US6793405B1 - Optical module - Google Patents

Optical module Download PDF

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Publication number
US6793405B1
US6793405B1 US09/509,669 US50966900A US6793405B1 US 6793405 B1 US6793405 B1 US 6793405B1 US 50966900 A US50966900 A US 50966900A US 6793405 B1 US6793405 B1 US 6793405B1
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United States
Prior art keywords
optical
optical element
light
principal surface
optical module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US09/509,669
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English (en)
Inventor
Akihiro Murata
Shojiro Kitamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
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Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Assigned to SEIKO EPSON CORPORATION reassignment SEIKO EPSON CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KITAMURA, SHOJIRO, MURATA, AKIHIRO
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Publication of US6793405B1 publication Critical patent/US6793405B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73257—Bump and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Definitions

  • the present invention relates to an optical module which is formed by integrating an optical element, optical waveguide, or the like.
  • An optical module is a transducer from electrical energy to light, or from light to electrical energy.
  • An optical module is constituted in hybrid integrated form by an optical element, an optical waveguide, an electrical circuit, and the like.
  • An optical module is used, for example, in an optical fiber communications system.
  • FIG. 3 shows schematically the disposition of an optical waveguide and optical element in a conventional optical module. This is disclosed in the journal Optical Technology Contact Vol. 36, No. 4 (1998).
  • a depression 42 is provided on a principal surface of a mounting substrate 40 .
  • an optical element 44 On the principal surface of the mounting substrate 40 is fitted an optical waveguide 46 .
  • the end portion 48 of the optical waveguide 46 is positioned over the optical element 44 .
  • the end portion 48 forms a mirror.
  • Light 50 emitted by the optical element 44 is reflected by the end portion 48 , and enters the core 52 of the optical waveguide 46 .
  • the light 50 proceeds in the direction shown by an arrow within the core 52 , and is transmitted through the optical fiber or the like.
  • the objective of this invention is the provision of an optical module which can be made more compact and lightweight.
  • An optical module of this invention comprises:
  • a mounting member having a principal surface; an interconnect formed on the mounting member; and an optical element mounted on the principal surface and electrically connected to the interconnect,
  • the mounting member is an optical waveguide for guiding light emitted from the optical element or light admitted to the optical element.
  • this invention has the mounting member and optical waveguide as an integral member.
  • the optical module can therefore be made thinner. As a result, the optical module can be made more compact and lightweight.
  • the mounting member In a conventional optical module, there are three members involved in the positioning: the mounting member, the optical waveguide, and the optical element. On the other hand, in this invention there are two: the mounting member (optical waveguide) and the optical element. Therefore, in this invention, the optical element positioning is made easier, and the bonding accuracy can be improved.
  • a light-admitting aperture or light-emitting aperture of the optical element may be disposed opposing the principal surface.
  • Such an optical element may be, for example, a surface-emission laser.
  • a light-reflecting member may be provided on the optical waveguide. Through the light-reflecting member, light can be transmitted between the optical element and the optical waveguide.
  • An optical module of this invention comprises: an optical element for emitting or admitting light; and an optical waveguide having a principal surface, with the optical element mounted on the principal surface, for guiding light emitted from the optical element or light admitted to the optical element.
  • This aspect of the invention has the same effect as the aspect (1) of the invention.
  • the optical element and the optical waveguide may be fixed with an adhesive member having light transmitting characteristics interposed between the optical element and the optical waveguide in such a way that the position of emission or admission of light of the optical element opposes the optical waveguide, and be subjected to bare chip mounting.
  • Bare chip mounting allows more compact and lightweight design than with package mounting.
  • the optical module can be made more compact and lightweight.
  • the optical waveguide may have a modifying portion whereby the direction of progress of the light is changed; and the optical element may be positioned to overlie the modifying portion. By virtue of this, the direction of progress of the light can be efficiently changed.
  • the modifying portion is formed in the optical waveguide, and the optical element is directly mounted to the optical waveguide having the modifying portion.
  • the relative positioning (distance and the like) of the optical element and modifying portion can always be maintained constant, as a result of which there can be no loss of focus with respect to the modifying portion.
  • the optical element is not mounted directly on the optical waveguide, and therefore the optical waveguide and optical element are disposed separated from each other. For this reason, when both are fixed with respect to other elements, there is a possibility of relative movement between the two. Therefore, even if the positioning operation is achieved, thereafter there is the possibility of a change in the positioning caused by various influences (heat, external pressure, and the like).
  • the term “overlie” indicates that when seen projected from the optical element or modifying portion, both are disposed in positions such that it appears that both coincide.
  • the optical waveguide On the principal surface of the optical waveguide may be further mounted a semiconductor element in addition to the optical element, and the optical element and the semiconductor element may be integrally sealed with a resin.
  • the interconnect connecting the two may be made shorted.
  • the formation of the interconnect on the mounting substrate can be single layer, and the interconnect formation is made easier.
  • the optical element and semiconductor element are integrally sealed with a resin, the strength of the optical module can be improved.
  • the optical element and semiconductor element are hybrid, the degree of integration of the optical module can be improved. By the improvement of this degree of integration, the cost can be lowered.
  • the resin may have light blocking characteristics. If light impinges on the semiconductor element, faulty operation of the semiconductor element is possible. By sealing the semiconductor element with a resin having light blocking characteristics, faulty operation can be prevented.
  • the semiconductor element may have a function of driving the optical element.
  • the optical module can be made a module of high added value. A higher degree of integration of the optical module and a lower cost can also be achieved.
  • a circuit may be laminated directly on the principal surface of the optical waveguide. If a circuit is laminated directly on the principal surface of the optical waveguide, the mounting of the semiconductor element is not required. Therefore, it is no longer necessary to consider the reliability of connection between different components. In respect of connections between integrated circuit elements, the connections can be eliminated, and by virtue of this, the interconnect impedance characteristics and noise characteristics can be improved, while the effect of delays can be held to a minimum.
  • the degree of integration on the principal surface of the optical waveguide can be improved, and a high degree of integration of the optical module and low cost can be achieved.
  • An optical module of the invention comprises: an optical element; and a mounting member which has a function of an optical waveguide for guiding light emitted from the optical element or light admitted to the optical element and is electrically connected to the optical element or a semiconductor element associated therewith.
  • This aspect of the invention has the same effect as the aspect (1) of the invention.
  • An optical module of this invention comprises: a mounting member having a principal surface and a lateral surface; and an optical element mounted on the principal surface, wherein the mounting member has a function of an optical waveguide, and an optical input/output terminal for the optical waveguide is provided on the lateral surface of the mounting member.
  • an optical input/output terminal means a terminal at which light is input, or a terminal at which light is output, or a terminal at which light is input and/or output.
  • optical elements include both elements which emit light and elements which receive light.
  • the mounting member may be in plate, film, or other form, as long as it allows the optical element to be mounted.
  • FIG. 1 shows a schematic cross-section of one embodiment of the optical module of this invention
  • FIG. 2 shows a schematic plan view of one embodiment of the optical module of this invention.
  • FIG. 3 shows schematically the relative disposition of the optical waveguide and optical element of a conventional optical module.
  • FIG. 1 shows a schematic cross-section of one embodiment of the optical module of this invention.
  • FIG. 2 shows a schematic plan view thereof.
  • a glass mounting substrate 10 doubles as an optical waveguide.
  • a core 12 and cladding 14 extending along the surface for mounting an optical element on the mounting substrate 10 .
  • the core 12 and cladding 14 are formed within the mounting substrate 10 by using thin-film formation techniques, photolithography, or the like.
  • One end portion 18 of the optical waveguide forms a 45-degree mirror by which the light is bent through 90 degrees.
  • the 45-degree mirror is formed by using for example a 90-degree V-shape diamond saw, to machine the end portion 18 of the optical waveguide.
  • interconnects 16 a , 16 b , and 16 c are formed from a metal foil or the like.
  • the interconnects 16 a , 16 b , and 16 c are formed on the principal surface of the mounting substrate 10 , but these may equally be formed on a lateral surface of the mounting substrate 10 .
  • interconnects may be formed on the surface opposite to the principal surface of the mounting substrate 10 (the rear surface), and may be electrically connected to the principal surface through through holes or the like formed in the mounting substrate 10 .
  • the interconnects may be formed on any two or all of the principal surface, a lateral surface and the rear surface of the mounting substrate 10 . It should be noted that the largest surface of the mounting substrate 10 is commonly the principal surface, but even if not the largest surface, the surface on which it is possible to mount the optical element is the principal surface.
  • a semiconductor chip 20 is electrically connected by the flip-chip bonding to the interconnects 16 a and 16 c . That is to say, metal bumps are formed on the electrodes of the semiconductor chip 20 , and the semiconductor chip 20 is connected to the mounting substrate 10 forming the interconnect substrate by the face-down bonding.
  • the semiconductor chip 20 has a CMOS circuit, for example.
  • the interconnect 16 c forms an electrical input/output terminal.
  • one semiconductor chip 20 is fitted, but a plurality of semiconductor chips 20 may be fitted.
  • a plurality of semiconductor chips 20 may be fitted corresponding to a plurality of optical elements.
  • a surface-emission laser 22 is electrically connected to an interconnect 16 b by the flip-chip bonding.
  • an electrode 24 on one surface of the surface-emission laser 22 is formed electrodes 26 and a light-emitting aperture 28 .
  • the surface-emission laser 22 is disposed on the principal surface of the mounting substrate 10 so that light emitted from the aperture 28 is reflected by the end portion 18 , to pass along the core 12 .
  • the electrodes 26 and interconnect 16 b are electrically connected.
  • the emitting aperture 28 and electrodes 26 are sealed with a transparent resin 34 having light transmitting characteristics.
  • the transparent resin 34 is a silicone resin having light transmitting characteristics.
  • the electrode 24 is electrically connected to the interconnect 16 a by a wire 30 .
  • a plurality of surface-emission lasers 22 are provided as an example of a plurality of optical elements, but the present invention is not limited to this.
  • a single optical element may be provided, and this optical element may have a plurality of light-admitting apertures or light-emitting apertures.
  • a single optical element with a single light-admitting aperture or light-emitting aperture may also be provided.
  • the semiconductor chip 20 and surface-emission laser 22 are sealed with a resin 36 having light blocking characteristics.
  • the resin 36 is provided in such a way as not to impede the passage of light between the optical element (for example, the surface-emission laser 22 ) and the optical waveguide (for example the core 12 ).
  • the resin 36 is an epoxy resin.
  • the components of the epoxy resin are from 10 to 50 per cent epoxy and from 90 to 50 per cent filler (silica or the like).
  • three optical waveguides are aligned in parallel. That is to say, the three cores 12 forming the three optical waveguides are formed within the mounting substrate 10 .
  • the three cores 12 are disposed in parallel, and the optical output terminal 29 of each of their cores 12 (optical waveguides) are formed on the same lateral surface of the mounting substrate 10 .
  • the three surface-emission lasers 22 connected to the optical waveguides are mounted on the mounting substrate 10 at the end distant from the optical output terminals 29 .
  • the surface-emission laser 22 emits light 32 .
  • the light 32 is emitted from the emitting aperture 28 , and at the end portion 18 of the optical waveguide is reflected through 90 degrees. Then it proceeds along the center of the core 12 in the direction of the arrow, and is transmitted through the optical output terminal 29 to an optical fiber or the like.
  • the mounting substrate 10 doubles as an optical waveguide. Therefore, the optical module can be made thinner. As a result, the optical module can be made more compact and lightweight.
  • the mounting substrate 10 optical waveguide
  • the surface-emission laser 22 there are two items involved in the positioning: the mounting substrate 10 (optical waveguide) and the surface-emission laser 22 .
  • the bonding of the surface-emission laser and the optical waveguide which conventionally was complicated and time-consuming is simplified, and the bonding strength can also be improved. Additionally, the costs associated with bonding can be reduced.
  • the direction of the light is changed by a 45-degree mirror.
  • this is not limitative of the invention, and this any other component appropriate for changing the direction of the light may be applied in the invention.
  • the direction of the light is changed at the end portion of the waveguide.
  • the surface-emission laser 22 must inject light into the optical waveguide, and therefore the mounting position of the surface-emission laser 22 is restricted.
  • the semiconductor chip 20 can be mounted anywhere as long as it is on the principal surface of the mounting substrate 10 .
  • the surface-emission laser 22 and semiconductor chip 20 are mounted on the mounting substrate 10 by the flip-chip bonding.
  • the surface-emission laser 22 or semiconductor chip 20 may equally be mounted by face-up bonding or the like.
  • the semiconductor chip 20 is mounted on the mounting substrate 10 .
  • the mounting substrate 10 is made of glass. However, this is not limitative of the invention, and a polymer or suchlike film may be used for the mounting substrate 10 .
  • the surface-emission laser 22 constitutes an optical element.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Pivots And Pivotal Connections (AREA)
US09/509,669 1998-08-05 1999-07-22 Optical module Expired - Fee Related US6793405B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP23360898 1998-08-05
JP10-233608 1998-08-05
PCT/JP1999/003927 WO2000008505A1 (fr) 1998-08-05 1999-07-22 Module optique

Publications (1)

Publication Number Publication Date
US6793405B1 true US6793405B1 (en) 2004-09-21

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Country Status (6)

Country Link
US (1) US6793405B1 (fr)
EP (1) EP1020747A4 (fr)
KR (1) KR100489147B1 (fr)
CN (1) CN1287624A (fr)
TW (1) TW432236B (fr)
WO (1) WO2000008505A1 (fr)

Cited By (11)

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US20040033029A1 (en) * 2002-06-18 2004-02-19 Seiko Epson Corporation Optical communication module, optical-communication-module production method, and electronic device
US20040190832A1 (en) * 2003-03-27 2004-09-30 Infineon Technologies Ag Optical coupling unit
US20050053336A1 (en) * 2003-07-16 2005-03-10 Masataka Ito Protective sealing of optoelectronic modules
US20070058922A1 (en) * 2005-09-13 2007-03-15 Cho In K Optical waveguide master and method of manufacturing the same
US7248768B2 (en) 2005-09-30 2007-07-24 Doosan Corporation Optical interconnection module and method of manufacturing the same
US20080075408A1 (en) * 2006-09-27 2008-03-27 In Kui Cho Structure and method for optical connection between optical transmitter and optical receiver
US20090232443A1 (en) * 2005-02-28 2009-09-17 Nec Corporation Connection structure of two-dimensional array optical element and optical circuit
US20100104246A1 (en) * 2008-10-28 2010-04-29 Nitto Denko Corporation Manufacturing method of opto-electric hybrid module and opto-electric hybrid module manufactured thereby
US20100171023A1 (en) * 2006-08-10 2010-07-08 Panasonic Electric Works, Co., Ltd. Photoelectric converter
US8045829B2 (en) 2005-12-02 2011-10-25 Kyocera Corporation Optical waveguide member, optical wiring board, optical wiring module and method for manufacturing optical waveguide member and optical wiring board
US11262605B2 (en) * 2017-08-31 2022-03-01 Lightwave Logic Inc. Active region-less polymer modulator integrated on a common PIC platform and method

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TW460717B (en) * 1999-03-30 2001-10-21 Toppan Printing Co Ltd Optical wiring layer, optoelectric wiring substrate mounted substrate, and methods for manufacturing the same
JP3890999B2 (ja) 2002-02-14 2007-03-07 住友電気工業株式会社 光送信モジュール
KR100523992B1 (ko) * 2002-03-19 2005-10-26 학교법인 한국정보통신학원 광연결을 가지는 다칩 모듈 구조
KR100492697B1 (ko) * 2002-11-14 2005-06-07 학교법인 한국정보통신학원 조립형 렌즈를 이용한 광 연결 방법
JP2005115346A (ja) 2003-09-17 2005-04-28 Fujitsu Ltd 光導波路構造体及び光モジュール
KR100583646B1 (ko) * 2003-12-24 2006-05-26 한국전자통신연구원 병렬 광접속 모듈용 광접속 장치 및 이를 이용한 병렬광접속 모듈
JP4506216B2 (ja) * 2004-03-16 2010-07-21 ソニー株式会社 光結合装置及びその製造方法
CN101176024B (zh) * 2005-05-19 2010-10-27 株式会社藤仓 连接器座、带连接器座的光电转换器、光连接器固定结构、以及连接器座的组装方法
JP4760127B2 (ja) * 2005-05-20 2011-08-31 住友ベークライト株式会社 光導波路構造体
JP4760126B2 (ja) * 2005-05-20 2011-08-31 住友ベークライト株式会社 光導波路構造体
JP4668049B2 (ja) * 2005-12-02 2011-04-13 京セラ株式会社 光配線モジュール
JP2007178950A (ja) * 2005-12-28 2007-07-12 Kyocera Corp 光配線基板および光配線モジュール
US7492982B2 (en) 2006-02-06 2009-02-17 Samsung Electronics Co., Ltd. Optical module
KR100770853B1 (ko) 2006-02-09 2007-10-26 삼성전자주식회사 광 모듈
JP4983269B2 (ja) * 2007-01-18 2012-07-25 オムロン株式会社 光伝送モジュール、電子機器、及び光伝送モジュールの製造方法
KR100871252B1 (ko) * 2007-01-19 2008-11-28 삼성전자주식회사 광섬유를 이용한 광/전기 배선을 갖는 연성 인쇄회로기판
JP4762937B2 (ja) * 2007-03-06 2011-08-31 古河電気工業株式会社 光部品の実装方法
JP5029343B2 (ja) * 2007-12-18 2012-09-19 凸版印刷株式会社 光基板の製造方法
JP5262118B2 (ja) * 2008-01-10 2013-08-14 日立電線株式会社 光モジュールの製造方法
JP2009223340A (ja) * 2009-07-06 2009-10-01 Mitsubishi Electric Corp 光学部品、およびそれに用いられる光路変換デバイス
JP4793490B2 (ja) * 2009-12-16 2011-10-12 ソニー株式会社 光結合装置及びその製造方法
JP6231608B2 (ja) * 2016-04-21 2017-11-15 日本電信電話株式会社 光電子集積回路の実装方法

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KR100489147B1 (ko) 2005-05-17
TW432236B (en) 2001-05-01
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CN1287624A (zh) 2001-03-14
EP1020747A1 (fr) 2000-07-19
KR20010024407A (ko) 2001-03-26

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