Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
  • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
  • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/02—Contact members
  • H01R13/22—Contacts for co-operating by abutting
  • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
  • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
  • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
  • G01R1/02—General constructional details
  • G01R1/04—Housings; Supporting members; Arrangements of terminals
  • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
  • G01R1/0433—Sockets for IC's or transistors
  • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
  • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
  • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
  • H01R33/765—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket the terminal pins having a non-circular disposition
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S439/00—Electrical connectors
  • Y10S439/931—Conductive coating

Definitions

• the present invention relates to a socket used for inspecting a so-called inner one-side mounting type IC in which bumps are arrayed on the bottom surface of an IC body, and a socket using the socket. It relates to a method for producing Ic.
• a socket configured as shown in Fig. 1 has been used as a socket used when inspecting an Ic of an inner surface mounting type before shipment.
• the socket 1 is provided with a predetermined number of contact terminals 3 arranged in a socket body 2.
• these contact terminals 3 are bent so that a portion located in the socket body 2 is along the stepped bottom surface of the socket body 2, and the tip ends thereof are in contact with the contact portions 3 a.
• the portion protruding outward from the bottom surface of the socket body 2 is a terminal portion 3b.
• a holding member 5 is rotatably attached to the socket body 2 via a hinge 4.
• the IC 6 accommodated in the socket 1 is positioned so that the bump 7 which is an external electrode provided on the bottom surface of the IC body 8 contacts the contact portion 3a of the contact terminal 3 located in the socket body 2.
• IC 6 has an opening on the top side of socket body 2.
• the pressing member 5 a is provided so as to protrude from one side surface of the pressing member 5 that is rotated so as to close.
• the pressing member 5 a is stored in the socket body 2 while being pressed and supported.
• the holding member 5 is rotated so as to close the opening of the socket body 2 as shown in FIG. 1, and when the IC 6 housed in the socket body 2 is pressed and supported, the socket 5
• the IC 6 is locked by a hook member (not shown) provided in the main body 2 and maintains a state in which the IC 6 is pressed and supported.
• the arrangement pitch of the bumps 7 is relatively wide, and as shown in FIG. 1, the ICs 6 arranged in a row on two opposite sides of the bottom surface of the IC body 8 are arranged. It can be used for storage, but a BGA (ball grid 'array) type IC or CSP with a large number of bumps arranged in a matrix on the bottom of the IC body
• An object of the present invention is to provide an IC socket capable of accommodating an IC in which a large number of external electrode bumps are provided in a matrix in an IC body.
• Another object of the present invention is to be able to reliably and electrically connect and accommodate an IC bump having a large number of bumps arranged in a matrix at a narrow pitch and an electrode provided on a socket side. It is to provide a socket for Ic.
• Still another object of the present invention is to provide a socket for Ic having excellent durability and reliability.
• Still another object of the present invention is to provide a semiconductor device having good electrical characteristics capable of reducing the resistance value of a connection conductor electrically connected to an external electrode provided on Ic and reducing inductance. To provide a socket for c.
• Still another object of the present invention is to further reduce the connection resistance value between an external electrode provided on the IC and a contact electrode provided on the socket.
• Still another object of the present invention is to reduce crosstalk between contacts provided in a socket and prevent deterioration of a transmitted signal.
• Still another object of the present invention is to provide a reliable electrical and mechanical connection between an external electrode provided on Ic and a terminal provided on a socket for accommodating the IC, thereby producing a highly reliable Ic. It is an object of the present invention to provide a method for manufacturing an IC.
• Still another object of the present invention is to further reduce the connection resistance value between an external electrode provided on Ic and a contact electrode provided on a socket.
• Still another object of the c the present invention is to provide a method of manufacturing a I c capable of producing IC can reduce cross-talk between the contacts provided in the socket, to prevent degradation of the signal to be transmitted be able to
• An object of the present invention is to provide a method for producing Ic that can produce an IC.
• the socket for IC according to the present invention has a plurality of contact electrodes arranged and formed on one surface at the same pitch as the arrangement pitch of the external electrodes of the IC, and a plurality of contact electrodes respectively connected to the plurality of contact electrodes on the other surface.
• a base for mounting I c having an opening facing the adhesive, and a base provided in the opening, and one end positioned on the contact electrode via an anisotropic conductive adhesive, The other end is composed of a plurality of coil-shaped contacts protruding from the opening, and the contact electrode and the coil-shaped contact facing each other via the anisotropic conductive adhesive are mechanically and electrically connected by the anisotropic conductive adhesive. Connected.
• a plurality of contact electrodes are formed on one surface at the same pitch as the arrangement pitch of the external electrodes of the IC, and are connected to the plurality of contact electrodes on the other surface, respectively.
• a plurality of projecting coil-shaped contacts, and the coil-shaped contacts arranged in the plurality of through-holes are pressed at the other end by an external electrode of Ic, thereby forming a conductive film formed in the through-hole.
• the coil contact Conductive film that is functioning as a connecting conductor between the external electrode and the contact electrode of the IC.
• a plurality of contact electrodes are arranged and formed on one surface with the same pitch as the arrangement pitch of the external electrodes of the IC, and are connected to the plurality of contact electrodes on the other surface, respectively.
• a base for mounting an IC having an opening facing the anisotropic conductive adhesive, and a base provided in the opening, one end of which is provided on the contact electrode via the anisotropic conductive adhesive. It consists of a plurality of coil-shaped contacts, each located at the other end protruding from the opening, and the contact electrode and the coil-shaped contact facing each other via the anisotropic conductive adhesive are mechanically formed by the anisotropic conductive adhesive.
• IC socket that is electrically and electrically connected is used.
• the IC is mounted on the base of the IC socket so that the external electrodes of the IC come into contact with the coil-shaped contacts, and a plurality of terminal electrodes are tested. Electrical characteristics by connecting to the It has a testing process.
• FIG. 1 is a sectional view showing a conventional IC socket.
• FIG. 2 is a cross-sectional view showing an example of a socket preceding an IC socket according to the present invention.
• FIG. 3 is a cross-sectional view showing an assembled state of the IC socket shown in FIG.
• FIG. 4 is a perspective view showing a printed wiring board constituting the above-mentioned IC socket.
• FIG. 5 is a cross-sectional view showing a state where IC is loaded into the IC socket shown in FIG.
• FIG. 6 is an enlarged cross-sectional view showing a contact state between a bump provided on the IC and a coil-shaped contact.
• FIG. 7 is a cross-sectional view showing another example of the socket preceding the socket for IC according to the present invention.
• FIG. 8 is a cross-sectional view showing still another example of the socket preceding the IC socket according to the present invention.
• FIG. 9 is a cross-sectional view showing a state where IC is loaded in the IC socket shown in FIG.
• FIG. 10 is a perspective view showing a state in which a holding plate is attached to a base constituting the IC socket shown in FIG.
• FIG. 11 is a cross-sectional view showing an IC socket according to the present invention.
• Fig. 12 is a sectional view showing the assembled state of the IC socket shown in Fig. 11.
• FIG. 11 is a cross-sectional view showing an IC socket according to the present invention.
• Fig. 12 is a sectional view showing the assembled state of the IC socket shown in Fig. 11.
• FIG. 13 is a perspective view showing a printed wiring board constituting the IC socket according to the present invention.
• FIG. 14 is a cross-sectional view showing a state where IC is loaded into the IC socket shown in FIG.
• FIG. 15 is an enlarged cross-sectional view showing a contact state between the bump provided on the IC and the coil-shaped contact.
• FIG. 16 is a cross-sectional view showing another example of the IC socket according to the present invention.
• FIG. 17 is a cross-sectional view showing an IC socket according to the present invention including an IC pressing plate.
• FIG. 18 is a cross-sectional view showing a state where IC is loaded in the IC socket shown in FIG.
• FIG. 19 is a perspective view showing a state where a holding plate is attached to a base constituting the IC socket shown in FIG.
• FIG. 20 is a cross-sectional view illustrating an IC socket showing an example in which contact portions and terminal portions provided on a printed wiring board are provided at the same pitch.
• FIG. 21 is a cross-sectional view showing a main part of the IC socket shown in FIG.
• FIG. 22 is a cross-sectional view showing another example of the IC socket according to the present invention.
• FIG. 23 is a partial cross-sectional view showing a state where the IC is mounted on the IC socket shown in FIG.
• Figure 24 shows the IC socket mounted on the IC socket shown in Figure 22. It is a fragmentary sectional view showing other examples.
• FIG. 25 is a cross-sectional view showing still another example of the IC socket according to the present invention.
• FIG. 26 is a partial cross-sectional view showing a state where the IC is mounted on the IC socket shown in FIG.
• FIG. 27 is a partial cross-sectional view showing a state in which the conductive film formed on the inner peripheral surface of the through hole in which the coil-shaped contact is provided and the anisotropic conductive adhesive sheet are electrically connected.
• FIG. 28 is a cross-sectional view showing another example of the conductive film formed on the inner peripheral surface of the through hole.
• FIG. 29 is a partial cross-sectional view showing a state in which the conductive film formed on the inner peripheral surface of the through hole in which the coil-shaped contact is provided and the anisotropic conductive adhesive sheet are electrically connected.
• FIG. 30 is a cross-sectional view showing still another example of the IC socket according to the present invention.
• FIG. 31 is a cross-sectional view showing a through-hole portion formed in a printed wiring board constituting the IC socket shown in FIG.
• FIG. 32 is a cross-sectional view showing another example of the through hole formed in the printed wiring board.
• FIG. 33 is a cross-sectional view showing still another example of the through hole formed in the printed wiring board.
• FIG. 34 is a cross-sectional view showing a state where IC is loaded into the IC socket shown in FIG.
• FIG. 35 is a cross-sectional view showing an example in which a conductive film is provided together with a magnetic film on the inner peripheral surface of a through hole formed in a printed wiring board.
• FIG. 36 is a partial cross-sectional view showing a state where IC is mounted on the IC socket according to the present invention using the printed wiring board shown in FIG. 35.
• FIG. 37 is a partial cross-sectional view showing another example of a state where the IC is mounted on the IC socket according to the present invention using the printed wiring board shown in FIG. 35.
• FIG. 38 is a cross-sectional view showing still another example of the IC socket according to the present invention.
• FIG. 39 is a partial cross-sectional view showing a state where the IC is mounted on the IC socket shown in FIG.
• FIG. 40 is a perspective view showing a state where an IC test is performed using the IC socket according to the present invention.
• FIG. 41 is a perspective view showing another example of a state where an IC test is performed using the IC socket according to the present invention.
• BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an IC socket prior to an IC socket according to the present invention will be described.
• This IC socket 24 has a configuration as shown in FIGS. 2 and 3, and has a rectangular printed wiring board 11 as shown in FIG. As shown in FIG. 4, the printed wiring board 11 has a plurality of contact electrodes 12 arranged in a matrix at the center of one surface 11a. The arrangement pitch and the number of these contact electrodes 12 are the bump arrangement pitch and the number of ICs mounted on the socket 24.
• a total of 49 pieces are arranged at a pitch of 5 mm, 7 pieces each in the vertical and horizontal directions.
• the printed wiring board 11 is electrically connected to the contact electrode 12 arranged on the one surface 11a side, as shown in FIGS. 2 and 3.
• a plurality of terminal electrodes 13 are provided. These terminal electrodes 13 are formed by a multilayer print wiring technique. Each of the terminal electrodes 13 has a larger pitch than each of the contact electrodes 12 and is arranged along four sides of the printed wiring board 11. Here, the arrangement pitch of the terminal electrodes 13 is approximately 2.5 mm.
• a through-hole is formed in each terminal electrode 13, and one end of the through-hole is inserted into the through-hole, and the pin terminal 14 is attached. Each of the pin terminals 14 is electrically connected to the terminal electrode 13.
• the socket 24 of this example includes a base 15 formed of a synthetic resin, as shown in FIGS.
• a first concave portion 16 having a rectangular shape for accommodating the printed wiring board 11 is formed on a lower surface in FIGS. 2 and 3.
• the first recess 16 is formed slightly deeper than the thickness of the printed wiring board 11 accommodated therein.
• C At each corner of the first recess 16, a connecting pin 17 projects. It is established.
• a connection hole 18 is formed to pass through the connection pin 17.
• the printed wiring board 11 has the one surface 11 a side on which the contact electrodes 12 are formed facing the base 15 side, and the connection holes 18 are inserted into the connection pins 17. Then, it is positioned and accommodated in the first recess 16.
• the printed wiring board 11 is attached to the base 15 by force-shrinking the tip of each of the connection pins 17 passed through each of the connection holes 18.
• the base 15 is opposite to the surface on which the printed wiring board 11 is to be mounted.
• a second concave portion 19 for accommodating the IC is formed on the upper surface in FIGS. 2 and 3 which is the facing surface.
• a plurality of through holes 21 are formed in the bottom surface of the second concave portion 19 so as to face the respective contact electrodes 12 of the printed wiring board 11 housed and disposed in the first concave portion 16. I have.
• a coil-shaped contact 23 is inserted into a through hole 21 formed in the base 15.
• One end of each of the coiled contacts 23 is located on the contact electrode 12 of the printed wiring board 11 and contacts the contact electrode 12, and the other end of the coiled contact 23 is slightly located in the second recess 19. It is protruding.
• the coil-shaped contact 23 is merely inserted through the through-hole 21.
• one end of the coil-shaped contact 23 is connected to the printed wiring board 11 using a conductive adhesive or solder. It may be fixed to the electrodes 12.
• the socket 24 is attached to the circuit board 25 of the tester for shipping inspection as shown in FIG.
• the bumps 28, which are external electrodes arranged in a matrix, are arranged on the lower surface side of the IC body 27.
• the coiled contacts 23 are compressed by the bumps 28 as shown in Fig. 6 by pressing the upper surface of the IC body 27 with a support arm such as a robot, as shown in Fig. 6. Then, each bump 28 is pressed.
• the socket 24 configured as described above is provided with the through holes 2 of the base 15.
• the coil-shaped contacts 23 arranged in 1 form a contact portion that makes good contact with the narrow pitch IC bumps, and the pitch is converted from each contact portion by the printed wiring board 11 attached to the base 15 Since the derived mounting terminals are configured, a large number of bumps are arranged in a matrix at a narrow pitch in a BGA (ball-grid-array) -type IC and a CSP (chip-size-package) -type IC. It can be easily applied to ICs and inspected.
• BGA ball-grid-array
• CSP chip-size-package
• the pitch of the bumps provided on the IC is standardized and set to a constant value for various ICs.
• the number of bumps and the outer diameter of the IC main body are different depending on the function of the IC, and there are various types. Therefore, it is desirable to use the IC with various versatility even when the bump pitch is common and the number of bumps is different.
• the example shown in FIG. 7 is a socket 32 that can be used with a variety of ICs having different numbers of bumps, and the socket 32 is an IC provided on the base 15.
• the second concave portion 19 for accommodating the adapter is formed large and large enough to accommodate the adapter 31 together with the IC.
• the I C housed in the second recess 19 is positioned by the adapter 31 housed in the second recess 19.
• the number of contact electrodes 12 formed on the printed wiring board 11 used here is equal to or slightly larger than the maximum number of bumps of the IC that can be mounted on the socket 32. It has been. In the example shown here, a total of 100 contact electrodes 12 are provided, 10 in each of the vertical and horizontal directions, and a coiled contact 23 is provided on the base 15 side corresponding to these contact electrodes 12. I have.
• Adapter 31 can accommodate ICs As described above, the IC receiving hole 33 is formed in a frame shape at the center, and the IC is positioned and accommodated in the IC receiving hole 33.
• a plurality of types of adapters 31 having different IC housing holes 33 are prepared for various types of ICs having different external sizes.
• the adapter 31 By selecting the adapter 31 corresponding to the above, it can be used for inspection of various ICs having different external shapes, that is, different bump numbers while keeping the bump pitch common.
• a socket having an IC holding mechanism suitable for, for example, burn-in will be described with reference to FIG.
• the socket 34 shown in FIG. 8 is obtained by providing an IC holding mechanism in the socket having the adapter 31 described above.
• a holding plate 35 is rotatably attached to a base 15.
• the pressing plate 35 is formed using a metal plate, and a pair of mounting portions 36 is formed by bending on both sides at one end.
• the holding plate 35 supports the mounting portion 36 on a support shaft 37 provided on a bearing portion 38 protruding from one end of the base 15.
• the support shaft 37 is supported so as to be rotatable in the directions of arrows A and B in FIG.
• a pair of mounting legs 39 are formed on both sides of the intermediate portion of the holding plate 35 by bending, and the holding member 41 is attached to the mounting leg 3 by the support shaft 42.
• the holding member 41 is formed in a substantially rectangular parallelepiped shape using a synthetic resin, and the center of both sides is substantially supported by a support shaft 42, and is supported rotatably about the support shaft 42.
• a pair of coil springs 43 is interposed between the holding plate 35 and the holding member 41, and the holding member 41 receives the urging force of the coil panel 43 to support the shaft 4.
• the IC main body 27 is housed in the IC housing hole 33 of the adapter 31 and then the holding plate 35 is closed, as shown in FIG. IC 26 is pressed against the bottom surface of second recess 19. In this state, the rotation end side of the holding plate 35 is locked by the locking member 44, so that the IC 26 is mounted and fixed to the socket 34.
• the lock member 44 is formed by bending a bar, and both ends on the base end side are rotatably supported by the base 15 so as to be rotatable.
• the pressing member 41 since the pressing member 41 is rotationally displaced about the support shaft 42, the surface is surely brought into contact with the upper surface of the IC body 27.
• the IC body 27 is pressed by the pressing member 41 onto the bottom surface of the second concave portion 19 with an equal force, so that the bumps 28 provided in a matrix and the coil-shaped contacts 23 are securely connected. A good contact state can be obtained.
• the holding member 41 is evenly spread over a wide surface.
• the coil panel 43 for urging the pressing member 41 to rotate may be omitted.
• This IC socket 64 has a configuration as shown in FIGS. 11 and 12, and has a rectangular printed wiring board 51 as shown in FIG. I have.
• the printed wiring board 51 has a plurality of contact electrodes 52 arranged in a matrix at the center of one surface 51a. Arrangement of these contact electrodes 52 The row pitch and the number are the bump pitch and the number of the ICs mounted on the socket 64. In the example shown in FIG. 13, a total of 49 contact electrodes 52 are arranged at a pitch of 0.5 mm, seven in each of the vertical and horizontal directions.
• the printed wiring board 51 is electrically connected to the contact electrode 52 disposed on the one surface 51 a side, as shown in FIGS. 2 and 3.
• a plurality of terminal electrodes 53 are provided. These terminal electrodes 53 are formed by a multilayer print wiring technique. Each terminal electrode 53 has a larger pitch than each contact electrode 52, and is arranged along four sides of the printed wiring board 51. Here, the arrangement pitch of the terminal electrodes 53 is approximately 2.5 mm. In this example, through-holes are formed in each terminal electrode 53, and pin terminals 54 are attached by inserting one ends into these through-holes. Each pin terminal 54 is electrically connected to a terminal electrode 53.
• an anisotropic conductive material is provided so as to cover a plurality of contact electrodes 58 provided in a matrix.
• An adhesive sheet 55 is placed.
• the anisotropic conductive adhesive sheet 55 is an anisotropic conductive bonding material having a conductive adhesive function when pressed and / or heated, and is made of an epoxy adhesive film in which fine conductive particles are uniformly dispersed. The thickness is about 50 ⁇ m, and conductivity is generated in the pressing direction only when pressed.
• the socket 64 includes a base 56 formed of a synthetic resin.
• the base 56 is attached to the printed circuit board 51 on the lower surface in FIGS.
• a first recess 57 having a rectangular shape for accommodating therein is formed.
• the first recess 57 is formed slightly deeper than the thickness of the printed wiring board 51 housed therein.
• a connecting pin 58 is projected.
• a connection hole 59 is formed in each corner of the printed wiring board 51 so as to be inserted into the connection pin 58.
• the printed wiring board 51 has one surface 51 a on which the contact electrodes 52 are formed facing the base 56 side, and is passed through the respective connecting holes 59 through the respective connecting pins 58 so as to be positioned. Are accommodated in the first recess 57.
• the printed wiring board 51 is attached to the base 56 by caulking the ends of the connection pins 58 passed through the connection holes 59.
• an inclined surface 62 for guiding insertion of the IC positioned and stored in the concave portion 60 is formed on the peripheral surface on the opening end side of the second concave portion 60.
• the contact electrodes 63 are arranged in parallel in the opening 61 formed in the base 15.
• One end of each of the coil-shaped contacts 63 is positioned on each contact electrode 52 of the printed wiring board 51 via an anisotropic conductive adhesive sheet 55, and comes into contact with these contact electrodes 12;
• the other end of the c- coil contact 63 slightly protruding into the second concave portion 60 is, for example, a weight placed on the other end, and anisotropically conductively bonded under pressure from the other end. Heat curing of sheet 5 5
• the sheet is fixed to the anisotropic conductive adhesive sheet 55.
• the coil-shaped contact 33 fixed to the anisotropic conductive adhesive sheet 55 is electrically connected to each contact electrode 52 of the printed wiring board 51 via the anisotropic conductive adhesive sheet 55. . That is, the coil-shaped contact 63 and the contact electrode of the printed wiring board 51 are mechanically and electrically connected via the anisotropic conductive adhesive sheet 55.
• the portion of the anisotropic conductive adhesive sheet 55 that is not sandwiched between the contact electrode 52 and one end of the coil-shaped contact 63 functions as an insulating material.
• the socket 64 is attached to the circuit board 65 of the tester for shipping inspection as shown in FIG.
• the bumps 68 serving as external electrodes arranged in a matrix form on the lower surface side of the IC body 67 correspond to the corresponding coils.
• the upper surface of the IC body 67 is pressed and supported by a support arm such as a robot, so that the coil-shaped contact 63 is compressed by the bump 68 as shown in FIG. Press in contact with each bump 6 8.
• the socket 64 configured as described above is formed by the coil-shaped contacts 63 mounted on the contact electrodes 52 provided on the printed wiring board 51 via the anisotropic conductive adhesive sheet 55.
• the contact parts that make good contact with the narrow-pitch IC bumps are configured, and the printed wiring board 51 that is attached to the base 56 forms the mounting terminal parts that are converted from each contact part and led out. Therefore, it is applied to BGA (ball grid 'array') IC and CSP (chip size 'package') IC where many bumps are arranged in a matrix at a narrow pitch. This IC inspection can be easily performed.
• the socket 72 according to the present invention is different from that of FIG. 16 in that an opening 61 is provided on the bottom surface of the second concave portion 60 in which the IC 66 provided in the base 56 is stored. As shown in FIG. 7, a plurality of through holes 71 may be formed.
• the socket 7 2 has a plurality of through-holes 7 1 with coiled contacts 6 3 inserted therein, and the coiled contacts 6 3 are positioned by the through-holes 7 1, thereby preventing falling down. It has excellent durability and reliability in repeated use.
• the socket 74 shown in FIG. 17 has a coil-shaped contact 63 inserted into a through hole 71 formed in the bottom surface of the second recess 60 in which the IC 66 shown in FIG. 16 is housed. With an IC holding mechanism.
• a holding plate 75 is rotatably attached to a base 56.
• the holding plate 75 is formed using a metal plate, and a pair of mounting portions 76 is formed by bending at both ends on one end side.
• the holding plate 75 supports the mounting portion 76 on a support shaft 77 provided on a bearing portion 78 protruding from one end of the base 56. It is supported so as to be rotatable around the support shaft 77 in the directions of arrows A and B in FIG.
• a pair of mounting legs 79 are formed on both sides of the intermediate portion of the pressing plate 75 by bending, and a pressing member 81 is mounted between the mounting legs 79 by a support shaft 82.
• the holding member 81 is formed in a substantially rectangular parallelepiped shape using a synthetic resin, and the center of both sides is substantially supported by a support shaft 82. It is supported so as to be rotatable around a support shaft 82.
• a pair of coil springs 83 are interposed between the holding plate 75 and the holding member 81, and the holding members 81 receive the biasing force of the coil panel 83 and are reversed with respect to the support shaft 82. It is rotationally displaced in the direction.
• the IC body 67 is housed in the second concave portion 60, and then the holding plate 75 is closed, as shown in FIG. 66 is pressed against the bottom surface of the second concave portion 60. In this state, the IC 66 is mounted and fixed to the socket 74 by locking the rotating end side of the holding plate 75 with the locking member 84.
• the hook member 84 is formed by bending a bar material, and both ends on the base end side are rotatably supported by the base 56.
• the pressing member 81 since the pressing member 81 is rotationally displaced about the support shaft 82, the surface contact surely follows the upper surface of the IC body 67.
• the IC body 67 is pressed by the pressing member 81 onto the bottom surface of the second concave portion 60 with an equal force, so that the bumps 68 provided in a matrix and the coil-shaped contacts 63 are securely connected. A good contact state can be obtained.
• the pressing member 81 presses and supports the upper surface of the IC body 67 evenly on a wide surface, it is possible to reliably prevent the IC 66 from being damaged by uneven pressing.
• the coil spring 83 for biasing the pressing member 81 to rotate may be omitted.
• the arrangement pitch of the terminal electrodes 53 provided on the printed wiring board 51 is enlarged with respect to the arrangement pitch of the contact electrodes 52. 5 3 As shown in FIG. 20, the pitch may be the same as the arrangement pitch of the contact electrodes 52.
• the socket 94 shown here has a plurality of through-holes 85 drilled in the printed wiring board 51, and the through-holes 85 are respectively formed on the peripheral edges of both open ends.
• a contact electrode 52 and a terminal electrode 53 are provided.
• a pin terminal 54 is attached to each through hole 85 with its negative end inserted.
• Each pin terminal 54 is fixed by a solder 86 filled in a through hole 85, and is electrically connected to a contact electrode 52.
• each terminal pin 54 is electrically connected to the terminal electrode 53 by bringing the flange 54 a formed on the base end side into contact with the terminal electrode 53. Done.
• 6 3 is a through hole 7 like the socket 72 shown in FIG.
• the base 56 of the socket 94 shown here is composed of a base body 87 and a guide plate 88, as shown in FIG.
• the anisotropic conductive adhesive sheet 55 is used as the anisotropic conductive bonding material for mechanically and electrically connecting the contact electrode 52 and the coil-shaped contact 63.
• the present invention is not limited to this, and a paste-like anisotropic conductive paint can be used.
• the anisotropic conductive coating is applied on the printed wiring board 51 by printing using, for example, a printing unit.
• This socket 1 48 is connected to the printed circuit board 1 as shown in Figure 22.
• the base 141 which is arranged on the one side 1 2a, is composed of the guide plate 142 and the frame 143, and the printed wiring board 1 21 of the frame 143 is The first concave portion 144 is formed on the surface side on which the guide plate 144 is provided, and the guide plate 142 is disposed in the first concave portion 144.
• a plurality of through holes 1 3 1 are formed in the guide plate 1 4 2 on one surface 1 2 1 a side of the printed wiring board 1 2 1 to face the contact electrodes 1 2 2 provided in a matrix.
• An opening is formed in a portion of the frame 14 3 facing the through hole 13 1 provided in the guide plate 14 2, and the opening is formed on one side of the guide plate 14 2 facing the opening.
• an inclined surface 132 for guiding insertion of the IC accommodated in the second concave portion 129 is formed on the peripheral surface on the opening end side of the second concave portion 129.
• a cover for opening and closing the second concave portion 129 is rotatably attached to the bearing portion 145 provided on one end side of the frame 143. Note that a part of the cover rotated to a position for closing the second recessed portion 129 is engaged with the other end of the frame 144 opposite to the side on which the bearing portion 144 is provided. The cover c provided with the engagement projections 146 is engaged with the engagement projections 146 to be locked at a position for closing the second concave portion 129.
• the base 141 consisting of the guide plate 142 and the frame 1443, and the printed wiring board 121, which are not shown, are fixedly connected using caulking pins or the like.
• each through hole 1 31 that was drilled in the guide plate 1 42 As shown in FIG. 23, a conductive film 147 is formed.
• Each of the through-holes 13 1 in which the conductive film 1 47 is formed is provided with a respective coil-shaped contact point 133.
• One end of the coiled contact 1 3 3 is located on the contact electrode 1 2 2 of the printed wiring board 1 2 1 and contacts the contact electrode 1 2 2, and the other end is on one side of the guide plate 1 4 2 That is, it is slightly protruded from the bottom surface of the second concave portion 129 and is penetrated through the through hole 131.
• the conductive film 147 formed on the inner peripheral surface of the through hole 131 is formed of Cu plating or the like.
• a Ni plating serving as a base is provided on the Cu plating, and an Au plating is further provided. It has a three-layer plating structure.
• the coil-shaped contact 1 is formed by the bumps 13 8 provided on the lower surface side of the IC 13 6. 3 3 is pressed and compressed.
• the coil-shaped contact point 133 is securely brought into contact with the bump 138 by being pressed against the bump 138 by the elastic restoring force when compressed by the bump 138.
• the coil-shaped contact 1 3 3 is deformed so as to be curved in the through-hole 1 3 1, so that the through-hole 1 3
• connection resistance value of the socket which only has the coil-shaped contact through, to about 10: 1, and the inductance is reduced, so that the electrical characteristics of the socket are greatly improved. Can be improved.
• the coil-shaped contact 13 3 when the coil-shaped contact 13 3 is compressed by the bump 13 38, its axis can be compressed without bending in an ideal state, but in reality, the bump 13 8 and the coil-shaped contact 13 Due to factors such as the shape, size, and accuracy of the material, bending occurs during compression.
• conductive film 1 between this case P i and P 2 4 7 will function as the connection conductor.
• the winding pitch of the coil-shaped contacts 133 be relatively dense in order to obtain the curved shape of the coil-shaped contacts 133 and a favorable press-contact state with the conductive film 147 due to the bending.
• the contact electrode 1 2 2 and the coil-shaped contact 1 3 3 are electrically connected by an anisotropic conductive adhesive sheet 15 1. Portions common to the socket 148 shown in FIG. 2 are denoted by the same reference numerals, and detailed description is omitted.
• an anisotropic conductive adhesive sheet 15 1 is interposed between the printed wiring board 12 1 and the guide plate 14 2 of the base 14 1.
• the anisotropic conductive adhesive sheet 15 1 is made of an epoxy adhesive film in which fine conductive particles are uniformly dispersed, and produces good conductivity only in the pressed part in the pressing direction. .
• Anisotropic conductive adhesive The thickness of the plate 151 is preferably, for example, about 50 ⁇ m.
• the contact electrodes 1 2 2 and the coil contacts 1 3 3 have a structure opposed to each other via an anisotropic conductive adhesive sheet 15 1.
• anisotropic conductive adhesive sheet 15 1 By heating and curing the anisotropic conductive adhesive sheet 15 1 under the pressure of 15 1, the opposing contact electrodes 1 2 2 and coil-shaped contacts 1 3 3 become anisotropically conductive.
• the adhesive sheet 15 1 mechanically and electrically collectively connects. Therefore, in this example, there is no danger that each coil-shaped contact 13 3 will fall out of the through hole 13 1, and it will be held in the through hole 13 1.
• the guide plate 142 itself is also adhered to the printed circuit board 121 by the anisotropic conductive adhesive sheet 151.
• the bumps 13 8 provided on the lower surface side of the IC 13 As a result, the coil-shaped contacts 13 3 are pressed and compressed.
• the coil-shaped contact 1333 is securely brought into contact with the bump 1338 by being pressed against the bump 1338 by the elastic restoring force when compressed by the bump 1338.
• the coil-shaped contact 13 3 When the coil-shaped contact 13 3 is compressed by the bump 13 38, it deforms so as to be curved in the through-hole 13 1, so that the through-holes at the P: part and the P 2 part are formed.
• the conductive film 147 formed on the inner peripheral surface of the substrate 131 is partially pressed against the conductive film 147. As a result, the connection resistance at the short circuit caused by the conductive film 1 4 7 between P 2 is reduced.
• FIG. 28 shows the through hole 1 so that the above-mentioned conductive film 147 and the contact electrode 122 are electrically and electrically connected by the anisotropic conductive adhesive sheet 151 so as to be more stable and reliable.
• FIG. 29 shows an example in which an electrode film 1553 is formed on the periphery of the opening end side of the printed wiring board 121 of FIG. 31, and FIG. 29 shows an enlarged view of a part thereof.
• the electrode film 153 is formed by, for example, Cu plating, and is integrated with the conductive film 147.
• the electrode film 154 is also provided on the periphery of the through hole 1331 on the opening end side of the IC 1336 mounting side.
• this socket 249 has a base 241, which is arranged on one side 22a of the printed wiring board 221, and a guide plate 242.
• a first concave portion 24 4 is formed on the surface of the frame 24 3 on which the printed wiring board 22 1 is provided, and the first concave portion 24
• the guide plate 2 42 is arranged so as to be accommodated in 4.
• One side 2 2 1 of the printed wiring board 2 2 1 On the a side, a plurality of through holes 231 facing the respective contact electrodes 2 22 provided in a matrix are formed. An opening is formed in a portion of the frame 2 43 facing the through hole 2 31 provided in the guide plate 2 42, and the opening and one surface of the guide plate 2 42 facing the opening are formed.
• a second concave portion 229 for positioning and storing the IC mounted on the socket 249 is formed.
• An inclined surface 23 32 for guiding insertion of an IC accommodated in the second concave portion 229 is formed on the peripheral surface on the opening end side of the second concave portion 229.
• a cover for opening and closing the second concave portion 229 is rotatably attached to the bearing portion 245 provided on one end side of the frame 243. A part of the cover rotated to a position to close the second concave portion 229 is engaged with the other end of the frame 243 opposite to the side where the bearing portion 245 is provided.
• the c cover provided with the engagement projections 246 is engaged with the engagement projections 246 to be locked at a position where the second recess 229 is closed.
• a magnetic film 247 is formed on the inner peripheral surface of each through-hole 231 formed in the guide plate 242.
• Coiled contacts 2 33 are respectively inserted through the through holes 2 31 in which the magnetic film 2 47 is formed.
• One end of the coil-shaped contact 2 3 3 is located on the contact electrode 2 2 2 of the printed circuit board 2 2 1 and contacts the contact electrode 2 2 2, and the other end is on one side of the guide plate 2 4 2 That is, the through-hole 2 slightly protrudes from the bottom of the second recess 2 29. 3 1 is inserted.
• the magnetic film 247 is formed of, for example, permalloy.
• the magnetic film 247 is formed on the inner peripheral surface of each through hole 231 through, for example, the following steps.
• an underlayer Cu film 248 is formed on the inner peripheral surface of the through hole 231 and the peripheral edge of both opening ends by electroless plating as shown in FIG.
• the permalloy fine powder is paste-coated with a solvent such as a polyhydric alcohol, and the paint is applied to the through hole 31 on one side of the guide plate 242 using a screen mask. Print at the desired position.
• a solvent such as a polyhydric alcohol
• the above-mentioned paint is suctioned from the lower part of the through-hole 231, which faces the other side of the guide plate 24 on which the paint is printed, facing the other side.
• a coating film is formed on the peripheral surface, that is, on the underlying Cu film 248.
• the coating film is baked at a high temperature of, for example, 125 ° C X 3 H (hours), and cured.
• a permanent magnet magnetic film 247 is formed on the underlying Cu film 248.
• the magnetic film 247 is formed after forming the base Cu film 248.
• the base Cu film 248 is omitted, and the direct through-hole 2 is formed.
• the structure may be such that a magnetic film 247 is formed on the inner peripheral surface of 31.
• the magnetic film 247 is slightly inferior in thickness variation and strength as compared with the case where the base Cu film 248 is provided.
• FIG. 33 a structure in which the magnetic film 247 is provided only on the inner peripheral surface of the through hole 231 may be adopted.
• the magnetic film 247 may be formed by, for example, a plating method, in addition to the method described above.
• each coil-shaped contact 2 33 is surrounded by a magnetic film 247 formed on the inner peripheral surface of the through hole 2 31 and is magnetically shielded. Crosstalk is greatly reduced.
• a conductive film 251 is further formed on the magnetic film 247 of each through hole 231. You may do so.
• the conductive film 251 is formed by an electroless plating method or an electric plating method, and is composed of, for example, a three-layer film of an Au film, a Cu layer, a Ni layer, and an Au layer.
• the coil-shaped contact 2 33 is provided in a through hole 2 31 in which the magnetic layer 2 47 and the conductive film 2 51 are formed in a laminated manner.
• the IC 2 36 is positioned in the second recess 2 29 of the IC socket 2 49 in which the conductive film 2 51 is formed together with the magnetic film 2 47 on the inner peripheral surface of the through hole 2 3 1.
• the coil-shaped contact 2 33 is pressed and compressed by the bump 2 38 provided on the lower surface side of the IC 236.
• the coil-shaped contact 2 33 is surely brought into contact with the bump 238 by being pressed against the bump 238 by the elastic restoring force when compressed by the bump 238.
• the coil-shaped contact 2 33 When the coil-shaped contact 2 33 is compressed by the bump 2 3 8, the coil-shaped contact 2 3 3 is deformed so as to be curved in the through-hole 2 3 1, thereby forming the conductive film 2 formed on the inner peripheral surface of the through-hole 2 3 1. Five It is in a state of being partially pressed against 1. At this time, as shown in FIG. 36, the contact positions of the coil-shaped contact 23 3 and the conductive film 25 1 are, for example, three parts, a part, a P 2 part and a P 3 part.
• the P 3 between will be is short-circuited by the conductive film 2 5 1, conductive films 2 5 1 bumps 2 3 8 and the contact point electrode between coiled contact 2 3 3 and the Monico's and P 3 Functions as a connection conductor with 222.
• the connection resistance between the bumps 238 and the contact electrodes 222 is significantly reduced, and the inductance is also reduced, so that the electrical characteristics of the socket can be significantly improved.
• the axis can be compressed without bending in an ideal state, but in reality, the bump 2 3 8, the coil-like contact 2 3 3, etc. Due to factors such as the shape, size, and accuracy of the material, bending occurs during compression. At this time, unlike the state shown in FIG. 3 6, as shown in FIG. 3 7, parts, it is considered that two points of P 2 parts are in contact, the conductive film 2 5 between this case P and P 2 1 will function as the connection conductor. In order to obtain the curved shape of the coil-shaped contacts 2 33 and a favorable press-contact state with the conductive film 25 1 due to the curved shape, it is preferable that the winding pitch of the coiled contacts 2 33 is relatively dense. In the above-described IC sockets 249, the coil-shaped contacts 233 are merely arranged through the through holes 231. The contact point 2 3 3 may fall out of the through hole 2 3 1.
• the printed wiring board 2 21 and the guide plate 2 42 of the base 24 1 are anisotropic to prevent the coiled contacts 2 3 3 from falling off.
• the conductive adhesive sheet 25 3 interposed What is necessary is just to fix to the conductive adhesive sheet 25.
• the anisotropic conductive adhesive sheet 253 is made of, for example, an epoxy adhesive film in which fine conductive particles are uniformly dispersed, and produces good conductivity only in the pressed portion in the pressing direction. is there.
• the thickness of the anisotropic conductive adhesive sheet 253 is preferably, for example, about 50 / im.
• the contact electrode 222 and the coiled contact 233 have a structure opposed to each other via an anisotropic conductive adhesive sheet 253, and as shown in FIG.
• the contact electrode 22 2 and the coil-shaped contact 23 3 are mechanically and electrically connected collectively by the anisotropic conductive adhesive sheet 25 3. Therefore, each coil-shaped contact 2 33 is held in the through hole 2 31, and its falling-off is prevented.
• the guide plate 242 itself is also adhered to the printed wiring board 221 by the anisotropic conductive adhesive sheet 253. At this time, the guide plate 242 is also required.
• the conductive film 25 1 is electrically connected to the opposing contact electrode 22 2 via the anisotropic conductive adhesive sheet 25 3.
• the coiled contacts 2 3 3 are pressed by the bumps 2 3 8 and P! Even when the conductive film 25 1 is pressed against the conductive film 25 1 in the area P 2 and the area P 2 , the conductive pattern 25 1 and the anisotropic conductive adhesive sheet 25 3 As a result, a short circuit occurs and the resistance is further reduced.
• the IC socket according to the present invention configured as described above, for example, the IC socket 64 configured as illustrated in FIG. 11, during the manufacturing process of the IC 66, has an IC socket as illustrated in FIG. 40. Electrical characteristics testing process Used.
• the IC socket 64 according to the present invention equipped with the IC 66 is directly connected to the test board 301 as shown in FIG. At this time, the IC 66 is mounted on the IC socket 64 using the jig 302, and the IC socket 64 on which the IC 66 is mounted is mounted on the receiving member 303 and the test board is mounted. It is electrically connected and mounted on the mounting base 300 of the 301.
• the IC socket 64 according to the present invention can be used for an IC burn-in test as shown in FIG. In this case, too, the bypass board test is performed by connecting the IC socket 64 with the IC 66 attached to the bypass board 311.
• the IC socket according to the present invention having good electrical characteristics is used, and various tests such as electrical characteristics are performed to manufacture highly reliable ICs. It becomes possible.
• INDUSTRIAL APPLICABILITY The IC socket according to the present invention is electrically and mechanically connected using an anisotropic conductive adhesive disposed on a contact electrode provided in a matrix on a printed wiring board.
• the coil-shaped contacts make it possible to form contact parts arranged in a matrix at a narrow pitch, so that ICs in which bumps, which are external connection parts, are provided in a matrix on one surface of the IC body can be reliably and easily formed. Can be installed.

Landscapes

• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Connecting Device With Holders (AREA)
• Testing Of Individual Semiconductor Devices (AREA)

Priority Applications (2)

Applications Claiming Priority (6)

Publications (1)

Family

ID=27277206

Family Applications (1)

Country Status (4)

Cited By (3)

Families Citing this family (30)

Citations (3)

Family Cites Families (7)

• 1998
  • 1998-12-04 KR KR1019997008298A patent/KR100549731B1/ko not_active IP Right Cessation
  • 1998-12-04 WO PCT/JP1998/005504 patent/WO1999037001A1/ja active IP Right Grant
  • 1998-12-04 TW TW087120186A patent/TW408352B/zh active
• 1999
  • 1999-11-05 US US09/380,766 patent/US6174174B1/en not_active Expired - Fee Related

Patent Citations (3)

Also Published As

Similar Documents

Legal Events