US20060043843A1 - Ultrasonic sensor - Google Patents

Ultrasonic sensor Download PDF

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Publication number
US20060043843A1
US20060043843A1 US11/208,724 US20872405A US2006043843A1 US 20060043843 A1 US20060043843 A1 US 20060043843A1 US 20872405 A US20872405 A US 20872405A US 2006043843 A1 US2006043843 A1 US 2006043843A1
Authority
US
United States
Prior art keywords
ultrasonic sensor
receiving
conversion means
converters
transmission
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/208,724
Other languages
English (en)
Inventor
Makiko Sugiura
Takahiko Yoshida
Masatoshi Tokunaga
Yasutoshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Soken Inc
Original Assignee
Denso Corp
Nippon Soken Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp, Nippon Soken Inc filed Critical Denso Corp
Assigned to NIPPON SOKEN, INC., DENSO CORPORATION reassignment NIPPON SOKEN, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TOKUNAGA, MASATOSHI, SUGIURA, MAKIKO, SUZUKI, YASUTOSHI, YOSHIDA, TAKAHIKO
Publication of US20060043843A1 publication Critical patent/US20060043843A1/en
Priority to US11/586,561 priority Critical patent/US7329975B2/en
Priority to US12/003,096 priority patent/US7525237B2/en
Abandoned legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/521—Constructional features
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/0629—Square array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
    • F16M1/00—Frames or casings of engines, machines or apparatus; Frames serving as machinery beds
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • General Engineering & Computer Science (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
US11/208,724 2004-08-25 2005-08-23 Ultrasonic sensor Abandoned US20060043843A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US11/586,561 US7329975B2 (en) 2004-08-25 2006-10-26 Ultrasonic sensor
US12/003,096 US7525237B2 (en) 2004-08-25 2007-12-20 Ultrasonic sensor

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004245541 2004-08-25
JP2004-245541 2004-08-25
JP2005-42449 2005-02-18
JP2005042449A JP4513596B2 (ja) 2004-08-25 2005-02-18 超音波センサ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/586,561 Continuation US7329975B2 (en) 2004-08-25 2006-10-26 Ultrasonic sensor

Publications (1)

Publication Number Publication Date
US20060043843A1 true US20060043843A1 (en) 2006-03-02

Family

ID=35853755

Family Applications (3)

Application Number Title Priority Date Filing Date
US11/208,724 Abandoned US20060043843A1 (en) 2004-08-25 2005-08-23 Ultrasonic sensor
US11/586,561 Active US7329975B2 (en) 2004-08-25 2006-10-26 Ultrasonic sensor
US12/003,096 Active US7525237B2 (en) 2004-08-25 2007-12-20 Ultrasonic sensor

Family Applications After (2)

Application Number Title Priority Date Filing Date
US11/586,561 Active US7329975B2 (en) 2004-08-25 2006-10-26 Ultrasonic sensor
US12/003,096 Active US7525237B2 (en) 2004-08-25 2007-12-20 Ultrasonic sensor

Country Status (6)

Country Link
US (3) US20060043843A1 (ja)
JP (1) JP4513596B2 (ja)
KR (1) KR100693401B1 (ja)
CN (1) CN100568020C (ja)
DE (1) DE102005040081B4 (ja)
FR (1) FR2874780B1 (ja)

Cited By (39)

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US20070157731A1 (en) * 2006-01-11 2007-07-12 Denso Corporation Ultrasonic sensor
US20070158502A1 (en) * 2002-11-04 2007-07-12 Bonutti Peter M Ultrasonic communication and drag modification
US20070251324A1 (en) * 2006-04-26 2007-11-01 Denso Corporation Ultrasonic sensor and manufacture method of the same
US20080088206A1 (en) * 2006-10-13 2008-04-17 Denso Corporation Resin substrate and ultrasonic sensor using the same
US20080165620A1 (en) * 2005-07-20 2008-07-10 Denso Corporation Obstacle sensor having supersonic sensor
US20090071255A1 (en) * 2007-06-12 2009-03-19 Denso Corporation Ultrasonic sensor and self diagnostic method of the same
US20090085439A1 (en) * 2007-09-28 2009-04-02 Denso Corporation Ultrasonic sensor
US7821872B2 (en) 2007-08-31 2010-10-26 Denso Corporation Method for ultrasonic wave transmission and apparatus for ultrasonic wave transmission
US20100275675A1 (en) * 2007-12-05 2010-11-04 Heikki Seppa Device for measuring pressure, variation in acoustic pressure, a magnetic field, acceleration, vibration, or the composition of a gas
US20110227449A1 (en) * 2010-03-19 2011-09-22 Seiko Epson Corporation Ultrasonic sensor
US20130098157A1 (en) * 2011-10-21 2013-04-25 Riso Kagaku Corporation Ultrasonic sensor
US20130208572A1 (en) * 2010-07-30 2013-08-15 Koninklijke Philips Electronics N.V. Thin film ultrasound transducer
CN103770701A (zh) * 2013-05-15 2014-05-07 宁波保税区攀峒信息科技有限公司 一种特定物体近距离视觉盲区人体探测方法及装置
US20140276080A1 (en) * 2010-04-27 2014-09-18 Seiko Epson Corporation Ultrasonic sensor and electronic device
US20150258573A1 (en) * 2014-03-10 2015-09-17 Seiko Epson Corporation Ultrasonic sensor
US20160013394A1 (en) * 2014-07-11 2016-01-14 Microtech Medical Technologies Ltd. Multi-cell transducer
US20160027424A1 (en) * 2013-04-24 2016-01-28 Murata Manufacturing Co., Ltd. Ultrasonic wave generation apparatus
US20160036412A1 (en) * 2014-07-31 2016-02-04 Seiko Epson Corporation Ultrasonic device and probe as well as electronic apparatus and ultrasonic imaging apparatus
US20160139250A1 (en) * 2013-06-20 2016-05-19 Robert Bosch Gmbh Surroundings-sensing device having a modular ultrasonic transducer, and motor vehicle having such a surroundings-sensing device
US9348027B2 (en) 2011-06-13 2016-05-24 Denso Corporation Ultrasonic sensor device
US9554775B2 (en) 2012-03-30 2017-01-31 Seiko Epson Corporation Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device
US9818929B2 (en) 2013-11-20 2017-11-14 Seiko Epson Corporation Ultrasonic device, method for manufacturing the same, electronic device and ultrasonic imaging device
CN109150127A (zh) * 2018-07-27 2019-01-04 开元通信技术（厦门）有限公司 薄膜体声波谐振器及其制作方法、滤波器
CN111208498A (zh) * 2018-11-22 2020-05-29 精工爱普生株式会社 超声波元件及超声波装置
US20200186937A1 (en) * 2016-12-08 2020-06-11 Bae Systems Plc Electroacoustic transducer array
US20210009046A1 (en) * 2019-07-10 2021-01-14 Denso Corporation Ultrasonic sensor
US10929633B2 (en) 2016-09-18 2021-02-23 Boe Technology Group Co., Ltd. Fingerprint identification device, touch display panel, and method for driving fingerprint identification device
CN112805843A (zh) * 2018-08-01 2021-05-14 艾科索成像公司 用于集成具有混合触点的超声换能器的系统和方法
CN112887881A (zh) * 2019-11-29 2021-06-01 精工爱普生株式会社 超声波设备
US11181627B2 (en) * 2018-02-05 2021-11-23 Denso Corporation Ultrasonic sensor
US11179748B2 (en) 2017-05-09 2021-11-23 Seiko Epson Corporation Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic apparatus, and electronic apparatus
GB2564914B (en) * 2017-07-19 2022-08-31 Bae Systems Plc Electroacoustic transducer array
US11445304B2 (en) 2019-04-05 2022-09-13 Denso Corporation Ultrasonic sensor
US11666239B2 (en) 2017-03-14 2023-06-06 University Of Connecticut Biodegradable pressure sensor
US11678989B2 (en) * 2019-03-01 2023-06-20 University Of Connecticut Biodegradable piezoelectric nanofiber scaffold for bone or tissue regeneration
US11745001B2 (en) 2020-03-10 2023-09-05 University Of Connecticut Therapeutic bandage
US11826495B2 (en) 2019-03-01 2023-11-28 University Of Connecticut Biodegradable piezoelectric ultrasonic transducer system
US11910720B2 (en) 2019-12-26 2024-02-20 Seiko Epson Corporation Piezoelectric device and MEMS device
US11917922B2 (en) * 2016-04-27 2024-02-27 Seiko Epson Corporation Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic apparatus, and electronic apparatus

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US20110022509A1 (en) * 2005-11-13 2011-01-27 Rosenthal Collins Group, L.L.C. Method and system for electronic trading via a yield curve on plural network devices
JP4787648B2 (ja) * 2006-03-29 2011-10-05 パナソニック株式会社 コンデンサマイクロホンの製造方法およびコンデンサマイクロホン
JP5313877B2 (ja) * 2006-04-19 2013-10-09 コモンウェルス サイエンティフィック アンドインダストリアル リサーチ オーガナイゼーション 超音波トランスデューサシステム
JP2007306043A (ja) * 2006-05-08 2007-11-22 Denso Corp 超音波センサ
JP4702255B2 (ja) * 2006-10-13 2011-06-15 株式会社デンソー 超音波センサ
US7863856B2 (en) * 2008-01-11 2011-01-04 Modu Ltd. Bi-directional battery charging for coupled electronic devices
JP4958631B2 (ja) * 2007-05-14 2012-06-20 株式会社日立製作所 超音波送受信デバイス及びそれを用いた超音波探触子
DE102008054533B8 (de) 2007-12-26 2013-02-14 Denso Corporation Ultraschallsensor
GB0916480D0 (en) * 2009-09-21 2009-10-28 Univ Dundee Wire bond free connection of high frequency piezoelectric ultrasound transducer arrays
JP5671876B2 (ja) * 2009-11-16 2015-02-18 セイコーエプソン株式会社 超音波トランスデューサー、超音波センサー、超音波トランスデューサーの製造方法、および超音波センサーの製造方法
JP5600431B2 (ja) * 2009-12-28 2014-10-01 日本碍子株式会社 障害物の超音波検知デバイス
JP5517642B2 (ja) * 2010-01-26 2014-06-11 キヤノン株式会社 音響波探触子
FR2965249B1 (fr) * 2010-09-28 2013-03-15 Eurocopter France Systeme de degivrage ameliore pour voilure fixe ou tournante d'un aeronef
FR2966813A1 (fr) * 2010-10-29 2012-05-04 Thales Sa Microsysteme electromecanique (mems).
DE102011079646A1 (de) * 2011-07-22 2013-02-07 Robert Bosch Gmbh Ultraschallsensorvorrichtung zum Erfassen und/oder Senden von Ultraschall
DE102011084537B4 (de) 2011-10-14 2017-05-04 Robert Bosch Gmbh Ultraschallsensorarray
JP5885296B2 (ja) * 2012-02-15 2016-03-15 日本電波工業株式会社 超音波探触子
DE102012204638A1 (de) * 2012-03-22 2013-09-26 Robert Bosch Gmbh Ultraschallsensor und Verfahren zur Messung eines Objektabstands
JP6019671B2 (ja) * 2012-03-30 2016-11-02 セイコーエプソン株式会社 超音波プローブ並びに電子機器および超音波診断装置
JP6065421B2 (ja) * 2012-06-15 2017-01-25 セイコーエプソン株式会社 超音波プローブおよび超音波検査装置
JP6135088B2 (ja) * 2012-10-12 2017-05-31 セイコーエプソン株式会社 超音波トランスデューサーデバイス、プローブヘッド、超音波プローブ、電子機器及び超音波診断装置
US20140265732A1 (en) * 2013-03-15 2014-09-18 Piezotech, Llc Pressure-compensated transducer assembly
JP6442821B2 (ja) * 2013-09-30 2018-12-26 セイコーエプソン株式会社 超音波デバイス及び電子機器
CA2929723C (en) 2013-12-12 2020-09-15 Qualcomm Incorporated Micromechanical ultrasonic transducers and display
JP6458934B2 (ja) * 2013-12-18 2019-01-30 セイコーエプソン株式会社 超音波センサー
US9772314B2 (en) 2013-12-18 2017-09-26 Seiko Epson Corporation Ultrasonic sensor and measuring method using the same, and method of manufacturing ultrasonic sensor
CA2950919A1 (en) * 2014-07-08 2016-01-14 Qualcomm Incorporated Piezoelectric ultrasonic transducer and process
JP6587051B2 (ja) * 2015-03-24 2019-10-09 セイコーエプソン株式会社 超音波センサー及びその製造方法
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KR100693401B1 (ko) 2007-03-09
US7525237B2 (en) 2009-04-28
US7329975B2 (en) 2008-02-12
JP4513596B2 (ja) 2010-07-28
JP2006094459A (ja) 2006-04-06
FR2874780A1 (fr) 2006-03-03
US20070040477A1 (en) 2007-02-22
CN1740814A (zh) 2006-03-01
FR2874780B1 (fr) 2011-11-11
DE102005040081A1 (de) 2006-03-16
US20080116765A1 (en) 2008-05-22
KR20060050660A (ko) 2006-05-19
DE102005040081B4 (de) 2012-06-14

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