to the above molding materials.
- the above molding material is used as a material other than interior materials and building materials, for example, as a sheet material or matt pad material / cushion material.
- the epoxy compound When the epoxy compound is mixed with the phenol resin, the following reaction occurs between the ⁇ group of the phenol resin and the epoxy group of the epoxy compound, and the resin composition is cured by three-dimensionalization.
- the phenol group is
- the above curing reaction is carried out at a low temperature, and particularly when the phenol resin is a nopolak type, the reaction is carried out quickly and smoothly.
- the formaldehyde-formaldehyde donor is not used as a curing agent, so that the free formaldehyde content is reduced.
- the phenol contained in the phenol resin also reacts with the epoxy group of the epoxy compound in the same reaction as described above, so that the free phenol content in the phenol resin is reduced.
- a 50% by weight of a 50% by weight aqueous solution of a sulfomethylated alkylresorcinol-formaldehyde precondensate (A) (hereinafter simply referred to as “parts”) is 50% by weight of bisphenol A type epoxy resin using a surfactant.
- % Aqueous dispersion (B) were mixed in a volume ratio. Table 1 shows the results of measurement of free formaldehyde after forming a film of the mixture and curing by heating at 180 ° C for 2 minutes.
- Table 1 shows that the resin composition of the present invention has much less free formaldehyde than the conventional phenol resin.
- the water-insoluble epoxy resin can be stably dispersed over a wide pH range without using a surfactant.
- Table 3 shows the results obtained by mixing in the same manner as in Example 2 with the use of the initial cocondensate of orcinol phenol-formaldehyde which was not used in Example 2.
- Example 2 the film of the mixture with the water-soluble epoxy resin (C) was cured by heating at 200 ° C. for 60 seconds, and the result of measurement of free formaldehyde showed that the amount of free formaldehyde was small as shown in Table 4. Was. (Table 4)
- the wood board has a high strength and a low free formaldehyde content.
- the glass fiber after spray application was dried at 80 to 90 ° C for 10 minutes to remove water. After the drying, the glass fiber was hot-pressed at 180 ° C. for 5 minutes to obtain a molded article having excellent rigidity.
- Phenol (1 mol), 37% formalin (1.5 mol), sodium hydroxide (0.1 mol), and sodium sulfite (0.3 mol) were reacted at 85 ° C for 8 hours.
- sulfomethylated phenol over formalin precondensate (F) 100 parts by weight of the initial condensate (F) to (solid content 50 wt 0/0), was added 1 0 part by weight of melamine
- the mixture was stirred and mixed uniformly, and the mixture was mixed with 50 parts by weight of the sulfimeylated epoxy resin (E) obtained in Example 9 and mixed with glass fiber having a basis weight of 300 g / m 2 . so that the coating amount of 200 g / m 2, the said glass fibers was immersed including, then dried at 80 ° C 20 min, further for 5 minutes heat pressure molding at 1 70 ° C, excellent rigidity A molded product was obtained.
- Phenol (1 mol), 37% formalin (1.5 mol), sodium hydroxide (0.1 mol), and sodium sulfite (0.3 mol) are reacted at 85 ° C for 7 hours and sulfomethylated phenol resin An initial condensate is produced, and then urea (0.5 mol) is added and the mixture is further reacted for 2 hours to obtain a sulfomethylated phenol monourea monoformalin initial cocondensate.
- the glass fiber is spray-coated on a 400 g / m 2 glass fiber so as to have a coating amount of 100 / m 2. After the coating, the glass fiber is dried at 100 ° C. for 5 minutes. The fiber is polymerized on both sides of the damper, and hot-pressed at 160 ° C for 2 minutes to obtain rigidity To obtain an excellent molded product.
- a resin composition which has a low content of harmful substances such as free formaldehyde and free phenol at the time of curing and after curing and can be cured at a low temperature, and the composition comprises a molding material, a binder and an adhesive. Useful for paints, etc.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
- Table Devices Or Equipment (AREA)
Description
Claims
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2001240264A AU2001240264B2 (en) | 2000-02-07 | 2001-02-05 | Resin composition, molding material, and molded object |
DE60121553T DE60121553T2 (de) | 2000-02-07 | 2001-02-05 | Harzzusammensetzung, formmaterial und geformter gegenstand |
EP01951147A EP1264851B1 (en) | 2000-02-07 | 2001-02-05 | Resin composition, molding material, and molded object |
JP2001558123A JP4573489B2 (ja) | 2000-02-07 | 2001-02-05 | 成形材料および成形物 |
AU4026401A AU4026401A (en) | 2000-02-07 | 2001-02-05 | Resin composition, molding material, and molded object |
US10/203,360 US6794034B2 (en) | 2000-02-07 | 2001-02-05 | Resin composition, molding material, and molded object |
CA002399736A CA2399736A1 (en) | 2000-02-07 | 2001-02-05 | A molding material and a molded article |
AU2004242413A AU2004242413B2 (en) | 2000-02-07 | 2004-12-21 | A molding material, and a molded article |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000029496 | 2000-02-07 | ||
JP2000-29496 | 2000-02-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001058978A1 true WO2001058978A1 (fr) | 2001-08-16 |
Family
ID=18554748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/000809 WO2001058978A1 (fr) | 2000-02-07 | 2001-02-05 | Composition de resine, materiau de moulage et objet moule |
Country Status (9)
Country | Link |
---|---|
US (1) | US6794034B2 (ja) |
EP (1) | EP1264851B1 (ja) |
JP (1) | JP4573489B2 (ja) |
AT (1) | ATE333487T1 (ja) |
AU (2) | AU2001240264B2 (ja) |
CA (1) | CA2399736A1 (ja) |
DE (1) | DE60121553T2 (ja) |
ES (1) | ES2267791T3 (ja) |
WO (1) | WO2001058978A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1396855A2 (en) * | 2002-09-05 | 2004-03-10 | Matsushita Electric Industrial Co., Ltd. | Optical data recording medium and manufacturing method for the same; and a method for clamping the optical data recording medium |
WO2006118058A1 (ja) * | 2005-04-26 | 2006-11-09 | Nagoya Oilchemical Co., Ltd. | 成形性シートおよび内装材料 |
JP2009173808A (ja) * | 2008-01-25 | 2009-08-06 | Nagoya Oil Chem Co Ltd | 親水性フェノール樹脂、それを用いた成形可能材料、それらを用いた成形材および内装材 |
JP2015510558A (ja) * | 2012-02-20 | 2015-04-09 | オートモビリ ランボルギーニ ソチエタ ペル アツイオニ | 炭素繊維布帛を製造するための方法及びこの方法によって製造された布帛 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2428197A1 (en) * | 2000-11-10 | 2002-05-16 | Nagoya Oilchemical Co., Ltd. | Interior material |
JP3689415B2 (ja) * | 2003-06-18 | 2005-08-31 | 株式会社山本鍍金試験器 | バレル、バレルめっき装置及び液排出具 |
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US7741406B2 (en) * | 2006-09-13 | 2010-06-22 | Georgia-Pacific Chemicals Llc | Phenol-formaldehyde resin having low concentration of tetradimer |
US7807748B2 (en) * | 2006-09-13 | 2010-10-05 | Georgia-Pacific Chemicals Llc | Phenol-formaldehyde resin having low concentration of tetradimer |
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CN113801281A (zh) * | 2021-10-13 | 2021-12-17 | 兰州理工大学 | 一种pH响应聚集体形成的低溶解度磺化酚醛树脂的制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0710946A (ja) * | 1993-06-21 | 1995-01-13 | Nagoya Yuka Kk | アミノ系共縮合樹脂およびその製造方法 |
JPH09206885A (ja) * | 1996-01-31 | 1997-08-12 | Kao Corp | 炭酸ガス硬化用粘結剤組成物 |
JPH11343455A (ja) * | 1998-06-01 | 1999-12-14 | Toyo Ink Mfg Co Ltd | 水性分散体組成物 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS535703B2 (ja) * | 1973-07-04 | 1978-03-01 | ||
DE2966551D1 (en) * | 1978-07-31 | 1984-02-23 | Sumitomo Bakelite Co | A method of manufacturing an electrical article |
US4560714A (en) * | 1982-12-16 | 1985-12-24 | Celanese Corporation | Water-swellable crosslinked polymeric microgel particles and aqueous dispersions of organic film-forming resins containing the same |
US4501787A (en) * | 1983-04-29 | 1985-02-26 | Westinghouse Electric Corp. | Flame retardant B-staged epoxy resin prepregs and laminates made therefrom |
US4477512A (en) * | 1983-04-29 | 1984-10-16 | Westinghouse Electric Corp. | Flexibilized flame retardant B-staged epoxy resin prepregs and composite laminates made therefrom |
US4524107A (en) * | 1984-03-20 | 1985-06-18 | Westinghouse Electric Corp. | Toughened thermoset laminates |
JPS60260621A (ja) * | 1984-06-08 | 1985-12-23 | Dainippon Ink & Chem Inc | 成形材料用樹脂組成物 |
US4792479A (en) * | 1986-07-30 | 1988-12-20 | Westinghouse Electric Corp. | Punchable epoxy based laminating compositions |
US4769437A (en) * | 1986-12-22 | 1988-09-06 | Blount David H | Process for the production of phenolic resins |
US4868059A (en) * | 1987-11-16 | 1989-09-19 | The Dow Chemical Company | Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol |
US5066552A (en) * | 1989-08-16 | 1991-11-19 | International Business Machines Corporation | Low noise thin film metal alloy magnetic recording disk |
JPH03210338A (ja) * | 1990-01-13 | 1991-09-13 | Sumitomo Electric Ind Ltd | 摩擦材の製造方法 |
US5062938A (en) * | 1990-01-16 | 1991-11-05 | International Business Machines Corporation | High coercivity low noise cobalt alloy magnetic recording medium and its manufacturing process |
JPH04370182A (ja) * | 1991-06-19 | 1992-12-22 | Dainippon Ink & Chem Inc | フェノール樹脂付着基材の安定化方法及びレジノイド砥石の製造方法 |
US5478661A (en) * | 1993-04-01 | 1995-12-26 | Ag Technology Co., Ltd. | Magnetic recording medium and method for its production |
US5679473A (en) * | 1993-04-01 | 1997-10-21 | Asahi Komag Co., Ltd. | Magnetic recording medium and method for its production |
JP3448698B2 (ja) * | 1995-06-27 | 2003-09-22 | 株式会社日立製作所 | 磁気記憶装置及び磁気記録媒体 |
JP2000001599A (ja) * | 1998-03-10 | 2000-01-07 | Kashima Oil Co Ltd | 高反応性変性フェノ―ル樹脂を用いた樹脂組成物、成形体、繊維強化樹脂板、摩擦材、発泡体、接着剤、防食塗料および難燃剤 |
JP3731640B2 (ja) * | 1999-11-26 | 2006-01-05 | 株式会社日立グローバルストレージテクノロジーズ | 垂直磁気記録媒体及び磁気記憶装置 |
JP2002133645A (ja) * | 2000-10-20 | 2002-05-10 | Fuji Electric Co Ltd | 磁気記録媒体およびその製造方法 |
KR100387237B1 (ko) * | 2001-01-10 | 2003-06-12 | 삼성전자주식회사 | 초고밀도기록을 위한 수직 기록용 자성 박막 |
US6835475B2 (en) * | 2001-07-26 | 2004-12-28 | Hitachi Global Storage Technologies Netherlands B.V. | Dual-layer perpendicular magnetic recording media with laminated underlayer formed with antiferromagnetically coupled films |
JP4019703B2 (ja) * | 2001-12-07 | 2007-12-12 | 富士電機デバイステクノロジー株式会社 | 垂直磁気記録媒体およびその製造方法 |
JP4582978B2 (ja) * | 2001-12-07 | 2010-11-17 | 富士電機デバイステクノロジー株式会社 | 垂直磁気記録媒体の製造方法 |
JP2003217107A (ja) * | 2002-01-17 | 2003-07-31 | Fuji Electric Co Ltd | 磁気記録媒体 |
US7226674B2 (en) * | 2003-02-07 | 2007-06-05 | Hitachi Maxell, Ltd. | Magnetic recording medium, method for producing the same, and magnetic recording apparatus |
-
2001
- 2001-02-05 AT AT01951147T patent/ATE333487T1/de not_active IP Right Cessation
- 2001-02-05 US US10/203,360 patent/US6794034B2/en not_active Expired - Fee Related
- 2001-02-05 CA CA002399736A patent/CA2399736A1/en not_active Abandoned
- 2001-02-05 WO PCT/JP2001/000809 patent/WO2001058978A1/ja active IP Right Grant
- 2001-02-05 DE DE60121553T patent/DE60121553T2/de not_active Expired - Fee Related
- 2001-02-05 EP EP01951147A patent/EP1264851B1/en not_active Expired - Lifetime
- 2001-02-05 ES ES01951147T patent/ES2267791T3/es not_active Expired - Lifetime
- 2001-02-05 AU AU2001240264A patent/AU2001240264B2/en not_active Ceased
- 2001-02-05 AU AU4026401A patent/AU4026401A/xx active Pending
- 2001-02-05 JP JP2001558123A patent/JP4573489B2/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0710946A (ja) * | 1993-06-21 | 1995-01-13 | Nagoya Yuka Kk | アミノ系共縮合樹脂およびその製造方法 |
JPH09206885A (ja) * | 1996-01-31 | 1997-08-12 | Kao Corp | 炭酸ガス硬化用粘結剤組成物 |
JPH11343455A (ja) * | 1998-06-01 | 1999-12-14 | Toyo Ink Mfg Co Ltd | 水性分散体組成物 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1396855A2 (en) * | 2002-09-05 | 2004-03-10 | Matsushita Electric Industrial Co., Ltd. | Optical data recording medium and manufacturing method for the same; and a method for clamping the optical data recording medium |
EP1396855A3 (en) * | 2002-09-05 | 2006-04-26 | Matsushita Electric Industrial Co., Ltd. | Optical data recording medium and manufacturing method for the same; and a method for clamping the optical data recording medium |
US7290272B2 (en) | 2002-09-05 | 2007-10-30 | Matsushita Electric Industrial Co., Ltd. | Optical data recording disc with protrusion between clamping area and center hole |
US7389520B2 (en) | 2002-09-05 | 2008-06-17 | Matsushita Electric Industrial Co., Ltd. | Optical data recording disc with protrusion between clamping area and center hole |
US7401346B2 (en) | 2002-09-05 | 2008-07-15 | Matsushita Electric Industrial Co., Ltd. | Optical data recording disc with protrusion between clamping area and center hole |
US7401347B2 (en) | 2002-09-05 | 2008-07-15 | Matsushita Electric Industrial Co., Ltd. | Optical data recording medium with protrusion bonded between center hole and clamping area |
US7409699B2 (en) | 2002-09-05 | 2008-08-05 | Matsushita Electric Industrial Co., Ltd. | Optical data recording disc with protrusion between clamping area and center hole |
US7761888B2 (en) | 2002-09-05 | 2010-07-20 | Panasonic Corporation | Optical data recording disc with protrusion between clamping area and center hole |
WO2006118058A1 (ja) * | 2005-04-26 | 2006-11-09 | Nagoya Oilchemical Co., Ltd. | 成形性シートおよび内装材料 |
JP2009173808A (ja) * | 2008-01-25 | 2009-08-06 | Nagoya Oil Chem Co Ltd | 親水性フェノール樹脂、それを用いた成形可能材料、それらを用いた成形材および内装材 |
JP2015510558A (ja) * | 2012-02-20 | 2015-04-09 | オートモビリ ランボルギーニ ソチエタ ペル アツイオニ | 炭素繊維布帛を製造するための方法及びこの方法によって製造された布帛 |
Also Published As
Publication number | Publication date |
---|---|
US6794034B2 (en) | 2004-09-21 |
ES2267791T3 (es) | 2007-03-16 |
DE60121553D1 (de) | 2006-08-31 |
US20030088025A1 (en) | 2003-05-08 |
AU2001240264B2 (en) | 2005-06-16 |
EP1264851B1 (en) | 2006-07-19 |
DE60121553T2 (de) | 2007-07-26 |
EP1264851A1 (en) | 2002-12-11 |
EP1264851A4 (en) | 2003-04-16 |
ATE333487T1 (de) | 2006-08-15 |
CA2399736A1 (en) | 2001-08-16 |
JP4573489B2 (ja) | 2010-11-04 |
AU4026401A (en) | 2001-08-20 |
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