US20190055433A1 - Uv-crosslinked hot-melt pressure-sensitive adhesive used for polyvinyl-chloride insulated adhesive tape - Google Patents

Uv-crosslinked hot-melt pressure-sensitive adhesive used for polyvinyl-chloride insulated adhesive tape Download PDF

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Publication number
US20190055433A1
US20190055433A1 US16/074,608 US201616074608A US2019055433A1 US 20190055433 A1 US20190055433 A1 US 20190055433A1 US 201616074608 A US201616074608 A US 201616074608A US 2019055433 A1 US2019055433 A1 US 2019055433A1
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Prior art keywords
adhesive tape
acrylate
sensitive adhesive
melt pressure
antioxidant
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Abandoned
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US16/074,608
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English (en)
Inventor
Feng Wang
Shuqin QI
Shuang Li
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hebei Yongle Tape Co Ltd
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Hebei Yongle Tape Co Ltd
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Application filed by Hebei Yongle Tape Co Ltd filed Critical Hebei Yongle Tape Co Ltd
Publication of US20190055433A1 publication Critical patent/US20190055433A1/en
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
    • C08L27/06—Homopolymers or copolymers of vinyl chloride
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0893—Zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0869—Acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/025—Polyesters derived from dicarboxylic acids and dihydroxy compounds containing polyether sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C09J2205/102—
    • C09J2205/114—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
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    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
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    • C09J2433/00—Presence of (meth)acrylic polymer
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/10—Process efficiency

Definitions

  • the present invention relates to the field of chemical and chemical engineering technologies, specifically to a UV-crosslinked hot-melt pressure-sensitive adhesive used for a polyvinyl chloride (PVC) insulation adhesive tape, and more specifically to a novel UV-crosslinked hot-melt pressure-sensitive adhesive used for soft PVC insulation adhesive tapes (including regular electric insulation adhesive tapes for civil use and automobile cable bundling insulation adhesive tapes).
  • PVC polyvinyl chloride
  • the organic solvent will be further volatized into the environment, leading to a pollution; in the field of automobile cable wrapping and bundling, it has been specified, due to the implementation of environmental protection laws and regulations and strengthened environmental protection and health awareness of the public, that products used for automobile cables must satisfy the requirements by national environmental protection laws and regulations and the requirements for environmental protection in the automobile industry.
  • the European Commission has also promulgated the requirements in the Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (the ROHS Directive).
  • the ROHS Directive the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment
  • the adhesive set forth in the patent has excellent performance in resistance to migration of plasticizers from a soft PVC substrate to the adhesive. After a long-term storage or baking at high temperature of 60-80° C., plasticizers in the substrate diffuse and migrate to the adhesive layer, but the performance of the adhesive tape does not deteriorate significantly. The adhesive tape can still maintain excellent performance and completely meet the use requirements. Since the water-soluble adhesive does not contain a solvent, it is very environmentally friendly. However, its high temperature resistance is not very good, and the coating equipment takes up a large area and has a high energy consumption.
  • hot-melt pressure-sensitive adhesives in particular UV-crosslinked hot-melt pressure-sensitive adhesives
  • hot-melt pressure-sensitive adhesives have been extensively used in the field of automobile cable bundling tapes due to the characteristics that they are resistant to high temperature, resistant to solvents, and environmentally friendly.
  • the hot-melt coating equipment takes up a small area and has a low energy consumption.
  • the UV-crosslinked hot-melt pressure-sensitive adhesives that are popular on the market e.g. Novamelt® RC21171 and the like
  • the present invention provides a UV-crosslinked hot-melt pressure-sensitive adhesive used for a PVC insulation adhesive tape, and more specifically provides a novel UV-crosslinked hot-melt pressure-sensitive adhesive used for a soft PVC insulation adhesive tape, which overcomes the drawback of high energy consumption when a solvent-type adhesive is coated and achieves significant social benefits in the aspect of production energy saving; the problem that the adhesive in CN 101372607B cannot withstand high temperature is solved.
  • An automobile cable soft PVC adhesive tape made with the UV-crosslinked hot-melt pressure-sensitive adhesive according to the present invention achieves significant breakthroughs in resistance to high temperature, its long-term temperature resistance level reaches 125° C., its highest short-time temperature tolerance can reach up to 150° C., and it can be used in high temperature positions inside an automobile engine compartment.
  • the UV-crosslinked hot-melt pressure-sensitive adhesive used for a PVC insulation adhesive tape comprises the following major components: polymers containing vinyl monomers, functional monomers, soft monomers, and photoinitiators, a polymerization initiator, and an antioxidant.
  • the UV-crosslinked hot-melt pressure-sensitive adhesive used for a PVC insulation adhesive tape according to the present invention further comprises a copolymer of one or more polymerizable photosensitive initiators and acrylate monomers, or comprises a mixture of oligomers of one or more polymerizable photosensitive initiators and acrylate high polymers.
  • the vinyl monomer is selected from a group consisting of one or more n-butyl acrylate, 2-ethylhexyl acrylate, n-octyl acrylate, isobornyl acrylate, n-dodecyl acrylate, methyl n-butyl acrylate, methyl 2-ethylhexyl acrylate, and methyl n-octyl acrylate, and the amount of the vinyl monomer is 40-65% of the total amount.
  • the functional monomer is a nitrogen-containing functional monomer, preferably N-vinylpyrrolidone, and the amount thereof is 2-10% of the total amount.
  • the soft monomer is C17 acrylate or methyl acrylate, and the amount of the vinyl monomer is 5-15% of the total amount.
  • the photoinitiator is methacryloyloxy or acryloyloxy containing acetophenone or benzophenone derivatives (e.g. 2-hydroxy-4-(methacryloyloxy) benzophenone and the like), and the amount of the vinyl monomer is 2-10% of the total amount.
  • the UV-crosslinked hot-melt pressure-sensitive adhesive used for a PVC insulation adhesive tape according to the present invention further comprises a tackifying resin, the tackifying resin comprising one or more selected from the group consisting of rosin resins, terpene resins, petroleum resins, and corresponding hydrogenated or esterified modified resins.
  • the amount of the tackifying resin is 2-20% of the total amount.
  • the polymerization initiator comprises azo compounds, acyl peroxides, and alkyl peroxides, the azo compound being 2,2-azobisisobutyronitrile, and the acyl peroxides and alkyl peroxides being benzoyl peroxide, didecanoyl peroxide or isononanoyl peroxide, and benzotriazole-1-yl-oxy-tris(dimethylamino) phosphonium hexafluorophosphate.
  • the amount of the polymerization initiator is 1-10% of the total amount.
  • the antioxidant is an aromatic antioxidant, a hindered phenol antioxidant, or a secondary antioxidant.
  • the amount thereof is 0.5-1.5% of the total amount.
  • the antioxidant is dianiline, p-dianiline, antioxidant 1010, or antioxidant 1076.
  • the adhesion of the adhesive according to the present invention to a PVC substrate is enhanced, and the difficult problem that an adhesive tends to fall apart from a PVC adhesive tape at high temperature is overcome; by adding multi-carbon special soft monomers into the adhesive according to the present invention, the flexibility of the adhesive is improved.
  • composition of the UV-crosslinked hot-melt pressure-sensitive adhesive according to the present invention further comprises a copolymer of one or more polymerizable photosensitive initiators and acrylate monomers, or further comprises a mixture of oligomers of one or more polymerizable photosensitive initiators and acrylate high polymers.
  • the oligomers that contain polymerizable photosensitive initiators can lower the viscosity of the hot-melt pressure-sensitive adhesive, then lower the coating temperature, and better protect the PVC substrate that tends to deform at high temperature.
  • N-vinylpyrrolidone N-vinylpyrrolidone
  • n-butyl acrylate isooctyl acrylate
  • acrylic acid methyl acrylate
  • hydroxy ethyl acrylate hydroxy propyl acrylate
  • C17 acrylate or methacrylate is added into the adhesive according to the present invention.
  • the UV-crosslinked hot-melt pressure-sensitive adhesive according to the present invention must further comprise one or more photosensitive initiators, and the most commonly used photosensitive initiators are derivatives of acetophenone and benzophenone.
  • a photosensitive initiator Under the UV irradiation, more specifically under the UVC radiation, a photosensitive initiator generates free radicals, such that the acrylate monomers in the adhesive according to the present invention are further polymerized and the acrylate polymers are cross-linked to be cured.
  • Polymerizable photosensitive initiators are methacryloyloxy or acryloyloxy containing acetophenone or benzophenone derivatives, such as 2-hydroxy-4-(methacryloyloxy) benzophenone.
  • the use of a photosensitive initiator having high molecular weight in the composition of the UV-crosslinked hot-melt pressure-sensitive adhesive can further lower the volatility of the adhesive layer and enable the adhesive according to the present invention to better satisfy environmental protection requirements.
  • the tackifying resin contained in the adhesive according to the present invention comprises rosin resins, terpene resins, petroleum resins, and corresponding hydrogenated or esterified modified resins.
  • a proper amount of an anti-aging agent is typically further added.
  • the antioxidant contained in the adhesive according to the present invention is an aromatic antioxidant, a hindered phenol antioxidant, or a secondary antioxidant, for example, dianiline, p-dianiline antioxidant 1010, and antioxidant 1076.
  • the polymerization initiator contained in the adhesive according to the present invention comprises azo compounds, ketone peroxides, and alkyl peroxides; and the solvent used in the adhesive according to the present invention is ethyl acetate, ketones (e.g., acetone, and methyl ethyl ketone), alcohols (e.g., methanol, ethanol, propanol, butanol, and isobutanol), toluene, xylene, or a mixture of the above solvents.
  • ketones e.g., acetone, and methyl ethyl ketone
  • alcohols e.g., methanol, ethanol, propanol, butanol, and isobutanol
  • toluene xylene, or a mixture of the above solvents.
  • the UV-crosslinked hot-melt pressure-sensitive adhesive according to the present invention can achieve at least one of the following advantageous effects: 1. Environmentally friendly and excellent temperature resistance; 2. Applicable for wrapping and bundling of electric cables at different positions in an automobile body, in particular capable of satisfying the requirement for uses on high temperature-resistant positions of an engine inside the automobile, and reaching a long-term temperature resistance level of 125° C.
  • Preparation of a high temperature resistant PVC adhesive tape complete the preparation with a slot die coating or a rolling or laminating coating process on a hot-melt coating machine, install a high temperature resistant PVC substrate on an unwinding shaft, and drag it to a winding shaft.
  • the coating amount of the hot-melt pressure-sensitive adhesive is 18 g/m 2
  • the adhesive layer is crosslinked and cured by UV irradiation with a group of UV lamps.
  • the UV lamps that are used include high-pressure mercury lamps, medium to low-pressure mercury lamps, or LED lamps, and the minimum UV irradiation energy thereof needs to reach 10 mJ/cm 2 .
  • the crosslinked and cured adhesive tape is wound and divided to obtain the high temperature resistant PVC adhesive tape product.
  • Preparation of a high polymer (A) add 30% (wt) ethyl acetate into a reactor, heat to boil and maintain for 30 min, mix 63% (wt) n-butyl acrylate (BA), 3.5% (wt) acrylic acid (AA), and 3.5% (wt) benzotriazole-1-yl-oxy-tris(dimethyl amino) phosphonium hexafluorophosphate (BOP) and add dropwise the mixture into the reactor, fill the reactor with nitrogen for protection, and complete the dropwise addition within 1 h. After the titration is completed, continue to heat for 4 h; at 4 h, maintain the heating state, vacuumize the reactor, and discharge the high polymer (A) for later use;
  • BA n-butyl acrylate
  • AA acrylic acid
  • BOP benzotriazole-1-yl-oxy-tris(dimethyl amino) phosphonium hexafluorophosphate
  • Preparation of an oligomer (B) add 50% (wt) toluene into a reactor, heat to boil and maintain for 30 min, mix 33% (wt) n-butyl acrylate (BA), 1.5% (wt) acrylic acid (AA), 5% (wt) acryloyloxy acetophenone as a photo-initiator, 2.5% (wt) benzotriazole-1-yl-oxy-tris(dimethyl amino) phosphonium hexafluorophosphate (BOP), 5% (wt) C17 acrylate (from BASF), and 2% (wt) N-vinylpyrrolidone (NVP), and add dropwise the mixture into the reactor, and complete the dropwise addition within 2 h.
  • BA n-butyl acrylate
  • AA acrylic acid
  • AA 5%
  • acryloyloxy acetophenone as a photo-initiator
  • BOP benzotriazole-1-yl
  • Embodiment 3 heat 95% (wt) Embodiment 1 and 5% (wt) hydrogenated petroleum resin Regalite® 1090 (Eastman, USA) to 130° C., stir thoroughly, and mix homogeneously to prepare the product; use the same method as the one in Embodiment 1 to obtain the high temperature resistant PVC adhesive tape.
  • a pressure-sensitive adhesive add 45 g of a commercially available polyvinyl acetate emulsion into 300 g of the acrylate copolymer emulsion synthesized above, mix homogeneously, and then use ammonia to adjust the pH to 7-8 to obtain a desired emulsion pressure-sensitive adhesive, which has a solid content of 53%;
  • Performance testing coat the obtained emulsion pressure-sensitive adhesive on a 0.15 mm-thick soft PVC (SPVC) film substrate to prepare small rolls of an electric pressure-sensitive adhesive tape with a dry adhesive layer thickness of 20 ⁇ m; cure for 8 h in a 70° C. environment, then test various properties of the adhesive tape, and test the adhesive tape's 180° peel strength according to the Chinese national standard GB/T2792-1998.
  • SPVC soft PVC
  • the tack, 180° peel strength, and low-speed unwinding strength of the pressure-sensitive adhesive tapes in Table 1 are determined using methods according to Chinese national standards GB/T 4852-1984, GB/T 8451-1998, GB/T2792-1998, and GB/T4850-1984, respectively;
  • the method for determining temperature stability is as follows: use a pressure-sensitive adhesive tape to wind around cables, age for 24 h at 150° C., observe whether the aged cables have curled tapes at the edge or have loose tapes, or whether there is overflown adhesive liquid, and determine that the pressure-sensitive adhesive tape is qualified when the tape is not curled, the tape does not become loose, or there is no overflown adhesive liquid;
  • the method for determining flexibility is: treat an adhesive tape (having a width of 19-25 mm) with a length of at least 10 m wound around a paper core (having an outer diameter of 36 mm and a paper core wall thickness of 3-4 mm) at 20 ⁇ 1° C.
  • Embodiments 1-3 and Comparative Embodiments 1-2 that the soft PVC adhesive tapes made with the UV-crosslinked hot-melt pressure-sensitive adhesive used for soft PVC insulation adhesive tapes have significantly higher temperature resistance than that of the adhesive tapes made with the emulsion-type pressure-sensitive adhesive.
  • the use of the functional monomers improves the adhesive's adhesion to the PVC substrate and resistance to plasticizers.
  • the addition and use of the special soft monomers improves the flexibility of the PVC adhesive tapes.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Organic Insulating Materials (AREA)
US16/074,608 2016-02-03 2016-05-12 Uv-crosslinked hot-melt pressure-sensitive adhesive used for polyvinyl-chloride insulated adhesive tape Abandoned US20190055433A1 (en)

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CN201610073413.1A CN105694750A (zh) 2016-02-03 2016-02-03 一种新型耐高温聚氯乙烯胶带的制作方法
CN201610073413.1 2016-02-03
PCT/CN2016/081908 WO2017133121A1 (fr) 2016-02-03 2016-05-12 Adhésif sensible à la pression, fusible, réticulé par uv pour bande adhésive isolée de chlorure de polyvinyle

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US16/074,965 Abandoned US20190040288A1 (en) 2016-02-03 2016-05-12 Method for manufacturing high-temperature-resistant polyvinyl-chloride adhesive tape
US17/145,537 Pending US20210371709A1 (en) 2016-02-03 2021-01-11 Uv-crosslinked hot-melt pressure-sensitive adhesive used for polyvinyl chloride insulation adhesive tape
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