WO2000077113A1 - Bande adhesive pour fixer provisoirement une feuille a l'etat vert destinee a une piece electronique ceramique et procede de fabrication de cette piece - Google Patents

Bande adhesive pour fixer provisoirement une feuille a l'etat vert destinee a une piece electronique ceramique et procede de fabrication de cette piece Download PDF

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Publication number
WO2000077113A1
WO2000077113A1 PCT/JP2000/003796 JP0003796W WO0077113A1 WO 2000077113 A1 WO2000077113 A1 WO 2000077113A1 JP 0003796 W JP0003796 W JP 0003796W WO 0077113 A1 WO0077113 A1 WO 0077113A1
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WO
WIPO (PCT)
Prior art keywords
adhesive tape
pressure
sensitive adhesive
adhesive
polymer
Prior art date
Application number
PCT/JP2000/003796
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English (en)
Japanese (ja)
Inventor
Eiji Inoue
Toshiaki Kasazaki
Kiyotaka Nagai
Original Assignee
Nitta Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitta Corporation filed Critical Nitta Corporation
Publication of WO2000077113A1 publication Critical patent/WO2000077113A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Definitions

  • the present invention is particularly applicable to the production of ceramic electronic components such as multilayer ceramic capacitors, multilayer ceramic inductors, resistors, ferrites, sensor elements, thermistors, paris, and piezoelectric ceramics. It relates to a temporary adhesive tape used in the process of cutting a (raw) sheet into multiple chips. Background
  • multilayer ceramic capacitors are manufactured through the following processes.
  • a slurry of ceramic powder is thinly spread with a doctor blade to form a raw ceramic sheet, a plurality of electrodes are printed on the surface of the raw sheet, and then a plurality of these raw sheets are laminated and integrated to form a laminate of raw sheets. Form.
  • the laminate is cut lengthwise and crosswise using a cutting tool such as a dicer or a guillotine blade to form a plurality of ceramic laminate chips. ), And external electrodes are formed on the end surfaces of the obtained chips.
  • the raw sheet is temporarily fixed on a pedestal for fixing the sheet using an adhesive tape, cut, and then the work is mounted on the pedestal. It is necessary to peel off from the adhesive tape on the surface. At the time of peeling, it is necessary to reduce the adhesive force between the work and the adhesive tape. However, if the adhesive force cannot be sufficiently reduced, the following problems occur.
  • the adhesive layer may cause contaminants on the bottom of the chip.
  • blocking occurs and the residue of contaminants is also baked, which causes void cracking due to calcination of organic matter.
  • thermofoamable adhesive layer As disclosed in, for example, Japanese Patent Publication No. 6-79812, an adhesive tape having a thermofoamable adhesive layer has been used.
  • a foaming agent is mixed in the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape, and the laminate is cut and heated to reduce the contact area with the work by the action of the foaming agent.
  • the mold can be easily released from the surface of the mold.
  • the binder in the laminate evaporates when the pressure-sensitive adhesive tape is heated, thereby contaminating the work.
  • the work could not be peeled off from the adhesive tape in some cases because the adhesive strength did not decrease due to uneven foaming. Disclosure of the invention
  • the temporary fixing pressure-sensitive adhesive tape for a raw sheet for ceramic electronic components of the present invention is a temporary fixing pressure-sensitive adhesive tape for a raw sheet for ceramic electronic components in which a pressure-sensitive adhesive layer is provided on one or both surfaces of a base film, wherein the pressure-sensitive adhesive layer is An adhesive composition comprising a pressure sensitive adhesive and from about 1% to about 30% by weight of a side chain crystallizable polymer.
  • a pressure-sensitive adhesive layer is provided on both surfaces of the base film
  • examples of the pressure-sensitive adhesive on the second surface on which the pressure-sensitive adhesive layer is formed include the following.
  • Natural rubber adhesive Synthetic rubber adhesive; Styrene Z-butadiene latex based adhesive; Block copolymer type thermoplastic rubber; Butyl rubber; Polyisobutylene; Acrylic adhesive; Vinyl ether copolymer adhesive composition.
  • the side chain crystallizable polymer is mainly composed of an alkyl acrylate and / or an alkyl methacrylate having a linear alkyl group having 16 or more carbon atoms as a side chain.
  • the adhesive composition has a ceramic electronic part at 35 ° C. or higher.
  • the side chain crystallizable polymer has a melting point that occurs over a temperature range of less than 15 ° C.
  • the adhesive composition has an adhesive strength to a stainless steel sheet when heated to 35 ° C. or higher, which is 10% or less of an adhesive strength to a stainless steel sheet at 23 ° C., or 10 g Z 25 mm or less.
  • the polymer has a weight average molecular weight of 3,000 to 25,000.
  • the method for producing a ceramic electronic component according to the present invention includes a step of adhering a laminate of a raw sheet made of ceramic on a pedestal via an adhesive tape; a step of cutting the laminate to form a chip; Removing the cut chip from the tape surface while the adhesive tape is heated, wherein the adhesive tape is provided on one or both surfaces of the base film.
  • a pressure-sensitive adhesive, and the pressure-sensitive adhesive layer is formed from an adhesive composition containing a pressure-sensitive adhesive and about 1% to about 30% by weight of a side-chain crystallizable polymer;
  • the side chain crystallizable polymer is mainly composed of an alkyl acrylate and / or a methyl methacrylate having a linear alkyl group having 16 or more carbon atoms as a side chain, and is heated to 35 ° C or more.
  • Adhesive strength to Nresu steel sheet is 2 3 1 0% adhesion strength against a stainless steel plate in ° C or below.
  • a laminate obtained by laminating the ceramic raw sheets after electrode printing is fixed on a pedestal via an adhesive tape, and the laminate is cut.
  • the pressure-sensitive adhesive tape has excellent adhesiveness, the laminate does not peel off.
  • the work can be easily peeled off from the adhesive tape by heating the adhesive tape to a predetermined temperature or higher.
  • the adhesive composition constituting the pressure-sensitive adhesive tape contains a pressure-sensitive adhesive, and about 1% to about 30% by weight of the side chain crystallizable polymer based on the adhesive composition.
  • the temperature is slightly changed from By reversibly changing between crystalline and non-crystalline, the adhesion to the chip changes significantly.
  • the adhesive strength of the pressure-sensitive adhesive layer is rapidly reduced, so that the raw sheet for ceramic electronic components is adhered to an adhesive tape, cut and processed, and then the tape is heated.
  • the chip ceramic electronic component
  • the chip can be easily separated from the tape by greatly reducing the adhesiveness to the raw sheet for ceramic electronic components.
  • the raw sheet for ceramic electronic components referred to in the present application is a process for manufacturing ceramic electronic components such as multilayer ceramic capacitors, multilayer ceramic inductors, resistors, ferrites, sensor elements, thermistors, paris, and piezoelectric ceramics. And a laminate of a raw sheet made of ceramic and a raw sheet used in the above.
  • the adhesiveness to the raw sheet for ceramic electronic components can be adjusted only by changing the temperature of the temporary fixing adhesive tape.
  • the work When the work is taken out, it can be easily peeled off only by heating, and since there is no contamination of the work, the reliability of the ceramic electronic component can be improved.
  • Examples of the base film used for the temporary fixing adhesive tape of the present invention include polyethylene, polypropylene, polyester, polyamide, polycarbonate, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ethylene polypropylene.
  • Examples include a single layer of a synthetic resin film such as a copolymer and polypinyl chloride, and a sheet having a thickness of about 5 / m to about 500 / zm, which is composed of a plurality of these layers.
  • corona discharge treatment may be performed.
  • a pressure-sensitive adhesive layer composed of an adhesive composition described below is laminated on at least one surface of the substrate film.
  • the adhesive composition may include a side-chain crystallizable polymer having a melting point that occurs over a temperature range of less than about 15 ° C, and a pressure-sensitive adhesive.
  • the adhesive composition exhibits tackiness to a raw sheet for ceramic electronic parts and other adherends at a temperature T1, and is heated to a temperature T2 which is about 15 ° C or more higher than the temperature T1. Accordingly, the adhesiveness to the raw sheet for ceramic electronic parts and other adherends is greatly reduced.
  • Examples of the pressure-sensitive adhesive contained in the adhesive composition include the following.
  • Natural rubber adhesive Styrene Z-butadiene latex-based adhesive: ABA block copolymer type thermoplastic rubber (A indicates thermoplastic polystyrene end block, B indicates polyisoprene, polybutadiene or poly (ethylene / butylene) Butyl rubber; polyisobutylene; polyacrylate, and acrylic adhesives such as vinyl acetate / acrylic ester copolymers: copolymers of vinyl ethers such as polyvinyl methyl ether, polyvinyl ethyl ether, and polyvinyl isobutyl ether. Polymer.
  • an acrylic pressure-sensitive adhesive has an interaction with the polymer, so that the polymer disperses well at a given temperature and exhibits tackiness, and the polymer is peelable when heated above a given temperature. Is exhibited well.
  • Preferred acryl-based pressure-sensitive adhesives are those comprising ethylhexyl acrylate, hydroxyethyl acrylate, and the like. For example, 80-95 parts by weight of 2-ethylhexyl acrylate and 2— And copolymers of hydroxyethyl acrylate with 5 to 20 parts by weight.
  • the side chain crystallizable polymer contained in the adhesive composition has a temperature of less than about 15 ° C. Those having a melting point that occurs over a range are preferably used.
  • melting point refers to the temperature at which certain equilibrium processes cause a particular portion of a polymer, initially in an ordered arrangement, to become disordered.
  • the melting point of the polymer ranges from about 30 ° C to 100 ° C, more preferably from about 35 ° C to 65 ° C.
  • the melting occurs rapidly, ie in a relatively narrow temperature range of less than about 15 ° C, preferably less than about 10 ° C. It is preferred that the polymer crystallizes rapidly.
  • a seeding agent or crystallization catalyst may be incorporated into the polymer.
  • the heating temperature is usually about 40 ° C. to about 100 ° C., preferably about 40 ° C. to about 70 ° C., and more preferably about 50 ° C. to about 70 ° C. .
  • the side chain crystallizable polymer contained in the adhesive composition has, as constituent components, alkyl acrylate and Z or alkyl methacrylate having a linear alkyl group having 16 or more carbon atoms as a side chain.
  • alkyl acrylate and Z or alkyl methacrylate (hereinafter, also referred to as (meth) acrylate) having a linear alkyl group having 16 or more carbon atoms as a side chain include hexadecyl (meth) acrylate, (Meth) acrylates having a linear alkyl group having 16 to 22 carbon atoms, such as stearyl (meth) acrylate and docosyl (meth) acrylate, are preferably used.
  • (meth) acrylates having a linear alkyl group having 16 to 30 carbon atoms such as triaconyl (meth) acrylate, can also be used.
  • the following monomers can be used instead of or together with the (meth) acrylate having a linear alkyl group having 16 or more carbon atoms as a side chain.
  • acrylates having the straight-chain aliphatic group having 16 or more carbon atoms methacrylates, acrylamide derivatives, and methacrylamide derivatives are preferable. More preferred are acrylates, methacrylates, acrylamide derivatives, and methacrylamide derivatives having a linear aliphatic group having 14 to 22 carbon atoms. Particularly preferred are acrylates and methacrylates having a linear aliphatic group having 14 to 18 carbon atoms.
  • a monomer having the following functional group can be used as a copolymer component.
  • the monomer having such a functional group include acrylic acid, methacrylic acid, itaconic acid, mesaconic acid, citraconic acid, fumaric acid, maleic acid, monoalkyl itaconate, monoalkyl mesaconic acid, At least one selected from the group consisting of monoalkyl traconate, monoalkyl fumarate, monoalkyl maleate, 2-hydroxyethyl acrylate, acrylamide, methacrylamide, and ethyl butylaminoethyl methyl acrylate. One or more may be mentioned.
  • This monomer is used in consideration of the amount of the (meth) acrylate having a straight-chain alkyl group having 16 or more carbon atoms as a side chain. However, it is included in the total amount of all monomers used as a base polymer raw material. It can be contained in the range of 1% by weight to about 30% by weight.
  • the melting points of the side chain crystallizable polymers obtained from monomers having a linear alkyl group having 16 to 30 carbon atoms are shown below.
  • Preferred examples of the polymer contained in the adhesive composition are as follows.
  • the amount of crystallizable polymer in the adhesive composition ranges from about 1% to about 30% by weight. It is preferably from 5% by weight to 20% by weight. In particular, 5% by weight to 15% by weight is preferable.
  • the specific molecular weight of the crystallizable polymer used is an important factor in determining how the adhesive composition used in the present invention exhibits temperature-varying tack and bond strength. . That is, a low molecular weight crystallizable polymer loses its bond strength upon heating. For example, the adhesive strength (peel strength) at room temperature (23 ° C), the rate of decrease in adhesive strength when heated at 60 ° C is 90% or more. See below).
  • the weight average molecular weight of the polymer is preferably from about 3,000 to about 2,500, more preferably from about 4,000 to about 5,000. If the weight average molecular weight of the polymer exceeds about 25,000, the decrease in tackiness by heating is small. If the weight-average molecular weight of the polymer is less than about 3, 000, the change in adhesion with time is large, which is not preferable.
  • a pressure-sensitive adhesive and a crystallizable polymer may be mixed in a compatible solvent, and optional components such as a plasticizer, a filler, a filler, a cross-linking agent and the like may be added. Adjust the solids content to the desired viscosity and blend the mixture until homogeneous. After blending, remove air bubbles from the mixture.
  • crosslinking agent examples include isocyanate-based compounds such as tetramethylene diisocyanate, hexamethylene di-socionate, tolylene disocyanate 3 adduct of trimethylolpropane, polyisocyanate, sorbitol polyglycidyl ether, and polyglycerol poly.
  • Epoxy compounds such as glycidyl ether, pen erythritol polyglycidyl ether, diglycerol polyglycidyl ether, glycerol polyglycidyl ether, neopentyl glycol diglycidyl ether, and resorcin diglycidyl ether; trimethylolpropane triethyl / 3-aziridinyl propionate, tetramethylolmethane] 3-aziridinylpropionate, N, N'-hexamethylene-1,6-bis (1-1 aziridine Ruboxamide), N, N'-toluene-2,4-bis (1-aziridinecarboxamide), N, N'-diphenylmethane-1,4,4'-bis (1-aziridinecarboxamide), trimethylolpropane Tree 3- (2-methylaziridine) aziridine compounds such as propionate, and melamine compounds such as hexameth
  • a knife coat, a roll coat, a calender coat, a comma coat, and the like are often used. Depending on the thickness of the coating and the viscosity of the material, it can be carried out by gravure or overnight.
  • the pressure-sensitive adhesive composition can be applied by transfer from a release sheet in the same manner as in transfer printing. The composition can be applied as such, or with a suitable solvent, or as an emulsion or latex. Thus, a pressure-sensitive adhesive layer is formed from the adhesive composition.
  • the pressure-sensitive adhesive layer is bonded and protected by a separator until the pressure-sensitive adhesive layer is bonded to the surface of the raw sheet for ceramic electronic components.
  • Paper, polypropylene film, polyester film It is formed of a flexible thin leaf made of a plastic film such as an film, metal foil, etc., and is easily surface-treated with a release agent, if necessary, to give easy peelability.
  • a slurry of ceramic powder is spread thinly with a doctor blade to form a raw ceramic sheet, and electrodes are printed on the surface of the raw sheet.
  • a plurality of these green sheets are laminated and integrated to form a green sheet laminate.
  • the laminate is fixed on the pedestal via the adhesive tape of the present invention. Since the temperature at this time is a relatively low temperature (for example, about 20 ° C. to about 40 ° C.), the laminate adheres well to the adhesive layer of the adhesive tape.
  • the laminate is pressed and cut.
  • the work does not peel off from the adhesive layer or transfer onto the uncut raw sheet.
  • the obtained work is taken out from the adhesive tape, and then sent to the preliminary firing step and the final firing step.
  • the work can be easily peeled off from the adhesive tape by heating the adhesive tape to a predetermined temperature or higher as described above. After that, the work is fired, and external electrodes are formed on the end surfaces of the work to obtain a chip-type multilayer ceramic capacitor.
  • a method of heating the adhesive tape a method of heating the tape or the holding member (pedestal) of the tape by, for example, the following method is exemplified.
  • blow hot air for example, hot air blower / dryer
  • oven for example, blow steam
  • hit lamp infrared ray, far infrared ray
  • a raw sheet for ceramic electronic parts is attached to the surface of the adhesive tape at a temperature lower than the melting point of the polymer used, and after cutting, the chip is peeled from the surface of the adhesive tape at a temperature higher than the melting point of the polymer. Is preferred.
  • the peel strength is about 10% or less at a temperature not lower than the melting point of the side chain crystalline polymer.
  • the adhesive strength to the stainless steel sheet is about 10% or less or about 10% of the adhesive strength on the stainless steel sheet at about 23 ° C. g Z 25 mm or less is preferable.
  • a multilayer ceramic capacitor has been described as a ceramic electronic component in the above description, the present invention is not limited to this. It can be applied to temporary fixing adhesive tape used in the process of cutting raw sheets for electronic components into multiple chips. (Example)
  • parts means parts by weight.
  • the polymers obtained in Synthesis Examples 1 and 2 were mixed at a ratio of 5 parts to 100 parts.
  • 0.5 part of Colonel L45 manufactured by Nippon Polyurethane Co.
  • a polyethylene terephthalate (PET) film of about 100 m was added.
  • a temporary adhesive tape with a lock was obtained.
  • the 180-degree peel strength of the adhesive tape was measured with respect to SUS according to JIS C2107. The measurement was performed at 23 ° C and 60 ° C, respectively.
  • Temporary adhesive tape was prepared in the same manner as in Example 1 except that 1.0 part of Coronate L45 was added as a crosslinking agent to 100 parts of the polymer of Synthesis Example 2 to the polymer solution obtained in Example 1. I got The peel strength and the peeled state of the work of the obtained temporary fixing adhesive tape were evaluated in the same manner as in Example 1. Table 1 shows the results.
  • Example 1 Temporarily fixed in the same manner as in Example 1 except that 3.0 parts of Colonet L 45 was added as a crosslinking agent to 100 parts of the polymer of Synthesis Example 2 to the polymer solution obtained in Example 1. An adhesive tape was obtained. The peel strength and the peeled state of the work of the obtained temporary fixing adhesive tape were evaluated in the same manner as in Example 1. Table 1 shows the results.
  • coronate L 45 was added to 100 parts of the polymer obtained in Synthesis Example 2 above. (Manufactured by Nippon Polyurethane Co., Ltd.), and apply it to the corona-treated surface of a 100-m PET film with a roll coater. Release with acrylic adhesive layer (5 O / m thickness) A temporary adhesive tape with a mold sheet was obtained.
  • a mixture of 95 parts of stearyl acrylate and 5 parts of acrylic acid was added to a monomer mixture obtained by changing the number of parts of dodecyl mercaptan (polymerization inhibitor) to 8 parts.
  • Polymerization was carried out by stirring at 0 ° C for 5 hours to obtain polymers having a weight average molecular weight of about 2,000, about 4,000, about 8,000, about 15,000, and about 19,000 (Table 2 are shown as polymers 1 to 5, respectively).
  • the obtained temporary fixing adhesive tape was cut into a strip having a width of 25 ran to obtain a test piece.
  • the adhesive layer of the above test piece was pressure-bonded on a SUS plate whose surface was polished # 280 at 23 ° C by reciprocating four times with a rubber roller (45 band width, load 2 kg). I did.
  • the test piece was allowed to stand for 20 minutes, and the end of the test piece was peeled in the direction of 180 ° at a speed of 300 pixels, and the resistance value at that time was measured as a peel strength at 23 ° C.
  • test piece prepared in the same manner as above was placed on a hot plate previously heated to 60 ° C., and allowed to stand still for 20 minutes, and the end of the test piece was moved in the 180 ° direction at a speed of 30 OmZ. Minutes, the resistance was measured as the peel strength at 60 ° C.
  • Table 2 The results are shown in Table 2.
  • Table 2 shows that if the molecular weight of the side-chain crystalline polymer is too large, the peel strength when heated W
  • the temporarily-adhered adhesive tape obtained in the same manner as in Example 4 was cut out into a strip having a width of 25 mm to obtain a test piece.
  • test piece prepared in the same manner as above was allowed to stand in a constant temperature and humidity room at 23 ° C for 2 months, and the peel strength of the test piece at 23 ° C was measured in the same manner as in Example 4. .
  • Table 3 shows the results.
  • the rate of change after 2 months of aging indicates a ratio of 100 immediately after the trial production.
  • the adhesive has sufficient adhesive strength to prevent chips from scattering and slipping, and when peeling off the workpiece after that, it does not cause interlayer destruction and does not remain as a residue It is possible to provide a method for manufacturing a ceramic electronic component and a pressure-sensitive adhesive tape for temporarily fixing a raw sheet for a ceramic electronic component, which can be reduced.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

L'invention porte sur une bande adhésive permettant de fixer provisoirement des feuilles à l'état vert pour pièces électroniques céramiques et comprenant un film de base et une couche adhésive formée sur un côté ou les deux côtés du film. La couche adhésive comprend une composition adhésive constituée d'un adhésif et de 1 à 30 % en poids d'un polymère possédant des chaînes latérales cristallisables. Ce polymère est obtenu principalement à partir d'un acrylate d'alkyle et/ou d'un méthacrylate d'alkyle, chacun étant doté d'une chaîne latérale alkyle linéaire d'au moins 16 atomes de carbone. La bande adhésive est plus épaisse lorsqu'elle est utilisée pour fixer provisoirement une feuille à l'état vert pour pièces électroniques céramiques, peut facilement être détachée lorsque la pièce est terminée, et ne souille pas cette dernière.
PCT/JP2000/003796 1999-06-10 2000-06-09 Bande adhesive pour fixer provisoirement une feuille a l'etat vert destinee a une piece electronique ceramique et procede de fabrication de cette piece WO2000077113A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16450999A JP4391623B2 (ja) 1999-06-10 1999-06-10 セラミック電子部品用生シートの仮止め粘着テープ及びセラミック電子部品の製造方法
JP11/164509 1999-06-10

Publications (1)

Publication Number Publication Date
WO2000077113A1 true WO2000077113A1 (fr) 2000-12-21

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Country Status (6)

Country Link
JP (1) JP4391623B2 (fr)
KR (1) KR100457652B1 (fr)
CN (1) CN1272396C (fr)
MY (1) MY132153A (fr)
TW (1) TWI265189B (fr)
WO (1) WO2000077113A1 (fr)

Cited By (2)

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WO2005073332A1 (fr) * 2004-01-28 2005-08-11 Lg Chem, Ltd. Composition adhesive decollable
EP2677016A1 (fr) * 2012-06-19 2013-12-25 Samsung Display Co., Ltd. Dispositifs d'affichage et procédés de fabrication de dispositifs d'affichage

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JP2006245353A (ja) * 2005-03-04 2006-09-14 Nitta Ind Corp 固定用粘着テープおよび積層セラミックコンデンサの製造方法
KR100843449B1 (ko) 2006-08-31 2008-07-03 삼성전기주식회사 세라믹 시트 제품 및 그 제조방법
JP5276314B2 (ja) * 2007-12-21 2013-08-28 東京応化工業株式会社 接着剤組成物および接着フィルム
JP5408869B2 (ja) * 2007-12-25 2014-02-05 京セラ株式会社 接着用樹脂組成物及びそれを用いたセラミック基板の製造方法
WO2011001550A1 (fr) * 2009-07-02 2011-01-06 ニッタ株式会社 Bande adhésive fixée à un film fonctionnel, et procédé de transfert de film fonctionnel
JP5639446B2 (ja) * 2010-11-09 2014-12-10 ニッタ株式会社 易剥離性粘着シートおよび易剥離性粘着テープ
WO2014162943A1 (fr) * 2013-04-05 2014-10-09 ニッタ株式会社 Bande adhésive double face pour fixation temporaire et procédé de fixation temporaire d'une pièce à usiner l'utilisant
JP6542562B2 (ja) * 2015-04-03 2019-07-10 ニッタ株式会社 感温性粘着剤
JP2016199725A (ja) * 2015-04-14 2016-12-01 ニッタ株式会社 セラミック電子部品製造用の感温性粘着シートおよびセラミック電子部品の製造方法
JP6789001B2 (ja) * 2016-05-17 2020-11-25 ニッタ株式会社 感温性粘着剤
JP6967908B2 (ja) * 2016-09-09 2021-11-17 ニッタ株式会社 感温性粘着シートおよびこれを用いるウエハの製造方法
JP7319766B2 (ja) * 2018-08-10 2023-08-02 日東電工株式会社 粘着シート
JP7271169B2 (ja) * 2018-12-27 2023-05-11 日東電工株式会社 粘着シート
JP7358272B2 (ja) * 2019-02-21 2023-10-10 マクセル株式会社 粘着テープ及びその使用方法

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KR100457652B1 (ko) 2004-11-18
JP4391623B2 (ja) 2009-12-24
MY132153A (en) 2007-09-28
CN1272396C (zh) 2006-08-30
KR20020034089A (ko) 2002-05-08
CN1355833A (zh) 2002-06-26
TWI265189B (en) 2006-11-01

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