M280629 八、新型說明： 【新型所屬之技術領域】 ‘ 本創作為一種散熱裝置，尤指一種設於積體電路上 •用來導出並散逸積體電路的熱量，以降低積 :、: 度。 叩〉皿 【先前技術】 積體電路運作時，t產生μ，當積體電路的運作速 鲁度越快時，所產生的熱量越高’則積體電路的溫度越高，、 過高的溫度會使得積體電路受損，故一般會在積體電2上 设有散熱裝置來導出並散逸積體電路的熱量，以降低 •電路的溫度。 骚 八請參閱第十四及十五圖所示，現有技術的散熱裝置包 含有-底座（80)及複數個散熱韓片（9〇)，底座（8 〇)與積體電路相貼靠’藉由底I (80)將熱量傳導至 散熱鰭片（9 0 ) ’由散熱鰭片（9 〇 )將熱量散逸，底 座（8 0 )上成型有複數個結合槽（8丄），散熱鰭片（9 〇)插設於底I (8〇)的結合槽（81)中，固定散熱 鰭片（9 0 )日夺’利用壓模（3 〇 )下壓底座（8 〇 ): 結合槽（8"間的位置’以結合槽（81)㈤口端變形 :内縮迫緊散熱·鰭片（9 〇 )，以將散熱韓片（g 〇 )固 定於結合槽（8 1 )中，然而’由於結合槽（8丄）僅由 開口端内縮變形，结合_ f β Ί、 。才曰（8 1 )内壁並未與散熱鰭片 (9〇) a王遂。’則散熱鰭片（9〇)與底座（8〇) 的接觸位置僅在結合槽（81)底端及開口端，而熱量必 5 M280629 故底座（8 0 )將熱傳導至散敎絲 /、、、 <、、、日 ’而使得散熱效果大打折扣。 須經由接觸方能傳導， 片（9 0 )的效果不佳 【新型内容】 有鑑於前述之現有技術的缺失，本創作係設計一種散 熱裝置，使得散熱鰭片與底座充分接觸，以有效傳導熱量月， 而增進散熱效果。 ΜM280629 8. Description of the new type: [Technical field to which the new type belongs] ‘This creation is a heat sink, especially one that is provided on the integrated circuit. • It is used to derive and dissipate the heat of the integrated circuit to reduce the product:, :: degree.叩> [Previous technology] When the integrated circuit operates, t generates μ. When the integrated circuit operates at a faster speed, the higher the amount of heat generated, the higher the temperature of the integrated circuit is. The integrated circuit is damaged due to temperature, so a heat sink is generally provided on the integrated circuit 2 to dissipate and dissipate the heat of the integrated circuit to reduce the temperature of the circuit. Sao Ba Please refer to the fourteenth and fifteenth figures. The prior art heat sink includes a base (80) and a plurality of heat sinking Korean fins (90). The base (80) is in close contact with the integrated circuit. The heat is transmitted to the heat dissipation fin (90) through the bottom I (80). The heat is dissipated by the heat dissipation fin (90), and a plurality of coupling grooves (8 丄) are formed on the base (80). The sheet (90) is inserted into the coupling groove (81) of the bottom I (80), and the heat-dissipating fin (90) is fixed, and the base (80) is pressed down by the stamper (30): the bonding groove (The position of "8" is deformed at the mouth end of the coupling groove (81): the inner fins (90) are tightened tightly to fix the heat sink (80) in the coupling groove (81), However, 'Because the coupling groove (8 丄) is only deformed by the open end shrinkage, the combination _ f β Ί,. Cai said (8 1) that the inner wall is not in contact with the heat sink fin (90) a Wang Sui.' (90) The contact position with the base (80) is only at the bottom end and the open end of the combining groove (81), and the heat must be 5 M280629. Therefore, the base (80) conducts heat to the loose wire / ,,, <, ,,, and ' The heat dissipation effect is greatly reduced. It can only be conducted through contact, and the effect of the sheet (90) is not good. [New content] In view of the lack of the prior art, the author designed a heat dissipation device so that the heat dissipation fins are in full contact with the base. In order to effectively conduct heat month, and improve heat dissipation effect.
^為達到上述的創作目的，本創作所採用的技術手段為 。又。十—種散熱I置，其中包含有—底座及複數個散熱韓 片’每-散熱鰭片包含有一散熱片體，散熱片體一側端‘ •f折成型有至少—導熱片體，導熱片體固^於底座上且至 少一側與底座相貼合。 本創作的優點在於，藉由導熱片體的設置，並配合底 座上設有的固定裝置，使得導熱片體被固定於底座上，且 導熱片體至少-側與底座相貼合，則散熱鰭片與底座接觸 面積T加’故能有效傳導熱量至散熱片體，藉由散熱片體 將熱置散逸，而增進散熱效果。 【實施方式】 明芩閱第一及二圖所示，本創作的第一實施例包含有 一底座（1 0 )及複數個散熱韓片（2 0 )，底座（丄〇 ) 為一平坦塊體，底座（1 〇 )上成型有複數個凸塊（丄丄）， 凸塊（1 1 )間不相接且相互平行排列為複數行列，每一 政熱韓片（20)具有一散熱片體（21)，散熱片體（2 1)之一側端緣垂直彎折成型有一導熱片體（22)，導 …片( 2 2 )上成型有複數個相對於底座（丄〇 )之凸 6 M280629 塊（11)的穿孔（221)，導熱片體（22)上遠離 散熱片體（2 1 )之一側貼靠於底座（i 〇 )上，底座（工 〇)之凸塊（1；!)穿設於導熱片體（22)的穿孔（2 21)中，凸塊（ιι)突出於導熱片體（22)上遠離 於底座（1 〇 )之一側。^ In order to achieve the above-mentioned creative purpose, the technical means used in this creation is. also. Ten types of heat sinks, including-a base and a plurality of heat sinks. 'Each-heat sink fin contains a heat sink body, one side of the heat sink body.' The body is fixed on the base and at least one side is attached to the base. The advantage of this creation is that the heat-conducting sheet is fixed on the base through the arrangement of the heat-conducting sheet and the fixing device provided on the base, and the heat-conducting sheet is attached to the base at least on one side. The contact area T between the sheet and the base is increased, so it can effectively conduct heat to the heat sink body, and dissipate the heat through the heat sink body, thereby improving the heat dissipation effect. [Embodiment] As shown in the first and second figures, the first embodiment of this creation includes a base (1 0) and a plurality of heat sinking Korean pieces (20). The base (丄 〇) is a flat block. A plurality of bumps (丄 丄) are formed on the base (10), and the bumps (1 1) are not connected to each other and are arranged in parallel to each other in a plurality of rows and columns, and each of the Zhengre Korean films (20) has a heat sink body. (21), one side end edge of the heat sink body (2 1) is vertically bent to form a thermally conductive sheet body (22), and a plurality of protrusions (6) relative to the base (丄 〇) are formed on the guide plate (2 2) The perforation (221) of the M280629 block (11), one side of the heat conductive sheet body (22) far from the heat sink body (2 1) is abutted on the base (i 〇), and the projection (1) of the base (work 0). !) Penetrated through the perforation (2 21) of the thermally conductive sheet body (22), and the projection (ιι) protrudes from one side of the thermally conductive sheet body (22) away from the base (10).
請參閱第三至五圖所示，利用壓模（3 〇 )下壓底座 (1 0 )上的凸塊（1 1 )，使得凸塊（1 1 )變形，則 凸塊（1 1 )原先突出於導熱片體（2 2 )表面的部分體 積受壓後，向側邊變形延伸而貼靠於導熱片體（2 2 )上 遠離於底座（1 〇 )之一側，藉由向側邊延伸變形的凸塊 (1 1)卡合於導熱片體（22)之穿孔（221)週緣， 而使放熱韓片（2 0)被固定在底座（1 〇)上。 請參閱第六及七圖所示’本創作的第二實施例包含有 一底座（4 0 )及複數個散熱鰭片（5 〇 )，底座（4 〇 ) 為一平坦塊體，底座（4 〇)上成型有複數個肋條（4 i )， 肋條（4 1 )間不相接且相互平行，每—散熱歸片（5 〇 ) ^^散熱片體（51)，散熱片體（H)之-側端緣 :直爾型有複數個導熱片體（52) 體（5 2 )間成型有缺口 Γ ς 9 ]、 、朽 、（521)使得相鄰的導熱片體 (521)不相接，導埶月 τ w 等…、片體（5 2 )上遠離散熱片體（5 1 )之一側與底座（4 〇 抑执谐# U )相貼罪，散熱片體（5丄）相 鄰於導熱片體（5 2 )卢士而，士 t 缺槽（5 !有與缺口（5 2 1 )相通的 、 &座（4〇)之肋條（41)穿嗖於導 熱片體（5 2)間的缺口（5 ?（川牙°又於導 { b ^1)，且突伸於散熱片體 7 M280629 (5l)之缺槽（511)中。 =閱第八及九圖所示，利用塵模（3 〇)下麼底座 二的肋條（41)，使得肋條（川變形，則肋 、 1)原先突伸於散熱片. 中的n ^體（5 1 )之缺槽（5工i ) 2 :1竭，向側邊變形延伸而貼靠於導熱片體（5 」」上遂離於底座（4〇)之一 — 的A & ，猎由向側邊延伸變形 的肋條（4 1 )卡合於導熱片 U週緣，而使散熱，鳍片（5〇)】n2)間的缺口（52 上。 破固定在底座（4〇) 請參閱第十及十一圖所干 有m Ω ㈡所不，本創作的第三實施例包含 有底座（6 0)及複數個散熱 3 °)為-塊體，每—散熱㈣(7〇)=°匕W(6 1)，於私批u 具有一散熱片體（7 ;月文…片體（7 1 ) 一側端 體（⑴，且導熱片體（”）=:型有-導熱片 的夾角介於9〇度到180度之間本^熱片體（71)間 座（fi η、L 、 間本貫施例為135度，启 上成型有複數個相對於導埶 · 斜角度的凹槽（6丄）， …、片租（7 2)之傾 1 )中。 …體（72)插設於凹槽（6 請參閱第十二及十三圖斯一 底座(6。），底座(:。):：=°()^ 内壁與導熱片體（72)兩側皆緊密二使仔，（61) 0)被固定在底座（6〇)上。，、。’使政熱.鳍片（7 【圖式簡單說明】 圖 第一圖為本創作第-實施例之分解 M280629 第三圖為 第四圖為Please refer to the third to fifth figures, using the pressing die (30) to press the bump (1 1) on the base (1 0) to deform the bump (1 1), then the bump (1 1) was originally After a part of the volume protruding from the surface of the heat conductive sheet (2 2) is compressed, it deforms and extends to the side and abuts on the heat conductive sheet (2 2) away from one side of the base (10), and is directed to the side. The extended deformed bump (1 1) is engaged with the periphery of the perforation (221) of the thermally conductive sheet body (22), so that the exothermic Korean sheet (20) is fixed on the base (10). Please refer to the sixth and seventh figures. The second embodiment of the present invention includes a base (40) and a plurality of heat dissipation fins (50). The base (40) is a flat block and the base (40). ) Are formed with a plurality of ribs (4 i), the ribs (4 1) are not connected with each other and are parallel to each other, each of the heat sink fins (50) ^^ heat sink body (51), the heat sink body (H) -Side end edge: a straight shape has a plurality of thermally conductive sheet bodies (52), and a gap is formed between the bodies (5 2) Γ 9,,, and (521) so that adjacent thermally conductive sheet bodies (521) are not connected The guide plate τ w and so on ..., the side of the plate body (5 2) away from the heat sink body (5 1) is in close contact with the base (40 〇 执 执 harmonic # U), and the heat sink body (5 丄) Adjacent to the thermally conductive sheet (5 2), Lu Shi Er, Shi t notch (5! Has a rib (41) & seat (40) communicating with the notch (5 2 1) penetrates the thermally conductive sheet ( 5 2) gap (5? (Chuanya ° in the guide {b ^ 1), and protrudes into the gap (511) of the heat sink body 7 M280629 (5l). = See Figures 8 and 9 As shown, the ribs (41) of the second base under the dust mold (30) are used to make the ribs (川Shape, then the ribs, 1) originally protruded from the fin body (5 1) in the notch (5 i) 2: 1 exhaust, deformed and extended to the side to abut the heat conductive sheet body (5 "A & which is then separated from one of the bases (4〇), hunts for the ribs (4 1) extending to the side to engage with the periphery of the heat conducting sheet U, so as to dissipate heat, and the fins (50) 】 N2) between the gap (52). The base is fixed to the base (40). Please refer to the tenth and eleventh figures for m Ω. The third embodiment of this creation includes the base (60) and A plurality of heat sinks (3 °) are-blocks, each of which has a heat sink (7〇) = ° dagger W (6 1). In the private batch u, it has a heat sink (7; monthly ... sheet (7 1)) Side end body (⑴, and thermal conductive sheet body (") = = type-the included angle of the thermal conductive sheet is between 90 degrees and 180 degrees, and the thermal sheet body (71) between the seat (fi η, L, The embodiment is 135 degrees, and a plurality of grooves (6 丄) with respect to the guide angle and oblique angle are formed on the opening, ..., and the inclination 1) of the film rental (7 2). ... The body (72) is inserted in Groove (6 please refer to the twelfth and thirteenth Tuss base (6.), within the base (:.) :: = ° () ^ Both sides of the wall and the thermally conductive sheet body (72) are tightly attached to each other, (61) 0) is fixed on the base (60)., ... '使 政 热 .fins (7 [Schematic description] The first picture is the decomposition of the first embodiment of the creation M280629 The third picture is the fourth picture
, * Wb IMJ 彳作第一實施例動作剖面示意圖 第五W創作第—實施例側視剖面圖 弟五圖為本創彳七哲 第1 一貫施例另—側視剖面圖 ，圖為本創作第二實施例之分解圖 第八圖 第九圖 第十圖, * Wb IMJ The first embodiment of the action cross-section diagram of the fifth embodiment of the creation of the fifth W-side view of the first embodiment of the first embodiment of the first figure of the seven philosophers, the first consistent example of the seven philosophers-side-sectional view, the picture is the creation Exploded view of the second embodiment
μ ,、！ t本創作第二實施例之立體外觀圖 …:本創作第二實施例動作剖面示意圖 :、本創作第二實施例側視剖面圖 為本創作第三實施例之分解圖 2一圖為本創作第三實施例之立體外觀圖 :圖為本創作第三實施例動作剖面示意圖 二圖為本創作第三實施例側視剖面圖 弟十四圖A現有技術之動作剖面示意圖 第十五圖為現有技術之剖面圖 【主要元件符號說明】μ ,,! The three-dimensional appearance of the second embodiment of this creation ...: Schematic diagram of the action section of the second embodiment of this creation: The side view of the second embodiment of this creation is an exploded view of the third embodiment of this creation. The three-dimensional appearance of the third embodiment: the diagram is a schematic diagram of the action section of the third embodiment of the creation; the second diagram is the side view diagram of the third embodiment of the creation; Technical Section [Description of Symbols of Main Components]
(1 〇)底座 (2 〇 )散熱鰭片 (2 2 )導熱片體 (3 〇 )壓模 (4 1 )肋條 (5 1 )散熱片體 (5 2 )導熱片體 (6 〇 )底座 (7 〇 )散熱鰭片 (1 1 )凸塊 (21)散熱片體 (2 2 1 )穿孔 (4 0 )底座 (5 0 )散熱鰭片 (5 1 1 )缺槽 (5 2 1 )缺口 (61)凹槽 (7 1 )散熱片體 9 M280629 (72)導熱片體 （80)底座 (8 1 )結合槽 （9 0 )散熱鰭片(1 〇) base (2 〇) heat radiating fins (2 2) heat conducting fin body (3 〇) die (4 1) ribs (5 1) heat radiating fin body (5 2) heat conducting fin body (6 〇) base ( 7 〇) heat sink fin (1 1) bump (21) heat sink body (2 2 1) perforation (4 0) base (50) heat sink fin (5 1 1) notch (5 2 1) notch ( 61) Groove (7 1) heat sink body 9 M280629 (72) Thermal conductive body (80) Base (8 1) Combined groove (9 0) heat sink fin