US8674979B2 - Driver circuit, display device including the driver circuit, and electronic device including the display device - Google Patents

Driver circuit, display device including the driver circuit, and electronic device including the display device Download PDF

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US8674979B2
US8674979B2 US12/912,059 US91205910A US8674979B2 US 8674979 B2 US8674979 B2 US 8674979B2 US 91205910 A US91205910 A US 91205910A US 8674979 B2 US8674979 B2 US 8674979B2
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transistor
gate
circuit
signal
voltage
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US20110102409A1 (en
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Masahiko Hayakawa
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
    • H01L27/1225—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611—Control of matrices with row and column drivers
    • G09G3/3674—Details of drivers for scan electrodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611—Control of matrices with row and column drivers
    • G09G3/3674—Details of drivers for scan electrodes
    • G09G3/3677—Details of drivers for scan electrodes suitable for active matrices only
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611—Control of matrices with row and column drivers
    • G09G3/3685—Details of drivers for data electrodes
    • G09G3/3688—Details of drivers for data electrodes suitable for active matrices only
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0421—Structural details of the set of electrodes
    • G09G2300/0426—Layout of electrodes and connections
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0421—Structural details of the set of electrodes
    • G09G2300/043—Compensation electrodes or other additional electrodes in matrix displays related to distortions or compensation signals, e.g. for modifying TFT threshold voltage in column driver
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00—Command of the display device
    • G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
    • G09G2310/0264—Details of driving circuits
    • G09G2310/0286—Details of a shift registers arranged for use in a driving circuit
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00—Command of the display device
    • G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
    • G09G2310/0264—Details of driving circuits
    • G09G2310/0289—Details of voltage level shifters arranged for use in a driving circuit
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00—Command of the display device
    • G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
    • G09G2310/0264—Details of driving circuits
    • G09G2310/0291—Details of output amplifiers or buffers arranged for use in a driving circuit
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/02—Details of power systems and of start or stop of display operation
    • G09G2330/021—Power management, e.g. power saving

Definitions

  • the present invention relates to a driver circuit.
  • the present invention also relates to a display device including the driver circuit, and an electronic device including the display device.
  • a technique for forming a driver circuit such as a scan line driver circuit over the same substrate as a pixel portion with the use of a thin film transistor (TFT) whose channel region is formed using an amorphous semiconductor (especially, an oxide semiconductor) has actively developed.
  • a thin film transistor whose channel region is formed using an amorphous semiconductor is often used for a driver circuit formed using only n-channel transistors or p-channel transistors.
  • a structure disclosed in Patent Document 1 is given.
  • the transistor When a thin film transistor whose channel region is formed using an amorphous semiconductor is used for a driver circuit formed using only n-channel transistors or p-channel transistors, the transistor might become a depletion (also referred to as normally-on) transistor due to change in the threshold voltage, or the like. In the case of using the normally-on transistor, there are problems in that an increase in the power consumption and malfunction such as an abnormal output signal are caused by a leakage current from the transistor.
  • the degree of change in the threshold voltage varies among substrates in some cases.
  • circuit design where countermeasures against the case where the transistors become normally-on transistors are taken in advance, there might be a problem in that it is difficult to take countermeasures against the variations. Therefore, it is necessary to employ circuit design of a driver circuit with which an increase in the power consumption and malfunction are not caused regardless of the degree of change in the threshold voltage at which a thin film transistor is normally on.
  • a thin film transistor whose threshold voltage can be controlled
  • an element which includes at least the following four terminals is given: a first gate terminal (referred to as a first gate); a second gate terminal (referred to as a second gate); a drain terminal (also referred to as a drain); and a source terminal (also referred to as a source).
  • a thin film transistor including the four terminals has a channel region between a drain region and a source region, and current can flow between the drain region and the source region through the channel region.
  • the first gate and the second gate are disposed above and below the channel region.
  • a signal (also referred to as a first signal) for controlling switching of conduction and non-conduction of the thin film transistor is supplied to the first gate.
  • a signal (also referred to as a second signal) for controlling the threshold voltage of the thin film transistor is supplied to the second gate.
  • a terminal connected to a wiring for supplying a high power supply potential Vdd is described as a drain terminal and a terminal connected to a wiring for supplying a low power supply potential Vss is described as a source terminal in some cases.
  • the source terminal is referred to as a first terminal and the drain terminal is referred to as a second terminal in this specification.
  • the signals supplied to the first gate and the second gate may be reversed. That is, the first signal may be supplied to the second gate and the second signal may be supplied to the first gate.
  • FIG. 8A is a cross-sectional view illustrating an example of a structure of the thin film transistor including the four terminals.
  • a thin film transistor 900 is formed as follows: a first gate 901 is provided over a substrate 907 ; a gate insulating film 902 is provided over the first gate 901 ; an oxide semiconductor film 903 is provided over the gate insulating film 902 ; a source terminal 904 A and a drain terminal 904 B which are formed using a conductive film are provided to cover part of the oxide semiconductor film 903 ; an insulating layer 905 is provided to cover the oxide semiconductor film 903 , the source terminal 904 A, and the drain terminal 904 B; and a second gate 906 is provided over the insulating layer 905 .
  • FIG. 8B illustrates a circuit symbol of the thin film transistor 900 illustrated in FIG. 8A in which the first gate 901 and the second gate 906 are disposed above and below a channel region.
  • the thin film transistor 900 includes the first gate 901 , the second gate 906 , the source terminal 904 A, and the drain terminal 904 B.
  • a first signal G 1 for controlling switching of conduction and non-conduction between the source terminal 904 A and the drain terminal 904 B is inputted to the first gate 901
  • a second signal G 2 for controlling the threshold voltage of the thin film transistor is inputted to the second gate 906 .
  • the symbol of the thin film transistor 900 illustrated in FIG. 8B represents a thin film transistor which is controlled by four terminals.
  • the first signal G 1 is a signal which performs electric control (switching) between the source terminal 904 A and the drain terminal 904 B.
  • the second signal G 2 is a signal which controls the threshold voltage of the thin film transistor. In an n-channel transistor, the second signal G 2 serves as a signal which changes a depletion (normally-on) transistor into an enhancement (normally-off) transistor by application of a negative voltage. Note that the second signal G 2 is also referred to as a back-gate voltage Vbg below.
  • FIG. 9 is a graph illustrating relations between a drain current Id and a gate voltage Vg of the n-channel thin film transistor illustrated in FIGS. 8A and 8B .
  • a curve 911 in FIG. 9 shows the relation in the case of a depletion transistor. Even when the voltage applied to the first gate by the first signal G 1 is 0 V, the drain current Id flows. In a circuit formed using a plurality of thin film transistors such as a driver circuit, even when the voltage applied to the first gate is 0 V, that is, even when the driver circuit is not driven, flowing current is accumulated, leading to an increase in the power consumption which cannot be ignored.
  • the transistor when a negative voltage is applied to the back gate, the curve 911 is shifted toward the positive side, as shown by a curve 912 in FIG. 9 , so that the transistor can be an enhancement transistor.
  • the enhancement transistor when the voltage applied to the first gate by the first signal G 1 is 0 V, the drain current Id is small; therefore, the power consumption of the driver circuit can be reduced.
  • the curve 911 is shifted toward the positive side, as shown by a curve 913 , by making the back-gate voltage Vbg larger in a negative direction, when the thin film transistor is made conductive by the first signal, it is necessary to apply a higher voltage to the first gate. Accordingly, an increase in the power consumption is caused. Moreover, the driver circuit malfunctions in some cases.
  • FIG. 10 illustrates a bootstrap-type inverter circuit formed using a plurality of n-channel transistors as an example of a circuit included in the driver circuit.
  • the inverter circuit illustrated in FIG. 10 includes a thin film transistor 921 , a thin film transistor 922 , a thin film transistor 923 , a thin film transistor 924 , and a capacitor 925 .
  • a wiring 926 supplies the high power supply potential Vdd and a wiring 927 supplies the low power supply potential Vss.
  • Second gates of the thin film transistors 921 to 924 are connected to a wiring 928 for supplying the back-gate voltage Vbg.
  • An input signal In serving as the first signal is supplied to first gates of the thin film transistors 921 and 923 .
  • An output signal Out is outputted from a node at which the thin film transistor 924 and the thin film transistor 923 are connected to each other.
  • the wiring 926 and the wiring 927 are brought into conduction; thus, a large amount of leakage current flows. Even when the back-gate voltage is applied to each of the thin film transistors so that the transistors becomes enhancement transistors and the leakage current is reduced, depending on the voltage of the input signal In, the thin film transistor 921 and the thin film transistor 923 are not turned on and malfunctions are caused. Further, when the voltage of the input signal In is high, the power consumption is increased.
  • An object of one embodiment of the present invention is, when a thin film transistor whose channel is formed using an amorphous semiconductor is used for a driver circuit formed using only n-channel transistors or p-channel transistors, to provide a driver circuit in which the threshold voltage is compensated in accordance with the degree of change in the threshold voltage at which the transistor becomes a depletion transistor; thus, an increase in the power consumption and malfunctions can be suppressed.
  • One embodiment of the present invention is a driver circuit which includes a unipolar transistor including a first gate and a second gate disposed above and below a semiconductor layer with insulating layers provided therebetween.
  • a first signal for controlling switching of the transistor is inputted to the first gate and a second signal for controlling a threshold voltage of the transistor is inputted to the second gate.
  • the second signal is controlled in accordance with a value of current consumption including a current which flows between a source and a drain of the transistor.
  • a driver circuit described as follows can be provided: the threshold voltage is compensated in accordance with the degree of change in the threshold voltage so that an increase in the power consumption and malfunctions can be suppressed when a thin film transistor that can become a depletion transistor is used for a driver circuit formed using only n-channel transistors or p-channel transistors.
  • a “unipolar circuit” in this specification refers to a circuit including transistor elements which have the same conductivity type. Specifically, the “unipolar circuit” in this specification refers to a circuit including n-channel transistors or a circuit including p-channel transistors.
  • FIG. 1 is a block diagram illustrating an example of a display device
  • FIG. 2 is a flow chart of setting operations based on change in a current value (a voltage value) of a back-gate voltage
  • FIGS. 3A to 3C are diagrams illustrating an example of a circuit included in a shift register circuit
  • FIG. 4 is an example of a timing chart of a shift register
  • FIG. 5 is a cross-sectional view illustrating an example of a display device
  • FIG. 6A is a block diagram illustrating an example of a signal line driver (a source driver) circuit and FIG. 6B is an example of a timing chart thereof;
  • FIGS. 7A to 7C are views each illustrating an example of a display device
  • FIG. 8A is a cross-sectional view illustrating an example of a thin film transistor and FIG. 8B is an example of a circuit symbol thereof;
  • FIG. 9 is a graph illustrating relations between Id-Vg characteristics and a back-gate voltage Vbg of a thin film transistor
  • FIG. 10 is a circuit diagram illustrating a bootstrap type inverter circuit in which unipolar (n-channel) transistors are used.
  • FIG. 11 is a graph illustrating relations between a back-gate voltage and current consumption.
  • N is a natural number
  • FIG. 1 illustrates an example of a driver circuit of a display device.
  • a driver circuit 100 in this embodiment includes a display portion driver circuit 101 and a control circuit 102 .
  • the display portion driver circuit 101 includes a gate line driver circuit 103 A and a signal line driver circuit 103 B, for example.
  • the gate line driver circuit 103 A and the signal line driver circuit 103 B are each a driver circuit which drives a display portion 104 including a plurality of pixels.
  • the gate line driver circuit 103 A, the signal line driver circuit 103 B, and the display portion 104 are formed using thin film transistors which are formed over a substrate 105 .
  • the thin film transistors included in the gate line driver circuit 103 A, the signal line driver circuit 103 B, and the display portion 104 are unipolar transistors, specifically, n-channel thin film transistors.
  • n-channel thin film transistor it is preferable to use a thin film transistor in which an oxide semiconductor is used for a semiconductor layer.
  • An oxide semiconductor is used for a semiconductor layer of a thin film transistor, so that the field effect mobility can be increased as compared with a silicon-based semiconductor material such as amorphous silicon.
  • zinc oxide (ZnO) or tin oxide (SnO 2 ) can be used as the oxide semiconductor, for example.
  • In, Ga, or the like can be added to ZnO.
  • a thin film represented by InMO 3 (ZnO) x (x>0) can be used.
  • M represents one or more metal elements selected from gallium (Ga), iron (Fe), nickel (Ni), manganese (Mn), and cobalt (Co).
  • M might be Ga or might include the above metal element in addition to Ga, for example, M might be Ga and Ni or Ga and Fe.
  • a transitional metal element such as Fe or Ni or an oxide of the transitional metal is contained as an impurity element in addition to the metal element contained as M.
  • an In—Ga—Zn—O-based film can be used for an oxide semiconductor layer.
  • an InMO 3 (ZnO) x (x>0) film in which M is a different metal element may be used instead of the In—Ga—Zn—O-based film.
  • any of the following oxide semiconductors can be used in addition to the above: an In—Sn—Zn—O-based oxide semiconductor; an In—Al—Zn—O-based oxide semiconductor; a Sn—Ga—Zn—O-based oxide semiconductor; an Al—Ga—Zn—O-based oxide semiconductor; a Sn—Al—Zn—O-based oxide semiconductor; an In—Zn—O-based oxide semiconductor; a Sn—Zn—O-based oxide semiconductor; an Al—Zn—O-based oxide semiconductor; an In—O-based oxide semiconductor; a Sn—O-based oxide semiconductor; and a Zn—O-based oxide semiconductor.
  • the gate line driver circuit 103 A and the signal line driver circuit 103 B include unipolar transistors.
  • the unipolar transistor includes the first gate and the second gate.
  • the first gate is disposed below a semiconductor layer with an insulating layer provided therebetween, and the second gate is disposed above the semiconductor layer with an insulating layer provided therebetween, as described in FIG. 8A . Note that the positions of the first gate and the second gate may be reversed.
  • a transistor included in a driver circuit described in this specification is an element including at least four terminals of the first gate, the second gate, the drain, and the source as shown in FIG. 8A , and current can flow between the drain and the source through the channel region.
  • a first signal inputted to the first gate is a signal for controlling switching of the transistor.
  • a second signal inputted to the second gate is a signal for controlling the threshold voltage of the transistor. Note that the second signal is referred to as a back-gate voltage Vbg in some cases.
  • the control circuit 102 supplies a signal for controlling the display portion driver circuit 101 .
  • the display portion driver circuit 101 is driven so as to perform display in the display portion 104 .
  • the control circuit 102 includes a signal generation circuit 106 and a back-gate voltage control circuit 107 .
  • the signal generation circuit 106 outputs signals for performing panel display in the display portion 104 through the display portion driver circuit 101 .
  • the back-gate voltage control circuit 107 controls the threshold voltage of unipolar transistors included in the display portion driver circuit.
  • the signal generation circuit 106 outputs pulse signals for performing panel display in the display portion 104 to the display portion driver circuit 101 via wirings.
  • the pulse signals pass through the gate line driver circuit 103 A and the signal line driver circuit 103 B and outputted to the display portion 104 .
  • the signal generation circuit 106 operates as follows: the high power supply potential Vdd and the low power supply potential Vss, which are power supply voltages, are supplied to the gate line driver circuit 103 A and the signal line driver circuit 103 B: a start pulse SP and a clock signal CK for a gate line driver circuit are generated and outputted to the gate line driver circuit 103 A and/or a start pulse SP and a clock signal CK for a signal line driver circuit are generated and outputted to the signal line driver circuit 103 B.
  • the signal generation circuit 106 may generate another signal such as an image signal or a latch signal.
  • the back-gate voltage control circuit 107 includes a current value detection circuit 108 , a judgment circuit 109 , a correction voltage memory circuit 110 , and a correction voltage output circuit 111 .
  • the current value detection circuit 108 the current value is measured and outputted to the judgment circuit 109 every given period.
  • the measurement in the current value detection circuit 108 is not limited to the current value, and voltage values of both terminals of constant-value resistors which are connected in series in the current value detection circuit 108 may be detected.
  • the structure in which a wiring for supplying power supply potentials (Vdd, Vss) and a wiring for supplying a clock signal and a start pulse are connected to the current value detection circuit 108 is illustrated; however, the structure of the current value detection circuit 108 is not limited thereto. For example, only the wiring for supplying a power supply potential may be provided with the current value detection circuit 108 .
  • the power supply potential is a signal of a direct current, and thus, an increase in the current value due to a leakage current is easily detected, which is preferable.
  • the timing when back-gate voltage setting treatment starts may be after the power of the driver circuit 100 is supplied, or may be every given period while the driver circuit 100 operates.
  • the judgment circuit 109 judges weather the strength X of the current value or the voltage value measured in the current value detection circuit 108 is smaller than the strength A of the reference value set in advance.
  • the strength X is larger than the strength A
  • the current which flows between the source and the drain of the transistor included in the driver circuit is large, the Id-Vg characteristics of a plurality of unipolar transistors included in the driver circuit are normally-on, the current consumption including the current which flows between the source and the drain of the transistor included in the display portion driver circuit 101 is large.
  • the strength X is expressed using the current value or the voltage value in this embodiment, the strength X expressed using another physical value may be compared with the strength A of the reference value.
  • a decrease in current consumption can occur in the case where the switching of the transistor is not performed.
  • the back-gate voltage is made extremely low and applied to the second gate, the current consumption is decreased and the desired pulse wave pattern cannot be obtained.
  • a sufficiently high voltage for example, a voltage at which a transistor becomes surely a depletion transistor, is preferably applied as the initial value of the back-gate voltage when the back-gate voltage setting treatment starts.
  • the initial value of the back-gate voltage in the n-channel transistor is set at a sufficiently high, so that the back-gate voltage can be set at which the operation of the transistor can be more stable even when the normal operation is difficult because the transistor has been an enhancement transistor whose threshold voltage is extremely shifted toward the high potential side.
  • the correction voltage memory circuit 110 is a circuit for setting the back-gate voltage Vbg.
  • the correction voltage memory circuit 110 sets and stores the level of a voltage outputted as the back-gate voltage Vbg from the correction voltage output circuit 111 on the basis of the judgment result of the judgment circuit 109 .
  • the result of the judgment circuit 109 is that the strength X ⁇ the strength A
  • the value in which Vstep which is set in advance is added to the value of Vbg, that is, the value of Vbg ⁇ Vstep
  • the value of Vbg in this setting treatment is stored and the operation of setting treatment of Vbg is finished.
  • the value of the back-gate voltage Vbg stored in the correction voltage memory circuit 110 is outputted from the correction voltage output circuit 111 as the back-gate voltage Vbg.
  • a constant back-gate voltage Vbg is continuously outputted from the correction voltage output circuit 111 on the basis of the value of the back-gate voltage Vbg stored in the correction voltage memory circuit 110 .
  • the correction voltage memory circuit 110 preferably includes a nonvolatile memory device.
  • the back-gate voltage Vbg stored in the correction voltage memory circuit 110 is stored in the nonvolatile memory device; thus, the back-gate voltage Vbg with the same value as that before the power supply is not supplied can be outputted from the collection voltage output circuit 111 . Accordingly, when the power supply of the driver circuit 100 is turned on, the back-gate voltage Vbg can be outputted immediately, without the back-gate voltage setting treatment.
  • the signal generation circuit 106 and the back-gate voltage control circuit 107 be formed using transistors formed over a substrate which is not the substrate over which the gate line driver circuit 103 A, the signal line driver circuit 103 B, and the display portion 104 are formed.
  • transistors formed using a single-crystal semiconductor are preferably used for the signal generation circuit 106 and the back-gate voltage control circuit 107 .
  • the shift of the threshold voltage of a transistor formed using a single-crystal semiconductor is small; thus, malfunctions hardly occur and a stable signal can be outputted.
  • the high power supply potential refers to a signal having a potential which is higher than a reference potential
  • the low power supply potential refers to a signal having a potential which is lower than or equal to the reference potential. It is preferable that the high power supply potential and the low power supply potential be each a potential at which a transistor can operate and deterioration, breakdown, or power consumption does not matter.
  • the reference potential refers to a ground potential GND, or the like.
  • voltage refers to a potential difference between a given potential and a reference potential (e.g., a ground potential) in many cases. Accordingly, voltage, a potential, and a potential difference can be referred to as a potential, voltage, and a voltage difference, respectively.
  • the operation of the back-gate voltage control circuit 107 in the driver circuit illustrated in FIG. 1 will be described with reference to a flow chart illustrated in FIG. 2 . Further, the driver circuit in this embodiment with less power consumption and less malfunctions will be described even in the case where the transistors included in the driver circuit have variations in normally-on state.
  • the power supply voltage is applied to the display portion driver circuit and the back-gate voltage Vbg is applied to the second gate ( FIG. 2 , a step 201 ).
  • the initial value of the back-gate voltage Vbg applied to the second gate may be set in the correction voltage memory circuit 110 illustrated in FIG. 1 in advance.
  • the back-gate voltage Vbg which is stored in the correction voltage memory circuit 110 when the power supply is not supplied may be outputted as it is.
  • the back-gate voltage Vbg is applied from the correction voltage output circuit 111 illustrated in FIG. 1 to the second gate of the transistor included in the driver circuit.
  • the level of the current flowing through a wiring supplied from the signal generation circuit 106 or the level of voltages of both terminals of constant-value resistors which are connected in series is measured ( FIG. 2 , a step 202 ).
  • the transistor is a depletion transistor
  • the current value (or the voltage value) which is detected in the current value detection circuit is large as compared with an enhancement transistor.
  • the judgment circuit 109 illustrated in FIG. 1 it is judged that weather the strength X of the current value or the voltage value is smaller than the strength A of the reference value or not ( FIG. 2 , a step 203 ).
  • the transistor becomes an enhancement transistor by the application of the back-gate voltage Vbg in the step 201 and the strength X of the current value or the voltage value is smaller than the strength A of the reference value, it is judged that the current consumption including the leakage current which flows through the transistor is small; therefore, the value of the back-gate voltage Vbg in this setting treatment is stored in the correction voltage memory circuit 110 .
  • the judgment circuit 109 in the case where the strength X of the current value or the voltage value is larger than or equal to the strength A of the reference value, it is judged that the current consumption including the leakage current which flows through the transistor included in the display portion driver circuit 101 is large. In that case, the value in which Vstep which is set in advance is added to the back-gate voltage, that is, the value of Vbg ⁇ Vstep is set as a new value of Vbg and applied to the second gate ( FIG. 2 , a step 204 ).
  • the level of Vstep for setting the back-gate voltage Vbg is set in accordance with the number of successive operations for setting the back-gate voltage Vbg.
  • the level of the current or the level of the voltage supplied via a wiring from the signal generation circuit 106 is measured ( FIG. 2 , a step 205 ).
  • judgment weather the current value or the voltage value is smaller than the reference value or not is performed ( FIG. 2 , a step 206 ).
  • the transistor becomes an enhancement transistor by the application of the back-gate voltage Vbg in the step 204 and the strength X of the current value or the voltage value is smaller than the strength A of the reference value, it is judged that the current consumption including the leakage current which flows through the transistor is small; therefore, the value of the back-gate voltage Vbg in this setting treatment is stored in the correction voltage memory circuit 110 .
  • an extra voltage (a margin) set in advance be further added to the value of the back-gate voltage Vbg which is judged to be decreased in the current consumption and the value added with the extra voltage be stored in the correction voltage memory circuit 110 .
  • the back-gate voltage Vbg has the margin, even when the TFT characteristics are changed in some degree because of long interval of the back-gate voltage setting treatment, the normal operation can be realized with more certainty.
  • the step is returned to the step 204 shown in FIG. 2 and is followed by the next step.
  • the threshold voltage is compensated in accordance with the degree of change in the threshold voltage, so that an increase in the power consumption or malfunctions can be suppressed.
  • FIGS. 3A to 3C illustrate an example of a structure of a shift register included in the display portion driver circuit.
  • a shift register illustrated in FIG. 3A includes first to N-th pulse output circuits 10 _ 1 to 10 _N (N is a natural number greater than or equal to 3).
  • N is a natural number greater than or equal to 3
  • a first clock signal CK 1 , a second clock signal CK 2 , a third clock signal CK 3 , and a fourth clock signal CK 4 are supplied from a first wiring 11 , a second wiring 12 , a third wiring 13 , and a fourth wiring 14 , respectively.
  • a start pulse SP 1 (a first start pulse) is inputted from a fifth wiring 15 to the first pulse output circuit 10 _ 1 .
  • n-th pulse output circuit 10 — n of the second or subsequent stage a signal from a pulse output circuit of the preceding stage (such a signal is referred to as a preceding-stage signal OUT(n ⁇ 1)) is inputted.
  • a signal from the third pulse output circuit 10 _ 3 of a stage following the next stage is inputted.
  • a signal from the (n+2)th pulse output circuit 10 _(n+2) of the stage following the next stage (such a signal is referred to as a subsequent-stage signal OUT(n+2)) is inputted. Therefore, from the pulse output circuits of the respective stages, first output signals OUT( 1 )(SR) to OUT(N)(SR) to be inputted to the pulse output circuits of the subsequent stages and/or the stages before the preceding stages and second output signals OUT( 1 ) to OUT(N) to be electrically connected to different wirings or the like are outputted.
  • the back-gate voltage Vbg is supplied from the back-gate voltage control circuit 107 via a sixth wiring 16 to the pulse output circuits of the respective stages.
  • a second start pulse SP 2 and a third start pulse SP 3 may be inputted from a seventh wiring 17 and an eighth wiring 18 , respectively, to the corresponding last two stages, for example.
  • signals may be generated inside.
  • a (n+1)th pulse output circuit 10 _(n+1) and a (n+2)th pulse output circuit 10 _(n+2) which do not contribute to output of pulses to a display portion may be provided, and signals corresponding to a second start pulse (SP 2 ) and a third start pulse (SP 3 ) may be generated from the dummy stages.
  • each of the first to fourth clock signals (CK 1 ) to (CK 4 ) is a signal that oscillates between an H-level signal and an L-level signal at regular intervals. Further, the first to fourth clock signals (CK 1 ) to (CK 4 ) are delayed by 1 ⁇ 4 cycle sequentially. In this embodiment, driving of the pulse output circuits is controlled with the first to fourth clock signals (CK 1 ) to (CK 4 ).
  • the clock signal is also referred to as GCK or SCK in some cases depending on a driver circuit to which the clock signal is inputted, and the clock signal is referred to as CK in the following description.
  • each of A and B is an object (e.g., a device, an element, a circuit, a wiring, an electrode, a terminal, a conductive film, or a layer). Accordingly, another element may be interposed between elements having a connection relation illustrated in drawings and texts, without limitation to a predetermined connection relation, for example, the connection relation illustrated in the drawings and the texts.
  • Each of the first to N-th pulse output circuits 10 _ 1 to 10 _N includes a first input terminal 21 , a second input terminal 22 , a third input terminal 23 , a fourth input terminal 24 , a fifth input terminal 25 , a first output terminal 26 , a second output terminal 27 , and a sixth input terminal 28 (see FIG. 3B ).
  • the first input terminal 21 , the second input terminal 22 , and the third input terminal 23 are electrically connected to any of the first to fourth wirings 11 to 14 .
  • the first input terminal 21 is electrically connected to the first wiring 11 ; the second input terminal 22 is electrically connected to the second wiring 12 ; and the third input terminal 23 is electrically connected to the third wiring 13 .
  • the first input terminal 21 is electrically connected to the second wiring 12 ; the second input terminal 22 is electrically connected to the third wiring 13 ; and the third input terminal 23 is electrically connected to the fourth wiring 14 .
  • a start pulse is inputted to the fourth input terminal 24 ; a subsequent-stage signal OUT( 3 ) is inputted to the fifth input terminal 25 ; the first output signal OUT( 1 )(SR) is outputted from the first output terminal 26 ; the second output signal OUT( 1 ) is outputted from the second output terminal 27 ; and the back-gate voltage Vbg is inputted from the sixth input terminal 28 .
  • a first terminal of a first transistor 31 is electrically connected to a wiring 51 .
  • a second terminal of the first transistor 31 is electrically connected to a first terminal of a ninth transistor 39 .
  • a gate electrode of the first transistor 31 is electrically connected to a fourth input terminal 24 .
  • a first terminal of a second transistor 32 is electrically connected to a power supply line 53 .
  • a second terminal of the second transistor 32 is electrically connected to the first terminal of the ninth transistor 39 .
  • a gate electrode of the second transistor 32 is electrically connected to a gate electrode of a fourth transistor 34 .
  • a first terminal of a third transistor 33 is electrically connected to a first input terminal 21 .
  • a second terminal of the third transistor 33 is electrically connected to a first output terminal 26 .
  • a first terminal of the fourth transistor 34 is electrically connected to the power supply line 53 .
  • a second terminal of the fourth transistor 34 is electrically connected to the first output terminal 26 .
  • a first terminal of a fifth transistor 35 is electrically connected to the power supply line 53 .
  • a second terminal of the fifth transistor 35 is electrically connected to the gate electrode of the second transistor 32 and the gate electrode of the fourth transistor 34 .
  • a gate electrode of the fifth transistor 35 is electrically connected to the fourth input terminal 24 .
  • a first terminal of a sixth transistor 36 is electrically connected to the wiring 51 .
  • a second terminal of the sixth transistor 36 is electrically connected to the gate electrode of the second transistor 32 and the gate electrode of the fourth transistor 34 , and gate electrode of the sixth transistor 36 is electrically connected to the fifth input terminal 25 .
  • a first terminal of a seventh transistor 37 is electrically connected to the wiring 51 .
  • a second terminal of the seventh transistor 37 is electrically connected to a second terminal of an eighth transistor 38 .
  • a gate electrode of the seventh transistor 37 is electrically connected to the third input terminal 23 .
  • a first terminal of the eighth transistor 38 is electrically connected to the gate electrode of the second transistor 32 and the gate electrode of the fourth transistor 34 .
  • a gate electrode of the eighth transistor 38 is electrically connected to the second input terminal 22 .
  • the first terminal of the ninth transistor 39 is electrically connected to the second terminal of the first transistor 31 and the second terminal of the second transistor 32 .
  • a second terminal of the ninth transistor 39 is electrically connected to a gate electrode of the third transistor 33 and a gate electrode of a tenth transistor 40 .
  • a gate electrode of the ninth transistor 39 is electrically connected to the wiring 51 .
  • a first terminal of the tenth transistor 40 is electrically connected to the first input terminal 21 .
  • a second terminal of the tenth transistor 40 is electrically connected to the second output terminal 27 .
  • the gate electrode of the tenth transistor 40 is electrically connected to the second terminal of the ninth transistor 39 .
  • a first terminal of an eleventh transistor 41 is electrically connected to the power supply line 53 .
  • a second terminal of the eleventh transistor 41 is electrically connected to the second output terminal 27 .
  • a gate electrode of the eleventh transistor 41 is electrically connected to the gate electrode of the second transistor 32 and the gate electrode of the fourth transistor 34 .
  • Second gates of the first to eleventh transistors 31 to 41 are electrically connected to a wiring 52 for supplying the back-gate voltage Vbg.
  • a connection point of the gate electrode of the third transistor 33 , the gate electrode of the tenth transistor 40 , and the second terminal of the ninth transistor 39 is referred to as a node NA.
  • a connection point of the gate electrode of the second transistor 32 , the gate electrode of the fourth transistor 34 , the second terminal of the fifth transistor 35 , the second terminal of the sixth transistor 36 , the first terminal of the eighth transistor 38 , and the gate electrode of the eleventh transistor 41 is referred to as a node NB.
  • the pulse output circuit in FIG. 3C is the first pulse output circuit 10 _ 1
  • the first clock signal CK 1 is inputted to the first input terminal 21
  • the second clock signal CK 2 is inputted to the second input terminal 22
  • the third clock signal CK 3 is inputted to the third input terminal 23
  • the start pulse SP is inputted to the fourth input terminal 24
  • the subsequent-stage signal OUT( 3 ) is inputted to the fifth input terminal 25
  • the first output signal OUT( 1 )(SR) is outputted from the first output terminal 26
  • the second output signal OUT( 1 ) is outputted from the second output terminal 27
  • a judgment signal JS is inputted to the sixth input terminal 28 .
  • FIG. 4 illustrates a timing chart of a shift register including a plurality of pulse output circuits illustrated in FIG. 3C . Note that when the shift register is included in a scan line driver circuit, a period 61 in FIG. 4 corresponds to a vertical retrace period and a period 62 in FIG. 4 corresponds to a gate selection period.
  • the transistor included in the driver circuit is a depletion transistor
  • the wiring 51 and the wiring 53 are brought into conduction, leading to a leakage current.
  • the power consumption due to such a leakage current can be reduced by application of the back-gate voltage Vbg.
  • the thin film transistor can be an enhancement transistor which does not interrupt the operation of the driver circuit, without being an enhancement transistor whose threshold voltage is extremely shifted toward the high potential side.
  • the threshold voltage is compensated in accordance with the degree of change in the threshold voltage, so that an increase in the power consumption or malfunctions can be suppressed.
  • the driver circuit described in the above embodiment and a cross-sectional view of a display device including a display portion controlled by the driver circuit will be described with reference to FIG. 5 .
  • an example of a liquid crystal display device will be described as the display device; however, the present invention can be used for another display device including a light-emitting element such as an organic EL element or a driver circuit for an electronic paper including an electrophoretic element.
  • the structure described in the above embodiment can be applied to a different device such as a driver circuit for an optical sensor, in addition to the driver circuit of the display device.
  • FIG. 5 A liquid crystal display device which is one embodiment of the present invention is illustrated in FIG. 5 .
  • a substrate 706 which is provided with a pixel portion including a thin film transistor 701 and a capacitor 702 , a driver circuit portion including a thin film transistor 703 , a pixel electrode layer 704 , and an insulating layer 705 serving as an alignment film, and a counter substrate 710 which is provided with an insulating layer 707 serving as an alignment film, a counter electrode layer 708 , and a coloring layer 709 serving as a color filter face each other with a liquid crystal layer 711 positioned between the substrates.
  • the substrate 706 is provided with a polarizing plate (a layer including a polarizer, also simply referred to as a polarizer) 712 a on a side opposite to the liquid crystal layer 711
  • the counter substrate 710 is provided with a polarizing plate 712 b on a side opposite to the liquid crystal layer 711 .
  • a first terminal 713 , a connection electrode 714 , and a terminal electrode 715 for connection are provided in a terminal portion for a gate wiring, and a second terminal 716 and a terminal electrode 717 for connection are provided in a terminal portion for a source wiring.
  • a semiconductor layer 723 is provided over a gate electrode layer 721 and a gate insulating layer 722 , an oxide insulating layer 724 is provided over the semiconductor layer 723 , and a conductive layer 718 is provided over the oxide semiconductor layer 724 .
  • a drain electrode layer 719 b is electrically connected to a conductive layer 720 which is formed in the same step as the gate electrode layer 721 .
  • a drain electrode layer of the thin film transistor 701 is electrically connected to the pixel electrode layer 704 .
  • the use of an oxide semiconductor for a thin film transistor leads to reduction in manufacturing cost.
  • the thin film transistor formed using an oxide semiconductor has high field-effect mobility and is favorably used in a pixel portion and a driver circuit of a display device.
  • an oxide semiconductor tends to have n-type conductivity due to a defect of void by lack of oxygen even when an extrinsic impurity is not added.
  • an oxide insulating film is formed in contact with an oxide semiconductor layer, a thin film transistor with stable electrical characteristics can be obtained.
  • the threshold voltage is compensated in accordance with the degree of change in the threshold voltage; thus, an increase in the power consumption and malfunctions can be suppressed.
  • the thin film transistor that can become the depletion transistor included in the driver circuit has the first gate and the second gate. Therefore, for example, the structure described in Embodiment 1 can be used for a normally-on thin film transistor when a semiconductor layer of the thin film transistor formed using amorphous silicon intentionally or unintentionally contains an impurity imparting n-type conductivity.
  • the driver circuit whose structure is the same or substantially the same as that in Embodiment 1, when a thin film transistor that can become a depletion transistor is used for a driver circuit formed using only n-channel transistors or p-channel transistors in the display portion driver circuit, the threshold voltage is compensated in accordance with the degree of change in the threshold voltage, so that an increase in the power consumption or malfunctions can be suppressed.
  • driver circuits and a thin film transistor provided in a pixel portion are formed over the same substrate.
  • the thin film transistor formed over the substrate may be formed as illustrated in the cross-sectional view in Embodiment 2.
  • the signal line driver circuit includes a shift register 5601 and a switching circuit 5602 .
  • the switching circuit 5602 includes a plurality of switching circuits 5602 _ 1 to 5602 _N (N is a natural number).
  • the switching circuits 5602 _ 1 to 5602 _N each include a plurality of thin film transistors 5603 _ 1 to 5603 — k (k is a natural number). An example where the thin film transistors 5603 _ 1 to 5603 — k are n-channel TFTs is described below.
  • a connection relation in the signal line driver circuit is described using the switching circuit 5602 _ 1 as an example.
  • First terminals of the thin film transistors 5603 _ 1 to 5603 — k are connected to wirings 5604 _ 1 to 5604 — k , respectively.
  • Second terminals of the thin film transistors 5603 _ 1 to 5603 — k are connected to signal lines S 1 to Sk, respectively.
  • Gates of the thin film transistors 5603 _ 1 to 5603 — k are connected to a wiring 5605 _ 1 .
  • the shift register 5601 has a function of sequentially selecting the switching circuits 5602 _ 1 to 5602 _N by sequentially outputting H-level signals (also referred to as H signals or signals at high power supply potential levels) to the wiring 5605 _ 1 and wirings 5605 _ 2 to 5605 _N.
  • H-level signals also referred to as H signals or signals at high power supply potential levels
  • the switching circuit 5602 _ 1 has a function of controlling a conduction state between the wirings 5604 _ 1 to 5604 — k and the signal lines S 1 to Sk (electrical continuity between the first terminal and the second terminal), that is, a function of controlling whether potentials of the wiring 5604 _ 1 to 5604 — k are supplied to the signal lines S 1 to Sk. In this manner, the switching circuit 5602 _ 1 functions as a selector.
  • the thin film transistors 5603 _ 1 to 5603 — k have functions of controlling conduction states between the wirings 5604 _ 1 to 5604 — k and the signal lines S 1 to Sk, respectively, that is, functions of supplying potentials of the wirings 5604 _ 1 to 5604 — k to the signal lines S 1 to Sk, respectively.
  • each of the thin film transistors 5603 _ 1 to 5603 — k functions as a switch.
  • the video signal data (DATA) is inputted to each of the wirings 5604 _ 1 to 5604 — k .
  • the video signal data (DATA) is an analog signal corresponding to image data or an image signal, in many cases.
  • FIG. 6B illustrates examples of signals Sout_ 1 to Sout_N and signals Vdata_ 1 to Vdata_k.
  • the signals Sout_ 1 to Sout_N are examples of signals outputted from the shift register 5601 .
  • the signals Vdata_ 1 to Vdata_k are examples of signals input to the wirings 5604 _ 1 to 5604 — k .
  • one operation period of the signal line driver circuit corresponds to one gate selection period in a display device. For example, one gate selection period is divided into periods T 1 to TN. Each of the periods T 1 to TN is a period during which the video signal data (DATA) is written to a pixel in a selected row.
  • DATA video signal data
  • the shift register 5601 sequentially outputs H-level signals to the wirings 5605 _ 1 to 5605 _N. For example, in the period T 1 , the shift register 5601 outputs an H-level signal to the wiring 5605 _ 1 . Then, the thin film transistors 5603 _ 1 to 5603 — k are turned on, so that the wirings 5604 _ 1 to 5604 — k and the signal lines S 1 to Sk are brought into conduction. At this time, Data (S 1 ) to Data (Sk) are inputted to the wirings 5604 _ 1 to 5604 — k , respectively.
  • the Data (S 1 ) to Data (Sk) are written to pixels in first to k-th columns in a selected row through the thin film transistors 5603 _ 1 to 5603 — k , respectively. In this manner, in the periods T 1 to TN, the video signal data (DATA) is sequentially written to the pixels in the selected row by k columns.
  • the number of video signal data (DATA) or the number of wirings can be reduced.
  • the number of connections with an external circuit can be reduced.
  • writing time can be extended when video signals are written to pixels by a plurality of columns; thus, insufficient writing of video signals can be prevented.
  • the scan line driver circuit may include a shift register, a buffer, or the like. Additionally, the scan line driver circuit may include a level shifter in some cases.
  • CLK clock signal
  • SP start pulse signal
  • a selection signal is generated. The selection signal generated is buffered and amplified in the buffer, and the resulting signal is supplied to a corresponding scan line.
  • Gate electrodes of transistors in pixels of one line are connected to the scan line. Since the transistors in the pixels of one line have to be turned on all at once, a buffer which can supply a large amount of current is used.
  • control circuit described in the above embodiment is employed in the driver circuit in this embodiment, so that the threshold voltage is compensated in accordance with the degree of change in the threshold voltage. Accordingly, an increase in the power consumption or malfunctions can be suppressed.
  • the content (or part of the content) described in each drawing in the above embodiment can be applied to a variety of electronic devices. Specifically, it can be applied to display portions of electronic devices.
  • electronic devices there are cameras such as video cameras and digital cameras, goggle-type displays, navigation systems, audio reproducing devices (e.g., car audio equipment or audio component sets), computers, game machines, portable information terminals (e.g., mobile computers, mobile phones, portable game machines, or e-book readers), image reproducing devices provided with recording media (specifically devices which reproduce the content of recording media such as digital versatile discs (DVDs) and have displays for displaying the reproduced images), and the like.
  • cameras such as video cameras and digital cameras, goggle-type displays, navigation systems, audio reproducing devices (e.g., car audio equipment or audio component sets), computers, game machines, portable information terminals (e.g., mobile computers, mobile phones, portable game machines, or e-book readers), image reproducing devices provided with recording media (specifically devices which reproduce the content of recording media such as
  • FIG. 7A illustrates a display, which include a housing 1011 , a support 1012 , and a display portion 1013 .
  • the display illustrated in FIG. 7A has a function of displaying a variety kinds of information (e.g., still images, moving images, and text images) on the display portion. Note that the display illustrated in FIG. 7A is not limited to having this function.
  • the display illustrated in FIG. 7A can have a variety of functions.
  • FIG. 7B illustrates a camera, which includes a main body 1031 , a display portion 1032 , an image reception portion 1033 , operation keys 1034 , an external connection port 1035 , and a shutter button 1036 .
  • the camera illustrated in FIG. 7B has a function of taking still images and may have a function of taking moving images. Note that the camera illustrated in FIG. 7B is not limited to having these functions.
  • the camera illustrated in FIG. 7B can have a variety of functions.
  • FIG. 7C illustrates a computer, which includes a main body 1051 , a housing 1052 , a display portion 1053 , a keyboard 1054 , an external connection port 1055 , and a pointing device 1056 .
  • the computer illustrated in FIG. 7C has a function of displaying a variety kinds of information (e.g., still images, moving images, and text images) on the display portion. Note that the computer illustrated in FIG. 7C is not limited to having this function.
  • the computer illustrated in FIG. 7C can have a variety of functions.
  • the display device described in the above embodiment is used in the display portion in this embodiment, so that the threshold voltage is compensated in accordance with the degree of change in the threshold voltage. Accordingly, an increase in the power consumption or malfunctions can be suppressed, which leads to an electronic device with less power consumption and higher display quality.
  • FIG. 11 is a graph in which the horizontal axis represents the back-gate voltage Vbg which applied to the second gate in the wiring connected to the driver circuit, and the vertical axis represents the current consumption in the wirings for supplying the high power supply potential Vdd and the low power supply potential Vss.
  • the rhombuses represent the current consumption (hereinafter referred to as Isvdd) in the wiring for supplying the high power supply potential
  • the triangles represent the current consumption (hereinafter referred to as Isvss) in the wiring for supplying the low power supply potential.
  • the structure of the driver circuit which supplies the high power supply potential Vdd and the low power supply potential Vss in FIG. 11 corresponds to the structure of the driver circuit illustrated in FIGS. 3A to 3C .
  • the current consumption is decreased as the back-gate voltage Vbg is shifted toward the minus side smaller than 0 V.
  • the Isvdd and the Isvss are greatly decreased in the range of from ⁇ 3.5 V to ⁇ 2.0 V in FIG. 11 .
  • the threshold voltage of the transistor included in the driver circuit is shifted and the depletion transistor is changed into the enhancement transistor, so that the current consumption is decreased.
  • the transistor was changed into the enhancement transistor the leakage current was decreased.
  • the driver circuit operated normally in the range of from ⁇ 7.0 V to ⁇ 3.5 V (preferably ⁇ 6.0 V to ⁇ 4.0 V: the range denoted by an arrow 1101 in FIG. 11 ).
  • the strength of the reference value A is set in advance at 1.5 mA when the Isvdd is used, and set at 4.0 mA when the Isvss is used.
  • the back-gate voltage Vbg is ⁇ 3.5 V
  • the strength X of the current value is smaller than the strength A of the reference value; thus, the back-gate voltage Vbg can be set at ⁇ 3.5 V.
  • the back-gate voltage when the application value of the back-gate voltage is smaller than or equal to ⁇ 7.0 V, the current consumption is further decreased. The decrease in the current consumption is caused by the transistor in which switching cannot be performed.
  • the waveform of pulse output of the driver circuit was checked, the desired pulse waveform was not obtained in the case where the application value of the back-gate voltage is smaller than or equal to ⁇ 7.0 V. Accordingly, when the back-gate voltage is set, it is preferable to apply a high voltage in advance, for example, 0 V in the case of FIG. 11 , as an initial value of the back-gate voltage.

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9478187B2 (en) 2013-04-04 2016-10-25 Semiconductor Energy Laboratory Co., Ltd. Pulse generation circuit and semiconductor device
US9548133B2 (en) 2011-09-28 2017-01-17 Semiconductor Energy Laboratory Co., Ltd. Shift register circuit
US9812466B2 (en) 2014-08-08 2017-11-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10176778B2 (en) 2016-01-04 2019-01-08 Samsung Display Co., Ltd. Display device
US10553690B2 (en) 2015-08-04 2020-02-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US11257722B2 (en) 2017-07-31 2022-02-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having oxide containing gallium indium and zinc
US11355645B2 (en) 2012-04-13 2022-06-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising stacked oxide semiconductor layers
US20230238959A1 (en) * 2018-04-20 2023-07-27 Texas Instruments Incorporated Stress reduction on stacked transistor circuits

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011033909A1 (en) 2009-09-16 2011-03-24 Semiconductor Energy Laboratory Co., Ltd. Driver circuit, display device including the driver circuit, and electronic device including the display device
CN106298794B (zh) 2010-08-27 2019-07-30 株式会社半导体能源研究所 存储器件及半导体器件
US9024317B2 (en) 2010-12-24 2015-05-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor circuit, method for driving the same, storage device, register circuit, display device, and electronic device
JP5933897B2 (ja) 2011-03-18 2016-06-15 株式会社半導体エネルギー研究所 半導体装置
US8891285B2 (en) 2011-06-10 2014-11-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
US8718224B2 (en) * 2011-08-05 2014-05-06 Semiconductor Energy Laboratory Co., Ltd. Pulse signal output circuit and shift register
TWI761910B (zh) * 2011-08-29 2022-04-21 日商半導體能源研究所股份有限公司 半導體裝置
US8988152B2 (en) * 2012-02-29 2015-03-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
DE102013207324A1 (de) * 2012-05-11 2013-11-14 Semiconductor Energy Laboratory Co., Ltd. Halbleitervorrichtung und elektronisches Gerät
US9742378B2 (en) * 2012-06-29 2017-08-22 Semiconductor Energy Laboratory Co., Ltd. Pulse output circuit and semiconductor device
TWI600022B (zh) 2012-07-20 2017-09-21 半導體能源研究所股份有限公司 脈衝輸出電路、顯示裝置、及電子裝置
KR102013158B1 (ko) * 2012-08-22 2019-08-23 삼성디스플레이 주식회사 게이트 구동회로 및 이를 포함하는 표시장치
US8947158B2 (en) * 2012-09-03 2015-02-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US9397649B2 (en) 2012-09-11 2016-07-19 Sharp Kabushiki Kaisha Semiconductor device and display device
CN104620211A (zh) * 2012-09-14 2015-05-13 夏普株式会社 触摸面板和触摸面板一体型的显示装置
KR101441958B1 (ko) * 2012-09-28 2014-09-18 엘지디스플레이 주식회사 박막트랜지스터 보상회로를 포함하는 액정표시장치
CN102968229A (zh) * 2012-11-07 2013-03-13 江苏美琪威电子科技有限公司 电容式触摸屏感应器的充电电流补偿方法及系统
WO2014141800A1 (ja) * 2013-03-12 2014-09-18 シャープ株式会社 シフトレジスタ回路、駆動回路、及び表示装置
WO2014174889A1 (ja) * 2013-04-25 2014-10-30 シャープ株式会社 表示装置及びその駆動方法
US20140374744A1 (en) * 2013-06-19 2014-12-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6406926B2 (ja) 2013-09-04 2018-10-17 株式会社半導体エネルギー研究所 半導体装置
US9455349B2 (en) * 2013-10-22 2016-09-27 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor thin film transistor with reduced impurity diffusion
US9136864B1 (en) * 2014-02-26 2015-09-15 Maxim Integrated Products, Inc. Method for trimming segment currents in current steering DAC based on most back gate voltage modulation
JP2015169811A (ja) * 2014-03-07 2015-09-28 株式会社Ｊｏｌｅｄ 表示装置、及び、表示装置を備えた電子機器
WO2015136413A1 (en) 2014-03-12 2015-09-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2015186832A1 (ja) * 2014-06-06 2015-12-10 シャープ株式会社 アクティブマトリクス基板及び表示パネル
KR102281755B1 (ko) * 2014-09-16 2021-07-27 삼성디스플레이 주식회사 유기전계발광 표시장치
KR102278875B1 (ko) * 2015-01-14 2021-07-20 삼성디스플레이 주식회사 게이트 구동회로 및 이를 포함하는 표시장치
KR102431311B1 (ko) 2015-01-15 2022-08-12 티씨엘 차이나 스타 옵토일렉트로닉스 테크놀로지 컴퍼니 리미티드 표시 장치
KR102244015B1 (ko) * 2015-01-29 2021-04-27 삼성디스플레이 주식회사 게이트 구동회로를 포함하는 표시 장치
KR102457156B1 (ko) * 2015-09-09 2022-10-24 삼성디스플레이 주식회사 게이트 구동회로를 포함하는 표시 장치 및 그것의 구동 방법
US10297331B2 (en) * 2015-10-30 2019-05-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US10177142B2 (en) * 2015-12-25 2019-01-08 Semiconductor Energy Laboratory Co., Ltd. Circuit, logic circuit, processor, electronic component, and electronic device
SG10201701689UA (en) 2016-03-18 2017-10-30 Semiconductor Energy Lab Semiconductor device, semiconductor wafer, and electronic device
US10810962B2 (en) 2016-07-20 2020-10-20 Mitsubishi Electric Corporation Shift register circuit and display panel
CN106683631B (zh) * 2016-12-30 2018-06-22 深圳市华星光电技术有限公司 一种igzo薄膜晶体管的goa电路及显示装置
US10504470B2 (en) 2017-02-07 2019-12-10 Semiconductor Energy Laboratory Co., Ltd. Driving method of display device
KR102527817B1 (ko) * 2018-04-02 2023-05-04 삼성디스플레이 주식회사 표시 장치
WO2020062230A1 (zh) * 2018-09-30 2020-04-02 深圳市柔宇科技有限公司 阵列基板栅极驱动电路、薄膜晶体管及显示装置
JP2022078757A (ja) * 2020-11-13 2022-05-25 株式会社ジャパンディスプレイ 表示装置及び表示装置の駆動方法
CN115909978B (zh) * 2021-09-30 2024-08-06 乐金显示有限公司 栅极驱动电路以及包括栅极驱动电路的显示装置

Citations (149)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4571584A (en) 1982-07-22 1986-02-18 Sony Corporation Liquid crystal image display system
US4591848A (en) 1982-04-01 1986-05-27 Seiko Epson Corporation Matrix panel with an active driving system
US4769639A (en) 1985-09-25 1988-09-06 Casio Computer Co., Ltd. Liquid crystal drive circuit for driving a liquid crystal display element having scanning and signal electrodes arranged in matrix form
US4922240A (en) 1987-12-29 1990-05-01 North American Philips Corp. Thin film active matrix and addressing circuitry therefor
US5132819A (en) 1990-01-17 1992-07-21 Kabushiki Kaisha Toshiba Liquid-crystal display device of active matrix type having connecting means for repairing defective pixels
US5159260A (en) 1978-03-08 1992-10-27 Hitachi, Ltd. Reference voltage generator device
US5250931A (en) 1988-05-17 1993-10-05 Seiko Epson Corporation Active matrix panel having display and driver TFT's on the same substrate
US5365250A (en) 1991-09-10 1994-11-15 Sharp Kabushiki Kaisha Semiconductor device for driving liquid crystal panel
US5457474A (en) 1993-11-11 1995-10-10 Nec Corporation Driving circuit for active-matrix type liquid crystal display
US5477073A (en) 1993-08-20 1995-12-19 Casio Computer Co., Ltd. Thin film semiconductor device including a driver and a matrix circuit
US5559526A (en) 1992-04-09 1996-09-24 Casio Computer Co., Ltd. Liquid crystal display having a drive circuit
US5567959A (en) 1993-12-27 1996-10-22 Nec Corporation Laminated complementary thin film transistor device with improved threshold adaptability
US5570105A (en) 1993-12-25 1996-10-29 Semiconductor Energy Laboratory Co., Ltd. Driving circuit for driving liquid crystal display device
US5574474A (en) 1990-11-27 1996-11-12 Kabushiki Kaisha Toshiba Liquid crystal driving circuit
US5574475A (en) 1993-10-18 1996-11-12 Crystal Semiconductor Corporation Signal driver circuit for liquid crystal displays
US5644147A (en) 1994-07-07 1997-07-01 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device incorporating pixel transistors with plural gate electrodes
US5646643A (en) 1992-05-14 1997-07-08 Kabushiki Kaisha Toshiba Liquid crystal display device
US5663918A (en) 1994-10-19 1997-09-02 Intel Corporation Method and apparatus for detecting and selecting voltage supplies for flash memory
US5666133A (en) 1991-12-13 1997-09-09 Kyocera Corporation Method for driving liquid crystal display unit
US5680149A (en) 1993-12-25 1997-10-21 Semiconductor Energy Laboratory Co., Ltd. Driving circuit for driving liquid crystal display device
US5689280A (en) 1993-03-30 1997-11-18 Asahi Glass Company Ltd. Display apparatus and a driving method for a display apparatus
US5712652A (en) 1995-02-16 1998-01-27 Kabushiki Kaisha Toshiba Liquid crystal display device
US5731856A (en) 1995-12-30 1998-03-24 Samsung Electronics Co., Ltd. Methods for forming liquid crystal displays including thin film transistors and gate pads having a particular structure
US5744864A (en) 1995-08-03 1998-04-28 U.S. Philips Corporation Semiconductor device having a transparent switching element
US5808595A (en) 1995-06-29 1998-09-15 Sharp Kabushiki Kaisha Thin-film transistor circuit and image display
US5807772A (en) 1992-06-09 1998-09-15 Semiconductor Energy Laboratory Co., Ltd. Method for forming semiconductor device with bottom gate connected to source or drain
US5814834A (en) 1995-12-04 1998-09-29 Semiconductor Energy Laboratory Co. Thin film semiconductor device
US5834797A (en) 1995-11-21 1998-11-10 Sony Corporation Transistor having first and second gate electrodes
US5899547A (en) 1990-11-26 1999-05-04 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and driving method for the same
US5917199A (en) 1998-05-15 1999-06-29 Ois Optical Imaging Systems, Inc. Solid state imager including TFTS with variably doped contact layer system for reducing TFT leakage current and increasing mobility and method of making same
US5917221A (en) 1992-06-09 1999-06-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for forming the same
US5929527A (en) 1996-07-16 1999-07-27 Semiconductor Energy Laboratory Co., Ltd. Electronic device
US5956011A (en) 1995-10-14 1999-09-21 Semiconductor Energy Laboratory Co., Ltd. Matrix type liquid-crystal display unit
US6010923A (en) 1997-03-31 2000-01-04 Sanyo Electric Co., Ltd. Manufacturing method of semiconductor device utilizing annealed semiconductor layer as channel region
JP2000044236A (ja) 1998-07-24 2000-02-15 Hoya Corp 透明導電性酸化物薄膜を有する物品及びその製造方法
JP2000150900A (ja) 1998-11-17 2000-05-30 Japan Science & Technology Corp トランジスタ及び半導体装置
US6072193A (en) 1997-05-30 2000-06-06 Semiconductor Energy Laboratory Co., Ltd. Thin-film transistor and semiconductor device using thin-film transistors
US6081131A (en) 1997-11-12 2000-06-27 Seiko Epson Corporation Logical amplitude level conversion circuit, liquid crystal device and electronic apparatus
US6150283A (en) 1995-08-04 2000-11-21 Seiko Epson Corporation Thin film transistor fabrication method, active matrix substrate fabrication method, and liquid crystal display device
US6153893A (en) 1993-11-05 2000-11-28 Sony Corporation Thin film semiconductor device for display
US6197624B1 (en) 1997-08-29 2001-03-06 Semiconductor Energy Laboratory Co., Ltd. Method of adjusting the threshold voltage in an SOI CMOS
US6198133B1 (en) 1993-12-03 2001-03-06 Semiconductor Energy Laboratory Company, Ltd. Electro-optical device having silicon nitride interlayer insulating film
US6204519B1 (en) 1996-03-10 2001-03-20 Semicondutor Energy Laboratory Co., Ltd. Thin film semiconductor device
US6207971B1 (en) 1996-12-27 2001-03-27 Sanyo Electric Co., Ltd. Thin film transistor suitable for use in an active matrix type display and method of fabricating the same
US6215154B1 (en) 1997-02-17 2001-04-10 Sanyo Electric Co., Ltd. Thin film transistor and method of fabricating the same
US6294274B1 (en) 1998-11-16 2001-09-25 Tdk Corporation Oxide thin film
US20010046027A1 (en) 1999-09-03 2001-11-29 Ya-Hsiang Tai Liquid crystal display having stripe-shaped common electrodes formed above plate-shaped pixel electrodes
JP2002076356A (ja) 2000-09-01 2002-03-15 Japan Science & Technology Corp 半導体デバイス
US6380011B1 (en) 1998-08-07 2002-04-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and a method of manufacturing the same
US20020056838A1 (en) 2000-11-15 2002-05-16 Matsushita Electric Industrial Co., Ltd. Thin film transistor array, method of producing the same, and display panel using the same
US6392628B1 (en) 1999-01-08 2002-05-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device and driving circuit therefor
US6396078B1 (en) 1995-06-20 2002-05-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with a tapered hole formed using multiple layers with different etching rates
US20020132454A1 (en) 2001-03-19 2002-09-19 Fuji Xerox Co., Ltd. Method of forming crystalline semiconductor thin film on base substrate, lamination formed with crystalline semiconductor thin film and color filter
JP2002289859A (ja) 2001-03-23 2002-10-04 Minolta Co Ltd 薄膜トランジスタ
US6462723B1 (en) * 1998-06-12 2002-10-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US6512271B1 (en) 1998-11-16 2003-01-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2003086808A (ja) 2001-09-10 2003-03-20 Masashi Kawasaki 薄膜トランジスタおよびマトリクス表示装置
JP2003086000A (ja) 2001-09-10 2003-03-20 Sharp Corp 半導体記憶装置およびその試験方法
US6569716B1 (en) 1997-02-24 2003-05-27 Sanyo Electric Co., Ltd. Method of manufacturing a polycrystalline silicon film and thin film transistor using lamp and laser anneal
US20030189401A1 (en) 2002-03-26 2003-10-09 International Manufacturing And Engineering Services Co., Ltd. Organic electroluminescent device
US20030218222A1 (en) 2002-05-21 2003-11-27 The State Of Oregon Acting And Through The Oregon State Board Of Higher Education On Behalf Of Transistor structures and methods for making the same
US20040038446A1 (en) 2002-03-15 2004-02-26 Sanyo Electric Co., Ltd.- Method for forming ZnO film, method for forming ZnO semiconductor layer, method for fabricating semiconductor device, and semiconductor device
JP2004103957A (ja) 2002-09-11 2004-04-02 Japan Science & Technology Corp ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ
US20040127038A1 (en) 2002-10-11 2004-07-01 Carcia Peter Francis Transparent oxide semiconductor thin film transistors
JP2004222256A (ja) 2002-12-25 2004-08-05 Semiconductor Energy Lab Co Ltd 半導体装置およびこれを用いた表示装置並びに電子機器
JP2004273732A (ja) 2003-03-07 2004-09-30 Sharp Corp アクティブマトリクス基板およびその製造方法
JP2004273614A (ja) 2003-03-06 2004-09-30 Sharp Corp 半導体装置およびその製造方法
WO2004114391A1 (ja) 2003-06-20 2004-12-29 Sharp Kabushiki Kaisha 半導体装置およびその製造方法ならびに電子デバイス
US20050017302A1 (en) 2003-07-25 2005-01-27 Randy Hoffman Transistor including a deposited channel region having a doped portion
JP2005251348A (ja) 2004-03-08 2005-09-15 Casio Comput Co Ltd シフトレジスタ回路及びその駆動制御方法
US20050199959A1 (en) 2004-03-12 2005-09-15 Chiang Hai Q. Semiconductor device
US20060043377A1 (en) 2004-03-12 2006-03-02 Hewlett-Packard Development Company, L.P. Semiconductor device
US20060091793A1 (en) 2004-11-02 2006-05-04 3M Innovative Properties Company Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes
US20060108636A1 (en) 2004-11-10 2006-05-25 Canon Kabushiki Kaisha Amorphous oxide and field effect transistor
US20060110867A1 (en) 2004-11-10 2006-05-25 Canon Kabushiki Kaisha Field effect transistor manufacturing method
US20060108529A1 (en) 2004-11-10 2006-05-25 Canon Kabushiki Kaisha Sensor and image pickup device
US20060113565A1 (en) 2004-11-10 2006-06-01 Canon Kabushiki Kaisha Electric elements and circuits utilizing amorphous oxides
US20060113536A1 (en) 2004-11-10 2006-06-01 Canon Kabushiki Kaisha Display
US20060113539A1 (en) 2004-11-10 2006-06-01 Canon Kabushiki Kaisha Field effect transistor
US20060113549A1 (en) 2004-11-10 2006-06-01 Canon Kabushiki Kaisha Light-emitting device
US7061014B2 (en) 2001-11-05 2006-06-13 Japan Science And Technology Agency Natural-superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film
US20060169973A1 (en) 2005-01-28 2006-08-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, electronic device, and method of manufacturing semiconductor device
US20060170111A1 (en) 2005-01-28 2006-08-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, electronic device, and method of manufacturing semiconductor device
JP2006237624A (ja) 1998-06-12 2006-09-07 Semiconductor Energy Lab Co Ltd 半導体装置及びインバータ回路
US20060197092A1 (en) 2005-03-03 2006-09-07 Randy Hoffman System and method for forming conductive material on a substrate
US7105868B2 (en) 2002-06-24 2006-09-12 Cermet, Inc. High-electron mobility transistor with zinc oxide
US20060208977A1 (en) 2005-03-18 2006-09-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, and display device, driving method and electronic apparatus thereof
US20060228974A1 (en) 2005-03-31 2006-10-12 Theiss Steven D Methods of making displays
US20060231882A1 (en) 2005-03-28 2006-10-19 Il-Doo Kim Low voltage flexible organic/transparent transistor for selective gas sensing, photodetecting and CMOS device applications
US20060238135A1 (en) 2005-04-20 2006-10-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device
US20060284171A1 (en) 2005-06-16 2006-12-21 Levy David H Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby
US20060284172A1 (en) 2005-06-10 2006-12-21 Casio Computer Co., Ltd. Thin film transistor having oxide semiconductor layer and manufacturing method thereof
EP1737044A1 (en) 2004-03-12 2006-12-27 Japan Science and Technology Agency Amorphous oxide and thin film transistor
US20060292777A1 (en) 2005-06-27 2006-12-28 3M Innovative Properties Company Method for making electronic devices using metal oxide nanoparticles
US20070024187A1 (en) 2005-07-28 2007-02-01 Shin Hyun S Organic light emitting display (OLED) and its method of fabrication
US20070046191A1 (en) 2005-08-23 2007-03-01 Canon Kabushiki Kaisha Organic electroluminescent display device and manufacturing method thereof
US20070054507A1 (en) 2005-09-06 2007-03-08 Canon Kabushiki Kaisha Method of fabricating oxide semiconductor device
US20070052025A1 (en) 2005-09-06 2007-03-08 Canon Kabushiki Kaisha Oxide semiconductor thin film transistor and method of manufacturing the same
US20070090365A1 (en) 2005-10-20 2007-04-26 Canon Kabushiki Kaisha Field-effect transistor including transparent oxide and light-shielding member, and display utilizing the transistor
US7211825B2 (en) 2004-06-14 2007-05-01 Yi-Chi Shih Indium oxide-based thin film transistors and circuits
US20070108446A1 (en) 2005-11-15 2007-05-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US20070152217A1 (en) 2005-12-29 2007-07-05 Chih-Ming Lai Pixel structure of active matrix organic light-emitting diode and method for fabricating the same
US20070172591A1 (en) 2006-01-21 2007-07-26 Samsung Electronics Co., Ltd. METHOD OF FABRICATING ZnO FILM AND THIN FILM TRANSISTOR ADOPTING THE ZnO FILM
US20070187760A1 (en) 2006-02-02 2007-08-16 Kochi Industrial Promotion Center Thin film transistor including low resistance conductive thin films and manufacturing method thereof
US20070187678A1 (en) 2006-02-15 2007-08-16 Kochi Industrial Promotion Center Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof
US20070252928A1 (en) 2006-04-28 2007-11-01 Toppan Printing Co., Ltd. Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof
US7297977B2 (en) 2004-03-12 2007-11-20 Hewlett-Packard Development Company, L.P. Semiconductor device
US20070272922A1 (en) 2006-04-11 2007-11-29 Samsung Electronics Co. Ltd. ZnO thin film transistor and method of forming the same
US20070287296A1 (en) 2006-06-13 2007-12-13 Canon Kabushiki Kaisha Dry etching method for oxide semiconductor film
US20080006877A1 (en) 2004-09-17 2008-01-10 Peter Mardilovich Method of Forming a Solution Processed Device
US7323356B2 (en) 2002-02-21 2008-01-29 Japan Science And Technology Agency LnCuO(S,Se,Te)monocrystalline thin film, its manufacturing method, and optical device or electronic device using the monocrystalline thin film
US20080038882A1 (en) 2006-08-09 2008-02-14 Kazushige Takechi Thin-film device and method of fabricating the same
US20080038929A1 (en) 2006-08-09 2008-02-14 Canon Kabushiki Kaisha Method of dry etching oxide semiconductor film
US20080050595A1 (en) 2006-01-11 2008-02-28 Murata Manufacturing Co., Ltd. Transparent conductive film and method for manufacturing the same
EP1895545A2 (en) 2006-08-31 2008-03-05 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
US20080073653A1 (en) 2006-09-27 2008-03-27 Canon Kabushiki Kaisha Semiconductor apparatus and method of manufacturing the same
EP1906414A2 (en) 2006-09-29 2008-04-02 Semiconductor Energy Laboratory Co., Ltd. Display device
US20080083950A1 (en) 2006-10-10 2008-04-10 Alfred I-Tsung Pan Fused nanocrystal thin film semiconductor and method
JP2008083692A (ja) 2006-08-31 2008-04-10 Semiconductor Energy Lab Co Ltd 液晶表示装置
US20080106191A1 (en) 2006-09-27 2008-05-08 Seiko Epson Corporation Electronic device, organic electroluminescence device, and organic thin film semiconductor device
US20080129195A1 (en) 2006-12-04 2008-06-05 Toppan Printing Co., Ltd. Color el display and method for producing the same
US20080128689A1 (en) 2006-11-29 2008-06-05 Je-Hun Lee Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays
US7385224B2 (en) 2004-09-02 2008-06-10 Casio Computer Co., Ltd. Thin film transistor having an etching protection film and manufacturing method thereof
US20080166834A1 (en) 2007-01-05 2008-07-10 Samsung Electronics Co., Ltd. Thin film etching method
US7402506B2 (en) 2005-06-16 2008-07-22 Eastman Kodak Company Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby
US20080182358A1 (en) 2007-01-26 2008-07-31 Cowdery-Corvan Peter J Process for atomic layer deposition
US7411209B2 (en) 2006-09-15 2008-08-12 Canon Kabushiki Kaisha Field-effect transistor and method for manufacturing the same
US20080224133A1 (en) 2007-03-14 2008-09-18 Jin-Seong Park Thin film transistor and organic light-emitting display device having the thin film transistor
US20080258141A1 (en) 2007-04-19 2008-10-23 Samsung Electronics Co., Ltd. Thin film transistor, method of manufacturing the same, and flat panel display having the same
US20080258140A1 (en) 2007-04-20 2008-10-23 Samsung Electronics Co., Ltd. Thin film transistor including selectively crystallized channel layer and method of manufacturing the thin film transistor
US20080258139A1 (en) 2007-04-17 2008-10-23 Toppan Printing Co., Ltd. Structure with transistor
US20080258143A1 (en) 2007-04-18 2008-10-23 Samsung Electronics Co., Ltd. Thin film transitor substrate and method of manufacturing the same
US7453087B2 (en) 2005-09-06 2008-11-18 Canon Kabushiki Kaisha Thin-film transistor and thin-film diode having amorphous-oxide semiconductor layer
US20080296568A1 (en) 2007-05-29 2008-12-04 Samsung Electronics Co., Ltd Thin film transistors and methods of manufacturing the same
US7501293B2 (en) 2002-06-13 2009-03-10 Murata Manufacturing Co., Ltd. Semiconductor device in which zinc oxide is used as a semiconductor material and method for manufacturing the semiconductor device
US20090073325A1 (en) 2005-01-21 2009-03-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same, and electric device
JP2009094927A (ja) 2007-10-11 2009-04-30 Seiko Epson Corp バッファ、レベルシフト回路及び表示装置
US20090114910A1 (en) 2005-09-06 2009-05-07 Canon Kabushiki Kaisha Semiconductor device
US20090134399A1 (en) 2005-02-18 2009-05-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor Device and Method for Manufacturing the Same
US20090152541A1 (en) 2005-02-03 2009-06-18 Semiconductor Energy Laboratory Co., Ltd. Electronic device, semiconductor device and manufacturing method thereof
US20090152506A1 (en) 2007-12-17 2009-06-18 Fujifilm Corporation Process for producing oriented inorganic crystalline film, and semiconductor device using the oriented inorganic crystalline film
JP2009251205A (ja) 2008-04-04 2009-10-29 Sony Corp 表示装置と電子機器
US7674650B2 (en) 2005-09-29 2010-03-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US20100065844A1 (en) 2008-09-18 2010-03-18 Sony Corporation Thin film transistor and method of manufacturing thin film transistor
US20100092800A1 (en) 2008-10-09 2010-04-15 Canon Kabushiki Kaisha Substrate for growing wurtzite type crystal and method for manufacturing the same and semiconductor device
US20100102314A1 (en) 2008-10-24 2010-04-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US20100102313A1 (en) 2008-10-24 2010-04-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US20100109002A1 (en) 2007-04-25 2010-05-06 Canon Kabushiki Kaisha Oxynitride semiconductor
US20100117079A1 (en) 2008-11-13 2010-05-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3117684B2 (ja) * 1998-05-14 2000-12-18 ヨンス チョー 自動車用ステアリングホイールリムの製造方法
JP2001284592A (ja) * 2000-03-29 2001-10-12 Sony Corp 薄膜半導体装置及びその駆動方法
JP4069648B2 (ja) * 2002-03-15 2008-04-02 カシオ計算機株式会社 半導体装置および表示駆動装置
TWI648719B (zh) * 2004-09-16 2019-01-21 日商半導體能源研究所股份有限公司 具有圖素的顯示裝置和電子裝置
KR101142996B1 (ko) * 2004-12-31 2012-05-08 재단법인서울대학교산학협력재단 표시 장치 및 그 구동 방법
KR101340512B1 (ko) * 2006-12-01 2013-12-12 삼성디스플레이 주식회사 반도체 칩 패키지 및 이를 포함하는 인쇄 회로 기판어셈블리
JP5049691B2 (ja) * 2007-08-06 2012-10-17 株式会社日立製作所 半導体集積回路
JP5344449B2 (ja) * 2007-12-14 2013-11-20 国立大学法人島根大学 半導体多結晶薄膜及び半導体装置
JP5264197B2 (ja) * 2008-01-23 2013-08-14 キヤノン株式会社 薄膜トランジスタ
JP2009207041A (ja) * 2008-02-29 2009-09-10 Seiko Epson Corp 電気回路、電気光学装置、電子機器、および電気回路の制御方法
JP5602390B2 (ja) * 2008-08-19 2014-10-08 富士フイルム株式会社 薄膜トランジスタ、アクティブマトリクス基板、及び撮像装置

Patent Citations (186)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5159260A (en) 1978-03-08 1992-10-27 Hitachi, Ltd. Reference voltage generator device
US4591848A (en) 1982-04-01 1986-05-27 Seiko Epson Corporation Matrix panel with an active driving system
US4571584A (en) 1982-07-22 1986-02-18 Sony Corporation Liquid crystal image display system
US4769639A (en) 1985-09-25 1988-09-06 Casio Computer Co., Ltd. Liquid crystal drive circuit for driving a liquid crystal display element having scanning and signal electrodes arranged in matrix form
US4922240A (en) 1987-12-29 1990-05-01 North American Philips Corp. Thin film active matrix and addressing circuitry therefor
US5250931A (en) 1988-05-17 1993-10-05 Seiko Epson Corporation Active matrix panel having display and driver TFT's on the same substrate
US5132819A (en) 1990-01-17 1992-07-21 Kabushiki Kaisha Toshiba Liquid-crystal display device of active matrix type having connecting means for repairing defective pixels
US5899547A (en) 1990-11-26 1999-05-04 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and driving method for the same
US5574474A (en) 1990-11-27 1996-11-12 Kabushiki Kaisha Toshiba Liquid crystal driving circuit
US5365250A (en) 1991-09-10 1994-11-15 Sharp Kabushiki Kaisha Semiconductor device for driving liquid crystal panel
US5666133A (en) 1991-12-13 1997-09-09 Kyocera Corporation Method for driving liquid crystal display unit
US5559526A (en) 1992-04-09 1996-09-24 Casio Computer Co., Ltd. Liquid crystal display having a drive circuit
US5646643A (en) 1992-05-14 1997-07-08 Kabushiki Kaisha Toshiba Liquid crystal display device
US5807772A (en) 1992-06-09 1998-09-15 Semiconductor Energy Laboratory Co., Ltd. Method for forming semiconductor device with bottom gate connected to source or drain
US5917221A (en) 1992-06-09 1999-06-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for forming the same
US5689280A (en) 1993-03-30 1997-11-18 Asahi Glass Company Ltd. Display apparatus and a driving method for a display apparatus
US5477073A (en) 1993-08-20 1995-12-19 Casio Computer Co., Ltd. Thin film semiconductor device including a driver and a matrix circuit
US5821137A (en) 1993-08-20 1998-10-13 Casio Computer Co., Ltd. Thin film semiconductor device including a driver and a matrix circuit
US5574475A (en) 1993-10-18 1996-11-12 Crystal Semiconductor Corporation Signal driver circuit for liquid crystal displays
US6153893A (en) 1993-11-05 2000-11-28 Sony Corporation Thin film semiconductor device for display
US5457474A (en) 1993-11-11 1995-10-10 Nec Corporation Driving circuit for active-matrix type liquid crystal display
US6198133B1 (en) 1993-12-03 2001-03-06 Semiconductor Energy Laboratory Company, Ltd. Electro-optical device having silicon nitride interlayer insulating film
US5680149A (en) 1993-12-25 1997-10-21 Semiconductor Energy Laboratory Co., Ltd. Driving circuit for driving liquid crystal display device
US5570105A (en) 1993-12-25 1996-10-29 Semiconductor Energy Laboratory Co., Ltd. Driving circuit for driving liquid crystal display device
US5567959A (en) 1993-12-27 1996-10-22 Nec Corporation Laminated complementary thin film transistor device with improved threshold adaptability
US5818070A (en) 1994-07-07 1998-10-06 Semiconductor Energy Laboratory Company, Ltd. Electro-optical device incorporating a peripheral dual gate electrode TFT driver circuit
US5644147A (en) 1994-07-07 1997-07-01 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device incorporating pixel transistors with plural gate electrodes
US5663918A (en) 1994-10-19 1997-09-02 Intel Corporation Method and apparatus for detecting and selecting voltage supplies for flash memory
US5712652A (en) 1995-02-16 1998-01-27 Kabushiki Kaisha Toshiba Liquid crystal display device
US6396078B1 (en) 1995-06-20 2002-05-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with a tapered hole formed using multiple layers with different etching rates
US5808595A (en) 1995-06-29 1998-09-15 Sharp Kabushiki Kaisha Thin-film transistor circuit and image display
US5744864A (en) 1995-08-03 1998-04-28 U.S. Philips Corporation Semiconductor device having a transparent switching element
US6150283A (en) 1995-08-04 2000-11-21 Seiko Epson Corporation Thin film transistor fabrication method, active matrix substrate fabrication method, and liquid crystal display device
US6608613B2 (en) 1995-10-14 2003-08-19 Semiconductor Energy Laboratory Co., Ltd. Matrix type liquid-crystal display unit
US5956011A (en) 1995-10-14 1999-09-21 Semiconductor Energy Laboratory Co., Ltd. Matrix type liquid-crystal display unit
US6037924A (en) 1995-10-14 2000-03-14 Semiconductor Energy Laboratory Co., Ltd. Matrix type liquid-crystal display unit
US5834797A (en) 1995-11-21 1998-11-10 Sony Corporation Transistor having first and second gate electrodes
US5814834A (en) 1995-12-04 1998-09-29 Semiconductor Energy Laboratory Co. Thin film semiconductor device
US5731856A (en) 1995-12-30 1998-03-24 Samsung Electronics Co., Ltd. Methods for forming liquid crystal displays including thin film transistors and gate pads having a particular structure
US6204519B1 (en) 1996-03-10 2001-03-20 Semicondutor Energy Laboratory Co., Ltd. Thin film semiconductor device
US5929527A (en) 1996-07-16 1999-07-27 Semiconductor Energy Laboratory Co., Ltd. Electronic device
US6207971B1 (en) 1996-12-27 2001-03-27 Sanyo Electric Co., Ltd. Thin film transistor suitable for use in an active matrix type display and method of fabricating the same
US6215154B1 (en) 1997-02-17 2001-04-10 Sanyo Electric Co., Ltd. Thin film transistor and method of fabricating the same
US6569716B1 (en) 1997-02-24 2003-05-27 Sanyo Electric Co., Ltd. Method of manufacturing a polycrystalline silicon film and thin film transistor using lamp and laser anneal
US6010923A (en) 1997-03-31 2000-01-04 Sanyo Electric Co., Ltd. Manufacturing method of semiconductor device utilizing annealed semiconductor layer as channel region
US6072193A (en) 1997-05-30 2000-06-06 Semiconductor Energy Laboratory Co., Ltd. Thin-film transistor and semiconductor device using thin-film transistors
US6197624B1 (en) 1997-08-29 2001-03-06 Semiconductor Energy Laboratory Co., Ltd. Method of adjusting the threshold voltage in an SOI CMOS
US6081131A (en) 1997-11-12 2000-06-27 Seiko Epson Corporation Logical amplitude level conversion circuit, liquid crystal device and electronic apparatus
US5917199A (en) 1998-05-15 1999-06-29 Ois Optical Imaging Systems, Inc. Solid state imager including TFTS with variably doped contact layer system for reducing TFT leakage current and increasing mobility and method of making same
US20050158929A1 (en) 1998-06-12 2005-07-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2006237624A (ja) 1998-06-12 2006-09-07 Semiconductor Energy Lab Co Ltd 半導体装置及びインバータ回路
US7247882B2 (en) 1998-06-12 2007-07-24 Semiconductor Energy Laboratory Co., Ltd. Display device
US6462723B1 (en) * 1998-06-12 2002-10-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US6603453B2 (en) 1998-06-12 2003-08-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US6960787B2 (en) 1998-06-12 2005-11-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2000044236A (ja) 1998-07-24 2000-02-15 Hoya Corp 透明導電性酸化物薄膜を有する物品及びその製造方法
US6380011B1 (en) 1998-08-07 2002-04-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and a method of manufacturing the same
US6294274B1 (en) 1998-11-16 2001-09-25 Tdk Corporation Oxide thin film
US6512271B1 (en) 1998-11-16 2003-01-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2000150900A (ja) 1998-11-17 2000-05-30 Japan Science & Technology Corp トランジスタ及び半導体装置
US6727522B1 (en) 1998-11-17 2004-04-27 Japan Science And Technology Corporation Transistor and semiconductor device
US7064346B2 (en) 1998-11-17 2006-06-20 Japan Science And Technology Agency Transistor and semiconductor device
US6392628B1 (en) 1999-01-08 2002-05-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device and driving circuit therefor
US20010046027A1 (en) 1999-09-03 2001-11-29 Ya-Hsiang Tai Liquid crystal display having stripe-shaped common electrodes formed above plate-shaped pixel electrodes
JP2002076356A (ja) 2000-09-01 2002-03-15 Japan Science & Technology Corp 半導体デバイス
US20020056838A1 (en) 2000-11-15 2002-05-16 Matsushita Electric Industrial Co., Ltd. Thin film transistor array, method of producing the same, and display panel using the same
US20020132454A1 (en) 2001-03-19 2002-09-19 Fuji Xerox Co., Ltd. Method of forming crystalline semiconductor thin film on base substrate, lamination formed with crystalline semiconductor thin film and color filter
JP2002289859A (ja) 2001-03-23 2002-10-04 Minolta Co Ltd 薄膜トランジスタ
US6563174B2 (en) 2001-09-10 2003-05-13 Sharp Kabushiki Kaisha Thin film transistor and matrix display device
JP2003086000A (ja) 2001-09-10 2003-03-20 Sharp Corp 半導体記憶装置およびその試験方法
JP2003086808A (ja) 2001-09-10 2003-03-20 Masashi Kawasaki 薄膜トランジスタおよびマトリクス表示装置
US7061014B2 (en) 2001-11-05 2006-06-13 Japan Science And Technology Agency Natural-superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film
US7323356B2 (en) 2002-02-21 2008-01-29 Japan Science And Technology Agency LnCuO(S,Se,Te)monocrystalline thin film, its manufacturing method, and optical device or electronic device using the monocrystalline thin film
US7049190B2 (en) 2002-03-15 2006-05-23 Sanyo Electric Co., Ltd. Method for forming ZnO film, method for forming ZnO semiconductor layer, method for fabricating semiconductor device, and semiconductor device
US20040038446A1 (en) 2002-03-15 2004-02-26 Sanyo Electric Co., Ltd.- Method for forming ZnO film, method for forming ZnO semiconductor layer, method for fabricating semiconductor device, and semiconductor device
US20030189401A1 (en) 2002-03-26 2003-10-09 International Manufacturing And Engineering Services Co., Ltd. Organic electroluminescent device
US20030218222A1 (en) 2002-05-21 2003-11-27 The State Of Oregon Acting And Through The Oregon State Board Of Higher Education On Behalf Of Transistor structures and methods for making the same
US7501293B2 (en) 2002-06-13 2009-03-10 Murata Manufacturing Co., Ltd. Semiconductor device in which zinc oxide is used as a semiconductor material and method for manufacturing the semiconductor device
US7105868B2 (en) 2002-06-24 2006-09-12 Cermet, Inc. High-electron mobility transistor with zinc oxide
JP2004103957A (ja) 2002-09-11 2004-04-02 Japan Science & Technology Corp ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ
US20040127038A1 (en) 2002-10-11 2004-07-01 Carcia Peter Francis Transparent oxide semiconductor thin film transistors
US20060035452A1 (en) 2002-10-11 2006-02-16 Carcia Peter F Transparent oxide semiconductor thin film transistor
US7786985B2 (en) 2002-12-25 2010-08-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, and display device and electronic device utilizing the same
US7202863B2 (en) 2002-12-25 2007-04-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, and display device and electronic device utilizing the same
US8044906B2 (en) 2002-12-25 2011-10-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, and display device and electronic device utilizing the same
US20120032943A1 (en) 2002-12-25 2012-02-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor Device, and Display Device and Electronic Device Utilizing the Same
US8059078B2 (en) 2002-12-25 2011-11-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, and display device and electronic device utilizing the same
JP2004222256A (ja) 2002-12-25 2004-08-05 Semiconductor Energy Lab Co Ltd 半導体装置およびこれを用いた表示装置並びに電子機器
JP2004273614A (ja) 2003-03-06 2004-09-30 Sharp Corp 半導体装置およびその製造方法
JP2004273732A (ja) 2003-03-07 2004-09-30 Sharp Corp アクティブマトリクス基板およびその製造方法
US20060244107A1 (en) 2003-06-20 2006-11-02 Toshinori Sugihara Semiconductor device, manufacturing method, and electronic device
WO2004114391A1 (ja) 2003-06-20 2004-12-29 Sharp Kabushiki Kaisha 半導体装置およびその製造方法ならびに電子デバイス
US20050017302A1 (en) 2003-07-25 2005-01-27 Randy Hoffman Transistor including a deposited channel region having a doped portion
JP2005251348A (ja) 2004-03-08 2005-09-15 Casio Comput Co Ltd シフトレジスタ回路及びその駆動制御方法
US20060043377A1 (en) 2004-03-12 2006-03-02 Hewlett-Packard Development Company, L.P. Semiconductor device
EP1737044A1 (en) 2004-03-12 2006-12-27 Japan Science and Technology Agency Amorphous oxide and thin film transistor
US20070194379A1 (en) 2004-03-12 2007-08-23 Japan Science And Technology Agency Amorphous Oxide And Thin Film Transistor
US7297977B2 (en) 2004-03-12 2007-11-20 Hewlett-Packard Development Company, L.P. Semiconductor device
US20090278122A1 (en) 2004-03-12 2009-11-12 Japan Science And Technology Agency Amorphous oxide and thin film transistor
US20090280600A1 (en) 2004-03-12 2009-11-12 Japan Science And Technology Agency Amorphous oxide and thin film transistor
US20050199959A1 (en) 2004-03-12 2005-09-15 Chiang Hai Q. Semiconductor device
US20080254569A1 (en) 2004-03-12 2008-10-16 Hoffman Randy L Semiconductor Device
US7462862B2 (en) 2004-03-12 2008-12-09 Hewlett-Packard Development Company, L.P. Transistor using an isovalent semiconductor oxide as the active channel layer
EP2226847A2 (en) 2004-03-12 2010-09-08 Japan Science And Technology Agency Amorphous oxide and thin film transistor
US7282782B2 (en) 2004-03-12 2007-10-16 Hewlett-Packard Development Company, L.P. Combined binary oxide semiconductor device
US7211825B2 (en) 2004-06-14 2007-05-01 Yi-Chi Shih Indium oxide-based thin film transistors and circuits
US7385224B2 (en) 2004-09-02 2008-06-10 Casio Computer Co., Ltd. Thin film transistor having an etching protection film and manufacturing method thereof
US20080006877A1 (en) 2004-09-17 2008-01-10 Peter Mardilovich Method of Forming a Solution Processed Device
US20060091793A1 (en) 2004-11-02 2006-05-04 3M Innovative Properties Company Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes
US20060113565A1 (en) 2004-11-10 2006-06-01 Canon Kabushiki Kaisha Electric elements and circuits utilizing amorphous oxides
US20060108636A1 (en) 2004-11-10 2006-05-25 Canon Kabushiki Kaisha Amorphous oxide and field effect transistor
US7453065B2 (en) 2004-11-10 2008-11-18 Canon Kabushiki Kaisha Sensor and image pickup device
US20060110867A1 (en) 2004-11-10 2006-05-25 Canon Kabushiki Kaisha Field effect transistor manufacturing method
US20060108529A1 (en) 2004-11-10 2006-05-25 Canon Kabushiki Kaisha Sensor and image pickup device
US20060113536A1 (en) 2004-11-10 2006-06-01 Canon Kabushiki Kaisha Display
US20060113539A1 (en) 2004-11-10 2006-06-01 Canon Kabushiki Kaisha Field effect transistor
US20060113549A1 (en) 2004-11-10 2006-06-01 Canon Kabushiki Kaisha Light-emitting device
US20090073325A1 (en) 2005-01-21 2009-03-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same, and electric device
US20060169973A1 (en) 2005-01-28 2006-08-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, electronic device, and method of manufacturing semiconductor device
US20060170111A1 (en) 2005-01-28 2006-08-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, electronic device, and method of manufacturing semiconductor device
US20090152541A1 (en) 2005-02-03 2009-06-18 Semiconductor Energy Laboratory Co., Ltd. Electronic device, semiconductor device and manufacturing method thereof
US20090134399A1 (en) 2005-02-18 2009-05-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor Device and Method for Manufacturing the Same
US20060197092A1 (en) 2005-03-03 2006-09-07 Randy Hoffman System and method for forming conductive material on a substrate
US20060208977A1 (en) 2005-03-18 2006-09-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, and display device, driving method and electronic apparatus thereof
US20060231882A1 (en) 2005-03-28 2006-10-19 Il-Doo Kim Low voltage flexible organic/transparent transistor for selective gas sensing, photodetecting and CMOS device applications
US20060228974A1 (en) 2005-03-31 2006-10-12 Theiss Steven D Methods of making displays
US20060238135A1 (en) 2005-04-20 2006-10-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device
US20060284172A1 (en) 2005-06-10 2006-12-21 Casio Computer Co., Ltd. Thin film transistor having oxide semiconductor layer and manufacturing method thereof
US20060284171A1 (en) 2005-06-16 2006-12-21 Levy David H Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby
US7402506B2 (en) 2005-06-16 2008-07-22 Eastman Kodak Company Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby
US20060292777A1 (en) 2005-06-27 2006-12-28 3M Innovative Properties Company Method for making electronic devices using metal oxide nanoparticles
US20070024187A1 (en) 2005-07-28 2007-02-01 Shin Hyun S Organic light emitting display (OLED) and its method of fabrication
US20070046191A1 (en) 2005-08-23 2007-03-01 Canon Kabushiki Kaisha Organic electroluminescent display device and manufacturing method thereof
US7468304B2 (en) 2005-09-06 2008-12-23 Canon Kabushiki Kaisha Method of fabricating oxide semiconductor device
US20070052025A1 (en) 2005-09-06 2007-03-08 Canon Kabushiki Kaisha Oxide semiconductor thin film transistor and method of manufacturing the same
US7453087B2 (en) 2005-09-06 2008-11-18 Canon Kabushiki Kaisha Thin-film transistor and thin-film diode having amorphous-oxide semiconductor layer
US20090114910A1 (en) 2005-09-06 2009-05-07 Canon Kabushiki Kaisha Semiconductor device
US20070054507A1 (en) 2005-09-06 2007-03-08 Canon Kabushiki Kaisha Method of fabricating oxide semiconductor device
US7674650B2 (en) 2005-09-29 2010-03-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US7732819B2 (en) 2005-09-29 2010-06-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US20070090365A1 (en) 2005-10-20 2007-04-26 Canon Kabushiki Kaisha Field-effect transistor including transparent oxide and light-shielding member, and display utilizing the transistor
US20070108446A1 (en) 2005-11-15 2007-05-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US20090068773A1 (en) 2005-12-29 2009-03-12 Industrial Technology Research Institute Method for fabricating pixel structure of active matrix organic light-emitting diode
US20070152217A1 (en) 2005-12-29 2007-07-05 Chih-Ming Lai Pixel structure of active matrix organic light-emitting diode and method for fabricating the same
US20080050595A1 (en) 2006-01-11 2008-02-28 Murata Manufacturing Co., Ltd. Transparent conductive film and method for manufacturing the same
US20070172591A1 (en) 2006-01-21 2007-07-26 Samsung Electronics Co., Ltd. METHOD OF FABRICATING ZnO FILM AND THIN FILM TRANSISTOR ADOPTING THE ZnO FILM
US20070187760A1 (en) 2006-02-02 2007-08-16 Kochi Industrial Promotion Center Thin film transistor including low resistance conductive thin films and manufacturing method thereof
US20070187678A1 (en) 2006-02-15 2007-08-16 Kochi Industrial Promotion Center Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof
US20070272922A1 (en) 2006-04-11 2007-11-29 Samsung Electronics Co. Ltd. ZnO thin film transistor and method of forming the same
US20070252928A1 (en) 2006-04-28 2007-11-01 Toppan Printing Co., Ltd. Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof
US20070287296A1 (en) 2006-06-13 2007-12-13 Canon Kabushiki Kaisha Dry etching method for oxide semiconductor film
US20080038929A1 (en) 2006-08-09 2008-02-14 Canon Kabushiki Kaisha Method of dry etching oxide semiconductor film
US20080038882A1 (en) 2006-08-09 2008-02-14 Kazushige Takechi Thin-film device and method of fabricating the same
US20110187694A1 (en) 2006-08-31 2011-08-04 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
JP2008083692A (ja) 2006-08-31 2008-04-10 Semiconductor Energy Lab Co Ltd 液晶表示装置
US7859510B2 (en) 2006-08-31 2010-12-28 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
US20120068173A1 (en) 2006-08-31 2012-03-22 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
EP1895545A2 (en) 2006-08-31 2008-03-05 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
US7411209B2 (en) 2006-09-15 2008-08-12 Canon Kabushiki Kaisha Field-effect transistor and method for manufacturing the same
US20080073653A1 (en) 2006-09-27 2008-03-27 Canon Kabushiki Kaisha Semiconductor apparatus and method of manufacturing the same
US20080106191A1 (en) 2006-09-27 2008-05-08 Seiko Epson Corporation Electronic device, organic electroluminescence device, and organic thin film semiconductor device
US20120049184A1 (en) 2006-09-29 2012-03-01 Semiconductor Energy Laboratory Co., Ltd. Display device
US20120056860A1 (en) 2006-09-29 2012-03-08 Semiconductor Energy Laboratory Co., Ltd. Display device
JP2008089915A (ja) 2006-09-29 2008-04-17 Semiconductor Energy Lab Co Ltd 液晶表示装置
US8054279B2 (en) 2006-09-29 2011-11-08 Semiconductor Energy Laboratory Co., Ltd. Display device
EP1906414A2 (en) 2006-09-29 2008-04-02 Semiconductor Energy Laboratory Co., Ltd. Display device
US20080083950A1 (en) 2006-10-10 2008-04-10 Alfred I-Tsung Pan Fused nanocrystal thin film semiconductor and method
US20080128689A1 (en) 2006-11-29 2008-06-05 Je-Hun Lee Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays
US20080129195A1 (en) 2006-12-04 2008-06-05 Toppan Printing Co., Ltd. Color el display and method for producing the same
US20080166834A1 (en) 2007-01-05 2008-07-10 Samsung Electronics Co., Ltd. Thin film etching method
US20080182358A1 (en) 2007-01-26 2008-07-31 Cowdery-Corvan Peter J Process for atomic layer deposition
US20080224133A1 (en) 2007-03-14 2008-09-18 Jin-Seong Park Thin film transistor and organic light-emitting display device having the thin film transistor
US20080258139A1 (en) 2007-04-17 2008-10-23 Toppan Printing Co., Ltd. Structure with transistor
US20080258143A1 (en) 2007-04-18 2008-10-23 Samsung Electronics Co., Ltd. Thin film transitor substrate and method of manufacturing the same
US20080258141A1 (en) 2007-04-19 2008-10-23 Samsung Electronics Co., Ltd. Thin film transistor, method of manufacturing the same, and flat panel display having the same
US20080258140A1 (en) 2007-04-20 2008-10-23 Samsung Electronics Co., Ltd. Thin film transistor including selectively crystallized channel layer and method of manufacturing the thin film transistor
US20100109002A1 (en) 2007-04-25 2010-05-06 Canon Kabushiki Kaisha Oxynitride semiconductor
US20080296568A1 (en) 2007-05-29 2008-12-04 Samsung Electronics Co., Ltd Thin film transistors and methods of manufacturing the same
JP2009094927A (ja) 2007-10-11 2009-04-30 Seiko Epson Corp バッファ、レベルシフト回路及び表示装置
US20090152506A1 (en) 2007-12-17 2009-06-18 Fujifilm Corporation Process for producing oriented inorganic crystalline film, and semiconductor device using the oriented inorganic crystalline film
JP2009251205A (ja) 2008-04-04 2009-10-29 Sony Corp 表示装置と電子機器
US20100065844A1 (en) 2008-09-18 2010-03-18 Sony Corporation Thin film transistor and method of manufacturing thin film transistor
US20100092800A1 (en) 2008-10-09 2010-04-15 Canon Kabushiki Kaisha Substrate for growing wurtzite type crystal and method for manufacturing the same and semiconductor device
US20100102313A1 (en) 2008-10-24 2010-04-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US20100102314A1 (en) 2008-10-24 2010-04-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US20100117079A1 (en) 2008-11-13 2010-05-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same

Non-Patent Citations (73)

* Cited by examiner, † Cited by third party
Title
Asakuma.N et al., "Crystallization and Reduction of Sol-Gel-Derived Zinc Oxide Films by Irradiation with Ultraviolet Lamp,", Journal of Sol-Gel Science and Technology, 2003, vol. 26, pp. 181-184.
Asaoka.Y et al., "29.1: Polarizer-Free Reflective LCD Combined With Ultra Low-Power Driving Technology,", SID Digest '09 : SID International Symposium Digest of Technical Papers, May 31, 2009, pp. 395-398.
Chern.H et al., "An Analytical Model for the Above-Threshold Characteristics of Polysilicon Thin-Film Transistors,", IEEE Transactions on Electron Devices, Jul. 1, 1995, vol. 42, No. 7, pp. 1240-1246.
Cho.D et al., "21.2:Al and Sn-Doped Zinc Indium Oxide Thin Film Transistors for AMOLED Back-Plane,", SID Digest '09 : SID International Symposium Digest of Technical Papers, May 31, 2009, pp. 280-283.
Clark.S et al., "First Principles Methods Using CASTEP,", Zeitschrift fur Kristallographie, 2005, vol. 220, pp. 567-570.
Coates.D et al., "Optical Studies of the Amorphous Liquid-Cholesteric Liquid Crystal Transition:The "Blue Phase",", Physics Letters, Sep. 10, 1973, vol. 45A, No. 2, pp. 115-116.
Costello.M et al., "Electron Microscopy of a Cholesteric Liquid Crystal and Its Blue Phase,", Phys. Rev. A (Physical Review. A), May 1, 1984, vol. 29, No. 5, pp. 2957-2959.
Dembo.H et al., "RFCPUS on Glass and Plastic Substrates Fabricated by TFT Transfer Technology,", IEDM 05: Technical Digest of International Electron Devices Meeting, Dec. 5, 2005, pp. 1067-1069.
Fortunato.E et al., "Wide-Bandgap High-Mobility ZnO Thin-Film Transistors Produced at Room Temperature,", Appl. Phys. Lett. (Applied Physics Letters) , Sep. 27, 2004, vol. 85, No. 13, pp. 2541-2543.
Fung.T et al., "2-D Numerical Simulation of High Performance Amorphous In-Ga-Zn-O TFTs for Flat Panel Displays,", AM-FPD '08 Digest of Technical Papers, Jul. 2, 2008, pp. 251-252, The Japan Society of Applied Physics.
Godo.H et al., "P-9:Numerical Analysis on Temperature Dependence of Characteristics of Amorphous In-Ga-Zn-Oxide TFT,", SID Digest '09 : SID International Symposium Digest of Technical Papers, May 31, 2009, pp. 1110-1112.
Godo.H et al., "Temperature Dependence of Characteristics and Electronic Structure for Amorphous In-Ga-Zn-Oxide TFT,", AM-FPD '09 Digest of Technical Papers, Jul. 1, 2009, pp. 41-44.
Hayashi.R et al., "42.1: Invited Paper: Improved Amorphous In-Ga-Zn-O TFTS,", SID Digest '08 : SID International Symposium Digest of Technical Papers, May 20, 2008, vol. 39, pp. 621-624.
Hirao.T et al., "Novel Top-Gate Zinc Oxide Thin-Film Transistors (ZnO TFTs) for AMLCDS,", Journal of the SID, 2007, vol. 15, No. 1, pp. 17-22.
Hosono.H et al., "Working hypothesis to explore novel wide band gap electrically conducting amorphous oxides and examples,", J. Non-Cryst. Solids (Journal of Non-Crystalline Solids), 1996, vol. 198-200, pp. 165-169.
Hosono.H, "68.3:Invited Paper:Transparent Amorphous Oxide Semiconductors for High Performance TFT,". SID Digest '07 : SID International Symposium Digest of Technical Papers, 2007, vol. 38, pp. 1830-1833.
Hsieh.H et al., "P-29:Modeling of Amorphous Oxide Semiconductor Thin Film Transistors and Subgap Density of States,", SID Digest '08 : SID International Symposium Digest of Technical Papers, 2008, vol. 39, pp. 1277-1280.
Ikeda.T et al., "Full-Functional System Liquid Crystal Display Using CG-Silicon Technology,", SID Digest '04 : SID International Symposium Digest of Technical Papers, 2004, vol. 35, pp. 860-863.
International Search Report (Application No. PCT/JP2010/067814) Dated Nov. 2, 2010.
Janotti.A et al., "Native Point Defects in ZnO,", Phys. Rev. B (Physical Review. B), Oct. 4, 2007, vol. 76, No. 16, pp. 165202-1-165202-22.
Janotti.A et al., "Oxygen Vacancies in ZnO,", Appl. Phys. Lett. (Applied Physics Letters) , 2005, vol. 87, pp. 122102-1-122102-3.
Jeong.J et al., "3.1: Distinguished Paper: 12.1-Inch WXGA AMOLED Display Driven by Indium-Gallium-Zinc Oxide TFTs Array,", SID Digest '08 : SID International Symposium Digest of Technical Papers, May 20, 2008, vol. 39, No. 1, pp. 1-4.
Jin.D et al., "65.2:Distinguished Paper:World-Largest (6.5'') Flexible Full Color Top Emission AMOLED Display on Plastic Film and Its Bending Properties,", SID Digest '09 : SID International Symposium Digest of Technical Papers, May 31, 2009, pp. 983-985.
Jin.D et al., "65.2:Distinguished Paper:World-Largest (6.5″) Flexible Full Color Top Emission AMOLED Display on Plastic Film and Its Bending Properties,", SID Digest '09 : SID International Symposium Digest of Technical Papers, May 31, 2009, pp. 983-985.
Kanno.H et al., "White Stacked Electrophosphorecent Organic Light-Emitting Devices Employing MOO3 as a Charge-Generation Layer,", Adv. Mater. (Advanced Materials), 2006, vol. 18, No. 3, pp. 339-342.
Kikuchi.H et al., "39.1:Invited Paper:Optically Isotropic Nano-Structured Liquid Crystal Composites for Display Applications,", SID Digest '09 : SID International Symposium Digest of Technical Papers, May 31, 2009, pp. 578-581.
Kikuchi.H et al., "62.2:Invited Paper:Fast Electro-Optical Switching in Polymer-Stabilized Liquid Crystalline Blue Phases for Display Application,", SID Digest '07 : SID International Symposium Digest of Technical Papers, 2007, vol. 38, pp. 1737-1740.
Kikuchi.H et al., "Polymer-Stabilized Liquid Crystal Blue Phases,", Nature Materials, Sep. 1, 2002, vol. 1, pp. 64-68.
Kim.S et al., "High-Performance oxide thin film transistors passivated by various gas plasmas,", 214th ECS Meeting, 2008, No. 2317.
Kimizuka.N et al., "Spinel,YBFE2O4, and YB2FE3O7 Types of Structures for Compounds in the In2O3 and Sc2O3-A2O3-Bo Systems [A; Fe, Ga, or Al; B: Mg, Mn, Fe, Ni, Cu,or Zn] at Temperatures Over 1000° C.,", Journal of Solid State Chemistry, 1985, vol. 60, pp. 382-384.
Kimizuka.N et al., "Syntheses and Single-Crystal Data of Homologous Compounds, In2O3(ZnO)m (m=3, 4, and 5), InGaO3(ZnO)3, and Ga2O3(ZnO)m (m=7, 8, 9, and 16) in the In2O3-ZnGa2O4-ZnO System,", Journal of Solid State Chemistry, Apr. 1, 1995, vol. 116, No. 1, pp. 170-178.
Kitzerow.H et al., "Observation of Blue Phases in Chiral Networks,", Liquid Crystals, 1993, vol. 14, No. 3, pp. 911-916.
Kurokawa.Y et al., "UHF RFCPUS on Flexible and Glass Substrates for Secure RFID Systems,", Journal of Solid-State Circuits , 2008, vol. 43, No. 1, pp. 292-299.
Lany.S et al., "Dopability, Intrinsic Conductivity, and Nonstoichiometry of Transparent Conducting Oxides,", Phys. Rev. Lett. (Physical Review Letters), Jan. 26, 2007, vol. 98, pp. 045501-1-045501-4.
Lee.H et al., "Current Status of, Challenges to, and Perspective View of AM-OLED ,", IDW '06 : Proceedings of the 13th International Display Workshops, Dec. 7, 2006, pp. 663-666.
Lee.J et al., "World's Largest (15-Inch) XGA AMLCD Panel Using IGZO Oxide TFT,", SID Digest '08 : SID International Symposium Digest of Technical Papers, May 20, 2008, vol. 39, pp. 625-628.
Lee.M et al., "15.4:Excellent Performance of Indium-Oxide-Based Thin-Film Transistors by DC Sputtering,", SID Digest '09 : SID International Symposium Digest of Technical Papers, May 31, 2009, pp. 191-193.
Li.C et al., "Modulated Structures of Homologous Compounds InMO3(ZnO)m (M=In,Ga; m=integer) Described by Four-Dimensional Superspace Group,", Journal of Solid State Chemistry, 1998, vol. 139, pp. 347-355.
Masuda.S et al., "Transparent thin film transistors using ZnO as an active channel layer and their electrical properties,", J. Appl. Phys. (Journal of Applied Physics) , Feb. 1, 2003, vol. 93, No. 3, pp. 1624-1630.
Meiboom.S et al., "Theory of the Blue Phase of Cholesteric Liquid Crystals,", Phys. Rev. Lett. (Physical Review Letters), May 4, 1981, vol. 46, No. 18, pp. 1216-1219.
Miyasaka.M, "Suftla Flexible Microelectronics on Their Way to Business,", SID Digest '07 : SID International Symposium Digest of Technical Papers, 2007, vol. 38, pp. 1673-1676.
Mo.Y et al., "Amorphous Oxide TFT Backplanes for Large Size AMOLED Displays,", IDW '08 : Proceedings of the 6th International Display Workshops, Dec. 3, 2008, pp. 581-584.
Nakamura.M et al., "The phase relations in the In2O3-Ga2ZnO4-ZnO system at 1350° C.,", Journal of Solid State Chemistry, Aug. 1, 1991, vol. 93, No. 2, pp. 298-315.
Nakamura.M, "Synthesis of Homologous Compound with New Long-Period Structure,", Nirim Newsletter, Mar. 1, 1995, vol. 150, pp. 1-4.
Nomura.K et al., "Amorphous Oxide Semiconductors for High-Performance Flexible Thin-Film Transistors,", Jpn. J. Appl. Phys. (Japanese Journal of Applied Physics) , 2006, vol. 45, No. 58, pp. 4303-4308.
Nomura.K et al., "Carrier transport in transparent oxide semiconductor with intrinsic structural randomness probed using single-crystalline InGaO3(ZnO)5 films,", Appl. Phys. Lett. (Applied Physics Letters) , Sep. 13, 2004, vol. 85, No. 11, pp. 1993-1995.
Nomura.K et al., "Room-Temperature Fabrication of Transparent Flexible Thin-Film Transistors Using Amorphous Oxide Semiconductors,", Nature, Nov. 25, 2004, vol. 432, pp. 488-492.
Nomura.K et al., "Thin-Film Transistor Fabricated in Single-Crystalline Transparent Oxide Semiconductor,", Science, May 23, 2003, vol. 300, No. 5623, pp. 1269-1272.
Nowatari.H et al., "60.2: Intermediate Connector With Suppressed Voltage Loss for White Tandem OLEDs,", SID Digest '09 : SID International Symposium Digest of Technical Papers, May 31, 2009, vol. 40, pp. 899-902.
Oba.F et al., "Defect energetics in ZnO: A hybrid Hartree-Fock density functional study,", Phys. Rev. B (Physical Review. B), 2008, vol. 77, pp. 245202-1-245202-6.
Oh.M et al., "Improving the Gate Stability of ZnO Thin-Film Transistors With Aluminum Oxide Dielectric Layers,", J. Electrochem. Soc. (Journal of the Electrochemical Society), 2008, vol. 155, No. 12, pp. H1009-H1014.
Ohara.H et al., "21.3:4.0 In. QVGA AMOLED Display Using In-Ga-Zn-Oxide TFTs With a Novel Passivation Layer,", SID Digest '09 : SID International Symposium Digest of Technical Papers, May 31, 2009, pp. 284-287.
Ohara.H et al., "Amorphous In-Ga-Zn-Oxide TFTs with Suppressed Variation for 4.0 inch QVGA AMOLED Display,", AM-FPD '09 Digest of Technical Papers, Jul. 1, 2009, pp. 227-230, The Japan Society of Applied Physics.
Orita.M et al., "Amorphous transparent conductive oxide InGeO3(ZnO)m (m<4):a Zn4s conductor,", Philosophical Magazine, 2001, vol. 81, No. 5, pp. 501-515.
Orita.M et al., "Mechanism of Electrical Conductivity of Transparent InGaZnO4,", Phys. Rev. B (Physical Review. B), Jan. 15, 2000, vol. 61, No. 3, pp. 1811-1816.
Osada.T et al., "15.2: Development of Driver-Integrated Panel using Amorphous In-Ga-Zn-Oxide TFT,", SID Digest '09 : SID International Symposium Digest of Technical Papers, May 31, 2009, pp. 184-187.
Osada.T et al., "Development of Driver-Integrated Panel Using Amorphous In-Ga-Zn-Oxide TFT,", AM-FPD '09 Digest of Technical Papers, Jul. 1, 2009, pp. 33-36.
Park et al., "Threshold voltage control in dual gate ZnO-based thin film transistors," IMID '09 Digest, 2009, pp. 527-530.
Park.J et al., "Amorphous Indium-Gallium-Zinc Oxide TFTs and Their Application for Large Size AMOLED,", AM-FPD '08 Digest of Technical Papers, Jul. 2, 2008, pp. 275-278.
Park.J et al., "Dry etching of ZnO films and plasma-induced damage to optical properties,", J. Vac. Sci. Technol. B (Journal of Vacuum Science & Technology B), Mar. 1, 2003, vol. 21, No. 2, pp. 800-803.
Park.J et al., "Electronic Transport Properties of Amorphous Indium-Gallium-Zinc Oxide Semiconductor Upon Exposure to Water,", Appl. Phys. Lett. (Applied Physics Letters) , 2008, vol. 92, pp. 072104-1-072104-3.
Park.J et al., "High performance amorphous oxide thin film transistors with self-aligned top-gate structure,", IEDM 09: Technical Digest of International Electron Devices Meeting, Dec. 7, 2009, pp. 191-194.
Park.J et al., "Improvements in the Device Characteristics of Amorphous Indium Gallium Zinc Oxide Thin-Film Transistors by Ar Plasma Treatment,", Appl. Phys. Lett. (Applied Physics Letters) , Jun. 26, 2007, vol. 90, No. 26, pp. 262106-1-262106-3.
Park.S et al., "Challenge to Future Displays: Transparent AM-OLED Driven by Peald Grown ZnO TFT,", IMID '07 Digest, 2007, pp. 1249-1252.
Park.Sang-Hee et al., "42.3: Transparent ZnO Thin Film Transistor for the Application of High Aperture Ratio Bottom Emission AM-OLED Display,", SID Digest '08 : SID International Symposium Digest of Technical Papers, May 20, 2008, vol. 39, pp. 629-632.
Prins.M et al., "A Ferroelectric Transparent Thin-Film Transistor,", Appl. Phys. Lett. (Applied Physics Letters) , Jun. 17, 1996, vol. 68, No. 25, pp. 3650-3652.
Sakata.J et al., "Development of 4.0-In. AMOLED Display With Driver Circuit Using Amorphous In-Ga-Zn-Oxide TFTS,", IDW '09 : Proceedings of the 16th International Display Workshops, 2009, pp. 689-692.
Son.K et al., "42.4L: Late-News Paper: 4 Inch QVGA AMOLED Driven by the Threshold Voltage Controlled Amorphous GIZO (Ga2O3-In2O3-ZnO) TFT,", SID Digest '08 : SID International Symposium Digest of Technical Papers, May 20, 2008, vol. 39, pp. 633-636.
Takahashi.M et al., "Theoretical Analysis of IGZO Transparent Amorphous Oxide Semiconductor,", IDW '08 : Proceedings of the 15th International Display Workshops, Dec. 3, 2008, pp. 1637-1640.
Tsuda.K et al., "Ultra Low Power Consumption Technologies for Mobile TFT-LCDs ,", IDW '02 : Proceedings of the 9th International Display Workshops, Dec. 4, 2002, pp. 295-298.
Ueno.K et al., "Field-Effect Transistor on SrTiO3 With Sputtered Al2O3 Gate Insulator,", Appl. Phys. Lett. (Applied Physics Letters) , Sep. 1, 2003, vol. 83, No. 9, pp. 1755-1757.
Van de Walle.C, "Hydrogen as a Cause of Doping in Zinc Oxide,", Phys. Rev. Lett. (Physical Review Letters), Jul. 31, 2000, vol. 85, No. 5, pp. 1012-1015.
Written Opinion (Application No. PCT/JP2010/067814) Dated Nov. 2, 2010.

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