US20170051184A1 - Pressure-sensitive adhesive composition - Google Patents

Pressure-sensitive adhesive composition Download PDF

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Publication number
US20170051184A1
US20170051184A1 US15/308,537 US201615308537A US2017051184A1 US 20170051184 A1 US20170051184 A1 US 20170051184A1 US 201615308537 A US201615308537 A US 201615308537A US 2017051184 A1 US2017051184 A1 US 2017051184A1
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United States
Prior art keywords
sensitive adhesive
pressure
composition
film
butylene
Prior art date
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Abandoned
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US15/308,537
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English (en)
Inventor
Hyun Jee Yoo
Hyun Suk Kim
Jung Ok MOON
Se Woo YANG
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LG Chem Ltd
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LG Chem Ltd
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Assigned to LG CHEM, LTD. reassignment LG CHEM, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, HYUN SUK, MOON, JUNG OK, YANG, SE WOO, YOO, HYUN JEE
Publication of US20170051184A1 publication Critical patent/US20170051184A1/en
Abandoned legal-status Critical Current

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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the pressure-sensitive adhesive composition of the present application may be formed in an encapsulation film, for example, which seals the entire surfaces of an organic electronic element of the OED so as to protect the element from moisture or oxygen.
  • a pressure-sensitive adhesive composition may include a polymer derived from butylene and a compound satisfying Formula 1 shown below.
  • the compound of Formula 1 may include a monofunctional acrylate.
  • Such a moisture scavenger may be controlled in a suitable size according to use.
  • an average particle size of the moisture scavenger may be controlled to about 10 to 15000 nm.
  • the moisture scavenger having a size in the above range may be easily stored since a reaction speed of the moisture scavenger with moisture is not so fast, and effectively remove moisture without damage to an element to be encapsulated.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
US15/308,537 2015-02-04 2016-02-04 Pressure-sensitive adhesive composition Abandoned US20170051184A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20150017620 2015-02-04
KR10-2015-0017620 2015-02-04
PCT/KR2016/001269 WO2016126129A1 (ko) 2015-02-04 2016-02-04 점착제 조성물

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US20170051184A1 true US20170051184A1 (en) 2017-02-23

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Application Number Title Priority Date Filing Date
US15/309,153 Abandoned US20170077440A1 (en) 2015-02-04 2016-02-04 Pressure-sensitive adhesive composition
US15/308,800 Active US10074827B2 (en) 2015-02-04 2016-02-04 Encapsulation film
US15/308,537 Abandoned US20170051184A1 (en) 2015-02-04 2016-02-04 Pressure-sensitive adhesive composition
US15/308,325 Active 2036-04-29 US10355239B2 (en) 2015-02-04 2016-02-04 Encapsulation film

Family Applications Before (2)

Application Number Title Priority Date Filing Date
US15/309,153 Abandoned US20170077440A1 (en) 2015-02-04 2016-02-04 Pressure-sensitive adhesive composition
US15/308,800 Active US10074827B2 (en) 2015-02-04 2016-02-04 Encapsulation film

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US15/308,325 Active 2036-04-29 US10355239B2 (en) 2015-02-04 2016-02-04 Encapsulation film

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US (4) US20170077440A1 (ko)
EP (4) EP3147338B1 (ko)
JP (5) JP6586107B2 (ko)
KR (4) KR101822254B1 (ko)
CN (4) CN106795400B (ko)
TW (4) TWI612112B (ko)
WO (4) WO2016126130A1 (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10714708B2 (en) 2018-02-01 2020-07-14 Samsung Display Co., Ltd. Display and method of manufacturing the same
US20220136109A1 (en) * 2019-04-12 2022-05-05 Epiluvac Ab Device and method to provide planarity of a wafer during growth
US20220216451A1 (en) * 2021-01-07 2022-07-07 Samsung Display Co., Ltd. Apparatus and method for manufacturing display device
US11955355B2 (en) * 2021-02-25 2024-04-09 Applied Materials, Inc. Isolated volume seals and method of forming an isolated volume within a processing chamber

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150016878A (ko) * 2013-08-05 2015-02-13 주식회사 엘지화학 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법
CN104658990B (zh) * 2015-03-02 2017-05-17 京东方科技集团股份有限公司 一种封装件及其制备方法
CN114973928B (zh) 2016-04-29 2024-08-02 三星显示有限公司 显示设备
KR102159497B1 (ko) * 2016-08-22 2020-09-25 주식회사 엘지화학 점착제 조성물
KR102146529B1 (ko) * 2016-08-22 2020-08-20 주식회사 엘지화학 점착제 조성물
US20200172771A1 (en) * 2016-09-23 2020-06-04 Lg Chem, Ltd. Adhesive composition
WO2018159377A1 (ja) * 2017-02-28 2018-09-07 日東電工株式会社 画像表示装置および該画像表示装置の製造方法
CN109148732B (zh) * 2017-06-19 2020-08-18 Tcl科技集团股份有限公司 一种基于金属粒子与有机小分子交联的器件封装方法
JP2019014888A (ja) * 2017-07-06 2019-01-31 三菱ケミカル株式会社 樹脂組成物、シート、それを用いた積層体、画像表示装置
CN107201190B (zh) * 2017-07-13 2020-07-17 深圳市新创源电子材料有限公司 一种电子贴片封装薄膜材料及其制备方法、应用
JP7170387B2 (ja) * 2017-08-21 2022-11-14 リンテック株式会社 粘着シートおよび表示体
KR101962195B1 (ko) * 2017-08-22 2019-03-26 (주)이녹스첨단소재 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
KR101962743B1 (ko) * 2017-08-22 2019-03-27 (주)이녹스첨단소재 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
KR101999792B1 (ko) * 2017-08-22 2019-07-12 (주)이녹스첨단소재 유기전자장치 봉지재용 접착조성물 및 이를 포함하는 유기전자장치 봉지재용 접착필름
KR102398554B1 (ko) * 2017-08-31 2022-05-17 엘지디스플레이 주식회사 봉지층을 포함하는 유기 발광 표시 장치
EP3683264A4 (en) * 2017-09-12 2020-07-29 LG Chem, Ltd. ENCLOSURE COMPOSITION
KR102475857B1 (ko) 2017-09-18 2022-12-12 삼성디스플레이 주식회사 플렉서블 표시 장치
JP6566324B2 (ja) * 2017-09-29 2019-08-28 サイデン化学株式会社 粘着シート
US20190256743A1 (en) * 2017-10-17 2019-08-22 Jeffrey R. Bowers Pressure Sensitive Adhesives Including (Meth)Acrylates and Rubber
CN107785503B (zh) * 2017-10-24 2019-03-08 京东方科技集团股份有限公司 金属封装结构及制备方法、显示面板的封装方法、显示装置
KR102271843B1 (ko) 2017-12-18 2021-07-01 주식회사 엘지화학 봉지 필름
US20210343977A1 (en) * 2018-09-03 2021-11-04 Lg Chem, Ltd. Encapsulation film
CN109309172A (zh) * 2018-10-11 2019-02-05 信利半导体有限公司 柔性oled器件及其制造方法、显示装置
KR102335253B1 (ko) * 2018-11-05 2021-12-03 주식회사 엘지화학 봉지 필름
CN112996877B (zh) * 2018-11-12 2024-01-05 株式会社Lg化学 封装组合物
US20220010116A1 (en) * 2018-11-14 2022-01-13 Denka Company Limited Composition
KR20200070140A (ko) * 2018-12-07 2020-06-17 주식회사 엘지화학 봉지 조성물
CN109830619B (zh) * 2019-01-28 2021-02-26 信利半导体有限公司 柔性显示器件的制作方法及柔性显示器件
JP7346907B2 (ja) * 2019-05-21 2023-09-20 王子ホールディングス株式会社 粘着シート、剥離シート付き粘着シート及び積層体の製造方法
KR102183612B1 (ko) * 2019-07-02 2020-11-26 (주)이녹스첨단소재 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
KR102248284B1 (ko) * 2019-07-05 2021-05-04 (주)이녹스첨단소재 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
CN112909198B (zh) * 2019-11-19 2024-02-02 利诺士尖端材料有限公司 能常温下贴合的有机电子装置用封装材料及有机电子装置
KR102325732B1 (ko) * 2019-11-19 2021-11-12 (주)이녹스첨단소재 상온에서 합착이 가능한 유기전자장치용 봉지재 및 이를 포함하는 유기전자장치
KR102325733B1 (ko) * 2019-11-19 2021-11-12 (주)이녹스첨단소재 상온에서 합착이 가능한 유기전자장치용 봉지재 및 이를 포함하는 유기전자장치
CN115551930B (zh) * 2020-05-14 2024-09-10 株式会社Lg化学 封装膜
CN116018358A (zh) * 2020-08-19 2023-04-25 株式会社Lg化学 热固性树脂组合物和使用其的封装膜
KR102698631B1 (ko) * 2020-12-24 2024-08-26 (주)이녹스첨단소재 유기전자장치용 봉지재 및 이를 포함하는 유기전자장치
KR20220097348A (ko) * 2020-12-31 2022-07-07 주식회사 엘지화학 밀봉재 조성물 및 이를 포함하는 유기전자장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030203183A1 (en) * 2001-12-14 2003-10-30 3M Innovative Properties Company Membrane module elements
US20110105637A1 (en) * 2008-06-02 2011-05-05 Jun Fujita Adhesive encapsulating composition and electronic devices made therewith
WO2013013568A1 (en) * 2011-07-25 2013-01-31 Henkel (China) Company Limited Photo curable adhesive compositions and use thereof
WO2013103281A1 (ko) * 2012-01-06 2013-07-11 주식회사 엘지화학 봉지용 필름
US20130207093A1 (en) * 2010-07-07 2013-08-15 Lg Chem, Ltd. Organic light emitting device comprising encapsulating structure

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57159864A (en) 1981-03-30 1982-10-02 Bridgestone Corp Self-adhesive composition
JPH0570404A (ja) * 1991-09-13 1993-03-23 Chisso Corp 新規アクリレート
JP3145743B2 (ja) * 1991-09-19 2001-03-12 日東電工株式会社 感圧性接着剤ないし接着シ―トの製造法
JPH11317475A (ja) 1998-02-27 1999-11-16 Canon Inc 半導体用封止材樹脂および半導体素子
IL147579A0 (en) 2000-09-06 2002-08-14 Appleton Paper Inc In situ microencapsulated adhesive
JP4301544B2 (ja) * 2003-01-07 2009-07-22 日東電工株式会社 画像表示装置の製造方法、画像表示装置および粘着型光学フィルム
JP2005107068A (ja) * 2003-09-30 2005-04-21 Nippon Shokubai Co Ltd 光学シート用組成物
US7070051B2 (en) * 2004-03-26 2006-07-04 Atrion Medical Products, Inc. Needle counter device including troughs of cohesive material
JP4695348B2 (ja) * 2004-05-27 2011-06-08 株式会社リコー カード型メモリ、画像形成装置、画像形成装置起動方法
JP4353009B2 (ja) * 2004-07-02 2009-10-28 東亞合成株式会社 光硬化性樹脂組成物
JP4976075B2 (ja) * 2005-12-26 2012-07-18 リンテック株式会社 偏光板用粘着剤、粘着剤付き偏光板及びその製造方法
JP2007197517A (ja) 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
JP2008102271A (ja) * 2006-10-18 2008-05-01 Nitto Denko Corp 表面保護フィルムおよび表面保護フィルム付き光学フィルム
WO2009052605A1 (en) * 2007-10-22 2009-04-30 Gill Paramjit S Leveraging and influencing computing network activity
CN101998982A (zh) * 2008-04-11 2011-03-30 3M创新有限公司 透明粘合剂片材及包括所述透明粘合剂片材的图像显示装置
JP2010209168A (ja) * 2009-03-09 2010-09-24 Lintec Corp 粘着シート
DE102009036968A1 (de) * 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102009046362A1 (de) * 2009-11-03 2011-05-05 Tesa Se Haftklebestoff aus einem vernetzbaren Polyolefin und einem Klebharz
CN101705067B (zh) 2009-11-23 2012-01-18 南亚塑胶工业股份有限公司 一种使用于贴合偏光板的黏着剂组合物
WO2012003416A1 (en) * 2010-07-02 2012-01-05 3M Innovative Properties Company Barrier assembly
US8663407B2 (en) * 2010-11-17 2014-03-04 3M Innovative Properties Company Isobutylene (Co)polymeric adhesive composition
AU2011250831A1 (en) * 2010-12-03 2012-06-21 Bayer Intellectual Property Gmbh Security and/or valuable documents with a top layer with a scratch-resistant finish
JP2012238768A (ja) * 2011-05-12 2012-12-06 Okura Ind Co Ltd 太陽電池素子封止シートおよび太陽電池モジュール
CN102898959B (zh) * 2011-07-25 2016-07-06 汉高股份有限及两合公司 一种可光固化的粘合剂组合物及其用途
CN102898958B (zh) 2011-07-25 2016-11-02 汉高股份有限公司 一种粘合剂组合物
CN103827158B (zh) * 2011-09-27 2017-02-15 株式会社钟化 (甲基)丙烯酰末端聚异丁烯类聚合物、其制造方法、及活性能量线固化性组合物
DE102011085034A1 (de) * 2011-10-21 2013-04-25 Tesa Se Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung
KR101424346B1 (ko) 2011-11-18 2014-08-01 주식회사 엘지화학 유기전자장치 봉지용 광경화형 점접착 필름, 유기전자장치 및 그의 봉지 방법
KR101883030B1 (ko) * 2012-03-01 2018-07-27 쓰리엠 이노베이티브 프로퍼티즈 컴파니 연속적 에지 보호된 배리어 조립체
EP2841520B1 (en) 2012-04-27 2020-11-04 Kuraray Co., Ltd. Acrylic pressure-sensitive adhesive composition and pressure-sensitive adhesive products
JP6087518B2 (ja) * 2012-05-14 2017-03-01 信越化学工業株式会社 熱伝導性シート供給体及び熱伝導性シートの供給方法
JP2013241542A (ja) * 2012-05-22 2013-12-05 Nippon Shokubai Co Ltd 接着剤組成物及びこれを用いた接着剤シート並びに半導体素子
KR20130135142A (ko) * 2012-05-30 2013-12-10 주식회사 엘지화학 유기전자장치
WO2013180536A1 (ko) * 2012-05-31 2013-12-05 주식회사 엘지화학 유기전자장치의 제조방법
KR101707268B1 (ko) 2012-12-24 2017-02-15 주식회사 엘지화학 광전자 장치용 이면시트, 이를 포함하는 광전자 장치 및 그 제조방법
JP6251575B2 (ja) 2013-01-23 2017-12-20 日東電工株式会社 シート状の電子部品封止用熱硬化性樹脂組成物、樹脂封止型半導体装置、及び樹脂封止型半導体装置の製造方法
WO2014129821A1 (ko) * 2013-02-20 2014-08-28 주식회사 엘지화학 디스플레이 장치용 패키징 필름
TWI557471B (zh) * 2013-02-20 2016-11-11 Ｌｇ化學股份有限公司 顯示裝置
EP3001476B1 (en) 2013-05-21 2021-12-22 LG Chem, Ltd. Encapsulation film and method for encapsulating organic electronic device using same
US10103352B2 (en) * 2013-05-21 2018-10-16 Lg Chem, Ltd. Organic electronic device having dimension tolerance between encapsulating layer and metal-containing layer less than or equal to 200 microns
JP6378533B2 (ja) * 2013-06-01 2018-08-22 日東電工株式会社 熱伝導性粘着シート
JP6191252B2 (ja) * 2013-06-07 2017-09-06 大日本印刷株式会社 太陽電池モジュール用の封止材組成物及び封止材
EP3023461B1 (en) * 2013-07-19 2020-10-21 LG Chem, Ltd. Sealing composition
KR20150016878A (ko) * 2013-08-05 2015-02-13 주식회사 엘지화학 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법
JP6152319B2 (ja) * 2013-08-09 2017-06-21 日東電工株式会社 粘着剤組成物、粘着テープ又はシート

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030203183A1 (en) * 2001-12-14 2003-10-30 3M Innovative Properties Company Membrane module elements
US20110105637A1 (en) * 2008-06-02 2011-05-05 Jun Fujita Adhesive encapsulating composition and electronic devices made therewith
US20130207093A1 (en) * 2010-07-07 2013-08-15 Lg Chem, Ltd. Organic light emitting device comprising encapsulating structure
WO2013013568A1 (en) * 2011-07-25 2013-01-31 Henkel (China) Company Limited Photo curable adhesive compositions and use thereof
WO2013103281A1 (ko) * 2012-01-06 2013-07-11 주식회사 엘지화학 봉지용 필름
EP2801476A1 (en) * 2012-01-06 2014-11-12 LG Chem, Ltd. Encapsulation film

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"Thermal Conductivity of common Materials and Gases." The Engineering ToolBox, http://www.engineeringtoolbox.com/thermal-conductivity-d_429.html. Accessed 10 May 2017. *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10714708B2 (en) 2018-02-01 2020-07-14 Samsung Display Co., Ltd. Display and method of manufacturing the same
US20220136109A1 (en) * 2019-04-12 2022-05-05 Epiluvac Ab Device and method to provide planarity of a wafer during growth
US20220216451A1 (en) * 2021-01-07 2022-07-07 Samsung Display Co., Ltd. Apparatus and method for manufacturing display device
US11955355B2 (en) * 2021-02-25 2024-04-09 Applied Materials, Inc. Isolated volume seals and method of forming an isolated volume within a processing chamber

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