US8063399B2 - Electroactive materials - Google Patents

Electroactive materials Download PDF

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US8063399B2
US8063399B2 US12/272,210 US27221008A US8063399B2 US 8063399 B2 US8063399 B2 US 8063399B2 US 27221008 A US27221008 A US 27221008A US 8063399 B2 US8063399 B2 US 8063399B2
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US20110095269A1 (en
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Gary A. Johansson
Eric Maurice Smith
Reid John Chesterfield
Michael Henry Howard, Jr.
Kyung-ho Park
Nora Sabina Radu
Gene M. Rossi
Frederick P. Gentry
Troy C. Gehret
Daniel David Lecloux
Adam Fennimore
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LG Chem Ltd
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EI Du Pont de Nemours and Co
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Assigned to E. I. DU PONT DE NEMOURS AND COMPANY reassignment E. I. DU PONT DE NEMOURS AND COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHESTERFIELD, REID JOHN, HOWARD, MICHAEL HENRY, JR., SMITH, ERIC MAURICE, RADU, NORA SABINA, PARK, KYUNG-HO, FENNIMORE, ADAM, GEHRET, TROY C., GENTRY, FREDERICK P., JOHANSSON, GARY A., LECLOUX, DANIEL DAVID, ROSSI, GENE M.
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Priority to US13/241,542 priority patent/US8889269B2/en
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Definitions

  • the present disclosure relates to novel electroactive compounds.
  • the disclosure further relates to electronic devices having at least one active layer comprising such an electroactive compound.
  • organic photoactive electronic devices such as organic light emitting diodes (“OLED”), that make up OLED displays
  • OLED organic light emitting diodes
  • the organic active layer is sandwiched between two electrical contact layers in an OLED display.
  • the organic photoactive layer emits light through the light-transmitting electrical contact layer upon application of a voltage across the electrical contact layers.
  • organic electroluminescent compounds As the active component in light-emitting diodes. Simple organic molecules, conjugated polymers, and organometallic complexes have been used.
  • Devices that use photoactive materials frequently include one or more charge transport layers, which are positioned between a photoactive (e.g., light-emitting) layer and a contact layer (hole-injecting contact layer).
  • a device can contain two or more contact layers.
  • a hole transport layer can be positioned between the photoactive layer and the hole-injecting contact layer.
  • the hole-injecting contact layer may also be called the anode.
  • An electron transport layer can be positioned between the photoactive layer and the electron-injecting contact layer.
  • the electron-injecting contact layer may also be called the cathode.
  • an electronic device having at least one layer comprising the above compound.
  • FIG. 1 includes an illustration of one example of an organic electronic device.
  • an electronic device having at least one layer comprising the above compound.
  • alkyl includes branched and straight-chain saturated aliphatic hydrocarbon groups. Unless otherwise indicated, the term is also intended to include cyclic groups. Examples of alkyl groups include methyl, ethyl, propyl, isopropyl, isobutyl, secbutyl, tertbutyl, pentyl, isopentyl, neopentyl, cyclopentyl, hexyl, cyclohexyl, isohexyl and the like.
  • alkyl further includes both substituted and unsubstituted hydrocarbon groups. In some embodiments, the alkyl group may be mono-, di- and tri-substituted.
  • substituted alkyl group is trifluoromethyl.
  • Other substituted alkyl groups are formed from one or more of the substituents described herein.
  • alkyl groups have 1 to 20 carbon atoms.
  • the group has 1 to 6 carbon atoms.
  • the term is intended to include heteroalkyl groups. Heteroalkyl groups may have from 1-20 carbon atoms.
  • aryl means an aromatic carbocyclic moiety, which may be a single ring (monocyclic) or multiple rings (bicyclic, or more) fused together or linked covalently. Any suitable ring position of the aryl moiety may be covalently linked to the defined chemical structure. Examples of aryl moieties include, but are not limited to, phenyl, 1-naphthyl, 2-naphthyl, dihydronaphthyl, tetrahydronaphthyl, biphenyl.
  • aryl groups have 6 to 60 carbon atoms; in some embodiments, 6 to 30 carbon atoms.
  • the term is intended to include heteroaryl groups. Heteroaryl groups may have from 4-50 carbon atoms; in some embodiments, 4-30 carbon atoms.
  • alkoxy is intended to mean the group —OR, where R is alkyl.
  • aryloxy is intended to mean the group —OR, where R is aryl.
  • substituents include D, alkyl, aryl, nitro, cyano, —N(R 7 )(R 8 ), halo, hydroxy, carboxy, alkenyl, alkynyl, cycloalkyl, heteroaryl, alkoxy, aryloxy, heteroaryloxy, alkoxycarbonyl, perfluoroalkyl, perfluoroalkoxy, arylalkyl, silyl, siloxane, thioalkoxy, —S(O) 2 —N(R′)(R′′), —C( ⁇ O)—N(R′)(R′′), (R′)(R′′)N-alkyl, (R′)(R′′)N-alkoxyalkyl,
  • R′ and R′′ is independently an optionally substituted alkyl, cycloalkyl, or aryl group.
  • R′ and R′′, together with the nitrogen atom to which they are bound, can form a ring system in certain embodiments.
  • Substituents may also be crosslinking groups.
  • charge transport when referring to a layer, material, member, or structure is intended to mean such layer, material, member, or structure facilitates migration of such charge through the thickness of such layer, material, member, or structure with relative efficiency and small loss of charge.
  • Hole transport materials facilitate positive charge; electron transport material facilitate negative charge.
  • light-emitting materials may also have some charge transport properties, the term “charge transport layer, material, member, or structure” is not intended to include a layer, material, member, or structure whose primary function is light emission.
  • compound is intended to mean an electrically uncharged substance made up of molecules that further include atoms, wherein the atoms cannot be separated from their corresponding molecules by physical means without breaking chemical bonds.
  • the term is intended to include oligomers and polymers.
  • crosslinkable group or “crosslinking group” is intended to mean a group than can lead to crosslinking via thermal treatment or exposure to radiation.
  • the radiation is UV or visible.
  • active refers to a layer or a material
  • active materials include, but are not limited to, materials which conduct, inject, transport, or block a charge, where the charge can be either an electron or a hole, or materials which emit radiation or exhibit a change in concentration of electron-hole pairs when receiving radiation.
  • inactive materials include, but are not limited to, planarization materials, insulating materials, and environmental barrier materials.
  • fluoro is intended to indicate that one or more hydrogens in a group has been replaced with fluorine.
  • hetero indicates that one or more carbon atoms has been replaced with a different atom.
  • the heteroatom is O, N, S, or combinations thereof.
  • non-planar configuration as it refers to [T 1 -T 2 ] in Formulae I-III herein, is intended to mean that the immediately adjacent groups in T 1 and T 2 are not oriented in the same plane.
  • oxyalkyl is intended to mean a heteroalkyl group having one or more carbons replaced with oxygens.
  • the term includes groups which are linked via an oxygen.
  • photoactive is intended to mean to any material that exhibits electroluminescence or photosensitivity.
  • silyl refers to the group R 3 Si—, where R is H, D, C1-20 alkyl, fluoroalkyl, or aryl. In some embodiments, one or more carbons in an R alkyl group are replaced with Si. In some embodiments, the silyl groups are (hexyl) 2 Si(Me)CH 2 CH 2 Si(Me) 2 - and [CF 3 (CF 2 ) 6 CH 2 CH 2 ] 2 SiMe-.
  • siloxane refers to the group (RO) 3 Si—, where R is H, D, C1-20 alkyl, or fluoroalkyl.
  • adjacent to when used to refer to layers in a device, does not necessarily mean that one layer is immediately next to another layer.
  • the terms “comprises,” “comprising,” “includes,” “including,” “has,” “having” or any other variation thereof, are intended to cover a non-exclusive inclusion.
  • a process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
  • “or” refers to an inclusive or and not to an exclusive or. For example, a condition A or B is satisfied by any one of the following: A is true (or present) and B is false (or not present), A is false (or not present) and B is true (or present), and both A and B are true (or present).
  • the compound described herein has Formula I, Formula II, or Formula III:
  • At least one Ar 1 is a substituted phenyl with a substituent selected from the group consisting of alkyl, alkoxy, silyl, and a substituent with a crosslinking group.
  • a is 1-3.
  • a is 1-2.
  • a is 1.
  • e is 1-4.
  • e is 1-3.
  • e 1.
  • at least one Ar 1 has a substituent that has a crosslinking group.
  • Ar 2 has Formula a
  • Ar 2 is selected from the group consisting of a group having Formula a, naphthyl, phenylnaphthyl, and naphthylphenyl. In some embodiments, Ar 2 is selected from the group consisting phenyl, p-biphenyl, p-terphenyl, naphthyl, phenylnaphthyl, and naphthylphenyl. In some embodiments, Ar 2 is selected from the group consisting of phenyl, biphenyl, and terphenyl.
  • any of the aromatic rings in Formulae I-III may be substituted at any position.
  • the substituents may be present to improve one or more physical properties of the compound, such as solubility.
  • the substituents are selected from the group consisting of C 1-12 alkyl groups, C 1-12 alkoxy groups and silyl groups.
  • the alkyl groups are heteroalkyl groups.
  • the alkyl groups are fluoroalkyl groups.
  • at least one Ar 2 has an alkyl, alkoxy or silyl substituent.
  • the substituents may be present to provide crosslinking capability. In some embodiments, crosslinking substituents are present on at least one Ar 2 .
  • crosslinking substituents are present on at least one M moiety. In some embodiments, there is at least one substituent which includes a crosslinkable group.
  • crosslinkable groups include, but are not limited to vinyl, acrylate, perfluorovinylether, 1-benzo-3,4-cyclobutane, siloxane, cyanate groups, cyclic ethers (epoxides), cycloalkenes, and acetylenic groups.
  • the crosslinkable group is vinyl
  • the T 1 -T 2 group introduces non-planarity into the backbone of the compound.
  • the moiety in T 1 that is directly linked to a moiety in T 2 is linked such that the T 1 moiety is oriented in a plane that is different from the moiety in T 2 to which it is linked.
  • other parts of the T 1 unit for example, substituents, may lie in one or more different planes, it is the plane of the linking moiety in T 1 and the linking moiety in T 2 in the compound backbone that provide the non-planarity.
  • the compounds are chiral. In general, they are formed as racemic mixtures.
  • the compounds can also be in enantiomerically pure form.
  • the non-planarity can be viewed as the restriction to free rotation about the T 1 -T 2 bond. Rotation about that bond leads to racemization.
  • the half-life of racemization for T 1 -T 2 is greater than that for an unsubstituted biphenyl. In some embodiments, the half-life or racemization is 12 hours or greater at 20° C.
  • T 1 and T 2 are conjugated moieties. In some embodiments, T 1 and T 2 are aromatic moieties. In some embodiments, T 1 and T 2 are selected from the group consisting of phenylene, naphthylene, and anthracenyl groups.
  • [T 1 -T 2 ] is a substituted biphenylene group.
  • the term “biphenylene” is intended to mean a biphenyl group having two points of attachment to the compound backbone.
  • the term “biphenyl” is intended to mean a group having two phenyl units joined by a single bond.
  • the biphenylene group can be attached at one of the 2,3-, 4-, or 5-positions and one of the 2′, 3′-, 4′-, or 5′-positions.
  • the substituted biphenylene group has at least one substitutent in the 2-position.
  • the biphenylene group has substituents in at least the 2- and 2′-positions.
  • [T 1 -T 2 ] is a binaphthylene group.
  • binaphthylene is intended to mean a binapthyl group having 2 points of attachment to the compound backbone.
  • binaphthyl is intended to mean a group having two naphthalene units joined by a single bond.
  • the binaphthylene group is a 1,1′-binaphthylene, which is attached to the compound backbone at one of the 3-, 4-, 5-, 6, or 7-positions and one of the 3′-, 4′-, 5′-, 6′, or 7′-positions. This is illustrated below, where the dashed lines represent possible points of attachment.
  • the binaphthylene group is a 1,2′-binaphthylene having at least one substituent at the 8- or 9′-position, and which is attached to the compound backbone at one of the 3-, 4-, 5-, 6, or 7-positions and one of the 4′-, 5′-, 6′-, 7′, or 8′-positions. This is illustrated below, where the dashed lines represent possible points of attachment and at least one R represents a substituent.
  • the binaphthylene group is a 2,2′-binaphthylene having at least one substituent at the 8- or 9′-position, and which is attached to the compound backbone at one of the 4-, 5-, 6-, 7, or 8-positions and one of the 4′-, 5′-, 6′-, 7′, or 8′-positions. This is illustrated below, where the dashed lines represent possible points of attachment and at least one R represents a substituent.
  • [T 1 -T 2 ] is a phenylene-naphthylene group. In some embodiments, [T 1 -T 2 ] is a phenylene-1-naphthylene group, which is attached to the compound backbone at one of the 3-, 4-, or 5-positions in the phenylene and one of the 3-, 4-, or 5-positions of the naphthylene.
  • [T 1 -T 2 ] is a phenylene-2-naphthylene group, which is attached to the compound backbone at one of the 3-, 4-, or 5-positions in the phenylene and one of the 4-, 5-, 6-, 7-, or 8-positions of the naphthylene.
  • the biphenylene, binaphthylene, and phenylene-naphthylene groups are substituted at one or more positions.
  • [T 1 -T 2 ] is selected from one of the following:
  • R is the same or different and is selected from the group consisting of alkyl, aryl, alkoxy, aryloxy, fluoroalkyl, fluoroaryl, fluoroaryloxy fluoroalkyloxy, oxyalkyl, alkenyl groups, silyl, siloxane and crosslinking groups.
  • the dashed line represents a possible point of attachment to the compound backbone.
  • R is a C 1-10 alkyl or alkoxy; in some embodiments, a C 3-8 branched alkyl or alkoxy.
  • the two R groups are joined together to form a non-aromatic ring.
  • [T 1 -T 2 ] is a 1,1-binaphthylene group which is attached to the compound backbone at the 4 and 4′ positions, referred to as 4,4′-(1,1-binaphthylene).
  • the 4,4′-(1,1-binaphthylene) is the only isomer present.
  • two or more isomers are present.
  • the 4,4′-(1,1-binaphthylene) is present with up to 50% by weight of a second isomer.
  • the second isomer is selected from the group consisting of 4,5′-(1,1-binaphthylene), 4,6′-(1,1-binaphthylene), and 4,7′-(1,1-binaphthylene).
  • Formula III represents a copolymer in which there is at least one T moiety and at least one other conjugated moiety.
  • c is at least 0.4. In some embodiments, c is in the range of 0.4 to 0.6.
  • the copolymers can be random, alternating, or block copolymers.
  • M comprises triarylamine units. In some embodiments, M is an aromatic group. In some embodiments, M is an aromatic unit having a crosslinkable substituent. The amount of M having a crosslinkable substituent is generally between 4 and 20 mole percent.
  • Some non-limiting examples of compounds having Formula III include Compounds N through Y4 below.
  • the new compounds can be made using any technique that will yield a C—C or C—N bond.
  • a variety of such techniques are known, such as Suzuki, Yamamoto, Stille, and Pd- or Ni-catalyzed C—N couplings.
  • the compounds can be formed into layers using solution processing techniques.
  • the term “layer” is used interchangeably with the term “film” and refers to a coating covering a desired area. The term is not limited by size. The area can be as large as an entire device or as small as a specific functional area such as the actual visual display, or as small as a single sub-pixel.
  • Layers and films can be formed by any conventional deposition technique, including vapor deposition, liquid deposition (continuous and discontinuous techniques), and thermal transfer.
  • Continuous deposition techniques include but are not limited to, spin coating, gravure coating, curtain coating, dip coating, slot-die coating, spray coating, and continuous nozzle coating.
  • Discontinuous deposition techniques include, but are not limited to, ink jet printing, gravure printing, and screen printing.
  • the new compounds described herein have can be used as hole transport materials, as photoactive materials, and as hosts for photoactive materials.
  • the new compounds have hole mobilities and HOMO/LUMO energies similar to efficient small molecule hole transport compounds such as N,N′-diphenyl-N,N′-bis(3-methylphenyl)-[1,1′-biphenyl]-4,4′-diamine (TPD) and N,N′-bis(naphthalen-1-yl)-N,N′-bis-(phenyl)benzidine ( ⁇ -NPB).
  • TPD N,N′-diphenyl-N,N′-bis(3-methylphenyl)-[1,1′-biphenyl]-4,4′-diamine
  • ⁇ -NPB N,N′-bis(naphthalen-1-yl)-N,N′-bis-(phenyl)benzidine
  • Compounds such as TPD and NPD generally must be applied using a vapor deposition technique.
  • Organic electronic devices that may benefit from having one or more layers comprising at least one compound as described herein include, but are not limited to, (1) devices that convert electrical energy into radiation (e.g., a light-emitting diode, light emitting diode display, or diode laser), (2) devices that detect signals through electronics processes (e.g., photodetectors, photoconductive cells, photoresistors, photoswitches, phototransistors, phototubes, IR detectors), (3) devices that convert radiation into electrical energy, (e.g., a photovoltaic device or solar cell), and (4) devices that include one or more electronic components that include one or more organic semi-conductor layers (e.g., a transistor or diode).
  • Other uses for the compositions according to the present invention include coating materials for memory storage devices, antistatic films, biosensors, electrochromic devices, solid electrolyte capacitors, energy storage devices such as a rechargeable battery, and electromagnetic shielding applications.
  • FIG. 1 One illustration of an organic electronic device structure is shown in FIG. 1 .
  • the device 100 has an anode layer 110 and a cathode layer 150 , and a photoactive layer 130 between them.
  • Adjacent to the anode is a layer 120 comprising a charge transport material, for example, a hole transport material.
  • Adjacent to the cathode may be a charge transport layer 140 comprising an electron transport material.
  • devices may use one or more additional hole injection or hole transport layers (not shown) next to the anode 110 and/or one or more additional electron injection or electron transport layers (not shown) next to the cathode 150 .
  • photoactive refers to a material that emits light when activated by an applied voltage (such as in a light-emitting diode or light-emitting electrochemical cell), or responds to radiant energy and generates a signal with or without an applied bias voltage (such as in a photodetector).
  • a photoactive layer is an emitter layer.
  • the photoactive layer 130 can be a light-emitting layer that is activated by an applied voltage (such as in a light-emitting diode or light-emitting electrochemical cell), a layer of material that responds to radiant energy and generates a signal with or without an applied bias voltage (such as in a photodetector).
  • an applied voltage such as in a light-emitting diode or light-emitting electrochemical cell
  • a layer of material that responds to radiant energy and generates a signal with or without an applied bias voltage
  • Examples of photodetectors include photoconductive cells, photoresistors, photoswitches, phototransistors, and photovoltaic cells, as these terms are described in Kirk-Othmer Concise Encyclopedia of Chemical Technology, 4 th edition, p. 1537, (1999).
  • the hole transport layer 120 comprises at least one new electroactive compound as described herein.
  • the photoactive layer 130 comprises at least one new electroactive compound as described herein, wherein the electroactive compound is photoactive.
  • the photoactive layer 130 comprises at least one new electroactive compound as described herein, wherein the electroactive compound serves as a host having a photoactive material dispersed therein.
  • the other layers in the device can be made of any materials which are known to be useful in such layers.
  • the anode 110 is an electrode that is particularly efficient for injecting positive charge carriers. It can be made of, for example materials containing a metal, mixed metal, alloy, metal oxide or mixed-metal oxide, or it can be a conducting polymer, and mixtures thereof. Suitable metals include the Group 11 metals, the metals in Groups 4, 5, and 6, and the Group 8-10 transition metals. If the anode is to be light-transmitting, mixed-metal oxides of Groups 12, 13 and 14 metals, such as indium-tin-oxide, are generally used.
  • the anode 110 may also comprise an organic material such as polyaniline as described in “Flexible light-emitting diodes made from soluble conducting polymer,” Nature vol. 357, pp 477 479 (11 Jun. 1992). At least one of the anode and cathode should be at least partially transparent to allow the generated light to be observed.
  • organic material such as polyaniline as described in “Flexible light-emitting diodes made from soluble conducting polymer,” Nature vol. 357, pp 477 479 (11 Jun. 1992).
  • At least one of the anode and cathode should be at least partially transparent to allow the generated light to be observed.
  • the device further comprises a buffer layer between the anode and the layer comprising the new polymer.
  • buffer layer is intended to mean a layer comprising electrically conductive or semiconductive materials and may have one or more functions in an organic electronic device, including but not limited to, planarization of the underlying layer, charge transport and/or charge injection properties, scavenging of impurities such as oxygen or metal ions, and other aspects to facilitate or to improve the performance of the organic electronic device.
  • Buffer materials may be polymers, oligomers, or small molecules, and may be in the form of solutions, dispersions, suspensions, emulsions, colloidal mixtures, or other compositions.
  • the buffer layer can be formed with polymeric materials, such as polyaniline (PANI) or polyethylenedioxythiophene (PEDOT), which are often doped with protonic acids.
  • the protonic acids can be, for example, poly(styrenesulfonic acid), poly(2-acrylamido-2-methyl-1-propanesulfonic acid), and the like.
  • the buffer layer can comprise charge transfer compounds, and the like, such as copper phthalocyanine and the tetrathiafulvalene-tetracyanoquinodimethane system (TTF-TCNQ).
  • TTF-TCNQ tetrathiafulvalene-tetracyanoquinodimethane system
  • the buffer layer is made from a dispersion of a conducting polymer and a colloid-forming polymeric acid. Such materials have been described in, for example, published U.S. patent applications 2004-0102577, 2004-0127637, and 2005/205860.
  • hole transport layer 120 comprises the new electroactive compound described herein. In some embodiments, hole transport layer 120 consists essentially of the new electroactive compound described herein. In some embodiments, layer 120 comprises other hole transport materials. Examples of other hole transport materials for layer 120 have been summarized for example, in Kirk Othmer Encyclopedia of Chemical Technology, Fourth Edition, Vol. 18, p. 837 860, 1996, by Y. Wang. Both hole transporting molecules and polymers can be used.
  • hole transporting molecules include, but are not limited to: N,N′-diphenyl-N,N′-bis(3-methylphenyl)-[1,1′-biphenyl]-4,4′-diamine (TPD), 1,1-bis[(di-4-tolylamino) phenyl]cyclohexane (TAPC), N,N′-bis(4-methylphenyl)-N,N′-bis(4-ethylphenyl)-[1,1′-(3,3′-dimethyl)biphenyl]-4,4′-diamine (ETPD), tetrakis (3-methylphenyl)-N,N,N′,N′-2,5-phenylenediamine (PDA), a-phenyl 4-N,N-diphenylaminostyrene (TPS), p-(diethylamino)benzaldehyde diphenylhydrazone (DEH), triphenylamine (TPD
  • hole transporting polymers include, but are not limited to, polyvinylcarbazole, (phenylmethyl)polysilane, and polyaniline. It is also possible to obtain hole transporting polymers by doping hole transporting molecules such as those mentioned above into polymers such as polystyrene and polycarbonate. Buffer layers and/or hole transport layer can also comprise polymers of thiophene, aniline, or pyrrole with polymeric fluorinated sulfonic acids, as described in published US applications 2004/102577, 2004/127637, and 2005/205860.
  • any organic electroluminescent (“EL”) material can be used as the photoactive material in layer 130 .
  • Such materials include, but are not limited to, one of more compounds of the instant invention, small organic fluorescent compounds, fluorescent and phosphorescent metal complexes, conjugated polymers, and mixtures thereof.
  • fluorescent compounds include, but are not limited to, pyrene, perylene, rubrene, coumarin, derivatives thereof, and mixtures thereof.
  • metal complexes include, but are not limited to, metal chelated oxinoid compounds, such as tris(8-hydroxyquinolato)aluminum (Alq3); cyclometalated iridium and platinum electroluminescent compounds, and mixtures thereof.
  • conjugated polymers include, but are not limited to poly(phenylenevinylenes), polyfluorenes, poly(spirobifluorenes), polythiophenes, poly(p-phenylenes), copolymers thereof, and mixtures thereof.
  • the materials may also be present in admixture with a host material.
  • the host material is a hole transport material or an electron transport material.
  • the host is the new electroactive compound described herein.
  • the ratio of host material to photoactive material is in the range of 5:1 to 20:1; in some embodiments, 10:1 to 15:1.
  • the photoactive layer consists essentially of a photoactive material and the new electroactive compound described herein.
  • Examples of electron transport materials which can be used in the electron transport layer 140 and/or the optional layer between layer 140 and the cathode include metal chelated oxinoid compounds, such as tris(8-hydroxyquinolato)aluminum (AlQ), bis(2-methyl-8-quinolinolato)(p-phenylphenolato) aluminum (BAlq), tetrakis-(8-hydroxyquinolato)hafnium (HfQ) and tetrakis-(8-hydroxyquinolato)zirconium (ZrQ); and azole compounds such as 2-(4-biphenylyl)-5-(4-t-butylphenyl)-1,3,4-oxadiazole (PBD), 3-(4-biphenylyl)-4-phenyl-5-(4-t-butylphenyl)-1,2,4-triazole (TAZ), and 1,3,5-tri(phenyl-2-benzimidazole)benzene (TPBI); qui
  • the cathode 150 is an electrode that is particularly efficient for injecting electrons or negative charge carriers.
  • the cathode can be any metal or nonmetal having a lower work function than the anode.
  • Materials for the cathode can be selected from alkali metals of Group 1 (e.g., Li, Cs), the Group 2 (alkaline earth) metals, the Group 12 metals, including the rare earth elements and lanthanides, and the actinides. Materials such as aluminum, indium, calcium, barium, samarium and magnesium, as well as combinations, can be used.
  • Li-containing organometallic compounds, LiF, and Li 2 O can also be deposited between the organic layer and the cathode layer to lower the operating voltage.
  • each of the component layers is preferably determined by balancing the goals of providing a device with high device efficiency with device operational lifetime.
  • Other layers may also be present in the device.
  • There may be one or more hole injection and/or hole transport layers between the buffer layer and the organic active layer.
  • There may be one or more electron transport layers and/or electron injection layers between the organic active layer and the cathode.
  • the device can be prepared by a variety of techniques, including sequentially depositing the individual layers on a suitable substrate.
  • Substrates such as glass and polymeric films can be used.
  • Conventional vapor deposition techniques can be used, such as thermal evaporation, chemical vapor deposition, and the like.
  • the organic layers can be applied by liquid deposition using suitable solvents.
  • the liquid can be in the form of solutions, dispersions, or emulsions.
  • Typical liquid deposition techniques include, but are not limited to, continuous deposition techniques such as spin coating, gravure coating, curtain coating, dip coating, slot-die coating, spray-coating, and continuous nozzle coating; and discontinuous deposition techniques such as ink jet printing, gravure printing, and screen printing.
  • any conventional coating or printing technique including but not limited to spin-coating, dip-coating, roll-to-roll techniques, ink jet printing, screen-printing, gravure printing and the like.
  • liquid composition is intended to mean a liquid medium in which a material is dissolved to form a solution, a liquid medium in which a material is dispersed to form a dispersion, or a liquid medium in which a material is suspended to form a suspension or an emulsion.
  • the different layers have the following range of thicknesses: anode 110 , 500-5000 ⁇ , in one embodiment 1000-2000 ⁇ ; hole transport layer 120 , 50-2000 ⁇ , in one embodiment 200-1000 ⁇ ; photoactive layer 130 , 10-2000 ⁇ , in one embodiment 100-1000 ⁇ ; layer 140 , 50-2000 ⁇ , in one embodiment 100-1000 ⁇ ; cathode 150 , 200-10000 ⁇ , in one embodiment 300-5000 ⁇ .
  • the location of the electron-hole recombination zone in the device, and thus the emission spectrum of the device, can be affected by the relative thickness of each layer.
  • the thickness of the electron-transport layer should be chosen so that the electron-hole recombination zone is in the light-emitting layer.
  • the desired ratio of layer thicknesses will depend on the exact nature of the materials used.
  • the device has the following structure, in order: anode, buffer layer, hole transport layer, photoactive layer, electron transport layer, electron injection layer, cathode.
  • the anode is made of indium tin oxide or indium zinc oxide.
  • the buffer layer comprises a conducting polymer selected from the group consisting of polythiophenes, polyanilines, polypyrroles, copolymers thereof, and mixtures thereof.
  • the buffer layer comprises a complex of a conducting polymer and a colloid-forming polymeric acid.
  • the hole transport layer comprises the new compound described herein. In one embodiment, the hole transport layer comprises a compound having triarylamine or triarylmethane groups. In one embodiment, the hole transport layer comprises a material selected from the group consisting of TPD, MPMP, NPB, CBP, and mixtures thereof, as defined above.
  • the photoactive layer comprises an electroluminescent metal complex and a host material.
  • the host can be a charge transport material.
  • the host is the new electroactive compound described herein.
  • the electroluminescent complex is present in an amount of at least 1% by weight.
  • the electroluminescent complex is 2-20% by weight.
  • the electroluminescent complex is 20-50% by weight.
  • the electroluminescent complex is 50-80% by weight.
  • the electroluminescent complex is 80-99% by weight.
  • the metal complex is a cyclometalated complex of iridium, platinum, rhenium, or osmium.
  • the photoactive layer further comprises a second host material.
  • the electron transport layer comprises a metal complex of a hydroxyaryl-N-heterocycle.
  • the hydroxyaryl-N-heterocycle is unsubstituted or substituted 8-hydroxyquinoline.
  • the metal is aluminum.
  • the electron transport layer comprises a material selected from the group consisting of tris(8-hydroxyquinolinato)aluminum, bis(8-hydroxyquinolinato)(4-phenylphenolato)aluminum, tetrakis(8-hydroxyquinolinato)zirconium, tetrakis(8-hydroxyquinolinato)hafnium, and mixtures thereof.
  • the electron injection layer is LiF or Li 2 O.
  • the cathode is Al or Ba/Al.
  • there is an electron transport layer comprising a material selected from the group consisting of tris(8-hydroxyquinolinato)aluminum, bis(8-hydroxyquinolinato)(4-phenylphenolato)aluminum, tetrakis(8-hydroxyquinolinato)zirconium, tetrakis(8-hydroxyquinolinato)hafnium, and mixtures thereof, and an electron injection layer comprising LiF or Li 2 O.
  • the device is fabricated by liquid deposition of the buffer layer, the hole transport layer, and the photoactive layer, and by vapor deposition of the electron transport layer, the electron injection layer, and the cathode.
  • the buffer layer can be deposited from any liquid medium in which it is dissolved or dispersed and from which it will form a film.
  • the liquid medium consists essentially of one or more organic solvents.
  • the liquid medium consists essentially of water or water and an organic solvent.
  • the organic solvent is selected from the group consisting of alcohols, ketones, cyclic ethers, and polyols.
  • the organic liquid is selected from dimethylacetamide (“DMAc”), N-methylpyrrolidone (“NMP”), dimethylformamide (“DMF”), ethylene glycol (“EG”), aliphatic alcohols, and mixtures thereof.
  • the buffer material can be present in the liquid medium in an amount from 0.5 to 10 percent by weight.
  • the buffer layer can be applied by any continuous or discontinuous liquid deposition technique. In one embodiment, the buffer layer is applied by spin coating. In one embodiment, the buffer layer is applied by ink jet printing. After liquid deposition, the liquid medium can be removed in air, in an inert atmosphere, or by vacuum, at room temperature or with heating. In one embodiment, the layer is heated to a temperature less than 275° C. In one embodiment, the heating temperature is between 100° C. and 275° C. In one embodiment, the heating temperature is between 100° C. and 120° C. In one embodiment, the heating temperature is between 120° C. and 140° C. In one embodiment, the heating temperature is between 140° C. and 160° C.
  • the heating temperature is between 160° C. and 180° C. In one embodiment, the heating temperature is between 180° C. and 200° C. In one embodiment, the heating temperature is between 200° C. and 220° C. In one embodiment, the heating temperature is between 190° C. and 220° C. In one embodiment, the heating temperature is between 220° C. and 240° C. In one embodiment, the heating temperature is between 240° C. and 260° C. In one embodiment, the heating temperature is between 260° C. and 275° C.
  • the heating time is dependent upon the temperature, and is generally between 5 and 60 minutes. In one embodiment, the final layer thickness is between 5 and 200 nm. In one embodiment, the final layer thickness is between 5 and 40 nm.
  • the final layer thickness is between 40 and 80 nm. In one embodiment, the final layer thickness is between 80 and 120 nm. In one embodiment, the final layer thickness is between 120 and 160 nm. In one embodiment, the final layer thickness is between 160 and 200 nm.
  • the hole transport layer can be deposited from any liquid medium in which it is dissolved or dispersed and from which it will form a film.
  • the liquid medium consists essentially of one or more organic solvents.
  • the liquid medium consists essentially of water or water and an organic solvent.
  • the organic solvent is an aromatic solvent.
  • the organic liquid is selected from chloroform, dichloromethane, toluene, anisole, and mixtures thereof.
  • the hole transport material can be present in the liquid medium in a concentration of 0.2 to 2 percent by weight. Other weight percentages of hole transport material may be used depending upon the liquid medium.
  • the hole transport layer can be applied by any continuous or discontinuous liquid deposition technique. In one embodiment, the hole transport layer is applied by spin coating.
  • the hole transport layer is applied by ink jet printing.
  • the liquid medium can be removed in air, in an inert atmosphere, or by vacuum, at room temperature or with heating.
  • the layer is heated to a temperature of 300° C. or less.
  • the heating temperature is between 170° C. and 275° C.
  • the heating temperature is between 170° C. and 200° C.
  • the heating temperature is between 190° C. and 220° C.
  • the heating temperature is between 210° C. and 240° C.
  • the heating temperature is between 230° C. and 270° C.
  • the heating time is dependent upon the temperature, and is generally between 5 and 60 minutes.
  • the final layer thickness is between 5 and 50 nm. In one embodiment, the final layer thickness is between 5 and 15 nm. In one embodiment, the final layer thickness is between 15 and 25 nm. In one embodiment, the final layer thickness is between 25 and 35 nm. In one embodiment, the final layer thickness is between 35 and 50 nm.
  • the photoactive layer can be deposited from any liquid medium in which it is dissolved or dispersed and from which it will form a film.
  • the liquid medium consists essentially of one or more organic solvents.
  • the liquid medium consists essentially of water or water and an organic solvent.
  • the organic solvent is an aromatic solvent.
  • the organic liquid is selected from chloroform, dichloromethane, toluene, anisole, and mixtures thereof.
  • the photoactive material can be present in the liquid medium in a concentration of 0.2 to 2 percent by weight. Other weight percentages of photoactive material may be used depending upon the liquid medium.
  • the photoactive layer can be applied by any continuous or discontinuous liquid deposition technique. In one embodiment, the photoactive layer is applied by spin coating.
  • the photoactive layer is applied by ink jet printing.
  • the liquid medium can be removed in air, in an inert atmosphere, or by vacuum, at room temperature or with heating.
  • the deposited layer is heated to a temperature that is less than the Tg of the material having the lowest Tg.
  • the heating temperature is at least 10° C. less than the lowest Tg.
  • the heating temperature is at least 20° C. less than the lowest Tg.
  • the heating temperature is at least 30° C. less than the lowest Tg.
  • the heating temperature is between 50° C. and 150° C.
  • the heating temperature is between 50° C. and 75° C.
  • the heating temperature is between 75° C.
  • the heating temperature is between 100° C. and 125° C. In one embodiment, the heating temperature is between 125° C. and 150° C.
  • the heating time is dependent upon the temperature, and is generally between 5 and 60 minutes.
  • the final layer thickness is between 25 and 100 nm. In one embodiment, the final layer thickness is between 25 and 40 nm. In one embodiment, the final layer thickness is between 40 and 65 nm. In one embodiment, the final layer thickness is between 65 and 80 nm. In one embodiment, the final layer thickness is between 80 and 100 nm.
  • the electron transport layer can be deposited by any vapor deposition method. In one embodiment, it is deposited by thermal evaporation under vacuum. In one embodiment, the final layer thickness is between 1 and 100 nm. In one embodiment, the final layer thickness is between 1 and 15 nm. In one embodiment, the final layer thickness is between 15 and 30 nm. In one embodiment, the final layer thickness is between 30 and 45 nm. In one embodiment, the final layer thickness is between 45 and 60 nm. In one embodiment, the final layer thickness is between 60 and 75 nm. In one embodiment, the final layer thickness is between 75 and 90 nm. In one embodiment, the final layer thickness is between 90 and 100 nm.
  • the electron injection layer can be deposited by any vapor deposition method. In one embodiment, it is deposited by thermal evaporation under vacuum. In one embodiment, the vacuum is less than 10 ⁇ 6 torr. In one embodiment, the vacuum is less than 10 ⁇ 7 torr. In one embodiment, the vacuum is less than 10 ⁇ 8 torr. In one embodiment, the material is heated to a temperature in the range of 100° C. to 400° C.; 150° C. to 350° C. preferably. All vapor deposition rates given herein are in units of Angstroms per second. In one embodiment, the material is deposited at a rate of 0.5 to 10 ⁇ /sec. In one embodiment, the material is deposited at a rate of 0.5 to 1 ⁇ /sec.
  • the material is deposited at a rate of 1 to 2 ⁇ /sec. In one embodiment, the material is deposited at a rate of 2 to 3 ⁇ /sec. In one embodiment, the material is deposited at a rate of 3 to 4 ⁇ /sec. In one embodiment, the material is deposited at a rate of 4 to 5 ⁇ /sec. In one embodiment, the material is deposited at a rate of 5 to 6 ⁇ /sec. In one embodiment, the material is deposited at a rate of 6 to 7 ⁇ /sec. In one embodiment, the material is deposited at a rate of 7 to 8 ⁇ /sec. In one embodiment, the material is deposited at a rate of 8 to 9 ⁇ /sec.
  • the material is deposited at a rate of 9 to 10 ⁇ /sec.
  • the final layer thickness is between 0.1 and 3 nm. In one embodiment, the final layer thickness is between 0.1 and 1 nm. In one embodiment, the final layer thickness is between 1 and 2 nm. In one embodiment, the final layer thickness is between 2 and 3 nm.
  • the cathode can be deposited by any vapor deposition method. In one embodiment, it is deposited by thermal evaporation under vacuum. In one embodiment, the vacuum is less than 10 ⁇ 6 torr. In one embodiment, the vacuum is less than 10 ⁇ 7 torr. In one embodiment, the vacuum is less than 10 ⁇ 8 torr. In one embodiment, the material is heated to a temperature in the range of 100° C. to 400° C.; 150° C. to 350° C. preferably. In one embodiment, the material is deposited at a rate of 0.5 to 10 ⁇ /sec. In one embodiment, the material is deposited at a rate of 0.5 to 1 ⁇ /sec. In one embodiment, the material is deposited at a rate of 1 to 2 ⁇ /sec.
  • the material is deposited at a rate of 2 to 3 ⁇ /sec. In one embodiment, the material is deposited at a rate of 3 to 4 ⁇ /sec. In one embodiment, the material is deposited at a rate of 4 to 5 ⁇ /sec. In one embodiment, the material is deposited at a rate of 5 to 6 ⁇ /sec. In one embodiment, the material is deposited at a rate of 6 to 7 ⁇ /sec. In one embodiment, the material is deposited at a rate of 7 to 8 ⁇ /sec. In one embodiment, the material is deposited at a rate of 8 to 9 ⁇ /sec. In one embodiment, the material is deposited at a rate of 9 to 10 ⁇ /sec.
  • the final layer thickness is between 10 and 10000 nm. In one embodiment, the final layer thickness is between 10 and 1000 nm. In one embodiment, the final layer thickness is between 10 and 50 nm. In one embodiment, the final layer thickness is between 50 and 100 nm. In one embodiment, the final layer thickness is between 100 and 200 nm. In one embodiment, the final layer thickness is between 200 and 300 nm. In one embodiment, the final layer thickness is between 300 and 400 nm. In one embodiment, the final layer thickness is between 400 and 500 nm. In one embodiment, the final layer thickness is between 500 and 600 nm. In one embodiment, the final layer thickness is between 600 and 700 nm. In one embodiment, the final layer thickness is between 700 and 800 nm.
  • the final layer thickness is between 800 and 900 nm. In one embodiment, the final layer thickness is between 900 and 1000 nm. In one embodiment, the final layer thickness is between 1000 and 2000 nm. In one embodiment, the final layer thickness is between 2000 and 3000 nm. In one embodiment, the final layer thickness is between 3000 and 4000 nm. In one embodiment, the final layer thickness is between 4000 and 5000 nm. In one embodiment, the final layer thickness is between 5000 and 6000 nm. In one embodiment, the final layer thickness is between 6000 and 7000 nm. In one embodiment, the final layer thickness is between 7000 and 8000 nm. In one embodiment, the final layer thickness is between 8000 and 9000 nm. In one embodiment, the final layer thickness is between 9000 and 10000 nm.
  • the device is fabricated by vapor deposition of the buffer layer, the hole transport layer, and the photoactive layer, the electron transport layer, the electron injection layer, and the cathode.
  • the buffer layer is applied by vapor deposition. In one embodiment, it is deposited by thermal evaporation under vacuum. In one embodiment, the vacuum is less than 10 ⁇ 6 torr. In one embodiment, the vacuum is less than 10 ⁇ 7 torr. In one embodiment, the vacuum is less than 10 ⁇ 8 torr. In one embodiment, the material is heated to a temperature in the range of 100° C. to 400° C.; 150° C. to 350° C. preferably. In one embodiment, the material is deposited at a rate of 0.5 to 10 ⁇ /sec. In one embodiment, the material is deposited at a rate of 0.5 to 1 ⁇ /sec. In one embodiment, the material is deposited at a rate of 1 to 2 ⁇ /sec.
  • the material is deposited at a rate of 2 to 3 ⁇ /sec. In one embodiment, the material is deposited at a rate of 3 to 4 ⁇ /sec. In one embodiment, the material is deposited at a rate of 4 to 5 ⁇ /sec. In one embodiment, the material is deposited at a rate of 5 to 6 ⁇ /sec. In one embodiment, the material is deposited at a rate of 6 to 7 ⁇ /sec. In one embodiment, the material is deposited at a rate of 7 to 8 ⁇ /sec. In one embodiment, the material is deposited at a rate of 8 to 9 ⁇ /sec. In one embodiment, the material is deposited at a rate of 9 to 10 ⁇ /sec.
  • the final layer thickness is between 5 and 200 nm. In one embodiment, the final layer thickness is between 5 and 30 nm. In one embodiment, the final layer thickness is between 30 and 60 nm. In one embodiment, the final layer thickness is between 60 and 90 nm. In one embodiment, the final layer thickness is between 90 and 120 nm. In one embodiment, the final layer thickness is between 120 and 150 nm. In one embodiment, the final layer thickness is between 150 and 280 nm. In one embodiment, the final layer thickness is between 180 and 200 nm.
  • the hole transport layer is applied by vapor deposition. In one embodiment, it is deposited by thermal evaporation under vacuum. In one embodiment, the vacuum is less than 10 ⁇ 6 torr. In one embodiment, the vacuum is less than 10 ⁇ 7 torr. In one embodiment, the vacuum is less than 10 ⁇ 8 torr. In one embodiment, the material is heated to a temperature in the range of 100° C. to 400° C.; 150° C. to 350° C. preferably. In one embodiment, the material is deposited at a rate of 0.5 to 10 ⁇ /sec. In one embodiment, the material is deposited at a rate of 0.5 to 1 ⁇ /sec. In one embodiment, the material is deposited at a rate of 1 to 2 ⁇ /sec.
  • the material is deposited at a rate of 2 to 3 ⁇ /sec. In one embodiment, the material is deposited at a rate of 3 to 4 ⁇ /sec. In one embodiment, the material is deposited at a rate of 4 to 5 ⁇ /sec. In one embodiment, the material is deposited at a rate of 5 to 6 ⁇ /sec. In one embodiment, the material is deposited at a rate of 6 to 7 ⁇ /sec. In one embodiment, the material is deposited at a rate of 7 to 8 ⁇ /sec. In one embodiment, the material is deposited at a rate of 8 to 9 ⁇ /sec. In one embodiment, the material is deposited at a rate of 9 to 10 ⁇ /sec.
  • the final layer thickness is between 5 and 200 nm. In one embodiment, the final layer thickness is between 5 and 30 nm. In one embodiment, the final layer thickness is between 30 and 60 nm. In one embodiment, the final layer thickness is between 60 and 90 nm. In one embodiment, the final layer thickness is between 90 and 120 nm. In one embodiment, the final layer thickness is between 120 and 150 nm. In one embodiment, the final layer thickness is between 150 and 280 nm. In one embodiment, the final layer thickness is between 180 and 200 nm.
  • the photoactive layer is applied by vapor deposition. In one embodiment, it is deposited by thermal evaporation under vacuum. In one embodiment, the photoactive layer consists essentially of a single electroluminescent compound, which is deposited by thermal evaporation under vacuum. In one embodiment, the vacuum is less than 10 ⁇ 6 torr. In one embodiment, the vacuum is less than 10 ⁇ 7 torr. In one embodiment, the vacuum is less than 10 ⁇ 8 torr. In one embodiment, the material is heated to a temperature in the range of 100° C. to 400° C.; 150° C. to 350° C. preferably. In one embodiment, the material is deposited at a rate of 0.5 to 10 ⁇ /sec.
  • the material is deposited at a rate of 0.5 to 1 ⁇ /sec. In one embodiment, the material is deposited at a rate of 1 to 2 ⁇ /sec. In one embodiment, the material is deposited at a rate of 2 to 3 ⁇ /sec. In one embodiment, the material is deposited at a rate of 3 to 4 ⁇ /sec. In one embodiment, the material is deposited at a rate of 4 to 5 ⁇ /sec. In one embodiment, the material is deposited at a rate of 5 to 6 ⁇ /sec. In one embodiment, the material is deposited at a rate of 6 to 7 ⁇ /sec. In one embodiment, the material is deposited at a rate of 7 to 8 ⁇ /sec.
  • the material is deposited at a rate of 8 to 9 ⁇ /sec. In one embodiment, the material is deposited at a rate of 9 to 10 ⁇ /sec. In one embodiment, the final layer thickness is between 5 and 200 nm. In one embodiment, the final layer thickness is between 5 and 30 nm. In one embodiment, the final layer thickness is between 30 and 60 nm. In one embodiment, the final layer thickness is between 60 and 90 nm. In one embodiment, the final layer thickness is between 90 and 120 nm. In one embodiment, the final layer thickness is between 120 and 150 nm. In one embodiment, the final layer thickness is between 150 and 280 nm. In one embodiment, the final layer thickness is between 180 and 200 nm.
  • the photoactive layer comprises two electroluminescent materials, each of which is applied by thermal evaporation under vacuum. Any of the above listed vacuum conditions and temperatures can be used. Any of the above listed deposition rates can be used.
  • the relative deposition rates can be from 50:1 to 1:50. In one embodiment, the relative deposition rates are from 1:1 to 1:3. In one embodiment, the relative deposition rates are from 1:3 to 1:5. In one embodiment, the relative deposition rates are from 1:5 to 1:8. In one embodiment, the relative deposition rates are from 1:8 to 1:10. In one embodiment, the relative deposition rates are from 1:10 to 1:20. In one embodiment, the relative deposition rates are from 1:20 to 1:30. In one embodiment, the relative deposition rates are from 1:30 to 1:50.
  • the total thickness of the layer can be the same as that described above for a single-component photoactive layer.
  • the photoactive layer comprises one electroluminescent material and at least one host material, each of which is applied by thermal evaporation under vacuum. Any of the above listed vacuum conditions and temperatures can be used. Any of the above listed deposition rates can be used.
  • the relative deposition rate of electroluminescent material to host can be from 1:1 to 1:99. In one embodiment, the relative deposition rates are from 1:1 to 1:3. In one embodiment, the relative deposition rates are from 1:3 to 1:5. In one embodiment, the relative deposition rates are from 1:5 to 1:8. In one embodiment, the relative deposition rates are from 1:8 to 1:10. In one embodiment, the relative deposition rates are from 1:10 to 1:20. In one embodiment, the relative deposition rates are from 1:20 to 1:30.
  • the relative deposition rates are from 1:30 to 1:40. In one embodiment, the relative deposition rates are from 1:40 to 1:50. In one embodiment, the relative deposition rates are from 1:50 to 1:60. In one embodiment, the relative deposition rates are from 1:60 to 1:70. In one embodiment, the relative deposition rates are from 1:70 to 1:80. In one embodiment, the relative deposition rates are from 1:80 to 1:90. In one embodiment, the relative deposition rates are from 1:90 to 1:99.
  • the total thickness of the layer can be the same as that described above for a single-component photoactive layer.
  • the electron transport layer is applied by vapor deposition. In one embodiment, it is deposited by thermal evaporation under vacuum. In one embodiment, the vacuum is less than 10 ⁇ 6 torr. In one embodiment, the vacuum is less than 10 ⁇ 7 torr. In one embodiment, the vacuum is less than 10 ⁇ 8 torr. In one embodiment, the material is heated to a temperature in the range of 100° C. to 400° C.; 150° C. to 350° C. preferably. In one embodiment, the material is deposited at a rate of 0.5 to 10 ⁇ /sec. In one embodiment, the material is deposited at a rate of 0.5 to 1 ⁇ /sec. In one embodiment, the material is deposited at a rate of 1 to 2 ⁇ /sec.
  • the material is deposited at a rate of 2 to 3 ⁇ /sec. In one embodiment, the material is deposited at a rate of 3 to 4 ⁇ /sec. In one embodiment, the material is deposited at a rate of 4 to 5 ⁇ /sec. In one embodiment, the material is deposited at a rate of 5 to 6 ⁇ /sec. In one embodiment, the material is deposited at a rate of 6 to 7 ⁇ /sec. In one embodiment, the material is deposited at a rate of 7 to 8 ⁇ /sec. In one embodiment, the material is deposited at a rate of 8 to 9 ⁇ /sec. In one embodiment, the material is deposited at a rate of 9 to 10 ⁇ /sec.
  • the final layer thickness is between 5 and 200 nm. In one embodiment, the final layer thickness is between 5 and 30 nm. In one embodiment, the final layer thickness is between 30 and 60 nm. In one embodiment, the final layer thickness is between 60 and 90 nm. In one embodiment, the final layer thickness is between 90 and 120 nm. In one embodiment, the final layer thickness is between 120 and 150 nm. In one embodiment, the final layer thickness is between 150 and 280 nm. In one embodiment, the final layer thickness is between 180 and 200 nm.
  • the electron injection layer is applied by vapor deposition, as described above.
  • the cathode is applied by vapor deposition, as describe above.
  • the device is fabricated by vapor deposition of some of the organic layers, and liquid deposition of some of the organic layers. In one embodiment, the device is fabricated by liquid deposition of the buffer layer, and vapor deposition of all of the other layers
  • This example illustrates the preparation of an electroactive compound, Compound C.
  • tetrakistriphenylphosphine (363 mg, 5.00 mol %) and anhydrous toluene (10 mL) were combined in a round bottom flask.
  • the flask was sealed with a septum and removed from the glovebox.
  • the catalyst suspension was added to the reaction mixture via a cannula.
  • Water (30 mL) was added to the reaction vessel via syringe.
  • the nitrogen sparge was removed and replaced with a nitrogen blanket.
  • the reaction mixture was heated at 90° C. for 3 h. The reaction was allowed to cool to room temperature, transferred to a separatory funnel and diluted with ethyl acetate.
  • the Schlenk tube was inserted into an aluminum block and the block was heated and stirred on a hotplate/stirrer at a setpoint that resulted in an internal temperature of 60° C.
  • the catalyst system was held at 60° C. for 30 minutes and then raised to 70° C.
  • the monomer solution in toluene was added to the Schlenk tube and the tube was sealed.
  • the polymerization mixture was stirred at 70° C. for 18 h. After 18 h, the Schlenk tube was removed from the block and allowed to cool to room temperature. The tube was removed from the glovebox and the contents were poured into a solution of conc. HCl/MeOH (1.5% v/v conc. HCl).
  • 1,4-dibromo-2,5-dihexyl benzene (8.05 mmoles, 3.255 g), boronic ester 7 (17.7 mmoles, 7.545 g), Na 2 CO 3 (40.3 mmoles, 4.268 g) and Aliquat 336 (0.500 g) were suspended in toluene (100 mL) in a 250 mL two-necked-round-bottom-flask with stir bar and condenser. Reaction mixture degassed for 30 minutes. Pd(PPh 3 ) 4 (0.403 mmoles, 0.465 g) added as a powder to reaction mixture.
  • Reaction mixture degassed for a further 15 minutes, whilst simultaneously degassing water (50 mL). Water added via syringe to reaction vessel. Reaction heated to 90° C. for two days. Resulting reaction mixture diluted with ethyl acetate (150 mL), washed with ethyl acetate (3 ⁇ 100 mL). Organic layer washed with brine (2 ⁇ 100 mL), dried over magnesium sulfate, filtered and concentrated. Purification by column chromatography on silica gel using 1:3 dichloromethane: Hexanes to yield white powder (56%, 3.8 g).
  • reaction mixture was filtered through a pad of silica and celite, washed with toluene (2 ⁇ 200 mL) and concentrated to form brown solid. Purification by column chromatography on silica gel using 1:2 dichloromethane:hexanes, The product was washed with MeOH to give white powder (23%, 0.715 g).
  • the polymerization of compound 11 performed as described for compound C.
  • the polymer was obtained as a white solid.
  • Diamine 4 (mixture of 4,4′- and 4,5′-isomers) (1.75 g, 1.81 mmol), 14 (1.85 g, 4.52 mmol), bis(diphenylphosphinoferrocene) (50 mg, 0.91 mmol), tris(dibenzylideneacetone)dipalladium(0) (40 mg, 0.05 mmol), toluene (50 ml) and then sodium t-butoxide (0.44 g, 4.5 mmol) were weighed into a 250 mL round bottom flask in a nitrogen purged glovebox. The reaction vessel was capped, removed from the gloved box and equipped with a reflux condenser and nitrogen bubbler. The reaction was heated at 90° C.
  • the polymerization of 5 was carried out in a nitrogen purged glovebox.
  • Bis(1,5-cyclooctadiene)nickel(0) (0.277 g, 1.01 mmol) was added to a 25 ml Schlenk tube.
  • 2,2′-Dipyridyl (0.157 g, 1.01 mmol)
  • 1,5-cyclooctadiene (0.109 g, 1.01 mmol) were dissolved in 2 mL DMF. This solution was added to the nickel catalyst.
  • the catalyst solution was stirred and heated in an aluminum block at 60° C. for 30 minutes. The temperature of the heating block was raised to 70° C.
  • the monomer 16 was synthesized following the procedure outlined for compound 5 except that 4-vinyl-4′-bromobiphenyl was used instead of bromobiphenyl.
  • ditriflate 17 (3.2 g, 4.38 mmol) and 2-ethyl-4′-octyl-biphen-4-yl-amine (2.84 g, 9.19 mmol) were dissolved in toluene (60 mL) in a 200 mL of round bottom flask, followed by the addition of the toluene (10 mL) solution of tris(dibenzylideneacetone)dipalladium(0) (108 mg, 0.027 eq.) and 1,1′-bis(diphenylphosphino)ferrocene (128 mg, 0.053 eq) to the mixture.
  • diamine 18 (1 g, 0.935 mmol) and 4-bromo-4′-iodobiphenyl (1.026 g, 2.86 mmol) were dissolved in toluene (30 mL) in a 100 mL of round bottom flask, followed by the addition of the toluene (7 mL) solution of tris(dibenzylideneacetone)dipalladium(0) (24 mg, 0.027 eq.) and 1,1′-bis(diphenylphosphino)ferrocene (28 mg, 0.053 eq) to the mixture.
  • ditriflate 20 (1.7 g, 2.33 mmol) and 3-octylaniline (1 g, 4.89 mmol) were dissolved in toluene (20 mL) in a 100 mL of round bottom flask, followed by the addition of the toluene (10 mL) solution of tris(dibenzylideneacetone)dipalladium(0) (58 mg, 0.027 eq.) and 1,1′-bis(diphenylphosphino)ferrocene (68 mg, 0.053 eq) to the mixture.
  • ditriflate 23 (3 g, 4.11 mmol) and 3-octylaniline (1.77 g, 8.62 mmol) were dissolved in toluene (40 mL) in a 100 mL of round bottom flask, followed by the addition of the toluene (10 mL) solution of tris(dibenzylideneacetone)dipalladium(0) (102 mg, 0.027 eq.) and 1,1′-bis(diphenylphosphino)ferrocene (121 mg, 0.053 eq) to the mixture.
  • diamine 24 (1.2 g, 1.42 mmol) and 4-bromo-4′-iodobiphenyl (2.3 g, 6.42 mmol) were dissolved in toluene (30 mL) in a 100 mL of round bottom flask, followed by the addition of the toluene (8 mL) solution of tris(dibenzylideneacetone)dipalladium(0) (35 mg, 0.027 eq.) and 1,1′-bis(diphenylphosphino)ferrocene (42 mg, 0.053 eq) to the mixture.
  • a 4-neck one liter round bottom flask equipped with mechanical stirrer, thermometer and reflux condenser topped with nitrogen bubbler inlet was charged with 4-bromobiphenyl (23.31 g, 100 mmol) in acetic acid (400 mL), sulfuric acid (10 mL) and water (20 mL).
  • acetic acid 400 mL
  • sulfuric acid 10 mL
  • water 20 mL
  • iodic acid 4.84 g, 27.5 mmol
  • iodine chips 11.17 g, 44.0 mmol
  • Buffer 1 is an aqueous dispersion of polypyrrole and a polymeric fluorinated sulfonic acid. The material was prepared using a procedure similar to that described in Example 1 of published U.S. Patent application no. 2005/0205860.
  • This example demonstrates the fabrication and performance of a device having deep blue emission.
  • the device had the following layers:
  • OLED devices were fabricated by a combination of solution processing and thermal evaporation techniques.
  • Patterned indium tin oxide (ITO) coated glass substrates from Thin Film Devices, Inc were used. These ITO substrates are based on Corning 1737 glass coated with ITO having a sheet resistance of 50 ohms/square and 80% light transmission.
  • the patterned ITO substrates were cleaned ultrasonically in aqueous detergent solution and rinsed with distilled water.
  • the patterned ITO was subsequently cleaned ultrasonically in acetone, rinsed with isopropanol, and dried in a stream of nitrogen.
  • ITO substrates were treated with UV ozone for 10 minutes.
  • an aqueous dispersion of Buffer 1 was spin-coated over the ITO surface and heated to remove solvent.
  • the substrates were then spin-coated with a solution of the hole transport material, and then heated to remove solvent.
  • the substrates were spin-coated with the emissive layer solution, and heated to remove solvent.
  • the substrates were masked and placed in a vacuum chamber.
  • a ZrQ layer was deposited by thermal evaporation, followed by a layer of CsF.
  • Masks were then changed in vacuo and a layer of Al was deposited by thermal evaporation.
  • the chamber was vented, and the devices were encapsulated using a glass lid, desiccant, and UV curable epoxy.
  • the OLED samples were characterized by measuring their (1) current-voltage (I-V) curves, (2) electroluminescence radiance versus voltage, and (3) electroluminescence spectra versus voltage. All three measurements were performed at the same time and controlled by a computer.
  • the current efficiency of the device at a certain voltage is determined by dividing the electroluminescence radiance of the LED by the current density needed to run the device. The unit is a cd/A.
  • the power efficiency is the current efficiency divided by the operating voltage.
  • the unit is lm/W. The results are given in Table 1, below.
  • This example demonstrates the fabrication and performance of a device having deep blue emission.
  • the following materials were used:
  • OLED devices were fabricated by a combination of solution processing and thermal evaporation techniques.
  • Patterned indium tin oxide (ITO) coated glass substrates from Thin Film Devices, Inc were used. These ITO substrates are based on Corning 1737 glass coated with ITO having a sheet resistance of 50 ohms/square and 80% light transmission.
  • the patterned ITO substrates were cleaned ultrasonically in aqueous detergent solution and rinsed with distilled water.
  • the patterned ITO was subsequently cleaned ultrasonically in acetone, rinsed with isopropanol, and dried in a stream of nitrogen.
  • ITO substrates were treated with UV ozone for 10 minutes.
  • an aqueous dispersion of Buffer 1 was spin-coated over the ITO surface and heated to remove solvent.
  • the substrates were then spin-coated with a solution of the hole transport material, and then heated to remove solvent.
  • the substrates were masked and loaded into the vacuum chamber.
  • a 4:1 ratio of fluorescent host:dopant was co-evaporated to a thickness of 39 nm.
  • the substrates were masked and placed in a vacuum chamber.
  • a ZrQ layer was deposited by thermal evaporation, followed by a layer of CsF.
  • Masks were then changed in vacuo and a layer of Al was deposited by thermal evaporation.
  • the chamber was vented, and the devices were encapsulated using a glass lid, dessicant, and UV curable epoxy.
  • the OLED samples were characterized as described above.
  • This example demonstrates the fabrication and performance of a device having deep blue emission.
  • the following materials were used:
  • OLED devices were fabricated by a combination of solution processing and thermal evaporation techniques.
  • Patterned indium tin oxide (ITO) coated glass substrates from Thin Film Devices, Inc were used. These ITO substrates are based on Corning 1737 glass coated with ITO having a sheet resistance of 50 ohms/square and 80% light transmission.
  • the patterned ITO substrates were cleaned ultrasonically in aqueous detergent solution and rinsed with distilled water.
  • the patterned ITO was subsequently cleaned ultrasonically in acetone, rinsed with isopropanol, and dried in a stream of nitrogen.
  • ITO substrates were treated with UV ozone for 10 minutes.
  • an aqueous dispersion of Buffer 1 was spin-coated over the ITO surface and heated to remove solvent.
  • the substrates were then spin-coated with a solution of the hole transport material, and then heated to remove solvent.
  • the substrates were masked and loaded into the vacuum chamber.
  • a 6:1 ratio of fluorescent host:dopant was co-evaporated to a thickness of 32 nm.
  • the substrates were masked and placed in a vacuum chamber.
  • a ZrQ layer was deposited by thermal evaporation, followed by a layer of CsF.
  • Masks were then changed in vacuo and a layer of Al was deposited by thermal evaporation.
  • the chamber was vented, and the devices were encapsulated using a glass lid, dessicant, and UV curable epoxy.
  • the OLED samples were characterized as described above.
  • This example demonstrates the fabrication and performance of a device having deep blue emission.
  • the device had the following layers:
  • OLED devices were fabricated by a combination of solution processing and thermal evaporation techniques.
  • Patterned indium tin oxide (ITO) coated glass substrates from Thin Film Devices, Inc were used. These ITO substrates are based on Corning 1737 glass coated with ITO having a sheet resistance of 50 ohms/square and 80% light transmission.
  • the patterned ITO substrates were cleaned ultrasonically in aqueous detergent solution and rinsed with distilled water.
  • the patterned ITO was subsequently cleaned ultrasonically in acetone, rinsed with isopropanol, and dried in a stream of nitrogen.
  • ITO substrates were treated with UV ozone for 10 minutes.
  • an aqueous dispersion of Buffer 1 was spin-coated over the ITO surface and heated to remove solvent.
  • the substrates were then spin-coated with a solution of the hole transport material, and then heated to remove solvent.
  • the substrates were spin-coated with the emissive layer solution, and heated to remove solvent.
  • the substrates were masked and placed in a vacuum chamber.
  • a ZrQ layer was deposited by thermal evaporation, followed by a layer of CsF.
  • Masks were then changed in vacuo and a layer of Al was deposited by thermal evaporation.
  • the chamber was vented, and the devices were encapsulated using a glass lid, desiccant, and UV curable epoxy.
  • the OLED samples were characterized by measuring their (1) current-voltage (I-V) curves, (2) electroluminescence radiance versus voltage, and (3) electroluminescence spectra versus voltage. All three measurements were performed at the same time and controlled by a computer.
  • the current efficiency of the device at a certain voltage is determined by dividing the electroluminescence radiance of the LED by the current density needed to run the device. The unit is a cd/A.
  • the power efficiency is the current efficiency divided by the operating voltage.
  • the unit is lm/W. The results are given in Table 1, below.
  • This example demonstrates the fabrication and performance of a device having deep blue emission.
  • the following materials were used:
  • OLED devices were fabricated by a combination of solution processing and thermal evaporation techniques.
  • Patterned indium tin oxide (ITO) coated glass substrates from Thin Film Devices, Inc were used. These ITO substrates are based on Corning 1737 glass coated with ITO having a sheet resistance of 50 ohms/square and 80% light transmission.
  • the patterned ITO substrates were cleaned ultrasonically in aqueous detergent solution and rinsed with distilled water.
  • the patterned ITO was subsequently cleaned ultrasonically in acetone, rinsed with isopropanol, and dried in a stream of nitrogen.
  • ITO substrates were treated with UV ozone for 10 minutes.
  • an aqueous dispersion of Buffer 1 was spin-coated over the ITO surface and heated to remove solvent.
  • the substrates were then spin-coated with a solution of the hole transport material, and then heated to remove solvent.
  • the substrates were masked and loaded into the vacuum chamber.
  • a 4:1 ratio of fluorescent host:dopant was co-evaporated to a thickness of 39 nm.
  • the substrates were masked and placed in a vacuum chamber.
  • a ZrQ layer was deposited by thermal evaporation, followed by a layer of CsF.
  • Masks were then changed in vacuo and a layer of Al was deposited by thermal evaporation.
  • the chamber was vented, and the devices were encapsulated using a glass lid, dessicant, and UV curable epoxy.
  • This example demonstrates the fabrication and performance of a device having deep blue emission.
  • the following materials were used:
  • OLED devices were fabricated by a combination of solution processing and thermal evaporation techniques.
  • Patterned indium tin oxide (ITO) coated glass substrates from Thin Film Devices, Inc were used. These ITO substrates are based on Corning 1737 glass coated with ITO having a sheet resistance of 50 ohms/square and 80% light transmission.
  • the patterned ITO substrates were cleaned ultrasonically in aqueous detergent solution and rinsed with distilled water.
  • the patterned ITO was subsequently cleaned ultrasonically in acetone, rinsed with isopropanol, and dried in a stream of nitrogen.
  • ITO substrates were treated with UV ozone for 10 minutes.
  • an aqueous dispersion of Buffer 1 was spin-coated over the ITO surface and heated to remove solvent.
  • the substrates were then spin-coated with a solution of the hole transport material, and then heated to remove solvent.
  • the substrates were masked and loaded into the vacuum chamber.
  • a 4:1 ratio of fluorescent host:dopant was co-evaporated to a thickness of 39 nm.
  • the substrates were masked and placed in a vacuum chamber.
  • a ZrQ layer was deposited by thermal evaporation, followed by a layer of CsF.
  • Masks were then changed in vacuo and a layer of Al was deposited by thermal evaporation.
  • the chamber was vented, and the devices were encapsulated using a glass lid, dessicant, and UV curable epoxy.
  • This example demonstrates the fabrication and performance of a device having deep blue emission.
  • the device had the following layers:
  • OLED devices were fabricated by a combination of solution processing and thermal evaporation techniques.
  • Patterned indium tin oxide (ITO) coated glass substrates from Thin Film Devices, Inc were used. These ITO substrates are based on Corning 1737 glass coated with ITO having a sheet resistance of 50 ohms/square and 80% light transmission.
  • the patterned ITO substrates were cleaned ultrasonically in aqueous detergent solution and rinsed with distilled water.
  • the patterned ITO was subsequently cleaned ultrasonically in acetone, rinsed with isopropanol, and dried in a stream of nitrogen.
  • ITO substrates were treated with UV ozone for 10 minutes.
  • an aqueous dispersion of Buffer 1 was spin-coated over the ITO surface and heated to remove solvent.
  • the substrates were then spin-coated with a solution of the hole transport material, and then heated to remove solvent.
  • the substrates were spin-coated with the emissive layer solution, and heated to remove solvent.
  • the substrates were masked and placed in a vacuum chamber.
  • a ZrQ layer was deposited by thermal evaporation, followed by a layer of CsF.
  • Masks were then changed in vacuo and a layer of Al was deposited by thermal evaporation.
  • the chamber was vented, and the devices were encapsulated using a glass lid, desiccant, and UV curable epoxy.
  • the OLED samples were characterized by measuring their (1) current-voltage (I-V) curves, (2) electroluminescence radiance versus voltage, and (3) electroluminescence spectra versus voltage. All three measurements were performed at the same time and controlled by a computer.
  • the current efficiency of the device at a certain voltage is determined by dividing the electroluminescence radiance of the LED by the current density needed to run the device. The unit is a cd/A.
  • the power efficiency is the current efficiency divided by the operating voltage.
  • the unit is lm/W. The results are given in Table 1, below.
  • This example demonstrates the fabrication and performance of a device having deep blue emission.
  • the following materials were used:
  • OLED devices were fabricated by a combination of solution processing and thermal evaporation techniques.
  • Patterned indium tin oxide (ITO) coated glass substrates from Thin Film Devices, Inc were used. These ITO substrates are based on Corning 1737 glass coated with ITO having a sheet resistance of 50 ohms/square and 80% light transmission.
  • the patterned ITO substrates were cleaned ultrasonically in aqueous detergent solution and rinsed with distilled water.
  • the patterned ITO was subsequently cleaned ultrasonically in acetone, rinsed with isopropanol, and dried in a stream of nitrogen.
  • ITO substrates were treated with UV ozone for 10 minutes.
  • an aqueous dispersion of Buffer 1 was spin-coated over the ITO surface and heated to remove solvent.
  • the substrates were then spin-coated with a solution of the hole transport material, and then heated to remove solvent.
  • the substrates were masked and loaded into the vacuum chamber.
  • a 4:1 ratio of fluorescent host:dopant was co-evaporated to a thickness of 39 nm.
  • the substrates were masked and placed in a vacuum chamber.
  • a ZrQ layer was deposited by thermal evaporation, followed by a layer of CsF.
  • Masks were then changed in vacuo and a layer of Al was deposited by thermal evaporation.
  • the chamber was vented, and the devices were encapsulated using a glass lid, dessicant, and UV curable epoxy.

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