US20050139818A1 - Gallium nitride semiconductor light emitting device and method of manufacturing the same - Google Patents
Gallium nitride semiconductor light emitting device and method of manufacturing the same Download PDFInfo
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- US20050139818A1 US20050139818A1 US10/843,594 US84359404A US2005139818A1 US 20050139818 A1 US20050139818 A1 US 20050139818A1 US 84359404 A US84359404 A US 84359404A US 2005139818 A1 US2005139818 A1 US 2005139818A1
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- 229910002601 GaN Inorganic materials 0.000 title claims abstract description 235
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title claims abstract description 233
- 239000004065 semiconductor Substances 0.000 title claims abstract description 56
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 65
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 239000000463 material Substances 0.000 claims abstract description 21
- 239000013078 crystal Substances 0.000 claims abstract description 20
- 239000010410 layer Substances 0.000 claims description 278
- 239000011229 interlayer Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 3
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 29
- 230000003287 optical effect Effects 0.000 abstract description 7
- 229910052594 sapphire Inorganic materials 0.000 description 17
- 239000010980 sapphire Substances 0.000 description 17
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 12
- 150000004767 nitrides Chemical class 0.000 description 9
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 8
- 238000005424 photoluminescence Methods 0.000 description 8
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 239000003086 colorant Substances 0.000 description 6
- 238000005137 deposition process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000002708 enhancing effect Effects 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 5
- 238000002017 high-resolution X-ray diffraction Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 208000012868 Overgrowth Diseases 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02378—Silicon carbide
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02502—Layer structure consisting of two layers
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02576—N-type
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
Definitions
- the present invention relates to a gallium nitride (GaN) semiconductor light emitting device (LED), and more particularly to a high quality GaN semiconductor light emitting device and a method of manufacturing the same, which comprises a buffer layer consisting of single crystal AlN and which causes a reduction of defects, such as Ga vacancies and dislocations caused by lattice mismatching, by Al doping when growing GaN, thereby enhancing electrical and optical properties.
- GaN gallium nitride
- a light emitting device display board developed as a new transmission media for images or information has been advanced to a level of displaying a moving image, such as various CF images, graphic images, video display, etc., starting from information of simple characters or figures in the early days of the LED display board.
- colors as a high brightness blue LED using a nitride semiconductor has emerged recently, it has become possible to exhibit a full color display using colors of red, yellow-green and blue, not limited to an existing monochromatic coarse display or at most a limited range of colors, such as red or yellow-green, in the past.
- the yellow-green LED has a lower brightness than the blue LED or the red LED and emits light having a wavelength of about 565 nm which is not the wavelength of green required for the three primary colors.
- a high brightness pure green nitride semiconductor LED emitting a wavelength of 565 nm suitable for displaying the full range of natural colors.
- Such nitride semiconductors use a nitride semiconductor material with the formula Al x In y Ga (1-x-y) N (where 0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, 0 ⁇ x+y ⁇ 1), and investigations are being actively undertaken particularly on the semiconductor LED using GaN.
- a sapphire substrate is generally used as a dielectric substrate in the nitride semiconductor LED
- there is no commercially available substrate which has an identical crystal structure to that of a nitride semiconductor material, such as GaN, and which is in lattice matching with the material.
- crystal defects are created due to the differences in lattice parameters and in thermal expansion coefficient between the sapphire substrate and a GaN layer grown on the sapphire substrate.
- a GaN layer is grown on the buffer layer at a high temperature. This process is provided to decrease the difference in lattice parameters between the sapphire substrate and the GaN layer.
- the buffer layer grown at a low temperature has a great number of crystal defects and properties closer to a non-crystalline structure rather than a crystalline structure.
- the GaN layer is directly grown at a high temperature on the buffer layer grown at the low temperature, a large number of crystal defects move toward the upper GaN layer grown at the high temperature, thereby creating the defects, which are referred to as “dislocations.”
- the LEO (Lateral Epitaxy Overgrowth) method also referred to as ELOG (Epitaxial Lateral Overgrowth) method
- the pendeoepitaxy method has been suggested. Both methods prevent defects created at the interface between the sapphire substrate and the GaN layer from moving upward by laterally growing the GaN layer.
- the LEO method after a dielectric mask is formed on the sapphire substrate, or on the GaN epitaxial layer primarily grown on the sapphire substrate, the GaN layer is overgrown on the portion where the mask is not formed, such that the overgrowing GaN layer can grow laterally.
- the mask is partially etched and formed with grooves, so that the GaN epitaxial layer is overgrown on the grooves.
- FIGS. 1 a to 1 d show a method of growing the GaN layer with the conventional LEO method as described above.
- a GaN epitaxial layer 11 is primarily grown on a sapphire substrate 10
- a mask 12 with predetermined patterns is formed on the GaN epitaxial layer 11 using a silicon oxide film or a silicon nitride film.
- the GaN is overgrown on the portion where the mask 12 is not formed.
- a GaN layer 13 is laterally grown, as indicated by an arrow of FIG. 1 c .
- the pendeoepitaxy method further comprises the step of etching to remove the portion of the GaN epitaxial layer which is not covered with the mask, after forming the mask.
- the dislocations moving in the GaN layer formed by the LEO method or by the pendeoepitaxy method tend to be reduced.
- the underlying dislocations move to the overgrowing GaN layer 13
- the GaN layer 13 is laterally overgrown and no underlying dislocations move, thereby reducing the defects.
- the step of preparing the mask in the above methods caused increased costs, and the addition of the steps of patterning and overgrowing after the primary growth of the GaN epitaxial layer complicate the process.
- the present invention has been made in view of the above problems, and it is an object of the present invention to provide a gallium nitride semiconductor light emitting device and a method of manufacturing the same, in which defects, such as Ga vacancies and dislocations caused by lattice mismatching, are reduced by doping a small amount of Al when an n-type GaN layer is grown, whereby electrical and optical properties are reduced.
- GaN gallium nitride
- the n-type GaN clad layer may be doped with Al in a content of 0.01% ⁇ 1%.
- the light emitting device may further comprise a buffer layer formed between the substrate and the n-type GaN clad layer.
- the buffer layer may comprise an Al seed layer formed on the substrate layer and an AlN layer formed on the Al seed layer.
- the AlN layer may be a single crystal AlN layer and have a thickness of 10 nm ⁇ 50 nm.
- the light emitting device may further comprise a GaN interlayer formed between the buffer layer and the n-type GaN clad layer.
- the GaN interlayer may have a thickness of 100 nm ⁇ 1 ⁇ m.
- the light emitting device may further comprise an Al-doped GaN layer formed between the GaN interlayer and the n-type GaN clad layer.
- the Al-doped GaN layer may be doped with Al in a content of 0.01% ⁇ 1% and have a thickness of 1 ⁇ m ⁇ 4 ⁇ m.
- the step b) may comprise the step of forming an n-type GaN clad layer doped with Al in a content of 0.01% ⁇ 1%.
- the method may further comprise the step of e) forming a buffer layer on the substrate before the step b).
- the step e) may comprise the step of e-1) forming an Al seed layer on the substrate layer and the step of e-2) forming an AlN layer on the Al seed layer.
- the step e-2) may comprise the step of forming a single crystal AlN layer with a thickness of 10 nm ⁇ 50 nm at a high temperature of 1,000° C. ⁇ 1,100° C. using an MOCVD (Metal Organic Chemical Vapor Deposition) process.
- MOCVD Metal Organic Chemical Vapor Deposition
- the method may further comprise the step of f) forming a GaN interlayer on the buffer layer before the step b), and the step f) may comprise the step of forming a GaN interlayer with a thickness of 100 nm ⁇ 1 ⁇ m.
- the method may further comprise the step of g) forming an Al-doped GaN layer on the GaN interlayer before the step b).
- the step g) may comprise the step of forming an Al-doped GaN layer with a thickness of 1 ⁇ m ⁇ 4 ⁇ m and an Al content of 0.01% ⁇ 1%.
- the method may further comprise the steps of:
- FIGS. 1 a to 1 d are sectional views of a flow diagram showing a method of growing a GaN layer according to conventional LEO method
- FIG. 2 is a view showing dislocations created in the GaN layer grown by the conventional LEO method
- FIG. 3 is a perspective view showing a GaN semiconductor LED according to an embodiment of the present invention.
- FIGS. 4 a to 4 f are perspective views of a flow diagram showing a method of manufacturing a GaN semiconductor LED according to an embodiment of the present invention
- FIG. 5 is a graph showing the PL (Photo-Luminescence) characteristics of the conventional Si-doped n-type GaN clad layer and of an n-type GaN clad layer doped with Si and Al according to the present invention
- FIG. 6 is a graph showing the PL characteristics of an un-doped GaN clad layer and of an Al-doped GaN layer;
- FIG. 7 is a graph showing the electron mobility of the un-doped GaN layer and the Al-doped GaN layer.
- FIGS. 8 a and 8 b are reciprocal space maps illustrated using HR-XRD (High Resolution X-Ray Diffraction).
- FIG. 3 is a perspective view of the GaN semiconductor LED according to the embodiment of the present invention.
- the GaN semiconductor LED of the present invention comprises a substrate 30 for growing a GaN semiconductor material, a buffer layer 341 formed on the substrate 30 , a GaN interlayer 342 formed on the buffer layer 341 , an Al-doped GaN layer 343 formed on the GaN interlayer 342 , an Al-doped n-type GaN clad layer 31 formed on the Al-doped GaN layer 343 , an active layer 32 having a quantum well structure formed on the n-type GaN clad layer 31 , and a p-type GaN clad layer 33 formed on the active layer.
- the substrate 30 either a sapphire substrate or a SiC substrate can be used, the former is preferred in the art. This is because there is no commercially available substrate which has an identical crystal structure to that of the nitride semiconductor material grown on the substrate 30 and which is in lattice matching with the material.
- the n-type GaN clad layer 31 consists of an n-type doped GaN semiconductor material using Si as impurities. According to the present invention, the n-type doped GaN semiconductor material is doped with Si together with Al.
- the n-type GaN clad layer 31 is formed by growing the GaN semiconductor material on the substrate, with a well-known deposition process, such as the MOCVD process. Since it is difficult to have good quality crystal growth due to the differences in thermal expansion coefficients and in stresses caused by lattice mismatching, a buffer layer 341 may be prepared on the substrate in advance when growing the GaN semiconductor material on the sapphire substrate 30 .
- the buffer layer 341 a non-crystalline GaN or AlN layer grown at a low temperature may be used.
- the buffer layer 341 may further comprise an Al seed layer formed on the substrate and an AlN layer formed on the Al seed layer.
- the Al seed layer is deposited on the sapphire substrate to a thickness of several dozen A by supplying a trimethylaluminum (TMAl) source for several minutes without using an ammonia (NH 3 ) source at a temperature of 1,100° C. or more with the MOCVD process.
- TMAl trimethylaluminum
- NH 3 ammonia
- the Al seed layer is prepared so as to accelerate nucleus growth of the AlN layer formed on the Al seed.
- the AlN layer is formed in a single crystal state on the Al seed layer.
- the AlN layer acts as a buffer layer for reducing the differences in the thermal expansion coefficients and in the stresses caused by the lattice mismatching between the sapphire substrate 30 and the GaN layers formed thereon.
- the AlN layer is also formed as a single AlN crystal by supplying the TMA 1 and NH 3 sources at a temperature of 1,100° C. or more using the MOCVD process.
- the AlN layer preferably has a thickness of 10 nm ⁇ 50 nm.
- the buffer layer material Conventionally, a GaN layer or an AlN layer grown at a low temperature was mainly used as the buffer layer material.
- the conventional GaN buffer layer grown at a low temperature has a great number of crystalline defects and properties closer to a non-crystalline structure rather than a crystalline structure.
- the GaN buffer layer has a serious lattice mismatching with the sapphire substrate and with the GaN semiconductor layer grown on the GaN buffer layer.
- an AlN layer grown at a high temperature may be prepared as a single crystal, thereby providing advantages of reducing the lattice mismatching with the sapphire substrate and with the GaN semiconductor layer compared with the conventional AlN layer grown at a low temperature.
- the buffer layer 341 may comprise the Al seed layer formed on the substrate and the AlN layer formed on the Al seed layer.
- the GaN interlayer 342 is formed on the buffer layer 341 , more accurately on the AlN layer.
- the GaN interlayer 342 also acts as a kind of buffer layer and is prepared to compensate for the difference in lattice parameters from that of the AlN layer.
- the GaN interlayer 342 may also be formed using the well-known MOCVD process.
- the GaN interlayer 342 is also deposited on the AlN layer by supplying a trimethylgallium (TMGa) source and the ammonia (NH 3 ) source for several minutes at a temperature of 1,050° C. or more using the MOCVD process. With regard to this, the GaN interlayer 342 is grown very slowly by lowering the amount of TMGa so that a ratio of V/III is 134,000, and is preferably formed to have a thickness of 100 nm ⁇ 1 ⁇ m.
- TMGa trimethylgallium
- NH 3 ammonia
- the Al-doped GaN layer 343 is formed on the GaN interlayer 342 .
- an un-doped GaN layer is formed to prevent the defects caused by the lattice mismatching.
- point defects referred to as “Ga vacancies,” are created, deteriorating the properties of LED.
- Ga vacancies created on the un-doped GaN layer, there arise problems that the advantageous effects of the un-doped GaN layer for alleviating the lattice mismatching are deteriorated, and that the defects caused by the dislocations cannot be reduced.
- Ga vacancies are created by Ga deficiency and cause Ga and N not to be combined in the same amount when growing the GaN layer. Further, Ga vacancies cause the crystallinity of GaN to deteriorate, by which the crystallinity in the active layer formed on GaN is also deteriorated. Thus, defect level emitting heat, instead of light, in the lattice is generated, trapping the electrons, thereby reducing generation of photon. Thus, there arises a problem of deteriorated LED brightness.
- a small amount of Al is to be doped when growing the GaN layer.
- Al belongs to group III and fills the Ga vacancies to prevent the electrons from being trapped. As a result, a reduction of electrons due to trapping can be prevented to enhance the brightness of the LED.
- the Al-doped GaN layer 343 is preferably formed to have Al in a content of 0.01% ⁇ 1% by supplying the TMAl source for Al doping, simultaneously with supplying the TMGa and NH 3 sources for a ratio of V/III to be 2,400 at a temperature of 1,020° C. ⁇ 1,030° C. with the MOCVD process. Since if the content of Al is 1% or more, an AlGaN compound is generated, Al should be doped in a content of less than 1%. Further, the Al-doped GaN layer 343 preferably has a thickness of 1 ⁇ m ⁇ 4 ⁇ m.
- the n-type GaN clad layer 31 may comprise the n-doped GaN semiconductor material on the Al-doped GaN layer 343 using Si and Al for the impurities.
- Al is doped together so as to prevent the Ga vacancies from trapping the electrons. With the Al doping, there are provided advantages of reducing not only the defects caused by the Ga vacancies, but also the defects caused by the dislocations.
- the GaN clad layer 31 may also be deposited for Al to be doped in a content of 0.01% ⁇ 1% together with Si at a temperature of 1,020° C. ⁇ 1,030° C. with the well-known MOCVD process.
- the active layer 32 may comprise InGaN or GaN having a quantum well structure on the n-type GaN clad layer 31 .
- the active layer 32 may be also deposited using a well-known deposition process, such as the MOCVD process.
- the active layer 32 may be formed to expose a predetermined portion of the n-type GaN clad layer 31 . This is for forming an n-side electrode on the exposed portion of n-type GaN clad layer 31 .
- the p-type GaN clad layer 33 is formed on the active layer 32 .
- the p-type GaN clad layer 33 may be formed as a GaN layer doped with Mg using a well-known deposition process, such as the MOCVD process.
- a p-metal layer (not shown) is formed to enhance the electric current injection effect and create the ohmic contact.
- a material of the p-metal layer Ni/Au or ITO may be used, which is well-known in the art.
- a p-side bonding pad (not shown) is formed to provide wire bonding, while on the exposed portion of the GaN clad layer 32 , an n-side bonding pad (not shown) is formed.
- FIGS. 4 a to 4 f are perspective views of a flow diagram showing a method of manufacturing a GaN semiconductor LED according to an embodiment of the present invention.
- a buffer layer 441 is formed on a substrate 40 .
- the buffer layer 441 the GaN layer or the AlN layer grown at a low temperature may be used.
- the buffer layer may comprise the Al seed layer formed on the substrate and the AlN layer formed on the Al seed layer.
- the buffer layer 441 is formed on the substrate 40 with a formation of the Al seed layer having a thickness of several dozen A by supplying the TMAl source without using the NH 3 source at a temperature of 1,100° C. or more, and then with a formation of the single crystal AlN layer on the Al seed layer by supplying the TMAl source together with the NH 3 source at a temperature of 1,100° C. or more using the MOCVD process, respectively.
- a GaN interlayer 442 is formed on the buffer layer 441 . More accurately, the GaN interlayer 442 is formed on the AlN layer.
- the GaN interlayer 442 is also deposited on the AlN layer by supplying the TMGa and NH 3 sources for several minutes at a temperature of 1,050° C. or more with the MOCVD process. With regard to this, the GaN interlayer 442 is grown very slowly for a ratio of V/III to be 134,000 by reducing the amount of TMGa and preferably formed to have a thickness of 100 nm ⁇ 1 ⁇ m.
- an Al-doped GaN layer 443 is formed on the GaN interlayer 442 .
- the Al-doped GaN layer 443 is doped with Al to fill the point defects what are referred to as “Ga vacancies” created in the GaN layer.
- Ga vacancies By Al doping, Al fills the Ga vacancies trapping the electrons, thereby enhancing the crystallinity, so that the crystallinity of the active layer formed on the Al-doped GaN layer 443 is enhanced resulting in improving the brightness of the LED.
- the Al-doped GaN layer 443 may be formed to have Al in a content of 0.01% ⁇ 1% by supplying the TMAL source for Al doping, simultaneously with supplying the TMGa and NH 3 sources for a ratio of V/III to be 2,400 at a temperature of 1,020° C. ⁇ 1,030° C. with the MOCVD process.
- the Al-doped GaN layer 443 is preferably formed to have a thickness of 1 ⁇ m ⁇ 4 ⁇ m.
- an n-type GaN clad layer 41 is formed on the Al-doped GaN clad layer 443 .
- the n-type GaN clad layer 41 is formed by growing the n-type doped semiconductor material using Si and Al for the impurities.
- the GaN clad layer 41 may also be formed by depositing the GaN layer for Al to be doped in a content of 0.01% 1%, concurrently with depositing Si at a temperature of 1,020° C. ⁇ 1,030° C. using the well-known MOCVD process.
- the Al doping is prepared to prevent the Ga vacancies from trapping the electrons. By the Al doping, not only the defects caused by the Ga vacancies but also the defects by the dislocations can be reduced concurrently.
- an active layer 42 and a p-type GaN clad layer 43 are sequentially formed on the n-type GaN clad layer 41 .
- the active layer 42 may consist of InGaN or GaN with a quantum well structure on the n-type GaN clad layer 41
- the p-type GaN clad layer 43 may be formed as a GaN layer doped with Mg.
- the active layer 42 and the p-type GaN clad layer 43 are also formed using a well-known deposition process, such as the MOCVD process.
- a predetermined portion of the n-type GaN clad layer 41 are exposed by removing a predetermined portion of the active layer 42 and p-type clad layer 43 .
- the p-metal layer (not shown) consisting of Ni/Au or ITO is formed on the p-type GaN clad layer 43 to enhance the electric current injection effect and create the ohmic contact.
- the p-side bonding pad (not shown) is formed for wire bonding, and the n-side bonding pad (not shown) is formed on the exposed portion of the n-type GaN clad layer.
- the p-type GaN clad layer 43 is formed on the active layer 42 .
- the p-type GaN clad layer 43 and the n-type GaN clad layer 42 may be formed as the GaN layer doped with Mg using a well-known deposition process, such as the MOCVD process.
- FIGS. 5 to 8 show the enhanced effects in the crystallinity of the GaN semiconductor LED according to the present invention.
- FIG. 5 is a graph showing the PL (Photo Luminescence) characteristics of the conventional Si-doped n-type GaN clad layer and of the n-type GaN clad layer doped with Si and Al according to the present invention
- FIG. 6 is a graph showing the PL characteristics of the un-doped GaN clad layer and of the Al-doped GaN layer according to the present invention.
- the n-type GaN clad layer doped with Si and Al, and the Al-doped GaN clad layer according to the present invention exhibit a remarkably higher intensity of light than the un-doped GaN clad layer.
- the PL characteristics are further enhanced as the doping amount of Al is increased.
- the wavelengths having peal values are gradually decreased. In this regard, it is considered that in case of Al in a content of less than 1%, a variation in wavelength can be disregarded.
- FIG. 7 is a graph illustrating the electron mobility in the un-doped GaN layer and the Al-doped GaN layer.
- the electron mobility at a high temperature [at 700 K (room temperature) in FIG. 7 ] is influenced by the impurity while the electron mobility at a low temperature (at 77 K in FIG. 7 ) by the lattice.
- the case of being doped with Al exhibits a remarkable enhancement in the electron mobility as a whole.
- the Ga vacancies trapping the electrons in the growth of GaN are filled with the doped Al, thereby increasing the number of electrons which can move.
- the electron mobility at the low temperature (77 K) is rapidly decreased compared with the electron mobility at high temperature. Meanwhile, if Al is doped in a content of 0.45% ⁇ 0.3%, the electron mobility at the low temperature (77 K) is increased compared with the electron mobility at high temperature. That is, the excellence in the electron mobility, which is mainly affected by the lattice at the low temperature (77 K), is caused by the considerable reduction of lattice defects, such as dislocations, with the Al doping.
- FIGS. 8 a and 8 b show reciprocal space maps depicted using HR-XRD (High Resolution X-Ray Diffraction).
- FIG. 8 a shows the reciprocal space map of the un-doped GaN layer
- FIG. 8 b shows the reciprocal space map of the Al-doped GaN layer.
- the reciprocal space map of the un-doped GaN layer exhibits an un-symmetrical shape due to compressive strains caused by the defects.
- that of the Al-doped GaN layer of the present invention exhibits a symmetrical shape compared with FIG. 8 a .
- This is caused by the considerable reduction of dislocations by the Al doping. That is, according to the present invention, the dislocations caused by the lattice mismatching can be significantly reduced with the Al doping, thereby remarkably enhancing the crystallinity.
- a small amount of doped Al may prevent the point defects, such as Ga vacancies, from trapping the electrons, thereby enhancing the electron mobility leading to enhancement of the electrical and optical properties of the LED.
- the defects, such as dislocations can be reduced, thereby enhancing the crystallinity of the GaN layer and n-type GaN clad layer.
- a superior quality of crystal growth can be ensured with a lower cost, without using an expensive process, such as the LEO method or the pendioepitaxy method.
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US20060215256A1 (en) | 2006-09-28 |
US7674643B2 (en) | 2010-03-09 |
JP2010098336A (ja) | 2010-04-30 |
JP2005191519A (ja) | 2005-07-14 |
KR20050064527A (ko) | 2005-06-29 |
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