TWM435151U - Heat spreader - Google Patents
Heat spreader Download PDFInfo
- Publication number
- TWM435151U TWM435151U TW101204181U TW101204181U TWM435151U TW M435151 U TWM435151 U TW M435151U TW 101204181 U TW101204181 U TW 101204181U TW 101204181 U TW101204181 U TW 101204181U TW M435151 U TWM435151 U TW M435151U
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- heat sink
- base
- dissipating
- fins
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 claims description 45
- 238000005452 bending Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 12
- 238000001125 extrusion Methods 0.000 abstract description 10
- 238000005520 cutting process Methods 0.000 abstract description 8
- 238000004080 punching Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241000237858 Gastropoda Species 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
- B23P2700/10—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/08—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes pressed; stamped; deep-drawn
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/12—Fastening; Joining by methods involving deformation of the elements
- F28F2275/122—Fastening; Joining by methods involving deformation of the elements by crimping, caulking or clinching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Geometry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
M435151 五、新型說明: 【新型所屬之技術領域】 本創作係涉及一種散熱器,其主要係在裁切擠型塊的 上端面以剖溝形成複數組間隔排列且相向對應的夾持塊, 並於衝壓央持塊變形後可緊密央持散熱鰭片,達到散熱 座與散熱鰭片的快速結合。 w - 【先前技術】 習知銘(銅)播塑散熱器,其散熱底座與散熱·铸片係 一體成型,雖整體構造簡單,但底座較為粗厚,故糸呈 量多、重量沉且成本高,且散熱鰭片的相離間距較大材^ 熱鰭片的密度數量顯得稀疏,故散熱效果非常有限 政 此外,亦有習知散熱器係在散熱底座開設複數' 口及 ,以供相對複數的散熱鰭片插植結合,或在散熱底的失槽 面的熱源接觸面,另嫫設一個以上的熱管,且熱技端 出一平面,用以直接接觸熱源(如CPU等),而達可露 熱及散熱效果。 '速 【新型内容】 本創作之主要目的,乃在於提供一種散熱器,解麥 有散熱鰭片間距較大、密度稀疏而導致的散熱效果、見 問題。 '"的 方案: 為實現上述之實用新型目的,本創作採用如下之技術 一種散熱器,係包括一散熱底座與複數散熱鰭 散熱底座上端面具有旅數組呈間隔排列的夾持塊, 片 該 且各排 3 M435151 前後相鄰的夹持塊係具有一可容納散熱鰭片插植的間隙; 該複數散熱鰭片係在底端形成一具有複數缺口的彎折邊片 ,各缺口係與各夾持塊呈相互對應並匹配容納各夾持塊; 該複數散熱鰭片分別插植於散熱底座夹持塊的前後相鄰間 隙,各夾持塊受模具沖頭的衝壓而變形向下夾持于彎折邊 片缺口至少一側。 採用上述技術方案後,本創作具有明顯的優點和有益 效果,具體而言,由上述技術方案可知: 一、 其通過在散熱鰭片的底端設置為一具有相對缺口的彎 折邊片,再利用模具沖頭的衝壓,壓迫散熱底座之夾 持塊產生下壓變形而緊密夾持於散熱鰭片之彎折邊片 上缺口的至少一側,以完成散熱底座與散熱鰭片的快 速結合。此種結合結構可縮小散熱韓片之間的間距, 從而有效提高散熱鰭片的密度數量,改善其散熱效果 ,更簡化散熱底座與散熱籍片的組裝結合。 二、 由於所述抽擠成型的延伸夾條,其係可設為兩兩對稱 的相鄰構成,利用兩兩對稱的延伸夾條,通過間隔式 剖溝後,即可使兩兩對稱的延伸夹條形成複數組間隔 排列且呈相向對應的兩夾持塊,進而經過模具沖頭的 衝壓後,使兩夾持塊可分別反向下壓變形而緊密的夾 持於散熱鰭片的彎折邊片兩侧,使散熱底座與散熱鰭 片的結合更為穩固。 三、 其在抽擠成型時,係可於長條擠型體的下端面成型一 個以上的熱管緊配槽,用以提供熱管形成緊配結合, M435151 - 且熱管亦可露出一平面,該平面並可與散熱底座形成 貼齊,使熱管平面可直接接觸熱源,達到快速吸熱及 散熱效果。 四、其在抽擠成型時,係可同時在長條擠型體的上端面成 型一個以上的熱管跨置槽,而散熱鰭片的底端亦可形 成相對的熱管跨置槽,故可將熱管緊配結合在散熱底 > 座與散熱鰭片之間。 • 【實施方式】 Φ 茲依附圖實施例將本創作結構特徵及其他作用、目的 詳細說明如下: 第一圖所示係本創作的第一較佳實施例,其製法步驟 _ 主要是依序通過:抽擠、裁切、剖溝、插植及衝壓等工序 ,以完成散熱底座1與散熱鰭片2的快速結合,其中: 抽擠:係選用鋁質或銅質金屬進行抽擠成型,並抽擠 成型為一長條擠型體10 (如第二圖),而在長條擠^體10 的上端面成型一組以上可呈兩兩對稱的延伸夾條101、102 -·(或亦可實施為只具有單一延伸夾條101或102),且長條 擠型體10係可抽擠為一薄板形狀; 裁切:係依散熱底座所需的長度,將該長條擠型體10 裁切為個別的擠型單塊la (如第三圖),使擠型單塊la亦 具有一組以上呈兩兩對稱的延伸失條101、102,且該擠型 單塊1 a即係散熱底座的雛形; 剖溝:係於上述兩兩對稱的延伸夾條101、102同時施 以間隔式剖溝而成型為一散熱底座1,係使該延伸夾條101 5 M435151 、102經過剖溝後,形成複數組間隔排壯相向對應的夹持 鬼 (如第四圖),其前後的間隙A並可容納散熱鰭 片2植h又該散熱底座1亦可依需要進行鑽孔或攻牙加 工,以形成複數開孔13 (或螺孔),用以提供如散熱器固 定座或PCB電路板的裝配組合; 、插植.上述通過剖溝後所構成的散熱底座1,其係配 合複數散熱鰭片2分別插植於散熱底座i前後夾持塊u、 12的間隙A’而散細片3係預先在底端形成—具有缺口 211的彎折邊片21(如第五圖)’使散熱鰭片2插植於散熱 底座1時,以該彎折邊片21的缺σ211可匹配容納兩相向的 夾持塊11、12 (如第六圖至第八圖所示); 衝£.如第九圖所示’其係使用與複數散熱鰭片2呈 相互匹配的複數模具沖頭3,各模具沖頭3係沿著散熱韓 片2的相鄰空隙Β伸人(如第十圖),各模具沖頭3均於 對應各夾持塊11、12的位置設有衝壓凸部3卜以利用模具 沖頭3的衝壓凸部31進行衝屢(如第十-圖),而壓迫兩 夹持塊11、12分別反向下㈣形而緊密夾持於散熱鰭片2 的曾折邊片21兩側’以完成散熱底座1與散熱㈣2的穩 固結合(如第十二圖至第十四圖所示)。 本創作於上述抽擠工序中,該長條擠型體1〇所成型兩 兩對稱的延伸夾條1G1、1G2,實際上亦可成型為只具有單 一延伸夾條m (㈣2),並w㈣具備兩兩對稱的延 伸夾條1G卜1〇2為限制必要,同理可知,若釆單—延伸夹 條101 (或102)的成型f施,财軸過剖溝的工序後, M435151 該單一延伸夹條101 (或1〇2)將可形成複數個間隔排列的 夹持塊11 (或12),而各夹持塊π (或12)的前後同樣會 开ν成了谷納放熱鰭片2植入的間隙A,並於通過衝壓的 工序後,可利用夾持塊丨丨(或12)下壓變形而產生壓迫夾 持,故亦可緊密夾持於散熱鰭片2的彎折邊片21的一側, 亦能完成散熱底座1與散熱鰭片2的快速結合。 ^ 上述衝壓工序,模具沖頭3係沿著各散熱鰭片2的相 .鄰空隙B伸入,以供進行快速衝屋,如第九圖和第十圖所 Φ示,所述模具沖頭3係可從侧邊方向的空隙B伸入再進行 衝壓。當然,如複數散熱鰭片2的上端係呈開放空間時, 則模具沖頭3亦可沿著散熱鰭片2的間隙A而由上端方向 伸入(請另參考第三十四圖至第三十五圖所示上端空釘 的不同方向),亦可進行快速衝壓結合。 依本創作製法,其係依序通過:抽擠、裁士刀、剖溝、 插植及衝塵工序後即可快速完成散熱底座工與散熱鱗片2 的結合’組成-更薄更輕、用料節嗜且具有高密度散熱籍 片的散熱器’即如第五圖所示結構,該散熱器係包括一散 熱底座1與複數散熱鰭片2,而其中: 散熱底座1,係-薄板形狀,其上端面具有複數組可 呈間隔排列且為相向對應的夹持塊n、12,且各排前後相 鄰的夹持塊n、12係具有一可容納散熱鰭片2插植的間隙 A,又散熱底座1亦可依需要而開設複數開孔13(或螺幻 ’以提供散熱H©定座或PCBf路板的裝配組合; 複數散熱鳍片2,其形狀不拘,惟在底端形成一具有 M435151 複數缺口 211的彎折邊片21,各缺口 211係與各相向的夾持 塊Π、12呈相互對應’並使各缺口 211可匹配容納兩相向夾 持塊11、12 ; 利用上述的散熱底座i與複數散熱鰭片2,係將複數 散熱鰭片2分別插植於散熱底座1兩相向夾持塊丨丨、I]的 前後相鄰間隙A,並使彎折邊片21的缺口 211匹配容納兩相 向對應的夾持塊11、12 (如第六圖至第八圖),再利用複 數匹配的模具沖頭3將複數組相向的夾持塊“、12進行衝 疋變形(如第十、十一圖)’以向下壓迫兩相向夾持塊11 、12而變形夾持於散熱鰭片2的彎折邊片21,而完成散熱 底座1與散熱鰭片2的快速結合,使能具有更薄、更輕的 散熱^座1,且節省用料、降低成本,提高散熱鰭片2的 分佈密度,並簡化散熱底座工與散熱鳍片2的組裝結合。 同理,於上述散熱底座2的結構中,其實施時並不需 以同時具備兩兩對稱的夾持塊11、12為限制必要,必要時 各排亦可釆單-夾持塊!!(或12)的成型實施,則前後夹 持塊11 (或12)亦可具有一可容納散熱轉片2插植的間隙 A,且通過衝壓工序後,仍可利用夾持塊u (或向下 壓迫而變形夾持於散熱鰭片2的彎折邊片21至少一側,同 樣可達到散熱底座1與散熱韓片2快速結合的目的。 第十五圖至第二十六圖所示,係本創作的另一種實施 例,其主要是在抽擠成型時,除了在長條擠型體勘的上端 面成型-組以上呈兩兩對稱的延伸夹條101b、聽以外, 並同時在長條擠型體10b的下端面成型一個以上的熱管緊 M435151 配槽103b (如第十五圖),於抽擠後再通過裁切(如第十 六圖)、剖溝(如第十七圖)、插植及衝壓工序之組成( 如第十七圖至第二十六圖所示),利用複數匹配的模具沖 頭3向下壓迫複數組相向夾持塊Ub、12b,使其下壓變形 而夾持於散熱鰭月2的彎折邊片21,以快速完成散熱底座 lb與散熱鰭片2的結合,並利用散熱底座lb下端面抽擠成 、 型的熱管緊配槽14b,可供熱管4嵌入形成緊配結合,該熱 . 管4亦可露出一貼齊於散熱底座lb底面的平面41,使熱管 φ 4通過平面41而直接接觸熱源(如CPU等),達到快速吸 熱及散熱效果。 第二十七圖及第二十八圖所示,係本創作的又一種實 施例,其主要是針對本創作中的散熱鰭片2b再施改變,為 可在各散熱鰭片2b的兩端彎折邊片21b、22b,分別設有可 供前後扣接的連接片211b、221b,故可將複數散熱鰭片2b .預先扣接結合為一散熱鰭片模組,再將散熱鰭片模組一次 套植於散熱底座lb上,以供進行衝壓變形,而快速完成散 • 熱底座lb與散熱鰭片2b的組裝結合,但同理可知,散熱鰭 片模組的扣接結合方式,並不以上述連接片211b、221b為 限制。 如第二十九圖所示之本創作再一種實施例,其主要是 在抽擠成型時,於長條擠型體的上端面再成型一個以上的 熱管跨置槽15c,因此使該散熱底座lc的上端面同時具有一 個以上的熱管跨置槽15c,而散熱鰭片2c的底端則設有相對 的熱管跨置槽23c,故可將一個以上的熱管4c緊配結合在散 M435151 熱底座lc與散熱鰭片2c之間(如 合,故所述熱管⑽呈非外露的組合形態。开〉成穩固結 如第二十一圖至第三十三圖所示,係 種不同的熱管形態,提供其它的組合變化, =,其散細係可·f折而貫穿散熱^ 貫複數熱管4e’其散熱端匈系可正反交錯而 貫穿散熱.-、θ Me模組,第三十三圖所示的熱管4f,Μ是 延伸貫穿㈣合於其它-個或—個以上的散熱W模組。 如第三十四圖至第三十六圖所示係本創作又一實施例 ,其中,各複數散熱鰭片2f的上端係呈開放空間,亦即, 各散熱!!>{ 2f的上端均具有—相鄰空隙f,因此於進行衝壓 工序時,模具沖頭3f也可以沿著散熱鰭片2f的空隙f,由其 上端方向伸入’以便於進行快速的衝壓結合。 以上所述,僅是本創作的較佳實施例而已,並非對本 創作的技術範圍作任何限制,故凡是依據本創作的技術實 質對以上實施例所作的任何細微修改、等同變化與修飾, 均仍屬於本創作技術方案的範圍内。 【圖式簡單說明】 第一圖為本創作實施例主要製造工序的流程示意圖。 第二圖為本創作實施例通過抽擠成型長條擠型體的立 體示意圖。 第三圖為本創作實施例通過裁切成型擠型單塊的立體 第四圖為本創作實施例通過剖溝成型為散熱底座的立 M4351S1 體圖。 第五圖為本創作實施例中散熱底座與散熱鰭片於插植 前的分解立體圖。 第六圖為本創作實施例於插植後衝壓前的組合狀態示 意圖。 第七圖為第六圖的正面視圖。 第八圖為第六圖的局部剖面示意圖。 第九圖為本創作實施例使用模具沖頭的衝壓前動作示 意圖。 第十圖為第九圖於衝壓前的組合狀態示意圖。 第十一圖為第十圖進行衝壓的狀態示意圖。 第十二圖為本創作實施例完成衝壓結合的擠型散熱器 組合立體圖。 第十三圖為第十二圖的正面視圖。 第十四圖為第十二圖的局部剖面示意圖。 第十五圖為本創作實施例通過抽擠成型的另一種長條 擠型體立體示意圖。 第十六圖為第十五圖實施例通過裁切成型擠型單塊的 立體圖。 第十七圖為第十五圖實施例通過剖溝成型為散熱底座 的立體圖。 第十八圖為第十七圖實施例中散熱底座與散熱轉片於 插植前的分解立體圖。 第十九圖為第十八圖實施例於插植後衝壓前的組合狀 11 M435151 態示意圖。 ,十圖為第十九圖的正面視圖。 第二十-圖為第权圖實施例使賴具沖頭的衝盧前 動作示意圖。 第-十-圖為第十八圖實施例於衝壓前的組合狀態示 意圖。 ^ 第十—圖為第十八圖實施例於進行衝壓的狀態示意 圖0 第十四圖為第十八圖實施例完成衝壓結合的擠型散 熱器組合立體圖。 第一十五圖為第十八圖實施例的正面視圖。 第:十六圖為第十八圖實施例的局部剖面示意圖。 第二十七圖為本創作中配合另一種散熱鱗片的實施例 分解立體圖。 第十八圖為第一十七圖實施例的組合立體圖。 =十九圖為本創作的再—種實施例分解立體圖。 々一十圖為第二十九圖實施例的組合立體圖。 第二十-圖為本創作中配合其它形態熱管的組合立體 圖。 第三十二圖為本創作中配合另一種形態熱管的組合立 體圖。 第三十三圖為本創作中可配合熱管延伸結合於其它散 熱鰭片模組的組合立體圖。 第三十四圖為本創作㈣具沖職上端方向伸入散熱 12
Claims (1)
- 甲請專利範圍 101年05月17日修正替換 1、一種散熱器,係包括一散熱底座與複數散熱鰭片,其 特徵在於: 該散熱底座上端面具有複數組呈間隔排列的夾持 塊,且各排前後相鄰的夾持塊係具有一可容納散熱鰭 片插植的間隙; 該複數散熱鰭片係在底端形成一具有複數缺口的 彎折邊片,各缺口係與各夾持塊呈相互對應並匹配容 納各夾持塊; 該複數散熱鰭片分別插植於散熱底座夹持塊的前 後相鄰間隙,各夾持塊係變形向下夾持于彎折邊片缺 口至少一側。 2、 如申請專利範圍第1項所述的散熱器,其特徵在於: 所述散熱底座上端面的夾持塊係呈兩兩對稱且相向對 應的前後排列組成。 ’ 3、 如申請專利範圍第1項所述的散熱器,其特徵在於: 所述散熱底座的下端面係設有一個以上可供熱管緊配 結合的熱管緊配槽。 4、 如申請專利範圍第1項所述的散熱器,其特徵在於: 所述散熱底座的上端面係具有一個以上的熱管跨置槽 ,而散熱.鰭片的底端設有相對的熱管跨置槽,並將一 個以上的熱管緊配結合在散熱底座與散熱鰭片之間。 5、 如申請專利範圍第1項所述的散熱器,其特徵在於: 所述散熱底座係開設複數開孔。 14 M4351.51 6、如申請專利範圍第1項所述的散熱器,其特徵在於: 所述複數散熱鰭片係具有兩端彎折邊片,並分別設有 可供前後扣接的連接片。 15
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TW101107863A TWI575215B (zh) | 2011-12-22 | 2012-03-08 | Radiator and its manufacturing method |
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JP (1) | JP5912791B2 (zh) |
KR (1) | KR101474602B1 (zh) |
CN (1) | CN102522381B (zh) |
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TWI482002B (zh) * | 2012-12-05 | 2015-04-21 | Giga Byte Tech Co Ltd | 散熱器及其製造方法 |
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CN103369918B (zh) * | 2012-04-03 | 2015-01-21 | 全亿大科技(佛山)有限公司 | 散热装置及其组装方法 |
TW201606256A (zh) * | 2014-08-12 | 2016-02-16 | Shuan Da Prec Industry Co Ltd | 散熱器緊配固定構成及其方法 |
TWI816444B (zh) * | 2022-06-21 | 2023-09-21 | 艾姆勒科技股份有限公司 | 具有高密度散熱鰭片的浸沒式散熱結構 |
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-
2011
- 2011-12-22 CN CN201110433443.6A patent/CN102522381B/zh active Active
-
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- 2012-03-08 TW TW101204181U patent/TWM435151U/zh unknown
- 2012-03-08 TW TW101107863A patent/TWI575215B/zh active
- 2012-04-03 US US13/438,191 patent/US20130160982A1/en not_active Abandoned
- 2012-04-11 JP JP2012090285A patent/JP5912791B2/ja active Active
- 2012-04-20 DE DE102012103519A patent/DE102012103519B3/de active Active
- 2012-05-07 KR KR1020120048181A patent/KR101474602B1/ko active IP Right Grant
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TWI482002B (zh) * | 2012-12-05 | 2015-04-21 | Giga Byte Tech Co Ltd | 散熱器及其製造方法 |
CN104185401A (zh) * | 2013-05-27 | 2014-12-03 | 纬创资通股份有限公司 | 散热装置 |
TWI487476B (zh) * | 2013-05-27 | 2015-06-01 | Wistron Corp | 散熱裝置 |
Also Published As
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CN102522381A (zh) | 2012-06-27 |
JP5912791B2 (ja) | 2016-04-27 |
TWI575215B (zh) | 2017-03-21 |
US20130160982A1 (en) | 2013-06-27 |
KR20130079086A (ko) | 2013-07-10 |
TW201326730A (zh) | 2013-07-01 |
KR101474602B1 (ko) | 2014-12-19 |
DE102012103519B3 (de) | 2013-01-31 |
JP2013135209A (ja) | 2013-07-08 |
CN102522381B (zh) | 2015-09-30 |
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